WO2017210263A1 - High pressure ammonia nitridation of tunnel oxide for 3dnand applications - Google Patents

High pressure ammonia nitridation of tunnel oxide for 3dnand applications Download PDF

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Publication number
WO2017210263A1
WO2017210263A1 PCT/US2017/035151 US2017035151W WO2017210263A1 WO 2017210263 A1 WO2017210263 A1 WO 2017210263A1 US 2017035151 W US2017035151 W US 2017035151W WO 2017210263 A1 WO2017210263 A1 WO 2017210263A1
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Prior art keywords
chamber
processing chamber
processing
atm
injection assembly
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PCT/US2017/035151
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French (fr)
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Christopher S. Olsen
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Applied Materials Inc
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Applied Materials Inc
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Priority to CN201780033161.2A priority Critical patent/CN109196621B/en
Priority to KR1020187038055A priority patent/KR102228219B1/en
Priority to JP2018562292A priority patent/JP6759366B2/en
Priority to KR1020207033510A priority patent/KR102306570B1/en
Publication of WO2017210263A1 publication Critical patent/WO2017210263A1/en
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
    • C23C8/36—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases using ionised gases, e.g. ionitriding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
    • H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H10D64/01332—Making the insulator
    • H10D64/01336—Making the insulator on single crystalline silicon, e.g. chemical oxidation using a liquid
    • H10D64/01344—Making the insulator on single crystalline silicon, e.g. chemical oxidation using a liquid in a nitrogen-containing ambient, e.g. N2O oxidation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6518—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by introduction of substances into an already-existing insulating layer
    • H10P14/6519—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by introduction of substances into an already-existing insulating layer the substance being oxygen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6529—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a gas or vapour
    • H10P14/6532—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a gas or vapour by exposure to a plasma
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/20—Diffusion for doping of insulating layers
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
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    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/074—Manufacture or treatment of dielectric parts thereof of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H10W20/076—Manufacture or treatment of dielectric parts thereof of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers in via holes or trenches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H10W20/089—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/093—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts
    • H10W20/096—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts by contacting with gases, liquids or plasmas

Definitions

  • Embodiments disclosed herein generally related to system for forming a semiconductor structure, and a method of doing the same.
  • Multilevel interconnect technology provides the conductive paths throughout an IC device, and are formed in high aspect ratio features including contacts, plugs, vias, lines, wires, and other features.
  • a typical method for forming an interconnect on a substrate includes depositing one or more layers, etching at least one of the layer(s) to form one or more features, depositing a barrier layer in the feature(s), and depositing one or more layers to fill the feature.
  • a feature (or via) is formed in an oxide material disposed on a substrate.
  • Plasma nitridation has been used to nitride (i.e., incorporate nitrogen into) the oxide layer. This technique results in high nitrogen concentration on a surface of the oxide layer. As the demand for higher aspect ratios increase, it becomes increasingly more difficult to nitride the oxide layer. This is due to a combination of the average lifetime of the nitrogen compounds used in conventional nitridation processes, and the depth of the features in higher aspect ratios. Conventional processes are unable to adequately nitride the entire feature formed in the oxide layer.
  • Embodiments disclosed herein generally related to system for forming a semiconductor structure.
  • the processing chamber includes a chamber body, a substrate support device, a quartz envelope, one or more heating devices, a gas injection assembly, and a pump device.
  • the chamber body defines an interior volume.
  • the substrate support device is configured to support one or more substrates during processing.
  • the quartz envelope is disposed in the processing chamber.
  • the quartz envelope is configured to house the substrate support device.
  • the heating devices are disposed about the quartz envelope.
  • the gas injection assembly is coupled to the processing chamber.
  • the gas injection assembly is configured to provide an NH3 gas to the interior volume of the processing chamber.
  • the pump device is coupled to the processing chamber.
  • the pump device is configured to maintain the processing chamber at a pressure of at least 10 atm.
  • a system for forming a semiconductor structure includes a transfer chamber and a plurality of processing chambers.
  • the plurality of processing chambers is coupled to the transfer chamber.
  • At least one of the plurality of processing chambers includes a chamber body, a substrate support device, a quartz envelope, one or more heating devices, a gas injection assembly, and a pump device.
  • the chamber body defines an interior volume.
  • the substrate support device is configured to support one or more substrates during processing.
  • the quartz envelope is disposed in the processing chamber.
  • the quartz envelope is configured to house the substrate support device.
  • the heating devices are disposed about the quartz envelope.
  • the gas injection assembly is coupled to the processing chamber.
  • the gas injection assembly is configured to provide an NH3 gas to the interior volume of the processing chamber.
  • the pump device is coupled to the processing chamber.
  • the pump device is configured to maintain the processing chamber at a pressure of at least 10 atm.
  • a method of forming a semiconductor structure on a substrate is formed herein.
  • An oxide layer is formed on the surface of the substrate.
  • a via is formed in the oxide layer. The via extends at least partially into the oxide layer.
  • the oxide layer is exposed to NH3.
  • the chamber pressure is maintained at a pressure of at least 10 atm while the oxide layer is exposed to NH3.
  • Figure 1 is a schematic view of an integrated tool 100 for processing semiconductor substrates in which embodiments of the disclosure may be practiced.
  • Figure 2 is a cross-sectional view of a plasma nitridation chamber, according to one embodiment.
  • Figure 3 is a flow diagram that illustrates a method of forming a semiconductor device, according to one embodiment.
  • Figures 4A-4C illustrate cross-sectional views of a substrate at different stages of the method of Figure 3.
  • Figure 1 is a schematic view of an integrated tool 100 for processing semiconductor substrates in which embodiments of the disclosure may be practiced.
  • suitable integrated tools include the CENTURA® and ENDURA® integrated tools, all available from Applied Materials, Inc. of Santa Clara, California. It is contemplated that the methods described herein may be practiced in other tools having the requisite process chambers coupled thereto, including those from other manufacturers.
  • the integrated processing tool 100 includes a vacuum-tight processing platform 101 , a factory interface 104, and a system controller 102.
  • the platform 101 has a plurality of processing chambers 1 14A-1 14D and loadlock chambers 106A- 106B that are coupled to a vacuum substrate transfer chamber 103.
  • the factory interface 104 is coupled to the transfer chamber 103 by the loadlock chambers 106A-106B.
  • the factory interface 104 includes at least one docking station 107 and at least one factory interface robot 138.
  • the docking station 107 is configured to accept one or more front opening unified pods (FOUPs).
  • FOUPs 105A-105D are shown in the embodiment of Figure 1.
  • the factory interface robot 138 is configured to transfer substrates in the factory interface 104 between the FOUPs 105A-105D and the loadlock chambers 106A-106B.
  • the loadlock chambers 106A-106B have a first port coupled to the factory interface 104 and a second port coupled to the transfer chamber 103.
  • the loadlock chambers 106A-106B are coupled to a pressure control system (not shown) which pumps down and vents the chambers 106A-106B to facilitate passing the substrate between the vacuum environment of the transfer chamber 103 and the substantially ambient (e.g., atmospheric) environment of the factory interface,
  • the transfer chamber 103 has a vacuum robot 1 13 disposed therein.
  • the vacuum robot 1 13 is capable of transferring substrates 121 between the loadlock chamber 106A-106B and the processing chambers 1 14A-1 14D.
  • the processing chambers coupled to the transfer chamber 103 may be a chemical vapor deposition (CVD) chamber 1 14D, a plasma nitridation chamber 1 14C, a rapid thermal process (RTP) chamber 1 14B, or an atomic layer deposition (ALD) chamber 1 14A.
  • the particular chambers shown coupled to the transfer chamber 103 are examples of chambers that may be coupled to the transfer chamber 103.
  • different processing chambers including at least one of ALD, CVD, metal organic chemical vapor deposition (MOCVD), physical vapor deposition (PVD), plasma nitridation, or RTP chambers may be interchangeably incorporated into the integrated processing tool 100 in accordance with process requirements.
  • the system controller 102 is coupled to the integrated processing tool 100.
  • the system controller 102 controls the operation of the integrated processing tool 100 by direct control of the processing chambers 1 14A-1 14D of the integrated processing tool 100, or alternatively, by controlling the computers (or controllers) associated with the processing chambers 1 14A-1 14D of the integrated processing tool 100.
  • the system controller 102 enables data collection and feedback from the respective chambers and system to optimize performance of the integrated processing tool 100.
  • the system controller 102 generally includes a central processing unit (CPU) 130, memory 136, and support circuit 132.
  • the CPU 130 may be one of any form of a general purpose computer processor that can be used in an industrial setting.
  • the support circuits 132 are conventionally coupled to the CPU 130 and may comprise cache, clock circuits, input/output subsystems, power supplies, and the like.
  • the software routines when executed by the CPU 130 transform the CPU into a specific purpose computer (controller) and enable processes, such as the method described in conjunction with Figure 3, to be performed on the integrated processing tool 100.
  • the software routines may also be stored and/or executed by a second controller (not shown) that is located remotely from the integrated processing tool 100.
  • FIG. 2 is a cross-sectional view of a plasma nitridation chamber 1 14C according to one embodiment.
  • the plasma nitridation chamber 1 14C includes a chamber body 202 defining an interior volume 204.
  • the plasma nitridation chamber 1 14C further includes a quartz envelope 206.
  • the quartz envelope 206 is configured to house a substrate support device 208.
  • the substrate support device 208 is configured to support one or more substrates 201 in the plasma nitridation chamber 1 14C.
  • the substrate support device 208 is configured to support one or more substrates 201 in a vertical orientation in the quartz envelope 206.
  • the plasma nitridation chamber 1 14C further includes a plurality of heating elements 210.
  • the plurality of heating elements 210 is positioned about the quartz envelope 206.
  • the plurality of heating elements 210 is configured to heat the quartz envelope 206 to a desired temperature.
  • the plurality of heating elements 210 may heat the quartz envelope 206 to a temperature between 600°C and 1 ,200° ⁇
  • the plasma nitridation chamber 1 14C may further include a gas injection assembly 212 coupled to a gas source 216, a pump device 214, and an exhaust assembly 218.
  • the gas injection assembly 212 is configured to provide a gas to the interior volume 204 of the chamber 1 14C.
  • the gas source 216 is configured to provide NH3 gas to the interior volume 204 and inside the quartz envelope 206, such that the nitridation rate of the one or more substrates 201 is increased.
  • the NH 3 gas may be provided, in neat (i.e. 100%), concentrated (i.e. 50% up to 100%), or dilute (i.e.
  • the pump device 214 is coupled to the nitridation chamber 1 14C, in communication with the interior volume 204.
  • the pump device 214 is configured to control a pressure of the interior volume 204 of the chamber 1 14C.
  • the pump device 214 is configured to maintain a pressure of between 10-20 atmospheres (atm) while the gas injection assembly 212 provides NH 3 gas to the interior volume 204.
  • the exhaust assembly 218 may be disposed on an opposite side of the chamber 1 14C from the gas injection assembly 212.
  • the exhaust assembly 218 is configured to remove the NH 3 gas from the chamber 1 14C.
  • the plasma nitridation chamber 1 14C may further include a temperature control device 220.
  • the temperature control device 220 is configured to control a temperature of the chamber body 202 of the chamber 1 14C during processing.
  • the temperature control device may be in the form of thermal shield plates coupled to the chamber body 202.
  • the temperature control device 220 is in the form of a cooling channel 222 formed in the chamber body 202.
  • the cooling channel 222 is configured to flow a heat transfer fluid through the chamber body 202, to control the temperature of the chamber body 202 during processing.
  • FIG. 3 is a flow diagram that illustrates a method 300 of forming a semiconductor device 400, according to one embodiment.
  • Figures 4A -4D illustrate cross-sectional views of a substrate 401 at different stages of the method 300 of Figure 3.
  • Figure 4A depicts the substrate 401 without any layers deposited thereon.
  • the method 300 begins at block 302.
  • an oxide layer 402 is formed on the substrate 401.
  • the oxide layer 402 may be formed from Si0 2 .
  • the oxide layer 402 may be formed on the substrate 401 in a process chamber such as one of the processing chambers 1 14A-1 14D in Figure 1.
  • the oxide layer 402 may be formed in the RADIANCE® system, available from Applied Materials, Inc.
  • the oxide layer 402 may be deposited on the substrate 401 through CVD, rapid thermal-CVD (RT-CVD), plasma enhanced-CVD (PECVD), physical vapor deposition (PVD), ALD, or combinations thereof.
  • the oxide layer 402 may have a thickness between about 1 .5 nm to about 3 nm.
  • a via 404 is formed in the Oxide layer 402, as shown in Figure 4C.
  • the via 404 may extend partially into the Oxide layer 402, from a top surface 406 of the Oxide layer.
  • the substrate 401 having the Oxide layer 402 deposited thereon is transferred to a plasma nitridation chamber, such as the plasma nitridation chamber 1 14C, to undergo a nitridation process.
  • a plasma nitridation chamber such as the plasma nitridation chamber 1 14C
  • the oxygen on the surface of the oxide layer 402 is replaced by nitrogen.
  • about 40% of the oxygen in the oxide layer 402 is replaced with nitrogen.
  • NH 2 and NH have been used for nitridation processes. Due to the higher electronegativity of oxygen compared to nitrogen, highly reactive species are typically used to displace oxygen in such processes.
  • N * NH 2 , and NH have however proven to be too unstable to live long enough to travel down the high aspect ratio features in the Oxide layer and conformally nitride the feature.
  • the nitriding species need to survive one or more wall contact events without sticking, reacting, or extinguishing. Reduced reactivity species, or species having lower sticking coefficient, are needed.
  • NH 2 and NH may quickly relax back to N 2 and H 2 when they react with the oxide, resulting in a short residence time in the via 404.
  • the average lifetime of NH 2 and NH may be about 10 ms.
  • the substrate is exposed to NH 3 , as shown in Figure 4D.
  • the reaction of NH 3 and SiO 2 yields:
  • the temperature needed to drive the reaction forward is at least 600 ° C. In one embodiment, the temperature is about 1000 °C.
  • the NH3 is provided to the substrate at a flow rate of about 1 sLm to 20 sLm, for example 10 sLm. As noted above, the NH3 may be provided in neat, concentrated, or dilute form. The NH 3 is configured to travel to a bottom 408 of the via 404.
  • the processing chamber is maintained at a pressure of at least 10 atm while the substrate is exposed to NH 3 .
  • the pressure of the processing chamber is maintained at a pressure between 10 atm and 20 atm.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
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  • Metallurgy (AREA)
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  • Formation Of Insulating Films (AREA)
  • Chemical Vapour Deposition (AREA)
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  • Plasma & Fusion (AREA)

Abstract

Embodiments disclosed herein generally related to system for forming a semiconductor structure. The processing chamber includes a chamber body, a substrate support device, a quartz envelope, one or more heating devices, a gas injection assembly, and a pump device. The chamber body defines an interior volume. The substrate support device is configured to support one or more substrates during processing. The quartz envelope is disposed in the processing chamber. The quartz envelope is configured to house the substrate support device. The heating devices are disposed about the quartz envelope. The gas injection assembly is coupled to the processing chamber. The gas injection assembly is configured to provide an NH?3#191 gas to the interior volume of the processing chamber. The pump device is coupled to the processing chamber. The pump device is configured to maintain the processing chamber at a pressure of at least 10 atm.

Description

HIGH PRESSURE AMMONIA NITRIDATION OF TUNNEL OXIDE FOR 3DNAND
APPLICATIONS
BACKGROUND
[0001] Field
[0002] Embodiments disclosed herein generally related to system for forming a semiconductor structure, and a method of doing the same.
[0003] Description of the Related Art
[0004] As the structure size of integrated circuit (IC) devices is scaled down to sub- quarter micron dimensions, electrical resistance, and current densities have become an area for concern and improvement. Multilevel interconnect technology provides the conductive paths throughout an IC device, and are formed in high aspect ratio features including contacts, plugs, vias, lines, wires, and other features. A typical method for forming an interconnect on a substrate includes depositing one or more layers, etching at least one of the layer(s) to form one or more features, depositing a barrier layer in the feature(s), and depositing one or more layers to fill the feature. Typically, a feature (or via) is formed in an oxide material disposed on a substrate.
[0005] Plasma nitridation has been used to nitride (i.e., incorporate nitrogen into) the oxide layer. This technique results in high nitrogen concentration on a surface of the oxide layer. As the demand for higher aspect ratios increase, it becomes increasingly more difficult to nitride the oxide layer. This is due to a combination of the average lifetime of the nitrogen compounds used in conventional nitridation processes, and the depth of the features in higher aspect ratios. Conventional processes are unable to adequately nitride the entire feature formed in the oxide layer.
[0006] Thus, an improved processing chamber and method for forming a semiconductor structure are needed. SUMMARY
[0007] Embodiments disclosed herein generally related to system for forming a semiconductor structure. The processing chamber includes a chamber body, a substrate support device, a quartz envelope, one or more heating devices, a gas injection assembly, and a pump device. The chamber body defines an interior volume. The substrate support device is configured to support one or more substrates during processing. The quartz envelope is disposed in the processing chamber. The quartz envelope is configured to house the substrate support device. The heating devices are disposed about the quartz envelope. The gas injection assembly is coupled to the processing chamber. The gas injection assembly is configured to provide an NH3 gas to the interior volume of the processing chamber. The pump device is coupled to the processing chamber. The pump device is configured to maintain the processing chamber at a pressure of at least 10 atm.
[0008] In another embodiment, a system for forming a semiconductor structure is disclosed herein. The system includes a transfer chamber and a plurality of processing chambers. The plurality of processing chambers is coupled to the transfer chamber. At least one of the plurality of processing chambers includes a chamber body, a substrate support device, a quartz envelope, one or more heating devices, a gas injection assembly, and a pump device. The chamber body defines an interior volume. The substrate support device is configured to support one or more substrates during processing. The quartz envelope is disposed in the processing chamber. The quartz envelope is configured to house the substrate support device. The heating devices are disposed about the quartz envelope. The gas injection assembly is coupled to the processing chamber. The gas injection assembly is configured to provide an NH3 gas to the interior volume of the processing chamber. The pump device is coupled to the processing chamber. The pump device is configured to maintain the processing chamber at a pressure of at least 10 atm.
[0009] In another embodiment, a method of forming a semiconductor structure on a substrate is formed herein. An oxide layer is formed on the surface of the substrate. A via is formed in the oxide layer. The via extends at least partially into the oxide layer. The oxide layer is exposed to NH3. The chamber pressure is maintained at a pressure of at least 10 atm while the oxide layer is exposed to NH3.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this disclosure and are therefore not to be considered limiting of its scope, for the disclosure may admit to other equally effective embodiments.
[0011] Figure 1 is a schematic view of an integrated tool 100 for processing semiconductor substrates in which embodiments of the disclosure may be practiced.
[0012] Figure 2 is a cross-sectional view of a plasma nitridation chamber, according to one embodiment.
[0013] Figure 3 is a flow diagram that illustrates a method of forming a semiconductor device, according to one embodiment.
[0014] Figures 4A-4C illustrate cross-sectional views of a substrate at different stages of the method of Figure 3.
[0015] For clarity, identical reference numerals have been used, where applicable, to designate identical elements that are common between figures. Additionally, elements of one embodiment may be advantageously adapted for utilization in other embodiments described herein.
DETAILED DESCRIPTION
[0016] Figure 1 is a schematic view of an integrated tool 100 for processing semiconductor substrates in which embodiments of the disclosure may be practiced. Examples of suitable integrated tools include the CENTURA® and ENDURA® integrated tools, all available from Applied Materials, Inc. of Santa Clara, California. It is contemplated that the methods described herein may be practiced in other tools having the requisite process chambers coupled thereto, including those from other manufacturers.
[0017] The integrated processing tool 100 includes a vacuum-tight processing platform 101 , a factory interface 104, and a system controller 102. The platform 101 has a plurality of processing chambers 1 14A-1 14D and loadlock chambers 106A- 106B that are coupled to a vacuum substrate transfer chamber 103. The factory interface 104 is coupled to the transfer chamber 103 by the loadlock chambers 106A-106B.
[0018] In one embodiment, the factory interface 104 includes at least one docking station 107 and at least one factory interface robot 138. The docking station 107 is configured to accept one or more front opening unified pods (FOUPs). Four FOUPs 105A-105D are shown in the embodiment of Figure 1. The factory interface robot 138 is configured to transfer substrates in the factory interface 104 between the FOUPs 105A-105D and the loadlock chambers 106A-106B.
[0019] The loadlock chambers 106A-106B have a first port coupled to the factory interface 104 and a second port coupled to the transfer chamber 103. The loadlock chambers 106A-106B are coupled to a pressure control system (not shown) which pumps down and vents the chambers 106A-106B to facilitate passing the substrate between the vacuum environment of the transfer chamber 103 and the substantially ambient (e.g., atmospheric) environment of the factory interface,
[0020] The transfer chamber 103 has a vacuum robot 1 13 disposed therein. The vacuum robot 1 13 is capable of transferring substrates 121 between the loadlock chamber 106A-106B and the processing chambers 1 14A-1 14D.
[0021] In one embodiment, the processing chambers coupled to the transfer chamber 103 may be a chemical vapor deposition (CVD) chamber 1 14D, a plasma nitridation chamber 1 14C, a rapid thermal process (RTP) chamber 1 14B, or an atomic layer deposition (ALD) chamber 1 14A. The particular chambers shown coupled to the transfer chamber 103 are examples of chambers that may be coupled to the transfer chamber 103. Alternatively, different processing chambers, including at least one of ALD, CVD, metal organic chemical vapor deposition (MOCVD), physical vapor deposition (PVD), plasma nitridation, or RTP chambers may be interchangeably incorporated into the integrated processing tool 100 in accordance with process requirements.
[0022] The system controller 102 is coupled to the integrated processing tool 100. The system controller 102 controls the operation of the integrated processing tool 100 by direct control of the processing chambers 1 14A-1 14D of the integrated processing tool 100, or alternatively, by controlling the computers (or controllers) associated with the processing chambers 1 14A-1 14D of the integrated processing tool 100. In operation, the system controller 102 enables data collection and feedback from the respective chambers and system to optimize performance of the integrated processing tool 100.
[0023] The system controller 102 generally includes a central processing unit (CPU) 130, memory 136, and support circuit 132. The CPU 130 may be one of any form of a general purpose computer processor that can be used in an industrial setting. The support circuits 132 are conventionally coupled to the CPU 130 and may comprise cache, clock circuits, input/output subsystems, power supplies, and the like. The software routines when executed by the CPU 130 transform the CPU into a specific purpose computer (controller) and enable processes, such as the method described in conjunction with Figure 3, to be performed on the integrated processing tool 100. The software routines may also be stored and/or executed by a second controller (not shown) that is located remotely from the integrated processing tool 100.
[0024] Figure 2 is a cross-sectional view of a plasma nitridation chamber 1 14C according to one embodiment. The plasma nitridation chamber 1 14C includes a chamber body 202 defining an interior volume 204. The plasma nitridation chamber 1 14C further includes a quartz envelope 206. The quartz envelope 206 is configured to house a substrate support device 208. The substrate support device 208 is configured to support one or more substrates 201 in the plasma nitridation chamber 1 14C. In the embodiment shown in Figure 2, the substrate support device 208 is configured to support one or more substrates 201 in a vertical orientation in the quartz envelope 206.
[0025] The plasma nitridation chamber 1 14C further includes a plurality of heating elements 210. The plurality of heating elements 210 is positioned about the quartz envelope 206. The plurality of heating elements 210 is configured to heat the quartz envelope 206 to a desired temperature. For example, the plurality of heating elements 210 may heat the quartz envelope 206 to a temperature between 600°C and 1 ,200°σ
[0026] The plasma nitridation chamber 1 14C may further include a gas injection assembly 212 coupled to a gas source 216, a pump device 214, and an exhaust assembly 218. The gas injection assembly 212 is configured to provide a gas to the interior volume 204 of the chamber 1 14C. In one embodiment, the gas source 216 is configured to provide NH3 gas to the interior volume 204 and inside the quartz envelope 206, such that the nitridation rate of the one or more substrates 201 is increased. The NH3 gas may be provided, in neat (i.e. 100%), concentrated (i.e. 50% up to 100%), or dilute (i.e. <50%) form, at a flow rate of 1 sLm to 20 sLm, for example 10 sl_n The pump device 214 is coupled to the nitridation chamber 1 14C, in communication with the interior volume 204. The pump device 214 is configured to control a pressure of the interior volume 204 of the chamber 1 14C. For example, the pump device 214 is configured to maintain a pressure of between 10-20 atmospheres (atm) while the gas injection assembly 212 provides NH3 gas to the interior volume 204. The exhaust assembly 218 may be disposed on an opposite side of the chamber 1 14C from the gas injection assembly 212. The exhaust assembly 218 is configured to remove the NH3 gas from the chamber 1 14C.
[0027] The plasma nitridation chamber 1 14C may further include a temperature control device 220. The temperature control device 220 is configured to control a temperature of the chamber body 202 of the chamber 1 14C during processing. In one embodiment, the temperature control device may be in the form of thermal shield plates coupled to the chamber body 202. In the embodiment illustrated in Figure 1 , the temperature control device 220 is in the form of a cooling channel 222 formed in the chamber body 202. The cooling channel 222 is configured to flow a heat transfer fluid through the chamber body 202, to control the temperature of the chamber body 202 during processing.
[0028] Figure 3 is a flow diagram that illustrates a method 300 of forming a semiconductor device 400, according to one embodiment. Figures 4A -4D illustrate cross-sectional views of a substrate 401 at different stages of the method 300 of Figure 3. Figure 4A depicts the substrate 401 without any layers deposited thereon. The method 300 begins at block 302. At block 302, an oxide layer 402 is formed on the substrate 401. In one embodiment, the oxide layer 402 may be formed from Si02. The oxide layer 402 may be formed on the substrate 401 in a process chamber such as one of the processing chambers 1 14A-1 14D in Figure 1. For example, the oxide layer 402 may be formed in the RADIANCE® system, available from Applied Materials, Inc. The oxide layer 402 may be deposited on the substrate 401 through CVD, rapid thermal-CVD (RT-CVD), plasma enhanced-CVD (PECVD), physical vapor deposition (PVD), ALD, or combinations thereof. In one embodiment, the oxide layer 402 may have a thickness between about 1 .5 nm to about 3 nm.
[0029] At block 304, a via 404 is formed in the Oxide layer 402, as shown in Figure 4C. The via 404 may extend partially into the Oxide layer 402, from a top surface 406 of the Oxide layer.
[0030] At block 306, the substrate 401 having the Oxide layer 402 deposited thereon, is transferred to a plasma nitridation chamber, such as the plasma nitridation chamber 1 14C, to undergo a nitridation process. During the nitridation process, the oxygen on the surface of the oxide layer 402 is replaced by nitrogen. In one embodiment, about 40% of the oxygen in the oxide layer 402 is replaced with nitrogen. Conventionally, NH2 and NH have been used for nitridation processes. Due to the higher electronegativity of oxygen compared to nitrogen, highly reactive species are typically used to displace oxygen in such processes. N* NH2, and NH have however proven to be too unstable to live long enough to travel down the high aspect ratio features in the Oxide layer and conformally nitride the feature. To penetrate to the bottom of such features at concentrations that support conformal nitridation, the nitriding species need to survive one or more wall contact events without sticking, reacting, or extinguishing. Reduced reactivity species, or species having lower sticking coefficient, are needed. NH2 and NH may quickly relax back to N2 and H2 when they react with the oxide, resulting in a short residence time in the via 404. For example, the average lifetime of NH2 and NH may be about 10 ms. Additionally, it is difficult to lower reactivity and yet still have sufficient energy to nitride the oxide. By substituting NH3 for NH and NH2, the conformal nitridation process with a high temperature NH3 is driven by the partial pressure of NH3, and enhances the nitridation process. It has been found that while increases in processing temperature and processing time increase the number of nitrogen atoms in NH3 incrementally, the increase in pressure, particularly the increase in partial pressure, of NH3 during processing increases the number of nitrogen atoms at a greater rate.
[0031] At block 306, the substrate is exposed to NH3, as shown in Figure 4D. The reaction of NH3 and SiO2 yields:
NH3 + Si02→ SiON + H20
[0032] The temperature needed to drive the reaction forward is at least 600 ° C. In one embodiment, the temperature is about 1000 °C. The NH3 is provided to the substrate at a flow rate of about 1 sLm to 20 sLm, for example 10 sLm. As noted above, the NH3 may be provided in neat, concentrated, or dilute form. The NH3 is configured to travel to a bottom 408 of the via 404.
[0033] At block 308, the processing chamber is maintained at a pressure of at least 10 atm while the substrate is exposed to NH3. In one embodiment, the pressure of the processing chamber is maintained at a pressure between 10 atm and 20 atm. [0034] While the foregoing is directed to specific embodiments, other and further embodiments may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

What is claimed is:
1 . A processing chamber, comprising:
a chamber body defining an interior volume;
a substrate support device configured to support one or more substrates during processing;
a quartz envelope disposed in the processing chamber, the quartz envelop configured to house the substrate support device;
one or more heating devices disposed about the quartz envelope;
a gas injection assembly coupled to the processing chamber, the gas injection assembly configured to provide an NH3 gas to the interior volume of the processing chamber; and
a pump device coupled to the processing chamber, the pump device configured to maintain the processing chamber at a pressure of at least 10 atm.
2. The processing chamber of claim 1 , wherein the pump device is configured to maintain the processing chamber at a pressure between about 10 atm and 20 atm.
3. The processing chamber of claim 1 , further comprising:
a temperature control device configured to control a temperature of the chamber body.
4. The processing chamber of claim 3, wherein the temperature control device is a cooling channel formed in the chamber body, the cooling channel configured to flow a heating transfer fluid through the chamber body.
5. The processing chamber of claim 1 , further comprising:
a single chamber door located at an end of the processing chamber, configured to provide ingress and egress for the substrate support device.
6. The processing chamber of claim 1 , wherein the gas injection assembly supplies the NH3 gas to an interior volume of the quartz envelope.
7. The processing chamber of claim 1 , wherein the one or more substrates include a silicon dioxide (Si02) layer formed thereon.
8. A system for processing a substrate, comprising:
a transfer chamber; and
a plurality of processing chambers coupled to the transfer chamber, wherein at least one of the plurality of processing chambers comprises:
a chamber body defining an interior volume;
a substrate support device configured to support one or more substrates during processing;
a quartz envelope disposed in the processing chamber, the quartz envelop configured to house the substrate support device;
one or more heating devices disposed about the quartz envelope; a gas injection assembly coupled to the processing chamber, the gas injection assembly configured to provide an NH3 gas to the interior volume of the processing chamber; and
a pump device coupled to the processing chamber, the pump device configured to maintain the processing chamber at a pressure of at least 10 atm.
9. The system of claim 8, wherein the pump device is configured to maintain the processing chamber at a pressure between about 10 atm and 20 atm.
10. The system of claim 8, wherein the at least one of the processing chambers further comprises:
a temperature control device configured to control a temperature of the chamber body.
1 1 . The system of claim 10, wherein the temperature control device is a cooling channel formed in the chamber body, the cooling channel configured to flow a heating transfer fluid through the chamber body.
12. The system of claim 8, wherein the at least one of the processing chambers further comprises:
a single chamber door located at an end of the processing chamber, configured to provide ingress and egress for the substrate support device.
13. The system of claim 8, wherein the gas injection assembly supplies the NH3 gas to an interior volume of the quartz envelope.
14. The system of claim 8, wherein the one or more substrates include a silicon dioxide (Si02) layer formed thereon.
15. A method of forming a semiconductor structure, comprising:
forming an oxide layer on a surface of a substrate;
forming a via in the oxide layer, the via extending at least partially into the oxide layer;
exposing the oxide layer to NH3; and
maintaining a chamber pressure of at least 10 atm while exposing the oxide layer to NH3.
PCT/US2017/035151 2016-06-01 2017-05-31 High pressure ammonia nitridation of tunnel oxide for 3dnand applications Ceased WO2017210263A1 (en)

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