TWI616683B - Head mounted display device - Google Patents

Abstract

A head-mounted display device comprising a casing, a motherboard module, and a display The module, a lens group and a heat sink. The housing includes an airflow inlet located below, an airflow outlet located above, and an airflow passage communicating with the airflow outlet and the airflow inlet. The motherboard module is disposed in the housing. The display module is disposed in the housing and electrically connected to the motherboard module. The lens group is disposed in the housing and corresponds to the display module. The heat sink is disposed in the housing adjacent to the airflow passage and the motherboard module.

Description

Head mounted display device

The present invention relates to a display device, and more particularly to a head mounted display device.

As the technology industry is increasingly developed, the types, functions, and usage of electronic devices are becoming more diverse, and wearable electronic devices that can be directly attached to the user's body are also responding. There are quite a variety of head-mounted electronic devices. For example, a head-mounted display device such as an eye-mask type, after the user wears such an electronic device, in addition to the stereoscopic image, the image also follows the user's head. The rotation of the ministry can provide users with a more immersive experience.

However, the head-mounted display device will increase in temperature under long-term use, and it is necessary to maintain the head-mounted display device at a certain temperature to avoid overheating. In addition, when the head-mounted display device is worn for a long time, the user may sweat or the body temperature rises, and the head-mounted electronic device is likely to generate moisture at a portion in contact with the user, and the user feels stuffy.

The present invention provides a head-mounted display device which can provide a better heat dissipation effect and can provide a user with a more comfortable use experience.

A head-mounted display device of the present invention includes a housing, a motherboard module, a display module, a lens assembly, and a heat sink. The housing includes an airflow inlet located below, an airflow outlet located above, and an airflow passage communicating with the airflow outlet and the airflow inlet. The motherboard module is disposed in the housing. The display module is disposed in the housing and electrically connected to the motherboard module. The lens group is disposed in the housing and corresponds to the display module. The heat sink is disposed in the housing adjacent to the airflow passage and the motherboard module.

In an embodiment of the invention, the heat dissipating member contacts at least one wall surface of the air flow passage.

In an embodiment of the invention, the heat dissipating member is at least one wall surface of the air flow passage.

In an embodiment of the invention, the heat dissipating member is located away from the lens group in the housing, and the air flow passage extends from the bottom of the housing toward the heat sink and is L-shaped along the extending direction of the heat sink.

In an embodiment of the invention, the heat dissipating members are located on the left and right sides of the casing, and the air flow passages extend from the bottom of the casing toward the left and right sides of the casing to form an inverted shape.

In an embodiment of the invention, the lens group separates an inner cavity and an open outer cavity in the housing, the main board module and the display module are disposed in the inner cavity, and the head mounted display device is adapted to The edge of the open outer chamber abuts against the human face, and the air flow passage communicates with the open outer cavity.

In an embodiment of the invention, the heat dissipating member comprises a plurality of connected hollow metal tubes.

In an embodiment of the invention, the heat sink comprises a hot plate or a heat spreader.

In an embodiment of the invention, the head mounted display device further includes a heat conducting member connected to the motherboard module and the heat sink.

In an embodiment of the invention, the heat conducting member comprises a heat pipe

Based on the above, the head-mounted display device of the present invention has an airflow inlet disposed below the casing, an airflow outlet above, an airflow passage between the airflow inlet and the airflow outlet, and a heat dissipating member disposed in the casing near the airflow. Channel and motherboard module. When the head-mounted display device is in operation, the heat generated by the motherboard module can be transmitted to the heat sink through the air or the heat-conducting member, and the air in the airflow passage is heated, and the hot air moves along the airflow passage to the airflow outlet. The stack effect is formed, and the chimney effect has the characteristic of enhancing air convection. Therefore, when the hot air flows out, the cold air drawn into the environment is filled, thereby achieving the heat dissipation effect on the head mounted display device. In addition, if the air flow passage communicates with the open outer cavity of the casing, when the hot air flows out, the hot air in the open outer cavity is also drawn to reduce the sweltering of the user's face.

The above described features and advantages of the invention will be apparent from the following description.

FIG. 1 is a schematic diagram of the appearance of a head mounted display device according to an embodiment of the invention. 2 is a perspective schematic view of another perspective view of the head mounted display device of FIG. 1. Fig. 3 is a schematic cross-sectional view taken along line A-A of Fig. 1. Referring to FIG. 1 to FIG. 3 , the head mounted display device 100 of the present embodiment includes a housing 110 , a motherboard module 120 disposed in the housing 110 , a display module 130 , a lens assembly 140 , and A heat sink 150.

As shown in FIG. 3, the housing 110 includes an airflow inlet 113 located below, an airflow outlet 114 located above, and an airflow passage 115 communicating with the airflow outlet 114 and the airflow inlet 113. The lens group 140 separates an inner cavity 111 and an open outer cavity 112 in the housing 110. The motherboard module 120 and the display module 130 are disposed in the inner cavity 111, and the display module 130 is electrically connected to the motherboard module 120. The heat sink 150 is located within the housing 110 away from the lens set 140. The lens group 140 corresponds to the display module 130.

The heat sink 150 is located in the housing 110 and adjacent to the airflow passage 115 and the motherboard module 120. The heat sink 150 contacts at least one wall surface of the airflow passage 115. More specifically, as shown in FIG. 2, in the present embodiment, the heat dissipating member 150 includes a plurality of connected hollow metal pipe bodies, and opposite sides of the hollow metal pipe bodies respectively contact the two wall faces of the air flow passage 115. In this embodiment, the motherboard module 120 is disposed in the inner cavity 111 closer to the airflow channel 115, and the heat sink 150 is disposed in the airflow channel 115, so that the heat sink 150 is close to the motherboard module 120. Therefore, when the motherboard module 120 is in operation, the heat generated by the central processing unit on the motherboard module 120 causes the nearby housing 110 to heat up, and the heat sink 150 is also heated up, so that the airflow passage 115 is caused. The temperature inside the air increases. Since the air outlet 114 connected to the air flow passage 115 is located above, the hot air in the air passage 115 is discharged upward due to the chimney effect, and when the hot air flows out, the cold air in the environment is drawn into the air passage from the lower air inlet 113. 115, the drawn cold air reduces the temperature of the heat sink 150 and the housing 110 near the air flow passage 115, so that the heat generated by the central processing unit on the motherboard module 120 is carried away in the above manner to achieve The head mounted display device 100 has a heat dissipation effect.

In addition, as shown in FIG. 3, in the present embodiment, the air flow passage 115 extends from the bottom of the housing 110 toward the heat sink 150 and is L-shaped along the extending direction of the heat sink 150. The air flow passage 115 communicates with the open outer chamber 112, that is, the housing 110 also has an air flow inlet 116 at the location of the open outer chamber 112. In general, when the user wears the head mounted display device 100, the face will be abutted against the edge of the open outer cavity 112, and the open outer cavity 112 will be slightly closed. Since the air between the open outer cavity 112 and the face is slightly increased due to the user's body temperature and the air humidity may be slightly increased, the user feels stuffy. Therefore, the housing 110 is provided with an airflow inlet 116 at a portion of the open outer chamber 112, so that hot air between the open outer chamber 112 and the face can be discharged through the airflow passage 115 and the airflow outlet 114. Moreover, by the chimney effect, cold air from the outside is drawn into the open outer cavity 112 and the face through the gap between the open outer cavity 112 and the face, thereby providing a more comfortable use feeling for the user.

It is worth mentioning that in other embodiments, the heat sink 150 can also be a hot plate or a heat spreader. The heat spreader is, for example, a metal sheet or a quartz sheet or the like which can heat the heat. The heat sink 150 may be in contact with the wall surface of the air flow passage 115. Alternatively, the heat sink 150 may be at least one wall surface of the air flow passage 115. For example, in an unillustrated embodiment, the housing 110 may have an opening (not shown) on the wall surface of the air flow passage 115, and the heat sink 150 is disposed in the opening as one of the wall surfaces of the air flow passage 115. A portion, together with the housing 110, becomes the air flow passage 115. In addition, in other embodiments, the airflow outlet 114 may also be located directly above the airflow inlet 113, leaving the airflow passage 115 in an I-shape. Of course, the form and arrangement position of the heat sink 150 and the form of the air flow passage 115 are not limited to the above description, as long as the temperature of the entire head mounted display device 100 can be lowered.

Other embodiments of the head mounted display device 100 will be described below. It should be noted that in the following embodiments, the same or similar elements as the previous embodiment are denoted by the same or similar symbols, and no further description is provided. , only the main differences are explained.

4 is a perspective schematic view of a head mounted display device in accordance with another embodiment of the present invention. Figure 5 is a schematic illustration of another perspective of Figure 4. Figure 6 is a cross-sectional view taken along line B-B of Figure 4 . Referring to FIG. 4 to FIG. 6, the appearance of the head mounted display device 100a of the present embodiment is similar to that of the head mounted display device 100 of FIG. 1. The main difference is that in the present embodiment, the head mounted display device 100a The utility model further comprises a heat conducting component 160 connected to the motherboard module 120 and the heat sink 150. In the embodiment, the heat conducting member 160 is exemplified by a heat pipe, but the type of the heat conducting member 160 is not limited thereto. As shown in FIG. 6, the heat emitted by the motherboard module 120 can be directly and more quickly guided to the heat sink 150 through the heat conductive member 160. Similarly, the elevated temperature fins 150 will increase the temperature within the airflow passages 115 and will be exhausted through the chimney effect and drawn into the cold air in the environment. In addition, in other embodiments, the display module 130 can also guide the heat emitted by the display module 130 to the heat sink 150 through the same or another heat conducting component 160.

FIG. 7 is a schematic diagram of the appearance of a head mounted display device in accordance with another embodiment of the present invention. FIG. 8 is a perspective schematic view of another perspective view of the head mounted display device of FIG. 7. FIG. Fig. 9 is a schematic cross-sectional view taken along line A-A of Fig. 7. Referring to FIG. 7 to FIG. 9 , the main difference between the head mounted display device 100 b of the present embodiment and the head mounted display device 100 a of the previous embodiment is that the air outlet 114 , the main board, the heat sink 150 and the heat conducting member 160 are different. Configure the location. In this embodiment, the air outlets 114 are disposed on opposite sides of the housing 110, and the airflow passages 115 extend from the bottom of the housing 110 to the left and right sides of the housing 110 to form a collapsed shape (that is, close to the U-shape). ). The heat sinks 150 are correspondingly located on the left and right sides of the housing 110. The heat conducting member 160 extends from the rear of the motherboard to both sides to the heat sink 150. In the head-mounted display device 100b of the present embodiment, since the airflow outlet 114 and the heat sink 150 are disposed on both sides of the housing 110, the overall thickness can be reduced. When the user wears the head-mounted display device 100b, the head The center of gravity of the wearable display device 100b is closer to the user's face, and the stability and comfort of the wearing can be improved.

In summary, the head-mounted display device of the present invention has an airflow inlet below the casing, an airflow outlet above, an airflow passage between the airflow inlet and the airflow outlet, and a heat dissipating member disposed in the casing. Close to the airflow channel and the motherboard module. When the head-mounted display device is in operation, the heat generated by the motherboard module can be transmitted to the heat sink through the air or the heat-conducting member, and the air in the airflow passage is heated, and the hot air moves along the airflow passage to the airflow outlet. The stack effect is formed, and the chimney effect has the characteristic of enhancing air convection. Therefore, when the hot air flows out, the cold air drawn into the environment is filled, thereby achieving the heat dissipation effect on the head mounted display device. In addition, if the air flow passage communicates with the open outer cavity of the casing, when the hot air flows out, the hot air in the open outer cavity is also drawn to reduce the sweltering of the user's face.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100, 100a, 100b‧‧‧ head-mounted display devices

110‧‧‧shell

111‧‧‧ lumen

112‧‧‧Open external cavity

113, 116‧‧‧ air inlet

114‧‧‧Air outlet

115‧‧‧Air passage

120‧‧‧ motherboard module

130‧‧‧Display module

140‧‧‧ lens group

150‧‧‧ Heat sink

160‧‧‧heat-conducting parts

FIG. 1 is a schematic diagram of the appearance of a head mounted display device according to an embodiment of the invention. 2 is a perspective schematic view of another perspective view of the head mounted display device of FIG. 1. Fig. 3 is a schematic cross-sectional view taken along line A-A of Fig. 1. 4 is a perspective schematic view of a head mounted display device in accordance with another embodiment of the present invention. Figure 5 is a schematic illustration of another perspective of Figure 4. Figure 6 is a cross-sectional view taken along line B-B of Figure 4 . FIG. 7 is a schematic diagram of the appearance of a head mounted display device in accordance with another embodiment of the present invention. FIG. 8 is a perspective schematic view of another perspective view of the head mounted display device of FIG. 7. FIG. Fig. 9 is a schematic cross-sectional view taken along line A-A of Fig. 7.

Claims (9)

A head-mounted display device includes: a casing, an airflow inlet located below, an airflow outlet located above, an airflow passage communicating with the airflow outlet and the airflow inlet; and a motherboard module disposed at a display module disposed in the housing and electrically connected to the motherboard module; a lens group disposed in the housing and corresponding to the display module; and a heat sink disposed on the housing The airflow channel extends from the bottom of the casing to the heat dissipating component and is located along the extending direction of the heat dissipating component. L shape. A head-mounted display device includes: a casing, an airflow inlet located below, an airflow outlet located above, an airflow passage communicating with the airflow outlet and the airflow inlet; and a motherboard module disposed at a display module disposed in the housing and electrically connected to the motherboard module; a lens group disposed in the housing and corresponding to the display module; and a heat sink disposed on the housing The airflow channel extends from the bottom of the casing to the left and right sides of the casing to form a reversed shape, and is located on the left and right sides of the casing and adjacent to the airflow passage and the mainboard module. The head mounted display device of claim 1 or 2, wherein the heat sink contacts at least one wall surface of the air flow passage. The head mounted display device of claim 1 or 2, wherein the heat sink is at least one wall of the air flow passage. The head-mounted display device of claim 1 or 2, wherein the lens group separates an inner cavity and an open outer cavity in the housing, the motherboard module and the display module Disposed on the inner cavity, the head mounted display device abuts against a human face by an edge of the open outer cavity, and the air flow channel communicates with the open outer cavity. The head mounted display device of claim 1 or 2, wherein the heat sink comprises a plurality of connected hollow metal tubes. The head-mounted display device of claim 1 or 2, wherein the heat sink comprises a hot plate or a heat spreader. The head-mounted display device of claim 1 or 2, further comprising: a heat-conducting member coupled to the motherboard module and the heat sink. The head mounted display device of claim 1 or 2, wherein the heat conducting member comprises a heat pipe.