WO2018032676A1 - Head-mountable virtual reality device - Google Patents
Head-mountable virtual reality device Download PDFInfo
- Publication number
- WO2018032676A1 WO2018032676A1 PCT/CN2016/111125 CN2016111125W WO2018032676A1 WO 2018032676 A1 WO2018032676 A1 WO 2018032676A1 CN 2016111125 W CN2016111125 W CN 2016111125W WO 2018032676 A1 WO2018032676 A1 WO 2018032676A1
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- WO
- WIPO (PCT)
- Prior art keywords
- virtual reality
- heat
- housing
- reality device
- heat dissipation
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/017—Head mounted
- G02B27/0176—Head mounted characterised by mechanical features
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Abstract
Provided is a head-mountable virtual reality device having good heat-dissipation performance. The head-mountable virtual reality device comprises a device main body (10); the device main body (10) comprises a housing (11) and a housing inner cavity (12); the device main body (10) is provided with a heat-dissipating structure; the heat-dissipating structure comprises a heat-dissipating tab (13) arranged in the housing inner cavity (12), a heat-dissipating fan (14) arranged in the housing inner cavity (12), and a heat-dissipating hole (15) arranged on the housing (11). By means of arranging the heat-dissipating structure and transmitting from a heat source with the aid of the heat-dissipating tab (13), and using the heat-dissipating fan (14) to accelerate thermal convection, hot air is expelled from the heat-dissipating hole (15) and the heat-dissipation performance of the head-mountable virtual reality device is thus improved.
Description
一种头戴式虚拟现实设备 Head mounted virtual reality device
[0001] 相关申请的交叉引用 [0001] Cross-Reference to Related Applications
[0002] 本申请要求于 2016年 8月 16日提交中国专利局、 申请号为 201610672207.2、 发明 名称为"一种头戴式虚拟现实设备"的中国专利申请的优先权, 其全部内容通过弓 I 用结合在本申请中。 [0002] This application claims priority to Chinese Patent Application No. 201610672207.2, entitled "Head-mounted Virtual Reality Device", filed on August 16, 2016, the entire contents of which are incorporated herein by reference. Used in conjunction with this application.
技术领域 Technical field
[0003] 本发明涉及头戴式虚拟现实设备领域, 主要涉及一种便于散热的头戴式虚拟现 实设备。 The present invention relates to the field of head-mounted virtual reality devices, and relates to a head-mounted virtual reality device that is convenient for heat dissipation.
背景技术 Background technique
[0004] 头戴式虚拟现实设备, 是用于显示图像及色彩的设备。 通常是用眼罩或头盔的 形式, 把显示屏贴近用户的眼睛, 通过光路调整焦距以在近距离中对眼睛投射 画面, 现已广泛应用在游戏、 医学、 娱乐和军事等方面。 [0004] A head mounted virtual reality device is a device for displaying images and colors. It is usually in the form of an eye mask or a helmet, which is close to the user's eyes, and adjusts the focal length through the optical path to project the image at a close distance. It is now widely used in games, medicine, entertainment and military.
[0005] 现有技术中, 头戴式虚拟现实设备不论是由使用者置入手机或是一体机式, 都 存在温度过高与散热的问题, 而现有头戴式虚拟现实设备上通常没有散热结构[0005] In the prior art, the head-mounted virtual reality device has a problem of excessive temperature and heat dissipation whether the user puts the mobile phone or the integrated device, and the existing head-mounted virtual reality device usually does not have the problem. Heat dissipation structure
, 导致其不能有效散热, 影响其使用寿命。 , causing it to not effectively dissipate heat and affect its service life.
技术问题 technical problem
问题的解决方案 Problem solution
技术解决方案 Technical solution
[0006] 本申请一些实施例提供一种具有散热结构的头戴式虚拟现实设备, 包括设备主 体, 所述设备主体包括壳体和壳体内腔, 所述设备主体上设置有所述散热结构 , 所述散热结构包括设置在所述壳体内腔中的散热片、 设置在所述壳体内腔中 的散热风机和设置在所述壳体上的散热孔。 Some embodiments of the present disclosure provide a head mounted virtual reality device having a heat dissipation structure, including a device body, the device body including a housing and a housing inner cavity, wherein the device body is provided with the heat dissipation structure, The heat dissipation structure includes a heat sink disposed in the inner cavity of the housing, a heat dissipation fan disposed in the inner cavity of the housing, and a heat dissipation hole disposed on the housing.
发明的有益效果 Advantageous effects of the invention
对附图的简要说明 Brief description of the drawing
附图说明
[0007] 图 1为本发明头戴式虚拟现实设备的整体结构示意图一; DRAWINGS 1 is a schematic diagram 1 of an overall structure of a head mounted virtual reality device according to the present invention;
[0008] 图 2为本发明头戴式虚拟现实设备的整体结构示意图二; 2 is a schematic diagram 2 of an overall structure of a head mounted virtual reality device according to the present invention;
[0009] 图 3为本发明头戴式虚拟现实设备的壳体处的局部剖视图; 3 is a partial cross-sectional view of the housing of the head mounted virtual reality device of the present invention;
[0010] 图 4为本发明头戴式虚拟现实设备的散热风机及散热片在壳体内腔中的设置结 构示意图。 4 is a schematic view showing a structure of a heat dissipating fan and a heat sink of a head mounted virtual reality device in a housing inner cavity of the present invention.
实施该发明的最佳实施例 BEST MODE FOR CARRYING OUT THE INVENTION
本发明的最佳实施方式 BEST MODE FOR CARRYING OUT THE INVENTION
[0011] 下面结合附图和具体实施方式对本发明的技术方案作进一步详细的说明。 [0011] The technical solutions of the present invention are further described in detail below with reference to the accompanying drawings and specific embodiments.
[0012] 参照图 1至图 4, 本实施例的头戴式虚拟现实设备, 包括设备主体 10, 设备主体[0012] Referring to FIG. 1 to FIG. 4, the head mounted virtual reality device of the embodiment includes a device body 10 and a device body.
10包括壳体 11和壳体内腔 12, 设备主体 10上设置有散热结构, 散热结构包括设 置在壳体内腔 12中的散热片 13、 设置在壳体内腔 12中的散热风机 14和设置在壳 体 11上的散热孔 15。 10 includes a housing 11 and a housing inner cavity 12. The device body 10 is provided with a heat dissipation structure. The heat dissipation structure includes a heat sink 13 disposed in the housing interior 12, a heat dissipation fan 14 disposed in the housing interior 12, and a housing disposed in the housing. The heat dissipation hole 15 on the body 11.
[0013] 通过设置散热结构, 借助壳体内腔 12中的散热片 13传导发热源, 并由散热风机 14加速热对流, 使热气从散热孔 15中排出, 提高头戴式虚拟现实设备的散热效 果。 为提高散热效果并兼顾尽可能不会较高程度地增大头戴式虚拟现实设备的 重量, 以免影响佩戴舒适度, 本实施例中散热片 13优选铝合金散热片。 [0013] By providing a heat dissipation structure, the heat source is conducted by the heat sink 13 in the housing inner cavity 12, and the heat convection is accelerated by the heat dissipation fan 14, so that the hot air is discharged from the heat dissipation hole 15, thereby improving the heat dissipation effect of the head mounted virtual reality device. . In order to improve the heat dissipation effect and to minimize the weight of the head-mounted virtual reality device as much as possible, so as not to affect the wearing comfort, the heat sink 13 is preferably an aluminum alloy heat sink in this embodiment.
[0014] 进一步地, 散热风机 14正对散热片 13, 如图 4所示, 以进一步加速热对流。 [0014] Further, the heat dissipation fan 14 faces the heat sink 13, as shown in FIG. 4, to further accelerate the heat convection.
[0015] 通常, 为便于组装, 壳体 11包括连接为一体的上盖 111、 下壳 112和位于上盖 11 1、 下壳 112之间的壳体主体 113, 上盖 111位于壳体主体 113的上侧, 下壳 112位 于壳体主体 113的下侧, 上盖 111具有朝向下方的倾斜侧面 1111, 散热孔 15幵设 在倾斜侧面 1111上, 则散热孔 15在壳体 11上可以隐蔽设置, 以减小对产品外观 效果的不利影响, 且由于热气密度小, 向上流动, 则散热孔 15位于上盖 111上, 有利于热气的流动散出。 [0015] Generally, for ease of assembly, the housing 11 includes an upper cover 111, a lower housing 112, and a housing body 113 between the upper cover 11 1 and the lower housing 112. The upper cover 111 is located at the housing main body 113. On the upper side, the lower casing 112 is located on the lower side of the casing main body 113, and the upper cover 111 has a downwardly inclined side surface 1111. The heat dissipation hole 15 is disposed on the inclined side surface 1111, so that the heat dissipation hole 15 can be concealed on the casing 11. In order to reduce the adverse effect on the appearance of the product, and because the heat gas density is small, the upward flow, the heat dissipation hole 15 is located on the upper cover 111, which is favorable for the flow of the hot air to be dissipated.
[0016] 为进一步提高头戴式虚拟现实设备的外观效果, 提高市场竞争力, 如图 1和图 3 所示, 上盖 111与壳体主体 113的连接缝处设置有装饰条 16, 装饰条 16具有朝向 散热孔 15的散热凹槽 161。 装饰条 16的散热凹槽 16可以对上盖 111上的散热孔 15 起到避让作用, 以免影响热气的散出。 [0016] In order to further improve the appearance effect of the head-mounted virtual reality device and improve the market competitiveness, as shown in FIG. 1 and FIG. 3, the connecting seam of the upper cover 111 and the housing main body 113 is provided with a decorative strip 16 and a decorative strip. The 16 has a heat dissipation groove 161 facing the heat dissipation hole 15. The heat dissipation groove 16 of the decorative strip 16 can evade the heat dissipation holes 15 on the upper cover 111 to avoid affecting the release of hot air.
[0017] 为加强气流对流, 加快热气的散出, 在下壳 112上设置有与壳体内腔 12连通的
进气孔 1121, 则可以从进气孔 1121处引入外部自然风, 与壳体内腔 12内的热气 形成对流, 加快热气的散出。 [0017] In order to enhance the convection of the airflow and accelerate the dissipation of the hot air, the lower casing 112 is provided with a communication with the casing inner cavity 12. The air inlet hole 1121 can introduce an external natural wind from the air inlet hole 1121 to form a convection with the hot air in the casing inner cavity 12 to accelerate the release of the hot air.
[0018] 进一步地, 下壳 112的前侧边缘处具有凹陷部 1122, 进气孔 1121位于凹陷部 112[0018] Further, the front side edge of the lower case 112 has a recessed portion 1122, and the air intake hole 1121 is located at the recessed portion 112.
2上, 则从下壳 112的表面也不容易观察到进气孔 1121, 实现进气孔 1121的隐蔽 设置, 以减小对产品外观效果的不利影响。 On the second side, the air intake hole 1121 is not easily observed from the surface of the lower case 112, and the concealed arrangement of the air intake hole 1121 is realized to reduce the adverse effect on the appearance of the product.
[0019] 更进一步地, 下壳 112的轮廓优选为下凸的弧形, 下壳 112的弧形造形有助于引 导气流进入进气孔 1121, 加强对流效果。 Further, the outline of the lower case 112 is preferably a downward convex arc shape, and the arc shape of the lower case 112 helps to guide the airflow into the air inlet hole 1121 to enhance the convection effect.
[0020] 本实施例头戴式虚拟现实设备通过设置散热结构, 借助内部的散热片传导发热 源, 并以散热风机加速热对流, 使热气从散热孔中排出, 提高头戴式虚拟现实 设备的散热效果, 延长使用寿命。 [0020] The head-mounted virtual reality device of the embodiment provides a heat dissipation structure, conducts a heat source by means of an internal heat sink, accelerates heat convection with a heat dissipation fan, and discharges hot air from the heat dissipation hole, thereby improving the head-mounted virtual reality device. Cooling effect and prolonged service life.
[0021] 以上实施例仅用以说明本发明的技术方案, 而非对其进行限制; 尽管参照前述 实施例对本发明进行了详细的说明, 对于本领域的普通技术人员来说, 依然可 以对前述实施例所记载的技术方案进行修改, 或者对其中部分技术特征进行等 同替换; 而这些修改或替换, 并不使相应技术方案的本质脱离本发明所要求保 护的技术方案的精神和范围。
The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to be limiting; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still The technical solutions described in the embodiments are modified, or equivalents are replaced by some of the technical features; and the modifications and substitutions do not deviate from the spirit and scope of the technical solutions claimed in the present invention.
Claims
权利要求书 Claim
一种头戴式虚拟现实设备, 包括设备主体, 所述设备主体包括壳体和 壳体内腔, 其特征在于: 所述设备主体上设置有所述散热结构, 所述 散热结构包括设置在所述壳体内腔中的散热片、 设置在所述壳体内腔 中的散热风机和设置在所述壳体上的散热孔。 A head mounted virtual reality device, comprising a device body, the device body comprising a housing and a housing inner cavity, wherein: the device body is provided with the heat dissipation structure, and the heat dissipation structure comprises a heat sink in the inner cavity of the housing, a heat dissipating fan disposed in the inner cavity of the housing, and a heat dissipation hole disposed on the housing.
根据权利要求 1所述的头戴式虚拟现实设备, 其特征在于: 所述散热 风机正对所述散热片。 The head mounted virtual reality device according to claim 1, wherein: said heat radiating fan faces said heat sink.
根据权利要求 1所述的头戴式虚拟现实设备, 其特征在于: 所述壳体 包括连接为一体的上盖、 下壳和位于上盖、 下壳之间的壳体主体, 所 述上盖位于所述壳体主体的上侧, 所述下壳位于所述壳体主体的下侧 , 所述上盖具有朝向下方的倾斜侧面, 所述散热孔幵设在所述倾斜侧 面上。 The head mounted virtual reality device according to claim 1, wherein: the housing comprises an upper cover connected to the body, a lower case, and a case body between the upper cover and the lower case, the upper cover Located on an upper side of the casing body, the lower casing is located on a lower side of the casing body, the upper cover has an inclined side surface facing downward, and the heat dissipation hole is disposed on the inclined side surface.
根据权利要求 3所述的头戴式虚拟现实设备, 其特征在于: 所述上盖 与所述壳体主体的连接缝处设置有装饰条, 所述装饰条具有朝向所述 散热孔的散热凹槽。 The head mounted virtual reality device according to claim 3, wherein: the connecting slit of the upper cover and the housing body is provided with a decorative strip, and the decorative strip has a heat dissipation concave toward the heat dissipation hole groove.
根据权利要求 3所述的头戴式虚拟现实设备, 其特征在于: 所述下壳 上设置有与所述壳体内腔连通的进气孔。 The head mounted virtual reality device according to claim 3, wherein: the lower casing is provided with an air inlet hole communicating with the inner cavity of the casing.
根据权利要求 4所述的头戴式虚拟现实设备, 其特征在于: 所述下壳 的前侧边缘处具有凹陷部, 所述进气孔位于所述凹陷部上。 The head mounted virtual reality device according to claim 4, wherein: the front side edge of the lower case has a recessed portion, and the air intake hole is located on the recessed portion.
根据权利要求 3或 4所述的头戴式虚拟现实设备, 其特征在于: 所述下 壳的轮廓为下凸的弧形。
The head mounted virtual reality device according to claim 3 or 4, wherein: the outline of the lower case is a downward convex arc.
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CN201610672207.2A CN106132169A (en) | 2016-08-16 | 2016-08-16 | A kind of wear-type virtual reality device |
CN201610672207.2 | 2016-08-16 |
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CN105491860A (en) * | 2016-01-12 | 2016-04-13 | 深圳多哚新技术有限责任公司 | Cooling device for VR glasses-based hand-held terminal, hand-held terminal and VR glasses |
CN105607261A (en) * | 2016-03-11 | 2016-05-25 | 北京小鸟看看科技有限公司 | Shading and ventilating structure for virtual reality helmet |
CN105717648A (en) * | 2016-04-29 | 2016-06-29 | 四川数字工匠科技有限公司 | Virtual reality helmet device convenient for heat dissipation |
CN205958846U (en) * | 2016-07-29 | 2017-02-15 | 合肥宝龙达信息技术有限公司 | VRAR helmet that compact is wireless |
CN106132169A (en) * | 2016-08-16 | 2016-11-16 | 青岛歌尔声学科技有限公司 | A kind of wear-type virtual reality device |
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CN108319023A (en) * | 2018-03-25 | 2018-07-24 | 了了网络科技(苏州)有限公司 | A kind of VR glasses of comfortable wearing |
CN110412767A (en) * | 2019-07-25 | 2019-11-05 | 南昌如鱼电子商务有限公司 | A kind of VR helmet with heat sinking function |
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