WO2018016889A1

WO2018016889A1 - Vision inspection module and element handler having same

Info

Publication number: WO2018016889A1
Application number: PCT/KR2017/007823
Authority: WO
Inventors: 유홍준; 이명국
Original assignee: (주)제이티
Priority date: 2016-07-21
Filing date: 2017-07-20
Publication date: 2018-01-25
Also published as: TWI666437B; TW201805614A; KR20180010492A

Abstract

The present invention relates to an element handler and, more specifically, to a vision inspection module for performing vision inspection on a semiconductor element, and to an element handler having the vision inspection module. The present invention provides a vision inspection module comprising: a first vision inspection part (40) for obtaining, for vision inspection, side images of the sides at one pair of opposite edges, among two pairs of mutually opposite edges, of a semiconductor element (10) having a rectangular planar shape; and a second vision inspection part (50) for obtaining side images of the sides at the other pair of opposite edges, among the two pairs of mutually opposite edges, of the semiconductor element (10) which has gone through the first vision inspection part (40).

Description

Vision Inspection Module and Device Handler Having It

The present invention relates to an element handler, and more particularly, to a vision inspection module for performing a vision inspection on a semiconductor device and a device handler having the same.

After the packaging process, the semiconductor device device is shipped to the customer tray after inspection such as burn-in test.

In addition, the semiconductor device that is shipped is subjected to a marking process in which a label such as a serial number and a manufacturer's logo is displayed on a surface of the semiconductor device.

In addition, the semiconductor device device finally inspects whether the lead device or ball grid is damaged, cracks, scratches, etc., the appearance of the semiconductor device device and whether the marking formed on the surface is good. It will go through the process.

On the other hand, as the inspection of the appearance state of the semiconductor device device and whether the marking is satisfactory is added, the inspection time and the arrangement of each module affect the time and the size of the device for the entire process execution.

In particular, the size of the device depends on the loading of a tray loaded with a plurality of elements, one or more modules for vision inspection of each element, and the configuration and arrangement of the unloading module according to the inspection result after the inspection.

In addition, the size of the device limits the number of device handlers that can be installed in the device inspection line, or affects the installation cost for device production according to the installation of a predetermined number of device handlers.

SUMMARY OF THE INVENTION An object of the present invention is to provide a vision inspection module and a device handler having the vision inspection module capable of performing vision inspection by acquiring images of the surface of the semiconductor device and a plurality of side surfaces adjacent to the surface by recognizing the above points. To provide.

The present invention was created in order to achieve the object of the present invention as described above, the present invention is a pair of two pairs of large sides facing each other in the semiconductor device 10 of the planar rectangular shape for vision inspection A first vision inspection unit 40 for acquiring side images of the sides of the opposite sides; In the semiconductor device 10 that has passed through the first vision inspection unit 40, a second vision inspection unit 50 obtaining side images of sides of the other pair of opposite sides of the pair of large sides facing each other is provided. Disclosed is a vision inspection module comprising a.

The first vision inspection unit 40 includes: an image acquisition unit 600 for acquiring side images of the pair of opposite sides; It may include an optical system 300 for forming the first optical path (L1) for each of the side images of the pair of opposing sides to reach the image acquisition unit 600.

The second vision inspection unit 50 includes an image acquisition unit 600 for acquiring side images of the pair of opposite sides; It may include an optical system 300 for forming the first optical path (L1) for each of the side images of the pair of opposing sides to reach the image acquisition unit 600.

The image acquisition unit 600 may simultaneously acquire a first plane image of the first plane of the semiconductor device 10.

In this case, the optical system 300 may form a second optical path L2 to allow the first plane image of the first plane of the semiconductor device 10 to reach the image acquisition unit 100.

The optical system 300 may include a pair of auxiliary reflecting members 320 for reflecting each of the side images of the pair of opposing sides toward the image acquisition unit 600.

The pair of auxiliary reflecting members 320 may be formed on a center line of the pair of opposing sides to enable vision inspection according to the size of the width of the pair of opposing sides according to the size of the semiconductor device 10. It can be installed to enable linear symmetrical movement.

The optical system 300 may further include a width adjusting unit 330 for adjusting the width formed by the pair of auxiliary reflecting members 320.

The optical system 300 may further include a focal length compensator 340 for correcting a focal length difference between the first optical path L1 and the second optical path L2.

The focal length correction unit 340 may include a medium unit 342 installed on at least one of the first optical path L1 and the second optical path L2 and having a transparent material capable of light transmission. have.

The focal length correction unit 340 may be integrally formed with the pair of auxiliary reflection members 320.

In another aspect, the present invention, the wafer ring 20 is loaded by receiving the wafer ring 20 from the wafer ring loading unit 100 is loaded with a wafer ring 20 is loaded with a plurality of elements (10) ) And a wafer ring movement table 200 for moving to the withdrawal position; An element unloading unit 400 which unloads the element 10 by seating the elements 10 extracted from the wafer ring 20 on the unloading member 30; The unloading member 30 is picked up at the loading position P2 of the device unloading unit 400 by picking up the device 10 at the withdrawal position P1 from the wafer ring 20 on the wafer ring movement table 200. At least one transfer tool 500 is loaded on the), the vision inspection module according to any one of claims 1 to 3, which is installed on the transfer path by the at least one transfer tool 500 element ( Disclosed is a device handler comprising a vision inspection module for performing vision inspection for 10).

The one or more transfer tools 500, the rotary drive unit 710 having a vertical axis of rotation 711; A plurality of rotation arms 720 coupled to the rotation shaft 711 and disposed along the rotation direction of the rotation shaft 711; Pickers coupled to each of the plurality of rotation arms 720 to pick up the semiconductor device 10 so as to be sequentially positioned at the withdrawal position P1 and the unloading position P2 by the rotation of the rotation shaft 711. It may include a first transfer tool 700 including a (730).

The vision inspection module may be installed between the withdrawal position P1 and the unloading position P2 in the rotational movement path of the picker 730 around the rotation shaft 711.

The element handler picks up the semiconductor element 10 from the wafer ring 20 at the withdrawal position P1 and transfers the semiconductor element 10 to the first transfer tool 700 at the transfer position P3. The semiconductor device 10 may further include a second transfer tool 800 for flipping.

At this time, the second transfer tool 800, the rotary drive unit 810 having a horizontal axis of rotation 811; A plurality of rotation arms 820 coupled to the rotation shaft 811 and disposed along the rotation direction of the rotation shaft 811; Pickers coupled to each of the plurality of rotation arms 820 to be sequentially positioned at the lead position P1 and the transfer position P3 by rotation of the rotation shaft 811 (pickers for picking up the semiconductor element 10) 830).

The vision inspection module and the device handler having the same according to the present invention have the advantage of being able to perform various and rapid vision inspections by performing the vision inspection by acquiring an image of the surface of the semiconductor device and a plurality of side surfaces adjacent to the surface of the semiconductor device. have.

In particular, a pair of auxiliary reflecting members for performing vision inspection corresponding to a pair of opposing sides of the semiconductor device is installed to allow width adjustment between the pair of auxiliary reflecting members according to the specifications of the semiconductor device. Even if the specification of the device is changed, vision inspection can be performed without changing the device, thereby increasing the utilization of the device.

In addition, the element handler according to the present invention, when the element is picked up from the loading member loaded with a plurality of elements in the withdrawal position and unloading the element from the unloading position to the unloading member, a plurality of elements around the rotation axis of the rotary drive device Rotate the pickers to sequentially position them in the withdrawal and unloading positions, and install a vision inspection module between the withdrawal and unloading positions, simplifying and minimizing the picker's movement structure for pick-up, vision inspection and transfer of devices. There is an advantage that can significantly increase the system processing speed.

1 is a plan view showing an example of an element handler according to the present invention.

2A and 2B are a perspective view and a cross-sectional view showing an example of a loading member used in the element handler of FIG.

3 is a perspective view illustrating an example of an unloading member used in the element handler of FIG. 1.

4 is a side view of the element handler of FIG. 1.

5A is a conceptual diagram illustrating a distance adjusting process of an auxiliary reflection member according to a horizontal length of a semiconductor device of a vision inspection module installed in the device handler of FIG. 1.

5B is a conceptual diagram illustrating a distance adjusting process of the auxiliary reflection member according to the length of the semiconductor device of the vision inspection module installed in the device handler of FIG. 1.

FIG. 6 is a plan view illustrating an embodiment of a width adjusting unit of a vision inspection module installed in the device handler of FIG. 1.

7 is a plan view illustrating another embodiment of the width adjusting unit of the vision inspection module installed in the device handler of FIG. 1.

8 is a side view illustrating an example of an optical system configuration of a vision inspection module installed in the device handler of FIG. 1.

Hereinafter, a vision inspection module and a device handler including the same according to the present invention will be described with reference to the accompanying drawings.

The device handler according to an embodiment of the present invention, as shown in Figure 1, the wafer ring 20 from the wafer ring loading unit 100 is loaded with a wafer ring 20 loaded with a plurality of elements 10 A wafer ring movement table 200 for receiving the wafers and moving the wafer rings 20 loaded with each element to a withdrawal position; An element unloading unit 400 which unloads the element 10 by seating the elements 10 extracted from the wafer ring 20 on the unloading member 30; Picking up the element 10 at the withdrawal position P1 from the wafer ring 20 on the wafer ring movement table 200 and loading it on the unloading member 30 at the loading position P2 of the element unloading unit 400. One or more transfer tools 500; It includes a vision inspection module is installed on the transfer path by at least one transfer tool 500 to perform a vision inspection for the device (10).

Here, the semiconductor device 10 may be any object that is a semiconductor device that has completed a semiconductor process such as a memory, an SD RAM, a flash RAM, a CPU, and a GPU.

The wafer ring loading unit 100 is configured to load a plurality of wafer rings 20 loaded with a plurality of semiconductor elements 10, and various configurations are possible.

Meanwhile, the wafer ring loading unit 100 for transferring the wafer ring 20 from the wafer ring loading unit 100 to the wafer ring movement table 200 withdraws the wafer ring 20 from the wafer ring cassette and withdraws the wafer ring 20 from the wafer ring cassette. Any configuration can be used as long as the wafer ring 20 can be transferred to the wafer ring movement table 200.

The wafer ring cassette may have any configuration as long as the wafer ring 20 can be stacked up and down as a configuration for stacking the plurality of wafer rings 20.

For example, the wafer ring loading unit 100 may be configured as a clamping device and a linear driving device, or may be configured as a pusher and a linear driving device for linearly moving the pusher.

Herein, the semiconductor device 10 loaded on the wafer ring 20 may be a device that is classified by a separate device handler through a semiconductor inspection and sawing process in a wafer state, and vision inspection in a wafer state.

In particular, the semiconductor device, that is, the device 10, unlike the conventional device that goes through the packaging process after the semiconductor process, a so-called wafer level device that does not require a packaging process may be the object.

On the other hand, the wafer ring 20, as shown in Figures 2a and 2b, is a configuration in which the device 10 is completed after the semiconductor process and sawing process, the tape 11a and the tape to which the device 10 is attached It may be configured to include a frame member (11b) for fixing (11a).

As long as the tape 11a is a member to which the semiconductor elements 10 can be attached, any member may be used, and a so-called attachment tape may be used.

The frame member 11b is configured to fix the tape 11a to which the semiconductor elements 10 are attached, as shown in FIGS. 2A and 2B, and a circular ring, a square ring as shown in FIG. 3, and the like. Configuration is possible.

The wafer ring movement table 200 is configured to move the wafer ring 20 in a horizontal direction by receiving the wafer ring 20 from the wafer ring loading unit 100.

For example, the wafer ring movement table 200 receives a wafer ring 20 from the wafer ring loading unit 100 by a wafer ring loading unit (not shown) so that the semiconductor device 10 can be picked up. As the configuration for moving the ring 20 in the horizontal direction, various configurations such as an XY table and an XY-Θ table are possible.

In addition, the wafer ring movement table 200 may be moved in the vertical direction, that is, the Z-axis direction.

In addition, a needle pin is preferably installed below the wafer ring movement table 200 at the withdrawal position P1 for smooth device pickup.

The device unloading unit 400 is installed spaced apart from the wafer ring movement table 200 in the horizontal direction and is provided with an unloading member 30 for receiving and loading the semiconductor device 10 from the wafer ring 20. Various configurations are possible as

In particular, the device unloading unit 400 is configured according to the configuration of the unloading member 30 such as a tape and reel (carrier tape and cover tape).

On the other hand, the unloading member 30 may be any configuration as long as the device is loaded, and includes a tape and reel (carrier tape and cover tape) as shown in FIG. 1, and an adhesive tape as shown in FIG. 3. Various members may be used that are temporarily loaded for shipping or performing other processes, such as a plate and a tray having a plurality of insertion grooves in which the semiconductor device 10 is contained.

In addition to the member in which the semiconductor device 10 is temporarily loaded, the unloading member 30 includes a lead frame for manufacturing a substrate, a strip, and a chip, such as a PCB, on which the semiconductor device 10 is mounted. Etc. can be used for chip mounting and packaging processes.

For example, as shown in FIG. 1, the device unloading unit 400 may include a pocket in which the semiconductor device 10 is loaded, formed along the length direction and sealed by a tape (not shown) after device loading. When the tape constitutes the unloading member 30, a release roll unit (not shown) is rotatably installed at one end and the carrier tape on which the semiconductor element 10 is to be loaded, and is rotatably installed at the other end, and after device loading. A winding roll portion (not shown) to which the carrier tape sealed by the tape is wound, and a carrier tape guide portion (not shown) for guiding the movement of the carrier tape so that the carrier tape unwound from the release roll portion (not shown) passes the loading position. It can be configured to include.

As another example of the device unloading unit 400, in the case of a plate (see FIG. 3) to which the unloading member 30 is attached, the device unloading unit 400 may be positioned at one end and may include a plurality of semiconductor devices ( 10) a plate loading portion on which the plate to which the plates are attached are mounted, an XY table for supporting and moving the plate at the semiconductor device 10 loading position P2, and a tray moving portion for transferring the plate from the tray loading portion to the XY table (not shown) It may be configured to include).

Here, the plate, as shown in Figure 3, has a configuration similar to the wafer ring 20, the tape is attached to the device 10, and a frame member having a mark such as LOT number, classification grade while fixing the tape Or a tray formed of a plurality of insertion grooves in which the semiconductor element 10 is contained. A tray standardized according to the type of the semiconductor element 10, that is, a JEDEC tray, may be used.

The one or more transfer tools 500 pick up the element 10 at the withdrawal position P1 from the wafer ring 20 on the wafer ring movement table 200 to place the loading position P2 of the element unloading unit 400. In the configuration to load on the unloading member 30 in a variety of configurations are possible.

For example, the one or more transfer tools 500 may be provided with the device 10 at the withdrawal position P1 from the wafer ring 20 in which the plurality of semiconductor devices 10 are loaded, as shown in FIGS. 1 and 4. Picking up may include a first transfer tool 700 for transferring the semiconductor device 10 in order to unload the semiconductor device 10 to the unloading member 30 in the unloading position (P2).

In one embodiment, the first transfer tool 700, the rotary drive unit 710 having a vertical axis of rotation 711; A plurality of rotation arms 720 coupled to the rotation shaft 711 and disposed along the rotation direction of the rotation shaft 711; The picker 730 coupled to each of the plurality of rotation arms 720 so as to be sequentially positioned at the withdrawal position P1 and the unloading position P2 by the rotation of the rotation shaft 711, and picks up the semiconductor device 10. It may include.

The rotation driving unit 710 is provided with a rotating shaft 711 in the vertical direction, and any configuration can be used as long as the rotation driving device is a configuration for rotating the rotating arm 720 coupled to the rotating shaft 711.

On the other hand, the rotary drive unit 710, the picker 730 coupled to the rotary arm 720 picks up the semiconductor element 10 by the vacuum pressure bar while being capable of transmitting the vacuum pressure to the picker 730 It is desirable to have a pneumatic rotary joint for delivering pneumatics.

The rotating arm 720 may be any structure as long as it is coupled to the rotating shaft 711 and rotates and supports the picker 730.

The picker 730 is coupled to each of the plurality of rotation arms 520 so as to be sequentially positioned at the withdrawal position P1 and the unloading position P2 by the rotation of the rotation shaft 711. Any configuration can be used as long as it can pick up the semiconductor element 10 as a configuration for picking up.

As an example, the picker 730 may be configured to pick up the semiconductor device 10 from the wafer ring 20 by vacuum pressure.

In addition, the picker 730 may be moved up and down by a vertical drive device installed in the rotary arm 720.

In addition, the picker 730 is preferably installed in 4n (n is a natural number of 1 or more) so as to have an equiangular center around the axis of rotation (711) for regular pickup of the device pickup and place.

On the other hand, the device handler according to the present invention, by inverting (flip) the top and bottom of the picked-up semiconductor device 10 of the semiconductor device 10 to perform a vision inspection of one surface (top or bottom) of the semiconductor device 10 A second transfer tool 800 for flipping may be included.

The second transfer tool 800 is configured to transfer the semiconductor device 10 to the first transfer tool 700 after picking up and flipping the device 10 from the wafer ring 20.

For example, the second transfer tool 800 picks up the semiconductor element 1 from the wafer ring 20 at the withdrawal position P1 and transfers the semiconductor element 1 to the first transfer tool at the transfer position P3. The semiconductor device 1 may be flipped by transferring the data to 700.

The second transfer tool 800 may be installed between the withdrawal position P1 and the delivery position P3.

Here, the delivery position P3 is preferably set at a position spaced apart from the drawing position P1 in the vertical direction (Z-axis direction).

In one embodiment, the second transfer tool 800, the rotary drive unit 810 having a horizontal axis of rotation (811); A plurality of rotation arms 820 coupled to the rotation shaft 811 and disposed along the rotation direction of the rotation shaft 811; A picker 830 coupled to each of the plurality of rotation arms 820 so as to be sequentially positioned at the lead position P1 and the transfer position P3 by rotation of the rotary shaft 811, and picking up the semiconductor device 10. can do.

As shown in FIG. 4, the second transfer tool 800 has a horizontal axis of rotation 811 and the upper surface of the semiconductor device 10 picked up at the withdrawal position P1 is downward (-Z direction). Can be reversed to face.

The second transfer tool 800 is configured in the same manner as the first transfer tool 700 except that the rotation axis 811 is in the horizontal direction, and is a rotation axis 811 between the withdrawal position P1 and the transfer position P3. It can be rotated around.

On the other hand, the element handler, the picked-up device 10 to calculate the horizontal error of the semiconductor device 10 picked up at the withdrawal position (P1) by the transfer tool, that is, the picker 700 of the first transfer tool 700 The first lower image is obtained by horizontally receiving the semiconductor device 10 from the picker 730 passing through the first lower image acquisition unit 910 and the first lower image acquisition unit 910 for acquiring an image of the bottom surface of the first lower image. The element aligning unit 920 for correcting the horizontal error calculated from the image acquired by the acquiring unit 910, the vision inspection module described later, and the like, may have the withdrawal position P1 and the unloading position ( It can be installed sequentially between the P2).

The first lower image acquisition unit 910 is a semiconductor device 10 picked up at the extraction position P1 in order to calculate a horizontal error of the semiconductor device 10 picked up at the extraction position P1 by the picker 730. As a configuration for acquiring an image of the bottom of the), various configurations such as a scanner and a camera are possible.

The device alignment unit 920 is obtained by the first lower image acquisition unit 910 by horizontally receiving the semiconductor device 10 from the picker 730 that has passed through the first lower image acquisition unit 910. Various configurations are possible as the configuration for correcting the horizontal error calculated from the image.

For example, the device aligning unit 920 may be a device fixing part for fixing the semiconductor device 10 by receiving the semiconductor device 10 from the picker 730, as disclosed in Korean Patent Application Publication No. 10-2014-0027970. 922 and a horizontal shifter 924 which horizontally shifts the device fixing part 922 fixing the semiconductor device 10 to correct the horizontal error calculated from the image acquired by the first lower image acquirer 910. It may include.

The device fixing unit 922 may be configured to receive and fix the semiconductor device 10 from the picker 730 to fix and fix the semiconductor device 10 by vacuum pressure.

The horizontal shifting unit 924 is configured to horizontally shift the device fixing part 922 fixing the semiconductor device 10 to correct the horizontal error calculated from the image acquired by the first lower image acquisition unit 910. The device fixing part 922 may be configured to move in the XY direction and in the XY-Θ direction.

The device handler includes a picker 730 having a second lower image acquisition unit (not shown) which acquires an image of the bottom surface of the semiconductor device 10 picked up by the device alignment unit 920 around the rotation axis 711. It may be installed between the element alignment unit 920 and the unloading position (P2) in the rotational movement path of the).

In this case, the picker 730 picking up the semiconductor device 10 from the device alignment unit 920 may have a bottom surface state and a horizontal error of the semiconductor device 10 from an image acquired by a second lower image acquisition unit (not shown). It is preferable that the picker 730 places the semiconductor device 10 into the unloading member 30 at the unloading position P2 only when it is determined to be normal by calculating.

The second lower image acquisition unit (not shown) is disposed between the element alignment unit 920 and the unloading position P2 in the movement path of the picker 730, for example, in the rotation movement path. As a configuration for acquiring an image of a bottom surface, a configuration similar to that of the first lower image acquisition unit 910 is possible, and various configurations such as a scanner and a camera are possible.

On the other hand, the element handler is installed between the unloading position (P2) and the withdrawal position (P1) in the movement path of the picker 730 around the rotation axis 711, for example, the rotation movement path, and acquires a second lower image. If the bottom state and the horizontal error of the device 10 is determined to be abnormal by calculating the bottom state and the horizontal error from the image obtained by the (not shown) element recovery unit 930 for recovering the semiconductor device 10 from the picker 730 It can be installed additionally.

The element recovery unit 930 is not necessarily provided, but is installed on the movement path of the picker 730, for example, on the rotation movement path, in particular between the unloading position P2 and the extraction position P2. Any configuration may be used as long as the device 10 can receive and recover the elements 10 from the picker 730.

Meanwhile, the device handler may further include a vision inspection module that performs vision inspection on the semiconductor device 10.

The vision inspection module may be configured in various ways according to the type of vision inspection, and performs vision inspection on any one surface (hereinafter, referred to as a 'first plane') of the upper and lower surfaces of the semiconductor device 10 and adjacent sides thereof. It is preferred to be configured to perform all.

Specifically, the vision inspection module is a semiconductor device installed between the withdrawal position (P1) and the unloading position (P2) in the movement path of the picker 730 around the rotation axis 711, for example in the rotation movement path As the configuration for performing the vision inspection for (10), various configurations are possible.

In particular, the vision inspection module is configured to acquire an image of the appearance of the bottom surface of the semiconductor device 10 by using a camera, a scanner, or the like.

Here, the image acquired by the vision inspection module is used for non-point inspection, such as whether the defect after image analysis using a program or the like.

More specifically, the vision inspection module, as shown in FIGS. 2A and 8, has a surface opposite to that of the semiconductor device 10 having a rectangular planar shape in the state of being picked up by the first transfer tool 700. It is preferred to be configured to perform vision inspection on both the first plane) and the four sides.

That is, the vision inspection module includes a first vision inspection unit 40 for acquiring side images of sides of a pair of opposite sides of the four sides of the semiconductor device 10 having a planar rectangular shape for vision inspection. )Wow; The second vision inspection unit 50, which is arranged perpendicular to the opposite sides of the four sides of the semiconductor device 10 that pass through the first vision inspection unit 40 and acquires side images of the sides of the other pair of opposite sides facing each other. ) May be included.

The first vision inspection unit 40 and the second vision inspection unit 50 rotate the picker 730 that picks up the element 10, for example, the rotation of the picker 730 around the rotation axis 711. The moving path may be sequentially installed between the withdrawal position P1 and the unloading position P2.

Particularly, the first vision inspection unit 40 and the second vision inspection unit 50 are sequentially installed between the element alignment unit 920 and the stacking position P2 to sequentially perform vision inspection on opposite sides. Do.

The first vision inspection unit 40 is configured to acquire side images of side surfaces of a pair of opposing sides (first opposing sides) of the four sides of the semiconductor device 10 having a planar rectangular shape. Various configurations are possible.

The second vision inspection unit 50 may include side images of sides of a pair of opposing sides (second opposing sides) of the four opposite sides of the semiconductor device 10 that have passed through the first vision inspection unit 40. Various configurations are possible with the configuration to obtain.

On the other hand, the first vision inspection unit 40 and the second vision inspection unit 50 have a common in performing side vision inspection for four sides of the semiconductor device 10 having a rectangular planar shape. It may be configured, but need not necessarily be similarly configured.

More specifically, at least one of the first vision inspection unit 40 and the second vision inspection unit 50 includes: an image acquisition unit 600 for acquiring side images of a pair of opposite sides; The optical system 300 may include a plurality of first optical paths L1 that allow each of the side images of the pair of opposite sides to reach the image acquisition unit 600.

The image acquisition unit 600 is configured to acquire side images of the corresponding sides (sides of the first opposing sides or sides of the second opposing sides) of four sides of the semiconductor device 10. This is possible.

For example, the image acquisition unit 600 may be a camera, a scanner, or the like.

Meanwhile, at least one image acquisition unit 600 of the first vision inspection unit 40 and the second vision inspection unit 50 may simultaneously acquire a first plane image of the first plane of the semiconductor device 10. have.

The image acquisition unit 600 controls the first plane image of the first plane of the semiconductor device 10 and the side images of the sides of the opposite sides of the semiconductor device 10 to analyze the acquired images. (Not shown), and the delivered images may be used for vision inspection, such as whether the defect after image analysis using a program or the like.

The optical system 300 includes an image acquisition unit 600 each of the side images of the side surfaces (side surfaces of the first opposite sides or sides of the second opposite sides) of the four sides of the semiconductor device 10. Various configurations are possible as the configuration for forming the plurality of first optical paths L1 to reach the.

In detail, the optical system 300 includes the numbers of the lens 302, the reflecting

members

310 and 320, the transflective member, the prism, and the like according to the installation positions of the semiconductor device 10 and the image acquisition unit 600. The installation location can be selected.

Meanwhile, when the image acquisition unit 600 simultaneously acquires the first plane image of the first plane of the semiconductor device 10, the optical system 300 reaches the image acquisition unit 600. The second optical path L2 may be further formed.

In one embodiment, the optical system 300, the main reflection member 310 for reflecting the first plane image of the first plane toward the image acquisition unit 600, and the side surface of the semiconductor device 10 It may include a pair of auxiliary reflecting member 320 to reflect the side image toward the main reflecting member (310).

The main reflecting member 310, as a configuration for reflecting the first plane image on the first plane toward the image acquisition unit 600, various members such as a reflective member, a semi-transmissive member may be used.

The main reflection member 310 is configured to reflect the first plane image of the semiconductor device 10 toward the image acquisition unit 600, and only when the image acquisition unit 600 acquires the first plane image. As a matter of course, it does not correspond to the essential configuration of the present invention.

As shown in FIGS. 1 and 5A to 8, the pair of auxiliary reflecting members 320 are installed to correspond to a pair of side surfaces of the semiconductor device 10 that are opposite to each other of the semiconductor device 10. As a configuration for reflecting the side image on the side toward the image acquisition unit 600, various members such as a reflective member, a transflective member, and the like may be used.

When the optical system 300 includes a main reflection member 310 for reflecting the first plane image of the semiconductor device 10 to the image acquisition unit 600, the pair of auxiliary reflection members 320 may include a semiconductor device. The side image of each side of 10 may be reflected to face the main reflection member 310.

The pair of auxiliary reflecting members 320 may be symmetrically installed with respect to the centerlines C and N passing through the center of the pair of opposite sides and parallel to the pair of opposite sides.

At this time, the pair of auxiliary reflecting members 320, the center line (C) formed by a pair of opposing sides to enable vision inspection according to the size of the width of the pair of opposing sides according to the specification of the semiconductor device 10 , N) can be installed to enable linear symmetrical movement.

Specifically, the pair of auxiliary reflecting members 320 of the first vision inspection unit 40, as shown in Figure 5a, is installed symmetrically with respect to the center line (C) formed by a pair of opposing sides opposing sides They may be installed so as to be linearly symmetrical movement with respect to the center line formed by them.

Similarly, the pair of auxiliary reflecting members 320 of the second vision inspection unit 50, as shown in FIG. 5B, has a pair of opposing sides that have been inspected by the first vision inspection unit 40 (first). It can be installed symmetrically with respect to the center line (N) formed by the other pair of opposing sides (the second opposing sides) except for the opposite sides) so as to be linearly symmetrical with respect to the center line formed by the pair of opposing sides. have.

Meanwhile, the optical system 300 is provided with an illumination system 360 for irradiating light to the first plane and side surfaces for vision inspection, and the illumination system 360 may be variously installed according to the irradiation method.

The illumination system 360 may irradiate various types of light, such as monochromatic light such as laser light, tricolor light such as R, G, and B, and white light, depending on the form of vision inspection, and various light sources such as an LED element may be used.

In addition, the illumination system 360 may be variously disposed according to the configuration of the optical system.

For example, when the optical system 300 includes the main reflective member 310 described above, the main reflective member 310 may have a transflective material through which light can pass, and the illumination system 360 includes: It may be configured to irradiate light on each side of the first plane and the opposite sides at the back surface of the reflective surface reflecting the first plane image.

In addition, the illumination system 360 may be configured such that irradiation on the first plane and irradiation on each side of the side surfaces is performed by a separate light source (not shown), wherein the auxiliary reflection member 320 described above is It may be configured to have a transflective material that can transmit light, and to irradiate the light on each side of the opposite sides or opposite sides of the semiconductor device 10 on the back side of the reflective surface reflecting the side image.

On the other hand, the side images and the first plane image are obtained through different optical paths, that is, the first optical path L1 and the second optical path L2, so that the focal lengths are different from each other due to the path difference of the optical paths. When an image is acquired by an acquiring device, that is, a camera, one of the first planar image and the side image is out of focus, which causes blur.

Accordingly, the optical system 300 further includes a focal length correction unit 340 for correcting a focal length difference between the first optical path L1 and the second optical path L2, as shown in FIG. 8. can do.

Since the focal length correction unit 340 is obtained through the first optical path L1 and the second optical path L2, various configurations are possible as corrections for changing the focal lengths due to the path difference of the optical paths. .

For example, the focal length compensator 340 may include a medium part 342 installed on the light paths L1 and L2 and having a transparent material capable of light transmission.

The medium part 342 is provided on the optical paths L1 and L2 to correct the focal length, and is installed on the optical paths L1 and L2 such as transparent glass and quartz and has a focal length due to a difference in refractive index. It is a configuration to correct.

In particular, the medium part 342 is preferably installed in the first optical path L1 of the first optical path L1 and the second optical path L2.

Here, the medium part 342 may have a column shape such as a cylinder, a polygonal column, and the like, in which the incident surface and the transmissive surface of the light form a plane perpendicular to the optical path and have a predetermined thickness t.

In addition, the medium portion 342 is preferably formed integrally with the auxiliary reflection member 320.

The thickness t of the medium portion 342 is an image acquisition working distance A with respect to the side surface of the semiconductor device 10 disposed between the pair of auxiliary reflection members 320 as shown in Equation 1 below. It may vary.

Where t is the thickness of the medium portion 342 in the optical path direction, n is the refractive index of the medium portion 342, and A is This is the working distance for acquiring the image on the side.

The image acquisition working distance A on the side surface refers to the distance from the auxiliary reflection member 320 to the side surface of the semiconductor device 10.

The thickness t of the medium part 342 may be determined based on the semiconductor device 10 having a standard of the maximum measurable size.

Therefore, when the thickness t of the medium portion 342 is determined based on the semiconductor device 10 having the largest sizeable standard, the medium portion 342 having a constant thickness t may be formed of a semiconductor device having various standards. In order to utilize the vision inspection of 10), it is necessary to adjust the image acquisition working distance A on the side of the semiconductor device 10 according to the specification of the semiconductor device 10.

That is, the medium unit 342 is integrated with a pair of auxiliary reflecting members 320 to adjust the image acquisition working distance A on the side surface according to the standard of the semiconductor device 10 to be measured. It is preferable to be formed so as to be movable.

In other words, the medium part 342 is formed in a pair and installed on the first optical path L1, and is formed integrally with each of the pair of auxiliary reflecting members 320, and thus, the pair of auxiliary reflecting members 320. ) And linearly symmetrical movement with respect to the center line (C, N) formed by the sides (first opposite sides or the second opposite sides) associated with.

Thus, the optical system 300 may further include a width adjusting unit 330 for adjusting the width formed by the pair of auxiliary reflecting members 320.

The width adjusting part 330 may include the pair of auxiliary reflecting members 320 based on the center lines C and N of the side surfaces (the first opposing sides or the second opposing sides) of the semiconductor device 10. Various configurations are possible by adjusting the width formed by the pair of auxiliary reflecting members 320 by moving in the direction away from or near the center line (C, N).

In one embodiment, as shown in FIG. 6, the width adjusting part 330 is installed in parallel to the arrangement direction of the pair of auxiliary reflecting members 320 and passes through the center of the semiconductor device 10. Left and right threaded lines are formed on the outer circumferential surface of the pair of auxiliary reflecting members 320 with respect to the center lines C and N parallel to the side surfaces (the first opposite sides or the second opposite sides). Rotating shafts 332 which are respectively screwed together; A rotation driving unit 334 coupled to one end of the rotation shaft to rotate the rotation shaft; It may include a guide portion 336 coupled to the other end of the pair of auxiliary reflecting member 320 to guide the movement path of the pair of auxiliary reflecting member 320, respectively.

In another embodiment, the width adjusting unit 330 is rotated by a pair of belt pulleys 333 installed on both sides of the pair of auxiliary reflecting members 320, as shown in FIG. Each of the pair of auxiliary reflecting members 320 may include a belt 335 coupled to the opposite side.

The width adjusting part 330 is a pair of auxiliary reflecting members 320 installed symmetrically with respect to the center line C of the pair of opposing sides is coupled to the opposite side of the belt 335, belt pulley 333 ) Rotates in a clockwise direction, the pair of sub-reflective members 320 move toward each other, and when the belt pulley 333 rotates counter-clockwise, the pair of sub-reflective members 320 move away from each other. Can be moved.

The width adjusting unit 330 having the configuration described above includes a pair of auxiliary reflecting members 320 or a pair of auxiliary reflecting members 320 and a pair of medium portions 342, respectively. May be coupled to the medium portion 342.

As shown in FIGS. 5A to 5B, the width adjusting unit 330 is a semiconductor having a shorter length in the W direction or the H direction than the semiconductor device 10 having the maximum size Wm and Hm. When the vision inspection is performed on the device 10, the pair of auxiliary reflection members 320 and the medium part 342 may be moved in the direction toward the semiconductor device 10, and thus the side surfaces of the semiconductor device 10 may be moved. Image acquisition working distance (A) can be adjusted.

By installing the pair of auxiliary reflecting members 320, the focal length correction unit 340 and the width adjusting unit 330 as described above, the focal length is different from each other due to the path difference of the optical path, that is, a single image acquisition device When the image is acquired by the camera, one of the first planar image and the side image may be out of focus and may be blurred.

According to the above configuration, the first vision inspection unit 40 may perform vision inspection by acquiring images of three surfaces of the first plane and two opposite sides of the semiconductor device 10.

The second vision inspection unit 50 acquires images of three surfaces of the first plane of the semiconductor device 10 and opposite sides of the first vision inspection unit 40 where vision inspection is not performed. Can be done.

In the vision inspection module according to the present invention, in the vision inspection of the semiconductor device 10 having a planar quadrangular shape, the two sides facing each other are opposed to each other, instead of acquiring an image of the first plane and four sides at once. Arranged perpendicular to the sides and the opposite sides, the image is obtained by separating the opposite sides facing each other, and by configuring the optical system for the image acquisition of the opposite sides and the opposite sides to be movable, various specifications without structural changes of the optical system Vision inspection of the semiconductor device 10 may be performed.

In addition, the vision inspection module according to the present invention is not limited to the device handler having the above configuration, and may be applied to any vision inspection system that inspects the side surface of the semiconductor device 10 having a rectangular planar shape.

The exemplary embodiments of the present invention have been described above by way of example, but the scope of the present invention is not limited to these specific embodiments, and may be appropriately changed within the scope of the claims.

Claims

A first vision inspection unit 40 for acquiring side images of sides of a pair of opposing sides of two pairs of large sides facing each other in the semiconductor device 10 having a rectangular planar shape for vision inspection;

In the semiconductor device 10 that has passed through the first vision inspection unit 40, a second vision inspection unit 50 obtaining side images of sides of the other pair of opposite sides of the pair of large sides facing each other is provided. Vision inspection module comprising a.
The method according to claim 1,

The first vision inspection unit 40,

An image acquisition unit 600 for acquiring side images of the pair of opposite sides;

And an optical system (300) forming first optical paths (L1) for reaching each of the side images of the pair of opposing sides to reach the image acquisition unit (600).
The method according to claim 1,

The second vision inspection unit 50,

An image acquisition unit 600 for acquiring side images of the pair of opposite sides;

And an optical system (300) forming first optical paths (L1) for reaching each of the side images of the pair of opposing sides to reach the image acquisition unit (600).
The method according to any one of claims 2 and 3,

The image acquisition unit 600,

Simultaneously acquiring a first plane image of the first plane of the semiconductor device 10,

The optical system 300,

Vision inspection module, characterized in that to form a second optical path (L2) for the first planar image of the first plane of the semiconductor device 10 to reach the image acquisition unit (100).
The method according to any one of claims 2 and 3,

The optical system 300,

Vision inspection module, characterized in that it comprises a pair of auxiliary reflecting member (320) for reflecting each of the side images of the pair of opposite sides facing the image acquisition unit (600).
The method according to claim 5,

The pair of auxiliary reflecting members 320,

According to the specification of the semiconductor device 10 characterized in that installed in the linear symmetrical movement with respect to the center line formed by the pair of opposing sides to enable vision inspection according to the size of the width formed by the pair of opposing sides Vision Inspection Module.
The method according to claim 6,

The optical system 300,

Vision inspection module, characterized in that it further comprises a width adjusting portion 330 for adjusting the width of the pair of auxiliary reflecting member (320).
The method according to any one of claims 2 to 7,

The second vision inspection unit 50,

An image acquisition unit 600 for acquiring side images of the pair of opposite sides;

And an optical system (300) forming first optical paths (L1) for reaching each of the side images of the pair of opposing sides to reach the image acquisition unit (600).
The method according to claim 4,

The optical system 300,

And a focal length correction unit (340) for correcting a focal length difference between the first optical path (L1) and the second optical path (L2).
The method according to claim 9,

The focal length correction unit 340,

Vision inspection module, characterized in that it comprises a medium portion 342 is installed on at least one of the first optical path (L1) and the second optical path (L2) having a transparent material capable of light transmission.
The method according to claim 9,

The optical system 300,

It includes a pair of auxiliary reflecting member 320 for reflecting each of the side images of the pair of opposite sides facing the image acquisition unit 600,

The focal length correction unit 340,

Vision inspection module, characterized in that formed integrally with the pair of auxiliary reflecting member (320).
A wafer which receives the wafer ring 20 from the wafer ring loading unit 100 on which the wafer rings 20 loaded with the plurality of elements 10 are loaded, and moves the wafer rings 20 loaded with the respective elements to a withdrawal position. A ring moving table 200;

An element unloading unit 400 which unloads the element 10 by seating the elements 10 extracted from the wafer ring 20 on the unloading member 30;

The unloading member 30 is picked up at the loading position P2 of the device unloading unit 400 by picking up the device 10 at the withdrawal position P1 from the wafer ring 20 on the wafer ring movement table 200. At least one transfer tool 500 for loading in),

A vision inspection module according to any one of claims 1 to 3, comprising a vision inspection module installed on a transport path by the one or more transfer tools 500 to perform a vision inspection for the device 10. Device handler, characterized in that.
The method according to claim 12,

The one or more transfer tools 500,

A rotary drive unit 710 having a vertical axis of rotation 711; A plurality of rotation arms 720 coupled to the rotation shaft 711 and disposed along the rotation direction of the rotation shaft 711; Pickers coupled to each of the plurality of rotation arms 720 to pick up the semiconductor device 10 so as to be sequentially positioned at the withdrawal position P1 and the unloading position P2 by the rotation of the rotation shaft 711. A device handler comprising a first transfer tool (700) comprising a (730).
The method according to claim 13,

The vision inspection module,

Device handler, characterized in that installed between the withdrawal position (P1) and the unloading position (P2) in the rotational movement path of the picker (730) around the rotation axis (711).
The method according to claim 13,

The device handler,

The semiconductor device 10 is picked up from the wafer ring 20 at the withdrawal position P1, and the semiconductor device 10 is transferred to the first transfer tool 700 at the transfer position P3. Further comprising a second transfer tool 800 to cause the flip,

The second transfer tool 800,

A rotary drive unit 810 having a horizontal axis of rotation 811; A plurality of rotation arms 820 coupled to the rotation shaft 811 and disposed along the rotation direction of the rotation shaft 811; Pickers coupled to each of the plurality of rotation arms 820 to be sequentially positioned at the lead position P1 and the transfer position P3 by rotation of the rotation shaft 811 (pickers for picking up the semiconductor element 10) 830, the device handler comprising a.