WO2017175949A1

WO2017175949A1 - Electronic apparatus

Info

Publication number: WO2017175949A1
Application number: PCT/KR2016/014764
Authority: WO
Inventors: 안경래; 권혁수; 김지홍; 김진호; 김홍삼; 방석; 유수현; 이승복; 한브라이언; 김동현
Original assignee: 삼성전자 주식회사
Priority date: 2016-04-04
Filing date: 2016-12-16
Publication date: 2017-10-12
Also published as: KR20170115141A

Abstract

An electronic apparatus, according to various embodiments of the present invention, may comprise: a main housing having at least one hole formed through one surface thereof; a circuit board disposed inside the housing; and at least one accessory device functionally connected to the circuit board, and disposed such that at least a portion thereof protrudes to the outside of the housing through the at least one hole, wherein the accessory device may include at least a device which performs a cooling function or an output function. Various embodiments of the electronic apparatus are possible.

Description

Electronic device

Various embodiments of the present invention relate to an electronic device, for example, to a personal computer.

As the information and communication industry develops, electronic devices may provide a means for a user to generate, accumulate, or receive various information. As the high-speed, high-capacity wireless communication becomes more common, the mobile communication industry is rapidly developing, but personal computing (PC) is still usefully used to generate, accumulate, or receive information on / offline. In general home or office environment, desktop PC has been mainly utilized, and it is relatively easy for users to replace various parts by themselves, which can extend the functionality of desktop PC or improve performance.

Some users use notebook PCs, tablet PCs, or All in one PCs instead of desktop PCs. Notebook PCs and tablet PCs have the advantage of being portable and taking up less space, while the All in one PC eliminates the need for a separate additional device, for example, a separate monitor, to keep the environment in which the PC is installed. have. However, notebook PCs, tablet PCs and all-in-one PCs can cost more than desktop PCs to achieve the same performance. In addition, unlike desktop PCs, notebook PCs, tablet PCs, and all-in-one PCs are difficult for users to replace parts, and thus, there is a limit to expanding functions or improving performances even if user demands.

Recently, as the degree of integration of electronic devices increases, desktop PCs are becoming smaller and smaller due to advantages such as desktop PCs and notebook PCs. However, even in a miniature desktop PC, it can be difficult to replace the parts you want. For example, a miniaturized desktop PC is provided with various components (eg, processor, graphics module, sound module, etc.) in the form of a single integrated card, so there may be limitations in expanding functions or improving performance according to user's requirements. have. On the other hand, in miniaturized desktop PCs, integrated circuit chips and the like may generate heat during operation, which may degrade the operating performance of the desktop PC.

Accordingly, various embodiments of the present disclosure are to provide an electronic device that is easy to miniaturize and expand functions or improve performance.

Various embodiments of the present invention are to provide an electronic device that can easily release the heat generated therein.

In addition, various embodiments of the present invention are to provide an electronic device that can be miniaturized while ensuring the expandability of the desktop PC.

An electronic device according to various embodiments of the present disclosure is provided.

A main housing having at least one hole formed on one surface thereof;

A circuit board disposed inside the housing; And

At least one accessory device operatively connected to the circuit board, the at least one portion disposed to protrude out of the housing through the at least one hole,

The accessory device may comprise at least a device for performing a cooling function or for performing an output function.

A main housing having at least one hole formed on one surface thereof;

A circuit board disposed inside the housing and including at least one integrated circuit chip that generates heat when operated; And

At least a portion may include at least one accessory arranged to protrude out of the housing through the at least one hole,

The accessory device may include a radiator that absorbs heat generated by the integrated circuit chip and releases the heat to the outside.

According to various embodiments of the present disclosure, an electronic device may perform at least one of a cooling function and an output function through an accessory device having at least a portion protruding out of the housing, thereby preventing a heat generation problem or a function of a miniaturized electronic device. Can be extended. For example, while miniaturizing the housing, good operating performance can be ensured, and the functions of the electronic device can be variously expanded according to the functions imparted to the accessory device. According to various embodiments of the present disclosure, in addition to the accessory device described above, a function of the electronic device may be combined with various additional devices such as an auxiliary power module, an auxiliary communication module, a wireless power transmission module, an optical module, a storage module, and a sensor module. It can scale or improve performance.

1 is a perspective view illustrating an electronic device according to various embodiments of the present disclosure.

2 is a plan view illustrating an electronic device according to various embodiments of the present disclosure.

3 is a side view illustrating an electronic device according to various embodiments of the present disclosure.

4 is a block diagram illustrating an electronic device according to various embodiments of the present disclosure.

5 is an exploded perspective view illustrating an example of an accessory device of an electronic device according to various embodiments of the present disclosure.

6 is a perspective view illustrating an example of an accessory device of an electronic device according to various embodiments of the present disclosure.

FIG. 7 is a diagram illustrating an example in which an accessory device of an electronic device is mounted in a housing, according to various embodiments of the present disclosure; FIG.

8 is an exploded perspective view illustrating another example of an accessory device of an electronic device according to various embodiments of the present disclosure;

9 is a perspective view illustrating another example of an accessory device of an electronic device according to various embodiments of the present disclosure.

FIG. 10 is a diagram illustrating an example in which an accessory device of an electronic device is mounted in a housing, according to various embodiments of the present disclosure; FIG.

11 is a view illustrating an operation of one of the accessory devices of an electronic device according to various embodiments of the present disclosure.

12 is an exploded perspective view illustrating a power supply unit of an electronic device according to various embodiments of the present disclosure.

13 is a perspective view illustrating a power supply unit of an electronic device according to various embodiments of the present disclosure.

14 is a plan view illustrating a method in which an additional device is coupled to an electronic device according to various embodiments of the present disclosure.

15 is a side view illustrating a state in which an additional device is coupled to an electronic device according to various embodiments of the present disclosure.

16 is an exploded perspective view illustrating an example of an additional device coupled to an electronic device according to various embodiments of the present disclosure.

17A, 17B, 17C, 17D, 17D and 17E illustrate a shape of an accessory device and / or an accessory device of an electronic device according to various embodiments of the present disclosure.

FIG. 18 is a diagram for describing an electrical connection structure of an accessory device and / or an accessory device of an electronic device according to various embodiments of the present disclosure.

19 is an exploded perspective view illustrating a control unit of an electronic device according to various embodiments of the present disclosure.

20 to 23 are diagrams for describing modifications of electronic devices according to various embodiments of the present disclosure, respectively.

Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. The examples and terms used herein are not intended to limit the techniques described in this document to specific embodiments, but should be understood to include various modifications, equivalents, and / or alternatives to the examples. In connection with the description of the drawings, similar reference numerals may be used for similar components. Singular expressions may include plural expressions unless the context clearly indicates otherwise. In this document, expressions such as "A or B" or "at least one of A and / or B" may include all possible combinations of items listed together. Expressions such as "first," "second," "first," or "second," etc. may modify the components in any order or importance, and are only used to distinguish one component from another. It does not limit the components. When any (eg first) component is said to be "connected (functionally or communicatively)" or "connected" to another (eg second) component, the other component is said other It may be directly connected to the component or may be connected through another component (for example, the third component).

In this document, "configured to" is modified to have the ability to "suitable," "to," "to," depending on the circumstances, for example, hardware or software. Can be used interchangeably with "made to", "doing", or "designed to". In some situations, the expression “device configured to” may mean that the device “can” together with other devices or components. For example, the phrase “processor configured (or configured to) perform A, B, and C” may be implemented by executing a dedicated processor (eg, an embedded processor) to perform its operation, or one or more software programs stored in a memory device. It may mean a general purpose processor (eg, a CPU or an application processor) capable of performing the corresponding operations.

An electronic device according to various embodiments of the present disclosure may be, for example, a smartphone, a tablet PC, a mobile phone, a video phone, an e-book reader, a desktop PC, a laptop PC, a netbook computer, a workstation, a server, a PDA, a PMP. It may include at least one of a portable multimedia player, an MP3 player, a medical device, a camera, or a wearable device. Wearable devices may be accessory (e.g. watches, rings, bracelets, anklets, necklaces, eyeglasses, contact lenses, or head-mounted-devices (HMDs), textiles or clothing integrated (e.g. electronic clothing), And may include at least one of a body-attachable (eg, skin pad or tattoo), or bio implantable circuit, In certain embodiments, an electronic device may comprise, for example, a television, a digital video disk (DVD) player, Audio, Refrigerator, Air Conditioner, Cleaner, Oven, Microwave Oven, Washing Machine, Air Purifier, Set Top Box, Home Automation Control Panel, Security Control Panel, Media Box (e.g. Samsung HomeSync ^TM , Apple TV ^TM , or Google TV ^TM ) , A game console (eg, Xbox ^™ , PlayStation ^™ ), an electronic dictionary, an electronic key, a camcorder, or an electronic picture frame.

In another embodiment, the electronic device may include a variety of medical devices (e.g., various portable medical measuring devices such as blood glucose meters, heart rate monitors, blood pressure meters, or body temperature meters), magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), Computed tomography (CT), cameras or ultrasounds), navigation devices, global navigation satellite systems (GNSS), event data recorders (EDRs), flight data recorders (FDRs), automotive infotainment devices, ship electronics (E.g. marine navigation systems, gyro compasses, etc.), avionics, security devices, vehicle head units, industrial or household robots, drones, ATMs in financial institutions, point of sale (POS) points in stores or Internet of Things devices (eg, light bulbs, various sensors, sprinkler devices, fire alarms, thermostats, street lights, toasters, exercise equipment, hot water tanks, heaters, boilers, etc.). . According to some embodiments, an electronic device may be a part of a furniture, building / structure or automobile, an electronic board, an electronic signature receiving device, a projector, or various measuring devices (eg, water, electricity, Gas, or a radio wave measuring instrument). In various embodiments, the electronic device may be flexible or a combination of two or more of the aforementioned various devices. Electronic devices according to embodiments of the present disclosure are not limited to the above-described devices. In this document, the term user may refer to a person who uses an electronic device or a device (eg, an artificial intelligence electronic device) that uses an electronic device.

1 is a perspective view illustrating an electronic device 100 according to various embodiments of the present disclosure. 2 is a plan view illustrating an electronic device 100 according to various embodiments of the present disclosure. 3 is a side view illustrating an electronic device 100 according to various embodiments of the present disclosure.

1 to 3, the electronic device 100 may include a main housing 101, a circuit board 102, and / or at least one

accessory device

103, 104. 103 and 104 are arranged such that at least a portion thereof protrudes out of the housing 101 and may perform at least one of a cooling function and / or an output function. According to various embodiments, the

accessory devices

103 and 104 may further perform an auxiliary power supply function, an auxiliary storage function, and the like in addition to the cooling function and the output function.

According to various embodiments of the present disclosure, the housing 101 may be formed by combining the upper case 101a and the lower case 101b, and accommodate the circuit board 102 or the like or the

accessory devices

103 and 104. It is possible to provide means for mounting the back. At least one hole (s) 113 formed on the first surface (for example, the upper surface) facing the first direction of the housing 101, and at least one, depending on the arrangement of the parts received therein It may include a protrusion 115a. For example, the internal storage module 121c and the power module 119 may be stacked in a structure inside the housing 101, and the power module 119 may have an internal space of the protrusion 115a. It can be arranged as. The protrusion 115a may be disposed adjacent to the holes 113 at an upper surface of the housing 101, and a connection hole 115b is formed at an upper surface of the protrusion 115a to provide

additional devices

161 and 163. (Shown in FIG. 3) and provide an electrical connection path. For example, the connection hole 115b may be provided with a connection device 117 that provides a mechanical mounting structure and an electrical connection function.

In another embodiment, the housing 101 may further include a cover member 115c surrounding the protruding portion 115b, thereby enhancing the appearance of the upper case 101a. In some embodiments, the cover member 115c may be integrally formed with the upper case 101a. For example, the cover member 115c may be formed of the upper case 101a and a uni body through a method such as injection molding or die casting.

As the

additional devices

161 and 163 mounted on the upper surface of the protrusion 115a, for example, an auxiliary power module (for example, a battery), an auxiliary communication module, a wireless power transmission module, an optical module (for example, a beam projector), The storage module may include at least one of a storage module (eg, an external hard disk) and various sensor modules. In another embodiment, an additional device in which at least one pair of the above-listed modules are combined may be mounted on an upper surface of the protrusion 115a (for example, outside of the cover member 115c). In another embodiment, a plurality of module (s) among the modules listed above may be mounted on the upper surface of the protrusion 115a, respectively. The plurality of module (s) may be mounted on the top surface of the protrusion 115a in a sequentially stacked structure, and some modules may include a circuit board 102 (eg, a processor) in which another module is accommodated in the housing 101. Electrical connection with the The electronic device 100 may diversify functions or improve performance by mounting and connecting the

additional devices

161 and 163 as described above. The attachment, connection, and the like of the

additional devices

161 and 163 will be described in more detail with reference to FIG. 14.

According to one embodiment, the housing 101, the inner side or the outer surface of the first bracket (111a) and / or the upper case (101a) disposed between the upper case (101a) and the lower case (101b). It may include a second bracket (111b) coupled to. The first bracket 111a and the second bracket 111b may be used as a decorative member to enhance the appearance of the housing 101 or as a reinforcing member to increase the strength of the housing 101. According to various embodiments, the first bracket 111a and the second bracket 111b may provide an insulation function between components accommodated and mounted in the housing 101.

According to various embodiments, the circuit board 102 may be mounted on the housing 101 with at least one

integrated circuit chip

121a or 121b (eg, a processor, a communication module chip, an audio module chip, etc.) mounted thereon. Can be accommodated. The

integrated circuit chips

121a and 121b (s) mounted on the circuit board 102 may include integrated circuit chips that generate heat during operation. For example, a processor, often referred to as a central processing unit (CPU), can generate significant heat during operation. In one embodiment, the electronic device 100 includes a cooling device 104 as an accessory device, thereby dissipating heat generated in the housing 101 to create a stable operating environment of the integrated circuit chip. In some embodiments, the internal storage module 121c may be mounted inside the housing 101 to be functionally connected to the circuit board 102. For example, the internal storage module 121c may be mounted and fixed to an internal structure of the housing 101 and connected to the circuit board 102 through a cable (for example, a ribbon cable).

According to various embodiments of the present disclosure, the accessory device may include, for example, a speaker device 103 and a cooling device 104 detachably provided in the housing 101. The speaker device 103 as an accessory device may be mounted in one of the holes 113 so that at least a portion thereof protrudes out of the housing 101. For example, the speaker device 103 secures a sufficient space without being affected by the volume of the housing 101, thereby miniaturizing the housing 101 (eg, the electronic device 100) while providing high quality sound. Can provide. The cooling device 104 as an accessory device may be mounted in the other of the holes 113 so that at least a portion thereof protrudes out of the housing 101. In one embodiment, the cooling device 104 is a heat plate mounted on a heat generating element (eg, an integrated circuit chip such as a processor indicated by reference numeral '121b') disposed on the circuit board 102. 145a, a heat pipe 145b extending from the heat dissipation plate 145a, and a heat generating element through a heat exchanger (for example, a radiator to be described later) connected to the heat pipe 145b. It can release heat generated from.

An electronic device such as a general personal computer (eg, a desktop PC) may operate a fan to radiate heat inside the housing to the outside, or introduce external air into the housing to provide a cooling function. In a miniaturized electronic device, the air flow inside the housing may not be smooth, and there may be a limit in ensuring sufficient cooling performance by only operating a fan mounted therein. The electronic device 100, according to various embodiments of the present disclosure, includes a cooling device 104 as an accessory device protruding out of the housing 101, so that substantial heat exchange (eg, cooling) is performed in the housing 101. In this case, the electronic device 100 can be miniaturized and sufficient cooling performance can be ensured.

The structure of the speaker device 103 or the cooling device 104 will be described in more detail with reference to FIG. 5. Meanwhile, according to various embodiments of the present disclosure, the

accessory devices

103 and 104 as described above may share a binding structure corresponding to the hole 113, thereby improving performance and function of the electronic device 100. Can be useful. For example, not only the speaker device 103 or the cooling device 104, but also an optical device such as a beam projector, a security device such as a closed circuit camera, and the like may be provided as the accessory devices.

According to various embodiments of the present disclosure, the electronic device 100 may further include an adjusting unit 105, for example, an adjusting knob 151 or an adjusting panel. The adjusting knob 151 or the adjusting panel may be used to adjust various operating states of the electronic device 100. For example, the adjustment knob 151 or the adjustment panel may be a power on / off of the electronic device 100, an output volume of the speaker device 103, and a fan accommodated in the cooling device 104. Allows the user to adjust the operating speed of the device. According to various embodiments of the present disclosure, if the electronic device 100 includes a lighting device such as a light emitting diode, the brightness or the color of the light may be adjusted through the adjusting knob 151 or the adjusting panel. In some embodiments, the adjustment knob 151 may include a dial structure, a mechanical switch structure, a touch button structure, and the like, and may be embedded in the housing 101 through the side hole 155 of the housing 101. Connected to the controlled substrate 153. For example, the control board 153 may generate a signal for adjusting the operating state of the speaker device 103 and / or the cooling device 104 according to the operation of the adjustment knob 151.

4 is a block diagram illustrating an electronic device 400 according to various embodiments of the present disclosure.

Referring to FIG. 4, the electronic device 400 (eg, the electronic device 100 of FIG. 1) according to various embodiments of the present disclosure may include a power management module 419, a bus 421, a processor 423, Memory 425, storage module 427, and / or accessory devices 403, 404 (eg, speaker device 103 and / or cooling device 104 of FIG. 1). According to various embodiments of the present disclosure, the additional device 406 may be mounted on the electronic device 400 to improve performance or expand a function of the electronic device 400. The bus 421 may include circuits that connect the components to each other and transfer communication (eg, control messages or data) between the components. The processor 423 may include one or more of a central processing unit, an application processor, or a communication processor (CP). The processor 423 may execute, for example, an operation or data processing related to control and / or communication of at least one other component of the electronic device 400.

The memory 425 may include volatile and / or nonvolatile memory. The memory 425 may store, for example, commands or data related to at least one other element of the electronic device 400. According to an embodiment, the memory may store software and / or a program for executing a series of instructions or functions.

The storage module 427 may be, for example, volatile memory (for example, DRAM, SRAM, or SDRAM), nonvolatile memory (for example, one time programmable ROM (OTPROM), PROM, EPROM, EEPROM, mask ROM, flash, etc.). At least one of a ROM, a flash memory, a hard drive, or a solid state drive (SSD) In one embodiment, the additional device 406 may include an external storage module, a hard drive, or It may include at least one of a solid state drive (SSD) For example, by mounting an additional device 406 including an external storage module in the housing (eg, the housing 101 of Figure 1), the electronic device ( 400 data storage capacity can be expanded.

The power management module 419 may manage power of the electronic device 400, for example. According to an embodiment, the power management module 419 may include a switched mode power supply (SMPS), a power management integrated circuit (PMIC), a charger IC, or a battery or fuel gauge. For example, if a rechargeable battery or a wireless power transmission module is provided as the additional device 406, the power management module 419 may be controlled.

According to an embodiment of the present disclosure, the electronic device 400 may include a speaker device 403 as an accessory device. The speaker device 403 may include a speaker 431 and / or an audio module 433. The speaker 431 and / or the audio module 433 may receive sound under the control of the processor 423. Can play. In some embodiments, the speaker device 403 includes a wireless communication module such as a Bluetooth module, so that the electronic device 400 is provided with an acoustic signal while wirelessly communicating with another electronic device to receive music and the like. You can print

In another embodiment, the electronic device 400 may include a cooling device 404 as an accessory device. For example, the cooling device 404 may diffuse and dissipate heat generated by the processor 423 or the like to the outside. According to an embodiment, the cooling device 404 is disposed adjacent to a heat generating element (eg, the processor 423) of the electronic device 400 and / or is mechanically connected to the heat generating element through a heat pipe or the like. The radiator 441 may be included. According to another embodiment, the cooling device 404 may further include a fan 443 installed adjacent to the radiator 441, and the fan 443 operates under the control of the processor 423. In addition, the performance of the cooling device 404 may be improved.

5 is an exploded perspective view illustrating an example of an accessory device 503 of an electronic device according to various embodiments of the present disclosure. 6 is a perspective view illustrating an example of an accessory device 503 of an electronic device according to various embodiments of the present disclosure. FIG. 7 is a diagram illustrating an example in which an accessory device 503 of an electronic device is mounted in a housing, according to various embodiments of the present disclosure.

5 to 7, as an accessory device of an electronic device according to various embodiments of the present disclosure, a speaker device 503 (eg, the speaker device 103 of FIG. 1) may include a housing 501 (eg, It may include a connecting member 531 mounted on the hole 513a of the housing 101 of FIG. 1. The connecting member 531 may include a generally cylindrical body 531a and at least one binding piece 531b extending outward from a lower end of the body 531a. According to various embodiments, the connection member 531 is detachably provided to the housing 501 (or to the circuit board (eg, the circuit board 102 of FIG. 1) to thereby mechanically operate the speaker device 503. Means and / or functionally mounted on the housing 501. For example, a screw penetrates the binding piece 531b (s) and is fastened to an inner wall of the housing 501. As the connection member 531 is mounted on the hole 513a of the housing 501, the connection member 531 may protrude to the outside of the housing 501.

In another embodiment, the speaker device 503 as an accessory device may further include a first housing 533 that at least partially surrounds the connecting member 531 outside the housing 501. The first housing 533 may provide a space for mounting at least one speaker module, and may be mounted on the hole 513a of the housing 501 by a screw 513c. In some embodiments, the housing 501 may further include a screw hole 513b disposed around the hole 513a.

According to an embodiment of the present disclosure, the speaker device 503 may include a plurality of speaker modules. For example, a main speaker 535a may be disposed at an upper end of the first housing 533, and a tweeter speaker 535b for outputting sound in a high-pitched region may be mounted above the main speaker 535a. have. In some embodiments, the speaker device 503 is coupled to an upper side of the first housing 533, for example, coupled to face the main speaker 535a while being spaced apart from the main speaker 535a. A tweeter lens 537 may be further included. The tweeter speaker 535b may be disposed between the main speaker 535a and the tweeter lens 537.

According to various embodiments, the first housing 533 may be directly mounted and fixed to the housing 501 by the screw 513c. If the first housing 533 may be directly mounted and fixed to the housing 501 by the screw 513c, the speaker device 503 may not include the connection member 531. In one embodiment, the speaker device 503 can be assembled by a screw 513c or the like, so that the output can be replaced with another speaker device or an accessory device having a different output function as required by the user. For example, another speaker device capable of outputting a higher volume, a speaker device having a different appearance design, an optical device having an image output function such as a beam projector, or the like may be replaced with the speaker device 503.

8 is an exploded perspective view illustrating another example of an accessory device 804 of an electronic device according to various embodiments of the present disclosure. 9 is a perspective view illustrating another example of an accessory device 804 of an electronic device according to various embodiments of the present disclosure. FIG. 10 is a diagram illustrating an example in which an accessory device 804 of an electronic device is mounted in a housing, according to various embodiments of the present disclosure.

8 to 10, an electronic device (eg, the electronic device 100 of FIG. 1) according to various embodiments of the present disclosure may include a cooling device 804 as an accessory device. The cooling device 804 may be mechanically and / or functionally connected to the housing 801 of the electronic device and / or the circuit board (eg, the circuit board 102 of FIG. 1). For example, if a heating element (eg, a processor) is generated among the integrated circuit chips mounted on the circuit board, the cooling device 804 may include a heat pipe 845b connected to the heating element. .

According to an embodiment, the cooling device 804 may include a connection member 841 mounted on the hole 813a of the housing 801 and protruding to the outside. In some embodiments, the connection member 841 may include at least partially a thermally conductive material, and may include a plurality of heat dissipation fins 841a formed on an outer surface thereof. By including the heat dissipation fins 841a, the connection member 841 may have a large surface area (an area capable of dissipating heat and / or an area in contact with external air) that occupies a real space. For example, the connection member 841 itself may provide a heat radiation function for dissipating heat inside the housing 801 to the outside. According to various embodiments, the heat dissipation fins 841a may be formed to reduce an area that a user may contact. For example, if the connection member 841 provides a heat dissipation function, there is a possibility of an image (eg, a low temperature image) due to the user's contact, but by forming the heat dissipation fins 841a, the user may actually touch the heat. The area can be reduced to prevent burns due to user contact. The connection member 841 may be mounted and fixed to the outside of the housing 801 by a screw 813c fastened through the screw hole 813b.

According to various embodiments, the cooling device 804 may include a radiating body 843 accommodated in the connecting member 841. The radiator 843 is generally cylindrical (or cylindrical) shape, a plurality of heat dissipation fins may be formed on the outer peripheral surface. For example, the radiator 843 may absorb heat generated from the heat inside the housing 801 or the heat generating element accommodated in the housing 801, and may release the heat absorbed into the air. Heat radiated from the radiator 843 may be discharged to the outside of the connecting member 841 by convection, or may radiate heat radiating fins 841a of the outer circumferential surface of the connecting member 841. Can be released to the outside.

In one embodiment, the cooling device 804 may further include a heat plate 845a and a heat pipe 845b extending from the heat plate 845a. The heat dissipation plate 845a may be mounted to, for example, a heat generating element inside the housing 801, and the heat pipe 845b is connected to the radiator 843 to heat the heat generated by the heat generating element. The radiator 843 may be transferred to the radiator 843. In another embodiment, the cooling device 804 may further include a fan 847 mounted adjacent to the radiator 843 in the connecting member 841. The fan 847 may operate to operate inside the connection member 841 to discharge air inside the connection member 841 to the outside. For example, by further including the heat dissipation plate 845a, the heat pipe 845b and / or the fan 847, heat is rapidly transferred from the heat generating element that generates heat to the radiator 843 or discharged to the outside. The cooling performance of the cooling device 804 can be improved.

According to various embodiments, the connection member 841 may have a cylindrical shape with open top and bottom. For example, an inner space of the housing 801 may be connected to the outside through the connection member 841. In an embodiment, a cap 849 may be mounted on an upper end of the connection member 841 to mitigate and prevent the internal space of the connection member 841 from being exposed to the outside. The cap 849 is at least partially open to exhaust the heat or air inside the connection member 841 to the outside, and the exposure of the internal space of the connection member 841 to the outside can be suppressed.

11 is a view illustrating an operation of one of the accessory devices 904 of the electronic device according to various embodiments of the present disclosure.

Referring to FIG. 11, an accessory device of an electronic device according to various embodiments of the present disclosure may be a cooling device 904 that discharges heat generated in a housing to the outside in a convection or radiation manner.

According to one embodiment, the housing 901 of the electronic device accommodates a circuit board 902 on which a heating element 921b (eg, a processor) is mounted, and the cooling device 904 includes the heating element 921b. It may include a heat dissipation plate (945a) attached to. Heat generated from the heat generating element 921b may be absorbed by the heat dissipation plate 945a and transferred to the heat dissipator 943 through the heat pipe 945b. Part of the heat generated by the heating element 921b may raise the internal temperature of the housing 901. As the fan 947 of the cooling device 904 operates, the internal air of the housing 901 is operated. (Or heat) may be discharged to the outside through the cap 943. Heat transferred to the radiator 943 through the heat pipe 945b may be discharged into the inner space of the connection member 941 through the radiator 943. For example, heat may be radiated to the internal space of the connection member 941 by radiation of the radiator 943. Heat released into the inner space of the connecting member 941 may be partially discharged to the outside by the operation of the fan 947. Another part of the heat discharged into the inner space of the connecting member 941 may heat the connecting member 941.

In one embodiment, the connecting member 941 may include at least partially a thermally conductive material, and may radiate heat released into the internal space to the outside by radiation. As mentioned above, the radiator 943 and / or the connecting member 941 may include a plurality of heat dissipation fins 941a to allow a large surface area to contact air compared to an actual volume occupying space. . For example, by contacting the outside air through a large surface area, heat dissipation performance can be improved.

According to various embodiments, the connection member 941 is mounted to the housing 901 by a screw 913c and protrudes to the outside of the housing 901 (for example, the upper side of the upper case 901a). It can provide a more efficient heat exhaust path. For example, since the heated air has a tendency to ascend in a predetermined space, the connection member 941 is disposed to protrude upward of the housing 901 so that the heated air is inside the housing 901. May be induced to be discharged to the outside of the housing 901. In another embodiment, radiation performance can be improved by the radiator 943 and / or connecting member 941 including a plurality of heat dissipation fins while including a thermally conductive material. For example, the heat exchange performance of the radiator 943 and / or the connection member 941 may be improved by increasing the contact area with external air.

12 is an exploded perspective view illustrating a power supply 1209 of an electronic device according to various embodiments of the present disclosure. 13 is a perspective view illustrating a power supply 1209 of an electronic device according to various embodiments of the present disclosure.

12 and 13, the power supply 1209 may include a protrusion 1215 formed or mounted in an upper case of the housing 1201. In an embodiment, the power supply module 1219 of the power supply unit 1209 may be accommodated in the housing 1201 and / or the protrusion 1215 in a stacked state with the storage module 1221. In one embodiment, the housing 1201 is a side hole 1255 or additional device (e.g., the

additional devices

161, 163 of FIG. 3) for installing an adjustment knob (e.g., the adjustment knob 151 of FIG. 1) or the like. ) May include a connection hole 1215a for mounting and connecting.

14 is a plan view illustrating a coupling of an additional device to the electronic device 1400 according to various embodiments of the present disclosure. 15 is a side view illustrating a state in which an additional device is coupled to the electronic device 1400 according to various embodiments of the present disclosure.

14 and 15, the electronic device 1400 according to various embodiments of the present disclosure may be detachably attached to the protrusion 1415 through the above-described connection hole (eg, the connection hole 115b of FIG. 1). It may include at least one additional device (1461, 1463) provided. For example, the additional devices 1541 and 1463 may include an auxiliary power module, an auxiliary communication module, a wireless power transmission module, an optical module, a storage module, and a sensor module. In some embodiments, a plurality of modules listed above may be integrated into one additional device.

According to various embodiments, each of the additional devices 1541 and 1463 may include a connection protrusion (not shown) corresponding to a connection hole (eg, the connection hole 115b of FIG. 1) formed in the protrusion 1415 of the housing 1401. And the attachments 1451 and 1463 are rotated in a state where the connection protrusion is inserted into the connection hole, so that the attachments 1451 and 1463 are mechanically and / or in the housing 1401. Or functionally connected and mounted. In another embodiment, each of the additional devices 1541 and 1463 may include other connection holes similar to the connection holes formed in the housing 1401. For example, as shown in FIG. 15, a plurality of the additional devices 1541 and 1463 may be sequentially stacked so that the additional devices 1541 and 1463 may be mechanically and / or functionally connected to each other. An additional device (e.g., an additional device indicated by reference numeral '1463') is a circuit board (e.g., a figure of the electronic device 1400) via another additional device (e.g., an additional device indicated by reference numeral '1461'). 1 can be connected to the circuit board 102.

16 is an exploded perspective view illustrating an example of an accessory device 1601 coupled to an electronic device according to various embodiments of the present disclosure.

The additional device 1661 illustrated in FIG. 16 illustrates an external storage module, and includes a first module case 1661a provided with a connection device 1601e and a bottom surface of the first module case 1661a. By including the two module cases 1661b, the hard disk assembly 1661c and the control board 1661d can be accommodated. According to an embodiment, a second connection device (not shown) may be provided in the second module case 1661b, wherein the second connection device is a connection device of another additional device (or a connection hole of the electronic device of FIG. 1). It may be configured to correspond to (115b).

In the above-described embodiment, the accessory device (e.g., the speaker device 103 and / or cooling device 104 of Figure 1) and / or the accessory device (e.g., the attachment devices 1451, 1463 of Figure 15) are generally cylindrical. Although shapes and / or cuboidal shapes are illustrated, the present invention need not be limited thereto. For example, referring to FIG. 17, the shape of the accessory device and / or the accessory device may vary from a circular planar view 1711, an elliptical 1713, a square 1715, a rectangle 1917, and the like in plan view. .

Referring to FIG. 18, the accessory device (for example, the speaker device 103 and / or the cooling device 104 of FIG. 1) and / or the accessory device (for example, the accessory devices 1541 and 1463 of FIG. In order to connect to the circuit board of the device (eg, the circuit board 102 of FIG. 1), the electronic device (eg, the electronic device 100 of FIG. 1) according to various embodiments of the present invention may connect various types of connection structures. It may include. As a connection structure for connecting the accessory device and / or the accessory device to the circuit board, for example, a mechanical / electrical connection device such as a pogo pin connector 1811 and a magnetic connector 1813 may be provided. In another embodiment, the accessory device and / or the accessory device may transmit and receive power or data signals with each other or with a circuit board of the electronic device in a wireless mode 1815.

19 is an exploded perspective view illustrating a control unit of an electronic device 1900 according to various embodiments of the present disclosure.

Referring to FIG. 19, the electronic device 1900 may include an adjusting unit (eg, the adjusting unit 105 of FIG. 1) that can be manipulated by a user. The adjusting part may include, for example, a dial adjusting knob 1951. The adjustment knob 1951 may protrude to the outside through the side hole 1955 formed in the housing 1901 while being mounted on the control substrate 1953 mounted inside the housing 1901 of the electronic device 1900. have. In consideration of the thickness of the housing 1901 and the diameter of the adjusting knob 1951, the adjusting knob 1051 is moved toward the side of the housing 1901 at a position corresponding to the protrusion 1915 of the housing 1901. Can be deployed. According to various embodiments, the adjustment knob 1951 may include a volume of a speaker device (eg, the speaker device 103 of FIG. 1), a fan speed of the cooling device (eg, the cooling device 104 of FIG. 1), and The brightness or color of the lighting device that may be included in the electronic device 1900, and the screen brightness of the optical device including the beam projector may be adjusted.

Referring to FIG. 20, an electronic device 2000 according to various embodiments of the present disclosure may be an accessory device in a housing 2001 provided with a protrusion 2015 and an adjusting knob 2051, and one cooling device 2004 may be provided. Can be mounted. In some embodiments, the cooling device 2004 may be replaced with other accessory devices such as a speaker device, an optical device, a photographing device, and the like.

Referring to FIG. 21, in the electronic device 2100 according to various embodiments of the present disclosure, a pair of holes (not shown) may be provided in the housing 2101 provided with the protrusion 2115 and the adjustment knob 2151. As an accessory device, a cooling device 2104 may be mounted in the holes of the housing 2101, respectively. A protrusion 2115 incorporating a power module may be disposed between the holes, for example, between the cooling devices 2104.

Referring to FIG. 22, the electronic device 2200 according to various embodiments of the present disclosure may be provided with a pair of holes (not shown) in the housing 2201 provided with the protrusion 2215 and the adjustment knob 2251. As an accessory device, a speaker device 2203 may be mounted in the holes of the housing 2201, respectively. A protrusion 2215 including a power module may be disposed between the holes, for example, between the speaker devices 2203.

Referring to FIG. 23, in an electronic device 2300 according to various embodiments of the present disclosure, three or more holes (not shown) may include a housing 2301 to mount a plurality of cooling devices and / or a plurality of speaker devices. Can be formed on. For example, as shown in FIG. 23, a pair of

cooling devices

2304a and 2304b and one speaker device 2303 may be mounted in the housing 2301. According to various embodiments, the housing 2301 may be equipped with a plurality of speaker devices and one cooling device.

20 to 23, an electronic device according to various embodiments of the present disclosure may select and configure a desired accessory device according to a specification or a user's preference. For example, a user may configure a high performance computer by mounting a high performance processor, in which case a plurality of cooling devices may be mounted in the housing to improve heat dissipation performance. In another embodiment, if a cooling device having a higher heat dissipation performance is provided even if a cooling device is provided as an accessory device, only one cooling device may be mounted in the housing, even if the electronic device is equipped with a high performance processor. For example, the accessory device of the electronic device according to various embodiments of the present disclosure may be appropriately combined according to the specification of the electronic device, the usage environment of the electronic device, and the function and performance of the accessory device.

In another embodiment, the above-described accessory device is detachably provided in the housing, so that even if the electronic device has already been purchased, it may be replaced with an additional accessory device as required by the user. For example, when the user improves the performance of the electronic device or there is a change in the use environment of the electronic device, the user may replace the accessory device mounted in the housing with an accessory device having different performance or function as needed.

As described above, an electronic device according to various embodiments of the present disclosure

A main housing having at least one hole formed on one surface thereof;

A circuit board disposed inside the housing; And

According to various embodiments, the accessory device may further include a connection member detachably provided to the housing or the circuit board.

The connection member may protrude out of the housing on the hole.

According to various embodiments of the present disclosure, the connection member may include a cylindrical body and at least one binding piece extending outward from a lower end of the body.

According to various embodiments, the accessory device may include:

A first housing at least partially enclosing the connection member outside the housing; And

It may include at least one speaker module mounted on the first housing.

According to various embodiments, the accessory device may further include a tweeter lens coupled to an upper side of the first housing,

The at least one speaker module may include a main speaker disposed on the top of the first housing, and a tweeter speaker disposed between the main speaker and the tweeter lens.

According to various embodiments, the accessory device may further include a radiating body accommodated in the connection member.

According to various embodiments of the present disclosure, the accessory device may further include a heat plate positioned on the circuit board and a heat pipe extending from the heat radiating plate and connected to the radiator.

According to various embodiments, the accessory may further include a fan mounted adjacent to the radiator in the connection member.

According to various embodiments, the connection member may at least partially comprise a heat conductive material.

According to various embodiments of the present disclosure, the accessory device may further include a radiation fin formed on at least one of an outer circumferential surface of the radiator and an outer circumferential surface of the connection member.

According to various embodiments of the present disclosure, the electronic device may further include at least one additional device detachably provided to the housing at a position adjacent to the hole.

According to various embodiments of the present disclosure, the additional device may include at least one of an auxiliary power module, an auxiliary communication module, a wireless power transmission module, an optical module, a storage module, and a sensor module.

According to various embodiments, a plurality of the additional devices may be mounted to the housing in a state of being stacked on each other.

According to various embodiments of the present disclosure, the electronic device may further include a power supply unit disposed at one side of the housing.

The additional device may be detachably provided on the power supply unit.

According to various embodiments, the power supply unit may be disposed to protrude to the outer circumferential surface of the housing at a position adjacent to the hole.

According to various embodiments of the present disclosure, a pair of holes is formed in the housing, and the power supply unit may be disposed between one of the pair of holes or one side of the pair of holes.

According to various embodiments of the present disclosure, the electronic device may further include at least one adjustment knob protruding from an outer circumferential surface of the housing.

The adjusting knob can adjust at least the operation of the accessory device.

A main housing having at least one hole formed on one surface thereof;

At least a portion may comprise at least one accessory arranged to protrude out of the housing through the at least one hole,

According to various embodiments, the accessory device may include: a heat dissipation plate disposed on the integrated circuit chip; A heat pipe extending from the heat sink and connected to the heat sink; And a fan mounted adjacent to the radiator.

The connection member may include at least partially a thermally conductive material while receiving the radiator, and may protrude out of the housing on the hole.

In the foregoing detailed description of the present invention, specific embodiments have been described. However, it will be apparent to those skilled in the art that various modifications can be made without departing from the scope of the present invention.

Claims

A main housing having at least one hole formed on one surface thereof;

A circuit board disposed inside the housing; And

At least one accessory device operatively connected to the circuit board, the at least one portion disposed to protrude out of the housing through the at least one hole,

The accessory device includes at least a device that performs a cooling function or performs an output function.
The apparatus of claim 1, wherein the accessory device further comprises a connection member detachably provided to the housing or the circuit board.

And the connection member protrudes out of the housing on the hole.
The electronic device of claim 2, wherein the connection member comprises a cylindrical body and at least one binding piece extending outward from a lower end of the body.
The method of claim 2, wherein the accessory device,

A first housing at least partially enclosing the connection member outside the housing;

At least one speaker module mounted to the first housing.
The apparatus of claim 4, wherein the accessory further comprises a tweeter lens coupled to an upper side of the first housing,

The at least one speaker module includes a main speaker disposed on the top of the first housing, and a tweeter speaker disposed between the main speaker and the tweeter lens.
The electronic device of claim 2, wherein the accessory device further comprises a radiating body accommodated in the connection member.
The electronic device of claim 6, wherein the accessory device further comprises a heat plate positioned on the circuit board, and a heat pipe extending from the heat radiating plate and connected to the radiator.
The electronic device of claim 6, wherein the accessory device further comprises a fan mounted adjacent to the radiator in the connection member.
The electronic device of claim 6, wherein the accessory device further comprises a radiation fin formed on at least one of an outer circumferential surface of the radiator and an outer circumferential surface of the connection member.
According to claim 1,

And at least one additional device detachably provided in the housing at a position adjacent to the hole.
The electronic device of claim 10, wherein the additional device comprises at least one of an auxiliary power module, an auxiliary communication module, a wireless power transmission module, an optical module, a storage module, and a sensor module.
The electronic device of claim 10, wherein the plurality of additional devices are mounted to the housing in a state in which the plurality of additional devices are stacked on each other.
The method of claim 10,

Further comprising a power supply disposed on one side of the housing,

The attachment device is detachably provided on the power supply unit.
The method of claim 13,

The power supply unit is arranged to protrude from the position adjacent to the hole to the outer peripheral surface of the housing.
The electronic device of claim 13, wherein a pair of the holes is formed in the housing, and the power supply unit is disposed between the pair of holes or on one side of the pair of holes.