JP2010283155A - Computer device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting structure such that high-density mounting connectors mounted on a plurality of substrates in a module which can be inserted into and extracted from a computer device can be engaged with reception-side connectors on a back board at the same time. <P>SOLUTION: A computer device includes mechanisms to move a sub-board 107 in up-down directions and right-left directions with respect to a main board 106. In the moving mechanism for the up-down directions, a hole 104 of the sub-board for fitting a support member 103 is in the shape of a long circle which is long in a direction perpendicular to the inserting direction of the module. The shape of the long-circle hole is so sized as to absorb structural errors of the module. In the right-left directions, the sub-board can move using a different-diameter step and a spacer of a shaft provided to a support member shaft part. The length by which the sub-board can move in the axial direction of the support member is also a dimension such that structural errors of the module can be absorbed. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a computer apparatus, and in particular, the computer apparatus includes a plurality of back-plug-in modules and a backboard to which each module is connected, and a backboard connection height prepared on a plurality of boards in each module. The present invention relates to a mounting structure of a computer apparatus in which a density mounting connector can be surely simultaneously fitted with a receiving connector on a backboard when a module is inserted.

  Conventionally, a configuration in which one computer device is mounted in one chassis was common, but due to the recent high-density mounting of information equipment, a pluggable back plug-in module is installed in the chassis. An increasing number of computer devices are provided. In the field of computers, a blade server is an example of this form. A blade server can have a plurality of blade modules mounted on a chassis. These blade type modules are connected to a common backboard prepared in the chassis. There are various types of blade-type modules, including a server computer with a CPU and a DIMM, an HDD module with an HDD and a RAID configuration, and a blade-type module with a DVD drive. Easy to expand.

  In order to deal with various applications as described above, some modules have a size corresponding to a plurality of modules with respect to other modules. When there are a plurality of substrates in this module and each substrate has a high-density mounting connector for connection to the backboard, it is necessary to simultaneously fit the high-density mounting connector on each substrate to the backboard. At this time, there is a problem that the position of the connector on the module side and the position of the connector on the backboard are shifted due to the shift in the structure of the module, and the connector does not fit. In response to this problem, Japanese Patent Laid-Open No. 2002-368456 provides a support member for supporting a board (sub board) other than the main board on a board (main board) on which the main logic is mounted in the module. A method is described in which the support member is provided with a mechanism capable of moving the sub-board in the axial direction of the support member, so that the displacement of the support member in the axial direction is absorbed and the connector is accurately fitted.

JP 2002-368456 A

  When a module having a plurality of boards each having a high-density mounting connector is mounted on a computer apparatus, the high-density mounting connectors on each board must be simultaneously and reliably fitted to the backboard. Here, the high-density mounting connector refers to a connector in which about 72 pins are arranged at intervals of about 2 mm in a narrow region such as 20 mm × 18 mm. In such high-density mounting connector fitting, high alignment accuracy is required in order to accurately align the pins arranged at a narrow pitch with the receiving-side connector pins on the backboard. However, when the module is inserted, the connector is misaligned due to error factors such as a misalignment of the connector mounting position and variations in the size of the created module sheet metal. These misalignments occur with respect to a plane perpendicular to the module insertion direction at the same time as the module insertion direction. Positioning of the high-density mounting connector in a plane perpendicular to the module insertion direction is facilitated by guiding the module-side connector to the receiving-side connector using guide pins. In order to perform alignment using a guide pin, a mechanism is required that allows the sub board to move within a plane perpendicular to the insertion direction of the module. With the mechanism described in Japanese Patent Laid-Open No. 2002-368456, alignment can be performed only in one direction within a plane perpendicular to the insertion direction of the module. For this reason, it is difficult to accurately fit the position of the high-density mounting connector with the position of the connector on the backboard side.

  The present invention solves the above problems and provides a mounting structure capable of simultaneously fitting a plurality of high-density mounting connectors mounted on a computer apparatus.

  The computer apparatus of the present invention has a module and a back board, and at least one module is provided with a main board and one or more sub boards, and the main board, the sub board, and the back board have high-density mounting connectors for connection. It is installed. The sub board includes a mechanism movable in two directions. One is a mechanism that can move in the axial direction of the support member, and this movable direction is defined as the left-right direction. The other is a mechanism that can move in the direction perpendicular to both the axial direction of the support member and the module insertion direction, and this movable direction is defined as the vertical direction. By providing the sub-board with the horizontal and vertical movement mechanisms, the connector can be aligned on a plane perpendicular to the module insertion direction.

  In the lateral movement mechanism, a step having different shaft diameters for supporting the sub board and a spacer movable in the axial direction of the support member are prepared in the shaft portion of the support member. The length by which the sub board adjusted by the support member and the spacer can move is a dimension capable of absorbing an axial displacement error of the support member in the module structure. The vertical movement mechanism has a structure in which the sub board can move along the guide by making the hole of the sub board for attaching the support member into an oblong shape that is long in the direction perpendicular to the insertion direction of the module. The shape of this oval hole is a dimension determined by the structure in the module, such as the distance that the sub board falls when the module is inserted, the allowable displacement of the guide, the effective fitting length of the connector, and the diameter of the support member. is there.

  By making the hole for supporting the support member of the sub board into an oval shape that is long in the direction perpendicular to the module insertion direction, the sub board can move in the vertical direction. The oval dimension is a dimension that can absorb the structural error of the module. In addition, the sub board can be moved in the left-right direction by a moving mechanism that is provided on the shaft portion of the support member and includes a step and a spacer having different diameters of the sub board support shaft. The length of the support member that can move in the axial direction is a dimension that can absorb the structural error of the module. With this two-way moving mechanism, it is possible to align the connectors in accordance with guide guidance on a plane perpendicular to the module insertion direction, and it is possible to simultaneously fit a plurality of high-density mounting connectors with high accuracy.

It is a perspective view which shows the outline of the mounting structure of the computer apparatus by one Embodiment of this invention. It is a figure explaining the shape of the hole for support member support provided in the sub board. It is explanatory drawing of the structural error of the up-down direction and the depth direction of the computer apparatus by one Embodiment of this invention. It is a figure which shows the positional relationship between board | substrates when a main board or a sub board makes a business trip in the depth direction at the time of module insertion. It is a figure which shows the positional relationship of the hole of a support member and a subboard at the time of module insertion. It is a figure which shows the structure where the support member was fixed with the module sheet metal and the main board. It is a figure which shows the example of a module provided with two sub boards.

  Embodiments of a computer apparatus mounting structure according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is a perspective view showing an outline of a mounting structure of a computer apparatus according to the present invention. A module 108 inserted into the housing 109 is provided with a main board 106 and a sub board 107. A rod-like support member 103 that supports the sub board 106 is fixed to the main board 106. On the other hand, the sub board 107 is provided with a hole 104, and the sub board 107 is fixed to the main board 106 with a predetermined play by passing the support member 103 through the hole 104. The high-density mounting connector 101 on the main board 106 and the high-density mounting connector 102 on the sub board 107 include guide pins 113 and 114, and the receiving side height mounted on the back board 110 installed inside the housing 109. The density mounting connectors 111 and 112 have guide holes into which guide pins are inserted. Therefore, the high-density mounting connector 101 on the main board 106 and the high-density mounting connector 102 on the sub board 107 follow the guidance of the guide pins 113 and 114, and receive high-density mounting connectors 111 and 111 mounted on the backboard 110. 112 is fitted. Further, the computer apparatus of the present invention is provided with a mechanism capable of moving the sub board 107 in the vertical direction and the horizontal direction in accordance with the guidance of the guide pin 113. The interface between the main board 106 and the sub board 107 is connected by a cable 105.

  First, the vertical movement mechanism will be described. The support member mounting hole 104 on the sub board 107 has an oval shape that is long in the direction perpendicular to the module insertion direction. As a result, the sub board 107 is movable in the vertical direction along the guide. FIG. 2 shows an enlarged view of the hole 104 for attaching the support member. The oval shape is determined by the diameter X of the circle and the straight portion Y of the oval. That is, the oval hole 104 has a shape in which a rectangle with a width of X and a length of Y in the vertical direction is sandwiched between two semicircles with a diameter X positioned above and below. These X and Y are lengths in a range in which an error generated in the module structure can be absorbed.

First, the range of the length of X is calculated from the structural error of the module related to the vertical direction and the depth direction. Errors in the structure of the module that can be considered as a cause of positional misalignment between the vertical direction and the depth direction include errors in the hole position for fixing the main board of the module sheet metal 108, errors in the mounting hole position of the high-density mounting connector 101 on the main board, etc. Is mentioned. When calculating the sum of these independent variation factors, a statistical method for calculating the square sum of squares is often used. When the elements of misalignment are set as a, b,..., The misalignment amount A (see FIG. 3) between the high-density mounting connector 101 on the main board and the high-density mounting connector 102 on the sub board in the vertical direction and the depth direction. Calculated as follows:
A = √ (a ² + b ² +...)

  For example, when a = 0.56 mm, b = 0.1 mm,..., A = 0.24 mm.

Due to this positional shift, when the module is inserted, the main board 106 may make a business trip in the insertion direction from the sub board 107 by A, or the sub board 107 may make a business trip from the main board 106 by A in the insertion direction. Further, as shown in FIG. 2, when the gap between the elongated hole 104 and the support member 103 is set to W, when the connector is fitted, the sub board 107 is pushed by the connector 112 on the back board side so that W is opposite to the module insertion direction. It is fitted in a state where it is pushed by (for example, W = 0.1 mm). When the fitting length error of the connector of the main board 106 and the sub board 107 is set to P, when the main board 106 makes a business trip as shown in FIG. 4A, the equation (1) is obtained, as shown in FIG. 4B. When the sub board 107 is on a business trip, P = A−W.
P = A + W (1)

If the effective fitting length of the connector is set to V (for example, V = 1.55 mm), the condition of the following formula (2) is necessary for the connector to be fitted.
V> P (2)

Since the maximum value of P is A + W from the equation (1), the equation (3) is established by substituting it into the equation (2).
V> A + W (3)

As shown in FIG. 2, when the diameter of the support member 103 is E (for example, E = 5.8 mm), it is expressed as X = E + 2W. Therefore, substituting this into equation (3) yields equation (4).
2V-2A + E> X (4)

Further, since X needs to be larger than the diameter E of the support member, the following equation (5) is established.
X> E (5)

Equation (6) is established by Equation (4) and Equation (5).
2V-2A + E>X> E (6)

  As described above, the diameter X of the circle is determined within a range in which an error in the structure of the module can be absorbed as shown in the equation (6). In one example, X = 6 mm.

Next, the range of the length of Y is calculated from the amount of error in the structure of the module. If each displacement element such as the dimensional error of the backboard fixing hole position on the chassis and the mounting position error of the high-density mounting connectors 111, 112 on the backboard is set as a1, b1,. The positional deviation amount B (see FIG. 3) between the high-density mounting connector 101 on the main board and the high-density mounting connector 112 on the receiving back board can be calculated as follows, similarly to the calculation in A.
B = √ (a1 ² + b1 ² +...)

  As an example, a1 = 0.1 mm, b1 = 0.056 mm,..., Where B is, for example, B = 0.3 mm.

  Therefore, the high-density mounting connector 102 on the subboard and the high-density mounting connector 112 on the backboard are different from each other in the positional deviation amount B between the high-density mounting connector 101 on the mainboard and the high-density mounting connector 112 on the receiving backboard. The upper high-density mounting connector 101 and the sub-board upper high-density mounting connector 102 are displaced by the sum of the positional deviation amounts A. In order to absorb this misalignment, the support member 103 needs to be able to move up and down by A + B from the center of the ellipse 104.

As shown in FIG. 5, the upper and lower floatable lengths are represented by (X + Y−E) / 2, and therefore (X + Y−E) / 2> A + B. By transforming the equation, the following equation (7) is established.
Y> 2 (A + B) −X + E (7)

  Further, when the module is inserted, as shown in FIG. 5, the sub board is inserted in a state of being dropped by (X + Y−E) / 2 from the center of the support member.

The sum of the shift amount (X + Y−E) / 2 from the center of the support member and A and B must be within the allowable displacement K in the vertical and horizontal directions of the guide 113 (eg, K = 1.52 mm). Connector will not fit. Therefore, A + B + (X + Y−E) / 2 <K needs to be satisfied. By deformation, the following equation (8) holds.
2 (K−A−B) −X + E> Y (8)

From the equations (7) and (8), the following equation (9) is established.
2 (K−A−B) −X + E>Y> 2 (A + B) −X + E (9)

  Therefore, the length Y of the straight line portion of the circle is determined within a range in which the module error can be absorbed, as shown in Equation (9). As an example, the value of Y is Y = 1 mm.

In addition, the upper limit of Y in the equation (8) is a length determined in a server-specific form such that the sub-board is inserted in a dropped state like a blade server. For example, in the case where the module is inserted sideways, the sub board does not fall, so the support member is inserted in the state of being positioned near the center of the oval instead of the oval end. Since the center portion of the oval is a straight portion corresponding to the length of Y, the center of the support member may be shifted by Y / 2 when viewed from the center of the oval when the module is inserted. The connector on the sub board is displaced at the maximum with respect to the connector on the back board by a length (A + B + Y / 2) obtained by adding other misregistration amounts A and B thereto. In order for the connector to fit, the sum of the displacement amounts needs to be shorter than the allowable displacement amount K in the vertical and horizontal directions of the guide 113, so that A + B + Y / 2 <K holds. The following equation (10) is established by deformation.
2 (KAB)> Y (10)

  In this way, the upper limit of the Y range (formula (9)) in the specific form that the sub board is inserted in the fall state is the upper limit of the Y range (formula (10)) in the form of inserting in the horizontal direction. Is different.

Next, the horizontal movement mechanism will be described. As shown in FIG. 6, a step for supporting the sub board 107 is provided on the shaft of the support member 103 that supports the sub board 107. The support member 107 is provided with an annular spacer 603 that is movable in the axial direction of the support member, and prevents the sub board 107 from moving more than necessary. The length by which the sub board 107 can move is a length L obtained by subtracting the length of the spacer 603 and the thickness of the sub board 107 from the length from the step of the support member 103 to the module sheet metal 108 (for example, L = 1.4 mm). It is. Factors that cause errors in the positional deviation in the axial direction (left-right direction) of the support member 103 include variations in the substrate thickness when the sub board 107 is manufactured, dimensional deviation in the level difference position of the shaft of the support member 103, and the like. When these misalignment elements are a2, b2,..., The misalignment amount C between the high-density mounting connector 102 on the sub-board and the high-density mounting connector 112 on the receiving back board in the left-right direction (see FIG. 6). Can be calculated in the same manner as A and B as follows.
C = √ (a2 ² + b2 ² + ...)

  As an example, a2 = 0.2 mm, b2 = 0.1 mm,..., And C at this time is C = 0.67 mm as an example.

A position above the step of the support member 103 by L / 2 is set as a reference. At this time, the sub board 107 can move left and right from the reference by L / 2. Since the sub board 107 needs to be movable more than the displacement C between the high density mounting connector 102 on the sub board in the left-right direction and the high density mounting connector 112 on the receiving back board, L / 2> C is satisfied. It holds. By transforming the equation, the following equation holds.
L> 2C (11)

If this movable amount L / 2 is within the allowable displacement K in the vertical and horizontal directions of the guide 113, the connector can be fitted. Therefore, K> L / 2 holds. The equation is transformed into the following equation (12).
2K> L (12)

From the expressions (11) and (12), the length of L is determined by the range of the following expression (13).
2K>L> 2C (13)

  FIG. 7 shows an embodiment in which two sub boards are prepared. When the second sub board 701 having the high-density mounting connector 702 is prepared, the support member 703 and the spacer 704 that support the second sub board 701 are prepared as in the case of one sub board. Since the structure for supporting the second sub board is the same as the structure for supporting the first sub board, Expression (13) is applicable. The movable length L2 of the sub board is determined by applying the expression (13). Similarly, if there are more than two sub-boards, prepare support members and spacers as many as the number of sub-boards, and apply Equation (13) to simultaneously mount high-density mounting connectors on the multiple sub-boards. It is possible to match.

  Next, a method for fixing the support member will be described. When the high-density mounting connector is mated, a force in the direction opposite to the module insertion direction is applied to the support member 103. Therefore, the support member bends in the direction opposite to the module insertion direction, and the force necessary for mating is applied to the connector. There is no possibility. As shown in FIG. 6 or 7, the upper portion of the support member 103 is fixed with the upper lid 602 and the screw 601 of the module 108 to prevent the support member 103 from being bent when the high-density mounting connector is fitted. The force required for fitting the connector can be maintained.

101 High Density Mounting Connector 102 High Density Mounting Connector 103 Support Member 104 Support Member Fixing Hole 105 Cable 106 Main Board 107 Sub Board 108 Module 109 Case 110 Back Board 111 High Density Mounting Connector 112 High Density Mounting Connector 113 Guide Pin 114 Guide pin 601 Screw 602 Upper lid 603 Spacer 701 Second sub-board 702 High-density mounting connector 703 Support member 704 Spacer

Claims (4)

A back plug-in module, and a housing on which a backboard including a first connector and a second connector on the receiving side is provided and the module is inserted;
The module includes a main board having a third connector that is fixed to a sheet metal of the module and fitted to the first connector at a rear end, and extends perpendicularly to a plane of the main board, and the main board and the sheet metal of the module A sub-board having a rod-shaped support member fixed to the support member and a fourth connector supported by the support member and fitted to the second connector at the rear end;
The sub board has an axial direction of the support member and an axial direction of the support member so that the third connector and the fourth connector can be simultaneously fitted with the first connector and the second connector. And a computer apparatus characterized by being movable in a direction perpendicular to both directions of the module insertion direction.   2. The computer apparatus according to claim 1, wherein each of the third connector and the fourth connector has a guide pin, and each of the first connector and the second connector has a guide hole into which the guide pin is inserted. A computer device characterized by.   3. The computer apparatus according to claim 2, wherein the support member supporting hole is formed on the sub board as a support member supporting hole in a direction perpendicular to both the axial direction of the support member and the module inserting direction and in the module inserting direction. A hole having a dimension capable of absorbing a positional deviation error of the support member, and a shaft moving portion of the support member including a step having a different diameter and a spacer at a shaft portion of the support member, A computer apparatus characterized in that a length by which the board can move is a dimension capable of absorbing a positional deviation error in the structure of the module in the axial direction of the support member. 3. The computer apparatus according to claim 2, wherein a rectangle having a width of X and a length of Y in the vertical direction is sandwiched between two semicircles having a diameter of X as the support member supporting hole on the sub board. An oval hole is provided, a length L is set in which the sub board can move in the axial direction of the support member, a diameter of the support member is E, the third connector and the fourth connector , The effective fitting length of the connector is V, the positional deviation amount between the first connector and the third connector is B, the positional deviation allowable amount of the guide focus guide hole is K, the first A computer apparatus characterized in that X, Y, and L satisfy the following expression, where C is the amount of positional deviation between the second connector and the fourth connector.
2V-2A + E>X> E
2 (K−A−B) −X + E>Y> 2 (A + B) −X + E
2K>L> 2C

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