WO2020101379A1

WO2020101379A1 - Antenna structure formed in bracket and electronic device including same

Info

Publication number: WO2020101379A1
Application number: PCT/KR2019/015510
Authority: WO
Inventors: 이민주
Original assignee: 삼성전자 주식회사
Priority date: 2018-11-14
Filing date: 2019-11-14
Publication date: 2020-05-22
Also published as: US20210384614A1; KR20200056017A; US11894602B2; KR102611475B1

Abstract

Disclosed is an electronic device comprising: a bracket comprising a first structure which is at least partially non-conductive, a second structure which is disposed on a first surface of the first structure and is at least partially conductive, and an antenna pattern disposed on a second surface of the first structure and electrically connected to the second structure; and a printed circuit board comprising a ground unit and a feeding unit. The ground unit may be electrically connected to the second structure, and the feeding unit may be electrically connected to a portion of the antenna pattern. Various other embodiments inferred from the specification are also possible.

Description

Antenna structure formed on bracket and electronic device including same

The embodiments disclosed in this document are related to an antenna implementation technology using a bracket.

With the recent development of mobile communication technology, electronic devices are being transformed into a form that can be easily carried while being freely accessible to wired and wireless communication networks. For example, portable electronic devices such as smart phones and tablet PCs are connected to a wireless communication network by providing an antenna for transmitting and receiving wireless signals.

The electronic device may include antennas for transmitting and receiving signals in various frequency bands. With the development of wireless communication technology, the frequency and the required frequency bandwidth used in a wireless communication device are increasing, and the number of antennas is increasing to correspond to the frequency. However, due to the tendency to reduce the size of the electronic device, the space in which the antenna can be mounted is extremely reduced.

The electronic device uses a grounded portion of a printed circuit board or an antenna to mount an antenna in order to implement an antenna in a limited antenna mounting space, but the antenna performance is changed according to a change in the circuit portion included in the printed circuit board. Problems may arise that may change or require additional costs to fabricate the carrier.

Various embodiments of the present invention are intended to provide an antenna structure that maintains constant performance regardless of a change in a circuit portion included in a printed circuit board.

Various embodiments of the present invention are to provide an antenna structure capable of saving an additional cost for manufacturing a carrier by manufacturing the antenna structure together when manufacturing the bracket.

An electronic device according to an embodiment disclosed in the present disclosure includes a first structure having at least a portion of non-conductivity, a second structure disposed on a first surface of the first structure, and having at least a portion of conductivity, and the second device. It is electrically connected to the structure, and includes a bracket including an antenna pattern disposed on the second surface of the first structure, and a printed circuit board including a grounding part and a feeding part, wherein the grounding part is electrically connected to the second structure. It may be connected to, and the feeding part may be electrically connected to a part of the antenna pattern.

In addition, the antenna structure implemented on the bracket according to an embodiment disclosed in the present document has a first structure having conductivity, a second structure disposed on a first surface of the first structure, and a second structure having conductivity. It may be electrically connected to the structure, and may include an antenna pattern disposed on the second surface of the first structure.

In addition, the electronic device according to an embodiment disclosed in the present disclosure includes a carrier on which an antenna pattern is formed, a first structure having at least a portion of which is non-conductive, and a first surface of the first structure, wherein at least a portion A bracket including a second structure having conductivity, and a printed circuit board disposed on a second surface of the first structure, disposed between the carrier and the bracket, and including a ground portion and a power feeding portion, wherein the The ground portion may be electrically connected to the first structure and the first portion of the antenna pattern, and the feed portion may be electrically connected to the second portion of the antenna pattern.

According to the embodiments disclosed in this document, antenna performance may be maintained constant regardless of a change in a circuit portion included in the printed circuit board.

According to the embodiments disclosed in the present document, an additional structure for manufacturing a carrier may be saved by manufacturing the antenna structure together when manufacturing the bracket.

According to the embodiments disclosed in this document, it is possible to increase the mechanical rigidity of the bracket of the double injection structure.

In addition, various effects that can be directly or indirectly identified through this document may be provided.

1 is an exploded perspective view of an electronic device according to an embodiment of the present invention.

2 is a view showing an antenna pattern disposed at the bottom of a bracket according to an embodiment.

3 is a view showing an antenna pattern disposed on the top of the bracket according to an embodiment.

4 is a view showing an antenna pattern disposed in a top direction on a side surface of a bracket according to an embodiment.

5 is a view showing an antenna pattern disposed in a downward direction on a side surface of a bracket according to an embodiment.

6 is a perspective view showing a connection relationship between a bracket and a printed circuit board according to an embodiment of the present invention.

7 is a view showing a method for using various resonant frequencies in an antenna using a bracket according to an embodiment of the present invention.

8A is a block diagram illustrating an embodiment of a ground switch connected to the second ground fastening portion of FIG. 7.

8B is a block diagram illustrating an embodiment of a ground switch connected to the second structure and antenna pattern of FIG. 7.

8C is a block diagram illustrating another embodiment of a ground switch connected to the second ground fastening part of FIG. 7.

9 is a graph showing a change in the resonance frequency of the antenna according to the configuration of the inductor or capacitor in FIG. 8C.

10 is a flowchart illustrating a control operation of an antenna according to an embodiment of the present invention.

11 is a view showing a method of feeding power through a coupling to an antenna pattern according to an embodiment of the present invention.

12 is a view showing a method of implementing an antenna using a carrier according to an embodiment of the present invention.

13 illustrates an electronic device in a network environment according to various embodiments of the present disclosure.

In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that various modifications, equivalents, and / or alternatives of embodiments of the present invention are included.

According to one embodiment, the electronic device 100 includes a front cover 110, a display panel 120, a bracket 130, a printed circuit board 140, a side bezel structure 150, a battery 160 and a back cover It may include (170). In some embodiments, the electronic device 100 may omit at least one of the components or additionally include other components.

According to one embodiment, the front cover 110 may be formed by a glass, at least a portion of which is substantially transparent. The glass may be formed by a glass plate or polymer plate comprising various coating layers. The front cover 110 may transmit light generated from the display panel 120 or light incident to various sensors (image sensor, iris sensor, or proximity sensor, etc.) disposed on the front of the electronic device 100. The back cover 170 may be formed by a substantially opaque cover. The cover may be formed by coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least one or more of the above materials. The side bezel structure 150 may be combined with the front cover 110 and the back cover 170 to form a housing of the electronic device 100. The housing may constitute an external appearance of the electronic device 100 and protect components disposed inside the electronic device 100 from external environments (moisture, shock, etc.).

According to an embodiment, the display panel 120 may be disposed under the glass of the front cover 110. At least a portion of the display panel 120 may be exposed through glass. In some embodiments, the edges of the display panel 120 may be formed to be substantially the same as the adjacent outer shape of the glass. In another embodiment, in order to expand the area where the display panel 120 is exposed, the distance between the outer edge of the display panel 120 and the outer edge of the glass may be substantially the same. The display panel 120 may be mounted on the first surface of the bracket 130. The display panel 120 may be connected to a processor (eg, the processor 1320 of FIG. 13) of the electronic device 100 using a flexible printed circuit board (FPCB). The display panel 120 may receive image data from the processor and display an image to be displayed by the processor. According to various embodiments of the present disclosure, the display panel 120 is electrically connected to the printed circuit board 140 to output content (eg, text, images, videos, icons, widgets, or symbols), or touch input from a user (Eg, touch, gesture, hovering, etc.) can be received.

According to an embodiment, the bracket 130 may be disposed inside the electronic device 100. For example, the bracket 130 may include a first structure 131, a second structure 132 and an antenna pattern 133. The antenna pattern 133 may be electrically connected to the second structure 132. The second structure 132 is disposed on the first surface of the first structure 131 (eg, the first surface of the bracket 130), and the antenna pattern 133 is the second surface of the first structure 131 ( Example: may be disposed on the bracket 130 (second side). The first structure 131 may be formed of a first material (eg, a polymer material), and the second structure 132 and the antenna pattern 133 may be formed of a second material (eg, a metal material). Alternatively, the second structure 132 and the antenna pattern 133 are formed of a metal material, and may be formed of the same metal material or different metal materials.

According to one embodiment, the first structure 131, the second structure 132 and the antenna pattern 133 may be integrally formed by a double injection method. For example, the second structure 132 and the antenna pattern 133 are formed, and the first structure 131 may be formed in accordance with the second structure 132.

According to one embodiment, the antenna pattern 133 may be formed by extending a portion of the second structure 132. A portion of the antenna pattern 133 may be disposed inside the first structure 131. The connection portion of the second structure 132 and the antenna pattern 133 may penetrate the first structure 131. The second structure 132 and the antenna pattern 133 can fix the first structure 131 in a surface facing each other, and improve the mechanical rigidity of the bracket 130 than the structure including only the second structure 132. Can be.

According to an embodiment, at least a portion of the second structure 132 may be used as a ground portion of the printed circuit board 140 or may be used as a ground portion of the antenna pattern 133. At least a portion of the antenna pattern 133 may be connected to a power supply portion or a ground portion of the printed circuit board 140.

According to an embodiment, at least a portion of the printed circuit board 140 may be disposed on a second surface of the bracket 130 (eg, a surface on which the antenna pattern 133 is formed). A processor (for example, the processor 1320 of FIG. 13) may be disposed on the printed circuit board 140. The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor. A wireless communication circuit (eg, the communication module 1190 of FIG. 13) may be disposed on the printed circuit board 140. The wireless communication circuit may perform short-range communication with an external device or wirelessly transmit and receive power required for charging. The printed circuit board 140 may include a ground portion. The ground portion of the printed circuit board 140 may function as a ground of an antenna implemented using a wireless communication circuit.

According to an embodiment, the battery 160 may convert chemical energy and electrical energy in both directions. For example, the battery 160 may convert chemical energy into electrical energy, and supply the converted electrical energy to various components or modules mounted on the display 120 and the printed circuit board 140. According to an embodiment, the printed circuit board 140 may include a power management module for managing charging and discharging of the battery 160.

2 to 5 describe an antenna structure using a bracket according to various embodiments of the present invention.

2 is a view showing an antenna pattern disposed at the bottom of a bracket according to an embodiment, and FIG. 3 is a view showing an antenna pattern disposed at the top of a bracket according to an embodiment. 4 is a view showing an antenna pattern disposed in an upper direction on one side of a bracket according to an embodiment, and FIG. 5 is a view showing an antenna pattern disposed in a lower direction on one side of the bracket according to an embodiment.

2 to 5, the

brackets

230, 330, 430, and 530 (eg, bracket 130) are

first structures

231, 331, 431, and 531 (eg, first structure 131). , The second structure (232, 332, 432, 532) (eg, the second structure 132) and the antenna pattern (233, 333, 433, 533) (eg, the antenna pattern 133) may be included. The

antenna patterns

233, 333, 433, and 533 may be electrically connected to the

second structures

232, 332, 432, and 532 through

pattern connecting portions

234, 334, 434, and 534. The

antenna patterns

233, 333, 433, and 533 may be formed by extending a portion of the

second structures

232, 332, 432, and 532. A portion of the

antenna patterns

233, 333, 433, and 533 may be disposed inside the

first structures

231, 331, 431, and 531.

According to an embodiment, the

second structures

232, 332, 432, and 532 and the

antenna patterns

233, 333, 433, and 533 may be simultaneously formed in a single process. Alternatively, after the

second structures

232, 332, 432, and 532 are formed, the

antenna patterns

233, 333, 433, and 533 may be formed through a separate additional process. The

second structures

232, 332, 432, 532 and the

antenna patterns

233, 333, 433, and 533 can fix the

first structures

231, 331, 431, 531 from opposite surfaces, and the second structure Mechanism stiffness of the

brackets

230, 330, 430, and 530 may be improved over a structure including only the

structures

232, 332, 432, and 532.

According to one embodiment, the second structure (232, 332, 432, 532) is disposed on the first surface of the first structure (231, 331, 431, 531), the antenna pattern (233, 333, 433, 533) May be disposed on the second surface of the first structure (231, 331, 431, 531). The

pattern connecting portions

234, 334, 434, and 534 may penetrate the

first structures

231, 331, 431, and 531. The printed circuit board (for example, the printed circuit board 140) is disposed to be seated on the second surface of the

first structures

231, 331, 431, 531, and through the

ground fastening parts

241, 341, 441, 541. It is electrically connected to the

second structures

232, 332, 432, 532, and can be electrically connected to the

antenna patterns

233, 333, 433, 533 through the power

supply fastening portions

242, 342, 442, 542.

According to one embodiment, the first structure (231, 331, 431, 531), the second structure (232, 332, 432, 532) and the antenna pattern (233, 333, 433, 533) is a double injection method integrally Can be formed. The

first structures

231, 331, 431, and 531 may be formed of different materials from the

second structures

232, 332, 432, and 532 and the

antenna patterns

233, 333, 433, and 533. For example, the

first structures

231, 331, 431, and 531 are formed of a first material (for example, a polymer material), and the

second structures

232, 332, 432, 532, and

antenna patterns

233, 333, 433 and 533) may be formed of a second material (eg, a metal material).

Referring to FIG. 2 according to an embodiment, the antenna pattern 233 may be disposed under the first structure 231. The antenna pattern 233 may be electrically connected to the second structure 232 through the pattern connection part 234. The pattern connection part 234 may penetrate the first structure 231. The antenna pattern 233 may be electrically connected to the feeding portion of the printed circuit board through the feeding fastening portion 242. The antenna pattern 233 may be formed to have the second structure 232 and a first distance D1. For example, the antenna pattern 233 has a first distance D1 and may be disposed to be parallel to the second structure 232.

Referring to FIG. 3 according to an embodiment, the antenna pattern 333 may be disposed on the top of the first structure 331. The antenna pattern 333 may be electrically connected to the second structure 332 through the pattern connection part 334. The pattern connection part 334 may penetrate the first structure 331. The antenna pattern 333 may be electrically connected to the feeding portion of the printed circuit board through the feeding fastening portion 342. The antenna pattern 333 may be formed to have the second structure 332 and a second distance D2. For example, the antenna pattern 333 has a second distance D2 and may be disposed to be parallel to the second structure 332.

Referring to FIG. 4 according to an embodiment, the antenna pattern 433 may be disposed on the side surface of the first structure 431. The antenna pattern 433 may be disposed to extend in the upper direction of the first structure 431. The antenna pattern 433 may be electrically connected to the second structure 432 through the pattern connection part 434. The pattern connection part 434 may penetrate the first structure 431. The antenna pattern 433 may be electrically connected to the feeding portion of the printed circuit board through the feeding fastening portion 442. The antenna pattern 433 may be formed to have a second structure 432 and a third distance D3. For example, the antenna pattern 433 has a third distance D3 and may be arranged to be parallel to the second structure 432.

Referring to FIG. 5 according to an embodiment, the antenna pattern 533 may be disposed on the side surface of the first structure 531. The antenna pattern 533 may be disposed to extend in a lower direction of the first structure 531. The antenna pattern 533 may be electrically connected to the second structure 532 through the pattern connection part 534. The pattern connection part 534 may penetrate the first structure 531. The antenna pattern 533 may be electrically connected to the feeding portion of the printed circuit board through the feeding fastening portion 542. The antenna pattern 533 may be formed to have a second structure 532 and a fourth distance D4. For example, the antenna pattern 533 has a fourth distance D4 and may be formed to be parallel to the second structure 532.

As described above, according to various embodiments, the

antenna patterns

233, 333, 433, and 533 together with the

second structures

232, 332, 432, and 532 as part of the

brackets

230, 330, 430, and 530 Can be formed. Therefore, the performance of the antenna of the electronic device (eg, the electronic device 100) can be maintained constant regardless of the change of the circuit mounted on the printed circuit board (eg, the printed circuit board 140). In addition, since there is no need to manufacture a separate carrier for forming the antenna pattern, the manufacturing cost of the electronic device can be reduced.

Referring to FIG. 6, the bracket 630 (eg, the bracket 130) may be disposed above the printed circuit board 640 (eg, the printed circuit board 140). According to an embodiment, the bracket 630 may include a first structure 631, a second structure 632 and an antenna pattern 633. The second structure 632 may be disposed on the first surface of the first structure 631, and the antenna pattern 633 may be disposed on the second surface of the first structure 631. The second structure 632 and the antenna pattern 633 may be electrically connected through a pattern connection part penetrating the first structure 631. A portion of the antenna pattern 633 may be disposed inside the first structure 631. The printed circuit board 640 may be coupled to the second surface of the first structure 631.

According to an embodiment, the printed circuit board 640 may include at least one ground fastening part 641 and a PCB ground part 643. The ground fastening portion 641 may be electrically connected to the PCB ground portion 643. For example, the PCB grounding portion 643 may be formed widely on the overall portion of the printed circuit board 640. The PCB ground portion 643 may be electrically connected to the second structure 632 through the ground fastening portion 641. For example, the PCB ground portion 643 and the second structure 632 may form one ground portion. Some of the at least one ground fastening part 641 may penetrate the first structure 631 and be connected to the second structure 632. A hole through which the ground fastening portion 641 passes may be formed in the first structure 631.

According to one embodiment, the printed circuit board 640 may include a power supply fastening part 642 and a PCB power supply part 644. The power supply fastening part 642 may be electrically connected to the PCB power supply part 644. The PCB feeding part 644 may feed the antenna pattern 633 through the feeding fastening part 642.

According to an embodiment, the at least one ground fastening part 641 and the power supply fastening part 642 may be a C-clip, a conductive tape, or the like.

Referring to FIG. 7, the bracket 730 (eg, the bracket 130) may include a first structure 731, a second structure 732, and an antenna pattern 733. The second structure 732 may be disposed on the first surface of the first structure 731, and the antenna pattern 733 may be disposed on the second surface of the first structure 731. The antenna pattern 733 may be electrically connected to the second structure 732 through the pattern connection part 734. The pattern connection part 734 may penetrate the first structure 731.

According to an embodiment, the second structure 732 may include a PCB grounding part (eg, a PCB grounding part) of a printed circuit board (eg, a printed circuit board 640) through at least one first grounding fastener 741. 643)). For example, the at least one first ground fastening unit 741 may include a first_1 ground fastening unit 741_1, a first_2 ground fastening unit 741_2, and a first_3 ground fastening unit 741_3. The first_1 ground fastening portion 741_1, the first_2 ground fastening portion 741_2 and the first_3 ground fastening portion 741_3 may be connected to different locations of the second structure 732. The antenna pattern 733 may be electrically connected to a PCB feeding portion (eg, PCB feeding portion 644) of the printed circuit board through a feeding fastening portion 742 (eg, a feeding fastening portion 642). Also, the antenna pattern 733 may be electrically connected to the PCB ground portion of the printed circuit board through an additional second ground fastening portion 745.

According to an embodiment, the antenna length of the electronic device (eg, the electronic device 100) may be determined according to the position of the second ground fastening part 745. For example, when the second ground fastening part 745 is not connected to the PCB ground part of the printed circuit board, the antenna length of the electronic device may be the first antenna length L1. When the second ground fastening part 745 is connected to the PCB ground part of the printed circuit board, the antenna length of the electronic device may be the second antenna length L2. When the antenna length increases, the resonance frequency of the antenna decreases, and when the antenna length decreases, the resonance frequency of the antenna may increase. Therefore, when the position of the second ground fastening part 745 is changed, the resonance frequency of the antenna of the electronic device may be changed.

According to an embodiment, an additional switch circuit may be connected between the second ground fastening part 745 and the PCB ground part of the printed circuit board. The switch circuit may connect or block at least one first ground fastening portion 741 and the PCB ground portion of the printed circuit board. Alternatively, the switch circuit may connect or block the second ground fastening part 745 and the PCB ground part of the printed circuit board. Therefore, the antenna pattern 733 can operate as an antenna having various resonance frequencies. Additional switch circuits are described in detail in FIGS. 8A-8C.

8A is a block diagram illustrating an embodiment of a ground switch connected to the antenna pattern of FIG. 7.

Referring to Figure 8a, the ground switch 801 is based on the switch control signal SW, the second ground fastening portion 845 (eg, the second ground fastening portion 745) printed circuit board (eg, a printed circuit) It may be connected to or disconnected from the PCB grounding portion 843 of the substrate 640 (eg, the PCB grounding portion 643).

According to one embodiment, the second ground fastening portion 845 may be connected to a portion of the antenna pattern 833. The ground switch 801 may be connected between the second ground fastening part 845 and the PCB ground part 843 of the printed circuit board. The ground switch 801 may receive power (PWR) from the printed circuit board. The ground switch 801 may receive a switch control signal SW from the printed circuit board. For example, the switch control signal SW may have a value of logic 0 or logic 1. When the switch control signal SW has a logic 1, the ground switch 801 is turned on to connect the second ground fastening part 845 and the PCB ground part 843 of the printed circuit board. When the switch control signal SW has logic 0, the ground switch 801 may be turned off to separate the second ground fastening part 845 and the PCB ground part 843 of the printed circuit board. However, the operation of the ground switch 801 is not limited to this.

According to an embodiment, the resonance frequency of the antenna of the electronic device (eg, the electronic device 100) may be changed according to whether the second ground fastening part 845 is connected to the PCB ground part 843 of the printed circuit board. have. For example, the resonance frequency of the antenna of the electronic device is the second ground fastening portion 845 and the PCB of the printed circuit board than the case where the second ground fastening portion 845 and the PCB ground portion 843 of the printed circuit board are separated. When the ground portion 843 is connected, it may increase relatively. In addition, when the position of the second ground fastening unit 845 is changed, the resonance frequency of the antenna of the electronic device may be changed.

Referring to FIG. 8B, the ground switch 801 may include a first ground fastening unit 841 (eg, a first ground fastening unit 741) and a first ground fastening unit 841 based on the first and second switch control signals SW1 and SW1. 2 A PCB grounding portion 843 of the printed circuit board (e.g., printed circuit board 640) (e.g., PCB grounding portion 643) Can be connected or separated by different paths.

According to one embodiment, the first ground fastening portion 841 is a 1_1 ground fastening portion 841_1 (eg, a 1_1 ground fastening portion 741_1), a 1_2 ground fastening portion 841_2 (eg, a 1_2 ground) Fasteners 741_2) and first_3 ground fasteners 841_3 (eg, first_3 ground fasteners 741_3). The first_1 ground fastening portion 841_1, the first_2 ground fastening portion 841_2, and the first_3 ground fastening portion 841_3 may be connected to a portion of the second structure 832 (eg, the second structure 732). The first_1 ground fastening portion 841_1, the first_2 ground fastening portion 841_2, and the first_3 ground fastening portion 841_3 may be connected to different locations of the second structure 832. However, the number of the first ground fastening portions 841 is not limited thereto. According to various embodiments, the second structure 832 may be connected to a larger number or a smaller number of first ground fastening portions 841. The second ground fastening part 845 may be connected to a portion of the antenna pattern 833. The ground switch 801 is between the first ground fastening portion 841 and the PCB ground portion 843 of the printed circuit board, and between the second ground fastening portion 845 and the PCB ground portion 843 of the printed circuit board. Can be connected to.

According to one embodiment, the ground switch 801 may be supplied with power (PWR) from the printed circuit board. The ground switch 801 may receive the first and second switch control signals SW1 and SW2 from a communication processor (eg, the communication module 1390) mounted on the printed circuit board. For example, each of the first and second switch control signals SW1 and SW2 may have a value of logic 0 or logic 1. The ground switch 801 is based on a combination of the first and second switch control signals SW1 and SW2, the 1_1 ground fastening unit 841_1, the 1_2 ground fastening unit 841_2, and the 1_3 ground fastening unit 841_3 And one of the second ground fastening portions 845 to the PCB ground portion 843 of the printed circuit board. However, the number of switch control signals is not limited to this. According to various embodiments, the communication processor may control the ground switch 801 through more switch control signals. The ground switch 801 connects at least one of the plurality of first ground fastening portions 841 and the plurality of second ground fastening portions 845 to the PCB ground portion 843 of the printed circuit board based on the switch control signals. Can be.

According to an embodiment, the resonance frequency of the antenna of the electronic device (eg, the electronic device 100) may be changed according to whether the first ground fastening part 841 is connected to the PCB ground part 843 of the printed circuit board. have. Also, the resonance frequency of the antenna of the electronic device may be changed according to whether the second ground fastening unit 845 is connected to the PCB grounding unit 843 of the printed circuit board. For example, the resonance frequency of the antenna of the electronic device may be the connection location between the PCB grounding portion 843 of the printed circuit board and the second structure 832 or the PCB grounding portion 843 and the antenna pattern 833 of the printed circuit board. It can be changed depending on the connection location.

8C is a block diagram illustrating another embodiment of a ground switch connected to the antenna pattern of FIG. 7.

Referring to FIG. 8C, the ground switch 801 prints the second ground fastening part 845 (eg, the second ground fastening part 745) based on the third and fourth switch control signals SW3 and SW4. The circuit board (eg, the printed circuit board 640) may be connected to or separated from each other by a different path to the PCB grounding portion 843 (eg, PCB grounding portion 643).

According to one embodiment, the second ground fastening portion 845 may be connected to a portion of the antenna pattern 833. The ground switch 801 may be connected between the second ground fastening part 845 and the PCB ground part 843 of the printed circuit board. The first passive element 802 may be connected to the ground switch 801 and the PCB ground portion 843 of the printed circuit board. The second to fourth

passive elements

803, 804, and 805 may be connected between the ground switch 801 and the second ground fastening part 845, respectively.

According to one embodiment, the ground switch 801 may be supplied with power (PWR) from the printed circuit board. The ground switch 801 may receive the third and fourth switch control signals SW3 and SW4 from a communication processor (for example, the communication module 1390) mounted on the printed circuit board. For example, each of the third and fourth switch control signals SW3 and SW4 may have a value of logic 0 or logic 1. The ground switch 801 selects and connects one of the second to fourth

passive elements

803, 804, and 805 based on a combination of the third and fourth switch control signals SW3 and SW4, or a second ground fastening unit The PCB ground portion 843 of the printed circuit board 845 can be separated. The resonant frequency of the antenna may be changed according to the type and capacity of the second to fourth

passive elements

803, 804, and 805. For example, each of the second to fourth

passive elements

803, 804, and 805 may include an inductor or a capacitor. When an inductor is connected between the second ground fastening portion 845 and the PCB ground portion 843 of the printed circuit board, the resonance frequency of the antenna may be relatively reduced. When a capacitor is connected between the second ground fastening portion 845 and the PCB ground portion 843 of the printed circuit board, the resonance frequency of the antenna may be relatively increased.

According to one embodiment, the first passive element 802 may be connected between the ground switch 801 and the PCB ground portion 843 of the printed circuit board. For example, the first passive element 802 may include an inductor or capacitor. The resonant frequency of the antenna may be determined by a combination of one selected from the first passive element 802 and the second to fourth passive elements 803, 904, and 905.

However, the configurations of the first to fourth

passive elements

802, 803, 804, and 805 and the ground switch 801 are not limited to this.

8C and 9, a resonance frequency of an antenna of an electronic device (eg, the electronic device 100) is selected from first passive elements 802 and second to fourth

passive elements

803, 804, and 805. It can be determined by one combination. According to an embodiment, when the passive element selected from the second to fourth

passive elements

803, 804, and 805 is an inductor, the resonance frequency of the antenna may be relatively reduced. The resonance frequency of the antenna may decrease in proportion to the size of the capacity of the inductor.

According to an embodiment, when the passive element selected from the second to fourth

passive elements

803, 804, and 805 is a capacitor, the resonance frequency of the antenna may be relatively increased. The resonance frequency of the antenna may increase in proportion to the size of the capacitor.

8A to 8C and 10, the electronic device (eg, the electronic device 100) changes the connection state of the PCB grounding part (eg, the PCB grounding part 843) of the printed circuit board as necessary. You can change the frequency of the antenna.

According to one embodiment, in operation 1010, the electronic device may transmit and receive a communication signal. For example, a communication processor (eg, processor 1320 or communication module 1390) is an external electronic device (eg, a first external electronic device 1302, a second external electronic device 1304, or a server 1308). In order to perform communication with the antenna, a communication signal may be transmitted and received through an antenna (for example, the antenna pattern 833).

According to one embodiment, in operation 1020, the electronic device may check the sensitivity of the communication signal. For example, the communication processor can compare the sensitivity of the communication signal with a reference value.

According to one embodiment, in operation 1030, the electronic device may change the connection state of the PCB ground. For example, when the sensitivity of the communication signal is smaller than the reference value, the communication processor may control the ground switch (eg, the ground switch 801). The communication processor may generate switch control signals (or switch control signals) (eg, first to fourth switch control signals SW1, SW2, SW3, and SW4) to control the ground switch.

According to an embodiment, the ground switch may include a plurality of first ground fastening units (eg, a first ground fastening unit 841) and a plurality of second ground fastening units based on a switch control signal (or switch control signals). For example: at least one of the second ground fasteners 845 may be connected to the PCB ground. For example, the first ground fastening part may be connected between the second structure (eg, the second structure 832) of the bracket (eg, the bracket 130) and the PCB ground part. The second ground fastening part may be connected between the antenna pattern (eg, antenna pattern 833) of the bracket and the PCB ground part. The ground switch may connect or disconnect the first ground fastening part and the PCB ground part based on the switch control signal (or switch control signals). Further, the ground switch may connect or disconnect the second ground fastening part and the PCB ground part based on the switch control signal (or switch control signals). The frequency of the antenna may be changed according to a connection state between the first grounding part (or the second grounding part) and the PCB grounding part.

According to one embodiment, in operation 1040, the electronic device may compare the sensitivity of the communication signal with a threshold value. For example, the communication processor may determine whether the frequency change of the antenna is appropriate based on the sensitivity of the communication signal. If the sensitivity of the communication signal is less than the threshold, the communication processor may repeat operation 1030 to determine an appropriate antenna frequency.

Referring to FIG. 11, the bracket 1130 (eg, the bracket 130) may include a first structure 1131, a second structure 1132 and an antenna pattern 1133. The second structure 1132 may be disposed on the first surface of the first structure 1131, and the antenna pattern 1133 may be disposed on the second surface of the first structure 1131. The antenna pattern 1133 may be electrically connected to the second structure 1132 through the pattern connection part 1134.

According to an embodiment, the printed circuit board 1140 (eg, the printed circuit board 140) may be disposed on the second surface of the first structure 1131. The power supply unit 1144 may be formed on the printed circuit board 1140. The power supply unit 1144 may be formed at a position corresponding to a portion of the antenna pattern 1133. The dielectric layer 1135 may be formed between the power supply unit 1144 and the antenna pattern 1133. The power supply unit 1144 may feed the antenna pattern 1133 through a coupling method.

Referring to FIG. 12, an antenna pattern 1207 may be formed on the carrier 1206. According to an embodiment, the printed circuit board 1240 (eg, the printed circuit board 140) may be disposed between the carrier 1206 and the bracket 1230 (eg, the bracket 130). The bracket 1230 may include a first structure 1231 and a second structure 1232. For example, the first structure 1231 may be made of a non-conductive material, and the second structure 1232 may be made of a conductive material.

According to an embodiment, the printed circuit board 1240 may include a grounding portion 1243 and a power feeding portion 1244. The power supply unit 1244 may be electrically connected to a portion of the antenna pattern 1207 through the power supply fastening unit 1208. The ground portion 1243 may be electrically connected to the antenna pattern 1208 through the first ground fastening portion 1209a. In addition, the ground portion 1243 may be electrically connected to the second structure 1232 through the second ground fastening portion 1209b. Accordingly, the volume of the antenna of the electronic device (eg, the electronic device 100) may be set to an area including the antenna pattern 1207 and the second structure 1232. If the second structure 1232 is not connected to the ground portion 1243, the volume of the antenna of the electronic device may be limited to an area including the antenna pattern 1207 and the printed circuit board 1240.

According to various embodiments of the present disclosure, an electronic device (eg, the electronic device 100) includes a first structure (eg, a first structure) in which at least a portion has non-conductivity, and is disposed on a first surface of the first structure and at least a portion A second structure having conductivity (eg, the second structure 132), and an antenna pattern electrically connected to the second structure and disposed on a second surface of the first structure (eg, the antenna pattern 133) Printed circuit board (e.g., printed circuit board) including a bracket (e.g., bracket 130), and a grounding part (e.g., PCB grounding part 643) and a feeding part (e.g., feeding part 644) (140)), the ground portion is electrically connected to the second structure, the feeding portion may be electrically connected to a portion of the antenna pattern.

According to various embodiments, the antenna pattern (eg, 233 in FIG. 2) may be disposed at the bottom of the first structure. Alternatively, the antenna pattern (eg, 333 in FIG. 3) may be disposed on the top of the first structure. Alternatively, the antenna pattern (eg, 433 in FIG. 4 or 533 in FIG. 5) may be disposed on the side surface of the first structure.

According to various embodiments, the first structure, the second structure, and the antenna pattern may be formed according to a double injection method. The antenna pattern may be arranged to be spaced apart from the second structure by a specific distance (eg, D1 in FIG. 2). The connecting portion of the antenna pattern and the second structure (eg, 234 in FIG. 2) may be configured to penetrate the first structure.

According to various embodiments, the ground part may be electrically connected to the second structure through at least one ground fastening part (eg, 241 of FIG. 2).

According to various embodiments, the ground part is electrically connected to the second structure through at least one first ground fastening part (eg, 741 of FIG. 7), and a second ground fastening part (eg, 745 of FIG. 7). Through it may be electrically connected to a specific location of the antenna pattern. A ground switch (for example, 801 in FIGS. 8A to 8C) positioned between the ground part and the second ground fastening part and electrically connecting or disconnecting the ground part and the second ground fastening part based on a switch control signal. It may further include. Further comprising a plurality of passive elements (eg, 802 to 805 in FIG. 8C) connected between the ground switch and the second ground fastening part, the ground switch based on the switch control signal, the plurality of passive elements The second ground fastening part and the ground part may be electrically connected through a selected one.

According to various embodiments of the present disclosure, the bracket includes a dielectric layer (eg, 1135 in FIG. 11) disposed between the power supply unit (eg, 1144 in FIG. 11) and the antenna pattern, and the power supply unit is a part of the antenna pattern It can be arranged at a position corresponding to the power supply to the antenna pattern through a coupling method.

According to various embodiments, the antenna structure implemented in the bracket includes a first structure having non-conductivity, conductivity, and a second structure disposed on a first surface of the first structure and electrically connected to the second structure, , It may include an antenna pattern disposed on the second surface of the first structure. The first structure, the second structure, and the antenna pattern may be formed according to a double injection method. The antenna pattern may be spaced apart from the second structure by a specific distance. The connecting portion of the antenna pattern and the second structure may be configured to penetrate the first structure.

According to various embodiments, the first structure may be formed of a different material from the second structure and the antenna pattern. The first structure may be formed of a polymer material, and the second structure and the antenna pattern may be formed of a metal material.

According to various embodiments of the present disclosure, the electronic device includes a carrier on which an antenna pattern is formed, a first structure having at least a portion of which is non-conductive, and a second structure having at least a portion of the first structure having conductivity. It may include a bracket, and a printed circuit board disposed on a second surface of the first structure, disposed between the carrier and the bracket, and including a ground portion and a power feeding portion. The ground portion may be electrically connected to the first structure and the first portion of the antenna pattern, and the feed portion may be electrically connected to the second portion of the antenna pattern. The volume of the antenna implemented by the antenna pattern may be set as an area between the second structure and the antenna pattern.

13 illustrates an electronic device 1301 (eg, electronic device 100) in a network environment 1300 according to various embodiments. An electronic device according to various embodiments disclosed in the present disclosure may be various types of devices. The electronic device is, for example, a portable communication device (for example, a smart phone), a computer device (for example, a personal digital assistant (PDA), a tablet PC (tablet PC), a laptop PC (for example, a desktop PC, a workstation, or a server). , Portable multimedia devices (e.g. e-book readers or MP3 players), portable medical devices (e.g. heart rate, blood sugar, blood pressure, or body temperature meters), cameras, or wearable devices. Types (e.g. watches, rings, bracelets, anklets, necklaces, glasses, contact lenses, or head-mounted devices (HMD)), fabrics or garments (e.g. electronic clothing), body attachments ( E.g., skin pads or tattoos), or bio-implantable circuits In some embodiments, the electronic device is, for example, a television, a digital video disk (DVD) player, an audio device, an audio accessory. Devices (e.g. speakers, headphones, or headsets), refrigerators, air conditioners, cleaners, ovens, microwaves, washing machines, air purifiers, set-top boxes, home automation control panels, security control panels, game consoles, electronic dictionaries, electronic keys, It may include at least one of a camcorder or an electronic picture frame.

In another embodiment, the electronic device includes a navigation device, a global navigation satellite system (GNSS), an event data recorder (EDR) (eg, a black box for a vehicle / ship / airplane), a car infotainment device (E.g. head-up displays for vehicles), industrial or household robots, drones, automated teller machines (ATMs), point of sales (POS) devices, measuring devices (e.g. water, electricity, or gas measuring devices), Or, it may include at least one of an Internet of Things device (eg, a light bulb, a sprinkler device, a fire alarm, a temperature controller, or a street light). The electronic device according to an embodiment of the present disclosure is not limited to the above-described devices, and, for example, a plurality of smartphones equipped with a function of measuring biometric information (eg, heart rate or blood sugar) of an individual is provided. The functions of the devices can be provided in combination. In this document, the term user may refer to a person using an electronic device or a device using an electronic device (eg, an artificial intelligence electronic device).

Referring to FIG. 13, in the network environment 1300, the electronic device 1301 communicates with the electronic device 1302 through short-range wireless communication 1398 or the electronic device 1304 or server (through the network 1399). 1308). According to an embodiment, the electronic device 1301 may communicate with the electronic device 1304 through the server 1308.

According to one embodiment, the electronic device 1301 includes a bus 1310, a processor 1320, a memory 1330, an input device 1350 (eg, a microphone or a mouse), a display device 1360, an audio module 1370 ), Sensor module 1376, interface 1377, haptic module 1379, camera module 1380, power management module 1388, and battery 1389, communication module 1390, and subscriber identification module 1396 ). In some embodiments, the electronic device 1301 may omit at least one of the components (for example, the display device 1360 or the camera module 1380) or additionally include other components.

The bus 1310 may include circuits that connect the components 1320-1390 to each other and transfer signals (eg, control messages or data) between the components.

The processor 1320 may be one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), an image signal processor (ISP) of a camera, or a communication processor (CP). Or more. According to an embodiment, the processor 1320 may be implemented as a system on chip (SoC) or a system in package (SiP). The processor 1320 may control, for example, at least one other component (eg, hardware or software component) of the electronic device 1301 connected to the processor 1320 by driving an operating system or an application program. , Can perform various data processing and operation. The processor 1320 loads and processes instructions or data received from at least one of other components (for example, the communication module 1390) into the volatile memory 1332, and stores the result data in the non-volatile memory 1334. Can be.

The memory 1330 may include a volatile memory 1332 or a non-volatile memory 1334. The volatile memory 1332 may be configured of, for example, random access memory (RAM) (eg, DRAM, SRAM, or SDRAM). The non-volatile memory 1334 includes, for example, programmable read-only memory (PROM), one time PROM (OTPROM), erasable PROM (EPROM), electrically EPROM (EEPROM), mask ROM, flash ROM, flash memory, HDD (hard disk drive), or solid state drive (SSD). Also, the non-volatile memory 1334 may be an internal memory 1336 disposed therein, or a stand-alone type exterior that can be connected and used only when necessary, depending on the connection form with the electronic device 1301 It may be configured as a memory 1338. The external memory 1338 is a flash drive, for example, compact flash (CF), secure digital (SD), micro-SD, mini-SD, extreme digital (xD), multi-media card (MMC) , Or a memory stick. The external memory 1338 may be functionally or physically connected to the electronic device 1301 through a wired (eg, cable or universal serial bus (USB)) or wireless (eg, Bluetooth).

The memory 1330 may store, for example, instructions or data related to at least one other software component of the electronic device 1301, for example, the program 1340. The program 1340 may include, for example, a kernel 1341, a library 1343, an application framework 1345, or an application program (interchangeably "application") 1347.

The input device 1350 may include a microphone, mouse, or keyboard. According to an embodiment, the keyboard may be connected as a physical keyboard or may be displayed as a virtual keyboard through the display device 1360.

The display device 1360 may include a display, a hologram device, or a projector and a control circuit for controlling the device. The display may include, for example, a liquid crystal display (LCD), light emitting diode (LED) display, organic light emitting diode (OLED) display, micro electromechanical system (MEMS) display, or electronic paper display. . The display may be implemented to be flexible, transparent, or wearable according to an embodiment. The display may include a touch circuitry that can sense a user's touch, gesture, proximity, or hovering input or a pressure sensor (interchangeably "force sensor") that can measure the intensity of pressure on the touch. Can be. The touch circuit or the pressure sensor may be implemented integrally with the display, or may be implemented with one or more sensors separate from the display. The hologram device may show a stereoscopic image in the air using interference of light. The projector can display an image by projecting light on the screen. The screen may be located, for example, inside or outside the electronic device 1301.

The audio module 1370 may convert, for example, sound and electric signals in both directions. According to an embodiment, the audio module 1370 acquires sound through the input device 1350 (eg, a microphone) or an output device (not shown) included in the electronic device 1301 (eg, a speaker or Sound through an external electronic device (e.g., electronic device 1302 (e.g., wireless speaker or wireless headphones) or electronic device 1306 (e.g., wired speaker or wired headphones)) connected to the electronic device 1301, or a receiver. Can output

The sensor module 1376 measures or detects an operating state (eg, power or temperature) inside the electronic device 1301 or an external environmental state (eg, altitude, humidity, or brightness), for example, An electrical signal or data value corresponding to the measured or sensed state information may be generated. The sensor module 1376 includes, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, and a color sensor (eg, RGB (red, green, blue) sensor) , IR (infrared) sensor, biometric sensor (e.g. iris sensor, fingerprint sensor, or heartbeat rate monitoring (HRM) sensor, electronic nose sensor, electromyography (EMG) sensor, electroencephalogram (EGG) sensor, electrocardiogram (ECG) Sensor), a temperature sensor, a humidity sensor, an illuminance sensor, or an ultra violet (UV) sensor. The sensor module 1376 may further include a control circuit for controlling at least one sensor included therein. In some embodiments, the electronic device 1301 may control the sensor module 1376 using a processor 1320 or a processor (eg, a sensor hub) separate from the processor 1320. In the case of using a separate processor (eg, a sensor hub), the electronic device 1301 does not wake the processor 1320 while the processor 1320 is in a sleep state, and operates the sensor module by operating a separate processor. At least a part of the operation or state of 1376 can be controlled.

Interface 1377, according to an embodiment, HDMI (high definition multimedia interface), USB, optical interface (optical interface), RS-232 (recommended standard 232), D-sub (D-subminiature), MHL (mobile) It may include a high-definition link (SD) interface, an SD card / multi-media card (MMC) interface, or an audio interface. The connection terminal 1378 may physically connect the electronic device 1301 and the electronic device 1306. According to an embodiment, the connection terminal 1378 may include, for example, a USB connector, an SD card / MMC connector, or an audio connector (eg, a headphone connector).

The haptic module 1379 may convert electrical signals into mechanical stimuli (eg, vibration or movement) or electrical stimuli. For example, the haptic module 1379 can provide stimuli associated with tactile or motor sensation to the user. The haptic module 1379 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 1380 may, for example, photograph still images and videos. The camera module 1380, according to an embodiment, may include one or more lenses (eg, wide-angle and telephoto lenses, or front and rear lenses), an image sensor, an image signal processor, or a flash (eg, a light emitting diode or xenon lamp) (xenon lamp), etc.).

The power management module 1388 is a module for managing power of the electronic device 1301, and may be configured, for example, as at least a part of a power management integrated circuit (PMIC).

The battery 1389 may be recharged by an external power source, including, for example, a primary cell, a secondary cell, or a fuel cell, to supply power to at least one component of the electronic device 1301.

The communication module 1390, for example, establishes a communication channel between the electronic device 1301 and an external device (eg, the first external electronic device 1302, the second external electronic device 1304, or the server 1308). And wired or wireless communication through the established communication channel. According to one embodiment, the communication module 1390 includes a wireless communication module 1392 or a wired communication module 1394, and among them, a first network 1398 (eg, Bluetooth or IrDA) using a corresponding communication module. A short-range communication network such as (infrared data association) or a second network 1399 (eg, a telecommunication network such as a cellular network) may communicate with an external device.

The wireless communication module 1392 may support cellular communication, short-range wireless communication, or GNSS communication, for example. Cellular communication, for example, long-term evolution (LTE), LTE Advance (LTE-A), code division multiple access (CDMA), wideband CDMA (WCDMA), universal mobile telecommunications system (UMTS), Wireless Broadband (WiBro) ), Or GSM (Global System for Mobile Communications). Short-range wireless communication includes, for example, wireless fidelity (Wi-Fi), Wi-Fi Direct, light fidelity (Li-Fi), Bluetooth, Bluetooth low energy (BLE), Zigbee, near field communication (NFC), MST ( magnetic secure transmission (RF), radio frequency (RF), or body area network (BAN). The GNSS may include, for example, Global Positioning System (GPS), Global Navigation Satellite System (Glonass), Beidou Navigation Satellite System (“Beidou”) or Galileo (the European global satellite-based navigation system). In this document, "GPS" may be used interchangeably with "GNSS".

According to one embodiment, when the wireless communication module 1392 supports cellular communication, for example, the identification and authentication of the electronic device 1301 within the communication network using the subscriber identification module 1396 is performed. can do. According to an embodiment, the wireless communication module 1392 may include a CP separate from the processor 1320 (eg, an AP). In this case, the CP may, for example, replace the processor 1320 while the processor 1320 is in an inactive (eg, sleep) state, or the processor 1320 while the processor 1320 is in an active state. Together, at least some of the functions related to at least one of the components 1310-1396 of the electronic device 1301 may be performed. According to an embodiment, the wireless communication module 1392 may be configured of a plurality of communication modules that support only a corresponding communication method among a cellular communication module, a short-range wireless communication module, or a GNSS communication module.

The wired communication module 1394 may include, for example, a local area network (LAN), power line communication, or plain old telephone service (POTS).

The first network 1398 includes, for example, Wi-Fi Direct or Bluetooth capable of transmitting or receiving commands or data through a wireless direct connection between the electronic device 1301 and the first external electronic device 1302. It can contain. The second network 1399 may be, for example, a telecommunication network (eg, a local area network (LAN)) capable of transmitting or receiving commands or data between the electronic device 1301 and the second external electronic device 1304. Computer networks, such as a wide area network (WAN), the Internet, or a telephone network.

According to various embodiments, the command or the data may be transmitted or received between the electronic device 1301 and the second external electronic device 1304 through a server 1308 connected to a second network. Each of the first and second external

electronic devices

1302 and 1304 may be the same or a different type of device from the electronic device 1301. According to various embodiments, all or some of the operations executed in the electronic device 1301 may be executed in another one or a plurality of electronic devices (for example, the

electronic devices

1302, 1304, or the server 1308). According to an example, when the electronic device 1301 needs to perform a function or service automatically or by request, the electronic device 1301 may execute the function or service on its own, or in addition, at least associated with it. Some functions may be requested from other devices (eg,

electronic devices

1302, 1304, or server 1308.) Other electronic devices (eg,

electronic devices

1302, 1304, or server 1308) may be requested. A function or an additional function may be executed, and the result may be transmitted to the electronic device 1301. The electronic device 1301 may provide the requested function or service by processing the received result as it is or additionally. For example, cloud computing, distributed computing, or client-server computing technology can be used.

It should be understood that various embodiments of the document and terms used therein are not intended to limit the technology described in this document to specific embodiments, and include various modifications, equivalents, and / or replacements of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar elements. Singular expressions may include plural expressions unless the context clearly indicates otherwise. In this document, expressions such as "A or B", "at least one of A and / or B", "A, B or C" or "at least one of A, B and / or C", etc. are all of the items listed together. Possible combinations may be included. Expressions such as "first," "second," "first," or "second," can modify the components, regardless of order or importance, to distinguish one component from another component It is used but does not limit the components. When it is said that one (eg, first) component is “connected (functionally or communicatively)” to another (eg, second) component or is “connected,” the component is the other It may be directly connected to the component, or may be connected through another component (eg, the third component).

In this document, "adapted to or configured to" is changed to be "appropriate for," having the ability to "appropriate," for example, in hardware or software. It can be used interchangeably with "" made to, "" can do, "or" designed to ". In some situations, the expression "a device configured to" may mean that the device "can" with other devices or parts. For example, the phrase "processor configured (or configured) to perform A, B, and C" refers to a dedicated processor (eg, an embedded processor) or memory device (eg, memory 1330) to perform the corresponding operations. By executing one or more stored programs, it may mean a general-purpose processor (eg, CPU or AP) capable of performing the corresponding operations.

As used herein, the term "module" includes a unit composed of hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit. Can be. The "module" may be an integrally configured component or a minimum unit that performs one or more functions or a part thereof. The "module" may be implemented mechanically or electronically, for example, an application-specific integrated circuit (ASIC) chip, field-programmable gate arrays (FPGAs), known or to be developed in the future, performing certain operations, or It may include a programmable logic device.

Instructions stored in a computer-readable storage medium (eg, memory 1330) in the form of a program module, at least a portion of a device (eg, modules or functions thereof) or method (eg, operations) according to various embodiments Can be implemented as When the instruction is executed by a processor (for example, the processor 1320), the processor may perform a function corresponding to the instruction. Computer-readable recording media include hard disks, floppy disks, magnetic media (eg magnetic tapes), optical recording media (eg CD-ROMs, DVDs, magnetic-optical media (eg floptical disks), internal memory, etc. The instructions may include code generated by a compiler or code executable by an interpreter.

Each component (eg, a module or a program module) according to various embodiments may be composed of a singular or a plurality of entities, and some of the aforementioned sub-components may be omitted, or other sub-components may be omitted. It may further include. Alternatively or additionally, some components (eg, modules or program modules) may be integrated into one entity, performing the same or similar functions performed by each corresponding component before being integrated. Operations performed by a module, program module, or other component according to various embodiments may be sequentially, parallel, repetitively, or heuristically executed, or at least some operations may be executed in a different order, omitted, or other operations This can be added.

Claims

In the electronic device,

A first structure having at least a portion of a non-conductive structure, a second structure disposed on a first surface of the first structure and having at least a portion of conductivity, and electrically connected to the second structure, and a second structure of the first structure A bracket including an antenna pattern disposed on the surface; And

It includes a printed circuit board including a ground portion and the power supply,

The ground portion is electrically connected to the second structure,

The power supply unit is an electronic device electrically connected to a part of the antenna pattern.
The method according to claim 1,

The antenna pattern is an electronic device disposed on an upper, lower, or side surface of the first structure.
The method according to claim 1,

An electronic device in which the first structure, the second structure, and the antenna pattern are formed according to a double injection method.
The method according to claim 1,

The antenna pattern is an electronic device spaced apart from the second structure by a specific distance.
The method according to claim 1,

An electronic device configured to connect the antenna pattern to the second structure through the first structure.
The method according to claim 1,

The ground unit is an electronic device that is electrically connected to the second structure through at least one ground fastening unit.
The method according to claim 1,

The ground portion is an electronic device that is electrically connected to the second structure through at least one first ground fastening portion, and is electrically connected to a specific location of the antenna pattern through a second ground fastening portion.
The method according to claim 7,

And a ground switch positioned between the ground part and the second ground fastening part and electrically connecting or disconnecting the ground part and the second ground fastening part based on a switch control signal.
The method according to claim 8,

Further comprising a plurality of passive elements connected between the ground switch and the second ground fastening portion,

The ground switch is an electronic device that electrically connects the second ground fastening part and the ground part through a selected one of the plurality of passive elements based on the switch control signal.
The method according to claim 1,

The bracket includes a dielectric layer disposed between the feeder and the antenna pattern,

The power supply unit is disposed at a position corresponding to a portion of the antenna pattern, the electronic device for feeding the antenna pattern through a coupling method.
In the antenna structure implemented in the bracket,

A first structure having non-conductivity;

A second structure having conductivity and disposed on a first surface of the first structure;

An antenna structure including an antenna pattern electrically connected to the second structure and disposed on a second surface of the first structure.
The method according to claim 11,

The first structure is an antenna structure formed of a material different from the second structure and the antenna pattern.
The method according to claim 12,

The first structure is formed of a polymer material,

The second structure and the antenna pattern are antenna structures formed of a metal material.
A carrier on which an antenna pattern is formed;

A bracket including a first structure having at least a portion of a non-conductive property, and a second structure of at least a portion of the first structure having a conductivity; And

Disposed on the second surface of the first structure, disposed between the carrier and the bracket, and includes a printed circuit board including a ground portion and a power feeding portion,

The ground portion is electrically connected to the first structure and the first portion of the antenna pattern,

The power supply unit is an electronic device that is electrically connected to the second portion of the antenna pattern.
The method according to claim 14,

The volume of the antenna implemented by the antenna pattern is set to an area between the second structure and the antenna pattern.