WO2017222165A1

WO2017222165A1 - High-current pcb assembly comprising current sensor

Info

Publication number: WO2017222165A1
Application number: PCT/KR2017/004759
Authority: WO
Inventors: 김춘식; 김성준; 박종민; 김대원
Original assignee: 태성전장주식회사
Priority date: 2016-06-24
Filing date: 2017-05-08
Publication date: 2017-12-28
Also published as: KR101687384B1

Abstract

Disclosed is a high-current PCB assembly comprising a current sensor capable of minimizing heat generated from the high current flow and measuring the value of the corresponding high current. The high-current PCB assembly comprising a current sensor according to one embodiment of the present invention comprises: a printed circuit board; a plurality of VIA holes; and a current measurement unit. The printed circuit board is provided with a shunt resistor inserted therein. The plurality of VIA holes extends from the surface of the printed circuit board to the shunt resistor. The current measurement unit is electrically connected to the shunt resistor to measure the current flowing therein.

Description

High Current PCB Assemblies with Current Sensors

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a large current PCB assembly including a current sensor, and to a large current PCB assembly including a current sensor for measuring a value of the large current while allowing a large current to pass through.

Recently, due to environmental problems, electric vehicles, hybrid vehicles (HV), etc. are in the spotlight. Hybrid cars have significantly reduced harmful gas emissions and fuel economy compared to conventional vehicles, such as the installation of internal combustion engines and battery engines of electric vehicles at the same time. Electric vehicles are the next-generation environmental vehicles that do not emit harmful gases because they do not have internal combustion engines. Say.

Such electric vehicles or hybrid vehicles require a large current to drive a motor. Therefore, a large current flows to the printed circuit board. However, when a large current flows through the printed circuit board, a lot of heat is generated, which may cause a problem that the circuit elements mounted on the printed circuit board are damaged by heat.

Meanwhile, electric vehicles use lithium batteries as their main power source. Lithium batteries can explode if overcharged or unbalanced. As such, lithium batteries are an important part that is directly connected to driver safety. The lithium battery is managed by the current value detected by the current sensor installed at the output end of the battery, so it is necessary to accurately detect the current value for safety.

It is an object of the present invention to provide a large current PCB assembly including a current sensor capable of minimizing heat generation due to the flow of large current and measuring the value of the large current.

A high current PCB assembly including a current sensor according to an aspect of the present invention for achieving the above object includes a printed circuit board, a plurality of via holes, and a current measuring unit. The printed circuit board has a shunt resistor inserted therein. Multiple via holes are formed from the surface of the printed circuit board to the shunt resistor. The current measurement unit is electrically connected to the shunt resistor to measure the current flowing through the shunt resistor.

According to another aspect of the present invention, the printed circuit board is divided into two parts, one part is made of a single layer and the other part is made of a multilayer, and the shunt resistance may be inserted into a part made of a single layer.

According to another aspect of the invention, the shunt resistor may be made of manganese in the center and copper or copper alloy at both ends.

According to another aspect of the present invention, a high current PCB assembly including a current sensor includes a printed circuit board, a plurality of via holes, and a hall sensor. The printed circuit board has a shunt resistor inserted therein. Multiple via holes are formed from the surface of the printed circuit board to the shunt resistor. The Hall sensor is mounted on a printed circuit board to measure the current flowing through the shunt resistor.

According to another aspect of the present invention, it may further include a shield member coupled in a form surrounding the hall sensor and the shunt resistor to shield the magnetic field.

According to the present invention, even when a large current flows, heat generation is minimized, thereby preventing damage to the circuit device due to heat generation.

In addition, according to the present invention can measure the value of a large current without a separate current sensor, so that the space utilization is increased and the cost is reduced.

1 is a perspective view of a large current PCB assembly including a current sensor according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a high current PC assembly including the current sensor shown in FIG. 1.

3 is a perspective view of a large current PCB assembly including a current sensor according to another embodiment of the present invention.

4 is a perspective view of a large current PCB assembly including a current sensor according to another embodiment of the present invention.

5 is a cross-sectional view of a high current PCB assembly including the current sensor shown in FIG. 4.

The foregoing and further aspects will become apparent from the embodiments described below. Corresponding elements in each figure are referred to by the same numerals in this specification. In addition, the shape or size of the components may be exaggerated than actual. And if the description of the related art is considered to unnecessarily obscure the subject matter of the present invention, the description of the known art is omitted.

Hereinafter, the present invention will be described in detail through various embodiments of the present invention.

1 is a perspective view of a high current PC assembly 10 including a current sensor according to an embodiment of the present invention, Figure 2 is a cross-sectional view of a high current PC assembly 10 including the current sensor of FIG.

1 to 2, the high current PCB assembly 10 including the current sensor includes a printed circuit board 110, a plurality of via holes 120, and a current measuring unit 130.

The shunt resistor 111 is inserted into the printed circuit board 110. The printed circuit board 110 may be a general FR-4 (Flame Retardant) printed circuit board, or may be a printed circuit board made of Bismaleimide Triazine (BT), Ajinomoto Build up Film (ABF), or the like. The printed circuit board of the present embodiment may have a rectangular plate shape like a conventional printed circuit board.

On the other hand, the printed circuit board 110 is divided into two parts (112, 113), one part 113 is made of a single layer and the other part 112 is made of a multi-layer shunt resistor 111 is a part consisting of a single layer (113) Can be inserted in The portion 112 formed of a multilayer may include a ground layer, a power layer 112a, and the like. The shunt resistor 111 may be inserted into the insulating layer 113a of the portion 113 formed of a single layer. The shunt resistor 111 may be connected to the positive terminal of the vehicle battery at one end through the coupling holes 111a formed at both ends thereof.

A plurality of via holes 120 are formed from the surface of the printed circuit board to the shunt resistor 111. Since the via hole 120 is formed from the surface of the printed circuit board 110 to the shunt resistor 111, heat generated from the shunt resistor 111 is discharged to the outside.

The current measuring unit 130 is electrically connected to the shunt resistor 111 to measure a current flowing through the shunt resistor 111. The current measuring unit 130 may calculate a current value by measuring a potential difference across the shunt resistor 111, that is, a voltage. The resistance value of the shunt resistor 111 may be measured in advance and recorded and stored in the current measuring unit 130 so that the current measuring unit 130 may calculate a current value by measuring the voltage. In addition, the current measuring unit 130 may include a microprocessor such as AS8510.

When the high current PCB assembly 10 including the current sensor made as described above does not generate excessive heat even when a large current flows, heat is discharged to the outside through a part of the shunt resistor and the via hole exposed to the outside of the printed circuit board. This can prevent damage to the circuit elements. Therefore, it is not necessary to use a heat sink to release heat to the outside, it is possible to reduce the size of the device, as well as to reduce the manufacturing cost. In addition, large current values can be measured without a separate current sensor, increasing space utilization and reducing costs.

On the other hand, the shunt resistor 111 may be made of manganese in the center and copper or copper alloy at both ends. Manganese has a small change in resistance to temperature with respect to heat, and copper or a copper alloy has a low resistance, so that an accurate current value can be measured.

3 is a perspective view of a large current PCB assembly 20 including a current sensor according to another embodiment of the present invention.

The high current PCB assembly 20 including the current sensor illustrated in FIG. 3 also includes a printed circuit board 210, a plurality of via holes 220, and a current measuring unit 230. In the high current PCB assembly 20 including the current sensor illustrated in FIG. 3, only one end of the shunt resistor 211 is exposed to the outside of the printed circuit board 220. It may be connected to the plus terminal of the vehicle battery through the fastening hole 211a formed at one end exposed to the outside.

4 is a perspective view of a high current PC assembly 30 including a current sensor according to another embodiment of the present invention, Figure 5 is a cross-sectional view of the high current PC assembly 30 including the current sensor shown in FIG.

The high current PCB assembly 30 including the current sensors illustrated in FIGS. 4 to 5 includes a printed circuit board 310, a plurality of via holes 320, and a hall sensor 330.

Since the printed circuit board 310 and the plurality of via holes 320 are the same as the printed circuit board 310 and the plurality of via holes 320 in the above-described embodiment, detailed descriptions thereof will be omitted.

The hall sensor 330 is mounted on the printed circuit board 310 to measure a current flowing through the shunt resistor 311. The hall sensor 330 uses a Hall effect, which is a physical phenomenon in which a potential difference occurs at both ends of a conductor when a magnetic field bridges a conductor through which current flows. The generated voltage is proportional to the strength of the current and the magnetic field. In addition, the current flowing through the shunt resistor 311 may be measured by analyzing the magnitude of the voltage through a circuit (not shown) connected to the hall sensor 330.

Since the current flows through the shunt resistor inserted into the printed circuit board, the high current PC assembly 30 including the current sensor configured as described above minimizes heat generation even when a large current flows to prevent damage to the circuit device due to heat generation. Can be. In addition, by measuring and calculating the current value by using a shunt resistor and a hall sensor, the current value can be measured accurately.

Meanwhile, the high current PC assembly 30 including the current sensor may further include a shield member 350. The shield member 350 is coupled to the printed circuit board 310 to surround the Hall sensor 320 and the shunt resistor 311 to shield the magnetic field. Since the shield member 350 shields the magnetic field and concentrates the magnetic flux, the signal is amplified, so that the hall sensor 320 can measure the current well. The shield member 350 may be a ferromagnetic metal plate. Specifically, it is preferable to manufacture a mumetal having a high permeability with an alloy of nickel iron copper. Specifically, as shown in the drawing, the shield member 350 may be formed in a U shape and may be coupled to be inserted into a hole in the printed circuit board 310. As described above, when the shield member 350 is formed in a U shape and is formed to surround only the hall sensor 320, shielding may be more effectively performed to accurately measure a current value.

Although the present invention has been described with reference to the embodiments illustrated in the accompanying drawings, this is merely exemplary, and a person of ordinary skill in the art may understand that various modifications and equivalent other embodiments are possible. There will be. Accordingly, the true scope of protection of the invention should be defined only by the appended claims.

Claims

A printed circuit board having a shunt resistor inserted therein;

A plurality of via holes formed from the surface of the printed circuit board to the shunt resistor; And

A current measuring unit electrically connected to the shunt resistor and measuring a current flowing through the shunt resistor;

Large current PCB assembly including a current sensor comprising a.
The method of claim 1,

The printed circuit board is divided into two parts, one part is made of a single layer and the other part is made of a multilayer, the shunt resistor is a high current PC assembly including a current sensor, characterized in that inserted into the part consisting of a single layer.
The method of claim 1,

The shunt resistor is a PCB assembly for a large current, including a current sensor, characterized in that the manganese in the center and copper or copper alloy at both ends.
A printed circuit board having a shunt resistor inserted therein;

A plurality of via holes formed from the surface of the printed circuit board to the shunt resistor; And

A hall sensor mounted on the printed circuit board to measure a current flowing through the shunt resistor;

Large current PCB assembly including a current sensor comprising a.
The method of claim 4, wherein

The printed circuit board is divided into two parts, one part is made of a single layer and the other part is made of a multilayer, the shunt resistor is a high current PC assembly including a current sensor, characterized in that inserted into the part consisting of a single layer.
The method of claim 5,

And a shielding member coupled to the printed circuit board to shield the magnetic field in a form surrounding the hall sensor and the shunt resistor.