WO2017138684A1

WO2017138684A1 - Laser processing system

Info

Publication number: WO2017138684A1
Application number: PCT/KR2016/010051
Authority: WO
Inventors: 이용우; 허진; 최영준; 신동수; 이준영; 김유석; 조규환; 정현택
Original assignee: (주)이오테크닉스
Priority date: 2016-02-12
Filing date: 2016-09-08
Publication date: 2017-08-17
Also published as: TWI637806B; KR20170094971A; TW201739556A

Abstract

A laser processing system is disclosed. The disclosed laser processing system comprises: a detection unit for detecting a thickness of a workpiece in an optical manner; a laser irradiation unit for irradiating a laser beam onto the workpiece on the basis of the thickness detected by the detection unit; and a cooling unit configured to cool the detection unit.

Description

Laser processing systems

The present invention relates to a laser processing system.

The laser processing system irradiates a laser beam emitted from a laser light source to an object to be processed using an optical system, and marking, dicing and scribing the object to be processed by the irradiation of the laser beam. Machining operations such as grooving are performed.

In the process of performing the machining operation as described above, a case may be required in which the laser beam should be accurately focused at a predetermined position in the thickness direction of the object to be processed. For example, when the grooving operation on the object to be processed is performed, it is necessary to accurately focus the laser beam at a predetermined position in the thickness direction of the object to be processed.

Such a laser processing system may include a detection unit for detecting the thickness of the object to be processed, and a laser irradiation unit for irradiating the laser beam by focusing the laser beam based on the thickness detected by the detection unit.

However, the internal temperature of the laser processing system may be changed in the process of preparing or processing the processing by the laser processing system. The internal temperature change of such a laser processing system may cause measurement error by the detection unit, which may result in the deterioration of the laser processing operation.

In this embodiment, a laser processing system having a processing accuracy is provided by employing a cooling unit that cools a detection unit that detects a thickness of a workpiece.

Laser processing system according to an aspect of the present invention,

A detection unit for detecting a thickness of the object to be processed by an optical method;

A laser irradiation unit for irradiating a laser beam to the processing object based on the thickness detected by the detection unit; And

And a cooling unit configured to cool the detection unit.

In one embodiment, the temperature change of the detection unit by the cooling unit may be within 0.4 ℃.

In one embodiment, the measurement error of the detection unit may be within 4 um.

In one embodiment, the cooling unit may include a first cooling member for supplying cooling air to the detection unit.

In one embodiment, the laser irradiation unit may include a laser light source for generating a laser beam, and a laser head for focusing the laser beam generated by the laser light source on the object to be processed.

In one embodiment, the head driving unit for moving the laser head in the optical axis direction may further include.

In one embodiment, the cooling unit may include a second cooling member for supplying cooling air to the head driving unit.

In one embodiment, the detection unit may be installed so that its position is fixed to the laser head.

In one embodiment, the detection unit may include at least one lens.

In one embodiment, the laser irradiation unit, the detection unit and the cooling unit may further include a space provided therein, a chamber provided with a door portion for opening and closing the opening to the processing object.

In one embodiment, the control unit for controlling the operation of the cooling unit further includes, wherein the control unit, when the internal temperature of the chamber is higher than the external temperature of the chamber, it may be controlled to operate the cooling unit.

The cooling unit may be rotatable about a rotation axis parallel to the optical axis.

Laser processing system according to another aspect of the present invention,

A detection unit for detecting at least one of a thickness and a position of the object to be processed by an optical method;

A laser irradiation unit that irradiates a laser beam to the processing object based on the information detected by the detection unit; And

And a cooling unit configured to cool the detection unit.

In one embodiment, the detection unit may include at least one lens.

In the laser processing system according to the embodiment of the present invention, by employing a cooling unit for cooling the detection unit, it is possible to ensure a constant processing quality for the object to be processed.

1 is a view schematically showing a laser processing system according to an embodiment.

2 is a perspective view showing an example of a specific configuration of the laser head and its peripheral structure in the laser processing system according to the embodiment.

3 is a plan view from above of the laser head of FIG. 2 and its peripheral configuration;

4 to 5 are perspective views showing another example of the configuration of the laser head and its peripheral configuration in the laser processing system according to the embodiment.

6 is a perspective view illustrating the cooling unit of FIG. 2.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention; Like reference numerals in the drawings refer to like elements, and the size or thickness of each element may be exaggerated for clarity.

Terms including ordinal numbers such as “first” and “second” may be used to describe various components, but the components are not limited by the terms. The terms are only used to distinguish one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. The term “and / or” includes any combination of a plurality of related items or any one of a plurality of related items.

1 schematically shows a laser processing system 1 according to an embodiment.

Referring to FIG. 1, the laser processing system 1 according to the embodiment includes a work table 20 on which a processing object W is disposed, and a laser irradiation unit 30 irradiating a laser beam L1 to the processing object W. ) And at least one detection unit 40 for detecting the characteristics of the object to be processed (W).

The laser processing system 1 may be, but is not necessarily limited to, a grooving device for grooving operations.

The laser irradiation unit 30 includes a laser light source 31 and a laser head 32. The laser light source 31 produces the laser beam L1, and the laser head 32 irradiates the object W with the focus of the laser beam L1.

The reflective mirror 33 may be disposed between the laser light source 31 and the laser head 32. The reflection mirror 33 may reflect the laser beam L1 generated by the laser light source 31 toward the laser head 32. Although not shown in the drawings, the laser irradiation unit 30 may further include various configurations, for example, a beam expander, a galvanometer, an fexeta lens 45, and the like. The various configurations may be disposed inside the laser head 32 or may be disposed in a separate configuration.

The laser head 32 focuses the laser beam L1 and irradiates the object W to be processed.

The laser head 32 may be moved along the optical axis direction in order to focus the laser beam L1 at a predetermined position in the thickness direction of the object to be processed (W).

The detection unit 40 can measure or detect the thickness of the object to be processed W by a non-contact method. For example, the detection unit 40 can detect the thickness of the object to be processed W by an optical method. Since the method of detecting the thickness by the optical method is known in the art, a detailed description thereof will be omitted.

In order to detect the thickness of the object to be processed W by the optical method, the detection unit 40 may include at least one lens 45. The detection unit 40 for detecting the thickness of the object to be processed W may be called a thickness detection unit.

Based on the thickness detected by the detection unit 40, the laser irradiation unit 30 irradiates the laser beam L1 to the object to be processed. Based on the thickness detected by the detection unit 40, the laser head 32 moves in the optical axis direction to focus on the object to be processed W. Therefore, a laser processing operation, for example, a grooving operation, is performed on the processing target object W in a state where the predetermined position is focused in the thickness direction of the processing target object W.

The laser irradiation unit 30 and the detection unit 40 described above are disposed in the space 11 of the chamber 10. The chamber 10 may be provided with an opening 12 through which the object to be processed W may enter and a door part 13 for opening and closing the opening 12.

However, in the process of laser processing using the laser processing system 1, or in the process of preparing for laser processing, the temperature inside the laser processing system 1 may vary. For example, the temperature inside the chamber 10 may vary.

As an example, in order to focus on the object W, in the process of moving the laser head 32 in the optical axis direction, heat may be generated in the configuration for moving the laser head 32. Accordingly, the temperature inside the chamber 10 may increase.

As another example, in the process of opening and closing the door part 13 of the chamber 10, the outside air of the chamber 10 is introduced into the chamber 10, or the air inside the chamber 10 is discharged from the chamber 10. In the process of flowing out, the temperature inside the chamber 10 may vary.

The above-described detection unit 40 having a structure for detecting the thickness of the processing object W by the optical method is cheaper than the detection unit 40 by the other method, but may be vulnerable to temperature change. .

For example, the lens 45 of the detection unit 40 contracts or expands in accordance with the temperature change around the detection unit 40 or its surroundings. Shrinkage or expansion of this lens 45 may appear as a measurement error of the detected thickness. As an example, when the ambient temperature of the detection unit 40 changes by 1 ° C., a measurement error of the detection unit 40 may occur about 10 μm. This measurement error can be fatal to the machining quality in laser machining operations, especially in grooving operations where precision is required.

The laser processing system 1 according to the embodiment includes a cooling unit 100 for cooling the detection unit 40 in consideration of the characteristics of the detection unit 40 sensitive to such a temperature change. In addition, the laser processing system 1 may further include a controller 130 for controlling the operation of the cooling unit 100.

By the cooling unit 100, the temperature of the detection unit 40 can be maintained within a predetermined temperature range. The controller 130 may control the cooling unit 100 to operate when the internal temperature of the chamber 10 is higher than the external temperature of the chamber 10.

If the cooling unit 100 is not included, a temperature change of 2 ° C. or more may appear inside the chamber 10, and accordingly, a measurement error by the detection unit 40 may be 20 μm or more.

However, the detection unit 40 according to the embodiment may be cooled by the cooling unit 100, and the temperature change of the detection unit 40 may be maintained within 0.4 ° C. The measurement error of the detection unit 40 may be within 4 um. Accordingly, in the laser processing system 1 according to the embodiment, it is possible to stably perform a precise laser processing operation.

2 is a perspective view showing an example in which the laser head 32 and its peripheral configuration are embodied in the laser processing system 1 according to the embodiment. 3 is a plan view from above of the laser head 32 and its surrounding configuration of FIG. 2.

2 and 3, a laser head 32 and a head driver 35 for moving the laser head 32 in the optical axis direction are disclosed.

The laser head 32 may include a focus adjuster 321 for adjusting the focus of the laser beam, and a support 322 for supporting the focus adjuster 321. The support 322 may be movable with respect to the head driver 35. For example, the support 322 may be slidably movable relative to the head driver 35.

The head drive part 35 can move the support part 322 and the focus control part 321 supported by the support part 322 along the optical axis direction.

The detection unit 40 may be installed so that its position is fixed to the laser head 32. Thus, when the laser head 32 is moved along the optical axis, the detection unit 40 can be moved together.

The detection unit 40 can detect the thickness and position of the object to be processed (W). For example, the detection unit 40 may include a high magnification vision camera 41. Through the high magnification vision camera 41, at least one of the thickness of the object to be processed W and the alignment position of the object to be processed W can be detected or observed. As an example of the magnification of the high magnification vision camera 41, it may be 1:10, but is not limited thereto.

The detection unit 40 may further include a low magnification vision camera 42. Through the low magnification vision camera 42, the center or the edge of the object to be processed W can be detected or observed. An example of the magnification of the low magnification vision camera 42 may be 1: 1, but is not limited thereto.

Meanwhile, heat may be generated in the process of operating the head driver 35 to move the laser head 32 along the optical axis. The heat generated by the head driver 35 heats the air inside the chamber 10 (see FIG. 1), and raises the ambient temperature of the detection unit 40. In other words, heat generated in the head drive 35 can be transferred to the detection unit 40 through convection.

The cooling unit 100 may perform a function of blocking heat generated from the head driver 35 from being transferred to the detection unit 40. For example, the cooling unit 100 may cool the detection unit 40 by an air cooling method.

As an example, the cooling unit 100 may include a first cooling member 110 supplying cooling air to the detection unit 40. Here, the cooling air may refer to air having a temperature lower than the temperature of the chamber 10 or the temperature of the detection unit 40.

The first cooling member 110 may inject cooling air toward the detection unit 40. For example, one first cooling member 110 injects cooling air toward the high magnification vision camera 41, and the other first cooling member 110 directs cooling air toward the low magnification vision camera 42. Can spray

However, the injection direction of the first cooling member 110 is not limited thereto, and may be variously modified as long as it is for cooling the detection unit 40 directly or indirectly. For example, the injection direction of the first cooling member 110 may face the periphery of the detection unit 40.

The cooling unit 100 may further include a second cooling member 120 for supplying cooling air to the head driving part 35. The second cooling member 120 may cool the head driving part 35, which is a main heat source for raising the temperature of the detection unit 40 in the chamber 10. Thereby, it is possible to reduce or prevent heat transfer from the head driver 35 to the detection unit 40.

Although the second cooling member 120 has been described with reference to the examples installed on both sides of the head driving part 35, the number and arrangement of the second cooling members 120 may vary.

Meanwhile, in the above-described embodiment, the cooling unit 100 is described with reference to an example including the first and

second cooling members

110 and 120, but the present invention is not limited thereto, and the first and second cooling members ( One of the 110 and 120 may be omitted, or another cooling member may be added in addition to the first and

second cooling members

110 and 120. For example, as shown in FIG. 4, the cooling unit 100a may include only the first cooling member 110, or as shown in FIG. 5, the cooling unit 100b may include only the second cooling member 120.

FIG. 6 is a perspective view illustrating the cooling unit 100 of FIG. 2. In FIG. 6, as an example of the cooling unit 100, the first cooling member 110 will be described, but the present invention is not limited thereto, and the second cooling member 120 may be similarly applied.

Referring to FIG. 6, in the first cooling member 110, a plurality of nozzle holes 101 for injecting cooling air may be arranged along the optical axis. The first cooling member 110 may be rotated about a rotation axis parallel to the optical axis. Accordingly, the user can rotate the first cooling member 110 to adjust the spraying direction of the cooling air as necessary.

On the other hand, in the laser processing system 1 according to the above-described embodiment, the cooling unit 100 has been described with reference to the embodiment in which the detection unit 40 for detecting the thickness of the processing object W is centered. It is not limited. For example, the cooling unit 100 which concerns on an Example is the detection unit 40 which detects the characteristic other than the thickness of the process target object W by an optical system, for example, the center of the process target object W. It may also be applied to cool the detection unit 40 to detect whether the edge or alignment.

Although embodiments of the present invention have been described above, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

* Description of the sign

1: laser processing system 10: chamber

20: work table 30: laser irradiation unit

31 laser light source 32 laser head

321: focusing portion 322: support portion

33: reflection mirror 35: head drive unit

40: detection unit 41: high magnification vision camera

42: low magnification vision camera 45: lens

100: cooling unit 101: nozzle hole

110: first cooling member 120: second cooling member

130: control unit

Claims

A detection unit for detecting a thickness of the object to be processed by an optical method;

A laser irradiation unit for irradiating a laser beam to the processing object based on the thickness detected by the detection unit; And

A cooling unit configured to cool the detection unit.
The method of claim 1,

And the temperature change of the detection unit is within 0.4 deg. C by the cooling unit.
The method of claim 1,

And a measurement error of the detection unit is within 4 um.
The method of claim 1,

The cooling unit,

And a first cooling member for supplying cooling air to the detection unit.
The method of claim 1,

The laser irradiation unit,

A laser light source for generating a laser beam,

A laser processing system comprising a laser head for focusing a laser beam generated in a laser light source onto a workpiece.
The method of claim 5,

And a head driver for moving the laser head along the optical axis direction.
The method of claim 6,

The cooling unit,

And a second cooling member for supplying cooling air to the head drive.
The method of claim 5,

And the detection unit is installed so that its position is fixed to the laser head.
The method of claim 1,

And the detection unit comprises at least one lens.
The method of claim 1,

And a chamber provided with a space in which the laser irradiation unit, the detection unit, and the cooling unit are disposed, and a door portion for opening and closing an opening through which the object to be processed can be entered.
The method of claim 10,

A control unit for controlling the operation of the cooling unit further includes;

And the control unit controls to operate the cooling unit when the chamber internal temperature is higher than the external temperature of the chamber.
The method of claim 1,

The cooling unit,

And rotatable about a rotation axis parallel to the optical axis.
A detection unit for detecting at least one of a thickness and a position of the object to be processed by an optical method;

A laser irradiation unit that irradiates a laser beam to the processing object based on the information detected by the detection unit; And

A cooling unit configured to cool the detection unit.
The method of claim 13,

And the temperature change of the detection unit is within 0.4 deg. C by the cooling unit.
The method of claim 13,

The cooling unit,

And a first cooling member for supplying cooling air to the detection unit.
The method of claim 13,

The laser irradiation unit,

A laser light source for generating a laser beam,

A laser processing system comprising a laser head for focusing a laser beam generated in a laser light source onto a workpiece.
The method of claim 16,

And a head driver for moving the laser head along the optical axis direction.
The method of claim 17,

The cooling unit,

And a second cooling member for supplying cooling air to the head drive.
The method of claim 16,

And the detection unit is installed so that its position is fixed to the laser head.
The method of claim 13,

And the detection unit comprises at least one lens.