WO2017130997A1 - Optical element manufacturing method - Google Patents

Optical element manufacturing method Download PDF

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Publication number
WO2017130997A1
WO2017130997A1 PCT/JP2017/002441 JP2017002441W WO2017130997A1 WO 2017130997 A1 WO2017130997 A1 WO 2017130997A1 JP 2017002441 W JP2017002441 W JP 2017002441W WO 2017130997 A1 WO2017130997 A1 WO 2017130997A1
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WO
WIPO (PCT)
Prior art keywords
hologram sheet
optical substrate
optical
bonded
thermocompression
Prior art date
Application number
PCT/JP2017/002441
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French (fr)
Japanese (ja)
Inventor
岡田　巧
Original Assignee
コニカミノルタ株式会社
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Publication date
Application filed by コニカミノルタ株式会社 filed Critical コニカミノルタ株式会社
Publication of WO2017130997A1 publication Critical patent/WO2017130997A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/32—Holograms used as optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording

Definitions

  • the present invention relates to a method for manufacturing an optical element. More specifically, the present invention relates to a method for manufacturing an optical element in which a hologram sheet is bonded to an optical substrate by a simple method and without reducing optical characteristics.
  • an optical element on which a hologram sheet is bonded is used.
  • it is used in a spectacle-type image display device that is mounted on an observer's head and can obtain information in a hands-free manner.
  • an optical substrate such as a prism is used in the display unit of the eyeglass-type image display device, and a hologram sheet is disposed on the reflection surface of the optical substrate.
  • the optical characteristics of the hologram sheet change depending on the state of bonding to the optical substrate. For example, when the hologram sheet does not faithfully conform to the shape of the bonding surface of the optical substrate, the wavelength shift and diffraction efficiency are reduced due to wrinkling and bending of the hologram sheet. Therefore, the hologram sheet needs to be in a state of being accurately bonded to the optical substrate.
  • a method for bonding a hologram sheet to an optical substrate for example, a method is known in which a hologram sheet having an adhesive layer made of an adhesive or the like on one side is accurately aligned with a plate-like member such as a glass plate and bonded.
  • Patent Document 1 a method is known in which a hologram sheet having an adhesive layer made of an adhesive or the like on one side is accurately aligned with a plate-like member such as a glass plate and bonded.
  • the hologram sheet is wrinkled or bent due to slight unevenness of the adhesive layer, there is a problem that it is difficult to attach the hologram sheet to the optical substrate so as not to cause wrinkling or bending.
  • the function as an optical element condensing, reflection, diffractive action, etc. is deteriorated due to the appearance failure and the floating / flipping of the hologram sheet.
  • the photosensitive sheet that is the hologram sheet before exposure is pressed against the optical substrate under vacuum, and then the photosensitive sheet is exposed.
  • a method for forming a hologram sheet is known (Patent Document 2).
  • Patent Document 2 since the photosensitive material of the photosensitive sheet is gel-like and sticky, it can be bonded to an optical substrate by pressing under vacuum.
  • this method has a problem that a special device is required because the pressing is performed under vacuum.
  • the hologram sheet after exposure is not sticky, if it is applied to a method of bonding the hologram sheet to an optical substrate, an adhesive layer is required for the hologram sheet, which is the same as the method of Patent Document 1. Problems arise.
  • Patent Document 1 and Patent Document 2 require a large apparatus and a complicated process in order to put the hologram sheet on the optical substrate. Therefore, there is a demand for a method capable of bonding a hologram sheet to an optical substrate by a simple method and without reducing optical characteristics.
  • the present invention has been made in view of the above problems and circumstances, and a solution to the problem is a method for manufacturing an optical element in which a hologram sheet is bonded to an optical substrate by a simple method and without reducing optical characteristics. Is to provide.
  • thermocompression bonding 1.
  • the optical substrate and the protection member are each prisms, 3.
  • thermocompression-bonded to the optical substrate by a thermocompression-bonding jig having a crimping surface portion formed of an elastic member. Manufacturing method.
  • thermocompression bonding jig has a cutter part
  • the optical element according to claim 5 wherein the hologram sheet is thermocompression-bonded to the optical substrate by the thermocompression-bonding jig, and an outer side than an optical usage range of the hologram sheet is cut by the cutter unit. Production method.
  • thermocompression bonding jig The curvature of the surface of the optical substrate to which the hologram sheet is bonded and the pressure bonding surface of the thermocompression bonding jig are different from each other, After a part of the crimping surface portion of the thermocompression bonding jig is brought into contact with a part of the hologram sheet disposed on the optical substrate, the crimping surface portion of the thermocompression bonding jig is placed on the outer periphery of the hologram sheet. 7.
  • the surface activation treatment is performed on the surface of the optical substrate to be thermocompression bonded before the hologram sheet is thermocompression bonded to the optical substrate.
  • an adhesive layer made of various adhesives or the like is not required between the optical substrate and the hologram sheet. Therefore, wrinkles and deflections due to the unevenness of the adhesive layer as described above do not occur, and a decrease in optical characteristics such as a wavelength shift and a decrease in diffraction efficiency can be prevented.
  • thermocompression bonding equipment Schematic diagram showing the positional relationship between the thermocompression bonding jig and the optical substrate before the hologram sheet is thermocompression bonded to the optical substrate.
  • the schematic diagram which shows the state which a part of crimping
  • the schematic diagram which shows the state which the crimping
  • substrate with which the hologram sheet was bonded, and a protection member 5A is a perspective view showing a state in which an adhesive layer is formed on the bonding surface of the optical substrate in FIG. 5A.
  • the perspective view which shows the state which the optical board
  • the method for producing an optical element of the present invention is characterized in that a hologram sheet is bonded to an optical substrate by thermocompression bonding. This feature is a technical feature common to the claimed invention.
  • the hologram sheet from the viewpoint of improving the adhesion between the hologram sheet and the optical substrate, it is preferable to cover the hologram sheet with a protective member from the upper surface of the hologram sheet bonded to the optical substrate.
  • the optical substrate and the protective member are each a prism, and from the upper surface of the hologram sheet bonded to the optical substrate, the protective member It is preferable to cover the hologram sheet and adhere to the optical substrate.
  • the surface of the optical substrate on which the hologram sheet is thermocompression bonded is a curved surface from the viewpoint of facilitating bonding with accuracy so as not to cause wrinkling or bending.
  • the hologram sheet is attached to the optical substrate by a thermocompression-bonding jig having a pressure-bonding surface portion formed of an elastic member from the viewpoint of facilitating accurate bonding so as not to cause wrinkles or bending. It is preferable to perform thermocompression bonding.
  • the thermocompression bonding jig has a cutter part, and the hologram sheet is thermocompression bonded to the optical substrate by the thermocompression bonding jig, and the hologram sheet is optically used by the cutter part. It is preferable to cut outside the range. Thereby, thermocompression bonding and cutting of unnecessary portions outside the optical use range can be performed in the same process, and the manufacturing process can be reduced.
  • the surface of the optical substrate to which the hologram sheet is bonded and the pressure bonding surface of the thermocompression bonding jig have different curvatures, and a part of the pressure bonding surface portion of the thermocompression bonding jig is Then, after contacting a part of the hologram sheet disposed on the optical substrate, the pressure-bonding surface portion of the thermocompression bonding jig is contacted toward the outer periphery of the hologram sheet, and the hologram sheet is placed on the optical substrate. Is preferably thermocompression-bonded. Thereby, it is possible to prevent the hologram sheet from being wrinkled or bent, and when bubbles are present between the hologram sheet and the optical substrate, the bubbles can be discharged to the outside.
  • thermocompression bonding from the viewpoint of suppressing damage to the hologram sheet by performing bonding by thermocompression bonding under lower temperature and pressure conditions, before thermocompression bonding the hologram sheet to the optical substrate.
  • the surface of the optical substrate to be thermocompression bonded is preferably surface activated.
  • ⁇ is used to mean that the numerical values described before and after it are included as a lower limit value and an upper limit value.
  • the optical element 1 includes a hologram sheet 10, an optical substrate 20, a protection member 30, and the like, and the hologram sheet 10 is formed between the optical substrate 20 and the protection member 30.
  • the surface of the optical substrate 20 to which the hologram sheet 10 is bonded is a mirror surface (optical surface) having surface accuracy on the order of wavelengths.
  • the hologram sheet 10 is directly bonded to the optical substrate 20 by thermocompression bonding.
  • the protective member 30 is covered by the adhesive layer 13 so as to cover the hologram sheet 10 from the upper surface of the hologram sheet 10 bonded to the optical substrate 20. Is preferably bonded to the optical substrate 20. In addition, as long as the hologram sheet 10 bonded to the optical substrate 20 has sufficient adhesion, it is not always necessary to provide the protective member 30 depending on the usage form.
  • the optical element 1 of the present invention directly bonds the hologram sheet 10 to the optical substrate 20 by thermocompression bonding, as will be described in the optical element 1 manufacturing method described later, the optical element of the conventional example shown in FIG.
  • the pressure-sensitive adhesive layer 14 made of various adhesives or the like is not necessary. Therefore, wrinkles and deflections due to the unevenness of the adhesive layer do not occur, the shape of the hologram sheet 10 can be maintained along the surface shape of the optical substrate 20, and the wavelength shift, the reduction in diffraction efficiency, and the diffraction direction can be maintained. It is possible to prevent deterioration of optical characteristics such as shift.
  • the hologram sheet 10 preferably has at least a hologram layer 11 and further has a protective layer 12.
  • the hologram layer 11 is a layer in which a hologram is recorded by laser exposure, ultraviolet irradiation, baking treatment, or the like on a photosensitive layer containing a chemical composition such as a hologram photosensitive composition, a dye composition, an exothermic endothermic composition, and a binder. It is.
  • the photosensitive layer before the hologram is recorded is gel-like and adhesive, but the hologram layer 11 on which the hologram is recorded has almost no adhesiveness.
  • the hologram photosensitive composition is preferably composed of, for example, a photosensitive silver halide, a non-photosensitive organic silver salt, a photopolymerizing agent, a reducing agent and the like.
  • binder examples include natural polymers, synthetic polymers and copolymers, and other media for forming sheets. Specific examples include, for example, gelatin, gum arabic, polyvinyl alcohol, hydroxyethyl cellulose, cellulose acetate butyrate, polyvinyl pyrrolidone, casein, starch, polyacrylic acid, polymethyl methacrylate, polymethacrylic acid, polyvinyl chloride, copoly (styrene-anhydrous Maleic acid), copoly (styrene-acrylonitrile), copoly (styrene-butadiene), polyvinyl acetals, polyvinyl formal, polyvinyl butyral, polyesters, polyurethanes, phenoxy resins, polyvinylidene chloride, polyepoxides, polycarbonates, polyvinyl Examples include acetates, cellulose esters, polyamides, and the like, which may be hydrophilic or non-hydrophilic.
  • the thickness of the hologram layer 11 is not particularly limited, but is preferably in the range of about 5 to 100 ⁇ m.
  • Examples of the protective layer 12 include plastic, glass, and metal.
  • the plastic which has the flexibility which can be made into roll shape and flat shape, and the intensity
  • Examples of the metal include aluminum and stainless steel.
  • Examples of the plastic include polyester, polystyrene, polycarbonate, polyethersulfone, polyimide, polycyclopentadiene, polynorbornene, nylon, and cellulose acetate.
  • Examples of the polyester include polyethylene terephthalate and polyethylene naphthalate.
  • the optical substrate 20 and the protection member 30 are preferably prisms made of transparent glass or transparent resin.
  • the optical substrate 20 and the protection member 30 may be formed of different materials, but when the optical element 1 is used as a see-through type display element, it is preferable that the optical substrate 20 and the protection member 30 are formed of a material having the same refractive index.
  • the optical substrate 20 is a transparent glass plate and the protective member 30 is a transparent resin film can be given (FIG. 6).
  • the material of the protective member 30 can be appropriately selected according to the embodiment. It may be different from the refractive index of the optical substrate 20.
  • an adhesive having the same refractive index as that of the optical substrate 20 such as an ultraviolet curable adhesive or a thermosetting adhesive.
  • an ultraviolet curable adhesive that can be cured at a low temperature with few restrictions during the coating process is preferably used.
  • the external light L3 that passes through the hologram sheet 10 is shown.
  • the wavelength region of the reproduction light L1 is arbitrary depending on each application, and may be a visible light region, an ultraviolet light region, or an infrared light region.
  • the manufacturing method of the optical element 1 is characterized in that the hologram sheet 10 is bonded to the optical substrate 20 by thermocompression bonding.
  • the hologram sheet 10 is softened by heat, and the softened hologram sheet 10 is brought into close contact with the optical substrate 20 without a gap by the applied pressure. Therefore, the state is similar to the optical contact, and the hologram sheet is applied to the optical substrate 20 only by thermocompression bonding. It is thought that 10 could be pasted.
  • the bonding method by thermocompression bonding according to the present invention does not require an adhesive layer made of various adhesives between the optical substrate 20 and the hologram sheet 10.
  • the hologram sheet 10 is bonded while maintaining the same shape as the surface shape of the optical substrate. Therefore, the wavelength shift, the reduction in diffraction efficiency, the diffraction It is possible to prevent a decrease in optical characteristics such as a direction shift.
  • a method for manufacturing the optical element 1 will be described by taking as an example the case where the optical substrate 20 and the protective member 30 are prisms.
  • thermocompression bonding The optical substrate 20 before thermocompression bonding is subjected to surface activation treatment such as ozone treatment, corona discharge treatment, glow discharge treatment, flame treatment, ultraviolet irradiation treatment, electron beam irradiation treatment and the like within a range not impairing the effects of the present invention. May be.
  • surface activation treatment such as ozone treatment, corona discharge treatment, glow discharge treatment, flame treatment, ultraviolet irradiation treatment, electron beam irradiation treatment and the like within a range not impairing the effects of the present invention. May be.
  • thermocompression bonding equipment can be performed by simultaneously applying heat and pressure to the hologram sheet 10 disposed on the optical substrate 20 by a conventionally known thermocompression bonding apparatus 40.
  • a thermocompression bonding apparatus 40 for example, an apparatus including a cradle 41, a thermocompression bonding jig 42, an electric heating unit 43, an air cylinder 44, and the like can be used (FIG. 2).
  • the cradle 41 is a pedestal for fixing the optical substrate 20 and can be appropriately changed according to the shape of the optical substrate 20.
  • the thermocompression bonding jig 42 has a pressure bonding surface that contacts the hologram sheet 10 and performs thermocompression bonding.
  • the material used for the thermocompression bonding jig 42 is not particularly limited as long as it has heat resistance and heat conductivity.
  • metals such as stainless steel, aluminum, and copper can be used.
  • the thermocompression bonding jig 42 includes a crimping surface portion 421 formed of an elastic member and a cutter portion 422 for cutting the hologram sheet 10.
  • the elastic member used for the pressure-bonding surface portion 421 is not particularly limited as long as it is an elastic body excellent in heat resistance and thermal conductivity.
  • heat-resistant silicone rubber or the like can be used.
  • a known cutter can be used as appropriate, but has a thickness that can cut the hologram sheet 10 and does not damage the optical substrate 20 (for example, about 0 to 30 ⁇ m larger than the thickness of the hologram sheet 10). It is preferable to use a cutter.
  • the electric heating unit 43 is connected to a power source (not shown) to form a heater.
  • the heat can be transferred to the thermocompression bonding jig 42 by heating the electrothermal portion 43.
  • the air cylinder 44 can move up and down the block having the thermocompression bonding jig 42 and the like by the energy of the compressed air in the air cylinder 44.
  • the air cylinder 44 has, for example, a first supply port 45a and a second supply port 45b for introducing air into the air cylinder 44, and descends when air is introduced from the first supply port 45a. It is configured to rise when air is introduced from the supply port 45b.
  • the surface on the side on which the hologram sheet 10 is thermocompression bonded is preferably a curved surface.
  • the surface of the optical substrate 20 to which the hologram sheet 10 is bonded and the pressure bonding surface of the thermocompression bonding jig 42 have different curvatures ( 4A and 4B).
  • thermocompression bonding a process of thermocompression bonding the hologram sheet 10 to the optical substrate 20 using the thermocompression bonding jig 42 will be described (FIGS. 3A and 3B).
  • 3A and 3B show only the main part of the thermocompression bonding apparatus 40 used for thermocompression bonding.
  • the hologram layer 11 is disposed on the optical substrate 20 side so that the hologram sheet 10 is aligned at a predetermined position (FIG. 3A).
  • the thermocompression bonding jig 42 heated to a predetermined temperature by the electric heating unit 43 is gradually lowered toward the hologram sheet 10 and the optical substrate 20 and brought into contact therewith. Pressure is applied simultaneously and thermocompression bonding is performed (FIG. 3B).
  • thermocompression bonding is performed according to the composition of the hologram sheet 10 at a predetermined temperature (for example, within a range of 60 to 110 ° C.), a predetermined pressure (for example, 0.1 to 0.6 MPa), and a predetermined time (for example, 5 to 60 seconds).
  • a predetermined temperature for example, within a range of 60 to 110 ° C.
  • a predetermined pressure for example, 0.1 to 0.6 MPa
  • a predetermined time for example, 5 to 60 seconds.
  • thermocompression bonding is performed at a temperature in the range of 90 to 110 ° C. and a pressure in the range of 0.3 to 0.6 MPa.
  • the process of thermocompression bonding is completed by raising the thermocompression bonding jig 42.
  • the cutter portion 422 of the thermocompression bonding jig 42 enters the inside of the hologram sheet 10, so that the cutter portion 422 is unnecessary outside the optical usage range of the hologram sheet 10.
  • the part can be cut.
  • the “optical use range” in this specification means a region to which the reproduction light L1 is irradiated when used as the optical element 1.
  • FIGS. 4A and 4B are examples in which the surface of the optical substrate 20 to which the hologram sheet 10 is bonded and the crimping surface of the thermocompression bonding jig 42 have different curvatures, and the central portion first comes into contact. It is. 4A and 4B, the cutter unit 422 is omitted for convenience of explanation.
  • thermocompression bonding jig 42 By lowering the thermocompression bonding jig 42 toward the optical substrate 20, a part of the crimping surface portion 421 of the thermocompression bonding jig 42 is brought into contact with a part of the hologram sheet 10 on the optical substrate 20.
  • a part of each comes into contact (FIG. 4A).
  • thermocompression bonding jig 42 is brought into contact with the outer periphery of the hologram sheet 10, and the crimping surface portion 421 and the upper surface portion of the hologram sheet 10 are brought into contact with each other (FIG. 4B).
  • thermocompression bonding is performed under the conditions described above.
  • the pressure-bonding surface portion 421 is an elastic member, the pressure-bonding surface portion 421 and all the upper surface portions of the hologram sheet 10 are gradually brought into contact with each other from a state where a portion of the pressure-bonding surface portion 421 is in contact with a part of the hologram sheet 10. It can be in contact. Thereby, it is possible to prevent the hologram sheet 10 from being wrinkled or bent, and when bubbles exist between the hologram sheet and the optical substrate, the bubbles can be discharged to the outside.
  • FIG. 4A a diagram is shown in which a center portion of each of the crimping surface portion 421 and a portion of the hologram sheet 10 abuts when the abutment portion 421 abuts, but the present invention is not limited to this.
  • a configuration may be adopted in which the pressure-bonding surface portion 421 and the hologram sheet 10 in FIG. 4A are first brought into contact with each other in the vicinity of the right end and gradually contacted toward the left end.
  • the curvatures of the optical substrate 20 and the pressure-bonding surface of the pressure-bonding surface portion 421 can be appropriately changed as long as the effects of the present invention are obtained.
  • FIG. 5A shows a state before the optical substrate 20 to which the hologram sheet 10 is bonded and the protective member 30 are joined.
  • an adhesive for example, an ultraviolet curable adhesive
  • an adhesive is applied to the hologram sheet 10 and the optical substrate 20 from the upper surface of the hologram sheet 10 bonded to the optical substrate 20 to form the adhesive layer 13 (FIG. 5B).
  • the hologram sheet 10 is covered with the protective member 30 and bonded to the optical substrate 20 from the upper surface of the hologram sheet 10 bonded to the optical substrate 20 so as to cover the hologram sheet 10 (FIG. 5C).
  • the bonding step is completed by curing the adhesive (in the case of an ultraviolet curable adhesive, irradiation with ultraviolet rays).
  • the adhesiveness of the hologram sheet 10 and the optical substrate 20 can be improved. Therefore, it is useful when the temperature and pressure conditions during thermocompression bonding are lowered and a large adhesion force cannot be obtained.
  • the adhesion of the protective member 30 to the optical substrate 20 does not affect the interface with the optical substrate 20
  • the adhesion between the hologram sheet 10 and the optical substrate 20 can be improved, the accuracy is not necessarily high. There is no need to perform alignment.
  • the protection member 30 may not necessarily be provided depending on the usage form.
  • the optical element 1 having the hologram sheet 10 of the present embodiment includes, for example, a head mounted display (HMD), a head up display (HUD), an optical memory, an optical disk pickup lens, a liquid crystal color filter, a reflective liquid crystal reflector, a lens, It is suitably used for diffraction gratings, optical filters, optical fiber couplers, optical polarizers, and the like. In addition to being used as an optical component, it may be used for architectural window glass, covers such as books and magazines, displays such as POPs, gifts, credit cards, banknotes, and packaging for security purposes for preventing counterfeiting.
  • the hologram sheet 10 of the present embodiment is configured to have the protective layer 12, it may have other layers such as an ultraviolet absorbing layer.
  • the ultraviolet absorbing layer is used to cut ultraviolet rays to the hologram layer 11.
  • conventionally known materials can be used as long as they have necessary strength and durability.
  • the optical element manufacturing method of the present invention is a simple method and can be used to bond a hologram sheet to an optical substrate without degrading optical characteristics. Therefore, a head mounted display (HMD), a head up display (HUD) ), An optical memory, an optical disk pickup lens, a liquid crystal color filter, a reflective liquid crystal reflector, a lens, a diffraction grating, an optical filter, an optical fiber coupler, an optical polarizer, and the like.
  • HMD head mounted display
  • HUD head up display
  • An optical memory an optical disk pickup lens
  • a liquid crystal color filter a reflective liquid crystal reflector
  • a lens a diffraction grating
  • an optical filter an optical fiber coupler
  • an optical polarizer an optical polarizer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Holo Graphy (AREA)

Abstract

The present invention addresses the problem of providing an optical element manufacturing method for affixing a hologram sheet to an optical substrate, with an easy method and without degrading optical characteristics. This optical element 1 manufacturing method is characterized in that a hologram sheet 10 is affixed to an optical substrate 20 by thermal pressure bonding. As an embodiment of the present invention, it is preferable to cover the hologram sheet 10 using a protective member 30, from the upper surface of the hologram sheet 10 which has been affixed to the optical substrate 20.

Description

光学素子の製造方法Optical element manufacturing method
　本発明は、光学素子の製造方法に関する。より詳細には、本発明は、簡易な方法で、かつ光学特性を低下させずに、ホログラムシートを光学基板に貼合する光学素子の製造方法に関する。 The present invention relates to a method for manufacturing an optical element. More specifically, the present invention relates to a method for manufacturing an optical element in which a hologram sheet is bonded to an optical substrate by a simple method and without reducing optical characteristics.
　従来、種々の用途において、ホログラムシートが貼合された光学素子が用いられており、例えば、観察者頭部に装着されてハンズフリーで情報を得ることのできる眼鏡型画像表示装置に用いられている。眼鏡型画像表示装置の表示部には、例えば、プリズム等の光学基板が使用されており、光学基板の反射面にはホログラムシートが配設されている。 Conventionally, in various applications, an optical element on which a hologram sheet is bonded is used. For example, it is used in a spectacle-type image display device that is mounted on an observer's head and can obtain information in a hands-free manner. Yes. For example, an optical substrate such as a prism is used in the display unit of the eyeglass-type image display device, and a hologram sheet is disposed on the reflection surface of the optical substrate.
　ホログラムシートは、光学基板への貼合状態により光学特性が変化する。例えば、ホログラムシートが光学基板の貼合面の形状に忠実に沿わない場合、ホログラムシートにしわや撓みが生じることによって、波長シフトや回折効率が低下する。そのため、ホログラムシートが精度よく光学基板に貼合した状態とする必要がある。 The optical characteristics of the hologram sheet change depending on the state of bonding to the optical substrate. For example, when the hologram sheet does not faithfully conform to the shape of the bonding surface of the optical substrate, the wavelength shift and diffraction efficiency are reduced due to wrinkling and bending of the hologram sheet. Therefore, the hologram sheet needs to be in a state of being accurately bonded to the optical substrate.
　ホログラムシートを光学基板に貼合する方法としては、例えば、片面に接着剤等からなる粘着層を有するホログラムシートを、ガラス板等の板状部材に正確に位置合せして貼合する方法が知られている（特許文献１）。
　しかしながら、この方法では、ホログラムシートの貼り付けのために粘着層が必要となる。そのため、ホログラムシートの面に対して高精度に粘着層を設ける手段と、さらに、当該ホログラムシートを光学基板の面に対して均等に圧力をかけて貼り付ける手段が必要となり、製造コストを要するという問題があった。また、粘着層のわずかな凹凸により、ホログラムシートにしわや撓みが生じてしまうため、しわや撓みが生じないようにホログラムシートを光学基板に貼り付けることが難しいという問題があった。さらに、外観不良やホログラムシートの浮き・ヨレが生じて、光学素子としての機能（集光、反射、回折作用等）が低下するという問題もあった。 As a method for bonding a hologram sheet to an optical substrate, for example, a method is known in which a hologram sheet having an adhesive layer made of an adhesive or the like on one side is accurately aligned with a plate-like member such as a glass plate and bonded. (Patent Document 1).
However, this method requires an adhesive layer for attaching the hologram sheet. Therefore, it is necessary to provide means for providing an adhesive layer with high accuracy on the surface of the hologram sheet, and further, means for applying the hologram sheet to the surface of the optical substrate by applying pressure evenly to the surface of the optical substrate, which requires manufacturing costs. There was a problem. Further, since the hologram sheet is wrinkled or bent due to slight unevenness of the adhesive layer, there is a problem that it is difficult to attach the hologram sheet to the optical substrate so as not to cause wrinkling or bending. In addition, there is a problem that the function as an optical element (condensing, reflection, diffractive action, etc.) is deteriorated due to the appearance failure and the floating / flipping of the hologram sheet.
　そこで、しわや撓みが生じることなくホログラムシートを光学基板に貼合した状態とする方法として、露光前のホログラムシートである感光シートを真空下で光学基板に押圧し、その後、感光シートを露光してホログラムシートを形成する方法が知られている（特許文献２）。この方法においては、感光シートの感材がゲル状で粘着性があるため、真空下で押圧することで、光学基板に貼合することが可能である。
　しかしながら、この方法では、真空下で押圧するため、特殊な装置が必要であるという問題があった。また、露光後のホログラムシートには粘着性がないため、仮にホログラムシートを光学基板に貼合する方法に適用する場合には、ホログラムシートに粘着層を必要とし、特許文献１の方法と同様の問題が生じる。 Therefore, as a method of making the hologram sheet bonded to the optical substrate without causing wrinkles or bending, the photosensitive sheet that is the hologram sheet before exposure is pressed against the optical substrate under vacuum, and then the photosensitive sheet is exposed. A method for forming a hologram sheet is known (Patent Document 2). In this method, since the photosensitive material of the photosensitive sheet is gel-like and sticky, it can be bonded to an optical substrate by pressing under vacuum.
However, this method has a problem that a special device is required because the pressing is performed under vacuum. Moreover, since the hologram sheet after exposure is not sticky, if it is applied to a method of bonding the hologram sheet to an optical substrate, an adhesive layer is required for the hologram sheet, which is the same as the method of Patent Document 1. Problems arise.
　また、特許文献１及び特許文献２の方法では、ホログラムシートを光学基板に貼り合わせた状態とするために、大型の装置や複雑な工程を必要とする。そのため、簡易な方法で、かつ光学特性を低下させずに、ホログラムシートを光学基板に貼合することができる方法が求められている。 In addition, the methods of Patent Document 1 and Patent Document 2 require a large apparatus and a complicated process in order to put the hologram sheet on the optical substrate. Therefore, there is a demand for a method capable of bonding a hologram sheet to an optical substrate by a simple method and without reducing optical characteristics.
特開平１０－１０９８１１号公報JP 10-109811 A 特開２００６－１７８１８４号公報JP 2006-178184 A
　本発明は上記問題及び状況に鑑みてなされたものであり、その解決課題は、簡易な方法で、かつ光学特性を低下させずに、ホログラムシートを光学基板に貼合する光学素子の製造方法を提供することである。 The present invention has been made in view of the above problems and circumstances, and a solution to the problem is a method for manufacturing an optical element in which a hologram sheet is bonded to an optical substrate by a simple method and without reducing optical characteristics. Is to provide.
　本発明者らは、上記課題を解決すべく、鋭意検討した結果、光学基板に、ホログラムシートを熱圧着によって貼合することよって、光学特性を低下させずに、ホログラムシートを光学基板に貼合することができることを見いだし、本発明を完成した。
　すなわち、本発明に係る課題は、以下の手段によって解決される。 As a result of intensive studies to solve the above problems, the present inventors bonded the hologram sheet to the optical substrate without degrading the optical characteristics by bonding the hologram sheet to the optical substrate by thermocompression bonding. We have found out what we can do and have completed the present invention.
That is, the subject concerning this invention is solved by the following means.
　１．光学基板に、ホログラムシートを熱圧着することによって貼合することを特徴とする光学素子の製造方法。 1. A method for producing an optical element, wherein the hologram sheet is bonded to an optical substrate by thermocompression bonding.
　２．前記光学基板に貼合された前記ホログラムシートの上面から、保護部材によって前記ホログラムシートを覆うことを特徴とする第１項に記載の光学素子の製造方法。 2. 2. The method of manufacturing an optical element according to claim 1, wherein the hologram sheet is covered with a protective member from the upper surface of the hologram sheet bonded to the optical substrate.
　３．前記光学基板及び前記保護部材がそれぞれプリズムであり、
　前記光学基板に貼合された前記ホログラムシートの上面から、前記保護部材によって前記ホログラムシートを覆って前記光学基板に接着することを特徴とする第２項に記載の光学素子の製造方法。 3. The optical substrate and the protection member are each prisms,
3. The method of manufacturing an optical element according to claim 2, wherein the hologram sheet is covered with the protective member from the upper surface of the hologram sheet bonded to the optical substrate and adhered to the optical substrate.
　４．前記ホログラムシートが熱圧着される前記光学基板の面が、曲面であることを特徴とする第１項から第３項までのいずれか一項に記載の光学素子の製造方法。 4. The method of manufacturing an optical element according to any one of claims 1 to 3, wherein a surface of the optical substrate to which the hologram sheet is thermocompression bonded is a curved surface.
　５．弾性部材によって形成された圧着面部を有する熱圧着治具によって、前記光学基板に前記ホログラムシートを熱圧着することを特徴とする第１項から第４項までのいずれか一項に記載の光学素子の製造方法。 5. The optical element according to any one of items 1 to 4, wherein the hologram sheet is thermocompression-bonded to the optical substrate by a thermocompression-bonding jig having a crimping surface portion formed of an elastic member. Manufacturing method.
　６．前記熱圧着治具は、カッター部を有し、
　前記熱圧着治具によって前記光学基板に前記ホログラムシートを熱圧着するとともに、前記カッター部により前記ホログラムシートの光学使用範囲よりも外側をカットすることを特徴とする第５項に記載の光学素子の製造方法。 6). The thermocompression bonding jig has a cutter part,
The optical element according to claim 5, wherein the hologram sheet is thermocompression-bonded to the optical substrate by the thermocompression-bonding jig, and an outer side than an optical usage range of the hologram sheet is cut by the cutter unit. Production method.
　７．前記ホログラムシートが貼合される前記光学基板の面と、前記熱圧着治具の圧着面が異なる曲率であり、
　前記熱圧着治具の前記圧着面部の一部を、前記光学基板上に配置した前記ホログラムシートの一部に当接させた後、前記熱圧着治具の前記圧着面部を前記ホログラムシートの外周に向かって当接させ、前記光学基板に前記ホログラムシートを熱圧着することを特徴とする第５項又は第６項に記載の光学素子の製造方法。 7). The curvature of the surface of the optical substrate to which the hologram sheet is bonded and the pressure bonding surface of the thermocompression bonding jig are different from each other,
After a part of the crimping surface portion of the thermocompression bonding jig is brought into contact with a part of the hologram sheet disposed on the optical substrate, the crimping surface portion of the thermocompression bonding jig is placed on the outer periphery of the hologram sheet. 7. The method for manufacturing an optical element according to claim 5, wherein the hologram sheet is thermocompression bonded to the optical substrate.
　８．前記光学基板に前記ホログラムシートを熱圧着する前に、前記光学基板の熱圧着される面を表面活性化処理することを特徴とする第１項から第７項までのいずれか一項に記載の光学素子の製造方法。 8. The surface activation treatment is performed on the surface of the optical substrate to be thermocompression bonded before the hologram sheet is thermocompression bonded to the optical substrate. The method according to any one of items 1 to 7, A method for manufacturing an optical element.
　本発明の上記手段により、簡易な方法で、かつ光学特性を低下させずに、ホログラムシートを光学基板に貼合する光学素子の製造方法を提供することができる。 By the above means of the present invention, it is possible to provide an optical element manufacturing method in which a hologram sheet is bonded to an optical substrate by a simple method and without reducing optical characteristics.
　本発明の光学素子の製造方法では、従来の方法のように、光学基板とホログラムシートとの間に、各種接着剤等からなる粘着層を必要としない。したがって、上述したような、粘着層の凹凸に起因したしわや撓みが生じることはなく、波長シフトや回折効率の低下等といった光学特性の低下を防ぐことができる。 In the method for producing an optical element of the present invention, unlike the conventional method, an adhesive layer made of various adhesives or the like is not required between the optical substrate and the hologram sheet. Therefore, wrinkles and deflections due to the unevenness of the adhesive layer as described above do not occur, and a decrease in optical characteristics such as a wavelength shift and a decrease in diffraction efficiency can be prevented.
光学素子の断面を示す模式図Schematic showing the cross section of the optical element 熱圧着装置の概略構成図Schematic configuration diagram of thermocompression bonding equipment 光学基板にホログラムシートを熱圧着する前の、熱圧着治具と光学基板の位置関係を示す模式図Schematic diagram showing the positional relationship between the thermocompression bonding jig and the optical substrate before the hologram sheet is thermocompression bonded to the optical substrate. 光学基板にホログラムシートを熱圧着するときの、熱圧着治具と光学基板の位置関係を示す模式図Schematic diagram showing the positional relationship between the thermocompression bonding jig and the optical substrate when the hologram sheet is thermocompression bonded to the optical substrate. 熱圧着治具の圧着面部の一部と、ホログラムシートの上面部の一部とが当接した状態を示す模式図The schematic diagram which shows the state which a part of crimping | compression-bonding surface part of the thermocompression bonding jig | tool and a part of upper surface part of the hologram sheet contact | abutted 熱圧着治具の圧着面部と、ホログラムシートの上面部とが当接した状態を示す模式図The schematic diagram which shows the state which the crimping | compression-bonding surface part of the thermocompression bonding jig | tool and the upper surface part of the hologram sheet contact | abutted ホログラムシートが貼合された光学基板と、保護部材との接合前の状態を示す斜視図The perspective view which shows the state before joining with the optical board | substrate with which the hologram sheet was bonded, and a protection member 図５Ａにおいて、光学基板の接合面に接着層が形成された状態を示す斜視図5A is a perspective view showing a state in which an adhesive layer is formed on the bonding surface of the optical substrate in FIG. 5A. ホログラムシートが貼合された光学基板と、保護部材とが接合した状態を示す斜視図The perspective view which shows the state which the optical board | substrate with which the hologram sheet was bonded, and the protection member joined. 光学基板と保護部材を異なる材料とした場合の光学素子の断面を示す模式図Schematic showing the cross section of the optical element when the optical substrate and the protective member are made of different materials 従来例の光学素子の断面を示す模式図Schematic diagram showing a cross section of a conventional optical element
　本発明の光学素子の製造方法は、光学基板に、ホログラムシートを熱圧着することによって貼合することを特徴とする。この特徴は、各請求項に係る発明に共通する技術的特徴である。 The method for producing an optical element of the present invention is characterized in that a hologram sheet is bonded to an optical substrate by thermocompression bonding. This feature is a technical feature common to the claimed invention.
　本発明の実施態様としては、ホログラムシートと光学基板の密着性を向上させる観点から、前記光学基板に貼合された前記ホログラムシートの上面から、保護部材によって前記ホログラムシートを覆うことが好ましい。 As an embodiment of the present invention, from the viewpoint of improving the adhesion between the hologram sheet and the optical substrate, it is preferable to cover the hologram sheet with a protective member from the upper surface of the hologram sheet bonded to the optical substrate.
　本発明の実施態様としては、本発明の効果発現の観点から、前記光学基板及び前記保護部材がそれぞれプリズムであり、前記光学基板に貼合された前記ホログラムシートの上面から、前記保護部材によって前記ホログラムシートを覆って前記光学基板に接着することが好ましい。 As an embodiment of the present invention, from the viewpoint of manifesting the effects of the present invention, the optical substrate and the protective member are each a prism, and from the upper surface of the hologram sheet bonded to the optical substrate, the protective member It is preferable to cover the hologram sheet and adhere to the optical substrate.
　本発明の実施態様としては、しわや撓みが生じないように精度よく貼合しやすくする観点から、前記ホログラムシートが熱圧着される前記光学基板の面が、曲面であることが好ましい。 As an embodiment of the present invention, it is preferable that the surface of the optical substrate on which the hologram sheet is thermocompression bonded is a curved surface from the viewpoint of facilitating bonding with accuracy so as not to cause wrinkling or bending.
　本発明の実施態様としては、しわや撓みが生じないように精度よく貼合しやすくする観点から、弾性部材によって形成された圧着面部を有する熱圧着治具によって、前記光学基板に前記ホログラムシートを熱圧着することが好ましい。 As an embodiment of the present invention, the hologram sheet is attached to the optical substrate by a thermocompression-bonding jig having a pressure-bonding surface portion formed of an elastic member from the viewpoint of facilitating accurate bonding so as not to cause wrinkles or bending. It is preferable to perform thermocompression bonding.
　本発明の実施態様としては、前記熱圧着治具は、カッター部を有し、前記熱圧着治具によって前記光学基板に前記ホログラムシートを熱圧着するとともに、前記カッター部により前記ホログラムシートの光学使用範囲よりも外側をカットすることが好ましい。これにより、熱圧着と、光学使用範囲外の不要部分のカットとを同一工程で行うことができ、製造工程を削減できる。 As an embodiment of the present invention, the thermocompression bonding jig has a cutter part, and the hologram sheet is thermocompression bonded to the optical substrate by the thermocompression bonding jig, and the hologram sheet is optically used by the cutter part. It is preferable to cut outside the range. Thereby, thermocompression bonding and cutting of unnecessary portions outside the optical use range can be performed in the same process, and the manufacturing process can be reduced.
　本発明の実施態様としては、前記ホログラムシートが貼合される前記光学基板の面と、前記熱圧着治具の圧着面が異なる曲率であり、前記熱圧着治具の前記圧着面部の一部を、前記光学基板上に配置した前記ホログラムシートの一部に当接させた後、前記熱圧着治具の前記圧着面部を前記ホログラムシートの外周に向かって当接させ、前記光学基板に前記ホログラムシートを熱圧着することが好ましい。これにより、ホログラムシートにしわや撓みが生じることを防止し、ホログラムシートと光学基板との間に気泡が存在していた場合には、当該気泡を外部に排出することができる。 As an embodiment of the present invention, the surface of the optical substrate to which the hologram sheet is bonded and the pressure bonding surface of the thermocompression bonding jig have different curvatures, and a part of the pressure bonding surface portion of the thermocompression bonding jig is Then, after contacting a part of the hologram sheet disposed on the optical substrate, the pressure-bonding surface portion of the thermocompression bonding jig is contacted toward the outer periphery of the hologram sheet, and the hologram sheet is placed on the optical substrate. Is preferably thermocompression-bonded. Thereby, it is possible to prevent the hologram sheet from being wrinkled or bent, and when bubbles are present between the hologram sheet and the optical substrate, the bubbles can be discharged to the outside.
　本発明の実施態様としては、熱圧着による貼合を、より低い温度及び圧力の条件で行うことで、ホログラムシートへのダメージを抑える観点から、前記光学基板に前記ホログラムシートを熱圧着する前に、前記光学基板の熱圧着される面を表面活性化処理することが好ましい。 As an embodiment of the present invention, from the viewpoint of suppressing damage to the hologram sheet by performing bonding by thermocompression bonding under lower temperature and pressure conditions, before thermocompression bonding the hologram sheet to the optical substrate. The surface of the optical substrate to be thermocompression bonded is preferably surface activated.
　以下、本発明とその構成要素及び本発明を実施するための形態について詳細な説明をする。なお、本願において、「～」は、その前後に記載される数値を下限値及び上限値として含む意味で使用する。 Hereinafter, the present invention, its components, and modes for carrying out the present invention will be described in detail. In the present application, “˜” is used to mean that the numerical values described before and after it are included as a lower limit value and an upper limit value.
［光学素子］
　光学素子の好ましい実施形態の一例の概略構成について、図１を用いて説明する。
　光学素子１は、ホログラムシート１０、光学基板２０及び保護部材３０等を備え、ホログラムシート１０が光学基板２０と保護部材３０に挟まれて形成されている。
　ホログラムシート１０が貼合される光学基板２０の面は、波長オーダーの面精度を持つ鏡面（光学面）である。
　光学素子１は、熱圧着によって、ホログラムシート１０が、光学基板２０に直接貼合されている。また、ホログラムシート１０と光学基板２０との密着性を向上させる観点から、光学基板２０に貼合されたホログラムシート１０の上面から、ホログラムシート１０を覆うように、接着層１３によって、保護部材３０を光学基板２０に接着した構成とすることが好ましい。
　なお、光学基板２０に貼合されたホログラムシート１０が充分な密着力を有していれば、使用形態によっては必ずしも保護部材３０を設ける必要はない。 [Optical element]
A schematic configuration of an example of a preferred embodiment of the optical element will be described with reference to FIG.
The optical element 1 includes a hologram sheet 10, an optical substrate 20, a protection member 30, and the like, and the hologram sheet 10 is formed between the optical substrate 20 and the protection member 30.
The surface of the optical substrate 20 to which the hologram sheet 10 is bonded is a mirror surface (optical surface) having surface accuracy on the order of wavelengths.
In the optical element 1, the hologram sheet 10 is directly bonded to the optical substrate 20 by thermocompression bonding. Further, from the viewpoint of improving the adhesion between the hologram sheet 10 and the optical substrate 20, the protective member 30 is covered by the adhesive layer 13 so as to cover the hologram sheet 10 from the upper surface of the hologram sheet 10 bonded to the optical substrate 20. Is preferably bonded to the optical substrate 20.
In addition, as long as the hologram sheet 10 bonded to the optical substrate 20 has sufficient adhesion, it is not always necessary to provide the protective member 30 depending on the usage form.
　本発明の光学素子１は、後述する光学素子１の製造方法で説明するように、熱圧着でホログラムシート１０を光学基板２０に直接貼合しているため、図７に示す従来例の光学素子のように各種接着剤等からなる粘着層１４が必要ではない。そのため、粘着層の凹凸に起因したしわや撓みが生じることはなく、光学基板２０の面形状に沿ってホログラムシート１０の形状を維持することができ、波長シフト、回折効率の低下、回折方向のシフト等といった光学特性の低下を防ぐことができる。 Since the optical element 1 of the present invention directly bonds the hologram sheet 10 to the optical substrate 20 by thermocompression bonding, as will be described in the optical element 1 manufacturing method described later, the optical element of the conventional example shown in FIG. Thus, the pressure-sensitive adhesive layer 14 made of various adhesives or the like is not necessary. Therefore, wrinkles and deflections due to the unevenness of the adhesive layer do not occur, the shape of the hologram sheet 10 can be maintained along the surface shape of the optical substrate 20, and the wavelength shift, the reduction in diffraction efficiency, and the diffraction direction can be maintained. It is possible to prevent deterioration of optical characteristics such as shift.
　ホログラムシート１０は、少なくともホログラム層１１を有し、さらに、保護層１２を有する構成とすることが好ましい。 The hologram sheet 10 preferably has at least a hologram layer 11 and further has a protective layer 12.
　ホログラム層１１は、ホログラム感光性組成物、色素組成物、発熱吸熱組成物等の化学組成物及びバインダー等を含む感光層に対して、レーザ露光、紫外線照射、ベイク処理等によってホログラムを記録した層である。ホログラムが記録される前の感光層は、ゲル状で粘着性があるが、ホログラムが記録されたホログラム層１１は、ほとんど粘着性を有しない。 The hologram layer 11 is a layer in which a hologram is recorded by laser exposure, ultraviolet irradiation, baking treatment, or the like on a photosensitive layer containing a chemical composition such as a hologram photosensitive composition, a dye composition, an exothermic endothermic composition, and a binder. It is. The photosensitive layer before the hologram is recorded is gel-like and adhesive, but the hologram layer 11 on which the hologram is recorded has almost no adhesiveness.
　ホログラム感光性組成物としては、例えば、感光性ハロゲン化銀、非感光性有機銀塩、光重合剤及び還元剤等を含むものからなることが好ましい。 The hologram photosensitive composition is preferably composed of, for example, a photosensitive silver halide, a non-photosensitive organic silver salt, a photopolymerizing agent, a reducing agent and the like.
　バインダーとしては、例えば、天然ポリマー、合成ポリマー及びコポリマー、その他シートを形成する媒体等が挙げられる。具体例としては、例えば、ゼラチン、アラビアゴム、ポリビニルアルコール、ヒドロキシエチルセルロース、セルロースアセテートブチレート、ポリビニルピロリドン、カゼイン、デンプン、ポリアクリル酸、ポリメチルメタクリレート、ポリメタクリ酸、ポリ塩化ビニル、コポリ（スチレン－無水マレイン酸）、コポリ（スチレン－アクリロニトリル）、コポリ（スチレン－ブタジエン）、ポリビニルアセタール類、ポリビニルホルマール、ポリビニルブチラール、ポリエステル類、ポリウレタン類、フェノキシ樹脂、ポリ塩化ビニリデン、ポリエポキシド類、ポリカーポネート類、ポリビニルアセテート類、セルロースエステル類、ポリアミド等が挙げられ、親水性でも非親水性でも良い。これらは、溶解する溶媒とともに溶液として用いても良いし、ラテックスのような水分散物の形状で用いても良い。
　ホログラム層１１の厚さは、特に限定されないが、約５～１００μｍの範囲内であることが好ましい。 Examples of the binder include natural polymers, synthetic polymers and copolymers, and other media for forming sheets. Specific examples include, for example, gelatin, gum arabic, polyvinyl alcohol, hydroxyethyl cellulose, cellulose acetate butyrate, polyvinyl pyrrolidone, casein, starch, polyacrylic acid, polymethyl methacrylate, polymethacrylic acid, polyvinyl chloride, copoly (styrene-anhydrous Maleic acid), copoly (styrene-acrylonitrile), copoly (styrene-butadiene), polyvinyl acetals, polyvinyl formal, polyvinyl butyral, polyesters, polyurethanes, phenoxy resins, polyvinylidene chloride, polyepoxides, polycarbonates, polyvinyl Examples include acetates, cellulose esters, polyamides, and the like, which may be hydrophilic or non-hydrophilic. These may be used as a solution together with a solvent to be dissolved, or may be used in the form of an aqueous dispersion such as latex.
The thickness of the hologram layer 11 is not particularly limited, but is preferably in the range of about 5 to 100 μm.
　保護層１２は、例えば、プラスチック、ガラス、金属等が挙げられる。これらの中でも、ロール状や平坦状にすることのできる可撓性を有し、ホログラムシート１０に損傷を与えにくい強度を有するプラスチックが好ましい。
　金属としては、例えば、アルミニウムやステンレス等が挙げられる。プラスチックとしては、例えば、ポリエステル、ポリスチレン、ポリカーボネート、ポリエーテルスルホン、ポリイミド、ポリシクロペンタジエン、ポリノルボルネン、ナイロン、セルロースアセテート等が挙げられる。ポリエステルとしては、例えば、ポリエチレンテレフタレート、ポリエチレンナフタレート等が挙げられる。 Examples of the protective layer 12 include plastic, glass, and metal. Among these, the plastic which has the flexibility which can be made into roll shape and flat shape, and the intensity | strength which does not damage the hologram sheet 10 is preferable.
Examples of the metal include aluminum and stainless steel. Examples of the plastic include polyester, polystyrene, polycarbonate, polyethersulfone, polyimide, polycyclopentadiene, polynorbornene, nylon, and cellulose acetate. Examples of the polyester include polyethylene terephthalate and polyethylene naphthalate.
　光学基板２０と保護部材３０は、透明なガラス又は透明な樹脂からなるプリズムであることが好ましい。また、光学基板２０と保護部材３０は、それぞれ異なる材料によって形成されていても良いが、光学素子１をシースルータイプの表示素子として用いる場合には、屈折率の等しい材料で形成することが好ましい。異なる材料とする場合の実施形態の例としては、例えば、光学基板２０を透明なガラス板とし、保護部材３０を透明な樹脂フィルムとする例が挙げられる（図６）。
　また、光学素子１をシースルータイプの表示素子ではなく、保護部材３０側が光学特性を必要としない実施形態で用いる場合には、保護部材３０の材料は、実施形態に応じて適宜選択可能であり、光学基板２０の屈折率と異なるものであってもよい。 The optical substrate 20 and the protection member 30 are preferably prisms made of transparent glass or transparent resin. The optical substrate 20 and the protection member 30 may be formed of different materials, but when the optical element 1 is used as a see-through type display element, it is preferable that the optical substrate 20 and the protection member 30 are formed of a material having the same refractive index. As an example of an embodiment in the case of using different materials, for example, an example in which the optical substrate 20 is a transparent glass plate and the protective member 30 is a transparent resin film can be given (FIG. 6).
In addition, when the optical element 1 is not a see-through display element and is used in an embodiment in which the protective member 30 side does not require optical characteristics, the material of the protective member 30 can be appropriately selected according to the embodiment. It may be different from the refractive index of the optical substrate 20.
　光学基板２０に保護部材３０を接着するための接着層１３としては、光学基板２０と同じ屈折率の接着剤を使用することが好ましく、紫外線硬化型の接着剤や熱硬化型の接着剤等の各種接着剤を用いることができる。これらの中でも、塗布工程時の制約が少なく、低温でも硬化可能な紫外線硬化型の接着剤が好ましく用いられる。 As the adhesive layer 13 for adhering the protective member 30 to the optical substrate 20, it is preferable to use an adhesive having the same refractive index as that of the optical substrate 20, such as an ultraviolet curable adhesive or a thermosetting adhesive. Various adhesives can be used. Among these, an ultraviolet curable adhesive that can be cured at a low temperature with few restrictions during the coating process is preferably used.
　図１及び図７には、光学基板２０と保護部材３０とをそれぞれプリズムとした場合に、光学基板２０側から再生光Ｌ１をホログラムシート１０に照射した際の回折光Ｌ２と、保護部材３０側からホログラムシート１０を通過する外光Ｌ３を示している。なお、再生光Ｌ１の波長領域はそれぞれの用途に応じて任意であり、可視光領域でもよく、紫外光領域でもよく、赤外光領域でもよい。 In FIGS. 1 and 7, when the optical substrate 20 and the protection member 30 are respectively prisms, the diffracted light L2 when the reproduction light L1 is applied to the hologram sheet 10 from the optical substrate 20 side, and the protection member 30 side. The external light L3 that passes through the hologram sheet 10 is shown. The wavelength region of the reproduction light L1 is arbitrary depending on each application, and may be a visible light region, an ultraviolet light region, or an infrared light region.
［光学素子の製造方法］
　光学素子１の製造方法は、光学基板２０に、ホログラムシート１０を熱圧着することによって貼合することを特徴とする。熱によってホログラムシート１０が軟化し、加えられた圧力によって、軟化したホログラムシート１０が光学基板２０に隙間なく密着されるため、オプティカルコンタクトと同様の状態となり、熱圧着のみで光学基板２０にホログラムシート１０を貼合できたものと考えられる。
　また、本発明に係る熱圧着による貼合方法は、光学基板２０とホログラムシート１０との間に、各種接着剤等からなる粘着層を必要としない。したがって、粘着層の凹凸に起因したしわや撓みが生じることはなく、光学基板の面形状と同じ形状を維持した状態でホログラムシート１０が貼合されるため、波長シフト、回折効率の低下、回折方向のシフト等といった光学特性の低下を防ぐことができる。
　なお、以下の説明では、前記光学基板２０及び前記保護部材３０がそれぞれプリズムである場合を例として、光学素子１の製造方法を説明する。 [Method for Manufacturing Optical Element]
The manufacturing method of the optical element 1 is characterized in that the hologram sheet 10 is bonded to the optical substrate 20 by thermocompression bonding. The hologram sheet 10 is softened by heat, and the softened hologram sheet 10 is brought into close contact with the optical substrate 20 without a gap by the applied pressure. Therefore, the state is similar to the optical contact, and the hologram sheet is applied to the optical substrate 20 only by thermocompression bonding. It is thought that 10 could be pasted.
Moreover, the bonding method by thermocompression bonding according to the present invention does not require an adhesive layer made of various adhesives between the optical substrate 20 and the hologram sheet 10. Therefore, wrinkles and deflections due to the unevenness of the adhesive layer do not occur, and the hologram sheet 10 is bonded while maintaining the same shape as the surface shape of the optical substrate. Therefore, the wavelength shift, the reduction in diffraction efficiency, the diffraction It is possible to prevent a decrease in optical characteristics such as a direction shift.
In the following description, a method for manufacturing the optical element 1 will be described by taking as an example the case where the optical substrate 20 and the protective member 30 are prisms.
＜光学基板の表面活性化処理＞
　熱圧着前の光学基板２０には、本発明の効果を損なわない範囲で、オゾン処理、コロナ放電処理、グロー放電処理、火炎処理、紫外線照射処理、電子線照射処理等の表面活性化処理を施してもよい。これにより、熱圧着において、温度と圧力を下げたり、熱圧着時間を短くすることができるため、熱圧着によるホログラムシート１０へのダメージを抑えることができる。 <Optical substrate surface activation treatment>
The optical substrate 20 before thermocompression bonding is subjected to surface activation treatment such as ozone treatment, corona discharge treatment, glow discharge treatment, flame treatment, ultraviolet irradiation treatment, electron beam irradiation treatment and the like within a range not impairing the effects of the present invention. May be. Thereby, in thermocompression bonding, since the temperature and pressure can be lowered and the thermocompression bonding time can be shortened, damage to the hologram sheet 10 due to thermocompression bonding can be suppressed.
＜熱圧着装置＞
　本発明に係る熱圧着は、従来公知の熱圧着装置４０によって、光学基板２０上に配置したホログラムシート１０に、熱及び圧力を同時に加えることによって行うことができる。
　熱圧着装置４０としては、例えば、受け台４１、熱圧着治具４２、電熱部４３及びエアシリンダー４４等を備えたものを用いることができる（図２）。 <Thermocompression bonding equipment>
The thermocompression bonding according to the present invention can be performed by simultaneously applying heat and pressure to the hologram sheet 10 disposed on the optical substrate 20 by a conventionally known thermocompression bonding apparatus 40.
As the thermocompression bonding apparatus 40, for example, an apparatus including a cradle 41, a thermocompression bonding jig 42, an electric heating unit 43, an air cylinder 44, and the like can be used (FIG. 2).
　受け台４１は、光学基板２０を固定するための台であり、光学基板２０の形状に応じて適宜付け替えられるものである。 The cradle 41 is a pedestal for fixing the optical substrate 20 and can be appropriately changed according to the shape of the optical substrate 20.
　熱圧着治具４２は、ホログラムシート１０に当接して熱圧着を行う圧着面を有している。熱圧着治具４２に用いられる材料としては、耐熱性及び熱伝導性を有していれば特に限られないが、例えば、ステンレス鋼、アルミニウム、銅等の金属を用いることができる。
　また、熱圧着治具４２には、弾性部材によって形成された圧着面部４２１と、ホログラムシート１０を切断するためのカッター部４２２備えることが好ましい。圧着面部４２１に用いられる弾性部材としては、耐熱性及び熱伝導性に優れた弾性体であれば特に限られないが、例えば、耐熱シリコーンゴム等を用いることができる。カッター部４２２としては、適宜公知のカッターを使用可能であるが、ホログラムシート１０をカットでき、かつ光学基板２０を傷つけない厚さ（例えば、ホログラムシート１０の厚さより０～３０μｍ程度大きい）を有するカッターを用いることが好ましい。 The thermocompression bonding jig 42 has a pressure bonding surface that contacts the hologram sheet 10 and performs thermocompression bonding. The material used for the thermocompression bonding jig 42 is not particularly limited as long as it has heat resistance and heat conductivity. For example, metals such as stainless steel, aluminum, and copper can be used.
Moreover, it is preferable that the thermocompression bonding jig 42 includes a crimping surface portion 421 formed of an elastic member and a cutter portion 422 for cutting the hologram sheet 10. The elastic member used for the pressure-bonding surface portion 421 is not particularly limited as long as it is an elastic body excellent in heat resistance and thermal conductivity. For example, heat-resistant silicone rubber or the like can be used. As the cutter unit 422, a known cutter can be used as appropriate, but has a thickness that can cut the hologram sheet 10 and does not damage the optical substrate 20 (for example, about 0 to 30 μm larger than the thickness of the hologram sheet 10). It is preferable to use a cutter.
　電熱部４３は、図示しない電源に接続されてヒーターを形成している。そして、電熱部４３が熱くなることで、熱圧着治具４２に熱を伝えることができる。 The electric heating unit 43 is connected to a power source (not shown) to form a heater. The heat can be transferred to the thermocompression bonding jig 42 by heating the electrothermal portion 43.
　エアシリンダー４４は、エアシリンダー４４内の圧縮空気のエネルギーによって、熱圧着治具４２等を有するブロックを上下に昇降することができる。エアシリンダー４４は、例えば、エアシリンダー４４の内部に空気を入れるための第１供給口４５ａ及び第２供給口４５ｂを有しており、第１供給口４５ａから空気を入れると下降し、第２供給口４５ｂから空気を入れると上昇するように構成されている。 The air cylinder 44 can move up and down the block having the thermocompression bonding jig 42 and the like by the energy of the compressed air in the air cylinder 44. The air cylinder 44 has, for example, a first supply port 45a and a second supply port 45b for introducing air into the air cylinder 44, and descends when air is introduced from the first supply port 45a. It is configured to rise when air is introduced from the supply port 45b.
　また、受け台４１に固定する光学基板２０は、ホログラムシート１０が熱圧着される側の面が、曲面であることが好ましい。これにより、ホログラムシート１０の光学パワーを基板表面の形状に持たせることができるため、ホログラムシート１０の負担が減り、良好な光学性能を得ることができる。また、熱圧着治具４２をホログラムシート１０に当接させる際に、ホログラムシート１０にしわや撓みを生じにくくすることができる。また、同様にホログラムシート１０にしわや撓みが生じにくくする観点から、ホログラムシート１０が貼合される光学基板２０の面と、熱圧着治具４２の圧着面が異なる曲率であることが好ましい（図４Ａ及び図４Ｂ参照）。 Further, in the optical substrate 20 fixed to the cradle 41, the surface on the side on which the hologram sheet 10 is thermocompression bonded is preferably a curved surface. Thereby, since the optical power of the hologram sheet 10 can be given to the shape of the substrate surface, the burden on the hologram sheet 10 is reduced, and good optical performance can be obtained. Further, when the thermocompression bonding jig 42 is brought into contact with the hologram sheet 10, the hologram sheet 10 can be made less likely to be wrinkled or bent. Similarly, from the viewpoint of making the hologram sheet 10 less likely to be wrinkled or bent, it is preferable that the surface of the optical substrate 20 to which the hologram sheet 10 is bonded and the pressure bonding surface of the thermocompression bonding jig 42 have different curvatures ( 4A and 4B).
＜熱圧着する工程＞
　次に、熱圧着治具４２によって、光学基板２０にホログラムシート１０を熱圧着する工程について説明する（図３Ａ及び図３Ｂ）。なお、図３Ａ及び図３Ｂには、熱圧着に使用する熱圧着装置４０の要部のみを示している。 <The process of thermocompression bonding>
Next, a process of thermocompression bonding the hologram sheet 10 to the optical substrate 20 using the thermocompression bonding jig 42 will be described (FIGS. 3A and 3B). 3A and 3B show only the main part of the thermocompression bonding apparatus 40 used for thermocompression bonding.
　まず、受け台４１に固定された光学基板２０上に、ホログラム層１１を光学基板２０側にして、ホログラムシート１０を所定の位置に位置合わせして配置する（図３Ａ）。
　次に、電熱部４３により所定の温度に温められた熱圧着治具４２を、ホログラムシート１０及び光学基板２０に向かって徐々に下降させて当接させた後、ホログラムシート１０の上から熱及び圧力を同時に加えて熱圧着する（図３Ｂ）。
　熱圧着は、ホログラムシート１０の組成等に応じて、所定の温度（例えば、６０～１１０℃の範囲内）、所定の圧力（例えば、０．１～０．６ＭＰａ）、及び所定の時間（例えば、５～６０秒）によって行う。好ましくは、９０～１１０℃の範囲内の温度、０．３～０．６ＭＰａの範囲内の圧力で熱圧着をするとよい。その後、熱圧着治具４２を上昇させることで、熱圧着する工程が完了する。 First, on the optical substrate 20 fixed to the cradle 41, the hologram layer 11 is disposed on the optical substrate 20 side so that the hologram sheet 10 is aligned at a predetermined position (FIG. 3A).
Next, the thermocompression bonding jig 42 heated to a predetermined temperature by the electric heating unit 43 is gradually lowered toward the hologram sheet 10 and the optical substrate 20 and brought into contact therewith. Pressure is applied simultaneously and thermocompression bonding is performed (FIG. 3B).
The thermocompression bonding is performed according to the composition of the hologram sheet 10 at a predetermined temperature (for example, within a range of 60 to 110 ° C.), a predetermined pressure (for example, 0.1 to 0.6 MPa), and a predetermined time (for example, 5 to 60 seconds). Preferably, thermocompression bonding is performed at a temperature in the range of 90 to 110 ° C. and a pressure in the range of 0.3 to 0.6 MPa. Then, the process of thermocompression bonding is completed by raising the thermocompression bonding jig 42.
　また、光学基板２０にホログラムシート１０を熱圧着するときに、熱圧着治具４２のカッター部４２２がホログラムシート１０内部に入りこむため、カッター部４２２によりホログラムシート１０の光学使用範囲よりも外側の不要部分をカットすることができる。
　なお、本明細書でいう「光学使用範囲」とは、光学素子１として使用する際に、再生光Ｌ１を照射する領域のことを意味する。 Further, when the hologram sheet 10 is thermocompression bonded to the optical substrate 20, the cutter portion 422 of the thermocompression bonding jig 42 enters the inside of the hologram sheet 10, so that the cutter portion 422 is unnecessary outside the optical usage range of the hologram sheet 10. The part can be cut.
Note that the “optical use range” in this specification means a region to which the reproduction light L1 is irradiated when used as the optical element 1.
＜熱圧着治具のホログラムシートへの当接＞
　次に、上述した熱圧着治具４２の圧着面部４２１をホログラムシート１０に当接させるときの圧着面付近の様子について、圧着面付近を拡大した図である図４Ａ及び図４Ｂを用いて説明する。
　図４Ａ及び図４Ｂは、ホログラムシート１０が貼合される光学基板２０の面と、熱圧着治具４２の圧着面が異なる曲率である場合であって、最初に中央部が当接する場合の例である。また、図４Ａ及び図４Ｂでは、説明の便宜のため、カッター部４２２については省略して記載している。 <Contact of the thermocompression jig to the hologram sheet>
Next, the state in the vicinity of the pressure-bonding surface when the pressure-bonding surface portion 421 of the thermocompression bonding jig 42 is brought into contact with the hologram sheet 10 will be described with reference to FIGS. 4A and 4B which are enlarged views of the vicinity of the pressure-bonding surface. .
FIGS. 4A and 4B are examples in which the surface of the optical substrate 20 to which the hologram sheet 10 is bonded and the crimping surface of the thermocompression bonding jig 42 have different curvatures, and the central portion first comes into contact. It is. 4A and 4B, the cutter unit 422 is omitted for convenience of explanation.
　まず、熱圧着治具４２を光学基板２０に向かって下降させることによって、熱圧着治具４２の圧着面部４２１の一部を、光学基板２０上のホログラムシート１０の一部に当接させる。ここで、ホログラムシート１０が貼合される光学基板２０の面と、熱圧着治具４２の圧着面が異なる曲率であるため、それぞれの一部が当接する（図４Ａ）。
　次に、熱圧着治具４２の圧着面部４２１をホログラムシート１０の外周に向かって当接させ、圧着面部４２１とホログラムシート１０の上面部とを当接させる（図４Ｂ）。そして、この状態で上述したような条件で熱圧着する。ここで、圧着面部４２１が弾性部材であるため、圧着面部４２１の一部がホログラムシート１０の一部に当接した状態から、徐々に圧着面部４２１とホログラムシート１０の上面部の全てとが当接した状態とすることができる。これにより、ホログラムシート１０にしわや撓みが生じることを防止し、ホログラムシートと光学基板との間に気泡が存在していた場合には、当該気泡を外部に排出することができる。 First, by lowering the thermocompression bonding jig 42 toward the optical substrate 20, a part of the crimping surface portion 421 of the thermocompression bonding jig 42 is brought into contact with a part of the hologram sheet 10 on the optical substrate 20. Here, since the curvature of the surface of the optical substrate 20 to which the hologram sheet 10 is bonded and the pressure bonding surface of the thermocompression bonding jig 42 are different, a part of each comes into contact (FIG. 4A).
Next, the crimping surface portion 421 of the thermocompression bonding jig 42 is brought into contact with the outer periphery of the hologram sheet 10, and the crimping surface portion 421 and the upper surface portion of the hologram sheet 10 are brought into contact with each other (FIG. 4B). In this state, thermocompression bonding is performed under the conditions described above. Here, since the pressure-bonding surface portion 421 is an elastic member, the pressure-bonding surface portion 421 and all the upper surface portions of the hologram sheet 10 are gradually brought into contact with each other from a state where a portion of the pressure-bonding surface portion 421 is in contact with a part of the hologram sheet 10. It can be in contact. Thereby, it is possible to prevent the hologram sheet 10 from being wrinkled or bent, and when bubbles exist between the hologram sheet and the optical substrate, the bubbles can be discharged to the outside.
　なお、図４Ａでは、圧着面部４２１の一部とホログラムシート１０の一部とが当接する際に、それぞれの中央部が当接した図を示しているが、これに限られない。例えば、図４Ａの圧着面部４２１とホログラムシート１０とそれぞれの右端付近でまず当接させ、左端に向かって徐々に当接するような構成としても良い。また、本発明の効果が得られる範囲内であれば、光学基板２０と、圧着面部４２１の圧着面の曲率は適宜変更可能である。 In FIG. 4A, a diagram is shown in which a center portion of each of the crimping surface portion 421 and a portion of the hologram sheet 10 abuts when the abutment portion 421 abuts, but the present invention is not limited to this. For example, a configuration may be adopted in which the pressure-bonding surface portion 421 and the hologram sheet 10 in FIG. 4A are first brought into contact with each other in the vicinity of the right end and gradually contacted toward the left end. Further, the curvatures of the optical substrate 20 and the pressure-bonding surface of the pressure-bonding surface portion 421 can be appropriately changed as long as the effects of the present invention are obtained.
＜ホログラムシートが貼合された光学基板と保護部材との接合＞
　次に、ホログラムシート１０が貼合された光学基板２０と、保護部材３０とを接合する工程について図５Ａ～図５Ｃを用いて説明する。 <Join between optical substrate and hologram protective member bonded>
Next, a process of bonding the optical substrate 20 to which the hologram sheet 10 is bonded and the protection member 30 will be described with reference to FIGS. 5A to 5C.
　ホログラムシート１０が貼合された光学基板２０と、保護部材３０との接合前の状態が図５Ａである。まず、光学基板２０に貼合されたホログラムシート１０の上面から、ホログラムシート１０及び光学基板２０に接着剤（例えば、紫外線硬化型の接着剤）を塗布し、接着層１３を形成する（図５Ｂ）。そして、ホログラムシート１０を覆うようにして、光学基板２０に貼合されたホログラムシート１０の上面から、保護部材３０によってホログラムシート１０を覆って光学基板２０に接着する（図５Ｃ）。最後に、接着剤を硬化する（紫外線硬化型の接着剤であれば、紫外線照射する）ことによって接合工程を完了する。
　これにより、保護部材３０によって、ホログラムシート１０の上面から光学基板２０に押し付けることができるため、ホログラムシート１０と光学基板２０の密着性を向上させることができる。したがって、熱圧着時の温度や圧力の条件を下げて大きな密着力を得られなかった場合等に有用である。 FIG. 5A shows a state before the optical substrate 20 to which the hologram sheet 10 is bonded and the protective member 30 are joined. First, an adhesive (for example, an ultraviolet curable adhesive) is applied to the hologram sheet 10 and the optical substrate 20 from the upper surface of the hologram sheet 10 bonded to the optical substrate 20 to form the adhesive layer 13 (FIG. 5B). ). Then, the hologram sheet 10 is covered with the protective member 30 and bonded to the optical substrate 20 from the upper surface of the hologram sheet 10 bonded to the optical substrate 20 so as to cover the hologram sheet 10 (FIG. 5C). Finally, the bonding step is completed by curing the adhesive (in the case of an ultraviolet curable adhesive, irradiation with ultraviolet rays).
Thereby, since it can press against the optical substrate 20 from the upper surface of the hologram sheet 10 by the protective member 30, the adhesiveness of the hologram sheet 10 and the optical substrate 20 can be improved. Therefore, it is useful when the temperature and pressure conditions during thermocompression bonding are lowered and a large adhesion force cannot be obtained.
　また、保護部材３０の光学基板２０への接着は、光学基板２０との界面には影響を与えるものではないため、ホログラムシート１０と光学基板２０の密着性を向上させることができれば、必ずしも高精度に位置合わせを行う必要はない。 Further, since the adhesion of the protective member 30 to the optical substrate 20 does not affect the interface with the optical substrate 20, if the adhesion between the hologram sheet 10 and the optical substrate 20 can be improved, the accuracy is not necessarily high. There is no need to perform alignment.
　なお、熱圧着によってホログラムシート１０と光学基板２０が充分な密着力を有していれば、使用形態によっては必ずしも保護部材３０を設けなくともよい。 In addition, as long as the hologram sheet 10 and the optical substrate 20 have sufficient adhesive force by thermocompression bonding, the protection member 30 may not necessarily be provided depending on the usage form.
［光学素子の用途］
　本実施形態のホログラムシート１０を有する光学素子１は、例えば、ヘッドマウントディスプレイ（ＨＭＤ）、ヘッドアップディスプレイ（ＨＵＤ）、光メモリ、光ディスク用ピックアップレンズ、液晶用カラーフィルター、反射型液晶反射板、レンズ、回折格子、光学フィルター、光ファイバー用結合器、光偏光器等に好適に用いられる。
　また、光学部品として用いるだけでなく、建築用窓ガラス、書籍、雑誌等の表紙、ＰＯＰなどのディスプレイ、ギフト、偽造防止用のセキュリティ目的としたクレジットカード、紙幣、包装等に用いても良い。 [Applications of optical elements]
The optical element 1 having the hologram sheet 10 of the present embodiment includes, for example, a head mounted display (HMD), a head up display (HUD), an optical memory, an optical disk pickup lens, a liquid crystal color filter, a reflective liquid crystal reflector, a lens, It is suitably used for diffraction gratings, optical filters, optical fiber couplers, optical polarizers, and the like.
In addition to being used as an optical component, it may be used for architectural window glass, covers such as books and magazines, displays such as POPs, gifts, credit cards, banknotes, and packaging for security purposes for preventing counterfeiting.
［その他］
　本発明の今回開示された実施の形態は、全ての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記した詳細な説明に限定されるものではなく特許請求の範囲によって示され、特許請求の範囲と均等の意味及び範囲内での全ての変更が含まれることが意図される。 [Others]
It should be thought that embodiment disclosed this time of this invention is an illustration and restrictive at no points. The scope of the present invention is not limited to the above detailed description, but is defined by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims. .
　例えば、本実施形態のホログラムシート１０は、保護層１２を有する構成としたが、紫外線吸収層等、他の層を有していてもよい。
　紫外線吸収層は、ホログラム層１１への紫外線をカットするために用いられる。紫外線吸収層としては、必要な強度及び耐久性を有するものであれば、従来公知の材料を使用することができる。 For example, although the hologram sheet 10 of the present embodiment is configured to have the protective layer 12, it may have other layers such as an ultraviolet absorbing layer.
The ultraviolet absorbing layer is used to cut ultraviolet rays to the hologram layer 11. As the ultraviolet absorbing layer, conventionally known materials can be used as long as they have necessary strength and durability.
　本発明の光学素子の製造方法は、簡易な方法で、かつ光学特性を低下させずに、ホログラムシートを光学基板に貼合することができるので、ヘッドマウントディスプレイ（ＨＭＤ）、ヘッドアップディスプレイ（ＨＵＤ）、光メモリ、光ディスク用ピックアップレンズ、液晶用カラーフィルター、反射型液晶反射板、レンズ、回折格子、光学フィルター、光ファイバー用結合器、光偏光器等の製造に好適に用いることができる。また、光学部品として用いるだけでなく、建築用窓ガラス、書籍、雑誌等の表紙、ＰＯＰなどのディスプレイ、ギフト、偽造防止用のセキュリティ目的としたクレジットカード、紙幣、包装等の製造にも好適に用いることができる。 The optical element manufacturing method of the present invention is a simple method and can be used to bond a hologram sheet to an optical substrate without degrading optical characteristics. Therefore, a head mounted display (HMD), a head up display (HUD) ), An optical memory, an optical disk pickup lens, a liquid crystal color filter, a reflective liquid crystal reflector, a lens, a diffraction grating, an optical filter, an optical fiber coupler, an optical polarizer, and the like. In addition to being used as an optical component, it is also suitable for manufacturing architectural window glass, covers for books, magazines, displays such as POPs, gifts, credit cards, banknotes, packaging, etc. for security purposes to prevent counterfeiting Can be used.
１　　　光学素子
１０　　ホログラムシート
１１　　ホログラム層
１２　　保護層
２０　　光学基板
３０　　保護部材
４０　　熱圧着装置
４１　　受け台
４２　　熱圧着治具
４２１　圧着面部
４２２　カッター部
４３　　電熱部
４４　　エアシリンダー
４５ａ　第１供給口
４５ｂ　第２供給口
Ｌ１　　再生光
Ｌ２　　回折光
Ｌ３　　外光 DESCRIPTION OF SYMBOLS 1 Optical element 10 Hologram sheet 11 Hologram layer 12 Protective layer 20 Optical substrate 30 Protective member 40 Thermocompression bonding apparatus 41 Receptacle 42 Thermocompression bonding jig 421 Crimp surface part 422 Cutter part 43 Electric heating part 44 Air cylinder 45a 1st supply port 45b 2nd Supply port L1 Reproduced light L2 Diffracted light L3 Outside light

Claims (8)

  1. 　光学基板に、ホログラムシートを熱圧着することによって貼合することを特徴とする光学素子の製造方法。 An optical element manufacturing method, wherein a hologram sheet is bonded to an optical substrate by thermocompression bonding.
  2. 　前記光学基板に貼合された前記ホログラムシートの上面から、保護部材によって前記ホログラムシートを覆うことを特徴とする請求項１に記載の光学素子の製造方法。 The method for manufacturing an optical element according to claim 1, wherein the hologram sheet is covered with a protective member from an upper surface of the hologram sheet bonded to the optical substrate.
  3. 　前記光学基板及び前記保護部材がそれぞれプリズムであり、
    　前記光学基板に貼合された前記ホログラムシートの上面から、前記保護部材によって前記ホログラムシートを覆って前記光学基板に接着することを特徴とする請求項２に記載の光学素子の製造方法。     The optical substrate and the protection member are each prisms,
    3. The method of manufacturing an optical element according to claim 2, wherein the hologram sheet is covered with the protective member and bonded to the optical substrate from the upper surface of the hologram sheet bonded to the optical substrate.
  4. 　前記ホログラムシートが熱圧着される前記光学基板の面が、曲面であることを特徴とする請求項１から請求項３までのいずれか一項に記載の光学素子の製造方法。 The method of manufacturing an optical element according to any one of claims 1 to 3, wherein a surface of the optical substrate to which the hologram sheet is thermocompression bonded is a curved surface.
  5. 　弾性部材によって形成された圧着面部を有する熱圧着治具によって、前記光学基板に前記ホログラムシートを熱圧着することを特徴とする請求項１から請求項４までのいずれか一項に記載の光学素子の製造方法。 5. The optical element according to claim 1, wherein the hologram sheet is thermocompression-bonded to the optical substrate by a thermocompression-bonding jig having a crimping surface portion formed of an elastic member. Manufacturing method.
  6. 　前記熱圧着治具は、カッター部を有し、
    　前記熱圧着治具によって前記光学基板に前記ホログラムシートを熱圧着するとともに、前記カッター部により前記ホログラムシートの光学使用範囲よりも外側をカットすることを特徴とする請求項５に記載の光学素子の製造方法。     The thermocompression bonding jig has a cutter part,
    The optical element according to claim 5, wherein the hologram sheet is thermocompression-bonded to the optical substrate by the thermocompression-bonding jig, and an outer side than an optical usage range of the hologram sheet is cut by the cutter unit. Production method.
  7. 　前記ホログラムシートが貼合される前記光学基板の面と、前記熱圧着治具の圧着面が異なる曲率であり、
    　前記熱圧着治具の前記圧着面部の一部を、前記光学基板上に配置した前記ホログラムシートの一部に当接させた後、前記熱圧着治具の前記圧着面部を前記ホログラムシートの外周に向かって当接させ、前記光学基板に前記ホログラムシートを熱圧着することを特徴とする請求項５又は請求項６に記載の光学素子の製造方法。     The curvature of the surface of the optical substrate to which the hologram sheet is bonded and the pressure bonding surface of the thermocompression bonding jig are different from each other,
    After a part of the crimping surface portion of the thermocompression bonding jig is brought into contact with a part of the hologram sheet disposed on the optical substrate, the crimping surface portion of the thermocompression bonding jig is placed on the outer periphery of the hologram sheet. The method of manufacturing an optical element according to claim 5, wherein the hologram sheet is thermocompression bonded to the optical substrate.
  8. 　前記光学基板に前記ホログラムシートを熱圧着する前に、前記光学基板の熱圧着される面を表面活性化処理することを特徴とする請求項１から請求項７までのいずれか一項に記載の光学素子の製造方法。 The surface activation process is performed on the surface of the optical substrate to be thermocompression-bonded before the hologram sheet is thermocompression-bonded to the optical substrate. The method according to any one of claims 1 to 7, A method for manufacturing an optical element.
PCT/JP2017/002441 2016-01-29 2017-01-25 Optical element manufacturing method WO2017130997A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0524889A (en) * 1990-09-11 1993-02-02 Asahi Glass Co Ltd Hologram sealed safety glass for automobile
JPH07186596A (en) * 1993-12-24 1995-07-25 Tsukioka:Kk Method of press-applying foil on glass lens
JPH07270615A (en) * 1994-03-31 1995-10-20 Central Glass Co Ltd Holographic laminated body
JP2003205510A (en) * 2002-01-11 2003-07-22 Murata Mfg Co Ltd Method and apparatus for laminating green sheet
JP2008287049A (en) * 2007-05-18 2008-11-27 Konica Minolta Holdings Inc Image display apparatus and head-mounted display

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0524889A (en) * 1990-09-11 1993-02-02 Asahi Glass Co Ltd Hologram sealed safety glass for automobile
JPH07186596A (en) * 1993-12-24 1995-07-25 Tsukioka:Kk Method of press-applying foil on glass lens
JPH07270615A (en) * 1994-03-31 1995-10-20 Central Glass Co Ltd Holographic laminated body
JP2003205510A (en) * 2002-01-11 2003-07-22 Murata Mfg Co Ltd Method and apparatus for laminating green sheet
JP2008287049A (en) * 2007-05-18 2008-11-27 Konica Minolta Holdings Inc Image display apparatus and head-mounted display

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