WO2018029771A1 - Calculateur - Google Patents

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Publication number
WO2018029771A1
WO2018029771A1 PCT/JP2016/073392 JP2016073392W WO2018029771A1 WO 2018029771 A1 WO2018029771 A1 WO 2018029771A1 JP 2016073392 W JP2016073392 W JP 2016073392W WO 2018029771 A1 WO2018029771 A1 WO 2018029771A1
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WO
WIPO (PCT)
Prior art keywords
module
substrate
lever
state
connector
Prior art date
Application number
PCT/JP2016/073392
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English (en)
Japanese (ja)
Inventor
輝 副田
福井　一夫
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to PCT/JP2016/073392 priority Critical patent/WO2018029771A1/fr
Publication of WO2018029771A1 publication Critical patent/WO2018029771A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution

Definitions

  • the present invention relates to a computer in which one or more modules can be inserted and removed.
  • Patent Document 1 discloses a connector system in which two substrates are simultaneously fitted to a backplane without applying stress to the backplane connector.
  • This connector system includes a mezzanine connector, a support attached to the lower board, a coil spring disposed on the support and capable of changing the distance between the lower board and the upper board, a screw for attaching the upper board to the support, and a loose insertion hole.
  • the mezzanine connector contacts the lower mezzanine connector disposed on the lower substrate and the upper mezzanine connector disposed on the upper substrate so that the two substrates are arranged in parallel with a distance from each other and connected.
  • the connector is movable in a parallel direction and a direction perpendicular to the parallel direction.
  • the loose insertion hole is a hole that is formed in the upper substrate and can change the relative position of the upper substrate in the parallel direction with respect to the column in a state where the upper substrate is attached to the column.
  • the connector system of Patent Document 1 has a two-stage structure in which a small upper package such as a mezzanine card is stacked on a mother board, and the number of connectors mounted on the upper package is as few as one or two. For this reason, in the case of a structure in which a large-scale package having a large number of connectors such as a mother board is formed in two stages with studs, warpage of the mother board and studs occurs due to an increase in the fitting force between the connector of the package and the connector on the housing side. . Therefore, the motherboard may be destroyed.
  • An object of the present invention is to suppress deformation and breakage of a circuit board when a plurality of stages of circuit boards are inserted and removed.
  • a computer is a computer in which one or more modules can be freely inserted and removed, and a housing having one or more through holes into which the modules are inserted and removed, and the modules in the through holes.
  • a plate-like member that is fixed to the housing so as to close the other opening opposite to the one opening through which is inserted and removed, and a plurality of members provided on the plate surface so as to be positioned in the other opening
  • a back plate having a plate connector, and the module has a first connector that fits with the first plate connector of the plurality of plate connectors when the module is inserted into the through hole.
  • the first substrate and the second substrate are disposed so that the first substrate is positioned above or below the second substrate so that the first substrate faces the back plate, and the first substrate A module housing that holds the board slidably in the insertion / extraction direction with respect to the through hole of the module and fixes the second board.
  • FIG. 1 is an exploded perspective view of a computer.
  • FIG. 2 is a partially broken perspective view of the first module.
  • FIG. 3 is an exploded perspective view of the first module.
  • FIG. 4A is a cross-sectional view illustrating a first operation procedure example 1 of the first lever and the second lever.
  • FIG. 4B is a cross-sectional view illustrating a second operation procedure example of the first lever and the second lever.
  • FIG. 4C is a cross-sectional view illustrating an operation procedure example 3 of the first lever and the second lever.
  • FIG. 4D is a cross-sectional view illustrating a fourth operation procedure example of the first lever and the second lever.
  • FIG. 4E is a cross-sectional view illustrating an operation procedure example 5 of the first lever and the second lever.
  • FIG. 4A is a cross-sectional view illustrating a first operation procedure example 1 of the first lever and the second lever.
  • FIG. 4B is a cross-sectional view illustrating a second operation procedure
  • FIG. 5 is a partially broken perspective view of the second module.
  • FIG. 6 is an exploded perspective view of the second module.
  • FIG. 7A is a cross-sectional view illustrating an operation procedure example 1 of the third lever.
  • FIG. 7B is a cross-sectional view illustrating an operation procedure example 2 of the third lever.
  • FIG. 7C is a cross-sectional view illustrating an operation procedure example 3 of the third lever.
  • FIG. 7D is a cross-sectional view illustrating an operation procedure example 4 of the third lever.
  • FIG. 8 is a partially broken perspective view of the third module.
  • a coordinate system consisting of an X axis, a Y axis, and a Z axis is defined.
  • the X direction that is the direction of the X axis is the insertion / extraction direction of the module group 100.
  • the direction from the origin O toward the end of the arrow on the X axis is the + X direction (insertion direction), and the opposite direction is the ⁇ X direction (extraction direction).
  • the X direction is the longitudinal direction of the module group 100.
  • the Y direction which is the direction of the Y axis, is the short direction (width direction) of the module group 100.
  • the direction from the origin O toward the end of the arrow on the Y axis is the + Y direction, and the opposite direction is the -Y direction.
  • the Z direction which is the direction of the Z axis, is the height direction of the module group 100.
  • the direction from the origin O toward the end of the arrow on the Z axis is the + Z direction, and the opposite direction is the ⁇ Z direction.
  • FIG. 1 is an exploded perspective view of the computer 1.
  • the computer 1 includes a front chassis 200, a backboard 300, and a rear chassis 201.
  • the front chassis 200 is a case of the computer 1 connected to the rear chassis 201 via the back board 300.
  • the front chassis 200 has a plurality of (for example, four in FIG. 1) slots 200a.
  • the slot 200a is a through hole penetrating in the X direction.
  • the module group 100 is inserted into and removed from the slot 200a.
  • the module group 100 is inserted into the front chassis 200 through the opening on the ⁇ X direction side of the slot 200a, and is connected to the backboard connector 301 on the opposite surface of the backboard 300 at the opening on the + X direction side of the slot 200a.
  • the module group 100 holds a circuit board called a package having a circuit, in which electronic parts such as an electronic circuit and a connector and wiring are mounted on the board.
  • An engagement hole 200 b is provided on the side surface of the front chassis
  • the backboard 300 is a back plate having a plurality of backboard connectors 301 on both sides.
  • the backboard 300 is held between the front chassis 200 and the rear chassis 201.
  • the backboard connector 301 is a rear connector fitted to a connector provided in the module group 100.
  • Each backboard connector 301 is electrically connected to another backboard connector 301.
  • the modules can communicate with each other via the backboard 300.
  • the rear chassis 201 is connected to the front chassis 200 via the back board 300. Similar to the front chassis 200, the rear chassis 201 also has a plurality of (four as an example in FIG. 1) slots 200a. A fan unit and a power supply unit are inserted into and removed from the slot 200a of the rear chassis 201. The fan unit and the power supply unit are inserted into the rear chassis 201 and connected to the backboard connector 301 on the opposite surface of the backboard 300.
  • the module group 100 includes a first module 101, a second module 102, and a third module 103.
  • the module group 100 includes only the first module 101, only the second module 102, only the third module 103, The first module 101 and the second module 102, the first module 101 and the third module 103, the second module 102 and the third module 103 may be used. Further, the number of modules may be different.
  • the first module 101 will be described with reference to FIGS. 2 to 4E.
  • the second module 102 will be described with reference to FIGS. 5 to 7D.
  • the third module 103 will be described with reference to FIG.
  • FIG. 2 is a partially broken perspective view of the first module 101.
  • FIG. 3 is an exploded perspective view of the first module 101.
  • the first module 101 is a module in which circuit boards are mounted in two stages in the Z direction.
  • the first module 101 includes a module chassis 31 (module housing) having a substantially box shape.
  • the module chassis 31 has a front plate 31a.
  • the front plate 31a is the front of the computer 1.
  • a hook 31b and a first lever 41 are provided at the lower end edge of the front plate 31a.
  • the first lever 41 faces the lower package 20 across the front plate 31a.
  • One end of the first lever 41 is a first rotating end 41a, and the vicinity thereof is detached by an operator with a hook 31b.
  • the front plate 31a has an opening 31c.
  • a second lever 42 is provided in the opening 31c.
  • the surface facing the front plate 31a is not sealed, and the connector 11 of the upper package 10 and the connector 21 of the lower package 20 are provided.
  • the module chassis 31 has a bottom plate 31d. Circular fixing holes 31e are formed at the four corners of the bottom plate 31d.
  • an upper package 10 and a lower package 20 are provided in the module chassis 31, an upper package 10 and a lower package 20 are provided.
  • the upper package 10 and the lower package 20 are circuit boards in which connectors 11 and 21 connected to electronic components (not shown) constituting the electronic circuit and the backboard connector 301 are mounted on the boards 10m and 20m.
  • the upper package 10 is held by the module chassis 31 so as to be slidable in the insertion / extraction direction (X direction), and the lower package 20 is fixed to the module chassis 31.
  • the connectors 11 and 21 are provided at positions facing the front plate 31a in the + X direction, and are arranged so as to be aligned in the Z direction.
  • the upper package 10 and the lower package 20 are circuit boards having the X direction as a long direction and the Y direction as a short direction.
  • a second lever 42 is provided at a corner on the ⁇ X direction side of the substrate 10m. The second lever 42 protrudes from the opening 31c.
  • a connector 11 is provided at an edge in the + X direction of the substrate 10m. The connector 11 is connected to the backboard connector 301 of the backboard 300. Long holes 10b elongated in the X direction are formed at the four corners of the substrate 10m.
  • a connector 21 is provided on the edge in the + X direction of the substrate 20m. The connector 21 is connected to the backboard connector 301 of the backboard 300.
  • Circular fixing holes 20a are formed at the four corners of the substrate 20m. The fixing hole 20a is an insertion hole into which the stud 33 is inserted. The substrate 10m and the substrate 20m are supported in the Z direction by the stud 33.
  • the stud 33 is a column provided at the four corners of the substrate 10m and the substrate 20m.
  • the upper end of the stud 33 is inserted into the long hole 10b of the substrate 10m.
  • the long hole 10b is an insertion hole into which the stud 33 is slidably inserted in the X direction.
  • the upper end of the stud 33 is screwed with a fixing screw 32.
  • the upper package 10 is slidable in the X direction by the elongated hole 10b in a state of being sandwiched between the screw head of the fixing screw 32 and the upper end of the stud 33.
  • the lower end of the stud 33 is inserted into the fixing hole 31e of the bottom plate 31d and the fixing hole 20a of the substrate 20m.
  • the lower end of the stud 33 is held by the stopper 34 with the bottom plate 31d and the substrate 20m sandwiched so that a gap is formed between the bottom plate 31d and the substrate 20m. Due to this gap, heat generated from the lower package 20 can be released.
  • the stopper 34 may be screwed with the fixing screw 32 like the upper end of the stud 33.
  • FIGS. 4A to 4E are cross-sectional views showing examples of operating procedures of the first lever 41 and the second lever 42.
  • FIG. 4A to 4E examples of operations when the first module 101 is inserted are shown, and FIGS. 4D and 4E show examples of operations when the first module 101 is removed.
  • 4A to 4E show cross sections obtained by dividing the first module 101 along the XY plane.
  • the direction of arrow A is the direction in which the first lever 41 and the second lever 42 rotate around the rotation shafts 41b and 42b so as to approach the front plate 31a in the XY plane.
  • An arrow B direction is a direction opposite to the A direction, and is a direction in which the first lever 41 and the second lever 42 rotate around the rotation shafts 41b and 42b so as to be separated from the front plate 31a in the XY plane. is there.
  • FIG. 4A shows a state in which the first module 101 starts to be inserted into the slot 200a of the front chassis 200.
  • the first lever 41 and the second lever 42 are opened in the arrow B direction.
  • the other end of the first lever 41 is a first base end 41x having a rotating shaft 41b, a first engagement piece 41c, and a second engagement piece 41d.
  • the first engagement piece 41c is inserted into the engagement hole 200b of the front chassis 200 and is in contact with the opening edge of the engagement hole 200b on the front plate 31a side.
  • the second engagement piece 41d is located at a position separated from the bent plate portion 200c having an L-shaped cross section on the front plate 31a side of the front chassis 200.
  • the engagement hole 200b and the bent plate portion 200c are engaged with the first base end 41x of the first lever 41 and become a first restriction portion that restricts the rotation of the first lever 41.
  • One end of the second lever 42 is a second rotating end 42a.
  • the other end of the second lever 42 is a second base end 42x having a rotation shaft 42b, a first engagement piece 42c, and a second engagement piece 42d.
  • a second restricting portion 31g On the back surface of the side plate 31f of the module chassis 31, a second restricting portion 31g having a substantially U-shaped cross section is provided.
  • the second restricting portion 31g forms an opening 31h between the first engaging plate portion 31ga on the front plate 31a side and the second engaging plate portion 31gb on the opposite side. 4A, the first engagement piece 42c is inserted into the opening 31h, and the second engagement piece 42d is located between the front plate 31a and the first engagement plate portion 31ga.
  • the connectors 11 and 21 are not in contact with the backboard connector 301.
  • the upper package 10 protrudes toward the ⁇ X direction side by ⁇ x compared to the lower package 20.
  • the shaft of the fixing screw 32 comes into contact with the opening edge of the elongated hole 10b in the + X direction.
  • ⁇ x corresponds to the length of the long hole 10b in the X direction.
  • FIG. 4B shows a state where the connector 21 of the lower package 20 is fitted to the backboard connector 301, but the connector 11 of the upper package 10 is not fitted to the backboard connector 301.
  • the contact surface of the first engagement piece 41c with the engagement hole 200b comes into contact with the opening edge of the engagement hole 200b, and the rotation of the first lever 41 in the arrow A direction is restricted.
  • the connector 11 of the upper package 10 abuts on the backboard connector 301, and a reaction force corresponding to the insertion force due to the rotation of the first lever 41 is generated.
  • the upper package 10 is guided to the long hole 10b and is released in the ⁇ X direction. For this reason, the pins of the connector 11 are not completely inserted into the holes of the backboard connector 301.
  • the insertion operation of the lower package 20 by the first lever 41 applies an insertion force only to the corresponding lower package 20. Further, this insertion operation applies a reaction force of the insertion force to the upper package 10 to guide it in the ⁇ X direction through the long hole 10b, thereby preventing the connector 11 and the backboard connector 301 from being fitted. Accordingly, excessive insertion force is not applied to the upper package 10 during the insertion operation of the lower package 20 by the first lever 41, and warpage or breakage of the upper package 10 can be suppressed.
  • FIG. 4C shows a state where the connector 21 of the lower package 20 is fitted to the backboard connector 301 and the connector 11 of the upper package 10 is also fitted to the backboard connector 301.
  • the first module 101 is inserted into the slot 200a by the first lever 41, and the connector 21 of the lower package 20 is first connected to the backboard connector 301.
  • the connector 11 of the upper package 10 is connected to the backboard connector 301 by the two levers 42.
  • FIG. 4D shows a state where the connector 11 of the upper package 10 is removed from the backboard connector 301 while the connector 21 of the lower package 20 is connected to the backboard connector 301.
  • FIG. The connector 11 of the upper package 10 is removed from the backboard connector 301 by the removal force of the upper package 10 in the ⁇ X direction.
  • the removal force is applied only to the corresponding upper package 10, and the removal from the backboard connector 301 is prevented without applying the removal force to the lower package 20. Accordingly, excessive pulling force is not applied to the lower package 20 during the pulling operation by the second lever 42, and warpage or breakage of the lower package 20 can be suppressed.
  • FIG. 4E shows a state in which the connector 11 of the upper package 10 is removed from the backboard connector 301 and the connector 21 of the lower package 20 is also removed from the backboard connector 301.
  • the connector 21 of the lower package 20 is removed from the backboard connector 301 by the removal force of the lower module in the ⁇ X direction.
  • the computer 1 may have a two-stage structure in which the upper package 10 is used in two stages instead of the lower package 20, and three levers may be provided.
  • three levers When three levers are used, two openings 31c are provided in the Z direction in the front plate 31a of the module chassis 31, and the second levers 42 of the upper packages 10 are inserted into the openings 31c.
  • the operation of the first lever 41 is the same as in FIGS. 4A to 4E.
  • the module chassis 31 is inserted into the slot 200a.
  • the two upper packages 10 are in a position shifted in the ⁇ X direction from the fitting completion position by ⁇ x.
  • Each connector 11 has not started mating with the backboard connector 301.
  • the upper packages 10 are inserted by ⁇ x, and the fitting between the connector 11 and the backboard connector 301 is completed.
  • the upper lever 10 can be removed at different timings by operating the first lever 41 after operating the second lever 42 for each of the upper packages 10.
  • the second module 102 will be described.
  • the same parts as those of the first module 101 are denoted by the same reference numerals, and the description thereof is omitted.
  • the first module 101 when the first module 101 is inserted, the fixed lower package 20 is inserted first, and then the sliding upper package 10 is inserted.
  • the sliding upper package 10 is removed first, and then the fixed lower package 20 is removed.
  • the sliding lower package 20 is inserted first, and then the fixed upper package 10 is inserted. Then, when the second module 102 is extracted, the fixed upper package 10 is extracted first, and then the sliding lower package 20 is extracted.
  • FIG. 5 is a partially broken perspective view of the second module 102.
  • FIG. 6 is an exploded perspective view of the second module 102.
  • the lower package 20 is held by the module chassis 31 so as to be slidable in the insertion / extraction direction (X direction), and the upper package 10 is fixed to the module chassis 31.
  • the fixing holes 10 a are provided at the four corners of the upper package 10, as in the lower package 20, instead of the long holes 10 b. Therefore, in the second module 102, the upper package 10 does not slide in the X direction unlike the first module 101.
  • the first module 101 is provided with the first lever 41 and the second lever 42, but the second module 102 is provided with the third lever 43.
  • elongated holes 20 b are provided at the four corners of the lower package 20 instead of the fixing holes 31 e, and elongated holes 20 c that pivotally support the third lever 43 are also provided.
  • the front plate 31a is not provided with the hook 31b.
  • the front plate 31a is not provided with the opening 31c.
  • the side plate 31f of the module chassis 31 is not provided with the second restricting portion 31g.
  • a third lever 43 is provided on the front plate 31a.
  • the third lever 43 is a lever that is long in the Y direction.
  • the length of the third lever 43 in the Y direction is equal to the length of the second module 102 in the Y direction.
  • the width of the third lever 43 in the Z direction is slightly larger than the height of the second module 102 in the Z direction.
  • One end of the third lever 43 is a rotation end 43a.
  • a shaft 53 serving as a rotation shaft is provided at the other end of the third lever 43.
  • An edge plate portion 31k is provided on the upper edge of the front plate 31a.
  • the edge plate portion 31k is a plate-like member that is bent in the + X direction from the upper end edge of the front plate 31a, is parallel to the XY plane, and extends in the Y direction.
  • the shaft 53 is inserted into an insertion hole (not shown) formed in the edge plate portion 31k and an insertion hole 31i formed in the bottom plate 31d of the module chassis 31.
  • the third lever 43 is pivotally supported so as to be rotatable about the shaft 53 in the arrow AB direction (see FIG. 7).
  • the other end of the third lever 43 is provided with a first engagement piece 43b and a second engagement piece 43c.
  • the first engagement piece 43b engages with the engagement hole 200b of the front chassis 200.
  • the second engagement piece 43 c engages with the stepped portion 200 d of the front chassis 200.
  • a fan-shaped pinion gear 51 is provided in the vicinity of the insertion hole 31 i of the shaft 53.
  • a gear guide 31j is provided in the vicinity of the insertion hole 31i of the bottom plate 31d of the module chassis 31.
  • the gear guide 31j is composed of two parallel protrusions 31ja and 31jb extending in the X direction on the bottom plate 31d.
  • the protrusion 31ja is longer than the protrusion 31jb.
  • the gear guide 31j regulates the gear member 52 so that the gear member 52 placed on the bottom plate 31d slides in the X direction.
  • the gear member 52 is a plate-like member that is long in the X direction and is placed on the bottom plate 31d so as to be sandwiched between the protrusions 31ja and 31jb.
  • a long side 52a extending in the X direction is provided on one side of the gear member 52 parallel to the X direction.
  • the long side 52a is in sliding contact with the long protrusion 31ja.
  • a short side 52b extending in the X direction is provided on the other side parallel to the X direction opposite to one side of the gear member 52.
  • the short side 52b is shorter than the long side 52a and is in sliding contact with the protrusion 31jb.
  • a rack gear 52c is provided on the + X direction side of the short side 52b.
  • the rack gear 52 c extends in the X direction and meshes with the pinion gear 51.
  • a boss 52 d is provided on the surface of the gear member 52 so as to protrude in the + Z direction, and is inserted into the elongated hole 20 c of the lower package 20. That is, the gear member 52 is guided in the X direction by the gear guide 31j and the long hole 20c, and slides by the length of the long hole 20c in the X direction.
  • FIGS. 7A to 7D are cross-sectional views showing an example of an operation procedure of the third lever 43.
  • FIG. Of FIGS. 7A to 7D FIGS. 7A to 7C show an operation example at the time of insertion, and FIG. 7D shows an operation example at the time of removal.
  • 7A to 7C show cross sections of the second module 102 cut along the XY plane.
  • the direction of arrow A is the direction in which the third lever 43 rotates around the shaft 53 that is the rotation axis so as to approach the front plate 31a in the XY plane.
  • An arrow B direction is a direction opposite to the A direction, and the third lever 43 rotates around the shaft 53 so as to be separated from the front plate 31a in the XY plane.
  • FIG. 7A shows a state where the second module 102 is inserted into the slot 200a of the front chassis 200.
  • the boss 52d abuts against the opening edge of the elongated hole 20c on the ⁇ X direction side, and the pinion gear 51 and the rack gear 52c mesh.
  • the axis of the stopper 34 comes into contact with the opening edge on the + X direction side of the long hole 20b. Accordingly, in the X direction, the position of the edge of the upper package 10 on the ⁇ X direction side and the position of the edge of the lower package 20 on the ⁇ X direction side coincide with each other.
  • the connectors 11 and 21 are not in contact with the backboard connector 301.
  • This rotation operation causes the gear member 52 to push the opening edge in the + X direction of the elongated hole 20c, so that the lower package 20 is inserted in the + X direction by ⁇ x more than the upper package 10.
  • ⁇ x corresponds to the length of the long hole 20c in the X direction.
  • the upper package 10 fixed to the module chassis 31 is also inserted in the + X direction. That is, the upper package 10 and the lower package 20 are shifted in the fitting timing of the connectors 11 and 21. Then, the connector 21 of the lower package 20 is connected to the backboard connector 301, resulting in the state of FIG. 7B.
  • FIG. 7B shows a state in which the rotation end 43a of the third lever 43 is further rotated in the direction of arrow A by an angle ⁇ with the shaft 53 as the rotation center from the state of FIG. 7A.
  • the lower package 20 is fixed to the front chassis 200 in a state where the insertion has been completed.
  • the rotation end 43a of the third lever 43 is rotated in the direction of arrow A by an angle ⁇ around the shaft 53 as the rotation center, the engagement between the pinion gear 51 and the rack gear 52c is released. Thereafter, the pinion gear 51 idles. Therefore, the lower package 20 is not pushed further by the insertion force of the third lever 43.
  • the first engagement piece 43b of the third lever 43 is inserted into the engagement hole 200b.
  • the insertion force increases with this contact position as an operating point, and the connector 11 of the upper package 10 starts to connect to the corresponding backboard connector 301 by the insertion force due to the rotation of the third lever 43.
  • the third lever 43 is rotated by an angle ⁇ by the rotation in the direction of arrow A
  • the first engagement piece 43b of the third lever 43 inserted into the engagement hole 200b is on the front plate 31a side of the engagement hole 200b. It abuts on the opening edge.
  • the upper package 10 is pushed in the + X direction and moves together with the module chassis 31 by the distance between the stopper 34 and the elongated hole 20b.
  • the connector 11 of the upper package 10 is connected to the backboard connector 301, resulting in the state of FIG. 7C.
  • FIG. 7C shows a state where the third lever 43 is pushed in the direction of arrow A by an angle ⁇ from the state of FIG. 7B. 7C, with the connector 21 of the lower package 20 connected to the backboard connector 301, the upper package 10 moves in the + X direction together with the module chassis 31 and is inserted into the slot 200a, and the connector 11 is inserted into the backboard connector 301. Connected to.
  • FIG. 8 is a partially broken perspective view of the third module 103.
  • the third module 103 is a module in which the package is configured in one stage in the second module 102.
  • the package 80 is a package having the same configuration as the upper package 10 of the second module 102, and is a circuit board in which circuit components and connectors 11 are mounted on the board 80m. Since the lower package 20 of the second module 102 is not mounted, the package 80 is mounted close to the bottom plate 31d.
  • the third module 103 is mounted in the slot 200a
  • the package 80 is pushed into the slot 200a by rotating the third lever 43 in the direction of arrow A (see FIGS. 7A to 7C) about the shaft 53 as a rotation axis.
  • the connector 11 is connected to the backboard connector 301.
  • the connector 11 is removed from the backboard connector 301, and the package 80 is detached from the slot 200a. .
  • modules (first module 101 and second module 102) having the upper package 10 slidable in the insertion / extraction direction and the fixed lower package 20 are inserted into and removed from the computer 1 described above.
  • the operator can insert / remove the upper package 10 and the lower package 20 in the module individually with a time difference.
  • it is possible to prevent an excessive insertion / extraction force from being applied to the other package at the time of insertion / extraction of one package, and it is possible to suppress warpage or breakage of the substrates 10m, 20m and the stud 33. Therefore, a package with a large number of connectors can be made into one module in two stages, and the height of the module can be reduced.
  • the first module 101 has a plurality of studs 33 inserted into the upper package 10 and the lower package 20 and fixed to the lower package 20 or the module chassis 31.
  • the upper package 10 has a plurality of studs 33 as first insertion holes, and has a long hole 10b that is elongated in the insertion / removal direction.
  • the lower package 20 has a fixing hole 20a into which a plurality of studs 33 are inserted as a second insertion hole.
  • the second module 102 has a plurality of studs 33 inserted into the upper package 10 and the lower package 20 and fixed to the upper package 10 or the module chassis 31.
  • the lower package 20 has a plurality of studs 33 inserted as first insertion holes, and has a long hole 20b elongated in the insertion / removal direction.
  • the upper package 10 has a fixing hole 10a into which a plurality of studs 33 are inserted as a second insertion hole.
  • the lower package 20 is inserted before the upper package 10, but a reaction force against the insertion force acts on the upper package 10 and is released in the removal direction (first Status). Therefore, no insertion force is applied to the upper package 10, and warpage or breakage of the substrate 10m or the stud 33 can be suppressed.
  • the upper package 10 is inserted, the upper package 10 is inserted by sliding in the insertion direction with respect to the lower package 20, and the connector 11 and the backboard connector 301 are fitted (second state). ). Accordingly, no insertion force is applied to the mounted lower package 20, and warpage or breakage of the substrate 20 m or the stud 33 can be suppressed.
  • the first module 101 has a first lever 41 corresponding to the lower package 20.
  • a first engagement piece 41c is provided at the first base end 41x of the first lever 41 and engages with the engagement hole 200b of the front chassis 200 which is the first restricting portion.
  • the first engagement piece 41c and the engagement hole 200b are engaged.
  • this engagement position as an operating point, the insertion force of the lower package 20 by the first lever 41 increases, the lower package 20 is pushed in, and a reaction force is generated by pushing the upper package 10, so that the upper package 10 Slide in the removal direction.
  • an operation that results in the first state can be realized.
  • operability can be improved due to lever operation.
  • the first module 101 has a second lever 42 corresponding to the upper package 10.
  • a first engagement piece 42c is provided at the second base end 42x of the second lever 42, and engages with the first engagement plate portion 31ga of the second restricting portion 31g.
  • the first engagement piece 42c and the first engagement plate portion 31ga are engaged. To do.
  • this engagement position as an operating point, the insertion force of the upper package 10 at the second lever 42 increases, and the upper package 10 is pushed in. Thereby, operation which changes to the said 2nd state is realizable. In addition, operability can be improved due to lever operation.
  • the upper package 10 is removed by sliding in the removal direction with respect to the lower package 20 (third state). Therefore, when the upper package 10 is removed, no lowering force is applied to the lower package 20, and warpage and damage to the substrate 20m and the stud 33 can be suppressed.
  • the connector 21 is removed from the backboard connector 301 (fourth state). Therefore, the removal force is not applied to the removed upper package 10, and the warpage and breakage of the substrate 10m and the stud 33 can be suppressed.
  • the first module 101 has a second lever 42 corresponding to the upper package 10.
  • a second engagement piece 42d is provided at the second base end 42x of the second lever 42, and engages with the first engagement plate portion 31ga of the second restricting portion 31g.
  • the second engagement piece 42d and the first engagement plate portion 31ga are engaged. To do.
  • this engagement position as an operating point, the removal force of the upper package 10 at the second lever 42 increases, and the upper package 10 is slid in the removal direction and removed. Thereby, the operation to transition to the third state can be realized. In addition, operability can be improved due to lever operation.
  • the first module 101 has a first lever 41 corresponding to the lower package 20.
  • a second engagement piece 41d is provided at the first base end 41x of the first lever 41, and engages with the bent plate portion 200c of the front chassis 200 that is the first restricting portion.
  • the second engagement piece 41d engages with the bent plate portion 200c of the front chassis 200 that is the first restricting portion.
  • the third state when the operator first pivots the pivot end 41a of the first lever 41 away from the front plate 31a of the first module 101, the second engagement piece 41d and the bent plate portion 200c. Engage. With this engagement position as an operating point, the removal force of the lower package 20 at the first lever 41 increases, and the lower package 20 is slid in the removal direction and removed. As a result, an operation for achieving the fourth state can be realized. In addition, operability can be improved due to lever operation.
  • the second module 102 having the fixed upper package 10 and the lower package 20 slidable in the insertion / removal direction is inserted into and removed from the computer 1 described above (first state).
  • the connector 21 of the lower package 20 is fitted to the backboard connector 301, and the warpage and breakage of the substrate 10m and the stud 33 can be suppressed.
  • the second module 102 has a third lever 43.
  • the third lever 43 has a base end 43x pivotally supported on the front plate 31a side and a rotation end 43a that is close to or away from the second module 102, and allows the upper package 10 and the lower package 20 to move.
  • the slot 200a is inserted and removed.
  • the second module 102 has a conversion mechanism that is detachably connected to the base end 43 x of the third lever 43 and slidable in the insertion / extraction direction with respect to the upper package 10.
  • the conversion mechanism When engaging with the base end 43x of the third lever 43, the conversion mechanism converts the rotation of the third lever 43 into sliding in the insertion / extraction direction, and when not engaging with the base end 43x of the third lever 43, The rotation of the three levers 43 is not converted to sliding in the insertion / extraction direction.
  • the conversion mechanism is provided so as to be slidable in the insertion / removal direction with respect to the lower package 20 and a fan-shaped pinion gear 51 that rotates together with the shaft 53 that is the rotation axis of the third lever 43. And a gear member 52 having a rack gear 52c that meshes with the gear member 52.
  • the upper package 10 when the second module 102 is removed from the front chassis 200, the upper package 10 is provided with a first removal force that pulls the second module 102 in the removal direction for removing the second module 102 from the slot 200a after the second state.
  • the upper package 10 is slid in the removal direction with respect to the lower package 20 by the first removal force, and the connector 11 is removed from the backboard connector 301 (third state). Therefore, when the upper package 10 is removed, no lowering force is applied to the lower package 20, and warpage and damage to the substrate 20m and the stud 33 can be suppressed.
  • the lower package 20 is slid in the removal direction with respect to the upper package 10 by the second removal force.
  • the connector 11 is removed from the backboard connector 301 by moving the connector 11 (fourth state). Therefore, when the lower package 20 is removed, the removal force is not applied to the removed upper package 10, and the warpage and breakage of the substrate 10m and the stud 33 can be suppressed.
  • the second module 102 includes the third lever 43 and the conversion mechanism described above.
  • the base end 43x of the third lever 43 and the conversion mechanism are not engaged after the second state, if the third lever 43 is rotated away from the second module 102, the upper package is removed in the removal direction. A first removal force for pulling out 10 is applied, and the state transitions to the third state.
  • the base end 43x of the third lever 43 is not engaged with the conversion mechanism, so that no lowering force is applied to the lower package 20, and the upper package 10 is removed from the lower package 20. Slide in the direction. Therefore, warpage and breakage of the substrate 20m and the stud 33 can be suppressed.
  • the base end 43x of the third lever 43 and the conversion mechanism are engaged and removed.
  • a second removal force for pulling out the lower package 20 in the direction is applied, and the state transitions to the fourth state.
  • the base end 43x of the third lever 43 and the conversion mechanism engage with each other, so that the removal force is not applied to the removed upper package 10, and the lower package 20 is not attached to the upper package 10. Slide in the removal direction. Therefore, warpage and breakage of the substrate 10m and the stud 33 can be suppressed.
  • the conversion mechanism includes the pinion gear 51 and the gear member 52 described above. If the rotation end 43a of the third lever 43 is rotated away from the second module 102 when the pinion gear 51 and the rack gear 52c are not engaged with each other, a first removal force is applied, Transition to 3 states. When the upper package 10 is removed, the pinion gear 51 and the rack gear 52c are not in mesh with each other, so that no lowering force is applied to the lower package 20, and the upper package 10 slides in the removal direction with respect to the lower package 20. . Therefore, warpage and breakage of the substrate 20m and the stud 33 can be suppressed.
  • the third module 103 can be inserted into and removed from the computer 1 described above. Thereby, various modules can be inserted and removed, and the highly versatile computer 1 can be provided.
  • the lower package 20 may be disposed above the upper package 10.
  • Each module may be configured without a lever. In this case, the operator directly inserts and removes the module.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

Ce calculateur comporte : un boîtier ayant un ou plusieurs trous traversants, à travers lesquels des modules sont insérés/retirés ; et une plaque de surface arrière, qui est un élément de type plaque fixé au boîtier de sorte que des ouvertures de trou traversant sur le côté opposé aux ouvertures de trou traversant à travers lesquelles les modules sont insérés/retirés sont fermées, ladite plaque de surface arrière ayant une pluralité de connecteurs de surface de plaque qui sont disposés sur une surface de plaque de telle sorte que les connecteurs de surface de plaque sont positionnés dans les ouvertures de côté opposé. Les modules comportent : un premier substrat ayant des premiers connecteurs qui sont couplés à des premiers connecteurs de surface de plaque des connecteurs de surface de plaque dans les cas où les modules sont insérés dans les trous traversants ; un second substrat ayant des seconds connecteurs qui sont couplés à des seconds connecteurs de surface de plaque des connecteurs de surface de plaque dans les cas où les modules sont insérés dans les trous traversants ; et un boîtier de module, qui dispose le premier substrat et le second substrat de telle sorte que les premiers connecteurs et les seconds connecteurs font face à la plaque de surface arrière, et le premier substrat est positionné au-dessus ou au-dessous du second substrat, et qui maintient le premier substrat de sorte que le premier substrat puisse coulisser librement dans la direction d'insertion/retrait par rapport aux trous traversants des modules, ledit boîtier de module fixant le second substrat.
PCT/JP2016/073392 2016-08-09 2016-08-09 Calculateur WO2018029771A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/073392 WO2018029771A1 (fr) 2016-08-09 2016-08-09 Calculateur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/073392 WO2018029771A1 (fr) 2016-08-09 2016-08-09 Calculateur

Publications (1)

Publication Number Publication Date
WO2018029771A1 true WO2018029771A1 (fr) 2018-02-15

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62180991U (fr) * 1986-05-06 1987-11-17
JPH07142883A (ja) * 1993-11-12 1995-06-02 Matsushita Electric Ind Co Ltd 電子装置
US5721669A (en) * 1995-09-15 1998-02-24 Apple Computer, Inc. Gear-driven docking apparatus for removable mass-storage drives
JP2010283155A (ja) * 2009-06-04 2010-12-16 Hitachi Ltd 計算機装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62180991U (fr) * 1986-05-06 1987-11-17
JPH07142883A (ja) * 1993-11-12 1995-06-02 Matsushita Electric Ind Co Ltd 電子装置
US5721669A (en) * 1995-09-15 1998-02-24 Apple Computer, Inc. Gear-driven docking apparatus for removable mass-storage drives
JP2010283155A (ja) * 2009-06-04 2010-12-16 Hitachi Ltd 計算機装置

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