WO2018029771A1

WO2018029771A1 - Calculator

Info

Publication number: WO2018029771A1
Application number: PCT/JP2016/073392
Authority: WO
Inventors: 輝副田; 福井　一夫
Original assignee: 株式会社日立製作所
Priority date: 2016-08-09
Filing date: 2016-08-09
Publication date: 2018-02-15

Abstract

This calculator has: a housing having one or more through holes, through which modules are inserted/removed; and a rear surface plate, which is a plate-like member fixed to the housing such that through hole openings on the side opposite to through hole openings through which the modules are inserted/removed are closed, said rear surface plate having a plurality of plate surface connectors that are provided on a plate surface such that the plate surface connectors are positioned in the opposite-side openings. The modules have: a first substrate having first connectors that couple to first plate surface connectors of the plate surface connectors in the cases where the modules are inserted into the through holes; a second substrate having second connectors that couple to second plate surface connectors of the plate surface connectors in the cases where the modules are inserted into the through holes; and a module housing, which disposes the first substrate and the second substrate such that the first connectors and the second connectors face the rear surface plate, and the first substrate is positioned above or below the second substrate, and which holds the first substrate such that the first substrate can freely slide in the inserting/removing direction with respect to the through holes of the modules, said module housing fixing the second substrate.

Description

calculator

The present invention relates to a computer in which one or more modules can be inserted and removed.

Patent Document 1 discloses a connector system in which two substrates are simultaneously fitted to a backplane without applying stress to the backplane connector. This connector system includes a mezzanine connector, a support attached to the lower board, a coil spring disposed on the support and capable of changing the distance between the lower board and the upper board, a screw for attaching the upper board to the support, and a loose insertion hole. And having. The mezzanine connector contacts the lower mezzanine connector disposed on the lower substrate and the upper mezzanine connector disposed on the upper substrate so that the two substrates are arranged in parallel with a distance from each other and connected. The connector is movable in a parallel direction and a direction perpendicular to the parallel direction. The loose insertion hole is a hole that is formed in the upper substrate and can change the relative position of the upper substrate in the parallel direction with respect to the column in a state where the upper substrate is attached to the column.

JP 2013-251133 A

However, the connector system of Patent Document 1 has a two-stage structure in which a small upper package such as a mezzanine card is stacked on a mother board, and the number of connectors mounted on the upper package is as few as one or two. For this reason, in the case of a structure in which a large-scale package having a large number of connectors such as a mother board is formed in two stages with studs, warpage of the mother board and studs occurs due to an increase in the fitting force between the connector of the package and the connector on the housing side. . Therefore, the motherboard may be destroyed.

On the other hand, when the rigidity of the structure itself is increased, when two motherboards are fixed, it is difficult to guide the other connector using the guide pins of one connector, and the positional accuracy of the connector is satisfied. I can't. The problem described above is the same for the three-stage structure or more.

An object of the present invention is to suppress deformation and breakage of a circuit board when a plurality of stages of circuit boards are inserted and removed.

A computer according to one aspect of the invention disclosed in the present application is a computer in which one or more modules can be freely inserted and removed, and a housing having one or more through holes into which the modules are inserted and removed, and the modules in the through holes. Is a plate-like member that is fixed to the housing so as to close the other opening opposite to the one opening through which is inserted and removed, and a plurality of members provided on the plate surface so as to be positioned in the other opening A back plate having a plate connector, and the module has a first connector that fits with the first plate connector of the plurality of plate connectors when the module is inserted into the through hole. A first substrate; a second substrate having a second connector that fits with a second plate connector of the plurality of plate connectors when the module is inserted into the through hole; the first connector; 2 connections The first substrate and the second substrate are disposed so that the first substrate is positioned above or below the second substrate so that the first substrate faces the back plate, and the first substrate A module housing that holds the board slidably in the insertion / extraction direction with respect to the through hole of the module and fixes the second board.

According to a typical embodiment of the present invention, it is possible to suppress the deformation and breakage of a substrate when a plurality of substrates are inserted and removed. Problems, configurations, and effects other than those described above will become apparent from the description of the following embodiments.

FIG. 1 is an exploded perspective view of a computer. FIG. 2 is a partially broken perspective view of the first module. FIG. 3 is an exploded perspective view of the first module. FIG. 4A is a cross-sectional view illustrating a first operation procedure example 1 of the first lever and the second lever. FIG. 4B is a cross-sectional view illustrating a second operation procedure example of the first lever and the second lever. FIG. 4C is a cross-sectional view illustrating an operation procedure example 3 of the first lever and the second lever. FIG. 4D is a cross-sectional view illustrating a fourth operation procedure example of the first lever and the second lever. FIG. 4E is a cross-sectional view illustrating an operation procedure example 5 of the first lever and the second lever. FIG. 5 is a partially broken perspective view of the second module. FIG. 6 is an exploded perspective view of the second module. FIG. 7A is a cross-sectional view illustrating an operation procedure example 1 of the third lever. FIG. 7B is a cross-sectional view illustrating an operation procedure example 2 of the third lever. FIG. 7C is a cross-sectional view illustrating an operation procedure example 3 of the third lever. FIG. 7D is a cross-sectional view illustrating an operation procedure example 4 of the third lever. FIG. 8 is a partially broken perspective view of the third module.

1 to 8 below, a coordinate system consisting of an X axis, a Y axis, and a Z axis is defined. The X direction that is the direction of the X axis is the insertion / extraction direction of the module group 100. The direction from the origin O toward the end of the arrow on the X axis is the + X direction (insertion direction), and the opposite direction is the −X direction (extraction direction). In this example, the X direction is the longitudinal direction of the module group 100. The Y direction, which is the direction of the Y axis, is the short direction (width direction) of the module group 100. The direction from the origin O toward the end of the arrow on the Y axis is the + Y direction, and the opposite direction is the -Y direction. The Z direction, which is the direction of the Z axis, is the height direction of the module group 100. The direction from the origin O toward the end of the arrow on the Z axis is the + Z direction, and the opposite direction is the −Z direction.

<Example of overall configuration>
FIG. 1 is an exploded perspective view of the computer 1. The computer 1 includes a front chassis 200, a backboard 300, and a rear chassis 201. The front chassis 200 is a case of the computer 1 connected to the rear chassis 201 via the back board 300. The front chassis 200 has a plurality of (for example, four in FIG. 1) slots 200a. The slot 200a is a through hole penetrating in the X direction. The module group 100 is inserted into and removed from the slot 200a. The module group 100 is inserted into the front chassis 200 through the opening on the −X direction side of the slot 200a, and is connected to the backboard connector 301 on the opposite surface of the backboard 300 at the opening on the + X direction side of the slot 200a. The module group 100 holds a circuit board called a package having a circuit, in which electronic parts such as an electronic circuit and a connector and wiring are mounted on the board. An engagement hole 200 b is provided on the side surface of the front chassis 200.

The backboard 300 is a back plate having a plurality of backboard connectors 301 on both sides. The backboard 300 is held between the front chassis 200 and the rear chassis 201. The backboard connector 301 is a rear connector fitted to a connector provided in the module group 100. Each backboard connector 301 is electrically connected to another backboard connector 301. As a result, the modules can communicate with each other via the backboard 300.

The rear chassis 201 is connected to the front chassis 200 via the back board 300. Similar to the front chassis 200, the rear chassis 201 also has a plurality of (four as an example in FIG. 1) slots 200a. A fan unit and a power supply unit are inserted into and removed from the slot 200a of the rear chassis 201. The fan unit and the power supply unit are inserted into the rear chassis 201 and connected to the backboard connector 301 on the opposite surface of the backboard 300.

The module group 100 includes a first module 101, a second module 102, and a third module 103. In FIG. 1, an example in which the first module 101, the second module 102, and the third module 103 are inserted will be described. The module group 100 includes only the first module 101, only the second module 102, only the third module 103, The first module 101 and the second module 102, the first module 101 and the third module 103, the second module 102 and the third module 103 may be used. Further, the number of modules may be different. The first module 101 will be described with reference to FIGS. 2 to 4E. The second module 102 will be described with reference to FIGS. 5 to 7D. The third module 103 will be described with reference to FIG.

<First module 101>
FIG. 2 is a partially broken perspective view of the first module 101. FIG. 3 is an exploded perspective view of the first module 101. The first module 101 is a module in which circuit boards are mounted in two stages in the Z direction. The first module 101 includes a module chassis 31 (module housing) having a substantially box shape. The module chassis 31 has a front plate 31a. The front plate 31a is the front of the computer 1. A hook 31b and a first lever 41 are provided at the lower end edge of the front plate 31a. The first lever 41 faces the lower package 20 across the front plate 31a. One end of the first lever 41 is a first rotating end 41a, and the vicinity thereof is detached by an operator with a hook 31b.

The front plate 31a has an opening 31c. A second lever 42 is provided in the opening 31c. The surface facing the front plate 31a is not sealed, and the connector 11 of the upper package 10 and the connector 21 of the lower package 20 are provided. The module chassis 31 has a bottom plate 31d. Circular fixing holes 31e are formed at the four corners of the bottom plate 31d.

In the module chassis 31, an upper package 10 and a lower package 20 are provided. The upper package 10 and the lower package 20 are circuit boards in which

connectors

11 and 21 connected to electronic components (not shown) constituting the electronic circuit and the backboard connector 301 are mounted on the

boards

10m and 20m. In the first module 101, the upper package 10 is held by the module chassis 31 so as to be slidable in the insertion / extraction direction (X direction), and the lower package 20 is fixed to the module chassis 31. The

connectors

11 and 21 are provided at positions facing the front plate 31a in the + X direction, and are arranged so as to be aligned in the Z direction.

The upper package 10 and the lower package 20 are circuit boards having the X direction as a long direction and the Y direction as a short direction. A second lever 42 is provided at a corner on the −X direction side of the substrate 10m. The second lever 42 protrudes from the opening 31c. A connector 11 is provided at an edge in the + X direction of the substrate 10m. The connector 11 is connected to the backboard connector 301 of the backboard 300. Long holes 10b elongated in the X direction are formed at the four corners of the substrate 10m. A connector 21 is provided on the edge in the + X direction of the substrate 20m. The connector 21 is connected to the backboard connector 301 of the backboard 300. Circular fixing holes 20a are formed at the four corners of the substrate 20m. The fixing hole 20a is an insertion hole into which the stud 33 is inserted. The substrate 10m and the substrate 20m are supported in the Z direction by the stud 33.

The stud 33 is a column provided at the four corners of the substrate 10m and the substrate 20m. The upper end of the stud 33 is inserted into the long hole 10b of the substrate 10m. The long hole 10b is an insertion hole into which the stud 33 is slidably inserted in the X direction. The upper end of the stud 33 is screwed with a fixing screw 32. The upper package 10 is slidable in the X direction by the elongated hole 10b in a state of being sandwiched between the screw head of the fixing screw 32 and the upper end of the stud 33. The lower end of the stud 33 is inserted into the fixing hole 31e of the bottom plate 31d and the fixing hole 20a of the substrate 20m.

The lower end of the stud 33 is held by the stopper 34 with the bottom plate 31d and the substrate 20m sandwiched so that a gap is formed between the bottom plate 31d and the substrate 20m. Due to this gap, heat generated from the lower package 20 can be released. The stopper 34 may be screwed with the fixing screw 32 like the upper end of the stud 33.

FIGS. 4A to 4E are cross-sectional views showing examples of operating procedures of the first lever 41 and the second lever 42. FIG. 4A to 4E, examples of operations when the first module 101 is inserted are shown, and FIGS. 4D and 4E show examples of operations when the first module 101 is removed. 4A to 4E show cross sections obtained by dividing the first module 101 along the XY plane. 4A to 4E, the direction of arrow A is the direction in which the first lever 41 and the second lever 42 rotate around the

rotation shafts

41b and 42b so as to approach the front plate 31a in the XY plane. An arrow B direction is a direction opposite to the A direction, and is a direction in which the first lever 41 and the second lever 42 rotate around the

rotation shafts

41b and 42b so as to be separated from the front plate 31a in the XY plane. is there.

FIG. 4A shows a state in which the first module 101 starts to be inserted into the slot 200a of the front chassis 200. The first lever 41 and the second lever 42 are opened in the arrow B direction. The other end of the first lever 41 is a first base end 41x having a rotating shaft 41b, a first engagement piece 41c, and a second engagement piece 41d. 4A, the first engagement piece 41c is inserted into the engagement hole 200b of the front chassis 200 and is in contact with the opening edge of the engagement hole 200b on the front plate 31a side. The second engagement piece 41d is located at a position separated from the bent plate portion 200c having an L-shaped cross section on the front plate 31a side of the front chassis 200. The engagement hole 200b and the bent plate portion 200c are engaged with the first base end 41x of the first lever 41 and become a first restriction portion that restricts the rotation of the first lever 41.

One end of the second lever 42 is a second rotating end 42a. The other end of the second lever 42 is a second base end 42x having a rotation shaft 42b, a first engagement piece 42c, and a second engagement piece 42d. On the back surface of the side plate 31f of the module chassis 31, a second restricting portion 31g having a substantially U-shaped cross section is provided. The second restricting portion 31g forms an opening 31h between the first engaging plate portion 31ga on the front plate 31a side and the second engaging plate portion 31gb on the opposite side. 4A, the first engagement piece 42c is inserted into the opening 31h, and the second engagement piece 42d is located between the front plate 31a and the first engagement plate portion 31ga.

4A, since the first module 101 is inserted into the slot 200a of the front chassis 200, the

connectors

11 and 21 are not in contact with the backboard connector 301. Also, the upper package 10 protrudes toward the −X direction side by Δx compared to the lower package 20. In this case, the shaft of the fixing screw 32 comes into contact with the opening edge of the elongated hole 10b in the + X direction. Δx corresponds to the length of the long hole 10b in the X direction.

In the state of FIG. 4A, when the operator rotates the first lever 41 from the first rotation end 41a of the first lever 41 in the direction of arrow A about the rotation shaft 41b, the first engagement piece 41c is engaged. The opening edge of the hole 200b on the front plate 31a side comes into contact. For this reason, the insertion force increases with this contact position as the point of action, the first module 101 is inserted into the slot 200a, and the connector 21 of the lower package 20 responds with the insertion force due to the rotation of the first lever 41. The backboard connector 301 starts to be fitted. When the first module 101 is pushed in until the first lever 41 is parallel to the front plate 31a by turning in the arrow A direction, the state shown in FIG. 4B is obtained.

FIG. 4B shows a state where the connector 21 of the lower package 20 is fitted to the backboard connector 301, but the connector 11 of the upper package 10 is not fitted to the backboard connector 301. When the first module 101 is pushed in by turning in the direction of arrow A until the first lever 41 is parallel to the front plate 31a, the pin of the connector 21 of the lower package 20 is pushed into the backboard connector 301, The connector 21 of the lower package 20 is connected to the backboard connector 301.

Also, the contact surface of the first engagement piece 41c with the engagement hole 200b comes into contact with the opening edge of the engagement hole 200b, and the rotation of the first lever 41 in the arrow A direction is restricted. The connector 11 of the upper package 10 abuts on the backboard connector 301, and a reaction force corresponding to the insertion force due to the rotation of the first lever 41 is generated. By this reaction force, the upper package 10 is guided to the long hole 10b and is released in the −X direction. For this reason, the pins of the connector 11 are not completely inserted into the holes of the backboard connector 301.

The insertion operation of the lower package 20 by the first lever 41 applies an insertion force only to the corresponding lower package 20. Further, this insertion operation applies a reaction force of the insertion force to the upper package 10 to guide it in the −X direction through the long hole 10b, thereby preventing the connector 11 and the backboard connector 301 from being fitted. Accordingly, excessive insertion force is not applied to the upper package 10 during the insertion operation of the lower package 20 by the first lever 41, and warpage or breakage of the upper package 10 can be suppressed.

In the state shown in FIG. 4B, when the operator turns the second lever 42 in the direction of arrow A around the rotation shaft 42b from the second turning end 42a of the second lever 42, the insertion by turning of the second lever 42 is performed. Due to the force, the upper package 10 is pushed in the + X direction, and the second engagement piece 42c and the first engagement plate portion 31ga come into contact with each other. For this reason, the insertion force increases with the contact position as an action point, and the upper package 10 is pushed in the + X direction. Then, the upper package 10 is guided in the long hole 10b and slides in the + X direction. When the upper package 10 is pushed in until the second lever 42 is parallel to the front plate 31a by turning in the direction of arrow A, the state shown in FIG. 4C is obtained.

FIG. 4C shows a state where the connector 21 of the lower package 20 is fitted to the backboard connector 301 and the connector 11 of the upper package 10 is also fitted to the backboard connector 301. When the upper package 10 is pushed in by turning in the direction of arrow A until the second lever 42 is parallel to the front plate 31a, the pins of the connector 11 of the upper package 10 are also pushed into the backboard connector 301. Ten connectors 11 are fitted to the backboard connector 301. Then, the shaft of the fixing screw 32 comes into contact with the end of the elongated hole 10b on the −X direction side, and the sliding of the upper package 10 stops.

4A to 4C, the first module 101 is inserted into the slot 200a by the first lever 41, and the connector 21 of the lower package 20 is first connected to the backboard connector 301. The connector 11 of the upper package 10 is connected to the backboard connector 301 by the two levers 42. Thus, by operating the

levers

41 and 42 with a time difference, the

packages

10 and 20 corresponding to the

levers

41 and 42 can be fitted into the backboard connector 301. That is, it is possible to suppress warpage or breakage of the upper package 10 that occurs when they are simultaneously fitted.

Next, an operation for removing the first module 101 from the slot 200a will be described. In the state of FIG. 4C, when the second lever 42 is rotated in the direction of arrow B about the rotation shaft 42b, the second engagement piece 42d comes into contact with the first engagement plate portion 31ga, and the module chassis 31 is moved in the + X direction. Push into. As a result, a pulling force acts on the upper package 10 in the −X direction, and the upper package 10 is guided by the elongated hole 10b to move in the −X direction, resulting in the state shown in FIG. 4D.

4D shows a state where the connector 11 of the upper package 10 is removed from the backboard connector 301 while the connector 21 of the lower package 20 is connected to the backboard connector 301. FIG. The connector 11 of the upper package 10 is removed from the backboard connector 301 by the removal force of the upper package 10 in the −X direction.

During the removal operation of the upper package 10 by the second lever 42, the removal force is applied only to the corresponding upper package 10, and the removal from the backboard connector 301 is prevented without applying the removal force to the lower package 20. Accordingly, excessive pulling force is not applied to the lower package 20 during the pulling operation by the second lever 42, and warpage or breakage of the lower package 20 can be suppressed.

In the state of FIG. 4D, when the first lever 41 is rotated in the direction of arrow B about the rotation shaft 41b, the second engagement piece 41d contacts the bent plate portion 200c and pushes the front chassis 200 in the + X direction. . As a result, a pulling force acts on the lower package 20 in the −X direction, and the state shown in FIG. 4E is obtained.

FIG. 4E shows a state in which the connector 11 of the upper package 10 is removed from the backboard connector 301 and the connector 21 of the lower package 20 is also removed from the backboard connector 301. The connector 21 of the lower package 20 is removed from the backboard connector 301 by the removal force of the lower module in the −X direction. Thus, by operating the

levers

41 and 42 with a time difference, the

packages

10 and 20 corresponding to the

levers

41 and 42 can be removed from the backboard connector 301. That is, it is possible to suppress warping or breakage of the upper package 10 that occurs when it is simultaneously removed.

In FIG. 3, the computer 1 may have a two-stage structure in which the upper package 10 is used in two stages instead of the lower package 20, and three levers may be provided. When three levers are used, two openings 31c are provided in the Z direction in the front plate 31a of the module chassis 31, and the second levers 42 of the upper packages 10 are inserted into the openings 31c. The operation of the first lever 41 is the same as in FIGS. 4A to 4E.

First, as shown in FIG. 4A, by pushing the first lever 41, the module chassis 31 is inserted into the slot 200a. As shown in FIG. 4B, when the operation of the first lever 41 is completed, the two upper packages 10 are in a position shifted in the −X direction from the fitting completion position by Δx. Each connector 11 has not started mating with the backboard connector 301.

Next, when the second lever 42 is operated for each of the upper packages 10, the upper packages 10 are inserted by Δx, and the fitting between the connector 11 and the backboard connector 301 is completed. When the upper package 10 is removed, the upper lever 10 can be removed at different timings by operating the first lever 41 after operating the second lever 42 for each of the upper packages 10.

<Second module 102>
Next, the second module 102 will be described. The same parts as those of the first module 101 are denoted by the same reference numerals, and the description thereof is omitted. In the first module 101, when the first module 101 is inserted, the fixed lower package 20 is inserted first, and then the sliding upper package 10 is inserted. When the first module 101 is removed, the sliding upper package 10 is removed first, and then the fixed lower package 20 is removed.

On the other hand, in the second module 102, when the second module 102 is inserted, the sliding lower package 20 is inserted first, and then the fixed upper package 10 is inserted. Then, when the second module 102 is extracted, the fixed upper package 10 is extracted first, and then the sliding lower package 20 is extracted.

FIG. 5 is a partially broken perspective view of the second module 102. FIG. 6 is an exploded perspective view of the second module 102. In the second module 102, the lower package 20 is held by the module chassis 31 so as to be slidable in the insertion / extraction direction (X direction), and the upper package 10 is fixed to the module chassis 31.

Specifically, for example, in the second module 102, the fixing holes 10 a are provided at the four corners of the upper package 10, as in the lower package 20, instead of the long holes 10 b. Therefore, in the second module 102, the upper package 10 does not slide in the X direction unlike the first module 101. The first module 101 is provided with the first lever 41 and the second lever 42, but the second module 102 is provided with the third lever 43. In the second module 102, elongated holes 20 b are provided at the four corners of the lower package 20 instead of the fixing holes 31 e, and elongated holes 20 c that pivotally support the third lever 43 are also provided. Further, since the first lever 41 is not provided, the front plate 31a is not provided with the hook 31b. Further, since there is no second lever 42, the front plate 31a is not provided with the opening 31c. The side plate 31f of the module chassis 31 is not provided with the second restricting portion 31g.

A third lever 43 is provided on the front plate 31a. The third lever 43 is a lever that is long in the Y direction. The length of the third lever 43 in the Y direction is equal to the length of the second module 102 in the Y direction. The width of the third lever 43 in the Z direction is slightly larger than the height of the second module 102 in the Z direction. One end of the third lever 43 is a rotation end 43a. At the other end of the third lever 43, a shaft 53 serving as a rotation shaft is provided.

An edge plate portion 31k is provided on the upper edge of the front plate 31a. The edge plate portion 31k is a plate-like member that is bent in the + X direction from the upper end edge of the front plate 31a, is parallel to the XY plane, and extends in the Y direction. The shaft 53 is inserted into an insertion hole (not shown) formed in the edge plate portion 31k and an insertion hole 31i formed in the bottom plate 31d of the module chassis 31. Thus, the third lever 43 is pivotally supported so as to be rotatable about the shaft 53 in the arrow AB direction (see FIG. 7). The other end of the third lever 43 is provided with a first engagement piece 43b and a second engagement piece 43c. The first engagement piece 43b engages with the engagement hole 200b of the front chassis 200. The second engagement piece 43 c engages with the stepped portion 200 d of the front chassis 200. A fan-shaped pinion gear 51 is provided in the vicinity of the insertion hole 31 i of the shaft 53.

A gear guide 31j is provided in the vicinity of the insertion hole 31i of the bottom plate 31d of the module chassis 31. The gear guide 31j is composed of two parallel protrusions 31ja and 31jb extending in the X direction on the bottom plate 31d. The protrusion 31ja is longer than the protrusion 31jb. The gear guide 31j regulates the gear member 52 so that the gear member 52 placed on the bottom plate 31d slides in the X direction.

The gear member 52 is a plate-like member that is long in the X direction and is placed on the bottom plate 31d so as to be sandwiched between the protrusions 31ja and 31jb. A long side 52a extending in the X direction is provided on one side of the gear member 52 parallel to the X direction. The long side 52a is in sliding contact with the long protrusion 31ja. On the other side parallel to the X direction opposite to one side of the gear member 52, a short side 52b extending in the X direction is provided. The short side 52b is shorter than the long side 52a and is in sliding contact with the protrusion 31jb. Further, on the other side of the gear member 52, a rack gear 52c is provided on the + X direction side of the short side 52b. The rack gear 52 c extends in the X direction and meshes with the pinion gear 51. A boss 52 d is provided on the surface of the gear member 52 so as to protrude in the + Z direction, and is inserted into the elongated hole 20 c of the lower package 20. That is, the gear member 52 is guided in the X direction by the gear guide 31j and the long hole 20c, and slides by the length of the long hole 20c in the X direction.

7A to 7D are cross-sectional views showing an example of an operation procedure of the third lever 43. FIG. Of FIGS. 7A to 7D, FIGS. 7A to 7C show an operation example at the time of insertion, and FIG. 7D shows an operation example at the time of removal. 7A to 7C show cross sections of the second module 102 cut along the XY plane. 7A to 7C, the direction of arrow A is the direction in which the third lever 43 rotates around the shaft 53 that is the rotation axis so as to approach the front plate 31a in the XY plane. An arrow B direction is a direction opposite to the A direction, and the third lever 43 rotates around the shaft 53 so as to be separated from the front plate 31a in the XY plane.

FIG. 7A shows a state where the second module 102 is inserted into the slot 200a of the front chassis 200. FIG. The third lever 43 is opened in the direction of arrow B by an angle of γ (= α + β). In this state, the boss 52d abuts against the opening edge of the elongated hole 20c on the −X direction side, and the pinion gear 51 and the rack gear 52c mesh. Further, in the lower package 20, the axis of the stopper 34 comes into contact with the opening edge on the + X direction side of the long hole 20b. Accordingly, in the X direction, the position of the edge of the upper package 10 on the −X direction side and the position of the edge of the lower package 20 on the −X direction side coincide with each other. In the state of FIG. 7A, the

connectors

11 and 21 are not in contact with the backboard connector 301.

In the state of FIG. 7A, when the rotation end 43a of the third lever 43 is rotated by an angle α around the shaft 53 in the direction of arrow A, the pinion gear 51 causes the rotation of the third lever 43 to be a gear member. 52 is converted to sliding in the + X direction. By rotating the third lever 43 by the angle α in the direction of arrow A, the boss 52d slides in the + X direction of the elongated hole 20c and comes into contact with the opening edge on the + X direction side. As a result, the lower package 20 moves in the + X direction.

This rotation operation causes the gear member 52 to push the opening edge in the + X direction of the elongated hole 20c, so that the lower package 20 is inserted in the + X direction by Δx more than the upper package 10. Δx corresponds to the length of the long hole 20c in the X direction. The upper package 10 fixed to the module chassis 31 is also inserted in the + X direction. That is, the upper package 10 and the lower package 20 are shifted in the fitting timing of the

connectors

11 and 21. Then, the connector 21 of the lower package 20 is connected to the backboard connector 301, resulting in the state of FIG. 7B.

During the mounting operation of the lower package 20 by the third lever 43, an insertion force is applied only to the lower package 20, and a reaction force of the insertion force is applied to the upper package 10 to connect the connector 11 and the backboard connector 301. To prevent. Thereby, simultaneous insertion of a plurality of packages can be avoided, and warpage or breakage of the

packages

10 and 20 caused by displacement between the

connectors

11 and 21 and the backboard connector 301 at the time of simultaneous insertion can be suppressed.

FIG. 7B shows a state in which the rotation end 43a of the third lever 43 is further rotated in the direction of arrow A by an angle α with the shaft 53 as the rotation center from the state of FIG. 7A. In the state of FIG. 7B, the lower package 20 is fixed to the front chassis 200 in a state where the insertion has been completed. In the state of FIG. 7B, when the rotation end 43a of the third lever 43 is rotated in the direction of arrow A by an angle β around the shaft 53 as the rotation center, the engagement between the pinion gear 51 and the rack gear 52c is released. Thereafter, the pinion gear 51 idles. Therefore, the lower package 20 is not pushed further by the insertion force of the third lever 43. On the other hand, the first engagement piece 43b of the third lever 43 is inserted into the engagement hole 200b.

For this reason, the insertion force increases with this contact position as an operating point, and the connector 11 of the upper package 10 starts to connect to the corresponding backboard connector 301 by the insertion force due to the rotation of the third lever 43. When the third lever 43 is rotated by an angle β by the rotation in the direction of arrow A, the first engagement piece 43b of the third lever 43 inserted into the engagement hole 200b is on the front plate 31a side of the engagement hole 200b. It abuts on the opening edge. As a result, the upper package 10 is pushed in the + X direction and moves together with the module chassis 31 by the distance between the stopper 34 and the elongated hole 20b. When the second module 102 is pushed into the slot 200a in this way, the connector 11 of the upper package 10 is connected to the backboard connector 301, resulting in the state of FIG. 7C.

FIG. 7C shows a state where the third lever 43 is pushed in the direction of arrow A by an angle β from the state of FIG. 7B. 7C, with the connector 21 of the lower package 20 connected to the backboard connector 301, the upper package 10 moves in the + X direction together with the module chassis 31 and is inserted into the slot 200a, and the connector 11 is inserted into the backboard connector 301. Connected to.

7A to 7C, when the plurality of

packages

10 and 20 are mounted with a time difference by the third lever 43, the warpage of the

packages

10 and 20 caused by the simultaneous insertion of the plurality of

packages

10 and 20 can be reduced. Damage can be suppressed. Further, since the lever to be operated is only the third lever 43, it is possible to prevent an operation error that the operation target lever is mistaken.

Next, an operation for removing the second module 102 from the slot 200a will be described. In the state of FIG. 7C, when the rotation end 43a of the third lever 43 is rotated by an angle β in the direction of arrow B around the shaft 53 as the rotation center, the second engagement piece 43c of the third lever 43 is moved to the front chassis 200. The stepped portion 200d is engaged. The engagement position serves as an action point, and the removal force increases. The connector 11 of the upper package 10 is removed from the backboard connector 301 by the removal force caused by the rotation of the third lever 43, and the state shown in FIG. 7D is obtained. .

During the removal operation of the upper package 10 by the third lever 43, an insertion force is applied only to the upper package 10, while the pinion gear 51 slips and prevents the lower package 20 from being removed from the backboard connector 301. . Thereby, simultaneous removal of the plurality of

packages

10 and 20 can be avoided, and warpage and breakage of the

packages

10 and 20 caused by simultaneous removal can be suppressed.

In the state of FIG. 7D, when the rotation end 43a of the third lever 43 is further rotated by the angle α in the direction of arrow B around the shaft 53 as the rotation center, the pinion gear 51 is engaged with the rack gear 52c, and the gear member 52 is engaged. Slide in the -X direction. Along with this, the boss 52d also slides in the −X direction and comes into contact with the opening edge of the long hole 20c on the front plate 31a side. Then, the engagement position between the second engagement piece 43c and the stepped portion 200d serves as an action point, and the removal force increases. As a result, the connector 21 of the lower package 20 is removed from the backboard connector 301 by the removal force generated by the rotation of the third lever 43, resulting in the state shown in FIG. 7A.

7C, FIG. 7D, and FIG. 7A, the

packages

10 and 20 generated by the simultaneous removal of the plurality of

packages

10 and 20 by the operation of removing the plurality of

packages

10 and 20 by the third lever 43 with a time difference. Warpage and damage can be suppressed. Further, since the lever to be operated is only the third lever 43, it is possible to prevent an operation error that the operation target lever is mistaken.

<Third module 103>
Next, the third module 103 will be described. The same parts as those of the first module 101 and the second module 102 are denoted by the same reference numerals, and the description thereof is omitted.

FIG. 8 is a partially broken perspective view of the third module 103. The third module 103 is a module in which the package is configured in one stage in the second module 102. The package 80 is a package having the same configuration as the upper package 10 of the second module 102, and is a circuit board in which circuit components and connectors 11 are mounted on the board 80m. Since the lower package 20 of the second module 102 is not mounted, the package 80 is mounted close to the bottom plate 31d. When the third module 103 is mounted in the slot 200a, the package 80 is pushed into the slot 200a by rotating the third lever 43 in the direction of arrow A (see FIGS. 7A to 7C) about the shaft 53 as a rotation axis. Then, the connector 11 is connected to the backboard connector 301. Further, by rotating the third lever 43 in the direction of arrow B (see FIG. 7D) about the shaft 53 as the rotation axis, the connector 11 is removed from the backboard connector 301, and the package 80 is detached from the slot 200a. .

As described above, modules (first module 101 and second module 102) having the upper package 10 slidable in the insertion / extraction direction and the fixed lower package 20 are inserted into and removed from the computer 1 described above. Thereby, the operator can insert / remove the upper package 10 and the lower package 20 in the module individually with a time difference. Thereby, it is possible to prevent an excessive insertion / extraction force from being applied to the other package at the time of insertion / extraction of one package, and it is possible to suppress warpage or breakage of the

substrates

10m, 20m and the stud 33. Therefore, a package with a large number of connectors can be made into one module in two stages, and the height of the module can be reduced.

The first module 101 has a plurality of studs 33 inserted into the upper package 10 and the lower package 20 and fixed to the lower package 20 or the module chassis 31. The upper package 10 has a plurality of studs 33 as first insertion holes, and has a long hole 10b that is elongated in the insertion / removal direction. On the other hand, the lower package 20 has a fixing hole 20a into which a plurality of studs 33 are inserted as a second insertion hole. Thereby, sliding in the insertion / extraction direction of the upper package 10 and fixation of the lower package 20 can be realized by existing members, and an increase in the number of components in the first module 101 can be suppressed.

Similarly, the second module 102 has a plurality of studs 33 inserted into the upper package 10 and the lower package 20 and fixed to the upper package 10 or the module chassis 31. The lower package 20 has a plurality of studs 33 inserted as first insertion holes, and has a long hole 20b elongated in the insertion / removal direction. On the other hand, the upper package 10 has a fixing hole 10a into which a plurality of studs 33 are inserted as a second insertion hole. Thereby, the sliding of the lower package 20 in the insertion / extraction direction and the fixing of the upper package 10 can be realized by existing members, and an increase in the number of components in the second module 102 can be suppressed.

Further, when the first module 101 is inserted, the lower package 20 is inserted before the upper package 10, but a reaction force against the insertion force acts on the upper package 10 and is released in the removal direction (first Status). Therefore, no insertion force is applied to the upper package 10, and warpage or breakage of the substrate 10m or the stud 33 can be suppressed.

Thereafter, when the upper package 10 is inserted, the upper package 10 is inserted by sliding in the insertion direction with respect to the lower package 20, and the connector 11 and the backboard connector 301 are fitted (second state). ). Accordingly, no insertion force is applied to the mounted lower package 20, and warpage or breakage of the substrate 20 m or the stud 33 can be suppressed.

Also, the first module 101 has a first lever 41 corresponding to the lower package 20. A first engagement piece 41c is provided at the first base end 41x of the first lever 41 and engages with the engagement hole 200b of the front chassis 200 which is the first restricting portion. Thus, when the operator first rotates the first lever 41 so as to be close to the front plate 31a of the first module 101, the first engagement piece 41c and the engagement hole 200b are engaged. With this engagement position as an operating point, the insertion force of the lower package 20 by the first lever 41 increases, the lower package 20 is pushed in, and a reaction force is generated by pushing the upper package 10, so that the upper package 10 Slide in the removal direction. As a result, an operation that results in the first state can be realized. In addition, operability can be improved due to lever operation.

Also, the first module 101 has a second lever 42 corresponding to the upper package 10. A first engagement piece 42c is provided at the second base end 42x of the second lever 42, and engages with the first engagement plate portion 31ga of the second restricting portion 31g. In the first state, when the operator first rotates the second lever 42 so as to approach the front plate 31a of the first module 101, the first engagement piece 42c and the first engagement plate portion 31ga are engaged. To do. With this engagement position as an operating point, the insertion force of the upper package 10 at the second lever 42 increases, and the upper package 10 is pushed in. Thereby, operation which changes to the said 2nd state is realizable. In addition, operability can be improved due to lever operation.

Thereafter, when the first module 101 is removed, the upper package 10 is removed by sliding in the removal direction with respect to the lower package 20 (third state). Therefore, when the upper package 10 is removed, no lowering force is applied to the lower package 20, and warpage and damage to the substrate 20m and the stud 33 can be suppressed.

Thereafter, by removing the lower package 20, the connector 21 is removed from the backboard connector 301 (fourth state). Therefore, the removal force is not applied to the removed upper package 10, and the warpage and breakage of the substrate 10m and the stud 33 can be suppressed.

Also, the first module 101 has a second lever 42 corresponding to the upper package 10. Further, a second engagement piece 42d is provided at the second base end 42x of the second lever 42, and engages with the first engagement plate portion 31ga of the second restricting portion 31g. In the second state, when the operator first rotates the second lever 42 away from the front plate 31a of the first module 101, the second engagement piece 42d and the first engagement plate portion 31ga are engaged. To do. With this engagement position as an operating point, the removal force of the upper package 10 at the second lever 42 increases, and the upper package 10 is slid in the removal direction and removed. Thereby, the operation to transition to the third state can be realized. In addition, operability can be improved due to lever operation.

Also, the first module 101 has a first lever 41 corresponding to the lower package 20. Further, a second engagement piece 41d is provided at the first base end 41x of the first lever 41, and engages with the bent plate portion 200c of the front chassis 200 that is the first restricting portion. In the third state, when the operator first pivots the pivot end 41a of the first lever 41 away from the front plate 31a of the first module 101, the second engagement piece 41d and the bent plate portion 200c. Engage. With this engagement position as an operating point, the removal force of the lower package 20 at the first lever 41 increases, and the lower package 20 is slid in the removal direction and removed. As a result, an operation for achieving the fourth state can be realized. In addition, operability can be improved due to lever operation.

Similarly, the second module 102 having the fixed upper package 10 and the lower package 20 slidable in the insertion / removal direction is inserted into and removed from the computer 1 described above (first state). Thus, when the second module 102 is inserted, when the lower package 20 is inserted, only the lower package 20 is applied with an insertion force and slides in the insertion direction with respect to the upper package 10. Does not slide because no insertion force is applied. Therefore, the connector 21 of the lower package 20 is fitted to the backboard connector 301, and the warpage and breakage of the substrate 10m and the stud 33 can be suppressed.

Thereafter, when the upper package 10 is inserted, only an insertion force is applied to the upper package 10 and slides in the insertion direction with respect to the lower package 20, and no insertion force is applied to the mounted lower package 20 (first 2 states). Therefore, the connector 11 of the upper package 10 is fitted to the backboard connector 301, and the warpage and breakage of the board 20m and the stud 33 can be suppressed.

Further, the second module 102 has a third lever 43. The third lever 43 has a base end 43x pivotally supported on the front plate 31a side and a rotation end 43a that is close to or away from the second module 102, and allows the upper package 10 and the lower package 20 to move. The slot 200a is inserted and removed. Further, the second module 102 has a conversion mechanism that is detachably connected to the base end 43 x of the third lever 43 and slidable in the insertion / extraction direction with respect to the upper package 10. When engaging with the base end 43x of the third lever 43, the conversion mechanism converts the rotation of the third lever 43 into sliding in the insertion / extraction direction, and when not engaging with the base end 43x of the third lever 43, The rotation of the three levers 43 is not converted to sliding in the insertion / extraction direction.

When the third lever 43 and the conversion mechanism are engaged, when the rotation end 43a of the third lever 43 is rotated so as to be close to the second module 102, the lower package 20 is pushed in the insertion direction. A first insertion force is applied to enter the first state. Therefore, no insertion force is applied to the upper package 10, and warpage or breakage of the substrate 10m or the stud 33 can be suppressed.

When the third lever 43 is rotated so as to approach the second module 102 after the first state, the engagement between the third lever 43 and the conversion mechanism is released, and the second package 10 is pushed in the insertion direction. An insertion force is applied and the state transitions to the second state. Accordingly, no insertion force is applied to the mounted lower package 20, and warpage or breakage of the substrate 20 m or the stud 33 can be suppressed.

The conversion mechanism is provided so as to be slidable in the insertion / removal direction with respect to the lower package 20 and a fan-shaped pinion gear 51 that rotates together with the shaft 53 that is the rotation axis of the third lever 43. And a gear member 52 having a rack gear 52c that meshes with the gear member 52.

When the pinion gear 51 and the rack gear 52c are engaged with each other, when the rotation end 43a of the third lever 43 is rotated so as to be close to the second module 102, the gear member 52 is slid in the insertion direction. Thus, a first insertion force is applied to push the lower package 20 in the insertion direction, and the first state is established. Therefore, no insertion force is applied to the upper package 10, and warpage or breakage of the substrate 10m or the stud 33 can be suppressed.

When the rotation end 43a of the third lever 43 is rotated so as to approach the second module 102 after the first state, the engagement between the pinion gear 51 and the rack gear 52c is released, and the pinion gear 51 rotates idle. A second insertion force for pushing the upper package 10 in the insertion direction is applied, and the state transitions to the second state. Accordingly, no insertion force is applied to the mounted lower package 20, and warpage or breakage of the substrate 20 m or the stud 33 can be suppressed.

Further, when the second module 102 is removed from the front chassis 200, the upper package 10 is provided with a first removal force that pulls the second module 102 in the removal direction for removing the second module 102 from the slot 200a after the second state. In this case, the upper package 10 is slid in the removal direction with respect to the lower package 20 by the first removal force, and the connector 11 is removed from the backboard connector 301 (third state). Therefore, when the upper package 10 is removed, no lowering force is applied to the lower package 20, and warpage and damage to the substrate 20m and the stud 33 can be suppressed.

Further, when a second removal force that pulls the second module 102 in the removal direction after the third state is applied to the lower package 20, the lower package 20 is slid in the removal direction with respect to the upper package 10 by the second removal force. The connector 11 is removed from the backboard connector 301 by moving the connector 11 (fourth state). Therefore, when the lower package 20 is removed, the removal force is not applied to the removed upper package 10, and the warpage and breakage of the substrate 10m and the stud 33 can be suppressed.

Further, the second module 102 includes the third lever 43 and the conversion mechanism described above. When the base end 43x of the third lever 43 and the conversion mechanism are not engaged after the second state, if the third lever 43 is rotated away from the second module 102, the upper package is removed in the removal direction. A first removal force for pulling out 10 is applied, and the state transitions to the third state. When the upper package 10 is removed, the base end 43x of the third lever 43 is not engaged with the conversion mechanism, so that no lowering force is applied to the lower package 20, and the upper package 10 is removed from the lower package 20. Slide in the direction. Therefore, warpage and breakage of the substrate 20m and the stud 33 can be suppressed.

Further, after the third state, when the pivot end 43a of the third lever 43 is pivoted away from the second module 102, the base end 43x of the third lever 43 and the conversion mechanism are engaged and removed. A second removal force for pulling out the lower package 20 in the direction is applied, and the state transitions to the fourth state. When the lower package 20 is removed, the base end 43x of the third lever 43 and the conversion mechanism engage with each other, so that the removal force is not applied to the removed upper package 10, and the lower package 20 is not attached to the upper package 10. Slide in the removal direction. Therefore, warpage and breakage of the substrate 10m and the stud 33 can be suppressed.

Further, the conversion mechanism includes the pinion gear 51 and the gear member 52 described above. If the rotation end 43a of the third lever 43 is rotated away from the second module 102 when the pinion gear 51 and the rack gear 52c are not engaged with each other, a first removal force is applied, Transition to 3 states. When the upper package 10 is removed, the pinion gear 51 and the rack gear 52c are not in mesh with each other, so that no lowering force is applied to the lower package 20, and the upper package 10 slides in the removal direction with respect to the lower package 20. . Therefore, warpage and breakage of the substrate 20m and the stud 33 can be suppressed.

When the pivot end 43a of the third lever 43 is pivoted away from the second module 102 after the third state, the pinion gear 51 and the rack gear 52c mesh with each other, and a second removal force is applied. Transition to the fourth state. When the lower package 20 is removed, the pinion gear 51 and the rack gear 52c are engaged with each other. Therefore, an extraction force is applied to the lower package 20, and the lower package 20 slides in the extraction direction with respect to the upper package 10. Therefore, warpage and breakage of the substrate 10m and the stud 33 can be suppressed.

Further, the third module 103 can be inserted into and removed from the computer 1 described above. Thereby, various modules can be inserted and removed, and the highly versatile computer 1 can be provided.

Further, in the first module 101 and the second module 102, the lower package 20 may be disposed above the upper package 10. Each module may be configured without a lever. In this case, the operator directly inserts and removes the module.

Although the present invention has been described in detail with reference to the accompanying drawings, the present invention is not limited to such specific configurations, and various modifications and equivalents within the spirit of the appended claims Includes configuration.

Claims

One or more modules can be inserted and removed,
A housing having one or more through holes into which the module is inserted and removed;
A plate-like member fixed to the housing so as to close the other opening opposite to the one opening through which the module is inserted and removed, and a plate surface positioned at the other opening And a back plate having a plurality of plate surface connectors provided on,
The module is
A first substrate having a first connector that fits with a first plate connector of the plurality of plate connectors when the module is inserted into the through hole;
A second substrate having a second connector that fits with a second plate connector of the plurality of plate connectors when the module is inserted into the through hole;
The first substrate and the second substrate so that the first connector and the second connector are opposed to the back plate and the first substrate is positioned above or below the second substrate. A module housing that holds the first substrate slidably in the insertion / extraction direction with respect to the through-hole of the module, and fixes the second substrate;
A computer characterized by comprising:
The computer according to claim 1,
A plurality of pillars inserted into the first substrate and the second substrate and fixed to the second substrate or the module housing;
The first substrate has the first insertion hole into which the plurality of support columns are inserted and is long in the insertion / extraction direction,
The computer, wherein the second substrate has a second insertion hole into which the plurality of support columns are inserted.
The computer according to claim 1,
By transitioning from the first state to the second state, the module is attached to the housing,
In the first state, when a first insertion force is applied to push the second substrate in the insertion direction in which the module is inserted into the through hole, the second connector and the second plate surface are applied by the first insertion force. In a removal direction in which the module is removed from the through-hole by a reaction force generated by fitting the connector and the first connector and the first plate surface connector coming into contact with each other by pushing the second board. The first substrate is slid;
In the second state, when a second insertion force that pushes the module in the insertion direction after the first state is applied to the first substrate, the second insertion force causes the second substrate to move toward the second substrate. A computer in which one board is slid in the insertion direction and the first connector and the first plate connector are fitted together.
The computer according to claim 3, wherein
The module includes a first base end pivotally supported on the side opposite to the side on which the back plate is provided, and a first rotation end that approaches or separates from the module by the rotation of the first base end. A first lever having
The casing engages with the first base end of the first lever and rotates when the first rotating end of the first lever is rotated close to the module. Having a first regulating part to regulate,
When the first pivot end of the first lever is pivoted so as to be close to the module, a first insertion force that pushes the second substrate in the insertion direction is applied to enter the first state. A computer characterized by that.
The computer according to claim 3, wherein
The module includes a second base end pivotally supported on the side opposite to the side on which the back plate is provided, and a second rotation end that approaches or separates from the module by the rotation of the second base end. And having a second lever for inserting and removing the first substrate with respect to the through hole,
The module housing engages with the second base end of the second lever and rotates when the second rotation end of the second lever is rotated so as to be close to the module. Having a second restricting part that regulates
After the first state, when the second turning end of the second lever is turned so as to be close to the module and restricted by the second restriction part, the second substrate is pushed in the insertion direction. A computer, wherein a second insertion force is applied to transition to the second state.
The computer according to claim 3, wherein
By transitioning from the third state to the fourth state, the module is removed from the housing,
In the third state, when a first removal force for pulling out the module in the removal direction is applied to the first substrate after the second state, the first removal force causes the first substrate to move with respect to the second substrate. 1 substrate is slid in the removal direction, and the first connector is removed from the first plate surface connector;
In the fourth state, when a second removal force for pulling out the module in the removal direction after the third state is applied to the second substrate, the second connector causes the second connector to be moved to the second plate. A computer characterized by being removed from the surface connector.
The computer according to claim 6, wherein
The module includes a second base end pivotally supported on the side opposite to the side on which the back plate is provided, and a second rotation end that approaches or separates from the module by the rotation of the second base end. And having a second lever for inserting and removing the first substrate with respect to the through hole,
When the second pivot end of the second lever is pivoted away from the module, the module housing engages with the second base end of the second lever to rotate the second lever. Having a second regulating part to regulate,
When the second turning end of the second lever is turned away from the module and restricted by the second restricting portion after the second state, the first removal force is applied, A computer which makes a transition to the third state.
The computer according to claim 6, wherein
The module has a first base end pivotally supported on the side opposite to the side on which the back plate is provided and a first base end so as to be close to or separated from the module by the rotation of the first base end. A first lever having a moving end;
The housing includes a first restricting portion that engages with the first base end of the first lever to restrict the rotation when the first lever is turned away from the module. Have
After the third state, when the first turning end of the first lever is turned away from the module and restricted by the first restricting portion, the second removal force is applied to the second substrate. And a transition to the fourth state.
The computer according to claim 1,
By transitioning from the first state to the second state, the module is attached to the housing,
In the first state, when a first insertion force for pushing the first substrate in an insertion direction for inserting the module into the through hole is given, the first substrate is applied to the second substrate by the first insertion force. Is slid in the insertion direction to fit the first connector and the first plate surface connector,
In the second state, when a second insertion force that pushes the module in the insertion direction after the first state is applied to the second substrate, the second insertion force causes the second state to be applied to the first substrate. A computer in which the board is slid in the insertion direction and the second connector and the second plate surface connector are fitted together.
The computer according to claim 9, wherein
The module has a base end pivotally supported on the side opposite to the side on which the back plate is provided, and a rotation end that approaches or separates from the module by the rotation of the base end, A lever for inserting and removing the first substrate and the second substrate with respect to the through hole;
The lever is slidable in the insertion / removal direction with respect to the first substrate and slidable in the insertion / removal direction with respect to the first substrate. A conversion mechanism that converts and does not convert rotation of the lever into sliding in the insertion / extraction direction when it does not engage with the base end,
When the base end and the conversion mechanism are engaged, when the lever is rotated so as to be close to the module, a first insertion force is applied to push the first substrate in the insertion direction. , The first state,
When the lever is rotated so as to approach the module after the first state, the engagement between the base end and the conversion mechanism is released, and the second insertion that pushes the second substrate in the insertion direction A computer, wherein a force is applied to make a transition to the second state.
The computer according to claim 10, wherein
The conversion mechanism is
A fan-shaped pinion gear that rotates with the lever;
A gear member that is slidable in the insertion / extraction direction with respect to the first substrate and has a rack gear that meshes with the pinion gear;
When the pinion gear and the rack gear are engaged with each other, when the lever is rotated so as to be close to the module, the gear member is slid in the insertion direction to insert the first substrate. A first insertion force that pushes in a direction is applied to enter the first state;
When the lever is rotated so as to approach the module after the first state, the engagement between the pinion gear and the rack gear is released, the pinion gear is idled, and the second board is inserted. A computer that is given a second insertion force that pushes in a direction and makes a transition to the second state.
The computer according to claim 9, wherein
By transitioning from the third state to the fourth state, the module is removed from the housing,
In the third state, when a first removal force for pulling out the module in the removal direction for removing the module from the through hole after the second state is applied to the second substrate, the first removal force causes the The second board is slid in the removal direction with respect to the first board and the second connector is removed from the second plate surface connector,
In the fourth state, when a second removal force for pulling out the module in the removal direction after the third state is applied to the first substrate, the second removal force causes the first substrate to move toward the second substrate. A computer in which the board is slid in the removal direction and the first connector is removed from the first plate connector.
The computer according to claim 12, comprising:
The module has a base end pivotally supported on the side opposite to the side on which the back plate is provided, and a rotation end that approaches or separates from the module, and the first substrate and the second substrate A lever that inserts and removes the substrate from the through hole;
The lever is slidable in the insertion / removal direction with respect to the first substrate and slidable in the insertion / removal direction with respect to the first substrate. A conversion mechanism that converts and does not convert rotation of the lever into sliding in the insertion / extraction direction when it does not engage with the base end,
When the lever is rotated away from the module when the base end and the conversion mechanism are not engaged after the second state, the first substrate is pulled out in the removal direction. With the removal force applied, transition to the third state,
When the lever is pivoted away from the module after the third state, the base end and the conversion mechanism engage with each other, and a second removal force that pulls the first substrate in the removal direction is generated. A computer which is given and makes a transition to the fourth state.
The computer according to claim 13, wherein
The conversion mechanism is
A fan-shaped pinion gear that rotates with the lever;
A gear member that is slidable in the insertion / extraction direction with respect to the first substrate and has a rack gear that meshes with the pinion gear;
When the pinion gear and the rack gear are not engaged with each other, when the lever is rotated so as to be separated from the module, the first extraction force is applied, and the state transitions to the third state.
When the lever is rotated so as to be separated from the module after the third state, the pinion gear and the rack gear mesh with each other, and the second pulling force is applied to the fourth state. A computer characterized by a transition.