KR20170094971A - Laser processing system - Google Patents

Laser processing system Download PDF

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Publication number
KR20170094971A
KR20170094971A KR1020160016357A KR20160016357A KR20170094971A KR 20170094971 A KR20170094971 A KR 20170094971A KR 1020160016357 A KR1020160016357 A KR 1020160016357A KR 20160016357 A KR20160016357 A KR 20160016357A KR 20170094971 A KR20170094971 A KR 20170094971A
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KR
South Korea
Prior art keywords
unit
detection unit
cooling
laser
head
Prior art date
Application number
KR1020160016357A
Other languages
Korean (ko)
Inventor
이용우
허진
최영준
신동수
이준영
김유석
조규환
정현택
Original Assignee
주식회사 이오테크닉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 이오테크닉스 filed Critical 주식회사 이오테크닉스
Priority to KR1020160016357A priority Critical patent/KR20170094971A/en
Priority to PCT/KR2016/010051 priority patent/WO2017138684A1/en
Priority to TW105130256A priority patent/TWI637806B/en
Publication of KR20170094971A publication Critical patent/KR20170094971A/en

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Classifications

    • B23K26/0066—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B23Q17/2452—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces
    • B23Q17/2471—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces of workpieces

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)

Abstract

A laser processing system is disclosed. The disclosed laser processing system comprises: a detection unit detecting thickness of an object to be processed by using an optical method; a laser radiation unit radiating a laser beam to the object to be processed based on the thickness detected by the detection unit; and a cooling unit configured to cool the detection unit. The present invention has processing accuracy.

Description

[0001] The present invention relates to a laser processing system,

The present invention relates to a laser processing system.

The laser processing system irradiates a laser beam emitted from a laser light source onto an object using an optical system and performs marking, dicing, and scribing on the object by irradiation of the laser beam. , Grooving, and the like.

In the process of performing the above-described machining operation, the focus of the laser beam may have to be precisely adjusted to a predetermined position in the thickness direction of the object to be processed. For example, when the grooving operation for the object to be processed is proceeding, it is necessary to accurately focus the laser beam at a predetermined position in the thickness direction of the object to be processed.

Such a laser processing system may include a detection unit for detecting the thickness of the object to be processed and a laser irradiation unit for irradiating the laser beam by focusing the laser beam on the basis of the thickness detected by the detection unit.

However, the internal temperature of the laser processing system may be changed during the process of preparing or preparing the laser processing system. Changes in the internal temperature of such a laser machining system can cause measurement errors by the detection unit, which may result in degradation of the laser machining operation.

The present embodiment provides a laser processing system having processing accuracy by employing a cooling unit that cools a detection unit that detects the thickness of an object to be processed.

According to an aspect of the present invention,

A detection unit for detecting the thickness of the object by an optical system;

A laser irradiation unit for irradiating the object with a laser beam based on the thickness detected by the detection unit; And

And a cooling unit configured to cool the detection unit.

In one embodiment, the temperature change of the detection unit may be within 0.4 [deg.] C by the cooling unit.

In one embodiment, the measurement error of the detection unit may be within 4 [mu] m.

In one embodiment, the cooling unit may include a first cooling member for supplying cooling air to the detection unit.

In one embodiment, the laser irradiation unit may include a laser light source that generates a laser beam, and a laser head that focuses the laser beam generated by the laser light source on the object to be processed.

In one embodiment, the apparatus may further include a head driving unit for moving the laser head along an optical axis direction.

In one embodiment, the cooling unit may include a second cooling member that supplies cooling air to the head driving unit.

In one embodiment, the detection unit may be installed such that its position is fixed to the laser head.

In one embodiment, the detection unit may comprise at least one lens.

In one embodiment, the apparatus may further include a chamber provided with a space in which the laser irradiation unit, the detection unit, and the cooling unit are disposed, and a door portion for opening and closing an opening through which the object can be inserted and removed.

In one embodiment, the control unit controls the operation of the cooling unit, and the control unit can control the cooling unit to operate when the chamber internal temperature is higher than the external temperature of the chamber.

The cooling unit may be rotatable about a rotation axis parallel to the optical axis.

According to another aspect of the present invention,

A detection unit which detects at least one of a thickness and a position of the object by an optical system;

A laser irradiation unit for irradiating the object with a laser beam based on the information detected by the detection unit; And

And a cooling unit configured to cool the detection unit.

In one embodiment, the temperature change of the detection unit may be within 0.4 [deg.] C by the cooling unit.

In one embodiment, the cooling unit may include a first cooling member for supplying cooling air to the detection unit.

In one embodiment, the laser irradiation unit may include a laser light source that generates a laser beam, and a laser head that focuses the laser beam generated by the laser light source on the object to be processed.

In one embodiment, the apparatus may further include a head driving unit for moving the laser head along an optical axis direction.

In one embodiment, the cooling unit may include a second cooling member that supplies cooling air to the head driving unit.

In one embodiment, the detection unit may be installed such that its position is fixed to the laser head.

In one embodiment, the detection unit may comprise at least one lens.

In the laser processing system according to the embodiment of the present invention, by employing the cooling unit for cooling the detection unit, it is possible to ensure a constant machining quality for the object to be processed.

1 is a schematic view of a laser machining system according to an embodiment.
2 is a perspective view illustrating an example of embodying a laser head and its peripheral structure in a laser processing system according to an embodiment.
3 is a top plan view of the laser head of FIG. 2 and its peripheral configuration.
FIGS. 4 to 5 are perspective views showing another example of embodying the laser head and its peripheral structure in the laser processing system according to the embodiment.
Fig. 6 is a perspective view for explaining the cooling unit of Fig. 2;

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, like reference numerals refer to like elements, and the size and thickness of each element may be exaggerated for clarity of explanation.

Terms including ordinals such as " first, " " second, " and the like can be used to describe various elements, but the elements are not limited by terms. Terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. The term " and / or " includes any combination of a plurality of related items or any of a plurality of related items.

1 is a schematic view of a laser machining system 1 according to an embodiment.

1, the laser processing system 1 according to the embodiment includes a work table 20 on which a workpiece W is placed, a laser irradiation unit 30 for irradiating the workpiece W with a laser beam L1 And at least one detection unit (40) for detecting the characteristics of the object to be processed (W).

The laser processing system 1 may be, but is not necessarily limited to, a grooving device for grooving operations.

The laser irradiation unit 30 includes a laser light source 31 and a laser head 32. The laser light source 31 generates a laser beam L1 and the laser head 32 focuses the laser beam L1 and irradiates the object W with the laser beam L1.

A reflective mirror 33 may be disposed between the laser light source 31 and the laser head 32. The reflecting mirror 33 can reflect the laser beam L1 generated by the laser beam source 31 toward the laser head 32. [ Although not shown in the drawings, the laser irradiation unit 30 may further include various configurations, for example, a beam expander, a galvanometer, an F-theta lens 45, and the like. The various configurations may be arranged inside the laser head 32, or may be arranged in a different configuration.

The laser head 32 focuses the laser beam L1 and irradiates the object W to be processed.

The laser head 32 can be moved along the optical axis direction so as to focus the laser beam L1 at a predetermined position in the thickness direction of the object W. [

The detection unit 40 can measure or detect the thickness of the object W by a non-contact method. For example, the detection unit 40 can detect the thickness of the object W by an optical method. Since the method of detecting the thickness by the optical method is well known in the related art, a detailed description thereof will be omitted.

In order to detect the thickness of the object W by the optical method, the detection unit 40 may include at least one lens 45. [ The detection unit 40 for detecting the thickness of the object W may be referred to as a thickness detection unit.

Based on the thickness detected by the detection unit 40, the laser irradiation unit 30 irradiates the object W with the laser beam L1. Based on the thickness detected by the detection unit 40, the laser head 32 moves in the direction of the optical axis to focus on the object W to be processed. Thereby, laser processing work, for example, grooving work, is performed on the object W in a state in which the object W is focused at a predetermined position in the thickness direction of the object W.

The laser irradiation unit 30 and the detection unit 40 described above are disposed in the space 11 of the chamber 10. The chamber 10 may be provided with an opening 12 through which the object W can enter and exit and a door portion 13 which opens and closes the opening 12. [

However, the temperature inside the laser processing system 1 may be changed in the process of laser processing using the laser processing system 1 or in the process of preparing the laser processing. For example, the temperature inside the chamber 10 may vary.

As an example, heat may be generated in a configuration for moving the laser head 32 in the process of moving the laser head 32 in the direction of the optical axis, in order to focus on the object W to be processed. Thereby, the temperature inside the chamber 10 can rise.

As another example, in the process of opening / closing the door portion 13 of the chamber 10, the outside air of the chamber 10 may be introduced into the chamber 10, or air inside the chamber 10 may be introduced into the chamber 10 The temperature inside the chamber 10 can be changed in the course of flowing out.

Described detection unit 40 having a structure for detecting the thickness of the object W by the optical method may be less expensive than the detection unit 40 by other methods while being susceptible to temperature variations .

For example, the lens 45 of the detection unit 40 shrinks or expands in accordance with the temperature change of the detection unit 40 or its vicinity. The contraction or expansion of such a lens 45 may appear as a measurement error of the detected thickness. As an example, when the ambient temperature of the detection unit 40 changes by 1 占 폚, a measurement error of the detection unit 40 may occur by about 10 占 퐉. Such a measurement error may be fatal to the laser machining operation, particularly, in a grooving operation requiring precision.

The laser processing system 1 according to the embodiment includes a cooling unit 100 for cooling the detection unit 40 in consideration of the characteristics of the detection unit 40 sensitive to such temperature change. In addition, the laser processing system 1 may further include a control unit 130 for controlling the operation of the cooling unit 100.

By the cooling unit 100, the temperature of the detection unit 40 can be maintained within a predetermined temperature range. The control unit 130 can control the cooling unit 100 to operate when the internal temperature of the chamber 10 is higher than the external temperature of the chamber 10. [

If the cooling unit 100 is not included, a temperature change of more than 2 占 폚 may appear inside the chamber 10, so that the measurement error by the detection unit 40 may be more than 20 占 퐉.

However, the detection unit 40 according to the embodiment can be cooled by the cooling unit 100, and the temperature change of the detection unit 40 can be kept within 0.4 占 폚. The measurement error of the detection unit 40 may be within 4 [mu] m. Accordingly, the laser machining system 1 according to the embodiment can stably perform a precise laser machining operation.

2 is a perspective view showing an example of embodying the laser head 32 and its peripheral structure in the laser machining system 1 according to the embodiment. FIG. 3 is a plan view of the laser head 32 and its peripheral configuration of FIG. 2 viewed from above.

2 and 3, a laser head 32 and a head driver 35 for moving the laser head 32 in the optical axis direction are disclosed.

The laser head 32 may include a focus adjusting portion 321 for adjusting the focus of the laser beam and a supporting portion 322 for supporting the focus adjusting portion 321. [ The supporting portion 322 may be movable with respect to the head driving portion 35. [ For example, the supporting portion 322 may be slidable with respect to the head driving portion 35. [

The head driving unit 35 can move the focus adjusting unit 321 supported by the supporting unit 322 and the supporting unit 322 along the optical axis direction.

The detection unit 40 can be installed so that its position is fixed to the laser head 32. Thereby, when the laser head 32 is moved along the optical axis, the detection unit 40 can be moved together.

The detection unit 40 can detect the thickness and the position of the object W. [ For example, the detection unit 40 may include a high magnification vision camera 41. It is possible to detect or observe at least one of the thickness of the object W and the alignment position of the object W through the high magnification vision camera 41. [ As an example of the magnification of the high magnification vision camera 41, it may be 1: 10, but is not limited thereto.

The detection unit 40 may further include a low magnification vision camera 42. [ The center or rim of the object W can be detected or observed through the low magnification vision camera 42. [ As an example of the magnification of the low magnification vision camera 42, it may be 1: 1, but is not limited thereto.

Meanwhile, heat may be generated during operation of the head driving unit 35 to move the laser head 32 along the optical axis. The heat generated in the head driving unit 35 heats the air inside the chamber 10 (see FIG. 1), raising the ambient temperature of the detection unit 40. In other words, the heat generated in the head driving unit 35 can be transmitted to the detection unit 40 through convection.

The cooling unit 100 may function to block the heat generated in the head driving unit 35 from being transmitted to the detection unit 40. For example, the cooling unit 100 can cool the detection unit 40 by an air cooling method.

As one example, the cooling unit 100 may include a first cooling member 110 that supplies cooling air to the detection unit 40. [ Here, the cooling air may mean air having a temperature inside the chamber 10 or a temperature lower than the temperature of the detection unit 40.

The first cooling member 110 can jet the cooling air toward the detection unit 40. [ For example, one first cooling element 110 may inject cooling air toward the high magnification vision camera 41 and the other first cooling element 110 may inject cooling air toward the low magnification vision camera 42 It can be sprayed.

 However, the direction of ejection of the first cooling member 110 is not limited thereto, and may be variously modified so as to cool the detection unit 40 directly or indirectly. For example, the ejecting direction of the first cooling member 110 may be directed to the periphery of the detecting unit 40. [

The cooling unit 100 may further include a second cooling member 120 for supplying cooling air to the head driving unit 35. The second cooling member 120 can cool the head driving unit 35 which is the main heat source for raising the temperature of the detection unit 40 inside the chamber 10. [ Accordingly, it is possible to reduce or prevent the heat from being transmitted from the head driving unit 35 to the detection unit 40. [

The second cooling member 120 is mounted on both sides of the head driving unit 35. However, it is needless to say that the number and arrangement of the second cooling members 120 can be changed.

In the above embodiment, the cooling unit 100 includes the first and second cooling members 110 and 120. However, the present invention is not limited thereto. The first and second cooling members 110, and 120 may be omitted, or a cooling member other than the first and second cooling members 110 and 120 may be added. For example, as shown in Fig. 4, the cooling unit 100a may include only the first cooling member 110, or the cooling unit 100b may include only the second cooling member 120 as shown in Fig.

6 is a perspective view for explaining the cooling unit 100 of FIG. 6, the first cooling member 110 will be mainly described as an example of the cooling unit 100, but the present invention is not limited thereto, and the second cooling member 120 may be similarly applied.

6, in the first cooling member 110, a plurality of nozzle holes 101 for ejecting cooling air may be arranged along the optical axis. The first cooling member 110 may be rotated around a rotation axis parallel to the optical axis. Accordingly, the user can rotate the first cooling member 110 as needed to adjust the direction of spraying of the cooling air.

In the laser processing system 1 according to the above-described embodiment, the cooling unit 100 has been described focusing on the embodiment in which the detection unit 40 for detecting the thickness of the object W is cooled. However, But is not limited thereto. For example, the cooling unit 100 according to the embodiment includes a detection unit 40 that detects a characteristic other than the thickness of the object W by an optical system, for example, a detection unit 40 that detects the center of the object W , Edge, or whether to align or not.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention as defined by the appended claims.

1: Laser processing system 10: Chamber
20: work table 30: laser irradiation unit
31: laser light source 32: laser head
321: focus adjusting portion 322:
33: reflection mirror 35: head driving part
40: Detection unit 41: High magnification vision camera
42: low magnification vision camera 45: lens
100: cooling unit 101: nozzle hole
110: first cooling member 120: second cooling member
130:

Claims (20)

A detection unit for detecting the thickness of the object by an optical system;
A laser irradiation unit for irradiating the object with a laser beam based on the thickness detected by the detection unit; And
And a cooling unit configured to cool the detection unit. The method according to claim 1,
Wherein the temperature change of the detection unit is within 0.4 占 폚 by the cooling unit. The method according to claim 1,
Wherein the measurement error of said detection unit is within 4 m. The method according to claim 1,
The cooling unit includes:
And a first cooling member for supplying cooling air to the detection unit. The method according to claim 1,
The laser irradiation unit may include:
A laser light source for generating a laser beam,
And a laser head for focusing the laser beam generated from the laser light source on the object to be processed. 6. The method of claim 5,
And a head driving unit for moving the laser head along an optical axis direction. The method according to claim 6,
The cooling unit includes:
And a second cooling member for supplying cooling air to the head driving unit. 6. The method of claim 5,
Wherein the detection unit is provided so that its position is fixed to the laser head. The method according to claim 1,
Wherein the detection unit comprises at least one lens. The method according to claim 1,
And a chamber provided with a space in which the laser irradiation unit, the detection unit, and the cooling unit are disposed, and a door portion for opening and closing an opening through which the object can be inserted and removed. 11. The method of claim 10,
And a control unit for controlling operation of the cooling unit,
Wherein the control unit controls the cooling unit to operate when the chamber internal temperature is higher than the external temperature of the chamber. The method according to claim 1,
The cooling unit includes:
And is rotatable about a rotational axis parallel to the optical axis. A detection unit which detects at least one of a thickness and a position of the object by an optical system;
A laser irradiation unit for irradiating the object with a laser beam based on the information detected by the detection unit; And
And a cooling unit configured to cool the detection unit. 14. The method of claim 13,
Wherein the temperature change of the detection unit is within 0.4 占 폚 by the cooling unit. 14. The method of claim 13,
The cooling unit includes:
And a first cooling member for supplying cooling air to the detection unit. 14. The method of claim 13,
The laser irradiation unit may include:
A laser light source for generating a laser beam,
And a laser head for focusing the laser beam generated from the laser light source on the object to be processed. 17. The method of claim 16,
And a head driving unit for moving the laser head along an optical axis direction. 18. The method of claim 17,
The cooling unit includes:
And a second cooling member for supplying cooling air to the head driving unit. 17. The method of claim 16,
Wherein the detection unit is provided so that its position is fixed to the laser head. 14. The method of claim 13,
Wherein the detection unit comprises at least one lens.
KR1020160016357A 2016-02-12 2016-02-12 Laser processing system KR20170094971A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020160016357A KR20170094971A (en) 2016-02-12 2016-02-12 Laser processing system
PCT/KR2016/010051 WO2017138684A1 (en) 2016-02-12 2016-09-08 Laser processing system
TW105130256A TWI637806B (en) 2016-02-12 2016-09-20 Laser processing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160016357A KR20170094971A (en) 2016-02-12 2016-02-12 Laser processing system

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WO (1) WO2017138684A1 (en)

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CN113714627B (en) * 2020-05-25 2024-05-24 深圳市大族数控科技股份有限公司 Laser processing device and thickness measuring method thereof

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JP3895887B2 (en) * 1999-06-25 2007-03-22 日本電気株式会社 Decibel level adjustment device
JP2001141437A (en) * 1999-11-15 2001-05-25 Nkk Corp Method and device for measuring tube thickness deviation and method and device for specifying cause of occurrence of tube thickness deviation
KR100920565B1 (en) * 2007-07-27 2009-10-08 주식회사 포스코 System and method for measuring the thickness, chine and floor of slab
JP2013230478A (en) * 2012-04-27 2013-11-14 Disco Corp Laser machining apparatus and laser machining method
KR20130143433A (en) * 2012-06-21 2013-12-31 주식회사 이오테크닉스 Laser machinning method and the apparatus adopting the same
KR101425493B1 (en) * 2012-12-26 2014-08-04 주식회사 이오테크닉스 method of laser machining and apparatus adopting the method

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TW201739556A (en) 2017-11-16
TWI637806B (en) 2018-10-11
WO2017138684A1 (en) 2017-08-17

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