WO2018020189A3 - Module électronique de puissance d'un aéronef et procédé de fabrication associé - Google Patents
Module électronique de puissance d'un aéronef et procédé de fabrication associé Download PDFInfo
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- WO2018020189A3 WO2018020189A3 PCT/FR2017/052137 FR2017052137W WO2018020189A3 WO 2018020189 A3 WO2018020189 A3 WO 2018020189A3 FR 2017052137 W FR2017052137 W FR 2017052137W WO 2018020189 A3 WO2018020189 A3 WO 2018020189A3
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- aircraft
- electronics module
- power electronics
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- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
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Abstract
L'invention concerne un module électronique de puissance (20a) d'un aéronef comprenant : - un dissipateur thermique (21 ) en matériau céramique, - un circuit de puissance (22) comprenant une première couche (23) électriquement conductrice, disposée contre le dissipateur thermique (21 ), - un circuit de commande (25) comprenant une première couche (26) électriquement conductrice, disposée contre le dissipateur thermique (21 ), - au moins un composant à semi-conducteur de puissance (24) et au moins un composant de commande (27) respectivement assemblés au circuit de puissance (22) et au circuit de commande (25).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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FR1657411 | 2016-07-29 | ||
FR1657411A FR3054721B1 (fr) | 2016-07-29 | 2016-07-29 | Module electronique de puissance d'un aeronef et procede de fabrication associe |
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WO2018020189A2 WO2018020189A2 (fr) | 2018-02-01 |
WO2018020189A3 true WO2018020189A3 (fr) | 2018-03-22 |
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PCT/FR2017/052137 WO2018020189A2 (fr) | 2016-07-29 | 2017-07-28 | Module électronique de puissance d'un aéronef et procédé de fabrication associé |
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WO (1) | WO2018020189A2 (fr) |
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DE102019124593A1 (de) * | 2019-09-12 | 2021-03-18 | Tdk Electronics Ag | Kühlsystem |
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JPS61230346A (ja) * | 1985-04-04 | 1986-10-14 | Mitsubishi Electric Corp | 半導体素子冷却装置 |
US20060113562A1 (en) * | 1999-10-01 | 2006-06-01 | Jeun Gi-Young | Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
US20080224303A1 (en) * | 2006-10-18 | 2008-09-18 | Sunao Funakoshi | Power Semiconductor Module |
US7579682B2 (en) * | 2005-08-01 | 2009-08-25 | Infineon Technologies Ag | Power semiconductor module |
US20100147571A1 (en) * | 2007-04-24 | 2010-06-17 | Claus Peter Kluge | Component having a metalized ceramic base |
EP2597676A2 (fr) * | 2011-11-28 | 2013-05-29 | Samsung Electro-Mechanics Co., Ltd | Emballage de module de puissance |
US20140217620A1 (en) * | 2007-12-14 | 2014-08-07 | Denso Corporation | Semiconductor device and method for manufacturing the same |
DE202015001441U1 (de) * | 2015-02-24 | 2015-03-18 | Vincotech Gmbh | Leistungshalbleitermodul mit kombinierten Dickfilm- und Metallsinterschichten |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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FR2990795B1 (fr) | 2012-05-16 | 2015-12-11 | Sagem Defense Securite | Agencement de module electronique de puissance |
-
2016
- 2016-07-29 FR FR1657411A patent/FR3054721B1/fr active Active
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2017
- 2017-07-28 WO PCT/FR2017/052137 patent/WO2018020189A2/fr active Application Filing
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JPS61230346A (ja) * | 1985-04-04 | 1986-10-14 | Mitsubishi Electric Corp | 半導体素子冷却装置 |
US20060113562A1 (en) * | 1999-10-01 | 2006-06-01 | Jeun Gi-Young | Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same |
US7579682B2 (en) * | 2005-08-01 | 2009-08-25 | Infineon Technologies Ag | Power semiconductor module |
US20080224303A1 (en) * | 2006-10-18 | 2008-09-18 | Sunao Funakoshi | Power Semiconductor Module |
US20100147571A1 (en) * | 2007-04-24 | 2010-06-17 | Claus Peter Kluge | Component having a metalized ceramic base |
US20140217620A1 (en) * | 2007-12-14 | 2014-08-07 | Denso Corporation | Semiconductor device and method for manufacturing the same |
EP2597676A2 (fr) * | 2011-11-28 | 2013-05-29 | Samsung Electro-Mechanics Co., Ltd | Emballage de module de puissance |
DE202015001441U1 (de) * | 2015-02-24 | 2015-03-18 | Vincotech Gmbh | Leistungshalbleitermodul mit kombinierten Dickfilm- und Metallsinterschichten |
Non-Patent Citations (1)
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LODGE K J ET AL: "PROTOTYPE PACKAGES IN ALUMINIUM NITRIDE FOR HIGH PERFORMANCE ELECTRONIC SYSTEMS", PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE. LAS VEGAS, MAY 20 - 23, 1990; [PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE], NEW YORK, IEEE, US, vol. CONF. 40, 20 May 1990 (1990-05-20), pages 103 - 110, XP000144669 * |
Also Published As
Publication number | Publication date |
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FR3054721A1 (fr) | 2018-02-02 |
FR3054721B1 (fr) | 2018-12-07 |
WO2018020189A2 (fr) | 2018-02-01 |
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