WO2017197738A1 - 改善电容器发声的装置及终端 - Google Patents

改善电容器发声的装置及终端 Download PDF

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Publication number
WO2017197738A1
WO2017197738A1 PCT/CN2016/088455 CN2016088455W WO2017197738A1 WO 2017197738 A1 WO2017197738 A1 WO 2017197738A1 CN 2016088455 W CN2016088455 W CN 2016088455W WO 2017197738 A1 WO2017197738 A1 WO 2017197738A1
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Prior art keywords
capacitor
contact
shield
terminal
sound emission
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PCT/CN2016/088455
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English (en)
French (fr)
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崔其晖
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中兴通讯股份有限公司
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Publication of WO2017197738A1 publication Critical patent/WO2017197738A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor

Definitions

  • This document relates to, but is not limited to, the field of terminal communication, and in particular to a device for improving the sounding of a capacitor and a terminal having the same.
  • MLCC multi-layer chip ceramic capacitor
  • the ceramic capacitor is a laminated capacitor, which is prone to piezoelectric effects, and is vibrated due to a change in voltage, so that it emits "noisy" noise.
  • the actual sound size is related to the size of the package, the package size, and the capacitance distribution.
  • the solutions in the related art can be roughly divided into the following four:
  • the use of large electrolytic capacitors is not easy to implement on mobile phones because of their high height and the large footprint of the motherboard.
  • the tantalum capacitor has a polarity and a large package size, and the safety is also worse than the ceramic capacitor.
  • many capacitor manufacturers have targeted anti-vibration products, even if they can improve the sound generation to a certain extent, they cannot be eradicated in essence, and there are also many restrictions on the use, such as high capacitance and internal capacitance change.
  • the orientation of the stack will make the package height higher, and on the other hand, the patch process is increased. Difficulty, on the other hand, the furnace temperature, stencil opening and the amount of tin are required, and it is very inconvenient for subsequent maintenance.
  • This paper proposes a device for improving the sound generation of capacitors, which can effectively improve the call noise.
  • An apparatus for improving sound emission of a capacitor comprising a shield, a contact, and a capacitor, the contact and the capacitor being received in the shield, the contact being respectively associated with the capacitor, and the shielding
  • the cover contacts such that the contact is pressed between the shield and the capacitor.
  • the contacts are respectively in contact with the capacitor and the shield cover:
  • a first side of the contact is on the top of the capacitor and a second side of the contact is on the inside of the shield.
  • the contact is non-conductive and is a flexible heat conductor.
  • the contact object comprises one or more of the following:
  • the first side of the contact is located at the top of the capacitor, the surface of the contact being close to the side of the capacitor is larger than the contact of the capacitor with the contact The surface area of the side.
  • the device for improving sound emission of the capacitor further includes a circuit board, and the end of the capacitor remote from the contact is electrically connected to the circuit board.
  • a terminal comprising means for improving the sounding of a capacitor, the means for improving the sounding of the capacitor comprising a shield, a contact, and a capacitor, the contact and the capacitor being received in the shield, the contacting Contacting the capacitor and the shield separately, The contact is pressed between the shield and the capacitor.
  • the contacts are respectively contacted with the capacitor and the shield cover:
  • a first side of the contact is on the top of the capacitor and a second side of the contact is on the inside of the shield.
  • the contact is non-conductive and is a flexible heat conductor.
  • the contact object includes one or more of the following:
  • the first side of the contact is located at the top of the capacitor, and the surface area of the contact near the capacitor is greater than the surface area of the capacitor near the contact side.
  • the device for improving sound emission of the capacitor further includes a circuit board, and the end of the capacitor remote from the contact is electrically connected to the circuit board.
  • the device for improving the sounding of a capacitor proposed in the present invention is that the contact and the capacitor are housed in the shield, and one end of the contact is located at the top of the capacitor, and the other end is located inside the shield, so that the contact is pressed between the shield and the capacitor.
  • the capacitor is fully contacted with the contact object and squeezed by the contact object to avoid "sniff" sound during the call, which has the effect of improving the sound generation of the capacitor, improves the user experience, and has a great application prospect.
  • FIG. 1 is a schematic diagram of a mobile phone call principle in related art
  • FIG. 2 is a schematic diagram of a voltage drop waveform of the RF power amplifier module of FIG. 1;
  • FIG. 3 is a schematic structural diagram of an apparatus for improving sound emission of a capacitor according to an embodiment of the present invention.
  • Figure 4 is a schematic view showing the combination of the shield cover and the contact of Figure 3, wherein Figure 4 is viewed from the inside of the device for improving the sound emission of the capacitor;
  • FIG. 5 is a schematic view showing the combination of the contact and the capacitor in FIG. 3.
  • FIG. 5 is a schematic view showing the combination of the contact and the capacitor in FIG. 3.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like should be understood broadly, and may be fixed connection, for example, or may be
  • the connection may be disassembled or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and may be an internal connection of two elements or an interaction relationship of two elements.
  • the meaning of the above terms in the embodiments of the present invention can be understood according to actual conditions.
  • the "upper” or “lower” of the first feature in the second feature may include direct contact of the first and second features, and may also include the first and the The two features are not in direct contact but are contacted by additional features between them.
  • the first feature “above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature, such as Figure 3 shows.
  • the first feature "below”, “below” and “below” the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
  • FIG. 1 is a schematic diagram of a mobile phone call principle in the related art.
  • the mobile phone call process involves a power supply, a power management module, an application processor, an RF power amplifier module, an antenna, a switch module, a filter module, and a radio frequency transmitting module.
  • Global System for Mobile Communications Global The System for Mobile Communication (GSM) system widely uses a combination of time division multiple access and frequency division multiple access.
  • Time division multiple access is in a fixed frequency band.
  • the wireless carrier is divided into several time division channels according to time (called time slot). Each user occupies one time slot and transmits and receives signals in corresponding time slots. Generally, 8 time slots are set at one frequency point, and signals are transmitted in time sharing.
  • One time slot is 0.577 milliseconds (ms), eight time slots are one frame, and one frame time is 4.615 ms. That is to say, at a certain fixed frequency point, the same user makes a call, and the information transmission is reflected on the signal waveform as a digital pulse with a period of 4.615 ms and a pulse width of 0.577 ms, and its working frequency is 217 Hz. . Therefore, when the GSM system talks, the RF Amplifier (PA) on the signal path will work periodically. When the PA is working, its working current is very large, and a large current is instantaneously extracted from the power supply, resulting in a large current. The power supply does not respond quickly and the voltage is pulled low. As shown in Fig.
  • FIG. 2 it is a schematic diagram of the voltage drop waveform of the RF power amplifier module.
  • the voltage drops from U2 to U1, and a voltage difference ⁇ U is formed, which causes a periodic drop of the entire power supply of the PA. , causing periodic charging and discharging of the multilayer ceramic capacitor placed on the power source. Due to its special laminated structure, under the action of the piezoelectric effect, it will oscillate. If there are many capacitors mounted on the power line, especially if there are many multilayer ceramic capacitors with large capacity and large capacity, multiple capacitors will sound together.
  • FIG. 3-5 is a schematic diagram of an apparatus for improving sound emission of a capacitor according to an embodiment of the present invention.
  • the device for improving the sound emission of the capacitor includes at least a shield case 1, a contact 2, a capacitor 3, and a circuit board 4, wherein the capacitor 3 is electrically connected to the circuit board 4, and the contact 2 is respectively connected to the capacitor 3 and the shield case. 1 contact.
  • the contact between the contact 2 and the capacitor 3 and the shield 1 can be in the manner shown in FIG. 3, that is, the contact 2 is located at the top of the capacitor 3 away from the end of the circuit board 4 (ie, the contact 2 as shown in FIG. 3).
  • the first side is connected to the top of the capacitor 3), and the shield cover 1 is disposed on the contact 2 (ie, the second side of the contact 2 is connected to the inner side of the shield as shown in FIG. 4) to contact the object 2 and the capacitor 3 is housed in the shield 1 . That is, after the shield 1 is covered, the contact 2 is pressed between the shield 1 and the capacitor 3. When talking, the capacitor 3 is in full contact with the contact 2 and is pressed by the contact 2 to avoid generation. "Zizi" sound, has a better effect of improving the sound of the capacitor 3, and improves the quality of the call.
  • the capacitor 3 is electrically connected to the circuit board 4, and may be electrically connected to the circuit board 4 through an end away from the contact 2. As shown in FIG. 3, when the top of the capacitor 3 is in contact with the contact 2, the capacitor 3 The bottom is the end away from the contact 2, at this time, the bottom of the capacitor 3 and the circuit board 4 Electrical connection is sufficient.
  • the contact 2 is a non-conductive flexible heat-conducting contact, that is, the contact 2 is non-conductive on the one hand to ensure the normal operation of the main board function, and is flexible on the other hand to ensure There is no damage to the capacitor 3 and the shield case 1 when in contact with. At the same time, the contact 2 has better heat dissipation to ensure that the temperature of the main board is not increased after being released.
  • the contact 2 may have elasticity.
  • the top surface of the contact 2 near the side of the shield 1 ie, the first side of the contact 2 in contact with the shield 1 in FIGS. 3 and 5
  • the bottom surface i.e., the side of the contact 2 in contact with the capacitor 3 in Figs. 3 and 5
  • the shape in which the contact 2 is recessed corresponds to the size and shape of the capacitor 3.
  • the contact 2 may include, but is not limited to, silica gel, foam, rubber, and the like.
  • the surface area of the contact 2 near the side of the capacitor 3 is larger than the surface area of the capacitor 3 near the side of the contact 2 (i.e., the top surface of the capacitor 3 in Fig. 5).
  • the contact 2 may be a regular shape such as a square body or a cylindrical body, or may be an irregular shape. Therefore, the first side of the contact 2 in contact with the capacitor 3 and the contact 2 are in contact with the shield case 1.
  • the second side is a different contact surface, and the embodiment of the present invention is not specifically limited herein.
  • one end of the contact 2 is located at the top of the capacitor 3, and the other end is located inside the shield 1, that is, the contact 2 is pressed between the capacitor 3 and the shield 1.
  • the contact 2 can also It is located between the capacitor 3 and other structural members, and the embodiment of the present invention is not specifically limited herein.
  • the capacitor 3 of the present embodiment is a multilayer chip ceramic capacitor (MLCC).
  • MLCC multilayer chip ceramic capacitor
  • the device for improving the sound emission of the capacitor provided by the embodiment of the present invention, after the shield cover 1 is covered, the contact 2 is pressed between the shield 1 and the capacitor 3. When the call is made, the capacitor 3 is in full contact with the contact 2 and is contacted.
  • the extrusion of the object 2 avoids the "sweet" sound, has the effect of improving the sound of the capacitor 3, improves the user experience, and has a large application prospect.
  • the embodiment of the invention further provides a terminal, the terminal comprising at least the above device for improving the sounding of the capacitor.
  • the terminal is a mobile phone.
  • the terminal can be any device with a call function.
  • the terminal with the improved capacitor sounding device provided by the embodiment of the invention has sufficient contact between the capacitor and the contact object to prevent the capacitor from oscillating when the call connection is established, thereby avoiding the occurrence of "sniff" sound, effectively
  • the problem of improving the sound of the capacitor is improved, and the quality of the call is provided.

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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

一种改善电容器发声的装置及具有该装置的终端，该装置包括屏蔽罩（1）、接触物（2）以及电容器（3），接触物（2）和电容器（3）收容于屏蔽罩（1）内，接触物（2）一端位于电容器（3）顶部，另一端位于屏蔽罩（1）内侧，使接触物（2）挤压于屏蔽罩（1）和电容器（3）之间。

Description

改善电容器发声的装置及终端 技术领域
本文涉及但不限于终端通讯领域，尤其涉及一种改善电容器发声的装置及具有该装置的终端。
背景技术
随着通讯技术的飞速发展，手机等移动终端具备了越来越多的功能，以满足用户在工作、生活、娱乐等方面的需要。尽管如此，手机的通话功能仍然是最重要的基本功能之一。然而，用户在接听电话时，在听筒中经常听到明显的“滋滋”声，不仅影响通话质量，也对用户的听力造成一定影响，极大地降低了用户体验。这种“滋滋”声来自于手机主板上的多层片式陶瓷电容器(MLCC)，MLCC是电子整机中主要的被动贴片元件之一，其具有高可靠、高精度、高集成高频率、智能化、低功耗、大容量、小型化和低成本等特点，使其在智能终端产品中有着广泛的应用。但是陶瓷电容属于叠层电容，容易发生压电效应，由于电压的变化而发生震动，以至于发出“滋滋”的噪声。实际的发声大小与容置大小、封装尺寸、以及电容分布情况有关。针对这一问题，相关技术中的解决方案大致可以分为以下四个：
1.增加很大的电解电容；
2.使用多个钽电容；
3.将电容垫高，尽量拜托电容与主板的联系；
4.改变电容内部叠层的排列方向，由横向改为竖向。
对于以上四个解决方案依然存在问题。例如，使用很大的电解电容，因其高度以及所占用主板面积均很大，不容易在手机上实现。而钽电容具有极性，且封装尺寸较大，在安全性上相较陶瓷电容也差的比较多。虽然很多电容厂家都有针对性的生产防震荡系列产品，即使能够在一定程度上改善发声情况，但并不能从本质上进行根除，而且使用上也存在诸多限制，如垫高电容和改变电容内部叠层排列方向会使封装高度较高，一方面增加了贴片工艺 难度，另一方面对炉温、钢网开孔及上锡量均有要求，而且非常不方便后续的维修。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本文提出一种改善电容器发声的装置，可以有效改善通话噪声。
本文提供的一种改善电容器发声的装置，包括屏蔽罩、接触物以及电容器，所述接触物和所述电容器收容于所述屏蔽罩内，所述接触物分别与所述电容器，以及所述屏蔽罩接触，使所述接触物挤压于所述屏蔽罩和所述电容器之间。
可选地，上述改善电容器发声的装置中，所述接触物分别与所述电容器，以及所述屏蔽罩接触指：
所述接触物的第一侧位于所述电容器顶部，所述接触物的第二侧位于所述屏蔽罩内侧。
可选地，上述改善电容器发声的装置中，所述接触物不导电且为柔性导热体。
可选地，上述改善电容器发声的装置中，所述接触物包括如下一种或几种：
硅胶、泡棉、橡胶。
可选地，上述改善电容器发声的装置中，所述接触物的第一侧位于所述电容器顶部指：所述接触物靠近所述电容器一侧的表面面积大于所述电容器靠近所述接触物一侧的表面面积。
可选地，上述改善电容器发声的装置，还包括电路板，所述电容器远离所述接触物的一端与电路板电性连接。
本文还提供了一种终端，包括改善电容器发声的装置，所述改善电容器发声的装置包括屏蔽罩、接触物以及电容器，所述接触物和所述电容器收容于所述屏蔽罩内，所述接触物分别与所述电容器，以及所述屏蔽罩接触，使 所述接触物挤压于所述屏蔽罩和所述电容器之间。
可选地，上述终端中，所述接触物分别与所述电容器，以及所述屏蔽罩接触指：
所述接触物的第一侧位于所述电容器顶部，所述接触物的第二侧位于所述屏蔽罩内侧。
可选地，上述终端中，所述接触物不导电且为柔性导热体。
可选地，上述终端中，所述接触物包括如下一种或几种：
硅胶、泡棉、橡胶。
可选地，上述终端中，所述接触物的第一侧位于所述电容器顶部指：所述接触物靠近所述电容器一侧的表面面积大于所述电容器靠近所述接触物一侧的表面面积。
可选地，上述终端中，所述改善电容器发声的装置还包括电路板，所述电容器远离所述接触物的一端与电路板电性连接。
本文提出的改善电容器发声的装置，通过将接触物和电容器收容在屏蔽罩内，且接触物一端位于电容器顶部，另一端位于屏蔽罩内侧，使接触物挤压于屏蔽罩和电容器之间。使电容器与接触物充分接触并受到接触物的挤压而避免通话时产生“滋滋”声，具有改善电容器发声的效果，提高了用户体验，具有较大的应用前景。
在阅读并理解了附图和详细描述后，可以明白其他方面。
附图概述
图1为相关技术中手机通话原理示意图；
图2为图1中射频功放模块电压跌落波形示意图；
图3为本发明实施例提供的改善电容器发声的装置的结构示意图；
图4为图3中屏蔽罩与接触物的组合示意图，其中，图4是由改善电容器发声的装置的内部向外部观察得到的；
图5为图3中接触物与电容器的组合示意图。
本发明的实施方式
下文中将结合附图对本文的实施例进行说明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互任意组合。
在本文的描述中，需要理解的是，术语“上”、“下”、“前”、“后”、“左”、“右”、“顶”、“底”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明实施例和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明实施例的限制。
在本发明实施例中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据实际情况理解上述术语在本发明实施例中的含义。
在本发明实施例中，除非另有明确的规定和限定，第一特征在第二特征中的“上”或“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征，如图3所示。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
请参照图1，为相关技术中手机通话原理示意图。手机通话过程涉及电源、电源管理模块、应用处理器、射频功放模块、天线、开关模块、滤波模块和射频发射模块。基于上述上述硬件结构，全球移动通信系统(Global  System for Mobile Communication，GSM)制式广泛采用时分多址和频分多址相结合的方式。时分多址是在某一固定频段上，无线载波会按照时间(称为时隙)被划分为若干个时分信道，每一用户占用一个时隙，在相应的时隙内收发信号。一般会在一个频点上设置8个时隙，分时传送信号。一个时隙是0.577毫秒(ms)，8个时隙为一帧，一帧时间为4.615ms。也就是说，在某一固定频点上，同一用户进行通话，信息的传送体现到信号波形上就是一个周期为4.615ms，脉宽为0.577ms的数字脉冲，其工作频率为217赫兹(Hz)。由此，当GSM制式通话时，信号通路上射频功率放大器(Power Amplifier，PA)就会周期性地工作，当PA工作时，其工作电流非常大，瞬间从电源上抽取很大的电流，导致电源无法迅速响应，电压会被拉低。如图2所示，为射频功放模块电压跌落波形示意图，在T1和T2的时间之差ΔT时间内，电压由U2降至U1，而形成电压差ΔU，导致PA的整个电源出现周期性的跌落，导致该电源上放置的多层陶瓷电容周期性的充放电。由于其特殊的叠层结构，在压电效应的作用下，会震荡发声。如果该电源线路上挂载的电容较多，尤其是大封装大容量的多层陶瓷电容较多，就会出现多个电容一同发声的情况。
请同时参照图3-5，为本发明实施例提供的改善电容器发声的装置的示意图。如图3所示，改善电容器发声的装置至少包括屏蔽罩1、接触物2、电容器3和电路板4，其中，电容器3电性连接于电路板4，接触物2分别与电容器3以及屏蔽罩1接触。可选地，接触物2分别与电容器3以及屏蔽罩1的接触方式可以采用图3所示方式，即接触物2位于电容器3远离电路板4一端的顶部(即如图3所示接触物2的第一侧与电容器3的顶部连接)，屏蔽罩1罩设于接触物2上(即如图4所示接触物2第二侧与屏蔽罩的内侧连接)，以将接触物2、电容器3收容于屏蔽罩1之内。也就是说，当屏蔽罩1盖上之后，接触物2挤压于屏蔽罩1和电容器3之间，当通话时，电容器3与接触物2充分接触并受到接触物2的挤压而避免产生“滋滋”声，具有较好的改善电容器3发声的效果，提高了通话质量。
可选地，电容器3电性连接于电路板4可以是通过远离接触物2的一端与电路板4电性连接，如图3所示，电容器3的顶部与接触物2接触时，电容器3的底部即为远离接触物2的一端，此时，电容器3的底部与电路板4 电性连接即可。
可选地，在本实施例中，接触物2为不导电柔性导热接触物，也就是说，接触物2一方面是不导电的以确保主板功能正常运行，另一方面是柔性的以确保在与接触时不会对电容器3和屏蔽罩1产生破坏。同时，接触物2具有较好的散热性，以确保解除后不会增加主板温度。
可选地，接触物2可以具有弹性。如图3和图5所示，接触物2靠近屏蔽罩1一侧的顶面(即图3和图5中接触物2与屏蔽罩1接触的第一侧)为平面，靠近电容器3一侧的底面(即图3和图5中接触物2与电容器3接触的一侧)在与电容器3相适应的位置因与电容器3相接触而形成凹陷。即，接触物2与电容器3之间的挤压力使接触物2产生弹性形变，当接触物2与电容器3分开时，接触物2的凹陷恢复形变而形成平面。可选地，接触物2凹陷的形状与电容器3的尺寸和形状相对应。
可选地，接触物2可以包括但不限于硅胶、泡棉、橡胶等。
可选地，接触物2靠近电容器3一侧(即图5中接触物2的底面)的表面面积大于电容器3靠近接触物2一侧(即图5中电容器3的顶面)的表面面积。
可选地，接触物2可以是方形体、柱形体等规则形状，也可以是不规则的形状，因此，接触物2与电容器3接触的第一侧，以及接触物2与屏蔽罩1接触的第二侧为不同的接触面，本发明实施例在此不做具体限制。
在本实施例中，接触物2一端位于电容器3顶部，另一端位于屏蔽罩1内侧，即接触物2挤压于电容器3和屏蔽罩1之间，在其他实施例中，接触物2也可以位于电容器3和其他结构件之间，本发明实施例在此不作具体限制。
可选地，本实施例的电容器3为多层片式陶瓷电容器(MLCC)。
本发明实施例提供的改善电容器发声的装置，当屏蔽罩1盖上之后，接触物2挤压于屏蔽罩1和电容器3之间，当通话时，电容器3与接触物2充分接触并受到接触物2的挤压而避免产生“滋滋”声，具有改善电容器3发声的效果，提高了用户体验，具有较大的应用前景。
本发明实施例还提供一种终端，该终端至少包括上述改善电容器发声的装置。在本实施例中，该终端为手机。在其他实施例中，终端可以是任何具备通话功能的设备。
工业实用性
本发明实施例提供的具有改善电容器发声装置的终端，在建立通话连接时，电容器与接触物充分接触并受到接触物的挤压而避免电容器出现震荡的情况，避免产生“滋滋”声，有效地改善了电容器发声的问题，提供了通话质量。

Claims (12)

  1. 一种改善电容器发声的装置，包括屏蔽罩、接触物以及电容器，所述接触物和所述电容器收容于所述屏蔽罩内，所述接触物分别与所述电容器，以及所述屏蔽罩接触，使所述接触物挤压于所述屏蔽罩和所述电容器之间。
  2. 根据权利要求1所述的改善电容器发声的装置，其中，所述接触物分别与所述电容器，以及所述屏蔽罩接触指：
    所述接触物的第一侧位于所述电容器顶部，所述接触物的第二侧位于所述屏蔽罩内侧。
  3. 根据权利要求2所述的改善电容器发声的装置，其中，所述接触物不导电且为柔性导热体。
  4. 根据权利要求2所述的改善电容器发声的装置，其中，所述接触物包括如下一种或几种：
    硅胶、泡棉、橡胶。
  5. 根据权利要求2至4任一项所述的改善电容器发声的装置，其中，所述接触物的第一侧位于所述电容器顶部指：所述接触物靠近所述电容器一侧的表面面积大于所述电容器靠近所述接触物一侧的表面面积。
  6. 根据权利要求5所述的改善电容器发声的装置，还包括电路板，所述电容器远离所述接触物的一端与电路板电性连接。
  7. 一种终端，包括改善电容器发声的装置，所述改善电容器发声的装置包括屏蔽罩、接触物以及电容器，所述接触物和所述电容器收容于所述屏蔽罩内，所述接触物分别与所述电容器，以及所述屏蔽罩接触，使所述接触物挤压于所述屏蔽罩和所述电容器之间。
  8. 根据权利要求7所述的终端，其中，所述接触物分别与所述电容器，以及所述屏蔽罩接触指：
    所述接触物的第一侧位于所述电容器顶部，所述接触物的第二侧位于所述屏蔽罩内侧。
  9. 根据权利要求8所述的终端，其中，所述接触物不导电且为柔性导热 体。
  10. 根据权利要求8所述的终端，其中，所述接触物包括如下一种或几种：
    硅胶、泡棉、橡胶。
  11. 根据权利要求8至10任一项所述的终端，其中，所述接触物的第一侧位于所述电容器顶部指：所述接触物靠近所述电容器一侧的表面面积大于所述电容器靠近所述接触物一侧的表面面积。
  12. 根据权利要求11所述的终端，其中，所述改善电容器发声的装置还包括电路板，所述电容器远离所述接触物的一端与电路板电性连接。
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