WO2017222333A1 - High-current pcb assembly comprising current breaking apparatus - Google Patents

High-current pcb assembly comprising current breaking apparatus Download PDF

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Publication number
WO2017222333A1
WO2017222333A1 PCT/KR2017/006637 KR2017006637W WO2017222333A1 WO 2017222333 A1 WO2017222333 A1 WO 2017222333A1 KR 2017006637 W KR2017006637 W KR 2017006637W WO 2017222333 A1 WO2017222333 A1 WO 2017222333A1
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Prior art keywords
current
circuit board
printed circuit
shunt resistor
power semiconductor
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PCT/KR2017/006637
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French (fr)
Korean (ko)
Inventor
김춘식
김성준
박종민
김대원
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태성전장주식회사
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Publication of WO2017222333A1 publication Critical patent/WO2017222333A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/145—Indicating the presence of current or voltage
    • G01R19/15—Indicating the presence of current
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H3/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection
    • H02H3/08—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess current
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to a high current PCB assembly including a current blocking device, and more particularly, to an apparatus for blocking the flow of current when a current value measured using a shunt resistor exceeds a reference value.
  • An overcurrent blocking device is used to protect the electronics when abnormal current flows through them.
  • the most common example of this blocking device is a fuse.
  • the fuse forms a part of the line and when an overcurrent flows in the line, the fuse melts and is blown off by heat generated by the current, thereby blocking the current. Therefore, the fuse is a disposable product and once the over current flows and the current is cut off, the fuse must be replaced with a new one. That is, the fuse is not recyclable and does not have a function of warning of overcurrent in advance.
  • a mechanical relay or a power semiconductor may be used to cut off the overcurrent instead of the fuse.
  • the semiconductor relay using the semiconductor device has the advantage that the reaction speed is faster than the electromechanical relay, and the life is long because there is no place to wear because there are no mechanical parts. It also has the advantage of no operating noise during operation.
  • the present invention has been made to solve the above problems, and can provide a large current PCB assembly including a small and inexpensive current blocking device that can block the flow of large current without damaging the semiconductor device. .
  • a high current PCB assembly including a current interrupting device for achieving the above object includes a printed circuit board, a plurality of via holes, a current measuring unit, a power semiconductor, and a controller.
  • the printed circuit board has a shunt resistor inserted therein. Multiple via holes are formed from the surface of the printed circuit board to the shunt resistor.
  • the current measurement unit is electrically connected to the shunt resistor to measure the current flowing through the shunt resistor.
  • the power semiconductor is mounted on a printed circuit board.
  • the controller is electrically connected to the current measuring unit and the power semiconductor to control the power semiconductor to cut off the current according to the current measured by the current measuring unit.
  • the printed circuit board may be divided into two sections, one section is formed of a single layer, and the other section is formed of a multilayer, and the shunt resistor may be inserted into a section consisting of a single layer.
  • the shunt resistor may be made of manganese in the center and copper or copper alloy at both ends.
  • the controller may further include a function of controlling the battery management system according to the measured current.
  • control unit may include a freewheeling diode to prevent damage to the circuit by the back EMF.
  • a high current PCB assembly including a current blocking device includes a printed circuit board, a plurality of bi-holes, a hall sensor, a power semiconductor, and a controller.
  • the printed circuit board has a shunt resistor inserted therein. Multiple via holes are formed from the surface of the printed circuit board to the shunt resistor.
  • the Hall sensor is mounted on a printed circuit board to measure the current flowing through the shunt resistor.
  • the power semiconductor is mounted on a printed circuit board.
  • the controller is electrically connected to the hall sensor and the power semiconductor to control the power semiconductor to block the current according to the current measured by the hall sensor.
  • the printed circuit board is divided into two parts, one part is made of a single layer and the other part is made of a multilayer, and the shunt resistance may be inserted into a part made of a single layer.
  • it may further include a shield member coupled to the printed circuit board to shield the magnetic field in a form surrounding the hall sensor and the shunt resistor.
  • the circuit device since the heat generation is minimized even when a large current flows, the circuit device may be prevented from being damaged by the heat generation.
  • FIG. 1 is a perspective view of a large current PCB assembly including a current interruption device according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of a high current PCB assembly including the current blocking device of FIG. 1.
  • FIG. 2 is a cross-sectional view of a high current PCB assembly including the current blocking device of FIG. 1.
  • FIG. 3 is a circuit diagram of a control unit according to an embodiment of the present invention.
  • FIG. 4 is a perspective view of a large current PCB assembly including a current interruption device according to another embodiment of the present invention.
  • FIG. 5 is a perspective view of a large current PCB assembly including a current interruption device according to another embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of a high current PCB assembly including the current interruption device shown in FIG. 5.
  • FIG. 1 is a perspective view of a large current PCB assembly including a current interruption device according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view of a large current PCB assembly including the current interruption device of FIG. 1.
  • a large current PCB assembly 10 including a current blocking device may include a printed circuit board 110, a plurality of via holes 120, a current measuring unit 130, and a power semiconductor 150. ), And the control unit 140.
  • the shunt resistor 111 is inserted into the printed circuit board 110.
  • the printed circuit board 110 may be a general FR-4 (Flame Retardant) printed circuit board, or may be a printed circuit board made of Bismaleimide Triazine (BT), Ajinomoto Build up Film (ABF), or the like.
  • the printed circuit board of the present embodiment may have a rectangular plate shape like a conventional printed circuit board.
  • the printed circuit board 110 is divided into two parts (112, 113), one part 113 is made of a single layer and the other part 112 is made of a multi-layer shunt resistor 111 is a part consisting of a single layer (113) Can be inserted in
  • the portion 112 formed of a multilayer may include a ground layer, a power layer 112a, and the like.
  • the shunt resistor 111 may be inserted into the insulating layer 113a of the portion 113 formed of a single layer.
  • the shunt resistor 111 may be connected to the positive terminal of the vehicle battery at one end through the coupling holes 111a formed at both ends thereof.
  • a plurality of via holes 120 are formed from the surface of the printed circuit board to the shunt resistor 111. Since the via hole 120 is formed from the surface of the printed circuit board 110 to the shunt resistor 111, heat generated from the shunt resistor 111 is discharged to the outside.
  • the current measuring unit 130 is electrically connected to the shunt resistor 111 to measure a current flowing through the shunt resistor 111.
  • the current measuring unit 130 may calculate a current value by measuring a potential difference across the shunt resistor 111, that is, a voltage.
  • the resistance value of the shunt resistor 111 may be measured in advance and recorded and stored in the current measuring unit 130 so that the current measuring unit 130 may calculate a current value by measuring the voltage.
  • the current measuring unit 130 may include a microprocessor such as AS8510.
  • the power semiconductor 150 is mounted on the printed circuit board 110. And it is controlled by the control unit 140 to be described below serves to block the flow of current.
  • the power semiconductor 150 may be a metal oxide semiconductor field effect transistor (MOSFET), an insulated gate bipolar mode transistor (IGBT), or the like. Semiconductor relays using MOSFETs or IGBTs are suitable for switching speeds, lower power consumption, and easier miniaturization than other semiconductor relays. However, it is not necessarily limited thereto.
  • the power semiconductor 150 has an advantage that the lifespan is long because the reaction speed is faster than the electromechanical relay and there are no parts to wear out. In addition, there is an advantage that there is no operating noise during operation.
  • the controller 140 is electrically connected to the current measuring unit 130 and the power semiconductor 150 to control the power semiconductor 150 to block the current according to the current measured by the current measuring unit 130.
  • the controller 140 shown in FIG. 3 includes a regulator, a flip-flop, a MOSFET driver, a freewheeling diode, and the like.
  • the MOSFET driver applies a control signal to the power semiconductor 150 so that the power semiconductor cuts off the current.
  • the regulator and the flip-flop are designed to maintain the power semiconductor 150 even when the vehicle is keyed off.
  • the freewheeling diode prevents devices from being damaged by back electromotive force generated when the power semiconductor is cut off. It is to.
  • the shunt resistor 111 may be made of manganese in the center and copper or copper alloy at both ends. Manganese has a small change in resistance to temperature with respect to heat, and copper or a copper alloy has a low resistance, so that an accurate current value can be measured.
  • the controller 140 may further include a function of controlling a battery management system according to the measured current.
  • the controller 140 may cause the battery management system to stop charging the battery or control the state of individual cells forming the battery according to the measured current.
  • FIG 4 is a perspective view of a large current PCB assembly 20 including a current interruption device according to another embodiment of the present invention.
  • the high current PCB assembly 20 including the current blocking device illustrated in FIG. 4 also includes a printed circuit board 210, a plurality of via holes 220, a current measuring unit 230, a power semiconductor 250, and a controller 240. It includes. In the high current PCB assembly 20 including the current interruption device shown in FIG. 4, only one end of the shunt resistor 211 is exposed to the outside of the printed circuit board 220. It may be connected to the plus terminal of the vehicle battery through the fastening hole 211a formed at one end exposed to the outside.
  • FIG. 5 is a perspective view of a large current PCB assembly 30 including a current interruption device according to another embodiment of the present invention
  • FIG. 6 is a cross-sectional view of a large current PCB assembly 30 including the current interruption device shown in FIG. 5. to be.
  • the high current PCB assembly 30 including the current blocking device illustrated in FIGS. 5 to 6 includes a printed circuit board 310, a plurality of via holes 320, a hall sensor 330, a power semiconductor 350, and a controller ( 340).
  • the printed circuit board 310, the plurality of via holes 320, the power semiconductor 350, and the controller 340 are the same as the printed circuit board 310 and the plurality of via holes 320 in the above-described embodiments. Will be omitted.
  • the hall sensor 330 is mounted on the printed circuit board 310 to measure a current flowing through the shunt resistor 311.
  • the hall sensor 330 uses a Hall effect, which is a physical phenomenon in which a potential difference occurs at both ends of a conductor when a magnetic field bridges a conductor through which current flows. The generated voltage is proportional to the strength of the current and the magnetic field.
  • the current flowing through the shunt resistor 311 may be measured by analyzing the magnitude of the voltage through a circuit (not shown) connected to the hall sensor 330.
  • the high current PC assembly 30 including the current sensor configured as described above minimizes heat generation even when a large current flows to prevent damage to the circuit device due to heat generation. Can be.
  • the current value can be measured accurately.
  • the high current PC assembly 30 including the current sensor may further include a shield member 360.
  • the shield member 360 is coupled to the printed circuit board 310 to surround the hall sensor 320 and the shunt resistor 311 to shield the magnetic field. Since the shield member 360 shields the magnetic field and concentrates the magnetic flux, the signal is amplified, so that the hall sensor 320 can measure the current well.
  • the shield member 360 may be a ferromagnetic metal plate. Specifically, it is preferable to manufacture a mumetal having a high permeability with an alloy of nickel iron copper.
  • the shield member 360 may be formed in a U-shape and may be coupled to be inserted into a hole in the printed circuit board 310. As described above, when the shield member 360 is formed to have a U shape and surrounds only the hall sensor 320, shielding is more effectively performed to accurately measure a current value.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
  • Emergency Protection Circuit Devices (AREA)

Abstract

Disclosed is a high-current PCB assembly comprising a small and low-priced current breaking apparatus capable of breaking the flow of high current without damaging semiconductor elements. The high-current PCB assembly comprising a current breaking apparatus according to one embodiment of the present invention comprises: a printed circuit board; a plurality of VIA holes; a current measurement unit; a power semiconductor; and a controller. The printed circuit board is provided with a shunt resistor inserted therein. The plurality of VIA holes extends from the surface of the printed circuit board to the shunt resistor. The current measurement unit is electrically connected to the shunt resistor to measure the current flowing therein. The power semiconductor is mounted on top of the printed circuit board. The controller is electrically connected to the current measurement unit and power semiconductor to control so that the power semiconductor breaks the current in accordance with the current measured by the current measurement unit.

Description

전류 차단 장치를 포함한 대전류용 피씨비 어셈블리High Current PCB Assemblies with Current Breaker
본 발명은 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리에 관한 것으로서, 션트 저항을 이용하여 측정한 전류값이 기준치를 초과하는 경우 전류의 흐름을 차단하는 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high current PCB assembly including a current blocking device, and more particularly, to an apparatus for blocking the flow of current when a current value measured using a shunt resistor exceeds a reference value.
일반적으로, 차량에는 엔진의 점화, 기동, 충전뿐만 아니라 조명, 보안, 냉난방 목적에 의하여 다수의 전장품들이 사용되고 있다. 특히나 최근에는 차량의 고급화, 자동화로 인하여 전장품이 더욱 증가하는 추세에 있다.In general, a large number of electronic devices are used in a vehicle for lighting, security, and heating as well as ignition, starting, and charging of an engine. In particular, in recent years, due to the luxury and automation of the vehicle, the electronic equipment has been increasing.
이러한 전장품에 이상 전류가 흐를 때 해당 전장품을 보호하기 위하여 과전류 차단 장치가 사용된다. 이 차단 장치의 가장 흔한 예로 퓨즈가 있다.An overcurrent blocking device is used to protect the electronics when abnormal current flows through them. The most common example of this blocking device is a fuse.
퓨즈는 선로의 일부를 구성하면서 선로에 과전류가 흐를 경우, 전류에 의해서 발생하는 열에 의해 녹아서 끊어짐으로써 전류를 차단하는 작용을 한다. 따라서, 퓨즈는 1회용 제품이고, 일단 과전류가 흘러 전류가 차단되면 퓨즈는 새로운 것으로 교체되어야 한다. 즉, 퓨즈는 재활용이 불가능하며 또한, 과전류를 사전에 경고하는 기능은 가지지 않는다.The fuse forms a part of the line and when an overcurrent flows in the line, the fuse melts and is blown off by heat generated by the current, thereby blocking the current. Therefore, the fuse is a disposable product and once the over current flows and the current is cut off, the fuse must be replaced with a new one. That is, the fuse is not recyclable and does not have a function of warning of overcurrent in advance.
한편, 퓨즈를 대신하여 과전류를 차단하기 위하여 기계적 릴레이나 전력 반도체가 사용될 수 있다.On the other hand, a mechanical relay or a power semiconductor may be used to cut off the overcurrent instead of the fuse.
그러나 기계식 릴레이는 비록 재활용은 가능하지만, 반응속도가 느리고, 반복 사용 시 마모가 발생하며 공간을 많이 차지한다는 단점이 있다.However, mechanical relays, although recyclable, have the disadvantages of slow reaction speed, wear and repetitive use, and take up a lot of space.
반면, 반도체 소자를 사용하는 반도체 릴레이는 전기 기계식 릴레이보다 반응속도가 빠르고, 기계적 동작을 하는 부품이 없어서 마모되는 곳이 없기 때문에 수명이 길다는 장점이 있다. 또한 동작 시에 동작 소음이 없는 장점도 있다.On the other hand, the semiconductor relay using the semiconductor device has the advantage that the reaction speed is faster than the electromechanical relay, and the life is long because there is no place to wear because there are no mechanical parts. It also has the advantage of no operating noise during operation.
그러나, 반도체 소자는 열에 약하기 때문에, 선로에 대전류가 흘러 고열이 발생하는 경우, 그 열에 견디지 못하고 반도체가 손상되는 문제가 있다.However, since a semiconductor element is weak in heat, when a large current flows through a line and high heat generate | occur | produces, there exists a problem that a semiconductor is damaged without being able to endure that heat.
따라서 반도체 소자를 사용하여 대전류를 차단하기 위해서는 대전류가 흘러도 열이 반도체 소자에 전달되지 않도록 하는 것이 중요하다. 이러한 목적을 위하여 PCB의 배면에 다수의 방열판(heat sink)을 부착하여 사용하는 방법이 있으나, 이러한 방식으로도 열 발산에 한계가 있어, 일정치 이상의 대전류가 흐를 때에는 반도체 소자가 파손되는 문제가 있으며, PCB의 배면에 다수의 방열판을 부착, 사용함으로써 제조 단가가 높아지는 문제가 있다.Therefore, in order to block a large current using a semiconductor device, it is important to prevent heat from being transferred to the semiconductor device even when a large current flows. There is a method of attaching a plurality of heat sinks to the back of the PCB for this purpose, but there is a limit to heat dissipation in this way, there is a problem that the semiconductor device is damaged when a large current of more than a certain value flows. There is a problem that the manufacturing cost increases by attaching and using a plurality of heat sinks on the back of the PCB.
본 발명은 상기한 문제점을 해결하기 위하여 창안된 것으로서, 반도체 소자가 손상되는 일 없이 대전류의 흐름을 차단할 수 있으며, 부피가 작고 가격이 저렴한 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리를 제공하는 데에 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and can provide a large current PCB assembly including a small and inexpensive current blocking device that can block the flow of large current without damaging the semiconductor device. .
전술한 과제를 달성하기 위한 본 발명의 일 양상에 따른 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리는 인쇄회로기판, 다수의 비아홀, 전류 측정부, 전력용 반도체 및 제어부를 포함한다. 인쇄회로기판은 션트 저항이 내부에 삽입된다. 다수의 비아홀은 인쇄회로기판의 표면에서부터 션트 저항까지 형성된다. 전류 측정부는 션트 저항에 전기적으로 연결되어 션트 저항에 흐르는 전류를 측정한다. 전력용 반도체는 인쇄회로기판 위에 실장된다. 제어부는 전류 측정부 및 전력용 반도체와 전기적으로 연결되어 전류 측정부에서 측정된 전류에 따라 전력용 반도체가 전류를 차단하도록 제어한다.A high current PCB assembly including a current interrupting device according to an aspect of the present invention for achieving the above object includes a printed circuit board, a plurality of via holes, a current measuring unit, a power semiconductor, and a controller. The printed circuit board has a shunt resistor inserted therein. Multiple via holes are formed from the surface of the printed circuit board to the shunt resistor. The current measurement unit is electrically connected to the shunt resistor to measure the current flowing through the shunt resistor. The power semiconductor is mounted on a printed circuit board. The controller is electrically connected to the current measuring unit and the power semiconductor to control the power semiconductor to cut off the current according to the current measured by the current measuring unit.
본 발명의 다른 양상에 따르면, 인쇄회로기판은 두 구역으로 나뉘며 한 구역은 단층으로 이루어지고 다른 구역은 다층으로 이루어져 션트 저항은 단층으로 이루어진 구역에 삽입되는 것일 수 있다.According to another aspect of the present invention, the printed circuit board may be divided into two sections, one section is formed of a single layer, and the other section is formed of a multilayer, and the shunt resistor may be inserted into a section consisting of a single layer.
본 발명의 또 다른 양상에 따르면, 션트 저항은 중앙의 망간과 양단의 구리 또는 구리합금으로 이루어진 것일 수 있다.According to another aspect of the invention, the shunt resistor may be made of manganese in the center and copper or copper alloy at both ends.
본 발명의 또 다른 양상에 따르면, 제어부는 측정된 전류에 따라 배터리 관리 시스템(battery management system)을 제어하는 기능을 더 구비한 것일 수 있다.According to another aspect of the present invention, the controller may further include a function of controlling the battery management system according to the measured current.
본 발명의 또 다른 양상에 따르면, 제어부는 역기전력에 의한 회로의 손상을 방지하는 프리휠링 다이오드를 포함하는 것일 수 있다.According to another aspect of the invention, the control unit may include a freewheeling diode to prevent damage to the circuit by the back EMF.
본 발명의 또 다른 양상에 따르면, 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리는 인쇄회로기판, 다수의 바이홀, 홀 센서, 전력용 반도체, 제어부를 포함한다. 인쇄회로기판은 션트 저항이 내부에 삽입되어 있다. 다수의 비아홀은 인쇄회로기판의 표면에서부터 션트 저항까지 형성된다. 홀 센서는 인쇄회로기판 위에 실장되어 션트 저항에 흐르는 전류를 측정한다. 전력용 반도체는 인쇄회로기판 위에 실장된다. 제어부는 홀 센서 및 전력용 반도체와 전기적으로 연결되어 홀 센서에서 측정된 전류에 따라 전력용 반도체가 전류를 차단하도록 제어한다.According to another aspect of the present invention, a high current PCB assembly including a current blocking device includes a printed circuit board, a plurality of bi-holes, a hall sensor, a power semiconductor, and a controller. The printed circuit board has a shunt resistor inserted therein. Multiple via holes are formed from the surface of the printed circuit board to the shunt resistor. The Hall sensor is mounted on a printed circuit board to measure the current flowing through the shunt resistor. The power semiconductor is mounted on a printed circuit board. The controller is electrically connected to the hall sensor and the power semiconductor to control the power semiconductor to block the current according to the current measured by the hall sensor.
본 발명의 또 다른 양상에 따르면, 인쇄회로기판은 두 부위로 나뉘며 일 부위는 단층으로 이루어지고 다른 부위는 다층으로 이루어져 션트 저항은 단층으로 이루어진 부위에 삽입되는 것일 수 있다.According to another aspect of the present invention, the printed circuit board is divided into two parts, one part is made of a single layer and the other part is made of a multilayer, and the shunt resistance may be inserted into a part made of a single layer.
본 발명의 또 다른 양상에 따르면, 홀 센서 및 션트 저항을 감싸는 형태로 인쇄회로기판에 결합되어 자계를 차폐시켜주는 실드부재를 더 포함할 수 있다.According to another aspect of the present invention, it may further include a shield member coupled to the printed circuit board to shield the magnetic field in a form surrounding the hall sensor and the shunt resistor.
본 발명에 따르면, 본 발명에 따르면 대전류가 흐르더라도 발열이 최소화되므로 발열로 인해 회로소자가 손상되는 것을 막을 수 있다.According to the present invention, since the heat generation is minimized even when a large current flows, the circuit device may be prevented from being damaged by the heat generation.
도 1은 본 발명의 일 실시예에 따른 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리의 사시도이다.1 is a perspective view of a large current PCB assembly including a current interruption device according to an embodiment of the present invention.
도 2는 도 1의 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리의 단면도이다.FIG. 2 is a cross-sectional view of a high current PCB assembly including the current blocking device of FIG. 1. FIG.
도 3은 본 발명의 일 실시예에 따른 제어부의 회로도이다.3 is a circuit diagram of a control unit according to an embodiment of the present invention.
도 4는 본 발명의 또 다른 실시예에 따른 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리의 사시도이다.4 is a perspective view of a large current PCB assembly including a current interruption device according to another embodiment of the present invention.
도 5는 본 발명의 또 다른 실시예에 따른 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리의 사시도이다.5 is a perspective view of a large current PCB assembly including a current interruption device according to another embodiment of the present invention.
도 6은 도 5에 도시된 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리의 단면도이다.6 is a cross-sectional view of a high current PCB assembly including the current interruption device shown in FIG. 5.
전술한, 그리고 추가적인 양상들은 후술하는 실시 예들을 통해 명확해질 것이다. 본 명세서에서 각 도면의 대응되는 구성 요소들은 동일한 번호로 참조된다. 또한, 구성요소들의 형상이나 크기 등은 실제보다 과장될 수 있다. 그리고 관련된 공지 기술에 대한 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 생각되는 경우 그 공지 기술에 대한 설명은 생략한다.The foregoing and further aspects will become apparent from the embodiments described below. Corresponding elements in each figure are referred to by the same numerals in this specification. In addition, the shape or size of the components may be exaggerated than actual. And if the description of the related art is considered to unnecessarily obscure the subject matter of the present invention, the description of the known art is omitted.
이하, 본 발명의 다양한 실시 예들을 통해 본 발명을 상세히 설명하기로 한다.Hereinafter, the present invention will be described in detail through various embodiments of the present invention.
도 1은 본 발명의 일 실시예에 따른 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리의 사시도이고, 도 2는 도 1의 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리의 단면도이다.1 is a perspective view of a large current PCB assembly including a current interruption device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a large current PCB assembly including the current interruption device of FIG. 1.
도 1 내지 도 2를 참조하여 설명하면, 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리(10)는 인쇄회로기판(110), 다수의 비아홀(120), 전류 측정부(130), 전력용 반도체(150), 제어부(140)를 포함한다.1 to 2, a large current PCB assembly 10 including a current blocking device may include a printed circuit board 110, a plurality of via holes 120, a current measuring unit 130, and a power semiconductor 150. ), And the control unit 140.
인쇄회로기판(110)의 내부에는 션트 저항(111)이 삽입된다. 인쇄회로기판(110)은 일반적인 FR-4(Flame Retardant) 인쇄회로기판일 수도 있고, BT(Bismaleimide Triazine), ABF(Ajinomoto Build up Film) 등으로 만들어진 인쇄회로기판일 수도 있다. 본 실시예의 인쇄회로기판은 통상적인 인쇄회로기판과 마찬가지로 직사각형의 판 모양일 수 있다.The shunt resistor 111 is inserted into the printed circuit board 110. The printed circuit board 110 may be a general FR-4 (Flame Retardant) printed circuit board, or may be a printed circuit board made of Bismaleimide Triazine (BT), Ajinomoto Build up Film (ABF), or the like. The printed circuit board of the present embodiment may have a rectangular plate shape like a conventional printed circuit board.
한편, 인쇄회로기판(110)은 두 부위(112, 113)로 나뉘며 일 부위(113)는 단층으로 이루어지고 다른 부위(112)은 다층으로 이루어져 션트 저항(111)은 단층으로 이루어진 부위(113)에 삽입될 수 있다. 다층으로 이루어진 부위(112)는 그라운드층, 파워층(112a) 등을 포함할 수 있다. 션트 저항(111)은 단층으로 이루어진 부위(113)의 절연층(113a)에 삽입될 수 있다. 그리고 션트 저항(111)은 양단에 형성된 체결홀(111a)을 통해 일단은 차량 배터리의 플러스 단자에 연결될 수 있다.On the other hand, the printed circuit board 110 is divided into two parts (112, 113), one part 113 is made of a single layer and the other part 112 is made of a multi-layer shunt resistor 111 is a part consisting of a single layer (113) Can be inserted in The portion 112 formed of a multilayer may include a ground layer, a power layer 112a, and the like. The shunt resistor 111 may be inserted into the insulating layer 113a of the portion 113 formed of a single layer. The shunt resistor 111 may be connected to the positive terminal of the vehicle battery at one end through the coupling holes 111a formed at both ends thereof.
다수의 비아홀(Via hole, 120)은 인쇄회로기판의 표면에서부터 션트 저항(111)까지 형성된다. 비아홀(120)이 인쇄회로기판(110)의 표면에서부터 션트 저항(111)까지 형성됨으로써 션트 저항(111)에서 발생되는 열이 외부로 방출된다.A plurality of via holes 120 are formed from the surface of the printed circuit board to the shunt resistor 111. Since the via hole 120 is formed from the surface of the printed circuit board 110 to the shunt resistor 111, heat generated from the shunt resistor 111 is discharged to the outside.
전류 측정부(130)는 션트 저항(111)에 전기적으로 연결되어 션트 저항(111)에 흐르는 전류를 측정한다. 전류 측정부(130)는 션트 저항(111) 양단의 전위차, 즉 전압을 측정하여 전류값을 산출할 수 있다. 전류 측정부(130)가 전압을 측정하여 전류값을 산출할 수 있도록 션트 저항(111)의 저항값은 사전에 측정되어 전류 측정부(130)에 기록, 저장될 수 있다. 그리고 전류 측정부(130)는 AS8510 등의 마이크로프로세서를 포함할 수 있다.The current measuring unit 130 is electrically connected to the shunt resistor 111 to measure a current flowing through the shunt resistor 111. The current measuring unit 130 may calculate a current value by measuring a potential difference across the shunt resistor 111, that is, a voltage. The resistance value of the shunt resistor 111 may be measured in advance and recorded and stored in the current measuring unit 130 so that the current measuring unit 130 may calculate a current value by measuring the voltage. In addition, the current measuring unit 130 may include a microprocessor such as AS8510.
전력용 반도체(150)는 인쇄회로기판(110) 위에 실장된다. 그리고 아래에서 설명할 제어부(140)에 의해 제어되어 전류의 흐름을 차단하는 역할을 수행한다. 전력용 반도체(150)는 금속 산화막 반도체 전계효과 트랜지스터(Metal Oxide Semiconductor Field Effect Transistor, MOSFET), 절연 게이트 양극성 트랜지스터(Insulated Gate Bipolar Mode Transistor, IGBT) 등이 사용될 수 있다. MOSFET이나 IGBT를 사용한 반도체 릴레이는 다른 반도체 릴레이보다 스위칭 속도가 빠르고 소비전력이 적으며, 미세화가 용이하여 적합하다. 그러나 반드시 이에 한정되는 것은 아니다.The power semiconductor 150 is mounted on the printed circuit board 110. And it is controlled by the control unit 140 to be described below serves to block the flow of current. The power semiconductor 150 may be a metal oxide semiconductor field effect transistor (MOSFET), an insulated gate bipolar mode transistor (IGBT), or the like. Semiconductor relays using MOSFETs or IGBTs are suitable for switching speeds, lower power consumption, and easier miniaturization than other semiconductor relays. However, it is not necessarily limited thereto.
전력용 반도체(150)는 전기 기계식 릴레이보다 반응속도가 빠르고 부품이 없어서 마모되는 곳이 없기 때문에 수명이 길다는 장점이 있다. 또한 동작 시에 동작 소음이 없는 장점이 있다.The power semiconductor 150 has an advantage that the lifespan is long because the reaction speed is faster than the electromechanical relay and there are no parts to wear out. In addition, there is an advantage that there is no operating noise during operation.
제어부(140)는 전류 측정부(130) 및 전력용 반도체(150)와 전기적으로 연결되어 전류 측정부(130)에서 측정된 전류에 따라 전력용 반도체(150)가 전류를 차단하도록 제어한다.The controller 140 is electrically connected to the current measuring unit 130 and the power semiconductor 150 to control the power semiconductor 150 to block the current according to the current measured by the current measuring unit 130.
도 3에는 본 발명의 일 실시예에 따른 제어부(140)가 도시되어 있다. 도 3에 도시된 제어부(140)는 레귤레이터(regulator)와 플리플롭(flip-flop), 모스펫 드라이버, 프리휠링 다이오드 등을 구비하고 있다.3 shows a controller 140 according to an embodiment of the present invention. The controller 140 shown in FIG. 3 includes a regulator, a flip-flop, a MOSFET driver, a freewheeling diode, and the like.
모스펫 드라이버는 전력용 반도체(150)에 제어 신호를 인가하여, 전력용 반도체가 전류를 차단하도록 한다. 레귤레이터 및 플리플롭은 차량의 key-off 시에도 전력용 반도체(150)가 제 기능을 유지하도록 하기 위한 것이며, 프리휠링 다이오드는 전력반도체가 전원을 차단할 때 발생하는 역기전력에 의해 소자들이 파손되는 것을 방지하기 위한 것이다.The MOSFET driver applies a control signal to the power semiconductor 150 so that the power semiconductor cuts off the current. The regulator and the flip-flop are designed to maintain the power semiconductor 150 even when the vehicle is keyed off. The freewheeling diode prevents devices from being damaged by back electromotive force generated when the power semiconductor is cut off. It is to.
전술한 바와 같이 이루어진 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리(10)를 이용하면 대전류가 흘러도 과도한 열이 발생하지 않고 인쇄회로기판 외부로 노출된 션트 저항의 일부분과 비아홀을 통하여 열이 외부로 배출되므로 발열로 인해 회로소자들이 손상되는 것을 막을 수 있다. 따라서 열을 외부로 방출하기 위하여 방열판 등을 사용할 필요가 없으므로 장치의 크기를 줄일 수 있을 뿐만 아니라, 제조 단가를 낮출 수 있는 장점이 있다. 또한, 전류 센서와 전류 차단 장치가 일체화되므로 공간 활용도가 증가하고 비용이 절감된다.When the high current PCB assembly 10 including the current blocking device made as described above is used, heat is discharged to the outside through a part of the shunt resistor and the via hole exposed to the outside of the printed circuit board without excessive heat even when a large current flows. Heat generation can prevent damage to circuit elements. Therefore, it is not necessary to use a heat sink to release heat to the outside, it is possible to reduce the size of the device, as well as to reduce the manufacturing cost. In addition, integrated current sensors and current interrupters increase space utilization and reduce costs.
한편, 션트 저항(111)은 중앙의 망간과 양단의 구리 또는 구리합금으로 이루어질 수 있다. 망간은 열에 대한 온도에 따른 저항의 변화가 작고, 구리 또는 구리합금은 낮은 저항을 가지므로 정확한 전류값을 측정할 수 있다.On the other hand, the shunt resistor 111 may be made of manganese in the center and copper or copper alloy at both ends. Manganese has a small change in resistance to temperature with respect to heat, and copper or a copper alloy has a low resistance, so that an accurate current value can be measured.
또한, 도시되지는 않았지만 제어부(140)는 측정된 전류에 따라 배터리 관리 시스템(battery management system)을 제어하는 기능을 더 구비할 수 있다. 그리하여 제어부(140)는 측정된 전류에 따라 배터리 관리 시스템으로 하여금 배터리를 충전하는 것을 중단하게 하거나 배터리를 이루는 개별 셀의 상태를 제어하도록 할 수 있다.In addition, although not shown, the controller 140 may further include a function of controlling a battery management system according to the measured current. Thus, the controller 140 may cause the battery management system to stop charging the battery or control the state of individual cells forming the battery according to the measured current.
도 4는 본 발명의 다른 실시예에 따른 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리(20)의 사시도이다.4 is a perspective view of a large current PCB assembly 20 including a current interruption device according to another embodiment of the present invention.
도 4에 도시된 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리(20)도 인쇄회로기판(210), 다수의 비아홀(220), 전류 측정부(230), 전력용 반도체(250), 제어부(240)를 포함하고 있다. 도 4에 도시된 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리(20)에서는 션트 저항(211)의 일단만이 인쇄회로기판(220) 외부로 노출되어 있다. 외부로 노출된 일단에 형성된 체결홀(211a)을 통해 차량 배터리의 플러스 단자 등에 연결될 수 있다.The high current PCB assembly 20 including the current blocking device illustrated in FIG. 4 also includes a printed circuit board 210, a plurality of via holes 220, a current measuring unit 230, a power semiconductor 250, and a controller 240. It includes. In the high current PCB assembly 20 including the current interruption device shown in FIG. 4, only one end of the shunt resistor 211 is exposed to the outside of the printed circuit board 220. It may be connected to the plus terminal of the vehicle battery through the fastening hole 211a formed at one end exposed to the outside.
도 5는 본 발명의 또 다른 실시예에 따른 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리(30)의 사시도이고, 도 6은 도 5에 도시된 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리(30)의 단면도이다.5 is a perspective view of a large current PCB assembly 30 including a current interruption device according to another embodiment of the present invention, and FIG. 6 is a cross-sectional view of a large current PCB assembly 30 including the current interruption device shown in FIG. 5. to be.
도 5 내지 도 6에 도시된 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리(30)는 인쇄회로기판(310), 다수의 비아홀(320), 홀 센서(330), 전력용 반도체(350), 제어부(340)를 포함하고 있다.The high current PCB assembly 30 including the current blocking device illustrated in FIGS. 5 to 6 includes a printed circuit board 310, a plurality of via holes 320, a hall sensor 330, a power semiconductor 350, and a controller ( 340).
인쇄회로기판(310), 다수의 비아홀(320), 전력용 반도체(350), 제어부(340)는 앞서 설명한 실시예에서의 인쇄회로기판(310) 및 다수의 비아홀(320)과 동일하므로 자세한 설명을 생략하기로 한다.The printed circuit board 310, the plurality of via holes 320, the power semiconductor 350, and the controller 340 are the same as the printed circuit board 310 and the plurality of via holes 320 in the above-described embodiments. Will be omitted.
홀 센서(330)는 인쇄회로기판(310) 위에 실장되어 션트 저항(311)에 흐르는 전류를 측정한다. 홀 센서(330)는 자기장이 전류가 흐르는 도체를 쇄교할 때 그 도체의 양단에 전위차가 생기는 물리 현상인 홀 효과(Hall effect)를 이용하는 것이다. 이때 발생된 전압은 전류와 자장의 세기에 비례한다. 그리고, 홀 센서(330)와 연결된 회로(미도시)를 통해서 상기 전압의 크기가 분석됨으로써 션트 저항(311)에 흐르는 전류가 측정될 수 있다.The hall sensor 330 is mounted on the printed circuit board 310 to measure a current flowing through the shunt resistor 311. The hall sensor 330 uses a Hall effect, which is a physical phenomenon in which a potential difference occurs at both ends of a conductor when a magnetic field bridges a conductor through which current flows. The generated voltage is proportional to the strength of the current and the magnetic field. In addition, the current flowing through the shunt resistor 311 may be measured by analyzing the magnitude of the voltage through a circuit (not shown) connected to the hall sensor 330.
상기와 같이 구성된 전류 센서를 포함한 대전류용 피씨비 어셈블리(30)는 인쇄회로기판 내부에 삽입된 션트 저항을 통해 전류가 흐르므로, 대전류가 흐르더라도 발열이 최소화되어 발열로 인해 회로소자가 손상되는 것을 막을 수 있다. 또한, 션트 저항과 홀 센서를 이용하여 전류값을 이중으로 측정, 산출함으로써 정확한 전류값을 측정할 수 있다.Since the current flows through the shunt resistor inserted into the printed circuit board, the high current PC assembly 30 including the current sensor configured as described above minimizes heat generation even when a large current flows to prevent damage to the circuit device due to heat generation. Can be. In addition, by measuring and calculating the current value by using a shunt resistor and a hall sensor, the current value can be measured accurately.
한편, 전류 센서를 포함한 대전류용 피씨비 어셈블리(30)는 실드부재(360)를 더 포함할 수 있다. 실드부재(360)는 홀 센서(320) 및 션트 저항(311)을 감싸는 형태로 인쇄회로기판(310)에 결합되어 자계를 차폐시켜준다. 실드부재(360)가 자계를 차폐하고 자속을 집중시켜 신호가 증폭되므로, 홀 센서(320)가 전류를 잘 측정할 수 있게 된다. 실드부재(360)는 강자성의 금속판일 수 있다. 구체적으로는 니켈ㅇ철ㅇ구리의 합금으로 투자율이 높은 뮤메탈(Mumetal)로 제작하는 것이 바람직하다. 구체적으로, 실드부재(360)는 도시된 바와 같이, U자형상으로 이루어져 인쇄회로기판(310)에 난 구멍에 끼워지는 형태로 결합될 수 있다. 이와 같이 실드부재(360)가 U자 형상으로 이루어지고 홀 센서(320)만을 감싸도록 형성되는 경우 차폐가 더욱 효과적으로 이루어져 전류값을 정확하게 측정할 수 있게 된다.Meanwhile, the high current PC assembly 30 including the current sensor may further include a shield member 360. The shield member 360 is coupled to the printed circuit board 310 to surround the hall sensor 320 and the shunt resistor 311 to shield the magnetic field. Since the shield member 360 shields the magnetic field and concentrates the magnetic flux, the signal is amplified, so that the hall sensor 320 can measure the current well. The shield member 360 may be a ferromagnetic metal plate. Specifically, it is preferable to manufacture a mumetal having a high permeability with an alloy of nickel iron copper. Specifically, as shown, the shield member 360 may be formed in a U-shape and may be coupled to be inserted into a hole in the printed circuit board 310. As described above, when the shield member 360 is formed to have a U shape and surrounds only the hall sensor 320, shielding is more effectively performed to accurately measure a current value.
본 발명은 첨부된 도면에 도시된 실시예들을 참고로 설명되었으나 이는 예시적인 것에 불과하며, 당해 기술분야에서 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 수 있을 것이다. 따라서, 본 발명의 진정한 보호 범위는 첨부된 청구 범위에 의해서만 정해져야 할 것이다.Although the present invention has been described with reference to the embodiments illustrated in the accompanying drawings, this is merely exemplary, and a person of ordinary skill in the art may understand that various modifications and equivalent other embodiments are possible. There will be. Accordingly, the true scope of protection of the invention should be defined only by the appended claims.

Claims (7)

  1. 션트 저항이 내부에 삽입된 인쇄회로기판;A printed circuit board having a shunt resistor inserted therein;
    상기 인쇄회로기판의 표면에서부터 상기 션트 저항까지 형성된 다수의 비아홀; 및A plurality of via holes formed from the surface of the printed circuit board to the shunt resistor; And
    상기 션트 저항에 전기적으로 연결되어 상기 션트 저항에 흐르는 전류를 측정하는 전류 측정부;A current measuring unit electrically connected to the shunt resistor and measuring a current flowing through the shunt resistor;
    상기 인쇄회로기판 위에 실장된 전력용 반도체; 및A power semiconductor mounted on the printed circuit board; And
    상기 전류 측정부 및 상기 전력용 반도체와 전기적으로 연결되어 상기 전류 측정부에서 측정된 전류에 따라 상기 전력용 반도체가 전류를 차단하도록 제어하는 제어부;A control unit electrically connected to the current measuring unit and the power semiconductor to control the power semiconductor to block the current according to the current measured by the current measuring unit;
    를 포함하는 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리.Large current PC assembly including a current interrupting device comprising a.
  2. 제1항에 있어서,The method of claim 1,
    상기 인쇄회로기판은 두 구역으로 나뉘며 한 구역은 단층으로 이루어지고 다른 구역은 다층으로 이루어져 상기 션트 저항은 단층으로 이루어진 구역에 삽입되는 것을 특징으로 하는 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리.The printed circuit board is divided into two sections, one section consists of a single layer and the other section consists of multiple layers, wherein the shunt resistor is inserted into a section consisting of a single layer.
  3. 제1항에 있어서,The method of claim 1,
    상기 제어부는 측정된 전류에 따라 배터리 관리 시스템(battery management system)을 제어하는 기능을 더 구비한 것을 특징으로 하는 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리.The controller of claim 1, wherein the control unit further comprises a function for controlling a battery management system (battery management system) according to the measured current.
  4. 제1항에 있어서,The method of claim 1,
    상기 제어부는 역기전력에 의한 회로의 손상을 방지하는 프리휠링 다이오드를 포함하는 것을 특징으로 하는 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리.The control unit is a high current PC assembly including a current blocking device, characterized in that it comprises a freewheeling diode to prevent damage to the circuit by the back electromotive force.
  5. 션트 저항이 내부에 삽입되어 있는 인쇄회로기판;A printed circuit board having a shunt resistor inserted therein;
    상기 인쇄회로기판의 표면에서부터 상기 션트 저항까지 형성된 다수의 비아홀; 및A plurality of via holes formed from the surface of the printed circuit board to the shunt resistor; And
    상기 인쇄회로기판 위에 실장되어 상기 션트 저항에 흐르는 전류를 측정하는 홀 센서;A hall sensor mounted on the printed circuit board to measure a current flowing through the shunt resistor;
    상기 인쇄회로기판 위에 실장된 전력용 반도체; 및A power semiconductor mounted on the printed circuit board; And
    상기 홀 센서 및 상기 전력용 반도체와 전기적으로 연결되어 상기 홀 센서에서 측정된 전류에 따라 상기 전력용 반도체가 전류를 차단하도록 제어하는 제어부;A control unit electrically connected to the hall sensor and the power semiconductor to control the power semiconductor to block the current according to the current measured by the hall sensor;
    를 포함하는 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리.Large current PC assembly including a current interrupting device comprising a.
  6. 제5항에 있어서,The method of claim 5,
    상기 인쇄회로기판은 두 부위로 나뉘며 일 부위는 단층으로 이루어지고 다른 부위는 다층으로 이루어져 상기 션트 저항은 단층으로 이루어진 부위에 삽입되는 것을 특징으로 하는 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리.The printed circuit board is divided into two parts, one part is made of a single layer and the other part is made of a multilayer, the shunt resistor is a high current PC assembly including a current blocking device, characterized in that inserted into the part consisting of a single layer.
  7. 제6항에 있어서,The method of claim 6,
    상기 홀 센서 및 션트 저항을 감싸는 형태로 상기 인쇄회로기판에 결합되어 자계를 차폐시켜주는 실드부재를 더 포함하는 것을 특징으로 하는 전류 차단 장치를 포함한 대전류용 피씨비 어셈블리.And a shielding member coupled to the printed circuit board to shield the magnetic field in a form of surrounding the hall sensor and the shunt resistor.
PCT/KR2017/006637 2016-06-24 2017-06-23 High-current pcb assembly comprising current breaking apparatus WO2017222333A1 (en)

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