WO2017222286A3 - 지문센서 모듈 및 그의 제조방법 - Google Patents

지문센서 모듈 및 그의 제조방법 Download PDF

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Publication number
WO2017222286A3
WO2017222286A3 PCT/KR2017/006488 KR2017006488W WO2017222286A3 WO 2017222286 A3 WO2017222286 A3 WO 2017222286A3 KR 2017006488 W KR2017006488 W KR 2017006488W WO 2017222286 A3 WO2017222286 A3 WO 2017222286A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensor module
fingerprint sensor
manufacturing same
sensor
base substrate
Prior art date
Application number
PCT/KR2017/006488
Other languages
English (en)
French (fr)
Other versions
WO2017222286A2 (ko
Inventor
손동남
김주성
Original Assignee
크루셜텍(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020160077432A external-priority patent/KR101809436B1/ko
Priority claimed from KR1020170076408A external-priority patent/KR101898572B1/ko
Application filed by 크루셜텍(주) filed Critical 크루셜텍(주)
Priority to US16/082,776 priority Critical patent/US20190095004A1/en
Publication of WO2017222286A2 publication Critical patent/WO2017222286A2/ko
Publication of WO2017222286A3 publication Critical patent/WO2017222286A3/ko

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/117—Identification of persons
    • A61B5/1171—Identification of persons based on the shapes or appearances of their bodies or parts thereof
    • A61B5/1172—Identification of persons based on the shapes or appearances of their bodies or parts thereof using fingerprinting
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K17/962—Capacitive touch switches
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Medical Informatics (AREA)
  • Pathology (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Molecular Biology (AREA)
  • Biophysics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Biomedical Technology (AREA)
  • Surgery (AREA)
  • Manufacturing & Machinery (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

본 발명의 일실시예는 베이스 기판의 상부에 구비되되, 상기 베이스 기판과 전기적으로 연결되며 생체 정보를 감지하는 센서부와, 상기 베이스 기판과 센서부를 덮는 봉지부를 갖는 센서 패키지; 및 상기 센서 패키지의 측면 둘레와 결합되며, 삽입 공간부를 형성하는 캡을 포함하는 지문센서 모듈 및 그의 제조방법을 제공한다.
PCT/KR2017/006488 2016-06-21 2017-06-20 지문센서 모듈 및 그의 제조방법 WO2017222286A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/082,776 US20190095004A1 (en) 2016-06-21 2017-06-20 Fingerprint sensor module and method of manufacturing same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2016-0077432 2016-06-21
KR1020160077432A KR101809436B1 (ko) 2016-06-21 2016-06-21 지문센서 모듈 및 그의 제조방법
KR1020170076408A KR101898572B1 (ko) 2017-06-16 2017-06-16 지문센서 모듈
KR10-2017-0076408 2017-06-16

Publications (2)

Publication Number Publication Date
WO2017222286A2 WO2017222286A2 (ko) 2017-12-28
WO2017222286A3 true WO2017222286A3 (ko) 2018-02-15

Family

ID=60784209

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2017/006488 WO2017222286A2 (ko) 2016-06-21 2017-06-20 지문센서 모듈 및 그의 제조방법

Country Status (2)

Country Link
US (1) US20190095004A1 (ko)
WO (1) WO2017222286A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106778542A (zh) * 2016-11-29 2017-05-31 惠州Tcl移动通信有限公司 一种基于移动终端的嵌入式指纹识别装置及其制造方法
KR102550592B1 (ko) * 2016-12-14 2023-07-04 삼성전자주식회사 센서 모듈을 구비한 전자 장치
CN109711235B (zh) * 2017-10-25 2023-04-14 光宝电子(广州)有限公司 指纹辨识模块
KR102658176B1 (ko) * 2018-04-24 2024-04-18 삼성디스플레이 주식회사 표시장치
US11437526B2 (en) * 2019-12-09 2022-09-06 Amkor Technology Singapore Holding Pte. Ltd. Electronic devices having a sensor and a translucent mold compound and methods of manufacturing electronic devices

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050098234A (ko) * 2002-12-30 2005-10-11 모토로라 인코포레이티드 콤팩트한 광학 포인팅 장치 및 방법
JP2008029739A (ja) * 2006-07-31 2008-02-14 Matsushita Electric Works Ltd 立体回路基板並びに指紋センサ装置
KR20090066364A (ko) * 2007-12-20 2009-06-24 정병주 다중문자 선택 발광키보드
US20130062177A1 (en) * 2011-09-08 2013-03-14 Giga-Byte Technology Co., Ltd. Replaceable key module and keyboard with the same
KR20150099295A (ko) * 2014-02-21 2015-08-31 삼성전자주식회사 물리적 키를 포함하는 포터블 전자 장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102918546B (zh) * 2010-04-15 2016-05-11 苹果公司 包括电容透镜的手指传感器及其相关方法
WO2015133645A1 (ja) * 2014-03-07 2015-09-11 オリンパス株式会社 成形金型及び成形金型を用いる製造方法
KR102419624B1 (ko) * 2016-01-21 2022-07-11 삼성전자 주식회사 전자 장치의 센서 배치 구조

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050098234A (ko) * 2002-12-30 2005-10-11 모토로라 인코포레이티드 콤팩트한 광학 포인팅 장치 및 방법
JP2008029739A (ja) * 2006-07-31 2008-02-14 Matsushita Electric Works Ltd 立体回路基板並びに指紋センサ装置
KR20090066364A (ko) * 2007-12-20 2009-06-24 정병주 다중문자 선택 발광키보드
US20130062177A1 (en) * 2011-09-08 2013-03-14 Giga-Byte Technology Co., Ltd. Replaceable key module and keyboard with the same
KR20150099295A (ko) * 2014-02-21 2015-08-31 삼성전자주식회사 물리적 키를 포함하는 포터블 전자 장치

Also Published As

Publication number Publication date
US20190095004A1 (en) 2019-03-28
WO2017222286A2 (ko) 2017-12-28

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