WO2017207141A1 - Module électronique pour unité de commande de transmission comportant un couvercle collé sur un film de plaquette de circuits imprimés fr4 - Google Patents

Module électronique pour unité de commande de transmission comportant un couvercle collé sur un film de plaquette de circuits imprimés fr4 Download PDF

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Publication number
WO2017207141A1
WO2017207141A1 PCT/EP2017/058139 EP2017058139W WO2017207141A1 WO 2017207141 A1 WO2017207141 A1 WO 2017207141A1 EP 2017058139 W EP2017058139 W EP 2017058139W WO 2017207141 A1 WO2017207141 A1 WO 2017207141A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
foil
lid
electronic module
Prior art date
Application number
PCT/EP2017/058139
Other languages
German (de)
English (en)
Inventor
Uwe Liskow
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2017207141A1 publication Critical patent/WO2017207141A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers

Definitions

  • Gearbox control unit The invention further relates to a transmission control unit with such an electronic module and to a method for manufacturing an electronic module.
  • Electronic modules are used for various technical purposes e.g. used for electrical control of processes.
  • An electronic module generally has electrical or electronic components such as ICs (Integrated Circuits), resistors,
  • vehicle electronics modules are among others as
  • Transmission control units used to control functions of a transmission In this case, an electronic module is preferably mounted inside a transmission.
  • a flexible conductor foil (sometimes also referred to as flex foil) was arranged between the plastic lid and a carrier plate carrying the structural components.
  • a flexible conductor foil has electrically conductive
  • Conductor tracks usually metallic interconnects, on which between two thin plastic films, usually made of polyimide, are added.
  • the plastic lid was then mechanically fixed to the carrier plate,
  • a circumferential seal for example in the form of a sealing ring, was arranged between the plastic cover and the flexible conductor foil passed between it and the carrier plate.
  • Embodiments of the present invention may advantageously enable to provide an electronic module in which building components are reliably and long term protected against attack by aggressive media. Furthermore, such an electronic module can be manufactured relatively simply and / or inexpensively. According to a first aspect of the present invention is a
  • Electronic module proposed for a transmission control unit, which has a support plate, arranged on the support plate electronics unit and a lid.
  • the support plate and the cover together surround an interior in which the electronic unit is accommodated.
  • the PCB foil has a carrier film and arranged on the carrier film conductor tracks.
  • the conductor tracks of the printed circuit board foil are connected to electrical connections of the electronic unit.
  • the edge of the lid is glued to the printed circuit board film by means of a potting compound.
  • a second aspect of the invention relates to a transmission control apparatus having an electronic module according to an embodiment of the first aspect of the invention.
  • a third aspect of the invention relates to a method for manufacturing a
  • An electronic module comprising the steps of: a carrier plate, an electronics unit, a lid and an annular circuit board film are provided.
  • the printed circuit board film has a carrier film and printed conductors arranged on the carrier film.
  • the printed circuit board foil is fastened to the carrier plate.
  • the conductor tracks arranged on the carrier foil are connected to electrical terminals of the electronic unit.
  • the lid is adhered to the annular printed circuit board film by means of a potting compound along an edge d surrounding a ring-shaped surrounding area.
  • the printed circuit board film has a carrier film and printed conductors arranged on this carrier film.
  • the printed circuit board film corresponds in terms of its construction of a conventional circuit board, but is typically thinner than a conventional printed circuit board for space reasons.
  • the printed circuit board foil may have a thickness in the range of between
  • conductor tracks may for example consist of metal, in particular of copper.
  • Such conductor tracks may typically have thicknesses in the range of ⁇ to 0.5 mm, preferably in the range of 18 to 400 ⁇ .
  • At least the carrier film, but preferably also the printed conductors applied thereon, are formed with a material which can be glued together well with common casting compounds.
  • annular printed circuit board film need not necessarily be integral.
  • a ring mold can also optionally by joining several printed circuit board parts, such as two
  • L-shaped printed circuit board parts can be achieved. Shock surfaces at which these printed circuit board film parts adjoin one another can optionally be glued together using the casting compound and additionally sealed.
  • the carrier film of the printed circuit board film is formed with so-called FR4 material.
  • FR4 material is a composite of epoxy resin and fiberglass fabric and is typically used for printed circuit boards used in electronics. With processes known from printed circuit board electronics, a thin layer of metal, in particular copper, can be applied to a surface of an FR4 film or a thin plate made of FR4 material and subsequently structured in such a way that a plurality of conductor tracks are formed. FR4 material can be bonded very well with common encapsulants used in electronics production.
  • the potting compound can be formed with epoxy resin, polyurethane (PU) or acrylate.
  • Epoxy resin-based potting compounds have proven to be very well suited for the hermetically sealed and long-term stable bonding of printed circuit board films, especially if they consist of FR4 material.
  • the epoxy-based potting compound can be particularly resistant, e.g. across from
  • epoxy resin has a similar thermal expansion coefficient (CTE) as the materials used for the printed circuit board film, in particular the preferred FR4 material and the printed conductors applied thereon.
  • CTE thermal expansion coefficient
  • Adhesives made of PU or acrylate can be used as alternative potting compounds, especially if no particularly good resistance to certain aggressive medium such as gear oil is required.
  • the electronic module further has at least one further contacting, preferably a flexible conductor foil, which is arranged outside the lid.
  • Conductor tracks of the printed circuit board foil are electrically connected to conductor tracks of the at least one further contacting, in particular of the flexible conductor foil.
  • the WeinerCount ist z. B. also be a ribbon cable.
  • the printed circuit board film can preferably serve, by means of their interconnects, an electrical connection between the in the of the Lid covered interior to accommodate recorded electronics unit and an external environment.
  • the printed circuit board film is carried out between the lid and the carrier plate. Outside the lid, it may be advantageous to effect a further electrical connection by means of conventionally used flexible conductor foils. Circuits of this flexible conductor foil can be electrically connected to conductor tracks of the printed circuit foil, for example by local soldering, welding or other techniques.
  • the flexible conductor foils can, for example, be routed to sensors or electrical connections arranged outside the cover.
  • the flexible conductor foils differ from the
  • Printed circuit board film in particular with regard to the material used for a carrier film or two conductor tracks. While FR4 material is preferably used for the printed circuit board film, carrier films of the flexible conductor films are usually made of polyimide.
  • the electronics module outside the lid on a plurality of spatially separated from each other flexible conductor foils.
  • a single annular printed circuit board foil with its various conductor tracks, can indeed ensure that electrical connections from the electronics unit are made to the outside from the interior space enclosed by the cover. There, however, then several separate flexible conductor foils can be used to the electrical
  • Each of the flexible conductor foils can be relatively narrow and, for example, only a single or a few
  • Conductive films can thus be used sparingly. In particular, during their production, an accumulating waste can be kept low.
  • the potting compound preferably covers a region in which a flexible conductor foil laterally adjoins the printed circuit board foil.
  • the potting compound should advantageously be applied sufficiently large area, so that they not only glued the lid with the directly underlying PCB foil, but also laterally further outwards and there has a transition at which the subsequent to the PCB foil flexible conductor foil , also covered and can have a sealing effect.
  • the carrier plate has a groove adjacent to the inner space covered by the lid and the potting compound extends into this groove.
  • a recess may be formed on the carrier plate, preferably in a region between the electronic unit and the edge of the lid, which forms a groove.
  • the potting compound is applied in such a large area in this case that it is not only temporarily stored in the area directly between the edge of the lid and the underlying support plate, but also laterally further inwards to the groove and extends into the groove. In this case, the potting compound also covers an edge of the printed circuit board film and can thus be further improved
  • the conductor tracks of the printed circuit board foil are in each case connected to the electrical connections of the electronic unit
  • Bond connections connected are standard in electronics manufacturing and have proven to be well suited for connecting the electronics unit to the circuit board film.
  • a bonding connection is effected by means of a small wire or ribbon, one end of which is bonded to an electrical terminal of the electronics unit and the other end of which is bonded to an exposed area of a printed circuit board trace.
  • CTE coefficient of thermal expansion
  • the conductor tracks of the printed circuit board film are arranged on the carrier film with a pitch of less than 3.6 mm, preferably less than 2.6 mm or even less than 1.3 mm.
  • the pitch can be understood in this case, a distance between the centerlines of adjacent tracks
  • PCB film can be formed with customary for the production of printed circuit boards processes such as photolithography and thereby relatively narrow and closely spaced from each other can be made.
  • interconnects necessary for the electrical connection of the TCU can thus be provided with a much smaller pitch. Flexibility in the layout of a
  • Electronic module can thereby be significantly increased.
  • the carrier plate has a multi-part construction and has an electronics carrier plate carrying the electronic unit and a module carrier plate which surrounds this electronic carrier plate in an annular manner.
  • the electronics carrier plate and the module carrier plate may differ, for example, with regard to materials and / or geometries used.
  • the electronics carrier plate can be optimized, for example, for the heat dissipation of components mounted on it, in particular the electronics unit.
  • Electronics carrier plate may be smaller or larger than a projection of the attached over the carrier plate lid.
  • the electronics carrier plate can only be loosely connected to the module carrier plate or be stably integrated in it.
  • Fig. 1 shows a sectional view through a conventional electronic module.
  • Fig. 2 illustrates a flexible conductor foil for a conventional one
  • Fig. 3 shows a sectional view through an inventive electronic module.
  • Fig. 4 illustrates a printed circuit board film and flexible conductor foils for use in the electronic module according to the invention.
  • FIGS. 5 to 8 illustrate sectional views of various stages of a method of manufacturing an electronic module according to one embodiment of the present invention
  • FIG 9 illustrates in partial section an electronic module according to an alternative embodiment of the present invention.
  • FIGS. 1 and 2 To better understand electronic modules, a conventional electronic module 101 will first be described with reference to FIGS. 1 and 2. The
  • Electronic module 101 has a two-part support plate 103 with a Electronics carrier plate 102 and a module carrier plate 104. On the
  • Electronics carrier plate is an electronics unit 105 applied.
  • Electronic unit 105 is electrically contacted laterally via flexible conductor foils 109 whose conductor tracks 111 (see FIG. 2) each over
  • Bond connections 113 are connected to terminals 115 of the electronic unit 105. At opposite ends, the tracks of the flexible conductor sheets 109 contact electrical terminals 108 or sensors 110.
  • a plastic lid 118 is mounted thereover. Edges 120 or flanks of this plastic cover 118 are sealed by means of a sealing ring 122 with respect to the flexible conductor foil 109 which is carried out between the plastic lid 118 and the carrier plate 103.
  • the flexible conductor foil 109 has to follow the edge 120 of the plastic lid 108 along its entire length
  • the flexible conductor sheet 109 should have a corresponding annular portion.
  • a corresponding contour has thus far mostly been cut out of a large-area flexible conductor foil, as shown in FIGS. 2 (b) and 2 (c).
  • this results in a considerable waste which among other things increases the production costs for the electronic module.
  • Fig. 3 is an electronic module 1 according to an embodiment of the
  • a support plate 3 is in turn formed in two parts with electronics support plate 2 and module support plate 4. On the
  • Electronics carrier plate 2 is an electronics unit 5 glued.
  • a cover 19 made of steel covers an interior space 23 in which the electronics unit 5
  • This printed circuit board film 7 has a carrier film 25 made of FR4 material and conductor tracks 26 arranged on this carrier film 25 and running essentially radially outwards.
  • the interconnects 26 are in turn electrically connected via connections 13 with terminals 15 of the electronic unit 5. Outside the lid 19 conductor tracks 26 of the
  • Printed circuit board film 7 with provided there relatively small-area flexible conductor foils 9 and their interconnects 11 may be connected to ultimately make electrical contact with plugs 8 or sensors 10 can.
  • Printed circuit board film 7 with provided there relatively small-area flexible conductor foils 9 and their interconnects 11 may be connected to ultimately make electrical contact with plugs 8 or sensors 10 can.
  • Potting compound 27 is preferably formed of epoxy resin.
  • Potting compound 27 may also be provided as a kind of paint.
  • Potting compound 27 adheres a downwardly directed surface of the edge 20 of the lid 19 with the printed circuit board film 7. Since the preferably made of FR4 material carrier film 25 of the printed circuit board film 7 adheres very well to the preferably epoxy resin-based potting compound 27 and this
  • Potting compound 27 in turn very well adheres to the steel cover 19, a total of very good sealing of the interior 23 can be achieved. Also, the thermal expansion coefficients of the materials of all these
  • Components are well matched so that the seal can withstand even severe temperature fluctuations without damage.
  • a region opposite the annular peripheral edge 20 of the lid 19 can be formed by the annular printed circuit board film 7. From this radially outgoing, several elongated narrow flexible conductor foils 9 can lead to the connectors 8 and sensors 10. Tracks 11 of the flexible
  • Conductor foil 9 can thereby contact conductor tracks 26 of the printed circuit board foil 7, for example by being soldered or welded together locally. In terms of area, substantially less flexible conductor foil 9 is required than was necessary in conventional electronic modules (see FIG. 2)
  • Cut contours for the narrow conductor foils 9 can be optimized so that a waste is relatively low.
  • the annular conductor foil can also consist of more than one part, for. B. from 2 L-shaped conductor foils, the joint is preferably filled with the potting compound 27, which may result in a tightness as in an uninterrupted circulating conductor foil.
  • a flexible conductor foil 9 is connected to a circuit board foil 7.
  • Lötstopplack be provided as a protective layer (see Fig. 5).
  • the structure thus formed for example, by means of an adhesive 31 or an adhesive tape, which may be formed using epoxy resin adhesive, on the support plate 3 and its electronic carrier plate
  • the electronics unit 5 is also glued, for example by using quarterleitkleber. Then, the conductor tracks 26 of the printed circuit board film 7 with terminals 15 of the electronic unit 5 by
  • Bond connections 13 electrically connected (see Fig. 7).
  • the potting compound 27 is applied to the printed circuit board film 7.
  • the potting compound 27 is preferably distributed along the entire annular printed circuit board film 7 and then the lid 19 is pressed in such a way that its annular rim 20 dips into the potting compound 27. After hardening or crosslinking of the potting compound 27, a permanent and tight connection between the cover 19 and the printed circuit board 3 applied to the printed circuit board film 7 can be effected in this way.
  • the potting compound 27 also covers the connection points between the printed circuit board film 7 and the radially further outwardly arranged flexible conductor films 9, so that it at this transition and in particular at the Soldering of the conductor 11 of the conductor foil 9 with the conductor tracks 26 of the printed circuit board film 7 comes to a further seal.
  • Potting compound 27 preferably also cover the contact point at which the
  • Bond connection 13 is connected to the conductor tracks 26 of the printed circuit board film 7.
  • the potting compound 27 extends even further in the direction of the electronics unit 5 until it reaches the electronics carrier plate 2 and seals an adhesive edge there between the printed circuit board film 7 and the electronics carrier plate 2.
  • an annular circumferential groove 33 is provided in this area, into which the potting compound 27 can extend. Thus, it can also come in this area to an additional encapsulation of the printed circuit board film 7 and attacking electrical connections.
  • Embodiment is a printed circuit board film 7 on its underside to a
  • Support plate 3 glued and covered at its top by a potting compound 27.
  • the circuit board film 7 is not connected in a region outside the lid 19 as in the previous embodiment with flexible conductor films 9, but placed around an edge of the support plate 3 and continued to the bottom of the support plate 3.
  • the there exposed down conductor tracks 26 of the printed circuit board film 7 can then be applied to a provided there circuit board 37 or alternatively a stamped grid or a flexible conductor foil, for example, soldered or glued be.
  • areas of printed circuit board film 7 not protected by potting compound 27 can be protected by means of a locally applied solder mask 39.
  • the lid 19, which covers the electronic unit 5, can be glued very efficiently and durable to the rest of the structure while a hermetically sealed and durable connection can be achieved.
  • a cost reduction due to the lower cut of flexible conductor foil 9 appears possible while maintaining the positive properties of, for example, a polyimide conductor foil.
  • a reduction in height can be achieved compared to conventional electronic modules.
  • bare-die electronics can preferably be used, which allows very high temperatures and small installation spaces.
  • the bare-die electronics can be implemented without direct Molden, since
  • Molds typically contain alpha-ray fillers which could otherwise damage the microelectronics. Further possible advantages, such as, for example, low mechanical loads in the event of temperature fluctuations due to the materials used for matching the thermal expansion coefficients are already mentioned above or obvious to the person skilled in the art.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

L'invention concerne un module électronique (1), destiné à une unité de commande de transmission, qui comporte une plaque de support (3), une unité électronique (5) disposée sur la plaque de support (3) et un couvercle (19). La plaque de support (3) et le couvercle (19) entourent conjointement un espace intérieur (23) dans lequel l'unité électronique (5) est logée. Le module électronique (1) est caractérisé en ce qu'un film de plaquette de circuits imprimés (7) de forme annulaire est intercalé entre un bord (20) du couvercle (19), entourant annulairement l'espace intérieur (23) et une région annulaire, faisant face au bord (20), d'une surface de la plaque de support (3). Le film de plaquette de circuits imprimés (7) comporte un film support (25), de préférence en matériau FR4, et des pistes conductrices (26) disposées sur le film support (25). Des pistes conductrices (26) du film de plaquette de circuits imprimés (7) sont reliées à des bornes électriques (15) de l'unité électronique (5). Le bord (20) du couvercle (19) est collé au film de plaquette de circuits imprimés (7) au moyen d'un matière d'enrobage (27), par exemple une résine époxy. Une encapsulation hermétique et durable de l'unité électronique (5) est rendue possible.
PCT/EP2017/058139 2016-05-31 2017-04-05 Module électronique pour unité de commande de transmission comportant un couvercle collé sur un film de plaquette de circuits imprimés fr4 WO2017207141A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016209485.8A DE102016209485A1 (de) 2016-05-31 2016-05-31 Elektronikmodul für ein Getriebesteuergerät mit auf FR4-Leiterplattenfolie verklebtem Deckel
DE102016209485.8 2016-05-31

Publications (1)

Publication Number Publication Date
WO2017207141A1 true WO2017207141A1 (fr) 2017-12-07

Family

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Application Number Title Priority Date Filing Date
PCT/EP2017/058139 WO2017207141A1 (fr) 2016-05-31 2017-04-05 Module électronique pour unité de commande de transmission comportant un couvercle collé sur un film de plaquette de circuits imprimés fr4

Country Status (2)

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DE (1) DE102016209485A1 (fr)
WO (1) WO2017207141A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006066983A1 (fr) * 2004-12-22 2006-06-29 Robert Bosch Gmbh Module de commande
EP1239710B1 (fr) 2001-03-06 2008-08-20 Conti Temic microelectronic GmbH Ensemble électronique
EP1882401B1 (fr) 2005-05-17 2012-06-13 Continental Automotive GmbH Unite de commande comprenant une carte de circuits imprimes souple

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1239710B1 (fr) 2001-03-06 2008-08-20 Conti Temic microelectronic GmbH Ensemble électronique
WO2006066983A1 (fr) * 2004-12-22 2006-06-29 Robert Bosch Gmbh Module de commande
EP1882401B1 (fr) 2005-05-17 2012-06-13 Continental Automotive GmbH Unite de commande comprenant une carte de circuits imprimes souple

Also Published As

Publication number Publication date
DE102016209485A1 (de) 2017-11-30

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