WO2017145966A1 - Pressure sensor - Google Patents

Pressure sensor Download PDF

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Publication number
WO2017145966A1
WO2017145966A1 PCT/JP2017/006058 JP2017006058W WO2017145966A1 WO 2017145966 A1 WO2017145966 A1 WO 2017145966A1 JP 2017006058 W JP2017006058 W JP 2017006058W WO 2017145966 A1 WO2017145966 A1 WO 2017145966A1
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WO
WIPO (PCT)
Prior art keywords
diaphragm
temperature
pressure sensor
pressure
present
Prior art date
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PCT/JP2017/006058
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French (fr)
Japanese (ja)
Inventor
高橋 浩司
山本 健太郎
Original Assignee
株式会社バルコム
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Publication date
Application filed by 株式会社バルコム filed Critical 株式会社バルコム
Priority to CN201780011855.6A priority Critical patent/CN108700480A/en
Priority to JP2018501656A priority patent/JP6728329B2/en
Publication of WO2017145966A1 publication Critical patent/WO2017145966A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00Measuring or testing not otherwise provided for
    • G01D21/02Measuring two or more variables by means not covered by a single other subclass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/02Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
    • G01L9/04Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges

Definitions

  • the present invention relates to a pressure sensor that can also measure temperature.
  • Patent Literature a sensor capable of measuring pressure and temperature by providing a sensor capable of detecting temperature to a pressure sensor in which a pressure detection gauge such as a strain gauge is provided on a diaphragm is known (Patent Literature). 1 and 2).
  • the pressure detection gauge in order to increase the pressure measurement accuracy, the pressure detection gauge must be appropriately deformed. Therefore, depending on the mounting structure of the sensor capable of detecting temperature, the deformation of the diaphragm may be hindered, and the deformation of the pressure detection gauge may be adversely affected.
  • An object of the present invention is to provide a pressure sensor that enables measurement of the temperature of a measurement object while suppressing a decrease in pressure measurement accuracy.
  • the present invention employs the following means in order to solve the above problems.
  • the pressure sensor of the present invention is A diaphragm having a thick portion at the center and a thin portion having a thinner thickness than the thick portion around the thick portion; A pressure detecting gauge provided on a surface opposite to the surface in contact with the measurement target in the thin portion; A temperature-sensitive element provided on the surface opposite to the surface on which the measurement object is in contact with the thick-walled portion; It is characterized by providing.
  • the pressure detection gauge is provided on the thin portion of the diaphragm, the diaphragm is easily deformed at the position where the pressure detection gauge is provided. Therefore, the pressure detection gauge is also easily deformed, and it is possible to suppress a decrease in pressure measurement accuracy.
  • the temperature sensitive element is provided in the thick part of the diaphragm, the temperature sensitive element is hardly affected by the deformation of the diaphragm even when the diaphragm is deformed.
  • the pressure sensor of the present invention can be applied to either a strain gauge type pressure sensor or a thin film gauge type pressure sensor.
  • the thick portion may be provided with a recess, and the temperature sensitive element may be provided at the bottom of the recess.
  • the temperature sensing element approaches the measurement object, the temperature measurement accuracy can be increased.
  • FIG. 1 is a schematic configuration diagram of a pressure sensor according to a first embodiment of the present invention.
  • FIG. 2 is a plan view of the sensor main body of the pressure sensor according to the first embodiment of the present invention.
  • FIG. 3 is a schematic cross-sectional view of the sensor main body of the pressure sensor according to the first embodiment of the present invention.
  • FIG. 4 is a plan view of the sensor main body of the pressure sensor according to the second embodiment of the present invention.
  • FIG. 5 is a part of a schematic cross-sectional view of a pressure sensor according to Embodiment 2 of the present invention.
  • FIG. 6 is a schematic configuration diagram of a temperature sensor according to a reference example.
  • FIG. 1 is a schematic configuration diagram of a pressure sensor according to a first embodiment of the present invention.
  • FIG. 2 is a plan view of the sensor main body of the pressure sensor according to the first embodiment of the present invention.
  • FIG. 3 is a schematic cross-sectional view of the sensor main body of the pressure sensor according to the first embodiment of the present invention. 3 is a cross-sectional view taken along the line AA in FIG.
  • the pressure sensor 10 includes a sensor main body 100 and a case 200 of the sensor main body 100.
  • the sensor main body 100 is electrically connected to the pressure display device 410 and the temperature display device 420 by a plurality of wires 300.
  • the case where the pressure display device 410 and the temperature display device 420 are provided separately is shown for convenience of explanation. However, both pressure and temperature may be displayed on one display device.
  • each member, such as the sensor main body 100 is simply shown.
  • the sensor main-body part 100 which is the principal part of the pressure sensor 10 which concerns on a present Example is demonstrated.
  • the sensor main body 100 includes a metal diaphragm 110, a pressure detection gauge (hereinafter referred to as a gauge 120) for measuring pressure, and a temperature sensitive element 130 for measuring temperature.
  • the diaphragm 110 integrally includes a substantially disc portion 111 having a circular planar shape, a cylindrical portion 112, and an outward flange portion 113.
  • the substantially disc part 111 has the thick part 111a provided in the center, and the thin part 111b provided in the circumference
  • the outer diameter of the cylindrical portion 112 is substantially smaller than the outer diameter of the disc portion 111.
  • the outer diameter of the outward flange portion 113 is slightly larger than the outer diameter of the substantially disc portion 111.
  • the outer peripheral surface 113a of the outward flange portion 113 is fixed to the inner peripheral surface of the case 200 described above. However, the diaphragm 110 and the case 200 may be integrated.
  • a space (S) surrounded by the substantially disc portion 111 and the cylindrical portion 112 is formed.
  • the substantially disc portion 111 is deformed according to the pressure of the measurement object in this space (S).
  • the outer diameter of the outward flange portion 113 is slightly larger than the outer diameter of the substantially disc portion 111, and is between the outer peripheral surface of the substantially disc portion 111 and the inner peripheral surface of the case 200. A gap is formed. Accordingly, the case 200 does not hinder the deformation of the substantially disc portion 111.
  • the gauge 120 is provided in the surface on the opposite side to the surface which the measuring object contacts in the thin part 111b of the substantially disc part 111.
  • FIG. There are a total of four gauges 120 at regular intervals in the circumferential direction. Since the pressure sensor itself in which the bridge circuit is configured by the four gauges 120 is a known technique (for example, see Japanese Patent Application Laid-Open No. 2002-131159), description thereof is omitted.
  • Each gauge 120 is electrically connected to the pressure display device 410 through the wiring 300 described above. In the pressure display device 410, the pressure obtained based on the electrical signal corresponding to the strain amount of each gauge 120 (the electrical signal obtained by converting the resistance value changed by the strain amount into the electrical amount) is displayed. To do.
  • the temperature sensitive element 130 is provided on the surface of the thick portion 111a of the substantially disc portion 111 on the opposite side to the surface that is in contact with the measurement target.
  • the temperature sensing element 130 has a function of converting temperature into an electric quantity.
  • the temperature sensing element 130 is electrically connected to the temperature display device 420 through the wiring 300 described above. In the temperature display device 420, the temperature obtained based on the electrical signal sent from the temperature sensing element 130 is displayed.
  • the temperature sensitive element 130 is preferably attached to the thick portion 111a with a heat radiating silicon adhesive having a high heat radiating effect.
  • ⁇ Excellent point of pressure sensor according to this embodiment> According to the pressure sensor 10 according to the present embodiment, by providing the diaphragm 110 with the temperature sensitive element 130, it is possible to measure not only the pressure to be measured but also the temperature.
  • the gauge 120 is provided on the thin portion 111 b in the diaphragm 110. Therefore, the diaphragm 110 is easily deformed at the position where the gauge 120 is provided. Therefore, the gauge 120 is also easily deformed, and it can be suppressed that the pressure measurement accuracy is lowered.
  • the temperature sensing element 130 is provided in the thick portion 111 a of the diaphragm 110, the temperature sensing element 130 is hardly affected by the deformation of the diaphragm 110 even when the diaphragm 110 is deformed. Therefore, even when the diaphragm 110 is deformed, the temperature sensing element 130 is not easily adversely affected, and the temperature sensing element 130 can also be prevented from obstructing the deformation of the diaphragm 110.
  • the pressure sensor according to the present embodiment can be applied to either a strain gauge type pressure sensor or a thin film gauge type pressure sensor. In the case of a strain gauge type pressure sensor, a film-like strain gauge is used as the gauge 120.
  • the strain gauge is attached to the substantially disc portion 111 by being affixed on the substantially disc portion 111 of the diaphragm 110.
  • the gauge 120 is formed by sputtering. More specifically, an insulating film is formed on the entire surface of the substantially disc portion 111 in the diaphragm 110, and the gauge 120 is formed on the upper surface of the insulating film by sputtering.
  • FIG. 4 is a plan view of the sensor main body of the pressure sensor according to the second embodiment of the present invention.
  • FIG. 5 is a part of a schematic cross-sectional view of a pressure sensor according to Embodiment 2 of the present invention. 5 corresponds to the BB cross section in FIG. Since the basic configuration and operation are the same as those in the first embodiment, the same components are denoted by the same reference numerals, and the description thereof is omitted as appropriate.
  • the sensor main body 100a which is a main part of the pressure sensor according to the present embodiment, includes a metal diaphragm 110, a gauge 120 for measuring pressure, and a temperature sensitive element 130 for measuring temperature. .
  • the diaphragm 110 integrally includes a substantially disc portion 111 having a circular planar shape, a cylindrical portion 112, and an outward flange portion 113.
  • the substantially disc part 111 has the thick part 111a provided in the center, and the thin part 111b provided in the circumference
  • the outer diameter of the cylindrical portion 112 is substantially smaller than the outer diameter of the disc portion 111.
  • the outer diameter of the outward flange portion 113 is slightly larger than the outer diameter of the substantially disc portion 111.
  • the outer peripheral surface 113a of the outward flange portion 113 is fixed to the inner peripheral surface of the case 200 described above. However, the diaphragm 110 and the case 200 may be integrated.
  • the thick portion 111a of the substantially disc portion 111 is provided with a recess 111aa.
  • a space (S) surrounded by the substantially disc portion 111 and the cylindrical portion 112 is formed.
  • the substantially disc portion 111 is deformed according to the pressure of the measurement object in this space (S).
  • the outer diameter of the outward flange portion 113 is slightly larger than the outer diameter of the substantially disc portion 111, and is between the outer peripheral surface of the substantially disc portion 111 and the inner peripheral surface of the case 200. A gap is formed. Therefore, the case 200 does not hinder the deformation of the substantially disc portion 111.
  • the gauge 120 is provided in the surface on the opposite side to the surface which the measuring object contacts in the thin part 111b of the substantially disc part 111.
  • FIG. There are a total of four gauges 120 at regular intervals in the circumferential direction. Since the gauge 120 is as described in the first embodiment, the description thereof is omitted.
  • the temperature sensitive element 130 is provided on the surface of the thick portion 111a of the substantially disc portion 111 on the opposite side to the surface that is in contact with the measurement target.
  • the temperature sensitive element 130 is provided at the bottom of the concave portion 111aa provided in the thick portion 111a.
  • the configuration of the temperature sensing element 130 itself and the electrical connection with the temperature display device are as described in the first embodiment. Also in the present embodiment, it is desirable that the temperature sensitive element 130 is attached to the thick portion 111a with a heat dissipation silicon adhesive having a high heat dissipation effect.
  • a metal cover 140 is provided on the substantially disc portion 111 of the diaphragm 110 so as to cover the temperature sensing element 130.
  • the case 200 is provided with a stopper 500.
  • the stopper 500 is provided at a position facing the cover 140 and exerts a function of regulating the deformation amount of the diaphragm 110 by contacting the cover 140 when the diaphragm 110 is deformed toward the cover 140 side.
  • the same effect as in the first embodiment can be obtained.
  • the thick portion 111a of the diaphragm 110 is provided with a recess 111aa, and the temperature sensitive element 130 is provided at the bottom of the recess 111aa.
  • the temperature sensitive element 130 approaches a measuring object, the temperature measurement accuracy can be increased.
  • the cover 140 that covers the temperature sensing element 130 and the diaphragm 110 are deformed toward the cover 140 side, the amount of deformation of the diaphragm 110 is reduced by contacting the cover 140.
  • a restricting stopper 500 is provided.
  • the pressure sensor according to this embodiment can be applied to both a strain gauge type pressure sensor and a thin film gauge type pressure sensor.
  • FIG. 6 is a schematic configuration diagram of a temperature sensor according to a reference example.
  • a temperature sensor 500 according to this reference example includes an annular housing 510 and a diaphragm 520 fixed to an inner peripheral surface of one end side (lower end side in the drawing) of the housing 510.
  • the diaphragm 520 according to this reference example is constituted by a disk-like member, unlike the diaphragm in the above embodiment.
  • a temperature sensing element 530 is provided on the surface on the other end side of the diaphragm 520.
  • the temperature sensing element 530 has a function of converting temperature into an electric quantity.
  • the temperature sensing element 530 is electrically connected to the temperature display device 550 through a wiring 540.
  • the temperature display device 550 the temperature obtained based on the electrical signal sent from the temperature sensing element 530 is displayed.
  • the temperature sensitive element 530 is desirably attached to the diaphragm 520 with a heat dissipating silicon adhesive having a high heat dissipating effect.
  • the temperature sensor 500 configured as described above is attached to a tank or the like in which a measurement object is stored.
  • the temperature sensor 500 is attached to a tank or the like so that the object to be measured exists on the opposite side of the diaphragm 520 from the side where the temperature sensing element 530 is provided.
  • a structure has been adopted in which temperature is measured by a protruding member protruding toward a measurement object in a tank.
  • the temperature sensor 500 according to the present reference example since the measurement target side is the plane of the diaphragm 520, there is an advantage that foreign matter is hardly attached and temperature measurement can be stably performed over a long period of time. .
  • Pressure sensor 100,100a Sensor main-body part 110 Diaphragm 111 Substantially disc part 111a Thick part 111aa Recessed part 111b Thin part 112 Cylindrical part 113 Outward flange part 113a Outer peripheral surface 120 Gauge (Pressure detection gauge) 130 Temperature Sensing Element 140 Cover 200 Case 300 Wiring 410 Pressure Display Device 420 Temperature Display Device 500 Stopper

Abstract

Provided is a pressure sensor which is capable of inhibiting reduction in accuracy of pressure measurement while being capable of measuring the temperature of an object to be measured. The present invention is characterized by including: a diaphragm 110 that has a thick portion 111a at the center thereof and has, around the thick portion 111a, a thin portion 111b thinner than the thick portion 111a; gauges 120 that are provided on a surface, of the thin portion 111b, opposite to a surface with which an object to be measured is brought into contact; and a temperature sensing element 130 that is provided on a surface, of the thick portion 111a, opposite to a surface with which the object to be measured is brought into contact.

Description

圧力センサPressure sensor
 本発明は、温度の測定も可能な圧力センサに関する。 The present invention relates to a pressure sensor that can also measure temperature.
 従来、ダイアフラム上に歪ゲージなどの圧力検出用ゲージが設けられた圧力センサに、温度を検出可能なセンサを設けることで、圧力と温度の測定を可能とするセンサが知られている(特許文献1,2参照)。ここで、圧力の測定精度を高めるためには、圧力検出用ゲージが適切に変形しなければならない。そのため、温度を検出可能なセンサの取り付け構造によっては、ダイアフラムの変形の妨げとなってしまい、圧力検出用ゲージの変形に悪影響が及ぼされる可能性がある。しかしながら、従来、そのような点に着目された技術は見当たらない。 Conventionally, a sensor capable of measuring pressure and temperature by providing a sensor capable of detecting temperature to a pressure sensor in which a pressure detection gauge such as a strain gauge is provided on a diaphragm is known (Patent Literature). 1 and 2). Here, in order to increase the pressure measurement accuracy, the pressure detection gauge must be appropriately deformed. Therefore, depending on the mounting structure of the sensor capable of detecting temperature, the deformation of the diaphragm may be hindered, and the deformation of the pressure detection gauge may be adversely affected. However, there has been no technology that has focused on such a point.
実開昭62-174247号公報Japanese Utility Model Publication No. 62-174247 特開2008-39760号公報JP 2008-39760 A
 本発明の目的は、測定対象の温度の測定を可能としつつ、圧力の測定精度の低下を抑制可能とする圧力センサを提供することにある。 An object of the present invention is to provide a pressure sensor that enables measurement of the temperature of a measurement object while suppressing a decrease in pressure measurement accuracy.
 本発明は、上記課題を解決するために以下の手段を採用した。 The present invention employs the following means in order to solve the above problems.
 すなわち、本発明の圧力センサは、
 中央に厚肉部を有し、該厚肉部の周囲に該厚肉部よりも肉厚の薄い薄肉部を有するダイアフラムと、
 前記薄肉部における測定対象が接する面とは反対側の面に設けられる圧力検出用ゲージと、
 前記厚肉部における測定対象が接する面とは反対側の面に設けられる感温素子と、
を備えることを特徴とする。
That is, the pressure sensor of the present invention is
A diaphragm having a thick portion at the center and a thin portion having a thinner thickness than the thick portion around the thick portion;
A pressure detecting gauge provided on a surface opposite to the surface in contact with the measurement target in the thin portion;
A temperature-sensitive element provided on the surface opposite to the surface on which the measurement object is in contact with the thick-walled portion;
It is characterized by providing.
 本発明によれば、圧力検出用ゲージは、ダイアフラムにおける薄肉部上に設けられているため、圧力検出用ゲージが設けられている位置においては、ダイアフラムは変形し易い。従って、圧力検出用ゲージも変形し易く、圧力の測定精度が低下してしまうことを抑制できる。また、感温素子は、ダイアフラムにおける厚肉部に設けられているため、ダイアフラムが変形した状態においても、感温素子はダイアフラムの変形による影響を受け難い。なお、本発明の圧力センサは、歪ゲージ式の圧力センサと薄膜ゲージ式の圧力センサのいずれにも適用可能である。 According to the present invention, since the pressure detection gauge is provided on the thin portion of the diaphragm, the diaphragm is easily deformed at the position where the pressure detection gauge is provided. Therefore, the pressure detection gauge is also easily deformed, and it is possible to suppress a decrease in pressure measurement accuracy. In addition, since the temperature sensitive element is provided in the thick part of the diaphragm, the temperature sensitive element is hardly affected by the deformation of the diaphragm even when the diaphragm is deformed. The pressure sensor of the present invention can be applied to either a strain gauge type pressure sensor or a thin film gauge type pressure sensor.
 前記厚肉部には凹部が設けられ、該凹部の底に前記感温素子が設けられているとよい。 The thick portion may be provided with a recess, and the temperature sensitive element may be provided at the bottom of the recess.
 これにより、感温素子は、測定対象に近づくため、温度の測定精度を高めることができる。 Thereby, since the temperature sensing element approaches the measurement object, the temperature measurement accuracy can be increased.
 前記感温素子を覆うカバーと、
 前記カバーに対向する位置に設けられ、前記ダイアフラムが前記カバー側に向かって変形した際に、前記カバーに当接することで、前記ダイアフラムの変形量を規制するストッパと、
 を備えるとよい。
A cover covering the temperature sensing element;
A stopper that is provided at a position facing the cover and restricts the amount of deformation of the diaphragm by contacting the cover when the diaphragm is deformed toward the cover;
It is good to have.
 これにより、ダイアフラムが変形し過ぎることを抑制でき、各部材の損傷を抑制することができる。 Thereby, it is possible to suppress the diaphragm from being deformed excessively and to suppress damage to each member.
 以上説明したように、本発明によれば、測定対象の温度の測定を可能としつつ、圧力の測定精度の低下を抑制することができる。 As described above, according to the present invention, it is possible to measure the temperature of the measurement object and suppress a decrease in pressure measurement accuracy.
図1は本発明の実施例1に係る圧力センサの概略構成図である。FIG. 1 is a schematic configuration diagram of a pressure sensor according to a first embodiment of the present invention. 図2は本発明の実施例1に係る圧力センサのセンサ本体部の平面図である。FIG. 2 is a plan view of the sensor main body of the pressure sensor according to the first embodiment of the present invention. 図3は本発明の実施例1に係る圧力センサのセンサ本体部の模式的断面図である。FIG. 3 is a schematic cross-sectional view of the sensor main body of the pressure sensor according to the first embodiment of the present invention. 図4は本発明の実施例2に係る圧力センサのセンサ本体部の平面図である。FIG. 4 is a plan view of the sensor main body of the pressure sensor according to the second embodiment of the present invention. 図5は本発明の実施例2に係る圧力センサの模式的断面図の一部である。FIG. 5 is a part of a schematic cross-sectional view of a pressure sensor according to Embodiment 2 of the present invention. 図6は参考例に係る温度センサの概略構成図である。FIG. 6 is a schematic configuration diagram of a temperature sensor according to a reference example.
 以下に図面を参照して、この発明を実施するための形態を、実施例に基づいて例示的に詳しく説明する。ただし、この実施例に記載されている構成部品の寸法、材質、形状、その相対配置などは、特に特定的な記載がない限りは、この発明の範囲をそれらのみに限定する趣旨のものではない。 DETAILED DESCRIPTION Hereinafter, embodiments for carrying out the present invention will be exemplarily described in detail with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements, and the like of the components described in this embodiment are not intended to limit the scope of the present invention only to those unless otherwise specified. .
 (実施例1)
 図1~図3を参照して、本発明の実施例1に係る圧力センサについて説明する。図1は本発明の実施例1に係る圧力センサの概略構成図である。図2は本発明の実施例1に係る圧力センサのセンサ本体部の平面図である。図3は本発明の実施例1に係る圧力センサのセンサ本体部の模式的断面図である。なお、図3は図2のAA断面図である。
Example 1
A pressure sensor according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic configuration diagram of a pressure sensor according to a first embodiment of the present invention. FIG. 2 is a plan view of the sensor main body of the pressure sensor according to the first embodiment of the present invention. FIG. 3 is a schematic cross-sectional view of the sensor main body of the pressure sensor according to the first embodiment of the present invention. 3 is a cross-sectional view taken along the line AA in FIG.
 <圧力センサ>
 図1を参照して、圧力センサ10の全体構成について説明する。圧力センサ10は、センサ本体部100と、センサ本体部100のケース200とを備えている。また、センサ本体部100は、圧力表示装置410及び温度表示装置420に対して、複数の配線300によって電気的に繋がっている。なお、図示の例においては、説明の便宜上、圧力表示装置410及び温度表示装置420をそれぞれ別々に備える場合を示している。しかしながら、一つの表示装置に圧力と温度の双方を表示させるようにしてもよい。また、図1においては、センサ本体部100などの各部材について簡略的に示している。
<Pressure sensor>
The overall configuration of the pressure sensor 10 will be described with reference to FIG. The pressure sensor 10 includes a sensor main body 100 and a case 200 of the sensor main body 100. The sensor main body 100 is electrically connected to the pressure display device 410 and the temperature display device 420 by a plurality of wires 300. In the illustrated example, the case where the pressure display device 410 and the temperature display device 420 are provided separately is shown for convenience of explanation. However, both pressure and temperature may be displayed on one display device. Moreover, in FIG. 1, each member, such as the sensor main body 100, is simply shown.
 <センサ本体部>
 図2及び図3を参照して、本実施例に係る圧力センサ10の要部であるセンサ本体部100について説明する。センサ本体部100は、金属製のダイアフラム110と、圧力を測定するための圧力検出用ゲージ(以下、ゲージ120と称する)と、温度を測定するための感温素子130とを備えている。
<Sensor body>
With reference to FIG.2 and FIG.3, the sensor main-body part 100 which is the principal part of the pressure sensor 10 which concerns on a present Example is demonstrated. The sensor main body 100 includes a metal diaphragm 110, a pressure detection gauge (hereinafter referred to as a gauge 120) for measuring pressure, and a temperature sensitive element 130 for measuring temperature.
 ダイアフラム110は、平面形状が円形の略円板部111と、円筒部112と、外向きフランジ部113とを一体に備えている。そして、略円板部111は、中央に設けられる厚肉部111aと、この厚肉部111aの周囲に設けられ、厚肉部111aよりも肉厚の薄い薄肉部111bとを有している。円筒部112の外径は略円板部111の外径よりも小さい。また、外向きフランジ部113の外径は、略円板部111の外径よりも僅かに大きくなっている。この外向きフランジ部113の外周面113aは、上述したケース200の内周面に固定される。ただし、ダイアフラム110とケース200とを一体としても構わない。 The diaphragm 110 integrally includes a substantially disc portion 111 having a circular planar shape, a cylindrical portion 112, and an outward flange portion 113. And the substantially disc part 111 has the thick part 111a provided in the center, and the thin part 111b provided in the circumference | surroundings of this thick part 111a and thinner than the thick part 111a. The outer diameter of the cylindrical portion 112 is substantially smaller than the outer diameter of the disc portion 111. Further, the outer diameter of the outward flange portion 113 is slightly larger than the outer diameter of the substantially disc portion 111. The outer peripheral surface 113a of the outward flange portion 113 is fixed to the inner peripheral surface of the case 200 described above. However, the diaphragm 110 and the case 200 may be integrated.
 以上のように構成されるダイアフラム110により、略円板部111と円筒部112によって囲まれる空間(S)が形成される。この空間(S)内の測定対象の圧力に応じて、略円板部111が変形する。ここで、上記の通り、外向きフランジ部113の外径は、略円板部111の外径よりも僅かに大きく、略円板部111の外周面とケース200の内周面との間には隙間が形成される。従って、ケース200によって、略円板部111の変形が妨げられることはない。 With the diaphragm 110 configured as described above, a space (S) surrounded by the substantially disc portion 111 and the cylindrical portion 112 is formed. The substantially disc portion 111 is deformed according to the pressure of the measurement object in this space (S). Here, as described above, the outer diameter of the outward flange portion 113 is slightly larger than the outer diameter of the substantially disc portion 111, and is between the outer peripheral surface of the substantially disc portion 111 and the inner peripheral surface of the case 200. A gap is formed. Accordingly, the case 200 does not hinder the deformation of the substantially disc portion 111.
 そして、略円板部111の薄肉部111bにおける測定対象が接する面とは反対側の面にゲージ120が設けられている。ゲージ120は、周方向に対して等間隔に合計4か所に設けられている。4つのゲージ120によって、ブリッジ回路が構成される圧力センサ自体については、公知技術(例えば、特開2002-131159号公報参照)であるので、その説明は省略する。そして、各ゲージ120は、上述した配線300によって、それぞれ圧力表示装置410と電気的に繋がっている。圧力表示装置410においては、それぞれのゲージ120の歪み量に応じた電気信号(歪み量によって変化した抵抗値が電気量に変換されることで得られる電気信号)に基づいて得られた圧力を表示する。 And the gauge 120 is provided in the surface on the opposite side to the surface which the measuring object contacts in the thin part 111b of the substantially disc part 111. FIG. There are a total of four gauges 120 at regular intervals in the circumferential direction. Since the pressure sensor itself in which the bridge circuit is configured by the four gauges 120 is a known technique (for example, see Japanese Patent Application Laid-Open No. 2002-131159), description thereof is omitted. Each gauge 120 is electrically connected to the pressure display device 410 through the wiring 300 described above. In the pressure display device 410, the pressure obtained based on the electrical signal corresponding to the strain amount of each gauge 120 (the electrical signal obtained by converting the resistance value changed by the strain amount into the electrical amount) is displayed. To do.
 また、略円板部111の厚肉部111aにおける測定対象が接する面とは反対側の面に感温素子130が設けられている。感温素子130は温度を電気量に変換できる機能を備えている。この感温素子130は、上述した配線300によって、温度表示装置420と電気的に繋がっている。温度表示装置420においては、感温素子130から送られる電気信号に基づいて得られた温度を表示する。なお、感温素子130は、放熱効果の高い放熱シリコン接着剤によって、厚肉部111aに貼り付けられるのが望ましい。 Further, the temperature sensitive element 130 is provided on the surface of the thick portion 111a of the substantially disc portion 111 on the opposite side to the surface that is in contact with the measurement target. The temperature sensing element 130 has a function of converting temperature into an electric quantity. The temperature sensing element 130 is electrically connected to the temperature display device 420 through the wiring 300 described above. In the temperature display device 420, the temperature obtained based on the electrical signal sent from the temperature sensing element 130 is displayed. The temperature sensitive element 130 is preferably attached to the thick portion 111a with a heat radiating silicon adhesive having a high heat radiating effect.
 <本実施例に係る圧力センサの優れた点>
 本実施例に係る圧力センサ10によれば、ダイアフラム110に感温素子130を設けたことにより、測定対象の圧力だけでなく、温度も測定することが可能となる。そして、ゲージ120は、ダイアフラム110における薄肉部111b上に設けられている。そのため、ゲージ120が設けられている位置においては、ダイアフラム110は変形し易い。従って、ゲージ120も変形し易く、圧力の測定精度が低下してしまうことを抑制できる。また、感温素子130は、ダイアフラム110における厚肉部111aに設けられているため、ダイアフラム110が変形した状態においても、感温素子130はダイアフラム110の変形による影響を受け難い。従って、ダイアフラム110が変形した状態においても、感温素子130は悪影響を受け難く、かつ感温素子130がダイアフラム110の変形を妨げてしまうことも抑制することができる。ここで、本実施例に係る圧力センサは、歪ゲージ式の圧力センサと薄膜ゲージ式の圧力センサのいずれにも適用可能である。歪ゲージ式の圧力センサの場合、ゲージ120として、フィルム状の歪ゲージが用いられる。歪ゲージは、ダイアフラム110における略円板部111上に貼り付けられることで、略円板部111に取付けられる。薄膜ゲージ式の圧力センサの場合、ゲージ120は、スパッタリングにより形成される。より具体的には、ダイアフラム110における略円板部111の表面上の全面に絶縁膜が形成され、この絶縁膜の上面に、スパッタリングによって、ゲージ120が形成される。
<Excellent point of pressure sensor according to this embodiment>
According to the pressure sensor 10 according to the present embodiment, by providing the diaphragm 110 with the temperature sensitive element 130, it is possible to measure not only the pressure to be measured but also the temperature. The gauge 120 is provided on the thin portion 111 b in the diaphragm 110. Therefore, the diaphragm 110 is easily deformed at the position where the gauge 120 is provided. Therefore, the gauge 120 is also easily deformed, and it can be suppressed that the pressure measurement accuracy is lowered. Further, since the temperature sensing element 130 is provided in the thick portion 111 a of the diaphragm 110, the temperature sensing element 130 is hardly affected by the deformation of the diaphragm 110 even when the diaphragm 110 is deformed. Therefore, even when the diaphragm 110 is deformed, the temperature sensing element 130 is not easily adversely affected, and the temperature sensing element 130 can also be prevented from obstructing the deformation of the diaphragm 110. Here, the pressure sensor according to the present embodiment can be applied to either a strain gauge type pressure sensor or a thin film gauge type pressure sensor. In the case of a strain gauge type pressure sensor, a film-like strain gauge is used as the gauge 120. The strain gauge is attached to the substantially disc portion 111 by being affixed on the substantially disc portion 111 of the diaphragm 110. In the case of a thin film gauge type pressure sensor, the gauge 120 is formed by sputtering. More specifically, an insulating film is formed on the entire surface of the substantially disc portion 111 in the diaphragm 110, and the gauge 120 is formed on the upper surface of the insulating film by sputtering.
 (実施例2)
 図4及び図5には、本発明の実施例2が示されている。図4は本発明の実施例2に係る圧力センサのセンサ本体部の平面図である。図5は本発明の実施例2に係る圧力センサの模式的断面図の一部である。なお、図5中のセンサ本体部は図4中のBB断面に相当する。なお、基本的な構成および作用については実施例1と同一なので、同一の構成部分については同一の符号を付して、その説明は適宜省略する。
(Example 2)
4 and 5 show a second embodiment of the present invention. FIG. 4 is a plan view of the sensor main body of the pressure sensor according to the second embodiment of the present invention. FIG. 5 is a part of a schematic cross-sectional view of a pressure sensor according to Embodiment 2 of the present invention. 5 corresponds to the BB cross section in FIG. Since the basic configuration and operation are the same as those in the first embodiment, the same components are denoted by the same reference numerals, and the description thereof is omitted as appropriate.
 圧力センサの全体構成については、上記実施例1の場合と同様であるので、その説明は省略する。 Since the entire configuration of the pressure sensor is the same as that in the first embodiment, description thereof is omitted.
 本実施例に係る圧力センサの要部であるセンサ本体部100aは、金属製のダイアフラム110と、圧力を測定するためのゲージ120と、温度を測定するための感温素子130とを備えている。 The sensor main body 100a, which is a main part of the pressure sensor according to the present embodiment, includes a metal diaphragm 110, a gauge 120 for measuring pressure, and a temperature sensitive element 130 for measuring temperature. .
 ダイアフラム110は、平面形状が円形の略円板部111と、円筒部112と、外向きフランジ部113とを一体に備えている。そして、略円板部111は、中央に設けられる厚肉部111aと、この厚肉部111aの周囲に設けられ、厚肉部111aよりも肉厚の薄い薄肉部111bとを有している。円筒部112の外径は略円板部111の外径よりも小さい。また、外向きフランジ部113の外径は、略円板部111の外径よりも僅かに大きくなっている。この外向きフランジ部113の外周面113aは、上述したケース200の内周面に固定される。ただし、ダイアフラム110とケース200とを一体としても構わない。 The diaphragm 110 integrally includes a substantially disc portion 111 having a circular planar shape, a cylindrical portion 112, and an outward flange portion 113. And the substantially disc part 111 has the thick part 111a provided in the center, and the thin part 111b provided in the circumference | surroundings of this thick part 111a and thinner than the thick part 111a. The outer diameter of the cylindrical portion 112 is substantially smaller than the outer diameter of the disc portion 111. Further, the outer diameter of the outward flange portion 113 is slightly larger than the outer diameter of the substantially disc portion 111. The outer peripheral surface 113a of the outward flange portion 113 is fixed to the inner peripheral surface of the case 200 described above. However, the diaphragm 110 and the case 200 may be integrated.
 そして、本実施例に係るダイアフラム110においては、略円板部111における厚肉部111aには、凹部111aaが設けられている。 And in the diaphragm 110 according to the present embodiment, the thick portion 111a of the substantially disc portion 111 is provided with a recess 111aa.
 以上のように構成されるダイアフラム110により、略円板部111と円筒部112によって囲まれる空間(S)が形成される。この空間(S)内の測定対象の圧力に応じて、略円板部111が変形する。ここで、上記の通り、外向きフランジ部113の外径は、略円板部111の外径よりも僅かに大きく、略円板部111の外周面とケース200の内周面との間には隙間が形成される。従って、ケース200によって、略円板部111の変形に支障が生じることはない。 With the diaphragm 110 configured as described above, a space (S) surrounded by the substantially disc portion 111 and the cylindrical portion 112 is formed. The substantially disc portion 111 is deformed according to the pressure of the measurement object in this space (S). Here, as described above, the outer diameter of the outward flange portion 113 is slightly larger than the outer diameter of the substantially disc portion 111, and is between the outer peripheral surface of the substantially disc portion 111 and the inner peripheral surface of the case 200. A gap is formed. Therefore, the case 200 does not hinder the deformation of the substantially disc portion 111.
 そして、略円板部111の薄肉部111bにおける測定対象が接する面とは反対側の面にゲージ120が設けられている。ゲージ120は、周方向に対して等間隔に合計4か所に設けられている。ゲージ120については、上記実施例1で説明した通りであるので、その説明は省略する。 And the gauge 120 is provided in the surface on the opposite side to the surface which the measuring object contacts in the thin part 111b of the substantially disc part 111. FIG. There are a total of four gauges 120 at regular intervals in the circumferential direction. Since the gauge 120 is as described in the first embodiment, the description thereof is omitted.
 また、略円板部111の厚肉部111aにおける測定対象が接する面とは反対側の面に感温素子130が設けられている。ここで、本実施例においては、厚肉部111aに設けられた凹部111aaの底に感温素子130が設けられている。なお、感温素子130自体の構成、及び温度表示装置と電気的に繋がっていることについては、実施例1で説明した通りである。また、本実施例においても、感温素子130は、放熱効果の高い放熱シリコン接着剤によって、厚肉部111aに貼り付けられるのが望ましい。 Further, the temperature sensitive element 130 is provided on the surface of the thick portion 111a of the substantially disc portion 111 on the opposite side to the surface that is in contact with the measurement target. Here, in the present embodiment, the temperature sensitive element 130 is provided at the bottom of the concave portion 111aa provided in the thick portion 111a. The configuration of the temperature sensing element 130 itself and the electrical connection with the temperature display device are as described in the first embodiment. Also in the present embodiment, it is desirable that the temperature sensitive element 130 is attached to the thick portion 111a with a heat dissipation silicon adhesive having a high heat dissipation effect.
 更に、本実施例においては、ダイアフラム110の略円板部111に対して、感温素子130を覆うように金属製のカバー140が設けられている。また、ケース200には、ストッパ500が設けられている。このストッパ500は、カバー140に対向する位置に設けられ、ダイアフラム110がカバー140側に向かって変形した際に、カバー140に当接することで、ダイアフラム110の変形量を規制する機能を発揮する。 Furthermore, in the present embodiment, a metal cover 140 is provided on the substantially disc portion 111 of the diaphragm 110 so as to cover the temperature sensing element 130. The case 200 is provided with a stopper 500. The stopper 500 is provided at a position facing the cover 140 and exerts a function of regulating the deformation amount of the diaphragm 110 by contacting the cover 140 when the diaphragm 110 is deformed toward the cover 140 side.
 以上のように構成された本実施例に係る圧力センサにおいても、上記実施例1の場合と同様の効果を得ることができる。また、本実施例に係る圧力センサにおいては、ダイアフラム110における厚肉部111aには凹部111aaが設けられ、この凹部111aaの底に感温素子130が設けられている。これにより、感温素子130は、測定対象に近づくため、温度の測定精度を高めることができる。更に、本実施例に係る圧力センサにおいては、感温素子130を覆うカバー140と、ダイアフラム110がカバー140側に向かって変形した際に、カバー140に当接することで、ダイアフラム110の変形量を規制するストッパ500が備えられている。従って、ダイアフラム110が変形し過ぎることを抑制でき、各部材の損傷を抑制することができる。なお、本実施例に係る圧力センサにおいても、歪ゲージ式の圧力センサと薄膜ゲージ式の圧力センサのいずれにも適用可能であることは言うまでもない。 Also in the pressure sensor according to the present embodiment configured as described above, the same effect as in the first embodiment can be obtained. In the pressure sensor according to the present embodiment, the thick portion 111a of the diaphragm 110 is provided with a recess 111aa, and the temperature sensitive element 130 is provided at the bottom of the recess 111aa. Thereby, since the temperature sensitive element 130 approaches a measuring object, the temperature measurement accuracy can be increased. Furthermore, in the pressure sensor according to the present embodiment, when the cover 140 that covers the temperature sensing element 130 and the diaphragm 110 are deformed toward the cover 140 side, the amount of deformation of the diaphragm 110 is reduced by contacting the cover 140. A restricting stopper 500 is provided. Therefore, the diaphragm 110 can be prevented from being deformed excessively, and damage to each member can be suppressed. Needless to say, the pressure sensor according to this embodiment can be applied to both a strain gauge type pressure sensor and a thin film gauge type pressure sensor.
 (参考例)
 図6を参照して、参考例に係る温度センサについて説明する。図6は参考例に係る温度センサの概略構成図である。この参考例に係る温度センサ500は、環状のハウジング510と、ハウジング510の一端側(図中、下端側)の内周面に固定されるダイアフラム520とを備えている。この参考例に係るダイアフラム520おいては、上記実施例におけるダイアフラムとは異なり、円板状の部材により構成される。そして、ダイアフラム520における他端側の面に、感温素子530が設けられている。この感温素子530は温度を電気量に変換できる機能を備えている。この感温素子530は、配線540によって、温度表示装置550と電気的に繋がっている。温度表示装置550においては、感温素子530から送られる電気信号に基づいて得られた温度を表示する。なお、感温素子530は、放熱効果の高い放熱シリコン接着剤によって、ダイアフラム520に貼り付けられるのが望ましい。
(Reference example)
A temperature sensor according to a reference example will be described with reference to FIG. FIG. 6 is a schematic configuration diagram of a temperature sensor according to a reference example. A temperature sensor 500 according to this reference example includes an annular housing 510 and a diaphragm 520 fixed to an inner peripheral surface of one end side (lower end side in the drawing) of the housing 510. The diaphragm 520 according to this reference example is constituted by a disk-like member, unlike the diaphragm in the above embodiment. A temperature sensing element 530 is provided on the surface on the other end side of the diaphragm 520. The temperature sensing element 530 has a function of converting temperature into an electric quantity. The temperature sensing element 530 is electrically connected to the temperature display device 550 through a wiring 540. In the temperature display device 550, the temperature obtained based on the electrical signal sent from the temperature sensing element 530 is displayed. Note that the temperature sensitive element 530 is desirably attached to the diaphragm 520 with a heat dissipating silicon adhesive having a high heat dissipating effect.
 以上のように構成される温度センサ500は、測定対象物が収容されるタンクなどに取付けられる。ダイアフラム520のうち、感温素子530が設けられている側とは反対側に測定対象物が存在するように、温度センサ500はタンクなどに取付けられる。従来、このような用途で用いられる温度センサにおいては、タンク内の測定対象物に向けて突出する突起状の部材により温度を測定する構造が採用されていた。これに対して、本参考例に係る温度センサ500の場合には、測定対象側がダイアフラム520の平面であるため、異物が付着し難く、長期に亘り安定的に温度測定が可能となる利点がある。 The temperature sensor 500 configured as described above is attached to a tank or the like in which a measurement object is stored. The temperature sensor 500 is attached to a tank or the like so that the object to be measured exists on the opposite side of the diaphragm 520 from the side where the temperature sensing element 530 is provided. Conventionally, in a temperature sensor used for such an application, a structure has been adopted in which temperature is measured by a protruding member protruding toward a measurement object in a tank. On the other hand, in the case of the temperature sensor 500 according to the present reference example, since the measurement target side is the plane of the diaphragm 520, there is an advantage that foreign matter is hardly attached and temperature measurement can be stably performed over a long period of time. .
 10 圧力センサ
 100,100a センサ本体部
 110 ダイアフラム
 111 略円板部
 111a 厚肉部
 111aa 凹部
 111b 薄肉部
 112 円筒部
 113 外向きフランジ部
 113a 外周面
 120 ゲージ(圧力検出用ゲージ)
 130 感温素子
 140 カバー
 200 ケース
 300 配線
 410 圧力表示装置
 420 温度表示装置
 500 ストッパ
DESCRIPTION OF SYMBOLS 10 Pressure sensor 100,100a Sensor main-body part 110 Diaphragm 111 Substantially disc part 111a Thick part 111aa Recessed part 111b Thin part 112 Cylindrical part 113 Outward flange part 113a Outer peripheral surface 120 Gauge (Pressure detection gauge)
130 Temperature Sensing Element 140 Cover 200 Case 300 Wiring 410 Pressure Display Device 420 Temperature Display Device 500 Stopper

Claims (3)

  1.  中央に厚肉部を有し、該厚肉部の周囲に該厚肉部よりも肉厚の薄い薄肉部を有するダイアフラムと、
     前記薄肉部における測定対象が接する面とは反対側の面に設けられる圧力検出用ゲージと、
     前記厚肉部における測定対象が接する面とは反対側の面に設けられる感温素子と、
    を備えることを特徴とする圧力センサ。
    A diaphragm having a thick portion at the center and a thin portion having a thinner thickness than the thick portion around the thick portion;
    A pressure detecting gauge provided on a surface opposite to the surface in contact with the measurement target in the thin portion;
    A temperature-sensitive element provided on the surface opposite to the surface on which the measurement object is in contact with the thick-walled portion;
    A pressure sensor comprising:
  2.  前記厚肉部には凹部が設けられ、該凹部の底に前記感温素子が設けられていることを特徴とする請求項1に記載の圧力センサ。 2. The pressure sensor according to claim 1, wherein a concave portion is provided in the thick portion, and the temperature sensing element is provided at the bottom of the concave portion.
  3.  前記感温素子を覆うカバーと、
     前記カバーに対向する位置に設けられ、前記ダイアフラムが前記カバー側に向かって変形した際に、前記カバーに当接することで、前記ダイアフラムの変形量を規制するストッパと、
     を備えることを特徴とする請求項2に記載の圧力センサ。
    A cover covering the temperature sensing element;
    A stopper that is provided at a position facing the cover and restricts the amount of deformation of the diaphragm by contacting the cover when the diaphragm is deformed toward the cover;
    The pressure sensor according to claim 2, further comprising:
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3537318A (en) * 1968-11-21 1970-11-03 Statham Instrument Inc Transducer overload protection means
JPS59116833U (en) * 1983-01-27 1984-08-07 株式会社ノーリツ Liquid temperature detection device
JPH10206202A (en) * 1997-01-24 1998-08-07 Nagano Keiki Co Ltd Composite sensor
JP2001201414A (en) * 2000-01-20 2001-07-27 Smc Corp Combined sensor and flow controller provided with the combined sensor
US20030221302A1 (en) * 2002-05-31 2003-12-04 Moyer James I. Method of making thick film pressure and temperature sensors on a stainless steel diaphragm

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06296032A (en) * 1993-04-09 1994-10-21 Riken Corp Force conversion element
US9170164B2 (en) * 2012-02-03 2015-10-27 Dieter Naegele-Preissmann Capacitive pressure sensor and a method of fabricating the same
CN104458105A (en) * 2014-05-08 2015-03-25 贵州航天凯山石油仪器有限公司 Method for detecting pressure in oil well and optical grating sensor used in same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3537318A (en) * 1968-11-21 1970-11-03 Statham Instrument Inc Transducer overload protection means
JPS59116833U (en) * 1983-01-27 1984-08-07 株式会社ノーリツ Liquid temperature detection device
JPH10206202A (en) * 1997-01-24 1998-08-07 Nagano Keiki Co Ltd Composite sensor
JP2001201414A (en) * 2000-01-20 2001-07-27 Smc Corp Combined sensor and flow controller provided with the combined sensor
US20030221302A1 (en) * 2002-05-31 2003-12-04 Moyer James I. Method of making thick film pressure and temperature sensors on a stainless steel diaphragm

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