WO2017137420A2 - Dispositif de frittage - Google Patents

Dispositif de frittage Download PDF

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Publication number
WO2017137420A2
WO2017137420A2 PCT/EP2017/052714 EP2017052714W WO2017137420A2 WO 2017137420 A2 WO2017137420 A2 WO 2017137420A2 EP 2017052714 W EP2017052714 W EP 2017052714W WO 2017137420 A2 WO2017137420 A2 WO 2017137420A2
Authority
WO
WIPO (PCT)
Prior art keywords
sintering
workpiece
cooling
heating
tool
Prior art date
Application number
PCT/EP2017/052714
Other languages
German (de)
English (en)
Other versions
WO2017137420A3 (fr
Inventor
Christoph Ötzel
Holger Ulrich
Dr. Frank OSTERWALD
Original Assignee
Pink Gmbh Thermosysteme
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pink Gmbh Thermosysteme filed Critical Pink Gmbh Thermosysteme
Publication of WO2017137420A2 publication Critical patent/WO2017137420A2/fr
Publication of WO2017137420A3 publication Critical patent/WO2017137420A3/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/04—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/003—Apparatus, e.g. furnaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
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    • B30B15/061—Cushion plates
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8384—Sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Definitions

  • the present invention relates to a sintering apparatus for producing a workpiece from at least one component by means of pressure sintering, with an upper tool and a lower tool, between which the at least one component is received, wherein the upper tool and the lower tool for applying a pressing force to the workpiece to be sintered relative to each other are adjustable, and at least one heating device for heating the workpiece to be sintered.
  • sintering devices can under the action of heat and pressure from a so-called green body, which consists of a fine or coarse-grained substance or mixture, a solid workpiece can be generated.
  • the insert considered here is used in particular for the mechanical and electrical and / or thermally conductive connection of two components, in particular electrical semiconductor components such as high-power switching elements or semiconductor components and a base body, usually a circuit board, a heat sink or the like.
  • the low-temperature pressure sintering two or more components, in particular electronic components and substrates, by means of a joining material with each other, in particular electrically and / or thermally conductive, are connected, in which case the joining joining material is sintered.
  • a corresponding device and a method are known, for example, from WO 2014/135151 A2. This is generally spoken of a possibility of cooling with gas or a fluid such as water or oil, but remains open, as such cooling should look like.
  • a cooling device as part of a sintering device is there, however, neither shown, nor are hints to a structural design suggested.
  • Generic sintering devices preferably for electrically and or thermally connecting an electrical component to a further component group, an electrical circuit board or a heat sink are frequently used in automatic sintering systems, in particular automatic multi-chamber sintering systems.
  • automatic sintering systems in particular automatic multi-chamber sintering systems.
  • a part of the generated by the heater Heat can be undesirably transferred to other parts of the sintering device.
  • These complex dynamic processes can only be controlled to a limited extent before, during and after the actual sintering process. This in turn makes it difficult to adjust the cycle times in an automatic sintering plant and / or compliance with predetermined temperature profiles for the entire sintering process.
  • A1 proposes a sintering device with a heating device as a lower tool with a heatable support plate, a radiant heater and a cooling line which opens into a heating / cooling region and is connected to a nitrogen source.
  • a cooling line opens in a heating / cooling area and is thus located on a side of the heating device facing the workpiece.
  • the cooling effect unfolds only by outflowing nitrogen fluid, wherein the outflow opening between the radiant heater of the lower tool and a workpiece is located.
  • a cooling effect on a side facing away from the workpiece is not achieved by the cooling line.
  • gaseous nitrogen can be blown against the platen for cooling, so that convection cooling can be done by means of a flowing gas medium from the side of the lower tool.
  • the upper tool remains uncooled and can continue to heat up in the course of a series production, so that a process overheating or to a reduction in the cycle speed in series production is the result.
  • US 2002/0 083 849 describes a sintering device which explicitly does not include a cooling device. However, it is mentioned that for cooling an upper cover could be removed, so that cooling can be done by injecting cooling air.
  • the object is achieved by a sintering device having the features of claim 1.
  • the sintering device further comprises at least one cooling device in an upper tool.
  • the cooling device By means of the cooling device, it is possible, parts of the sintering device, in particular the workpiece, the upper and / or lower tool or components of a hydraulic, pneumatic or electromotive actuator means, which is provided for generating the pressing force and is in thermal contact with the tools, to cool specifically, both spatially and temporally.
  • the sintering device can thus be cooled down to a desired starting temperature in a controlled manner, so that, in particular in the case of an automatic sintering plant, a defined initial temperature is present at the beginning of each clock cycle.
  • the cycle times compared to a purely passive cooling, in which it is necessary to wait until the sintering device has cooled by itself, the cycle times can be shortened and, in particular, also be maintained.
  • the temperature of the sintering device can be actively controlled.
  • the hotter lower tool undesirably heats the upper tool and would lead to overheating of the upper sintering tool without the active and controlled cooling device.
  • the cooling device it is not necessary to ensure a constant temperature maintenance for short sintered cycles.
  • the process temperature in the tools or on the workpiece to be sintered during the actual sintering process and in the previous heating phase and / or the subsequent cooling phase can be influenced, so that an even more precise temperature control is possible.
  • the entire sintering process including the warm-up phase and / or cooling phase of the workpiece can be carried out in a single chamber, so that no complex multi-chamber system with separate preheating and / or Abkühlhuntn must be operated.
  • the sintering device can be arranged in a continuous system for a series production of Lötsinterbearbeit GmbH electrical components.
  • This can basically be arranged in a single-chamber system, but also in a two- or three-chamber system with a preheating chamber, a sintering chamber and a cooling chamber.
  • the individual chambers may be gastight, e.g. by Trennshots or the like, are in a continuous connection with each other, so that in each chamber an individual process atmosphere is adjustable.
  • the sintering device is particularly suitable for low-temperature pressure sintering for connecting electronic components and substrates.
  • the sintering temperature is between 230 ° C and 300 ° C, preferably between 240 ° C and 280 ° C, in particular at 250 ° C, to produce energy-efficient reliable sintered connection.
  • the sintering pressure may be between 0.5 MPa and 40 MPa, preferably between 25 MPa and 35 MPa, in particular at 30 MPa.
  • the upper tool In a series production in a sintered soldering process, the upper tool in particular heats up considerably over time, since the process heat rises to the top. Typically, temperatures of up to 260 ° C are achieved in a sintering process. Due to the integration according to the invention of a cooling device in the upper tool, in particular in an upper punch of a sintering press under closed process Atmosphere, in a series production very precise thermal profiles can be maintained and hereby a consistently constant Sinterlötrise be maintained. An undesirable overheating of the upper tool can be avoided and short cycle times are met, since the upper tool can be controlled cooled and possibly also heated. A pressure pad, esp.
  • Silicone pad or a gas- or liquid-filled pressure pad for pressure distribution which is arranged between the upper tool and workpiece, has a typical temperature stability up to 200 ° C and can be operated thermally stable in mass production, and does not overheat in the course of a series production ,
  • the heating device is furthermore provided on the upper tool and / or on the lower tool, in particular integrated in the upper tool and / or in the lower tool.
  • a heater and a cooling device only on the upper tool.
  • only one heating device could be connected to the lower tool and only one cooling device to the upper tool or only one cooling device to the upper tool and heating to the lower tool.
  • a cooling device can advantageously be provided on the upper tool and on the lower tool, in particular integrated in the upper tool and / or in the lower tool.
  • a heating device and at least one cooling device assigned to the respective heating device are provided on the upper tool and on the lower tool.
  • a particularly effective temperature control is possible.
  • the cooling device is arranged on a side facing away from the workpiece of the heating device.
  • parts of the sintering device for example components of a hydraulic tool adjustment or pressing device, in unexposed desirably heated by the heater and thereby damaged.
  • a further cooling device is arranged on a side of the heating device facing the workpiece.
  • this further cooling device the workpiece can be cooled even more targeted, since not only the heater must be cooled before a heat dissipation from the workpiece by the arranged on the side facing away from the workpiece of the heater cooling device.
  • a pressure-resistant thermal insulation layer is provided between the heating device and the cooling device.
  • the heating device and the cooling device are thermally decoupled from one another, so that on the one hand undesired cooling of the heating device and, on the other hand, undesired heating of the cooling device is prevented or at least reduced.
  • the insulation layer is mechanically stably listed so that it can absorb the entire, applied by a pressing device pressing pressure and forward to the workpiece.
  • the thermal insulation layer is preferably arranged between the heating device and the cooling device which faces away from the workpiece, as viewed from the heating device.
  • the cooling device is designed as fluid cooling with at least one fluid-carrying coolant channel, which can be connected to a source of cooling fluid.
  • a cooling device has proven to be particularly effective and may be formed for example as a gas or liquid cooling device.
  • the cooling capacity of the cooling device can be changed by changing the flow rate and / or speed and / or Flow medium and / or outlet temperature of a flowing through the coolant passage cooling fluid can be influenced.
  • the workpiece comprises an electronic assembly having at least one electronic component, at least one circuit carrier and a joining material connecting the component and the circuit carrier, the connection being produced by pressure sintering, in particular low-temperature pressure sintering, of the joining material.
  • the sintering device according to the invention is suitable for such an electronic assembly in a special way, since in particular the one or more electronic components are often particularly sensitive to temperature and therefore the cooling device can prevent in particular overheating of the electronic components or.
  • a joining material for example, silver (Ag) can be used, which is held in the form of a silver-containing sintering paste. It is conceivable to provide a Cu / Ag powder, a silver alloy and other components in the sintering paste.
  • the sintering paste can be arranged in platelet form (solder preform) between electronic component and circuit carrier, so that a simple pre-assembly and a uniform paste coating of the contact point can be achieved.
  • the sintering device comprises a gas-tight sealable chamber, in which at least the workpiece is received during the pressure sintering.
  • a specific process atmosphere can be provided, which reduces or prevents undesirable chemical reactions, in particular oxidation of metallic surfaces of the workpiece.
  • Such a gas-tight sealable chamber may for example be formed as a separate process chamber, which surrounds the other components of the sintering device, but at least the upper and lower tool.
  • the chamber may be formed by the upper tool and the lower tool, for example, the upper tool enclosing a one-sided open cavity, which is closed by a suitably fitted lower tool.
  • the relative oxygen content can be reduced, for example to an oxygen content of 0.005% to 0.3%, preferably from 0.05% to 0.25%, and more preferably from 0.05% to 0.15%.
  • the process atmosphere may also include a reducing agent, e.g. For example, methanoic acid (CH 2 O 2 ).
  • the chamber can be evacuated. In the chamber thus a negative pressure and / or a vacuum can be generated, which also suppresses the flow of unwanted chemical reactions or prevented.
  • a deformable pressure pad is provided on the upper tool and / or on the lower tool for a uniform transfer of the pressing force to the workpiece.
  • Fig. 1 shows a cross section through a sintering apparatus according to an embodiment of the invention.
  • a sintering device 10 comprises an upper tool 12 and a lower tool 14, which are adjustable relative to one another by means of an adjusting device (not shown), wherein the pressing force necessary for sintering is applied by the adjusting device. Only the upper tool 12, only the lower tool 14 or both can be adjustable.
  • the upper tool 1 2 comprises a pot-like, downwardly open workpiece holder 1 6a, which surrounds a cavity in which the lower tool 14 is received linearly movable. Between the workpiece holder 1 6a and the lower tool 14, for example, a seal (not shown) may be provided, so that the cavity gas-tight closed, in particular evacuated.
  • a plate-shaped heating device 18a is arranged, which has a plurality of e.g. electrically operated heating elements 20a comprises.
  • the heating device 18a and the workpiece holder 1 6a are in good thermal contact with each other.
  • a plate-shaped cooling device 22a which is thermally insulated from the heating device 18a by a pressure-resistant insulating layer 26a.
  • a plurality of coolant channels 24a which can be flowed through by a suitable liquid or gaseous coolant.
  • the insulation layer 26a and 26b is characterized in its isolation capability, i. Thermal conductivity and coupling dimensioned and designed so that an active temperature maintenance of the sintering device can be achieved.
  • the choice of material and the thickness of the material can be chosen such that a sufficient thermal decoupling can be achieved even for high quantities and short cycle times in order to prevent undesired temperature increase of the upper tool.
  • the lower tool 14 is constructed in an approximately mirror-image manner to the upper tool 12.
  • a workpiece holder 1 6b on the underside of which a plurality of eg electrically operated heating elements 20b having plate-shaped heater 18b is arranged, between the heater 18b and the workpiece holder 1 6b a good thermal transition is ensured.
  • the underside of the heating device 18b in turn is followed by a pressure-resistant insulating layer 26b, which thermally decouples a likewise plate-shaped cooling device 22b provided below the insulating layer 26b from the heating device 18b.
  • the cooling device 22b also has a plurality of coolant channels 24b.
  • the workpiece holder 1 6b of the lower tool 14 is adapted to receive a workpiece 30, which is formed in the embodiment as an electronic assembly with a circuit substrate 32, an electronic component 36 and a provided between the circuit substrate 32 and the component 36 joining material 14, which after that Pressure sintering process, the device 36 connects to the circuit substrate 32.
  • the circuit carrier 32 is arranged in a recess of the workpiece holder 1 6b.
  • the edges of the circuit carrier 32 are covered by a on the workpiece holder 1 6b attachable edge protection frame 38, which protects the edges of the circuit substrate 32 from mechanical overloading.
  • a deformable pressure pad 28 whose width is advantageously greater than the width of the workpiece 30 can be provided on the side of the tool holder 16a opposite the tool holder 16b.
  • the pressure pad 28 serves to uniformly transfer the pressing force to the workpiece 30 and prevents mechanical overvoltages on sensitive components, especially on edges occur.
  • the cooling devices 22a, 22b prevent further components of the sintering device, in particular parts of the adjusting device, from being undesirably heated during the heating of the workpiece 30 by the heating devices 18a, 18b.
  • the insulation layers 26a, 26b cause a further thermal decoupling between the heaters 18a, 18b on the one hand and the cooling devices 22a, 22b on the other hand.
  • an additional cooling device (not shown).
  • a heating device and a cooling device can be combined to form a combined heating / cooling device.
  • a heating / cooling device for example, as a plate-shaped component be configured in which both one or more heating elements, as well as one or more coolant channels are arranged.
  • the heaters 18a, 18b or the above-mentioned combined heating / cooling device may also have one or more fluid channels in which a heated heating fluid can be passed instead of the exemplified electric heating elements 20a, 20b.
  • heating / cooling device and one or more fluid channels can be provided, which can be selectively traversed by a cooling fluid or a heating fluid.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)

Abstract

L'invention concerne un dispositif de frittage (10) servant à produire une pièce (30) à partir d'au moins un composant, par frittage sous pression. Ce dispositif de frittage comprend une matrice supérieure (12) et une matrice inférieure (14) entre lesquelles le(s) composant(s) est/sont accueilli(s). La matrice supérieure (12) et la matrice inférieure (14) sont déplaçables l'une par rapport à l'autre pour appliquer une force de compression sur la pièce (30) à fritter. Au moins un dispositif de chauffage (18a, 18b) est prévu pour chauffer la pièce (30) à fritter. Le dispositif de frittage selon l'invention comprend en outre au moins un dispositif de refroidissement (22a, 22b) dans une matrice supérieure (12) qui maintient activement le dispositif de frittage à une température plus constante. En effet, lors du processus de frittage, la matrice inférieure plus chaude chauffe de manière indésirable la matrice supérieure et surchaufferait la matrice de frittage supérieure en l'absence du dispositif de refroidissement actif et commandé. En outre, sans ledit dispositif de refroidissement, il n'est pas possible de garantir un maintien de température constante lors de processus de cycles de frittage courts.
PCT/EP2017/052714 2016-02-08 2017-02-08 Dispositif de frittage WO2017137420A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016102162.8 2016-02-08
DE102016102162.8A DE102016102162A1 (de) 2016-02-08 2016-02-08 Sintervorrichtung

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WO2017137420A2 true WO2017137420A2 (fr) 2017-08-17
WO2017137420A3 WO2017137420A3 (fr) 2017-10-05

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EP3709342A1 (fr) * 2019-03-12 2020-09-16 Infineon Technologies AG Agencement et procédé d'assemblage d'au moins deux éléments d'assemblage à l'aide d'une feuille sur un élément de support interposée entre l'élément supérieur d'assemblage et un outil de compression
CN112038263A (zh) * 2020-08-14 2020-12-04 深圳第三代半导体研究院 一种用于功率器件封装的夹具
CN112053973A (zh) * 2020-08-25 2020-12-08 深圳第三代半导体研究院 一种用于功率器件封装的夹具系统
CN112071775A (zh) * 2020-08-14 2020-12-11 深圳第三代半导体研究院 一种用于功率器件封装的烧结设备
CN115394689A (zh) * 2022-09-05 2022-11-25 江苏富乐华功率半导体研究院有限公司 一种功率半导体器件热压烧结装置
WO2023062116A3 (fr) * 2021-10-14 2023-11-09 Pink Gmbh Thermosysteme Dispositif de brasage par diffusion et/ou dispositif de frittage, outil et installation permettant de relier des composants d'au moins un module électronique

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WO2014135151A2 (fr) 2013-03-04 2014-09-12 Danfoss Silicon Power Gmbh Dispositif de frittage sous pression à basse température, procédé de frittage sous pression à basse température et module d'électronique de puissance

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3709342A1 (fr) * 2019-03-12 2020-09-16 Infineon Technologies AG Agencement et procédé d'assemblage d'au moins deux éléments d'assemblage à l'aide d'une feuille sur un élément de support interposée entre l'élément supérieur d'assemblage et un outil de compression
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CN112038263A (zh) * 2020-08-14 2020-12-04 深圳第三代半导体研究院 一种用于功率器件封装的夹具
CN112071775A (zh) * 2020-08-14 2020-12-11 深圳第三代半导体研究院 一种用于功率器件封装的烧结设备
CN112071775B (zh) * 2020-08-14 2024-08-09 南方科技大学 一种用于功率器件封装的烧结设备
CN112053973A (zh) * 2020-08-25 2020-12-08 深圳第三代半导体研究院 一种用于功率器件封装的夹具系统
WO2023062116A3 (fr) * 2021-10-14 2023-11-09 Pink Gmbh Thermosysteme Dispositif de brasage par diffusion et/ou dispositif de frittage, outil et installation permettant de relier des composants d'au moins un module électronique
CN115394689A (zh) * 2022-09-05 2022-11-25 江苏富乐华功率半导体研究院有限公司 一种功率半导体器件热压烧结装置
CN115394689B (zh) * 2022-09-05 2023-09-01 江苏富乐华功率半导体研究院有限公司 一种功率半导体器件热压烧结装置

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