WO2017213661A1 - Dispositifs á points quantiques á lignes magnétiques - Google Patents

Dispositifs á points quantiques á lignes magnétiques Download PDF

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Publication number
WO2017213661A1
WO2017213661A1 PCT/US2016/036831 US2016036831W WO2017213661A1 WO 2017213661 A1 WO2017213661 A1 WO 2017213661A1 US 2016036831 W US2016036831 W US 2016036831W WO 2017213661 A1 WO2017213661 A1 WO 2017213661A1
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quantum
fin
quantum dot
gates
gate
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PCT/US2016/036831
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English (en)
Inventor
Ravi Pillarisetty
Jeanette M. Roberts
David J. Michalak
Zachary R. YOSCOVITS
James S. Clarke
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Intel Corporation
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Priority to PCT/US2016/036831 priority Critical patent/WO2017213661A1/fr
Publication of WO2017213661A1 publication Critical patent/WO2017213661A1/fr

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    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/82—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of the magnetic field applied to the device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
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    • H01L29/1025—Channel region of field-effect devices
    • H01L29/1029—Channel region of field-effect devices of field-effect transistors
    • H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
    • H01L29/1037—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure and non-planar channel
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    • H01L29/42312—Gate electrodes for field effect devices
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    • H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
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    • H01L29/42376—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the length or the sectional shape
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    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66431—Unipolar field-effect transistors with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
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    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66977—Quantum effect devices, e.g. using quantum reflection, diffraction or interference effects, i.e. Bragg- or Aharonov-Bohm effects
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    • H01L29/76—Unipolar devices, e.g. field effect transistors
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    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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    • H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • H01L29/0669—Nanowires or nanotubes
    • H01L29/0673—Nanowires or nanotubes oriented parallel to a substrate
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    • H01L29/122—Single quantum well structures
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    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H01L29/161—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table including two or more of the elements provided for in group H01L29/16, e.g. alloys
    • H01L29/165—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table including two or more of the elements provided for in group H01L29/16, e.g. alloys in different semiconductor regions, e.g. heterojunctions
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    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7781—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with inverted single heterostructure, i.e. with active layer formed on top of wide bandgap layer, e.g. IHEMT
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    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET

Definitions

  • Quantum computing refers to the field of research related to computation systems that use quantum mechanical phenomena to manipulate data. These quantum mechanical phenomena, such as superposition (in which a quantum variable can simultaneously exist in multiple different states) and entanglement (in which multiple quantum variables have related states irrespective of the distance between them in space or time), do not have analogs in the world of classical computing, and thus cannot be implemented with classical computing devices.
  • FIGS. 1-3 are cross-sectional views of a quantum dot device, in accordance with various embodiments.
  • FIGS. 4-33 illustrate various example stages in the manufacture of a quantum dot device, in accordance with various embodiments.
  • FIGS. 34-36 are cross-sectional views of another quantum dot device, in accordance with various embodiments.
  • FIGS. 37-39 are cross-sectional views of various examples of quantum well stacks that may be used in a quantum dot device, in accordance with various embodiments.
  • FIGS. 40-46 illustrate example base/fin arrangements that may be used in a quantum dot device, in accordance with various embodiments.
  • FIGS. 47-49 illustrate various example stages in the manufacture of alternative gate arrangements that may be included in a quantum dot device, in accordance with various embodiments.
  • FIG. 50 illustrates an embodiment of a quantum dot device having multiple groups of gates on a single fin, in accordance with various embodiments.
  • FIGS. 51-55 illustrate various alternative stages in the manufacture of a quantum dot device, in accordance with various embodiments.
  • FIG. 56 illustrates an example alternative stage in the manufacture of a quantum dot device, in accordance with various embodiments.
  • FIGS. 57-58 illustrate detail views of various embodiments of a doped region in a quantum dot device.
  • FIG. 59 is a flow diagram of an illustrative method of manufacturing a quantum dot device, in accordance with various embodiments.
  • FIGS. 60-61 are flow diagrams of illustrative methods of operating a quantum dot device, in accordance with various embodiments.
  • FIG. 62 is a block diagram of an example quantum computing device that may include any of the quantum dot devices disclosed herein, in accordance with various embodiments.
  • a quantum dot device may include: a base; a fin extending away from the base, wherein the fin includes a quantum well layer; one or more gates disposed on the fin; and a magnet line disposed proximate to the fin.
  • a quantum dot formed in such a device may be constrained in the x-direction by the one or more gates, in the y-direction by the fin, and in the z-direction by the quantum well layer, as discussed in detail herein.
  • the one or more gates may include first, second, and third gates.
  • Spacers may be disposed on the sides of the first and second gates, such that a first spacer is disposed on a side of the first gate proximate to the second gate, and a second spacer, physically separate from the first spacer, is disposed on a side of the second gate proximate to the first gate.
  • the third gate may be disposed on the fin between the first and second gates and extend between the first and second spacers.
  • the quantum dot devices disclosed herein may enable the formation of quantum dots to serve as quantum bits ("qubits") in a quantum computing device, as well as the control of these quantum dots to perform quantum logic operations. Unlike previous approaches to quantum dot formation and manipulation, various embodiments of the quantum dot devices disclosed herein provide strong spatial localization of the quantum dots (and therefore good control over quantum dot interactions and manipulation), good scalability in the number of quantum dots included in the device, and/or design flexibility in making electrical connections to the quantum dot devices to integrate the quantum dot devices in larger computing devices.
  • the phrase “A and/or B” means (A), (B), or (A and B).
  • the phrase “A, B, and/or C” means (A), (B), (C), (A and B), (A and C), (B and C), or (A, B, and C).
  • the term “between,” when used with reference to measurement ranges, is inclusive of the ends of the measurement ranges.
  • the notation "A/B/C” means (A), (B), and/or (C).
  • a magnet line refers to a magnetic field- generating structure to influence (e.g., change, reset, scramble, or set) the spin states of quantum dots.
  • a magnet line is a conductive pathway that is proximate to an area of quantum dot formation and selectively conductive of a current pulse that generates a magnetic field to influence a spin state of a quantum dot in the area.
  • FIGS. 1-3 are cross-sectional views of a quantum dot device 100, in accordance with various embodiments.
  • FIG. 2 illustrates the quantum dot device 100 taken along the section A- A of FIG. 1 (while FIG. 1 illustrates the quantum dot device 100 taken along the section C-C of FIG. 2)
  • FIG. 3 illustrates the quantum dot device 100 taken along the section B-B of FIG. 1 with a number of components not shown to more readily illustrate how the gates 106/108 and the magnet line 121 may be patterned (while FIG. 1 illustrates a quantum dot device 100 taken along the section D-D of FIG. 3).
  • FIG. 1 indicates that the cross-section illustrated in FIG. 2 is taken through the fin 104-1, an analogous cross section taken through the fin 104-2 may be identical, and thus the discussion of FIG. 2 refers generally to the "fin 104.”
  • the quantum dot device 100 may include a base 102 and multiple fins 104 extending away from the base 102.
  • the base 102 and the fins 104 may include a substrate and a quantum well stack (not shown in FIGS. 1-3, but discussed below with reference to the substrate 144 and the quantum well stack 146), distributed in any of a number of ways between the base 102 and the fins 104.
  • the base 102 may include at least some of the substrate, and the fins 104 may each include a quantum well layer of the quantum well stack (discussed below with reference to the quantum well layer 152). Examples of base/fin arrangements are discussed below with reference to the base fin arrangements 158 of FIGS. 40-46.
  • the total number of fins 104 included in the quantum dot device 100 is an even number, with the fins 104 organized into pairs including one active fin 104 and one read fin 104, as discussed in detail below.
  • the fins 104 may be arranged in pairs in a line (e.g., 2N fins total may be arranged in a lx2N line, or a 2xN line) or in pairs in a larger array (e.g., 2N fins total may be arranged as a 4xN/2 array, a 6xN/3 array, etc.).
  • a line e.g., 2N fins total may be arranged in a lx2N line, or a 2xN line
  • a larger array e.g., 2N fins total may be arranged as a 4xN/2 array, a 6xN/3 array, etc.
  • each of the fins 104 may include a quantum well layer (not shown in FIGS. 1-3, but discussed below with reference to the quantum well layer 152).
  • the quantum well layer included in the fins 104 may be arranged normal to the z-direction, and may provide a layer in which a two-dimensional electron gas (2DEG) may form to enable the generation of a quantum dot during operation of the quantum dot device 100, as discussed in further detail below.
  • the quantum well layer itself may provide a geometric constraint on the z-location of quantum dots in the fins 104, and the limited extent of the fins 104 (and therefore the quantum well layer) in the y-direction may provide a geometric constraint on the y-location of quantum dots in the fins 104.
  • the fins 104 may take any suitable values.
  • the fins 104 may each have a width 162 between 10 and 30 nanometers.
  • the fins 104 may each have a height 164 between 200 and 400 nanometers (e.g., between 250 and 350 nanometers, or equal to 300 nanometers).
  • the fins 104 may be arranged in parallel, as illustrated in FIGS. 1 and 3, and may be spaced apart by an insulating material 128, which may be disposed on opposite faces of the fins 104.
  • the insulating material 128 may be a dielectric material, such as silicon oxide.
  • the fins 104 may be spaced apart by a distance 160 between 100 and 250 microns.
  • Multiple gates may be disposed on each of the fins 104. In the embodiment illustrated in FIG. 2, three gates 106 and two gates 108 are shown as distributed on the top of the fin 104. This particular number of gates is simply illustrative, and any suitable number of gates may be used. Additionally, as discussed below with reference to FIG. 50, multiple groups of gates (like the gates illustrated in FIG. 2) may be disposed on the fin 104.
  • the gate 108-1 may be disposed between the gates 106-1 and 106-2, and the gate 108-2 may be disposed between the gates 106-2 and 106-3.
  • Each of the gates 106/108 may include a gate dielectric 114; in the embodiment illustrated in FIG. 2, the gate dielectric 114 for all of the gates 106/108 is provided by a common layer of gate dielectric material. In other embodiments, the gate dielectric 114 for each of the gates 106/108 may be provided by separate portions of gate dielectric 114 (e.g., as discussed below with reference to FIGS. 51-55).
  • the gate dielectric 114 may be a multilayer gate dielectric (e.g., with multiple materials used to improve the interface between the fin 104 and the corresponding gate metal).
  • the gate dielectric 114 may be, for example, silicon oxide, aluminum oxide, or a high-k dielectric, such as hafnium oxide. More generally, the gate dielectric 114 may include elements such as hafnium, silicon, oxygen, titanium, tantalum, lanthanum, aluminum, zirconium, barium, strontium, yttrium, lead, scandium, niobium, and zinc.
  • Examples of materials that may be used in the gate dielectric 114 may include, but are not limited to, hafnium oxide, hafnium silicon oxide, lanthanum oxide, lanthanum aluminum oxide, zirconium oxide, zirconium silicon oxide, tantalum oxide, titanium oxide, barium strontium titanium oxide, barium titanium oxide, strontium titanium oxide, yttrium oxide, aluminum oxide, tantalum oxide, tantalum silicon oxide, lead scandium tantalum oxide, and lead zinc niobate.
  • an annealing process may be carried out on the gate dielectric 114 to improve the quality of the gate dielectric 114.
  • Each of the gates 106 may include a gate metal 110 and a hardmask 116.
  • the hardmask 116 may be formed of silicon nitride, silicon carbide, or another suitable material.
  • the gate metal 110 may be disposed between the hardmask 116 and the gate dielectric 114, and the gate dielectric 114 may be disposed between the gate metal 110 and the fin 104. Only one portion of the hardmask 116 is labeled in FIG. 2 for ease of illustration.
  • the gate metal 110 may be a superconductor, such as aluminum, titanium nitride (e.g., deposited via atomic layer deposition), or niobium titanium nitride.
  • the hardmask 116 may not be present in the quantum dot device 100 (e.g., a hardmask like the hardmask 116 may be removed during processing, as discussed below).
  • the sides of the gate metal 110 may be substantially parallel, as shown in FIG. 2, and insulating spacers 134 may be disposed on the sides of the gate metal 110 and the hardmask 116. As illustrated in FIG. 2, the spacers 134 may be thicker closer to the fin 104 and thinner farther away from the fin 104. In some embodiments, the spacers 134 may have a convex shape.
  • the spacers 134 may be formed of any suitable material, such as a carbon-doped oxide, silicon nitride, silicon oxide, or other carbides or nitrides (e.g., silicon carbide, silicon nitride doped with carbon, and silicon oxynitride).
  • the gate metal 110 may be any suitable metal, such as titanium nitride.
  • Each of the gates 108 may include a gate metal 112 and a hardmask 118.
  • the hardmask 118 may be formed of silicon nitride, silicon carbide, or another suitable material.
  • the gate metal 112 may be disposed between the hardmask 118 and the gate dielectric 114, and the gate dielectric 114 may be disposed between the gate metal 112 and the fin 104.
  • the hardmask 118 may extend over the hardmask 116 (and over the gate metal 110 of the gates 106), while in other embodiments, the hardmask 118 may not extend over the gate metal 110 (e.g., as discussed below with reference to FIG. 45).
  • the gate metal 112 may be a different metal from the gate metal 110; in other embodiments, the gate metal 112 and the gate metal 110 may have the same material composition.
  • the gate metal 112 may be a superconductor, such as aluminum, titanium nitride (e.g., deposited via atomic layer deposition), or niobium titanium nitride.
  • the hardmask 118 may not be present in the quantum dot device 100 (e.g., a hardmask like the hardmask 118 may be removed during processing, as discussed below).
  • the gate 108-1 may extend between the proximate spacers 134 on the sides of the gate 106- 1 and the gate 106-2, as shown in FIG. 2.
  • the gate metal 112 of the gate 108- 1 may extend between the spacers 134 on the sides of the gate 106-1 and the gate 106-2.
  • the gate metal 112 of the gate 108-1 may have a shape that is substantially complementary to the shape of the spacers 134, as shown.
  • the gate 108-2 may extend between the proximate spacers 134 on the sides of the gate 106-2 and the gate 106-3.
  • the gate dielectric 114 may extend at least partially up the sides of the spacers 134, and the gate metal 112 may extend between the portions of gate dielectric 114 on the spacers 134.
  • the gate metal 112, like the gate metal 110, may be any suitable metal, such as titanium nitride.
  • the dimensions of the gates 106/108 may take any suitable values.
  • the z-height 166 of the gate metal 110 may be between 40 and 75 nanometers (e.g., approximately 50 nanometers); the z-height of the gate metal 112 may be in the same range. In embodiments like the ones illustrated in FIGS. 2, 49, and 56, the z-height of the gate metal 112 may be greater than the z-height of the gate metal 110.
  • the length 168 of the gate metal 110 i.e., in the x-direction
  • the distance 170 between adjacent ones of the gates 106 may be between 40 and 60 nanometers (e.g., 50 nanometers).
  • the thickness 172 of the spacers 134 may be between 1 and 10 nanometers (e.g., between 3 and 5 nanometers, between 4 and 6 nanometers, or between 4 and 7 nanometers).
  • the length of the gate metal 112 i.e., in the x-direction may depend on the dimensions of the gates 106 and the spacers 134, as illustrated in FIG. 2.
  • the gates 106/108 on one fin 104 may extend over the insulating material 128 beyond their respective fins 104 and towards the other fin 104, but may be isolated from their counterpart gates by the intervening insulating material 130 and spacers 134.
  • the gates 106 and 108 may be alternatingly arranged along the fin 104 in the x-direction.
  • voltages may be applied to the gates 106/108 to adjust the potential energy in the quantum well layer (not shown) in the fin 104 to create quantum wells of varying depths in which quantum dots 142 may form.
  • Only one quantum dot 142 is labeled with a reference numeral in FIGS. 2 and 3 for ease of illustration, but five are indicated as dotted circles in each fin 104.
  • the location of the quantum dots 142 in FIG. 2 is not intended to indicate a particular geometric positioning of the quantum dots 142.
  • the spacers 134 may themselves provide "passive" barriers between quantum wells under the gates 106/108 in the quantum well layer, and the voltages applied to different ones of the gates 106/108 may adjust the potential energy under the gates 106/108 in the quantum well layer; decreasing the potential energy may form quantum wells, while increasing the potential energy may form quantum barriers.
  • the fins 104 may include doped regions 140 that may serve as a reservoir of charge carriers for the quantum dot device 100.
  • an n-type doped region 140 may supply electrons for electron-type quantum dots 142
  • a p-type doped region 140 may supply holes for hole-type quantum dots 142.
  • an interface material 141 may be disposed at a surface of a doped region 140, as shown. The interface material 141 may facilitate electrical coupling between a conductive contact (e.g., a conductive via 136, as discussed below) and the doped region 140.
  • the interface material 141 may be any suitable metal-semiconductor ohmic contact material; for example, in embodiments in which the doped region 140 includes silicon, the interface material 141 may include nickel silicide, aluminum silicide, titanium silicide, molybdenum silicide, cobalt silicide, tungsten silicide, or platinum silicide (e.g., as discussed below with reference to FIGS. 22-23). In some embodiments, the interface material 141 may be a non-silicide compound, such as titanium nitride. In some embodiments, the interface material 141 may be a metal (e.g., aluminum, tungsten, or indium).
  • the quantum dot devices 100 disclosed herein may be used to form electron-type or hole- type quantum dots 142.
  • the polarity of the voltages applied to the gates 106/108 to form quantum wells/barriers depend on the charge carriers used in the quantum dot device 100.
  • amply negative voltages applied to a gate 106/108 may increase the potential barrier under the gate 106/108
  • amply positive voltages applied to a gate 106/108 may decrease the potential barrier under the gate 106/108 (thereby forming a potential well in which an electron-type quantum dot 142 may form).
  • amply positive voltages applied to a gate 106/108 may increase the potential barrier under the gate 106/108, and amply negative voltages applied to a gate 106 and 108 may decrease the potential barrier under the gate 106/108 (thereby forming a potential well in which a hole-type quantum dot 142 may form).
  • the quantum dot devices 100 disclosed herein may be used to form electron-type or hole-type quantum dots.
  • Voltages may be applied to each of the gates 106 and 108 separately to adjust the potential energy in the quantum well layer under the gates 106 and 108, and thereby control the formation of quantum dots 142 under each of the gates 106 and 108. Additionally, the relative potential energy profiles under different ones of the gates 106 and 108 allow the quantum dot device 100 to tune the potential interaction between quantum dots 142 under adjacent gates. For example, if two adjacent quantum dots 142 (e.g., one quantum dot 142 under a gate 106 and another quantum dot 142 under a gate 108) are separated by only a short potential barrier, the two quantum dots 142 may interact more strongly than if they were separated by a taller potential barrier. Since the depth of the potential wells/height of the potential barriers under each gate 106/108 may be adjusted by adjusting the voltages on the respective gates 106/108, the differences in potential between adjacent gates 106/108 may be adjusted, and thus the interaction tuned.
  • two adjacent quantum dots 142 e.g., one quantum dot 142
  • the gates 108 may be used as plunger gates to enable the formation of quantum dots 142 under the gates 108, while the gates 106 may be used as barrier gates to adjust the potential barrier between quantum dots 142 formed under adjacent gates 108.
  • the gates 108 may be used as barrier gates, while the gates 106 are used as plunger gates.
  • quantum dots 142 may be formed under all of the gates 106 and 108, or under any desired subset of the gates 106 and 108.
  • Conductive vias and lines may make contact with the gates 106/108, and to the doped regions 140, to enable electrical connection to the gates 106/108 and the doped regions 140 to be made in desired locations.
  • the gates 106 may extend away from the fins 104, and conductive vias 120 may contact the gates 106 (and are drawn in dashed lines in FIG. 2 to indicate their location behind the plane of the drawing).
  • the conductive vias 120 may extend through the hardmask 116 and the hardmask 118 to contact the gate metal 110 of the gates 106.
  • the gates 108 may extend away from the fins 104, and conductive vias 122 may contact the gates 108 (also drawn in dashed lines in FIG.
  • the conductive vias 122 may extend through the hardmask 118 to contact the gate metal 112 of the gates 108.
  • Conductive vias 136 may contact the interface material 141 and may thereby make electrical contact with the doped regions 140.
  • the quantum dot device 100 may include further conductive vias and/or lines (not shown) to make electrical contact to the gates 106/108 and/or the doped regions 140, as desired.
  • the conductive vias and lines included in a quantum dot device 100 may include any suitable materials, such as copper, tungsten (deposited, e.g., by CVD), or a superconductor (e.g., aluminum, tin, titanium nitride, niobium titanium nitride, tantalum, niobium, or other niobium compounds such as niobium tin and niobium germanium).
  • tungsten deposited, e.g., by CVD
  • a superconductor e.g., aluminum, tin, titanium nitride, niobium titanium nitride, tantalum, niobium, or other niobium compounds such as niobium tin and niobium germanium.
  • a bias voltage may be applied to the doped regions 140 (e.g., via the conductive vias 136 and the interface material 141) to cause current to flow through the doped regions 140.
  • this voltage may be positive; when the doped regions 140 are doped with a p-type material, this voltage may be negative.
  • the magnitude of this bias voltage may take any suitable value (e.g., between 0.25 volts and 2 volts).
  • the quantum dot device 100 may include one or more magnet lines 121.
  • a single magnet line 121 is illustrated in FIGS. 1-3 proximate to the fin 104-1.
  • the magnet line 121 may be formed of a conductive material, and may be used to conduct current pulses that generate magnetic fields to influence the spin states of one or more of the quantum dots 142 that may form in the fins 104.
  • the magnet line 121 may conduct a pulse to reset (or "scramble") nuclear and/or quantum dot spins.
  • the magnet line 121 may conduct a pulse to initialize an electron in a quantum dot in a particular spin state.
  • the magnet line 121 may conduct current to provide a continuous, oscillating magnet field to which the spin of a qubit may couple.
  • the magnet line 121 may provide any suitable combination of these embodiments, or any other appropriate functionality.
  • the magnet line 121 may be formed of copper. In some embodiments, the magnet line 121 may be formed of copper.
  • the magnet line 121 may be formed of a superconductor, such as aluminum.
  • the magnet line 121 illustrated in FIGS. 1-3 is non-coplanar with the fins 104, and is also non-coplanar with the gates 106/108.
  • the magnet line 121 may be spaced apart from the gates 106/108 by a distance 167.
  • the distance 167 may take any suitable value (e.g., based on the desired strength of magnetic field interaction with the quantum dots 142); in some embodiments, the distance 167 may be between 25 nanometers and 1 micron (e.g., between 50 nanometers and 200 nanometers).
  • the magnet line 121 may be formed of a magnetic material.
  • a magnetic material such as cobalt
  • the magnet line 121 may have any suitable dimensions.
  • the magnet line 121 may have a thickness 169 between 25 and 100 nanometers.
  • the magnet line 121 may have a width 171 between 25 and 100 nanometers.
  • the width 171 and thickness 169 of a magnet line 121 may be equal to the width and thickness, respectively, of other conductive lines in the quantum dot device 100 (not shown) used to provide electrical interconnects, as known in the art.
  • the magnet line 121 may have a length 173 that may depend on the number and dimensions of the gates 106/108 that are to form quantum dots 142 with which the magnet line 121 is to interact.
  • the magnet line 121 illustrated in FIGS. 1-3 (and the magnet lines 121 illustrated in FIGS. 34-36 below) are substantially linear, but this need not be the case; the magnet lines 121 disclosed herein may take any suitable shape.
  • Conductive vias 123 may contact the magnet line 121.
  • the conductive vias 120, 122, 136, and 123 may be electrically isolated from each other by an insulating material 130.
  • the insulating material 130 may be any suitable material, such as an interlayer dielectric (ILD). Examples of the insulating material 130 may include silicon oxide, silicon nitride, aluminum oxide, carbon-doped oxide, and/or silicon oxynitride.
  • ILD interlayer dielectric
  • conductive vias and lines may be formed in an iterative process in which layers of structures are formed on top of each other.
  • the conductive vias 120/122/136/123 may have a width that is 20 nanometers or greater at their widest point (e.g., 30 nanometers), and a pitch of 80 nanometers or greater (e.g., 100 nanometers).
  • conductive lines (not shown) included in the quantum dot device 100 may have a width that is 100 nanometers or greater, and a pitch of 100 nanometers or greater.
  • the particular arrangement of conductive vias shown in FIGS. 1-3 is simply illustrative, and any electrical routing arrangement may be implemented.
  • the structure of the fin 104-1 may be the same as the structure of the fin 104-2; similarly, the construction of gates 106/108 on the fin 104-1 may be the same as the construction of gates 106/108 on the fin 104-2.
  • the gates 106/108 on the fin 104-1 may be mirrored by corresponding gates 106/108 on the parallel fin 104-2, and the insulating material 130 may separate the gates 106/108 on the different fins 104-1 and 104-2.
  • quantum dots 142 formed in the fin 104-1 (under the gates 106/108) may have counterpart quantum dots 142 in the fin 104-2 (under the corresponding gates 106/108).
  • the quantum dots 142 in the fin 104-1 may be used as "active" quantum dots in the sense that these quantum dots 142 act as qubits and are controlled (e.g., by voltages applied to the gates 106/108 of the fin 104-1) to perform quantum computations.
  • the quantum dots 142 in the fin 104-2 may be used as "read” quantum dots in the sense that these quantum dots 142 may sense the quantum state of the quantum dots 142 in the fin 104-1 by detecting the electric field generated by the charge in the quantum dots 142 in the fin 104-1, and may convert the quantum state of the quantum dots 142 in the fin 104-1 into electrical signals that may be detected by the gates 106/108 on the fin 104-2.
  • Each quantum dot 142 in the fin 104-1 may be read by its corresponding quantum dot 142 in the fin 104-2.
  • the quantum dot device 100 enables both quantum computation and the ability to read the results of a quantum computation.
  • FIGS. 4-33 illustrate various example stages in the manufacture of the quantum dot device 100 of FIGS. 1-3, in accordance with various embodiments. Although the particular manufacturing operations discussed below with reference to FIGS. 4-33 are illustrated as manufacturing a particular embodiment of the quantum dot device 100, these operations may be applied to manufacture many different embodiments of the quantum dot device 100, as discussed herein. Any of the elements discussed below with reference to FIGS. 4-33 may take the form of any of the embodiments of those elements discussed above (or otherwise disclosed herein).
  • FIG. 4 illustrates a cross-sectional view of an assembly 200 including a substrate 144.
  • the substrate 144 may include any suitable semiconductor material or materials.
  • the substrate 144 may include a semiconductor material.
  • the substrate 144 may include silicon (e.g., may be formed from a silicon wafer).
  • FIG. 5 illustrates a cross-sectional view of an assembly 202 subsequent to providing a quantum well stack 146 on the substrate 144 of the assembly 200 (FIG. 4).
  • the quantum well stack 146 may include a quantum well layer (not shown) in which a 2DEG may form during operation of the quantum dot device 100.
  • Various embodiments of the quantum well stack 146 are discussed below with reference to FIGS. 37-39.
  • FIG. 6 illustrates a cross-sectional view of an assembly 204 subsequent to forming fins 104 in the assembly 202 (FIG. 5).
  • the fins 104 may extend from a base 102, and may be formed in the assembly 202 by patterning and then etching the assembly 202, as known in the art. For example, a combination of dry and wet etch chemistry may be used to form the fins 104, and the appropriate chemistry may depend on the materials included in the assembly 202, as known in the art.
  • At least some of the substrate 144 may be included in the base 102, and at least some of the quantum well stack 146 may be included in the fins 104.
  • the quantum well layer (not shown) of the quantum well stack 146 may be included in the fins 104.
  • Example arrangements in which the quantum well stack 146 and the substrate 144 are differently included in the base 102 and the fins 104 are discussed below with reference to FIGS. 40-46.
  • FIG. 7 illustrates a cross-sectional view of an assembly 206 subsequent to providing an insulating material 128 to the assembly 204 (FIG. 6).
  • Any suitable material may be used as the insulating material 128 to electrically insulate the fins 104 from each other.
  • the insulating material 128 may be a dielectric material, such as silicon oxide.
  • FIG. 8 illustrates a cross-sectional view of an assembly 208 subsequent to planarizing the assembly 206 (FIG. 7) to remove the insulating material 128 above the fins 104.
  • the assembly 206 may be planarized using a chemical mechanical polishing (CMP) technique.
  • CMP chemical mechanical polishing
  • FIG. 9 is a perspective view of at least a portion of the assembly 208, showing the fins 104 extending from the base 102 and separated by the insulating material 128.
  • the cross-sectional views of FIGS. 4-8 are taken parallel to the plane of the page of the perspective view of FIG. 9.
  • FIG. 10 is another cross-sectional view of the assembly 208, taken along the dashed line along the fin 104-1 in FIG. 9.
  • the cross-sectional views illustrated in FIGS. 11-24, 26, 28, 30, and 32 are taken along the same cross-section as FIG. 10.
  • the cross-sectional views illustrated in FIGS. 25, 27, 29, 31, and 33 are taken along the same cross-section as FIG. 8.
  • FIG. 11 is a cross-sectional view of an assembly 210 subsequent to forming a gate stack 174 on the fins 104 of the assembly 208 (FIGS. 8-10).
  • the gate stack 174 may include the gate dielectric 114, the gate metal 110, and a hardmask 116.
  • the hardmask 116 may be formed of an electrically insulating material, such as silicon nitride or carbon-doped nitride.
  • FIG. 12 is a cross-sectional view of an assembly 212 subsequent to patterning the hardmask 116 of the assembly 210 (FIG. 11).
  • the pattern applied to the hardmask 116 may correspond to the locations for the gates 106, as discussed below.
  • the hardmask 116 may be patterned by applying a resist, patterning the resist using lithography, and then etching the hardmask (using dry etching or any appropriate technique).
  • FIG. 13 is a cross-sectional view of an assembly 214 subsequent to etching the assembly 212 (FIG. 12) to remove the gate metal 110 that is not protected by the patterned hardmask 116 to form the gates 106.
  • the gate dielectric 114 may remain after the etched gate metal 110 is etched away; in other embodiments, the gate dielectric 114 may also be etched during the etching of the gate metal 110. Examples of such embodiments are discussed below with reference to FIGS. 51-55.
  • FIG. 14 is a cross-sectional view of an assembly 216 subsequent to providing spacer material 132 on the assembly 214 (FIG. 13).
  • the spacer material 132 may include any of the materials discussed above with reference to the spacers 134, for example, and may be deposited using any suitable technique.
  • the spacer material 132 may be a nitride material (e.g., silicon nitride) deposited by sputtering.
  • FIG. 15 is a cross-sectional view of an assembly 218 subsequent to etching the spacer material 132 of the assembly 216 (FIG. 14), leaving spacers 134 formed of the spacer material 132 on the sides of the gates 106 (e.g., on the sides of the hardmask 116 and the gate metal 110).
  • the etching of the spacer material 132 may be an anisotropic etch, etching the spacer material 132 "downward" to remove the spacer material 132 on top of the gates 106 and in some of the area between the gates 106, while leaving the spacers 134 on the sides of the gates 106.
  • the anisotropic etch may be a dry etch.
  • FIG. 16 is a cross-sectional view of an assembly 220 subsequent to providing the gate metal 112 on the assembly 218 (FIG. 15).
  • the gate metal 112 may fill the areas between adjacent ones of the gates 106, and may extend over the tops of the gates 106.
  • FIG. 17 is a cross-sectional view of an assembly 222 subsequent to planarizing the assembly 220 (FIG. 16) to remove the gate metal 112 above the gates 106.
  • the assembly 220 may be planarized using a CMP technique. Some of the remaining gate metal 112 may fill the areas between adjacent ones of the gates 106, while other portions 150 of the remaining gate metal 112 may be located "outside" of the gates 106.
  • FIG. 18 is a cross-sectional view of an assembly 224 subsequent to providing a hardmask 118 on the planarized surface of the assembly 222 (FIG. 17).
  • the hardmask 118 may be formed of any of the materials discussed above with reference to the hardmask 116, for example.
  • FIG. 19 is a cross-sectional view of an assembly 226 subsequent to patterning the hardmask 118 of the assembly 224 (FIG. 18).
  • the pattern applied to the hardmask 118 may extend over the hardmask 116 (and over the gate metal 110 of the gates 106, as well as over the locations for the gates 108 (as illustrated in FIG. 2).
  • the hardmask 118 may be non-coplanar with the hardmask 116, as illustrated in FIG. 19.
  • the hardmask 118 illustrated in FIG. 19 may thus be a common, continuous portion of hardmask 118 that extends over all of the hardmask 116.
  • FIG. 20 is a cross-sectional view of an assembly 228 subsequent to etching the assembly 226 (FIG. 19) to remove the portions 150 that are not protected by the patterned hardmask 118 to form the gates 108. Portions of the hardmask 118 may remain on top of the hardmask 116, as shown.
  • the operations performed on the assembly 226 may include removing any gate dielectric 114 that is "exposed" on the fin 104, as shown. The excess gate dielectric 114 may be removed using any suitable technique, such as chemical etching or silicon bombardment.
  • FIG. 21 is a cross-sectional view of an assembly 230 subsequent to doping the fins 104 of the assembly 228 (FIG. 20) to form doped regions 140 in the portions of the fins 104 "outside" of the gates 106/108.
  • the type of dopant used to form the doped regions 140 may depend on the type of quantum dot desired, as discussed above.
  • the doping may be performed by ion implantation.
  • the quantum dot 142 is to be an electron-type quantum dot 142
  • the doped regions 140 may be formed by ion implantation of phosphorous, arsenic, or another n-type material.
  • the doped regions 140 may be formed by ion implantation of boron or another p-type material. An annealing process that activates the dopants and causes them to diffuse farther into the fins 104 may follow the ion implantation process.
  • the depth of the doped regions 140 may take any suitable value; for example, in some embodiments, the doped regions 140 may extend into the fin 104 to a depth 115 between 500 and 1000 Angstroms.
  • the outer spacers 134 on the outer gates 106 may provide a doping boundary, limiting diffusion of the dopant from the doped regions 140 into the area under the gates 106/108. As shown, the doped regions 140 may extend under the adjacent outer spacers 134. In some embodiments, the doped regions 140 may extend past the outer spacers 134 and under the gate metal 110 of the outer gates 106, may extend only to the boundary between the outer spacers 134 and the adjacent gate metal 110, or may terminate under the outer spacers 134 and not reach the boundary between the outer spacers 134 and the adjacent gate metal 110. Examples of such embodiments are discussed below with reference to FIGS. 57 and 58. The doping concentration of the doped regions 140 may, in some embodiments, be between 10 17 /cm 3 and 10 20 /cm 3 .
  • FIG. 22 is a cross-sectional side view of an assembly 232 subsequent to providing a layer of nickel or other material 143 over the assembly 230 (FIG. 21).
  • the nickel or other material 143 may be deposited on the assembly 230 using any suitable technique (e.g., a plating technique, chemical vapor deposition, or atomic layer deposition).
  • FIG. 23 is a cross-sectional side view of an assembly 234 subsequent to annealing the assembly 232 (FIG. 22) to cause the material 143 to interact with the doped regions 140 to form the interface material 141, then removing the unreacted material 143.
  • the interface material 141 may be nickel silicide. Materials other than nickel may be deposited in the operations discussed above with reference to FIG. 22 in order to form other interface materials 141, including titanium, aluminum, molybdenum, cobalt, tungsten, or platinum, for example. More generally, the interface material 141 of the assembly 234 may include any of the materials discussed herein with reference to the interface material 141.
  • FIG. 24 is a cross-sectional view of an assembly 236 subsequent to providing an insulating material 130 on the assembly 234 (FIG. 23).
  • the insulating material 130 may take any of the forms discussed above.
  • the insulating material 130 may be a dielectric material, such as silicon oxide.
  • the insulating material 130 may be provided on the assembly 234 using any suitable technique, such as spin coating, chemical vapor deposition (CVD), or plasma-enhanced CVD (PECVD).
  • the insulating material 130 may be polished back after deposition, and before further processing.
  • the thickness 131 of the insulating material 130 provided on the assembly 236 (as measured from the hardmask 118, as indicated in FIG. 24) may be between 50 nanometers and 1.2 microns (e.g., between 50 nanometers and 300 nanometers).
  • FIG. 25 is another cross-sectional view of the assembly 236, taken along the section C-C of FIG. 24.
  • FIG. 26 is a cross-sectional view of an assembly 238 subsequent to forming a trench 125 in the insulating material 130 of the assembly 236 (FIGS. 24 and 25).
  • the trench 125 may be formed using any desired techniques (e.g., resist patterning followed by etching), and may have a depth 127 and a width 129 that may take the form of any of the embodiments of the thickness 169 and the width 171, respectively, discussed above with reference to the magnet line 121.
  • FIG. 27 is another cross-sectional view of the assembly 238, taken along the section C-C of FIG. 26.
  • the assembly 236 may be planarized to remove the hardmasks 116 and 118, then additional insulating material 130 may be provided on the planarized surface before forming the trench 125; in such an embodiment, the hardmasks 116 and 118 would not be present in the quantum dot device 100.
  • FIG. 28 is a cross-sectional view of an assembly 240 subsequent to filling the trench 125 of the assembly 238 (FIGS. 26 and 27) with a conductive material to form the magnet line 121.
  • the magnet line 121 may be formed using any desired techniques (e.g., plating followed by planarization, or a semi-additive process), and may take the form of any of the embodiments disclosed herein.
  • FIG. 29 is another cross-sectional view of the assembly 240, taken along the section C-C of FIG. 28.
  • FIG. 30 is a cross-sectional view of an assembly 242 subsequent to providing additional insulating material 130 on the assembly 240 (FIGS. 28 and 29).
  • the insulating material 130 provided on the assembly 240 may take any of the forms of the insulating material 130 discussed above.
  • FIG. 31 is another cross-sectional view of the assembly 242, taken along the section C-C of FIG. 30.
  • FIG. 32 is a cross-sectional view of an assembly 244 subsequent to forming, in the assembly 242 (FIGS. 30 and 31), conductive vias 120 through the insulating material 130 (and the hardmasks 116 and 118) to contact the gate metal 110 of the gates 106, conductive vias 122 through the insulating material 130 (and the hardmask 118) to contact the gate metal 112 of the gates 108, conductive vias 136 through the insulating material 130 to contact the interface material 141 of the doped regions 140, and conductive vias 123 through the insulating material 130 to contact the magnet line 121. Further conductive vias and/or lines may be formed in the assembly 244 using conventional interconnect techniques, if desired. The resulting assembly 244 may take the form of the quantum dot device 100 discussed above with reference to FIGS. 1-3.
  • FIGS. 34- 36 are various cross-sectional views of an embodiment of a quantum dot device 100 having multiple magnet lines 121, each proximate to the fins 104 and oriented perpendicular to the longitudinal axes of the fins 104.
  • the magnet lines 121 of the embodiment of FIGS. 34-36 may take the form of any of the embodiments of the magnet line 121 discussed above.
  • the other elements of the quantum dot devices 100 of FIGS. 34-36 may take the form of any of those elements discussed herein.
  • the manufacturing operations discussed above with reference to FIGS. 4-33 may be used to manufacture the quantum dot device 100 of FIGS. 34-36.
  • multiple magnet lines 121 may be included in that embodiment of the quantum dot device 100 (e.g., multiple magnet lines 121 parallel to the longitudinal axes of the fins 104).
  • the quantum dot device 100 of FIGS. 1-3 may include a second magnet line 121 proximate to the fin 104-2 in a symmetric manner to the magnet line 121 illustrated proximate to the fin 104-1.
  • multiple magnet lines 121 may be included in a quantum dot device 100, and these magnet lines 121 may or may not be parallel to one another.
  • a quantum dot device 100 may include two (or more) magnet lines 121 that are oriented perpendicular to each other. Such an example is illustrated below in FIG. 50, which depicts a quantum dot device 100 including magnet lines 121 oriented like those illustrated in FIGS. 1-3, and magnet lines 121 oriented like those illustrated in FIGS. 34-36.
  • the base 102 and the fin 104 of a quantum dot device 100 may be formed from a substrate 144 and a quantum well stack 146 disposed on the substrate 144.
  • the quantum well stack 146 may include a quantum well layer in which a 2DEG may form during operation of the quantum dot device 100.
  • the quantum well stack 146 may take any of a number of forms, several of which are illustrated in FIGS. 37-39.
  • the various layers in the quantum well stacks 146 discussed below may be grown on the substrate 144 (e.g., using epitaxial processes).
  • FIG. 37 is a cross-sectional view of a quantum well stack 146 including only a quantum well layer 152.
  • the quantum well layer 152 may be disposed on the substrate 144 (e.g., as discussed above with reference to FIG. 5), and may be formed of a material such that, during operation of the quantum dot device 100, a 2DEG may form in the quantum well layer 152 proximate to the upper surface of the quantum well layer 152.
  • the gate dielectric 114 of the gates 106/108 may be disposed on the upper surface of the quantum well layer 152 (e.g., as discussed above with reference to FIG. 11).
  • the quantum well layer 152 of FIG. 37 may be formed of intrinsic silicon, and the gate dielectric 114 may be formed of silicon oxide; in such an
  • a 2DEG may form in the intrinsic silicon at the interface between the intrinsic silicon and the silicon oxide.
  • the quantum well layer 152 of FIG. 37 is formed of intrinsic silicon may be particularly advantageous for electron- type quantum dot devices 100.
  • the quantum well layer 152 of FIG. 37 may be formed of intrinsic germanium, and the gate dielectric 114 may be formed of germanium oxide; in such an arrangement, during use of the quantum dot device 100, a 2DEG may form in the intrinsic germanium at the interface between the intrinsic germanium and the germanium oxide.
  • Such embodiments may be particularly advantageous for hole-type quantum dot devices 100.
  • the quantum well layer 152 may be strained, while in other embodiments, the quantum well layer 152 may not be strained.
  • the thicknesses (i.e., z-heights) of the layers in the quantum well stack 146 of FIG. 37 may take any suitable values. For example, in some
  • the thickness of the quantum well layer 152 may be between 0.8 and 1.2 microns.
  • FIG. 38 is a cross-sectional view of a quantum well stack 146 including a quantum well layer 152 and a barrier layer 154.
  • the quantum well stack 146 may be disposed on a substrate 144 (e.g., as discussed above with reference to FIG. 5) such that the barrier layer 154 is disposed between the quantum well layer 152 and the substrate 144.
  • the barrier layer 154 may provide a potential barrier between the quantum well layer 152 and the substrate 144.
  • the quantum well layer 152 of FIG. 38 may be formed of a material such that, during operation of the quantum dot device 100, a 2DEG may form in the quantum well layer 152 proximate to the upper surface of the quantum well layer 152.
  • the quantum well layer 152 of FIG. 38 may be formed of silicon, and the barrier layer 154 may be formed of silicon germanium.
  • the germanium content of this silicon germanium may be 20-80% (e.g., 30%).
  • the barrier layer 154 may be formed of silicon germanium (with a germanium content of 20-80% (e.g., 70%)).
  • the thicknesses (i.e., z-heights) of the layers in the quantum well stack 146 of FIG. 38 may take any suitable values. For example, in some
  • the thickness of the barrier layer 154 (e.g., silicon germanium) may be between 0 and 400 nanometers. In some embodiments, the thickness of the quantum well layer 152 (e.g., silicon or germanium) may be between 5 and 30 nanometers.
  • FIG. 39 is a cross-sectional view of a quantum well stack 146 including a quantum well layer 152 and a barrier layer 154-1, as well as a buffer layer 176 and an additional barrier layer 154-2.
  • the quantum well stack 146 may be disposed on the substrate 144 (e.g., as discussed above with reference to FIG. 5) such that the buffer layer 176 is disposed between the barrier layer 154-1 and the substrate 144.
  • the buffer layer 176 may be formed of the same material as the barrier layer 154, and may be present to trap defects that form in this material as it is grown on the substrate 144.
  • the buffer layer 176 may be grown under different conditions (e.g., deposition temperature or growth rate) from the barrier layer 154-1.
  • the barrier layer 154-1 may be grown under conditions that achieve fewer defects than the buffer layer 176.
  • the silicon germanium of the buffer layer 176 may have a germanium content that varies from the substrate 144 to the barrier layer 154-1; for example, the silicon germanium of the buffer layer 176 may have a germanium content that varies from zero percent at the silicon substrate 144 to a nonzero percent (e.g., 30%) at the barrier layer 154-1.
  • the thicknesses (i.e., z-heights) of the layers in the quantum well stack 146 of FIG. 39 may take any suitable values.
  • the thickness of the buffer layer 176 may be between 0.3 and 4 microns (e.g., 0.3-2 microns, or 0.5 microns).
  • the thickness of the barrier layer 154-1 e.g., silicon germanium
  • the thickness of the quantum well layer 152 e.g., silicon or germanium
  • the barrier layer 154-2 like the barrier layer 154-1, may provide a potential energy barrier around the quantum well layer 152, and may take the form of any of the embodiments of the barrier layer 154-1.
  • the thickness of the barrier layer 154-2 (e.g., silicon germanium) may be between 25 and 75 nanometers (e.g., 32 nanometers).
  • the quantum well layer 152 of FIG. 39 may be formed of a material such that, during operation of the quantum dot device 100, a 2DEG may form in the quantum well layer 152 proximate to the upper surface of the quantum well layer 152.
  • the quantum well layer 152 of FIG. 39 may be formed of silicon, and the barrier layer 154-1 and the buffer layer 176 may be formed of silicon germanium.
  • the silicon germanium of the buffer layer 176 may have a germanium content that varies from the substrate 144 to the barrier layer 154-1; for example, the silicon germanium of the buffer layer 176 may have a germanium content that varies from zero percent at the silicon substrate 144 to a nonzero percent (e.g., 30%) at the barrier layer 154-1. In other embodiments, the buffer layer 176 may have a germanium content equal to the germanium content of the barrier layer 154-1 but may be thicker than the barrier layer 154-1 so as to absorb the defects that arise during growth.
  • the quantum well layer 152 of FIG. 28 may be formed of germanium, and the buffer layer 176 and the barrier layer 154-1 may be formed of silicon germanium.
  • the silicon germanium of the buffer layer 176 may have a germanium content that varies from the substrate 144 to the barrier layer 154-1; for example, the silicon germanium of the buffer layer 176 may have a germanium content that varies from zero percent at the substrate 144 to a nonzero percent (e.g., 70%) at the barrier layer 154-1.
  • the barrier layer 154-1 may in turn have a germanium content equal to the nonzero percent.
  • the buffer layer 176 may have a germanium content equal to the germanium content of the barrier layer 154-1 but may be thicker than the barrier layer 154-1 so as to absorb the defects that arise during growth. In some embodiments of the quantum well stack 146 of FIG. 28, the buffer layer 176 and/or the barrier layer 154-2 may be omitted.
  • the substrate 144 and the quantum well stack 146 may be distributed between the base 102 and the fins 104 of the quantum dot device 100, as discussed above. This distribution may occur in any of a number of ways.
  • FIGS. 40-46 illustrate example base/fin arrangements 158 that may be used in a quantum dot device 100, in accordance with various embodiments.
  • the quantum well stack 146 may be included in the fins 104, but not in the base 102.
  • the substrate 144 may be included in the base 102, but not in the fins 104.
  • the fin etching may etch through the quantum well stack 146, and stop when the substrate 144 is reached.
  • the quantum well stack 146 may be included in the fins 104, as well as in a portion of the base 102.
  • a substrate 144 may be included in the base 102 as well, but not in the fins 104.
  • the fin etching may etch partially through the quantum well stack 146, and stop before the substrate 144 is reached.
  • FIG. 42 illustrates a particular embodiment of the base/fin arrangement 158 of FIG. 41.
  • the quantum well stack 146 of FIG. 39 is used; the fins 104 include the barrier layer 154-1, the quantum well layer 152, and the barrier layer 154-2, while the base 102 includes the buffer layer 176 and the substrate 144.
  • the quantum well stack 146 may be included in the fins 104, but not the base 102.
  • the substrate 144 may be partially included in the fins 104, as well as in the base 102.
  • the fin etching may etch through the quantum well stack 146 and into the substrate 144 before stopping.
  • FIG. 44 illustrates a particular embodiment of the base/fin arrangement 158 of FIG. 43.
  • the quantum well stack 146 of FIG. 39 is used; the fins 104 include the quantum well stack 146 and a portion of the substrate 144, while the base 102 includes the remainder of the substrate 144.
  • the fins 104 have been illustrated in many of the preceding figures as substantially rectangular with parallel sidewalls, this is simply for ease of illustration, and the fins 104 may have any suitable shape (e.g., shape appropriate to the manufacturing processes used to form the fins 104).
  • the fins 104 may be tapered.
  • the fins 104 may taper by 3-10 nanometers in x-width for every 100 nanometers in z-height (e.g., 5 nanometers in x-width for every 100 nanometers in z-height).
  • FIG. 46 illustrates a particular embodiment of the base/fin arrangement 158 of FIG. 34.
  • the quantum well stack 146 is included in the tapered fins 104 while a portion of the substrate 144 is included in the tapered fins and a portion of the substrate 144 provides the base 102.
  • the z-height of the gate metal 112 of the gates 108 may be approximately equal to the sum of the z-height of the gate metal 110 and the z-height of the hardmask 116, as shown. Also in the embodiment of FIG. 2, the gate metal 112 of the gates 108 may not extend in the x-direction beyond the adjacent spacers 134.
  • FIGS. 47-49 illustrate various example stages in the manufacture of alternative gate arrangements that may be included in a quantum dot device 100, in accordance with various embodiments.
  • FIG. 47 illustrates an assembly 246 subsequent to providing the gate metal 112 and a hardmask 118 on the assembly 218 (FIG. 15). The assembly 246 may be similar to the assembly 224 of FIG.
  • the gate metal 112 may be planarized prior to provision of the hardmask 118, but the hardmask 118 may still be spaced away from the hardmask 116 in the z-direction by the gate metal 112, as shown in FIG. 47.
  • FIG. 48 illustrates an assembly 248 subsequent to patterning the hardmask 118 of the assembly 246 (FIG. 47).
  • the pattern applied to the hardmask 118 may include the locations for the gates 108, as discussed below.
  • the hardmask 118 may be non-coplanar with the hardmask 116, as illustrated in FIG. 47, and may extend "over" at least a portion of the hardmask 116 (and thus over the gate metal 110 of the gates 106).
  • FIG. 49 illustrates an assembly 246 subsequent to etching the assembly 248 (FIG. 48) to remove the portions 150 that are not protected by the patterned hardmask 118 to form the gates 108.
  • the gate metal 112 of the gates 106 may extend "over" the hardmask 116 of the gates 108, and may be electrically insulated from the gate metal 110 by the hardmask 116.
  • the z-height of the gate metal 112 of the gates 108 may be greater than the sum of the z-height of the gate metal 110 and the z-height of the hardmask 116 of the gates 106.
  • the gate metal 112 of the gates 108 may extend beyond the spacers 134 in the x- direction, as shown. Further manufacturing operations may be performed on the assembly 246, as discussed above with reference to FIGS. 21-33.
  • a single fin 104 may include multiple groups of gates 106/108, spaced apart along the fin by a doped region 140.
  • FIG. 50 is a cross-sectional view of an example of such a quantum dot device 100 having multiple groups of gates 180 on a single fin 104, in accordance with various embodiments.
  • Each of the groups 180 may include gates 106/108 (not labeled in FIG. 50 for ease of illustration) that may take the form of any of the embodiments of the gates 106/108 discussed herein.
  • a doped region 140 (and its interface material 141) may be disposed between two adjacent groups 180 (labeled in FIG. 50 as groups 180-1 and 180-2), and may provide a common reservoir for both groups 180.
  • this "common" doped region 140 may be electrically contacted by a single conductive via 136.
  • the particular number of gates 106/108 illustrated in FIG. 50, and the particular number of groups 180, is simply illustrative, and a fin 104 may include any suitable number of gates 106/108 arranged in any suitable number of groups 180.
  • the quantum dot device 100 of FIG. 50 may also include one or more magnet lines 121, arranged as desired. For example, FIG. 50 illustrates multiple magnet lines 121 oriented parallel to the longitudinal axis of the fin 104 and multiple magnet lines 121 oriented perpendicular to the longitudinal axis of the fin 104.
  • FIGS. 51-55 illustrate various alternative stages in the manufacture of such an embodiment of a quantum dot device 100, in accordance with various embodiments. In particular, the operations illustrated in FIGS. 51-55 may take the place of the operations illustrated in FIGS. 13-15.
  • FIG. 51 is a cross-sectional view of an assembly 252 subsequent to etching the assembly 212 (FIG. 12) to remove the gate metal 110, and the gate dielectric 114 that is not protected by the patterned hardmask 116, to form the gates 106.
  • FIG. 52 is a cross-sectional view of an assembly 254 subsequent to providing spacer material 132 on the assembly 252 (FIG. 51).
  • the deposition of the spacer material 132 may take any of the forms discussed above with reference to FIG. 14, for example.
  • FIG. 53 is a cross-sectional view of an assembly 256 subsequent to etching the spacer material 132 of the assembly 254 (FIG. 52), leaving spacers 134 formed of the spacer material 132 on the sides of the gates 106 (e.g., on the sides of the hardmask 116, the gate metal 110, and the gate dielectric 114).
  • the etching of the spacer material 132 may take any of the forms discussed above with reference to FIG. 15, for example.
  • FIG. 54 is a cross-sectional view of an assembly 258 subsequent to providing a gate dielectric 114 on the fin 104 between the gates 106 of the assembly 256 (FIG. 53).
  • the gate dielectric 114 provided between the gates 106 of the assembly 256 may be formed by atomic layer deposition (ALD) and, as illustrated in FIG. 54, may cover the exposed fin 104 between the gates 106, and may extend onto the adjacent spacers 134.
  • ALD atomic layer deposition
  • FIG. 55 is a cross-sectional view of an assembly 260 subsequent to providing the gate metal 112 on the assembly 258 (FIG. 54).
  • the gate metal 112 may fill the areas between adjacent ones of the gates 106, and may extend over the tops of the gates 106, as shown.
  • the provision of the gate metal 112 may take any of the forms discussed above with reference to FIG. 16, for example.
  • the assembly 260 may be further processed as discussed above with reference to FIGS. 17-33.
  • the pattern applied to the hardmask 118 may not result in a common, continuous portion of hardmask 118 that extends over all of the hardmask 116.
  • FIG. 56 is a cross-sectional view of an assembly 258 in which the hardmask 118 of the assembly 224 (FIG. 18) is not patterned to extend over the gates 106, but instead is patterned so as not to extend over the gate metal 110.
  • the assembly 258 may be further processed as discussed above with reference to FIGS.
  • the hardmasks 116 and 118 may remain in the quantum dot device 100 as part of the gates 106/108, while in other embodiments, the hardmasks 116 and 118 may be removed.
  • the outer spacers 134 on the outer gates 106 may provide a doping boundary, limiting diffusion of the dopant from the doped regions 140 into the area under the gates 106/108.
  • the doped regions 140 may extend past the outer spacers 134 and under the outer gates 106.
  • the doped region 140 may extend past the outer spacers 134 and under the outer gates 106 by a distance 182 between 0 and 10 nanometers.
  • the doped regions 140 may not extend past the outer spacers 134 toward the outer gates 106, but may instead "terminate" under the outer spacers 134. For example, as illustrated in FIG.
  • the doped regions 140 may be spaced away from the interface between the outer spacers 134 and the outer gates 106 by a distance 184 between 0 and 10 nanometers.
  • the interface material 141 is omitted from FIGS. 57 and 58 for ease of illustration.
  • FIG. 59 is a flow diagram of an illustrative method 1000 of manufacturing a quantum dot device, in accordance with various embodiments. Although the operations discussed below with reference to the method 1000 are illustrated in a particular order and depicted once each, these operations may be repeated or performed in a different order (e.g., in parallel), as suitable. Additionally, various operations may be omitted, as suitable. Various operations of the method 1000 may be illustrated with reference to one or more of the
  • the method 1000 may be used to manufacture any suitable quantum dot device (including any suitable ones of the embodiments disclosed herein).
  • a quantum well stack may be provided on a substrate.
  • the quantum well stack may include a quantum well layer.
  • a quantum well stack 146 including a quantum well layer 152 may be provided on a substrate 144 (e.g., as discussed above with reference to FIGS. 4-5 and 37- 39).
  • At 1004 at least some of the quantum well stack may be removed to form fins that include the quantum well layer.
  • at least some of the quantum well stack 146 may be removed to form fins 104 that include the quantum well layer 152 (e.g. as discussed above with reference to FIGS. 6 and 40-46).
  • a first insulating material may be provided between the fins.
  • the insulating material 128 may be provided between the fins 104 (e.g., as discussed above with reference to FIG. 7).
  • gates may be formed on the fins.
  • multiple gates 106 may be formed on the fins 104 (e.g., as discussed above with reference to FIGS. 11-13 and 51).
  • a magnet line may be provided.
  • the magnet line may be spaced apart from the gates by a second insulating material.
  • a magnet line 121 may be spaced apart from the gates 106/108 by the insulating material 130 (e.g., as discussed above with reference to FIGS. 24-31).
  • FIGS. 60-61 are flow diagrams of particular illustrative methods 1020 and 1040, respectively, of operating a quantum dot device, in accordance with various embodiments. Although the operations discussed below with reference to the methods 1020 and 1040 are illustrated in a particular order and depicted once each, these operations may be repeated or performed in a different order (e.g., in parallel), as suitable. Additionally, various operations may be omitted, as suitable. Various operations of the methods 1020 and 1040 may be illustrated with reference to one or more of the embodiments discussed above, but the methods 1020 and 1040 may be used to operate any suitable quantum dot device (including any suitable ones of the embodiments disclosed herein).
  • one or more voltages may be applied to one or more gates on a first fin to cause a first quantum dot to form in the first fin.
  • the first fin may extend away from a base.
  • one or more voltages may be applied to the gates 106/108 on a fin 104-1 (extending away from the base 102) to cause at least one quantum dot 142 to form in the fin 104-1.
  • a current pulse may be applied to a magnet line in the quantum dot device to influence a spin state of the first quantum dot.
  • a current pulse may be applied to one or more magnet lines 121 to influence a spin state of one or more quantum dots 142.
  • a voltage may be applied to a first gate disposed on a fin to cause a first quantum dot to form in a first quantum well in the fin under the first gate.
  • the fin may extend away from a base, and an insulating material is disposed on side faces of the fin.
  • a voltage may be applied to the gate 108-1 disposed on a fin 104 to cause a first quantum dot 142 to form in the quantum well layer 152 in the fin 104 under the gate 108-1.
  • the fin 104 may extend away from the base 102, and the insulating material 128 may be disposed on side faces of the fin 104.
  • a voltage may be applied to a second gate disposed on the fin to cause a second quantum dot to form in a second quantum well in the fin under the second gate.
  • a voltage may be applied to the gate 108-2 disposed on the fin 104 to cause a second quantum dot 142 to form in the quantum well layer 152 in the fin 104 under the gate 108-2.
  • a voltage may be applied to a third gate disposed on the fin to (1) cause a third quantum dot to form in a third quantum well in the fin under the third gate or (2) provide a potential barrier between the first quantum well and the second quantum well.
  • a voltage may be applied to the gate 106-2 to (1) cause a third quantum dot 142 to form in the quantum well layer 152 in the fin 104 (e.g., when the gate 106-2 acts as a "plunger” gate) or (2) provide a potential barrier between the first quantum well (under the gate 108-1) and the second quantum well (under the gate 108-2) (e.g., when the gate 106-2 acts as a "barrier" gate).
  • a current pulse may be applied to a magnet line to influence spin states of the quantum dots in the fin.
  • a current pulse may be applied to one or more magnet lines 121 to influence spin states of one or more quantum dots 142 in the fin 104.
  • FIG. 62 is a block diagram of an example quantum computing device 2000 that may include any of the quantum dot devices disclosed herein.
  • a number of components are illustrated in FIG. 62 as included in the quantum computing device 2000, but any one or more of these components may be omitted or duplicated, as suitable for the application.
  • some or all of the components included in the quantum computing device 2000 may be attached to one or more printed circuit boards (e.g., a motherboard).
  • various ones of these components may be fabricated onto a single system-on-a-chip (SoC) die.
  • SoC system-on-a-chip
  • the quantum computing device 2000 may not include one or more of the quantum computing device 2000.
  • the quantum computing device 2000 may include interface circuitry for coupling to the one or more components.
  • the quantum computing device 2000 may not include a display device 2006, but may include display device interface circuitry (e.g., a connector and driver circuitry) to which a display device 2006 may be coupled.
  • the quantum computing device 2000 may not include an audio input device 2024 or an audio output device 2008, but may include audio input or output device interface circuitry (e.g., connectors and supporting circuitry) to which an audio input device 2024 or audio output device 2008 may be coupled.
  • the quantum computing device 2000 may include a processing device 2002 (e.g., one or more processing devices).
  • processing device e.g., one or more processing devices.
  • the term "processing device” or “processor” may refer to any device or portion of a device that processes electronic data from registers and/or memory to transform that electronic data into other electronic data that may be stored in registers and/or memory.
  • the processing device 2002 may include a quantum processing device 2026 (e.g., one or more quantum processing devices), and a non-quantum processing device 2028 (e.g., one or more non-quantum processing devices).
  • the quantum processing device 2026 may include one or more of the quantum dot devices 100 disclosed herein, and may perform data processing by performing operations on the quantum dots that may be generated in the quantum dot devices 100, and monitoring the result of those operations. For example, as discussed above, different quantum dots may be allowed to interact, the quantum states of different quantum dots may be set or transformed, and the quantum states of quantum dots may be read (e.g., by another quantum dot).
  • the quantum processing device 2026 may be a universal quantum processor, or specialized quantum processor configured to run one or more particular quantum algorithms. In some embodiments, the quantum processing device 2026 may execute algorithms that are particularly suitable for quantum computers, such as cryptographic algorithms that utilize prime factorization, encryption/decryption, algorithms to optimize chemical reactions, algorithms to model protein folding, etc.
  • the quantum processing device 2026 may also include support circuitry to support the processing capability of the quantum processing device 2026, such as input/output channels, multiplexers, signal mixers, quantum amplifiers, and analog-to-digital converters.
  • the quantum processing device 2026 may include circuitry (e.g., a current source) to provide current pulses to one or more magnet lines 121 included in the quantum dot device 100.
  • the processing device 2002 may include a non-quantum processing device 2028.
  • the non-quantum processing device 2028 may provide peripheral logic to support the operation of the quantum processing device 2026.
  • the non-quantum processing device 2028 may control the performance of a read operation, control the performance of a write operation, control the clearing of quantum bits, etc.
  • the non-quantum processing device 2028 may also perform conventional computing functions to supplement the computing functions provided by the quantum processing device 2026.
  • the non-quantum processing device 2028 may interface with one or more of the other components of the quantum computing device 2000 (e.g., the communication chip 2012 discussed below, the display device 2006 discussed below, etc.) in a conventional manner, and may serve as an interface between the quantum processing device 2026 and conventional components.
  • the non-quantum processing device 2028 may include one or more digital signal processors (DSPs), application-specific integrated circuits (ASICs), central processing units (CPUs), graphics processing units (GPUs), cryptoprocessors (specialized processors that execute cryptographic algorithms within hardware), server processors, or any other suitable processing devices.
  • DSPs digital signal processors
  • ASICs application-specific integrated circuits
  • CPUs central processing units
  • GPUs graphics processing units
  • cryptoprocessors specialized processors that execute cryptographic algorithms within hardware
  • server processors or any other suitable processing devices.
  • the quantum computing device 2000 may include a memory 2004, which may itself include one or more memory devices such as volatile memory (e.g., dynamic random access memory (DRAM )), nonvolatile memory (e.g., read-only memory (ROM)), flash memory, solid state memory, and/or a hard drive.
  • volatile memory e.g., dynamic random access memory (DRAM )
  • nonvolatile memory e.g., read-only memory (ROM)
  • flash memory solid state memory
  • solid state memory solid state memory
  • hard drive solid state memory
  • the states of qubits in the quantum processing device 2026 may be read and stored in the memory 2004.
  • the memory 2004 may include memory that shares a die with the non-quantum processing device 2028. This memory may be used as cache memory and may include embedded dynamic random access memory (eDRAM) or spin transfer torque magnetic random-access memory (STT-M RAM ).
  • eDRAM embedded dynamic random access memory
  • STT-M RAM spin transfer torque magnetic random-access memory
  • the quantum computing device 2000 may include a cooling apparatus 2030.
  • the cooling apparatus 2030 may maintain the quantum processing device 2026 at a predetermined low temperature during operation to reduce the effects of scattering in the quantum processing device 2026. This predetermined low temperature may vary depending on the setting; in some embodiments, the temperature may be 5 degrees Kelvin or less.
  • the non- quantum processing device 2028 (and various other components of the quantum computing device 2000) may not be cooled by the cooling apparatus 2030, and may instead operate at room temperature.
  • the cooling apparatus 2030 may be, for example, a dilution refrigerator, a helium-3 refrigerator, or a liquid helium refrigerator.
  • the quantum computing device 2000 may include a communication chip 2012 (e.g., one or more communication chips).
  • the communication chip 2012 may be configured for managing wireless communications for the transfer of data to and from the quantum computing device 2000.
  • wireless and its derivatives may be used to describe circuits, devices, systems, methods, techniques, communications channels, etc., that may communicate data through the use of modulated electromagnetic radiation through a nonsolid medium. The term does not imply that the associated devices do not contain any wires, although in some embodiments they might not.
  • the communication chip 2012 may implement any of a number of wireless standards or protocols, including but not limited to Institute for Electrical and Electronic Engineers (IEEE) standards including Wi-Fi (IEEE 1402.11 family), I EEE 1402.16 standards (e.g., I EEE 1402.16-2005 Amendment), Long-Term Evolution (LTE) project along with any amendments, updates, and/or revisions (e.g., advanced LTE project, ultramobile broadband (UM B) project (also referred to as "3GPP2”), etc.).
  • IEEE 1402.16 compatible Broadband Wireless Access (BWA) networks are generally referred to as WiMAX networks, an acronym that stands for Worldwide Interoperability for Microwave Access, which is a certification mark for products that pass conformity and
  • the communication chip 2012 may operate in accordance with a Global System for Mobile Communication (GSM), General Packet Radio Service (GPRS), Universal Mobile Telecommunications System (UMTS), High Speed Packet Access (HSPA), Evolved HSPA (E-HSPA), or LTE network.
  • GSM Global System for Mobile Communication
  • GPRS General Packet Radio Service
  • UMTS Universal Mobile Telecommunications System
  • High Speed Packet Access HSPA
  • E-HSPA Evolved HSPA
  • LTE LTE network.
  • the communication chip 2012 may operate in accordance with Enhanced Data for GSM Evolution (EDGE), GSM EDGE Radio Access Network (GERAN), Universal Terrestrial Radio Access Network (UTRAN), or Evolved UTRAN (E-UTRAN).
  • EDGE Enhanced Data for GSM Evolution
  • GERAN GSM EDGE Radio Access Network
  • UTRAN Universal Terrestrial Radio Access Network
  • E-UTRAN Evolved UTRAN
  • the communication chip 2012 may operate in accordance with Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Evolution-Data Optimized (EV-DO), and derivatives thereof, as well as any other wireless protocols that are designated as 3G, 4G, 5G, and beyond.
  • CDMA Code Division Multiple Access
  • TDMA Time Division Multiple Access
  • DECT Digital Enhanced Cordless Telecommunications
  • EV-DO Evolution-Data Optimized
  • the communication chip 2012 may operate in accordance with other wireless protocols in other embodiments.
  • the quantum computing device 2000 may include an antenna 2022 to facilitate wireless communications and/or to receive other wireless
  • the communication chip 2012 may manage wired communications, such as electrical, optical, or any other suitable communication protocols (e.g., the Ethernet).
  • the communication chip 2012 may include multiple communication chips. For instance, a first communication chip 2012 may be dedicated to shorter-range wireless
  • a second communication chip 2012 may be dedicated to longer-range wireless communications such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, EV-DO, or others.
  • a first communication chip 2012 may be dedicated to wireless communications, and a second communication chip 2012 may be dedicated to wired communications.
  • the quantum computing device 2000 may include battery/power circuitry 2014.
  • the battery/power circuitry 2014 may include one or more energy storage devices (e.g., batteries or capacitors) and/or circuitry for coupling components of the quantum computing device 2000 to an energy source separate from the quantum computing device 2000 (e.g., AC line power).
  • the quantum computing device 2000 may include a display device 2006 (or corresponding interface circuitry, as discussed above).
  • the display device 2006 may include any visual indicators, such as a heads-up display, a computer monitor, a projector, a touchscreen display, a liquid crystal display (LCD), a light-emitting diode display, or a flat panel display, for example.
  • LCD liquid crystal display
  • the quantum computing device 2000 may include an audio output device 2008 (or corresponding interface circuitry, as discussed above).
  • the audio output device 2008 may include any device that generates an audible indicator, such as speakers, headsets, or earbuds, for example.
  • the quantum computing device 2000 may include an audio input device 2024 (or corresponding interface circuitry, as discussed above).
  • the audio input device 2024 may include any device that generates a signal representative of a sound, such as microphones, microphone arrays, or digital instruments (e.g., instruments having a musical instrument digital interface (M IDI) output).
  • M IDI musical instrument digital interface
  • the quantum computing device 2000 may include a global positioning system (GPS) device 2018 (or corresponding interface circuitry, as discussed above).
  • GPS global positioning system
  • the GPS device 2018 may be in communication with a satellite-based system and may receive a location of the quantum computing device 2000, as known in the art.
  • the quantum computing device 2000 may include an other output device 2010 (or corresponding interface circuitry, as discussed above).
  • Examples of the other output device 2010 may include an audio codec, a video codec, a printer, a wired or wireless transmitter for providing information to other devices, or an additional storage device.
  • the quantum computing device 2000 may include an other input device 2020 (or corresponding interface circuitry, as discussed above).
  • Examples of the other input device 2020 may include an accelerometer, a gyroscope, a compass, an image capture device, a keyboard, a cursor control device such as a mouse, a stylus, a touchpad, a bar code reader, a Quick Response (QR) code reader, any sensor, or a radio frequency identification (RFID) reader.
  • RFID radio frequency identification
  • the quantum computing device 2000 may have any appropriate form factor, such as a hand-held or mobile computing device (e.g., a cell phone, a smart phone, a mobile internet device, a music player, a tablet computer, a laptop computer, a netbook computer, an ultrabook computer, a personal digital assistant (PDA), an ultramobile personal computer, etc.), a desktop computing device, a server or other networked computing component, a printer, a scanner, a monitor, a set-top box, an entertainment control unit, a vehicle control unit, a digital camera, a digital video recorder, or a wearable computing device.
  • a hand-held or mobile computing device e.g., a cell phone, a smart phone, a mobile internet device, a music player, a tablet computer, a laptop computer, a netbook computer, an ultrabook computer, a personal digital assistant (PDA), an ultramobile personal computer, etc.
  • PDA personal digital assistant
  • Example 1 is a quantum dot device, including: a base; a fin extending away from the base, wherein the fin includes a quantum well layer; a gate disposed on the fin; and a magnet line disposed proximate to the fin.
  • Example 2 may include the subject matter of Example 1, and may further specify that the magnet line includes a portion that is oriented parallel to a longitudinal axis of the fin.
  • Example 3 may include the subject matter of any of Examples 1-2, and may further specify that the magnet line includes a portion that is oriented perpendicular to a longitudinal axis of the fin.
  • Example 4 may include the subject matter of any of Examples 1-3, and may further specify that the magnet line is non-coplanar with the fin.
  • Example 5 may include the subject matter of any of Examples 1-4, and may further specify that the magnet line is at least partially coplanar with the gate.
  • Example 6 may include the subject matter of any of Examples 1-5, and may further specify that the magnet line is formed of copper.
  • Example 7 may include the subject matter of any of Examples 1-6, and may further specify that the magnet line is spaced away from the gate by a distance between 25 nanometers and 1 micron.
  • Example 8 may include the subject matter of Example 7, and may further specify that the magnet line is spaced away from the gate by a distance between 50 nanometers and 200 nanometers.
  • Example 9 may include the subject matter of any of Examples 1-8, and may further specify that the magnet line has a thickness between 25 and 100 nanometers.
  • Example 10 may include the subject matter of any of Examples 1-9, and may further include circuitry to provide a current pulse to the magnet line.
  • Example 11 may include the subject matter of any of Examples 1-10, and may further specify that the fin is a first fin, the gate is a first gate, and the quantum dot device further includes: a second fin extending away from the base, wherein the second fin includes a quantum well layer; and a second gate disposed on the second fin.
  • Example 12 may include the subject matter of any of Examples 1-11, and may further specify that the fin has a tapered shape that is widest proximate to the base.
  • Example 13 may include the subject matter of any of Examples 1-12, and may further specify that the gate is a first gate, and the quantum dot device further includes a second gate disposed on the fin.
  • Example 14 is a method of operating a quantum dot device, including: applying one or more voltages to one or more gates on a first fin to cause a first quantum dot to form in the first fin, wherein the first fin extends away from a base; and applying a current pulse to a magnet line in the quantum dot device to influence a spin state of the first quantum dot.
  • Example 15 may include the subject matter of Example 14, and may further include:
  • Example 16 may include the subject matter of Example 15, and may further include:
  • Example 17 may include the subject matter of Example 16, and may further specify that applying the current pulse to the magnet line influences a spin state of the third quantum dot.
  • Example 18 may include the subject matter of any of Examples 16-17, and may further specify that allowing the first and third quantum dots to interact comprises applying the one or more voltages to the one or more gates on the first fin to control interaction between the first and third quantum dots.
  • Example 19 is a method of manufacturing a quantum dot device, including: providing a quantum well stack on a substrate, wherein the quantum well stack includes a quantum well layer; removing at least some of the quantum well stack to form fins, wherein the fins include the quantum well layer; providing a first insulating material between the fins; forming gates on top of the fins; and providing a magnet line spaced apart from the gates by a second insulating material.
  • Example 20 may include the subject matter of Example 19, and may further specify that the first and second insulating materials are different insulating materials.
  • Example 21 may include the subject matter of any of Examples 19-20, and may further specify that the magnet line is formed of a magnetic material.
  • Example 22 may include the subject matter of any of Examples 19-21, and may further specify that providing the magnet line includes: forming a trench in the second insulating material; and providing a conductive material in the trench.
  • Example 23 is a quantum computing device, including: a quantum processing device, wherein the quantum processing device includes a first fin in parallel with a second fin, an insulating material disposed between the first fin and the second fin, an active quantum well layer in the first fin, a read quantum well layer in the second fin, and at least one magnet line proximate to the active quantum well layer; a non-quantum processing device, coupled to the quantum processing device, to control voltages applied to gates on the first and second fin; and a memory device to store data generated by the read quantum well layer during operation of the quantum processing device.
  • Example 24 may include the subject matter of Example 23, and may further include a cooling apparatus to maintain a temperature of the quantum processing device below 5 degrees Kelvin.
  • Example 25 may include the subject matter of any of Examples 23-24, and may further specify that the quantum processing device is to provide a current pulse to the magnet line to influence spin states of multiple quantum dots in the active quantum well layer.

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Abstract

L'invention concerne des dispositifs à points quantiques comprenant des portes formant des motifs, ainsi que des dispositifs et procédés de calcul associés. Par exemple, dans certains modes de réalisation, un dispositif à points quantiques peut comprendre : une base; une ailette s'étendant à l'écart de la base, l'ailette comprenant une couche de puits quantique; une ou plusieurs portes disposées sur l'ailette; et une ligne magnetique disposée à proximité de l'ailette.
PCT/US2016/036831 2016-06-10 2016-06-10 Dispositifs á points quantiques á lignes magnétiques WO2017213661A1 (fr)

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US11417755B2 (en) 2018-01-08 2022-08-16 Intel Corporation Differentially strained quantum dot devices
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US11177912B2 (en) 2018-03-06 2021-11-16 Intel Corporation Quantum circuit assemblies with on-chip demultiplexers
US11355623B2 (en) 2018-03-19 2022-06-07 Intel Corporation Wafer-scale integration of dopant atoms for donor- or acceptor-based spin qubits
US11183564B2 (en) 2018-06-21 2021-11-23 Intel Corporation Quantum dot devices with strain control
US11417765B2 (en) 2018-06-25 2022-08-16 Intel Corporation Quantum dot devices with fine-pitched gates
US10910488B2 (en) 2018-06-26 2021-02-02 Intel Corporation Quantum dot devices with fins and partially wrapped gates
US11335778B2 (en) 2018-06-26 2022-05-17 Intel Corporation Quantum dot devices with overlapping gates
US10879446B2 (en) 2018-08-14 2020-12-29 Intel Corporation Vertical flux bias lines coupled to vertical squid loops in superconducting qubits
US11424324B2 (en) 2018-09-27 2022-08-23 Intel Corporation Multi-spacers for quantum dot device gates
US11450765B2 (en) 2018-09-27 2022-09-20 Intel Corporation Quantum dot devices with diodes for electrostatic discharge protection
US11616126B2 (en) 2018-09-27 2023-03-28 Intel Corporation Quantum dot devices with passive barrier elements in a quantum well stack between metal gates
US11749721B2 (en) 2018-09-28 2023-09-05 Intel Corporation Gate walls for quantum dot devices
US11658212B2 (en) 2019-02-13 2023-05-23 Intel Corporation Quantum dot devices with conductive liners
US11699747B2 (en) 2019-03-26 2023-07-11 Intel Corporation Quantum dot devices with multiple layers of gate metal
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US11011693B2 (en) 2019-06-24 2021-05-18 Intel Corporation Integrated quantum circuit assemblies for cooling apparatus
US11957066B2 (en) 2019-09-04 2024-04-09 Intel Corporation Stackable in-line filter modules for quantum computing
US11387324B1 (en) 2019-12-12 2022-07-12 Intel Corporation Connectivity in quantum dot devices

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