WO2018001617A1 - Ensemble carte de circuit imprimé dans laquelle des composants sont disposés entre une plaque de support et une carte de circuit imprimé, onduleur et système d'entraînement de véhicule à moteur comprenant un ensemble carte de circuit imprimé de ce type - Google Patents

Ensemble carte de circuit imprimé dans laquelle des composants sont disposés entre une plaque de support et une carte de circuit imprimé, onduleur et système d'entraînement de véhicule à moteur comprenant un ensemble carte de circuit imprimé de ce type Download PDF

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Publication number
WO2018001617A1
WO2018001617A1 PCT/EP2017/061714 EP2017061714W WO2018001617A1 WO 2018001617 A1 WO2018001617 A1 WO 2018001617A1 EP 2017061714 W EP2017061714 W EP 2017061714W WO 2018001617 A1 WO2018001617 A1 WO 2018001617A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
inverter
printed circuit
board assembly
carrier plate
Prior art date
Application number
PCT/EP2017/061714
Other languages
German (de)
English (en)
Inventor
Manuel Schwab
Alexander BIRK
Original Assignee
Zf Friedrichshafen Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zf Friedrichshafen Ag filed Critical Zf Friedrichshafen Ag
Priority to CN201780040182.7A priority Critical patent/CN109496386A/zh
Publication of WO2018001617A1 publication Critical patent/WO2018001617A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/33—Drive circuits, e.g. power electronics
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K9/00—Arrangements for cooling or ventilating
    • H02K9/22—Arrangements for cooling or ventilating by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
    • H02K9/223—Heat bridges
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10174—Diode

Definitions

  • the invention relates to a printed circuit board assembly. It also relates to an inverter with such a printed circuit board assembly and a motor vehicle drive system with such an inverter.
  • semiconductor switches such as IGBTs, together with diodes, are often arranged in a B6 bridge circuit to convert a DC voltage of a battery into a (quasi) AC voltage for operating an electric machine. If the electric motor then serves as a traction drive, it can deliver a great deal of power. Correspondingly large is the electrical power absorbed by her. This also causes high electrical currents in the electrical part of the drive system, that is, at least in the inverter and thus operated electric motor. Since then large amounts of electrical power must be switched by the semiconductors in the inverter, they are often built in a separate module and structurally separated from the rest of the signal electronics of the inverter.
  • these bonding wires represent a second wiring level. Since bonding wires are a weak point in terms of service life, there are arrangements in which the second wiring level is produced by copper plates with a suitable profile.
  • the construction and connection technology for semiconductor switches and diodes of inverters mainly consists of heat-resistant ceramic or metallic carrier substrates with a first wiring level and a different second wiring level (eg bonding wire).
  • the thus contacted semiconductor switches and diodes are ummouldet for electrical insulation or accommodated in a so-called frame module and electrically insulated with a potting compound and protected against environmental influences.
  • the first wiring level which is preferably carried out on the DBC, is characterized by a current distribution distributed mainly in the area. This has a negative effect on the parasitic inductance.
  • Power modules are also known in which a semiconductor switch and an associated diode are sintered on a relatively small ceramic carrier substrate designed as a DBC. This substrate forms the second wiring level.
  • a semiconductor switch and an associated diode are sintered on a relatively small ceramic carrier substrate designed as a DBC. This substrate forms the second wiring level.
  • EMC Electromagnetic Compatibility
  • the object of the invention is to improve the prior art.
  • the proposed printed circuit board assembly has a prefabricated carrier plate with a component side with pre-equipped electrical components, in particular special semiconductor components. It also has a printed circuit board which is soldered to the electrical components of the prefabricated carrier plate.
  • the circuit board assembly is thus easy and quick to complete by the prefabricated carrier plate, which is already equipped with the electrical components, is soldered to the electrical components to the circuit board.
  • the electrical components are thus soldered to the opposite side to the carrier plate side of the circuit board to the circuit board.
  • soldering of the components with the circuit board is carried out in particular by means of solder paste. This is applied before soldering on the circuit board in Lotpastedepots.
  • the printed circuit board arrangement is therefore distinguished by the fact that it can be manufactured in multi-layer construction, wherein each layer represents a further wiring level, which can be connected to one another with conventional plated-through holes.
  • each layer represents a further wiring level, which can be connected to one another with conventional plated-through holes.
  • the wiring levels can also be made such that the parasitic inductance can be reduced to, for example, one-tenth that of a conventional arrangement.
  • shielding layers can be set up with the additional wiring levels, with which the EMC interference emissions are significantly reduced.
  • Printed circuit boards can be produced much more flexibly than DBC or copper plates. Thus, with the proposed circuit board assembly can be responded quickly to a change in space requirements or performance requirements. Modern printed circuit board materials are resistant enough to withstand the required environmental impact. The mechanical stress of the connection points in the printed circuit board arrangement is almost symmetrical, since the expansion coefficient of the copper usually used for contacting dominates on both contacting sides.
  • This circuit board assembly can also be flexibly expanded by functional groups that can not be integrated in conventional power modules. These include current sensors (eg AMR), capacitors for producing a cascaded DC link, sensor lines at the gate, emitter and collector potentials of a semiconductor switch for better drive connection.
  • AMR current sensors
  • capacitors for producing a cascaded DC link sensor lines at the gate, emitter and collector potentials of a semiconductor switch for better drive connection.
  • solder mask such as solder mask
  • the area between the electrical components and the printed circuit board is thus solder mask free.
  • solder mask free of the electrical components with the printed circuit board.
  • a component side opposite side of the support plate is in particular free of electrical components.
  • electrical conductors can run.
  • DBC direct bonded copper
  • IMS insulated metal substrates
  • the support plate may alternatively be designed as a second circuit board. If, instead of a DBC, a printed circuit board is used as the carrier plate, an even more symmetrical mechanical loading of the electrical components arranged thereon is obtained. This increases the service life again. The material of which the carrier plate and the printed circuit board is then identical in particular.
  • a printed circuit board consists of at least one insulator layer and conductor tracks arranged thereon.
  • the insulator layer usually consists of fiber-reinforced plastic.
  • the interconnects are extracted from a layer of metal covering the insulator layer, in particular copper metal layer, for example by means of an etching process.
  • Such a printed circuit board can also be multi-layered, that is, have a plurality of interconnect layers lying in different planes (multilayer structure).
  • the electrical components are sintered onto the carrier plate, that is, fixed thereon by means of a sintering process and thus electrically contacted.
  • the electrical components are therefore preferably sintered with one side onto the component side of the carrier plate and with an opposite other side onto the conductor side.
  • soldered plate in particular by means of solder paste.
  • the electrical components are soldered in particular flat with the circuit board, in particular with a support plate opposite the respective contact surface. This contact surface comprises, in particular, the entire surface of the respective component facing the printed circuit board.
  • the prefabricated carrier plate is pre-equipped with exactly one semiconductor switch and exactly one diode as electrical components on the component side.
  • the semiconductor switch is, for example, an IGBT (insulated gate bipolar transistor) or MOSFET (metal oxide semiconductor field effect transistor) or HEMT (high electron mobility transistor) or JFET (junction field effect transistor).
  • the semiconductor switch may have the diode integrated.
  • the carrier plate is soldered directly to the circuit board in an edge region of the carrier plate by means of solder paste.
  • solder paste a direct electrical connection between the carrier plate and the circuit board is easily made.
  • a semiconductor switch is arranged as an electrical component on the carrier plate, its gate, drain and source or base, emitter, collector can thus be electrically connected to the printed circuit board, since these are often arranged on different sides of the semiconductor switch.
  • the carrier plate serves as a wiring level and the circuit board as another, second wiring level for the semiconductor switch. One side of the semiconductor switch can therefore be contacted directly with the printed circuit board and the other, opposite side of the semiconductor switch can then be contacted directly with the carrier plate.
  • the carrier plate is in turn contacted via the direct solder joint in the edge region of the circuit board.
  • the carrier plate is preferably soldered directly to the printed circuit board at at least two opposite edge regions of the carrier plate, in particular by means of solder paste.
  • the carrier plate can be soldered directly to the printed circuit board at exactly two opposite edge regions of the carrier plate, in particular by means of solder paste.
  • the electrical components ie in particular the semiconductor switch and the diode, are arranged between these direct solder joints.
  • a plurality of the prefabricated carrier plates are provided, which are each pre-equipped with exactly one semiconductor switch and exactly one diode as electrical components.
  • the semiconductor switches and diodes of the plurality of prefabricated carrier plates are soldered to the printed circuit board, in particular by means of solder paste.
  • exactly one circuit board is provided for the plurality of prefabricated support plates.
  • the electrical components are soldered in the form of semiconductor switches and diodes.
  • an inverter can be simple and modular.
  • the printed circuit board arrangement can therefore form a so-called power module.
  • a power module forms its own structural unit.
  • the power module can be provided for the support plate with the pre-equipped electrical components exactly one circuit board with which the components are soldered.
  • the power module may also comprise a plurality of the carrier plates with the components pre-equipped thereon and exactly one common circuit board with which the components are soldered.
  • the power module can also form an electrical half-bridge, in which a plurality of, in particular two of the carrier plates are soldered to a common circuit board with the components slaughter Glaten thereon.
  • One of the carrier plates with the components pre-fitted thereon then forms a high-side switch and another of the carrier plates with the components pre-fitted thereon then forms a low-side switch of the half-bridge.
  • a power module designed as a half bridge then has, in particular, a phase connection, which is arranged electrically between the high-side switch and the low-side switch, as well as two DC voltage connections, as well as connections for controlling the high
  • the proposed inverter has the proposed circuit board arrangement. Thus, this is easy and quick to complete.
  • Such an inverter can also be referred to as a DC-AC converter. It is designed to convert a direct current (DC) into a (quasi) alternating current (AC). Conversely, it can also be designed to convert an alternating current into a direct current.
  • the inverter has a plurality of half bridges. These are each formed by two series-connected semiconductor switches. In addition, a diode is connected in parallel to each of these two semiconductor switches. The semiconductor switches and diodes then form the electrical components of the proposed printed circuit board assembly.
  • the inverter can thus be designed, for example, as a B6 inverter, ie have three half-bridges. The half bridges each serve to energize exactly one phase of the inverter.
  • Particularly preferred exactly one common circuit board is provided for the plurality of carrier plates.
  • Per carrier plate is then exactly one of the semiconductor switches and exactly one of the diodes arranged as electrical components.
  • only one or a few of the support plates may be provided with a common circuit board to which the support plate (s) having the components pre-mounted thereon are / are soldered.
  • This printed circuit board with the carrier plates then forms in particular a power module.
  • the inverter is made up of several such power modules.
  • the proposed motor vehicle drive system has an electric motor as a traction drive, that is, to provide a drive torque, and it has the proposed inverter for operating the electric motor.
  • the inverter supplies the electric machine with the required for the operation of the electric motor electric power, in particular a (quasi) alternating current.
  • the electric motor can therefore be in particular an induction machine, such as a synchronous machine or asynchronous machine.
  • Fig. 3 is a motor vehicle drive system.
  • Fig. 1 shows a part of a circuit board assembly with a circuit board 1 and a support plate 2.
  • the support plate 2 is prefabricated with pre-equipped electrical components 3, 4 on a common component side of the support plate 2.
  • pre-equipped electrical components 3, 4 on a common component side of the support plate 2.
  • An opposite side of the component side of the support plate 2 (in Fig. 1 above) has no electrical components.
  • the printed circuit board arrangement shown in FIG. 1 forms, in particular, a power module which has exactly one individual printed circuit board 1 per carrier plate 2.
  • a power module may also have a plurality of carrier plates 2 with exactly one common printed circuit board 1.
  • the component 4 is a semiconductor switch, in particular an IGBT, and the component 3 is a diode.
  • the carrier plate 2 is a substrate with a ceramic plate and a conductor layer arranged thereon, in particular a DBC substrate or an IMS substrate.
  • the electrical components 3, 4 are in particular the only electrical components which are arranged on the carrier sheet 2.
  • further semiconductor switches and / or diodes may be provided. If the semiconductor switch 3 is, for example, a MOSFET, the diode may also be integrated in the semiconductor switch 3.
  • the components 3, 4 are sintered onto the carrier plate 2 with one side. This is done as part of the prefabrication of the support plate 2.
  • An opposite other side of the components 3, 4 is on the circuit board 1, for example by means Solder paste 5, surface soldered. This side of the components 3, 4 thus forms in its entirety a contact surface for the printed circuit board 1.
  • the soldering can be carried out as part of a reflow process, for which purpose solder paste was previously applied to the circuit board 1 by means of a solder mask.
  • the circuit board 1 may have been coated with a solder mask 5.
  • the solder joint between the components 3, 4 and the printed circuit board 1 is provided with the reference numeral 6.
  • the support plate 2 is also soldered directly to the circuit board 1 in an edge region of the support plate 2, for example, also by means of solder paste.
  • This direct solder joint between the support plate 2 and the circuit board 1 is provided with the reference numeral 7. Through the solder joints 6, 7, the electrical components 3, 4 are completely contacted with the printed circuit board 1 electrically.
  • Fig. 1 shows only a part of the printed circuit board 1.
  • On the entire circuit board 1 can be arranged any number of such prefabricated support plates 2, for example, to form an inverter (see, for example, Fig. 2).
  • FIG. 2 shows a schematic structure of an inverter 10 constructed by means of the printed circuit board arrangement according to FIG. 1.
  • the printed circuit board arrangement has the printed circuit board 1.
  • the prefabricated carrier plates 2 here by way of example six carrier plates 2 are arranged thereon.
  • Each carrier plate 2 is comprising the semiconductor switch 3 and the diode 4 as the only electrical components.
  • the inverter On the input side, the inverter has connections for DC cables DC + and DC-.
  • the inverter On the output side, the inverter has connections for phases U, V, W.
  • the inverter 10 also has an intermediate circuit capacitor 1 not shown in detail.
  • terminals for driving the semiconductor switch 3 may be provided.
  • each carrier plate 2 can be provided exactly one individual printed circuit board 1.
  • Printed circuit board 1 and support plate 2 then preferably together form a power module. From several such power modules then the inverter 10 is constructed. It is also possible that several re, but not all of the support plates 2 are arranged together on a circuit board 1. Then preferably the printed circuit board 1 forms a power module with the plurality of carrier plates 2 and electrical components 3, 4 arranged thereon. Even then, the inverter 10 is composed of several such power modules.
  • the semiconductor switch 3 and the diode 4 are connected in a conventional manner as a B6 bridge circuit with each other. If the carrier plates 2 are each designed with a printed circuit board 1 as a power module, so then six such power modules according to the type shown in Fig. 2 (B6 bridge circuit) interconnected.
  • each half bridge consists of a high-side semiconductor switch 3 with associated diode 4 and an associated low-side semiconductor switch 3 with associated diode 4.
  • Such half-bridges can also be designed in each case as a separate power module.
  • Such a power module then has two of the support plates 2 with the respectively pre-equipped electrical components (semiconductor switch 3 and diode 4) and a single, provided only for these two support plates 2 common circuit board.
  • Fig. 3 shows a motor vehicle drive system.
  • This has an electric motor 12 as traction drive, so to provide a drive torque.
  • the electric motor 12 is mechanically coupled to vehicle wheels 13 or at least coupled.
  • the motor vehicle drive system also has an inverter 10. It is designed in accordance with FIG. 2 and serves to operate the electric motor 12, that is to say to supply electrical current, so that the electric motor 12 provides the drive torque.
  • the drive torque can be both positive or negative, ie act impulsive or slowing down.
  • the inverter 10 is powered by a DC power source 14, such as a DC generator or a traction battery, with electrical power during engine operation. In a regenerative operation, the inverter 10 may also conduct electrical energy from the electric machine 12 back to the DC power source 14.
  • a DC power source 14 such as a DC generator or a traction battery

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inverter Devices (AREA)

Abstract

La présente invention concerne un ensemble carte de circuit imprimé qui comprend une plaque de support (2) préfabriquée présentant un côté composants sur laquelle sont pré-implantés des composants électriques (3, 4), et une carte de circuit imprimé (1) soudée avec les composants (3, 4) de la plaque de support (2). La présente invention concerne par ailleurs un onduleur et un système d'entraînement de véhicule à moteur comprenant un ensemble carte de circuit imprimé de ce type.
PCT/EP2017/061714 2016-06-28 2017-05-16 Ensemble carte de circuit imprimé dans laquelle des composants sont disposés entre une plaque de support et une carte de circuit imprimé, onduleur et système d'entraînement de véhicule à moteur comprenant un ensemble carte de circuit imprimé de ce type WO2018001617A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201780040182.7A CN109496386A (zh) 2016-06-28 2017-05-16 载板与电路板之间布置有器件的电路板设施、带有该电路板设施的逆变器和机动车驱动系统

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016211652.5A DE102016211652A1 (de) 2016-06-28 2016-06-28 Leiterplattenanordnung, Wechselrichter und Kraftfahrzeugantriebsystem mit einer solchen Leiterplattenanordnung
DE102016211652.5 2016-06-28

Publications (1)

Publication Number Publication Date
WO2018001617A1 true WO2018001617A1 (fr) 2018-01-04

Family

ID=58709960

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2017/061714 WO2018001617A1 (fr) 2016-06-28 2017-05-16 Ensemble carte de circuit imprimé dans laquelle des composants sont disposés entre une plaque de support et une carte de circuit imprimé, onduleur et système d'entraînement de véhicule à moteur comprenant un ensemble carte de circuit imprimé de ce type

Country Status (3)

Country Link
CN (1) CN109496386A (fr)
DE (1) DE102016211652A1 (fr)
WO (1) WO2018001617A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3731407A1 (fr) * 2019-04-24 2020-10-28 Siemens Aktiengesellschaft Machine électrique pourvue de convertisseur

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3959676A (en) * 1974-12-23 1976-05-25 Ford Motor Company Alternator rectifier bridge and method of assembly
US20060208348A1 (en) * 2005-03-18 2006-09-21 Tohru Ohsaka Stacked semiconductor package
US20070035323A1 (en) * 2005-08-09 2007-02-15 Samsung Electronics Co., Ltd Method for fabricating electronic circuit module and integrated circuit device
EP2270855A1 (fr) * 2009-06-29 2011-01-05 ABB Research Ltd. Module électrique
US20150022978A1 (en) * 2013-07-19 2015-01-22 Motorola Mobility Llc Circuit Assembly and Corresponding Methods
DE102014203310A1 (de) * 2014-02-25 2015-08-27 Siemens Aktiengesellschaft Elektronikmodul

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3959676A (en) * 1974-12-23 1976-05-25 Ford Motor Company Alternator rectifier bridge and method of assembly
US20060208348A1 (en) * 2005-03-18 2006-09-21 Tohru Ohsaka Stacked semiconductor package
US20070035323A1 (en) * 2005-08-09 2007-02-15 Samsung Electronics Co., Ltd Method for fabricating electronic circuit module and integrated circuit device
EP2270855A1 (fr) * 2009-06-29 2011-01-05 ABB Research Ltd. Module électrique
US20150022978A1 (en) * 2013-07-19 2015-01-22 Motorola Mobility Llc Circuit Assembly and Corresponding Methods
DE102014203310A1 (de) * 2014-02-25 2015-08-27 Siemens Aktiengesellschaft Elektronikmodul

Also Published As

Publication number Publication date
CN109496386A (zh) 2019-03-19
DE102016211652A1 (de) 2017-12-28

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