WO2017126766A1 - Method for manufacturing mobile phone antenna using flat coil - Google Patents

Method for manufacturing mobile phone antenna using flat coil Download PDF

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Publication number
WO2017126766A1
WO2017126766A1 PCT/KR2016/010129 KR2016010129W WO2017126766A1 WO 2017126766 A1 WO2017126766 A1 WO 2017126766A1 KR 2016010129 W KR2016010129 W KR 2016010129W WO 2017126766 A1 WO2017126766 A1 WO 2017126766A1
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Prior art keywords
flat coil
sheet
antenna
mobile phone
coil
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PCT/KR2016/010129
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French (fr)
Korean (ko)
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이계산
조오성
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(주)톰스코
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention does not use a circular coil, by manufacturing an antenna for a mobile phone using a flat coil formed a certain pattern with a flat wire, to maximize the charging efficiency and recognition distance, which is an important characteristic of the antenna,
  • the internal antenna of the mobile phone is stored in a narrow space, making it difficult to secure bandwidth and low gain due to the influence of surrounding electrical components. Ordinary small antennas also cause the antenna to bend intricately for resonance in tight spaces. In this case, an offset action is caused by showing a 180 degree phase difference in which the antenna current directions are opposite to each other.
  • the gain and radiation characteristics of the internal antenna at the time of development were far behind those of the external antenna, helical stubby or quarter-wave retractable. Due to steady research on gain and radiation efficiency, some internal antennas have better characteristics than external antennas.In the development of these internal antennas, the internal antennas have a narrow gap between the carrier and the PCB due to the antenna pattern formed in the internal carrier of the terminal. As a result, bandwidth is difficult to secure, and due to the limited space and the influence of surrounding electrical components, it is difficult to generate high gain and efficiency.
  • the antenna used in the conventional mobile phone is formed by the FPCB process, but in the case of a thick product in the FPCB process, many problems in the manufacturing process due to the difficulty of the etching process.
  • the present invention does not use a circular coil, by manufacturing an antenna for a mobile phone using a flat coil formed a certain pattern with a flat wire, to maximize the charging efficiency and recognition distance, which is an important characteristic of the antenna,
  • the present invention is to prepare a composite sheet by attaching a high hardness thermosetting second sheet to the bottom of any one sheet selected from polyvinyl (PVC), polyester (PET), polyimide (PI) Steps,
  • the antenna for a mobile phone manufactured according to the manufacturing method of the present invention has an advantage of maximizing the charging efficiency and the recognition distance of the antenna, which are important characteristics of the antenna.
  • FIG. 1 is a flow chart according to the antenna manufacturing method for a mobile phone using a flat coil of the present invention.
  • FIG. 2 is a view showing a flat coil according to the present invention.
  • FIG 3 is a view showing an alternative for preventing deformation of the sheet that may occur during the fusion process during the antenna manufacturing process by the FPCB of the present invention.
  • Figure 4 illustrates an alternative for preventing the lifting of the coil that may occur during the antenna manufacturing process by the FPCB of the present invention.
  • FIG. 5 is a view showing an alternative that can prevent the height of the junction that may occur during the antenna manufacturing process by the FPCB of the present invention to appear high.
  • the antenna manufacturing method using a flat coil according to the present invention is any one of the first sheet (sheet) selected from polyvinyl (PVC), polyester (PET), polyimide (PI) (11) attaching a high hardness thermosetting second sheet 12 to the lower part to manufacture the composite sheet 10;
  • sheet selected from polyvinyl (PVC), polyester (PET), polyimide (PI) (11) attaching a high hardness thermosetting second sheet 12 to the lower part to manufacture the composite sheet 10;
  • the composite sheet 10 is 0.06 made of any one selected from polyvinyl (PVC), polyester (PET), polyimide (PI) on the top of the high hardness thermosetting second sheet 12 of 0.1 ⁇ 0.2mm thickness It is formed by raising the first sheet 11 having a thickness of 0.1 mm to 0.12 mm and thermally compressing it for 15 to 30 seconds at a temperature condition of 110 to 150 ° C. and a pressure condition of 50 to 130 kgf / cm 2 using a press.
  • PVC polyvinyl
  • PET polyester
  • PI polyimide
  • the flat coil 20 is a coil of a flat conductive wire having a thickness of 0.08 to 0.13 mm and a width of 0.5 to 0.8 mm.
  • the antenna manufactured according to the present invention can maximize charging efficiency or recognition distance, which is an important characteristic of the antenna, due to the use of the flat coil 20.
  • a flat coil 20 is planted on a sheet of polyvinyl (PVC), polyester (PET), polyimide (PI), or the like through ultrasonic welding or heat welding. .
  • PVC polyvinyl
  • PET polyester
  • PI polyimide
  • the heat anastomosis is a method of melting a portion to be fused from a hot plate by heat conduction using a heater and then removing the heater and applying a pressing pressure.
  • a heating soak process of melting the joint joint by contacting it with a heater and pressing the melt;
  • the sheet may cause shrinkage and expansion due to ultrasonic fusion or thermal fusion, thereby causing a problem in that disconnection and characteristics change when punching for an external appearance of a product.
  • thermosetting second sheet 12 is not particularly limited as long as it is a high hardness thermosetting resin, but it is preferable to use a high hardness acrylic system.
  • Bonding of the first sheet 11 and the thermosetting second sheet 12 is performed by thermocompression as described above.
  • the present invention in order to prevent the lifting phenomenon of the flat coil 20, by applying the adhesive 30 to the top of the flat coil 20 after ultrasonic welding or heat welding to lift the coil. (Fig. 4)
  • the adhesive 30 is a non-conductive adhesive, based on 100 parts by weight of an epoxy resin (Diglycidyl ether of bisphenol F; DGEBF),
  • urethane-modified resin 80 g of adipic acid dihydrazide, and 40 g of imidazole are mixed with 100 g of epoxy resin to form a nonconductive adhesive.
  • the non-conductive adhesive 30 thus formed is coated onto the flat coil 20, and then the curing of the adhesive 30 is completed by applying heat at 150 to 170 ° C. for 2 to 20 seconds.
  • the antenna coil formed through the above process is bonded to the terminal PCB, the antenna for the mobile phone according to the present invention is completed.
  • the bonding may be performed by various methods such as coil soldering, SPOT, or thermocompression bonding.
  • coil soldering SPOT
  • thermocompression bonding thermocompression bonding
  • the Athena coil and the PCB are bonded through the following process.
  • the second sheet 12 is detached from the first sheet 11 (FIG. 5C), and then a pre-prepared solder printed PCB is attached to the bonding hole 13. ) And join the PCB 40 to the flat coil 20 ((d) and (e) of FIG. 5). This completes the antenna for the mobile phone according to the present invention.
  • the antenna using the flat coil according to the present invention can maximize the charging efficiency and recognition distance, which are important characteristics of the antenna, and prevent the deformation of the sheet during embedding during the manufacturing process by the FPCB, and lift the coil. It is possible to prevent the problem, by solving the problem that the height of the junction is high when the antenna coil and the terminal PCB is bonded, the industrial applicability is great.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Computer Networks & Wireless Communication (AREA)

Abstract

The present invention relates to a method for manufacturing a mobile phone antenna using a flat coil, wherein the method does not use a round coil but uses a flat coil having a certain pattern made of flat wire, and can thereby maximise the charging efficiency and the recognition distance that are crucial properties of the antenna, and can solve problem, that can occur when manufacturing mobile phone antennas using FPCB, of sheet deformation when embedding a flat coil, coil lift due to heat or ultrasonic waves generated when embedding the coil, and a joint part height being too high when joining the antenna coil and a PCB of a terminal part.

Description

평각코일을 이용한 휴대폰용 안테나 제조방법Method of manufacturing antenna for mobile phone using flat coil
본 발명은 원형코일을 사용하지 않고, 평각 도선으로 일정 패턴을 이룬 평각코일을 이용하여 휴대폰용 안테나를 제조함으로써, 안테나의 중요 특성인 충전효율과 인식거리를 극대화시킬 수 있도록 하고,The present invention does not use a circular coil, by manufacturing an antenna for a mobile phone using a flat coil formed a certain pattern with a flat wire, to maximize the charging efficiency and recognition distance, which is an important characteristic of the antenna,
또한 FPCB에 의한 휴대폰용 안테나를 제조하는 과정 중에 발생할 수 있는, 평각코일 임베딩시 시트의 변형 문제, 임베딩시 발생하는 열 또는 초음파에 의한 코일의 들뜸 현상, 안테나 코일과 단자부 PCB 접합시 접합부의 높이가 높게 나타나는 문제를 해결할 수 있도록 하는 평각코일을 이용한 휴대폰용 안테나 제조방법에 관한 것이다.In addition, the deformation problem of the sheet during the embedding of the flat coil, the floating phenomenon of the coil due to the heat or the ultrasonic wave generated during the embedding, and the height of the joint when the antenna coil and the terminal PCB are bonded, It relates to a method for manufacturing an antenna for a mobile phone using a flat coil to solve the problem that appears high.
정보화 사회에 살고 있는 인류는 정보통신기기의 급속한 발전과 더불어 다양한 혜택을 누리고 있다. 많은 혜택 중 이동통신 서비스가 주는 편리함은 언제 어디서나 웹서핑이 가능하고, 이동통신 중 휴대 단말기는 외부적으로는 소형화 및 슬림화되고 있고,내부적으로는 휴대 단말기 하나로 세계 어디서든 모든 서비스가 이루어지는 멀티 시스템화의 추세에 있다.Human beings living in the information society have enjoyed various benefits with the rapid development of information and communication devices. Among the many benefits, the convenience provided by the mobile communication service is possible to surf the web anytime and anywhere, and the mobile terminal is miniaturized and slimmed externally during the mobile communication. There is a trend.
최근 소형화되고 있는 휴대폰 단말기에 맞춰 내장형 안테나에 대한 기술이 지속적으로 개발되고 있다.Recently, the technology for the built-in antenna has been continuously developed in accordance with the miniaturized mobile phone terminal.
휴대폰 내장형 안테나는 좁은 공간에 수납되어 대역폭 확보가 어렵고, 주변 전기 부품들의 영향에 따라 낮은 이득을 얻는다. 또한 보통의 소형 안테나는 좁은 공간에서의 공진을 위해 안테나를 복잡하게 구부리게 된다. 이러한 경우 안테나 전류 방향이 서로 반대가 되는 180도 위상차를 보임으로써 상쇄 작용을 일으킨다. The internal antenna of the mobile phone is stored in a narrow space, making it difficult to secure bandwidth and low gain due to the influence of surrounding electrical components. Ordinary small antennas also cause the antenna to bend intricately for resonance in tight spaces. In this case, an offset action is caused by showing a 180 degree phase difference in which the antenna current directions are opposite to each other.
전류 상쇄 작용은 방사전자계의 약화를 초래하여 결국 이득이 감소하게 한다. 현재 휴대폰안테나의 경우 대부분이 이러한 이득감소의 문제점이 있다.Current canceling action results in a weakening of the radiated electromagnetic field resulting in a decrease in gain. Currently, most cell phone antennas have this problem of gain reduction.
내장형 안테나는 2000년대 초반부터 개발되어 휴대폰에 적용이 되고 있다Built-in antenna has been developed since the early 2000s and has been applied to mobile phones.
개발 당시의 내장형 안테나의 이득 및 방사특성은 외장형 안테나인 헤리컬 스터비나 1/4 파장 리트렉트블에 비해 크게 뒤떨어졌었다. 이득 및 방사효율 증대에 관한 꾸준한 연구로 인해 일부 내장형 안테나는 외장형 안테나보다 양호한 특성을 나타내고 있다.이러한 내장형 안테나의 발전에도 내장형 안테나는 단말기 내부 캐리어에 안테나 패턴이 형성됨으로 인하여 캐리어와 PCB 사이의 좁은 간격으로 대역폭 확보가 어렵고, 제한된 공간 및 주변의 전기적 부품들의 영향으로 인해 높은 이득과 효율을 발생시키기에 많은 어려움이 따른다.The gain and radiation characteristics of the internal antenna at the time of development were far behind those of the external antenna, helical stubby or quarter-wave retractable. Due to steady research on gain and radiation efficiency, some internal antennas have better characteristics than external antennas.In the development of these internal antennas, the internal antennas have a narrow gap between the carrier and the PCB due to the antenna pattern formed in the internal carrier of the terminal. As a result, bandwidth is difficult to secure, and due to the limited space and the influence of surrounding electrical components, it is difficult to generate high gain and efficiency.
또한, 기존의 휴대폰에 사용되는 안테나는 FPCB 공정에 의해 형성되나, FPCB 공정상 두께가 두꺼운 제품의 경우 에칭 공정 등의 어려움으로 인해 제조공정상의 많은 문제점을 발생시킨다.In addition, the antenna used in the conventional mobile phone is formed by the FPCB process, but in the case of a thick product in the FPCB process, many problems in the manufacturing process due to the difficulty of the etching process.
본 발명은 원형코일을 사용하지 않고, 평각 도선으로 일정 패턴을 이룬 평각코일을 이용하여 휴대폰용 안테나를 제조함으로써, 안테나의 중요 특성인 충전효율과 인식거리를 극대화시킬 수 있도록 하고,The present invention does not use a circular coil, by manufacturing an antenna for a mobile phone using a flat coil formed a certain pattern with a flat wire, to maximize the charging efficiency and recognition distance, which is an important characteristic of the antenna,
또한 FPCB에 의한 휴대폰용 안테나를 제조하는 과정 중에 발생할 수 있는, 평각코일 임베딩시 시트의 변형 문제, 임베딩시 발생하는 열 또는 초음파에 의한 코일의 들뜸 현상, 안테나 코일과 단자부 PCB 접합시 접합부의 높이가 높게 나타나는 문제를 해결할 수 있도록 하는 평각코일을 이용한 휴대폰용 안테나 제조방법을 제공하고자 하는 것을 발명의 목적으로 한다.In addition, the deformation problem of the sheet during the embedding of the flat coil, the floating phenomenon of the coil due to the heat or the ultrasonic wave generated during the embedding, and the height of the joint when the antenna coil and the terminal PCB are bonded, It is an object of the present invention to provide a method for manufacturing an antenna for a mobile phone using a flat coil to solve a problem that appears high.
상기의 목적을 달성하기 위하여,In order to achieve the above object,
본 발명은 폴리비닐(PVC), 폴리에스터(PET), 폴리이미드(PI) 중에서 선택되는 어느 1종의 제1시트(sheet) 하부에 고경도의 열경화성 제2시트를 부착하여 복합시트를 제조하는 단계와,The present invention is to prepare a composite sheet by attaching a high hardness thermosetting second sheet to the bottom of any one sheet selected from polyvinyl (PVC), polyester (PET), polyimide (PI) Steps,
상기 복합시트의 제1시트 상부에, 초음파 융착 또는 열융착을 통해 평각코일을 임베딩하는 단계와,Embedding a flat coil on the first sheet of the composite sheet by ultrasonic welding or thermal welding;
상기 임베딩 후, 상기 평각코일 상부에 접착제를 도포하는 단계와,After the embedding, applying an adhesive on the top of the flat coil;
상기 복합시트의 열경화성 제2시트의 하부로부터 평각코일에 이르는, 평각코일과 단자부 PCB 접합을 위한 접합홀을 형성하고, 납땜 인쇄된 PCB를 상기 접합홀에 넣어 상기 PCB와 상기 평각코일을 열접합하는 단계를 포함하여 이루어지는 평각코일을 이용한 휴대폰용 안테나 제조방법을 제공한다.Forming a bonding hole for joining the flat coil and the terminal portion PCB from the lower portion of the thermosetting second sheet of the composite sheet to the flat coil, and inserting a solder printed PCB into the joining hole to thermally bond the PCB and the flat coil. It provides a method for manufacturing an antenna for a mobile phone using a flat coil comprising a step.
본 발명의 제조방법에 따라 제조된 휴대폰용 안테나는 안테나의 중요 특성인 안테나의 충전효율과 인식거리를 극대화시킬 수 있다는 장점이 있다.The antenna for a mobile phone manufactured according to the manufacturing method of the present invention has an advantage of maximizing the charging efficiency and the recognition distance of the antenna, which are important characteristics of the antenna.
그리고 FPCB에 의한 제작과정 중, 임베딩시 시트의 변형을 방지할 수 있는 방안, 코일의 들뜸을 방지할 수 있는 방안을 제시한다.And during the manufacturing process by the FPCB, it is proposed to prevent the deformation of the sheet during embedding, to prevent the lifting of the coil.
안테나 코일과 단자부 PCB 접합시 접합부의 높이가 높게 나타나는 문제를 해결할 수 있다는 장점을 갖는다. When the antenna coil and the terminal PCB is bonded, the problem that the height of the junction is high can be solved.
도 1은 본 발명의 평각코일을 이용한 휴대폰용 안테나 제조방법에 따른 순서도.1 is a flow chart according to the antenna manufacturing method for a mobile phone using a flat coil of the present invention.
도 2는 본 발명에 따른 평각코일을 도시한 도면.2 is a view showing a flat coil according to the present invention.
도 3은 본 발명의 FPCB에 의한 안테나 제조공정 중 융착과정 중에 발생할 수 있는 시트의 변형방지를 위한 대안을 도시한 도면.3 is a view showing an alternative for preventing deformation of the sheet that may occur during the fusion process during the antenna manufacturing process by the FPCB of the present invention.
도 4는 본 발명의 FPCB에 의한 안테나 제조공정 중에 발생할 수 있는 코일의 들뜸방지를 위한 대안을 도시한 도면.Figure 4 illustrates an alternative for preventing the lifting of the coil that may occur during the antenna manufacturing process by the FPCB of the present invention.
도 5는 본 발명의 FPCB에 의한 안테나 제조공정 중에 발생할 수 있는 접합부의 높이가 높게 나타나는 것을 방지할 수 있는 대안을 도시한 도면.5 is a view showing an alternative that can prevent the height of the junction that may occur during the antenna manufacturing process by the FPCB of the present invention to appear high.
[부호의 설명][Description of the code]
10: 복합시트10: Composite Sheet
11: 제1시트11: first sheet
12: 제2시트12: Second sheet
13: 접합홀13: junction hole
20: 평각코일20: flat coil
30: 접착제30: glue
40: PCB40: PCB
도1Figure 1
이하, 상기의 기술 구성에 대해 도면과 함께 구체적으로 살펴보도록 한다.Hereinafter, the technical configuration will be described in detail with reference to the accompanying drawings.
도 1에 도시된 바와 같이, 본 발명에 따른 평각코일을 이용한 안테나 제조방법은 폴리비닐(PVC), 폴리에스터(PET), 폴리이미드(PI) 중에서 선택되는 어느 1종의 제1시트(sheet)(11) 하부에 고경도의 열경화성 제2시트(12)를 부착하여 복합시트(10)를 제조하는 단계와,As shown in Figure 1, the antenna manufacturing method using a flat coil according to the present invention is any one of the first sheet (sheet) selected from polyvinyl (PVC), polyester (PET), polyimide (PI) (11) attaching a high hardness thermosetting second sheet 12 to the lower part to manufacture the composite sheet 10;
상기 복합시트(10)의 제1시트(11) 상부에, 초음파 융착 또 열융착을 통해 평각코일(20)을 임베딩하는 단계와,Embedding the flat coil 20 on the first sheet 11 of the composite sheet 10 through ultrasonic fusion or thermal fusion;
상기 임베딩 후, 상기 평각코일(20) 상부에 접착제(30)를 도포하는 단계와,After the embedding, applying an adhesive 30 on the top of the flat coil 20,
상기 복합시트(10)의 열경화성 제2시트(12)의 하부로부터 평각코일(20)에 이르는, 평각코일(20)과 단자부 PCB(40) 접합을 위한 접합홀(13)을 형성하고, 납땜 인쇄된 PCB(40)를 상기 접합홀(13)에 넣어 상기 PCB(40)와 상기 평각코일(20)을 열접합하는 단계를 포함하여 이루어진다.Forming a bonding hole 13 for joining the flat coil 20 and the terminal PCB 40 from the lower portion of the thermosetting second sheet 12 of the composite sheet 10 to the flat coil 20, and solder printing And inserting the PCB 40 into the bonding hole 13 to thermally bond the PCB 40 and the flat coil 20 to each other.
이때 복합시트(10)는 0.1~0.2mm 두께의 고경도 열경화성 제2시트(12) 상부로 폴리비닐(PVC), 폴리에스터(PET), 폴리이미드(PI) 중에서 선택되는 어느 1종으로 이루어진 0.06mm ~ 0.12mm 두께의 제1시트(11)를 올리고, 프레스를 이용하여 110~150℃의 온도조건, 50~130kgf/㎠의 압력조건에서 15~30초 동안 열 압착함으로써 형성된다.At this time, the composite sheet 10 is 0.06 made of any one selected from polyvinyl (PVC), polyester (PET), polyimide (PI) on the top of the high hardness thermosetting second sheet 12 of 0.1 ~ 0.2mm thickness It is formed by raising the first sheet 11 having a thickness of 0.1 mm to 0.12 mm and thermally compressing it for 15 to 30 seconds at a temperature condition of 110 to 150 ° C. and a pressure condition of 50 to 130 kgf / cm 2 using a press.
상기 평각코일(20)은 도 2에 도시된 바와 같이, 평각 도선의 코일로서, 두께 0.08~0.13mm이고, 폭 0.5~0.8mm이다.As shown in FIG. 2, the flat coil 20 is a coil of a flat conductive wire having a thickness of 0.08 to 0.13 mm and a width of 0.5 to 0.8 mm.
본 발명에 따라 제조된 안테나는 평각코일(20)의 사용으로 인해 안테나의 중요 특성인 충전효율 또는 인식거리를 극대화시킬 수 있다.The antenna manufactured according to the present invention can maximize charging efficiency or recognition distance, which is an important characteristic of the antenna, due to the use of the flat coil 20.
이와 같은 효과를 갖는 안테나를 제작함에 있어 제조공정상의 여러 가지 문제가 발생하며, 이와 같은 문제의 해결방안을 본 발명을 통해 제시하고자 한다.In manufacturing an antenna having such an effect, various problems occur in the manufacturing process, and a solution for such a problem is proposed through the present invention.
FPCB에 의한 안테나를 제조하기 위하여, 먼저 폴리비닐(PVC), 폴리에스터(PET), 폴리이미드(PI) 등의 시트(Sheet) 상에, 초음파 융착 또는 열융착을 통해 평각코일(20)을 심는다.In order to manufacture an antenna by FPCB, first, a flat coil 20 is planted on a sheet of polyvinyl (PVC), polyester (PET), polyimide (PI), or the like through ultrasonic welding or heat welding. .
상기 열융착(heat anastomosis)은 열(heater)을 사용하여 열판으로부터 융착하고자 하는 부위를 열전도에 의하여 용융시킨 후 히터를 제거하고 압착압력을 가하여 접합하는 방법이다.The heat anastomosis is a method of melting a portion to be fused from a hot plate by heat conduction using a heater and then removing the heater and applying a pressing pressure.
융착의 공정단계는 다음과 같다.The process steps for fusion are as follows.
접합이음부를 히터에 접촉시켜 가압하면서 용융하는 가압용융(heating soak)과정과,A heating soak process of melting the joint joint by contacting it with a heater and pressing the melt;
접합이음부를 히터에 가볍게 밀착한 상태로 가열하여 융착을 하고자 하는 부위를 실질적으로 용융시킨 후 히터를 제거하는 과정과,Heating the bonded joint in a state where it is lightly adhered to the heater to substantially melt the portion to be fused, and then removing the heater;
용융면끼리 압착(heat melting)하는 과정과,The process of heat melting between the molten surface,
접합부위를 상온상태에서 냉각시키는 과정을 포함한다.Cooling the junction at room temperature;
그러나 상기 시트(Sheet)는 초음파 융착 또는 열융착에 의한 수축과 팽창이 발생하게 되며, 이로 인해 제품의 외관 형상을 위한 펀치(punch)시 단선 및 특성이 변하는 문제를 일으키게 된다.However, the sheet may cause shrinkage and expansion due to ultrasonic fusion or thermal fusion, thereby causing a problem in that disconnection and characteristics change when punching for an external appearance of a product.
본 발명에서는 이와 같은 문제를 해결하기 위하여, 도 3에 도시된 바와 같이, 상기 제1시트(11)의 하부에 단단한 재질의 고경도 아크릴계 열경화성 시트인 제2시트(12)를 부착함으로써 임베딩시 시트의 변형을 방지한다.In the present invention, in order to solve such a problem, as shown in Figure 3, by embedding the second sheet 12 of a high hardness acrylic thermosetting sheet of hard material to the lower portion of the first sheet 11 when embedding the sheet To prevent deformation.
상기 열경화성 제2시트(12)는 고경도 열경화성 수지라면 특별히 그 재질에 제한을 두지 않으나, 고경도의 아크릴계를 사용하는 것이 바람직하다.The thermosetting second sheet 12 is not particularly limited as long as it is a high hardness thermosetting resin, but it is preferable to use a high hardness acrylic system.
상기 제1시트(11)와 상기 열경화성 제2시트(12)의 접합은 상기한 바와 같이 열압착에 의해 이루어진다.Bonding of the first sheet 11 and the thermosetting second sheet 12 is performed by thermocompression as described above.
상기 시트의 변형 문제 외에, 임베딩시에 평각코일(20)의 간격이 좁은 경우에는 열 또는 초음파로 인해 인접한 평각코일(20)과의 들뜸 현상을 발생시키게 된다.In addition to the deformation problem of the sheet, when the spacing of the flat coil 20 is narrow at the time of embedding, the lifting phenomenon with the adjacent flat coil 20 is generated due to heat or ultrasonic waves.
따라서 이와 같은 문제를 해결하기 위하여, 본 발명은 상기 평각코일(20)의 들뜸 현상을 방지하기 위하여, 초음파 융착 또는 열융착 후에 평각코일(20) 상부에 접착제(30)를 도포하여 코일의 들뜸을 방지한다.(도 4)Therefore, in order to solve such a problem, the present invention, in order to prevent the lifting phenomenon of the flat coil 20, by applying the adhesive 30 to the top of the flat coil 20 after ultrasonic welding or heat welding to lift the coil. (Fig. 4)
상기 접착제(30)는 비전도성 접착제로서, 에폭시 수지(Diglycidyl ether of bisphenol F; DGEBF) 100중량부에 대하여, The adhesive 30 is a non-conductive adhesive, based on 100 parts by weight of an epoxy resin (Diglycidyl ether of bisphenol F; DGEBF),
강인화제(toughening agent)인 우레탄 변성레진(UME, urethane modified epoxy) 120~200중량부와,120-200 parts by weight of a urethane modified resin (UME), a toughening agent,
경화제인 아디픽산 디하이드라자이드(adipic acid dihydrazide) 60~90중량부와,60 to 90 parts by weight of adipic acid dihydrazide which is a curing agent,
촉매제인 이미다졸(imidazole) 10~50중량부를 혼합하여 조성된다.It is prepared by mixing 10 to 50 parts by weight of a catalyst imidazole.
더욱 구체적으로는 에폭시 수지 100g에 대하여, 우레탄 변성레진 150g, 아디픽산 디하이드라자이드 80g, 이미다졸 40g을 혼합하여 비전도성 접착제를 조성한다.More specifically, 150 g of urethane-modified resin, 80 g of adipic acid dihydrazide, and 40 g of imidazole are mixed with 100 g of epoxy resin to form a nonconductive adhesive.
이와 같이 조성된 비전도성 접착제(30)는 상기 평각코일(20) 상부로 도포한 후, 150~170℃의 열을 2~20초간 가하여 경화시킴으로써 접착제(30) 도포가 완성된다.The non-conductive adhesive 30 thus formed is coated onto the flat coil 20, and then the curing of the adhesive 30 is completed by applying heat at 150 to 170 ° C. for 2 to 20 seconds.
다음으로 상기 과정을 거쳐 형성된 안테나 코일은 단자부 PCB와 접합하는 과정을 거침으로써, 본 발명에 따른 휴대폰용 안테나가 완성된다.Next, the antenna coil formed through the above process is bonded to the terminal PCB, the antenna for the mobile phone according to the present invention is completed.
이때 접합은 코일납땜, SPOT 또는 열압착 등 다양한 방법에 의해 이루어질 수 있다. 그러나 종래 개시된 방법을 따를 경우 접합부의 높이게 높게 나타나는 문제가 있다.In this case, the bonding may be performed by various methods such as coil soldering, SPOT, or thermocompression bonding. However, when following the conventionally disclosed method, there is a problem that the junction appears to be high.
본 발명에서는 이와 같은 문제를 해결하기 위하여, 다음의 과정을 거쳐 아테나 코일과 PCB를 접합한다.In the present invention, in order to solve such a problem, the Athena coil and the PCB are bonded through the following process.
즉, 도 5에 도시된 바와 같이, 상기 임베딩 후, 상기 평각코일(20) 상부에 접착제(30)를 도포하는 과정을 마무리한 후에, 복합시트(10)의 열경화성 제2시트(12)의 하부로부터 평각코일(20)에 이르는 지점까지, RPM 1,000 이상의 고속드릴을 이용하여 접합홀(13)을 형성한다.(도 5의 (a)->(b))That is, as shown in Figure 5, after finishing the process of applying the adhesive 30 to the top of the flat coil 20 after the embedding, the lower portion of the thermosetting second sheet 12 of the composite sheet 10 To the point from the flat coil 20 to form a joining hole 13 using a high-speed drill of RPM 1,000 or more (Fig. 5 (a)-> (b)).
접합홀(13)을 형성한 후에는, 상기 제2시트(12)를 제1시트(11)로부터 탈착한 후에(도 5의 (c)), 미리 준비된 납땜 인쇄된 PCB를 상기 접합홀(13)에 끼워 넣어, 상기 PCB(40)평각코일(20)을 접합한다(도 5의 (d),(e)). 이로써 본 발명에 따른 휴대폰용 안테나가 완성된다.After the bonding hole 13 is formed, the second sheet 12 is detached from the first sheet 11 (FIG. 5C), and then a pre-prepared solder printed PCB is attached to the bonding hole 13. ) And join the PCB 40 to the flat coil 20 ((d) and (e) of FIG. 5). This completes the antenna for the mobile phone according to the present invention.
그리고 이와 같은 과정을 통해 평각코일과 PCB의 접합을 이룸으로써, 도 5에 도시된 바와 같이 접합부의 높이가 높게 나타나는 문제를 해결할 수 있다.And by forming a flat coil and a PCB through this process, it is possible to solve the problem that the height of the junction is high, as shown in FIG.
본 발명에 따른 평각코일을 이용한 안테나는 안테나의 중요 특성인 충전효율과 인식거리를 극대화시킬 수 있고, 그리고 FPCB에 의한 제작과정 중, 임베딩시 시트의 변형을 방지할 수 있는 방안, 코일의 들뜸을 방지할 수 있는 방안, 안테나 코일과 단자부 PCB 접합시 접합부의 높이가 높게 나타나는 문제를 해결하여 줌으로써 산업상 이용가능성이 크다.The antenna using the flat coil according to the present invention can maximize the charging efficiency and recognition distance, which are important characteristics of the antenna, and prevent the deformation of the sheet during embedding during the manufacturing process by the FPCB, and lift the coil. It is possible to prevent the problem, by solving the problem that the height of the junction is high when the antenna coil and the terminal PCB is bonded, the industrial applicability is great.

Claims (5)

  1. 폴리비닐(PVC), 폴리에스터(PET), 폴리이미드(PI) 중에서 선택되는 어느 1종의 제1시트(sheet)(11) 하부에 고경도의 열경화성 제2시트(12)를 부착하여 복합시트(10)를 제조하는 단계와,Composite sheet by attaching a second hard thermosetting sheet 12 to the bottom of any one sheet selected from polyvinyl (PVC), polyester (PET) and polyimide (PI) Manufacturing (10),
    상기 복합시트(10)의 제1시트(11) 상부에, 초음파 융착 또는 열융착을 통해 평각코일(20)을 임베딩하는 단계와,Embedding the flat coil 20 on the first sheet 11 of the composite sheet 10 by ultrasonic welding or thermal welding;
    상기 임베딩 후, 상기 평각코일(20) 상부에 접착제(30)를 도포하는 단계와,After the embedding, applying an adhesive 30 on the top of the flat coil 20,
    상기 복합시트(10)의 열경화성 제2시트(12)의 하부로부터 평각코일(20)에 이르는, 평각코일(20)과 단자부 PCB(40) 접합을 위한 접합홀(13)을 형성하고, 상기 제2시트(12)를 탈착한 후, 납땜 인쇄된 PCB(40)를 상기 접합홀(13)에 넣어 상기 PCB(40)와 상기 평각코일(20)을 열접합하는 단계를 포함하여 이루어지는 것임을 특징으로 하는 평각코일을 이용한 휴대폰용 안테나 제조방법.Forming a bonding hole 13 for joining the flat coil 20 and the terminal portion PCB 40 from the lower portion of the thermosetting second sheet 12 of the composite sheet 10 to the flat coil 20, After the two sheets 12 are removed, the solder printed PCB 40 is inserted into the joining hole 13 to thermally bond the PCB 40 and the flat coil 20 to each other. Method for manufacturing an antenna for a mobile phone using a flat coil.
  2. 청구항 1에 있어서,The method according to claim 1,
    복합시트는 고경도 아크릴계로 이루어진 0.1~0.2mm 두께의 고경도 열경화성 제2시트 상부로 폴리비닐(PVC), 폴리에스터(PET), 폴리이미드(PI) 중에서 선택되는 어느 1종으로 이루어진 0.06mm ~ 0.12mm 두께의 제1시트를 올리고, The composite sheet is composed of a high hardness acrylic sheet of 0.1-0.2mm thick high hardness thermosetting second sheet, 0.06mm ~ consisting of any one selected from polyvinyl (PVC), polyester (PET), polyimide (PI) Raise the first sheet 0.12 mm thick,
    프레스를 이용하여 110~150℃의 온도조건, 50~130kgf/㎠의 압력조건에서 15~30초 동안 열압착함으로써 형성되는 것임을 특징으로 하는 평각코일을 이용한 휴대폰용 안테나 제조방법.Method of manufacturing an antenna for a mobile phone using a flat coil, characterized in that formed by thermal compression for 15 to 30 seconds at a temperature condition of 110 ~ 150 ℃, pressure conditions of 50 ~ 130kgf / ㎠ using a press.
  3. 청구항 1에 있어서,The method according to claim 1,
    평각코일은 두께 0.08~0.13mm이고, 폭 0.5~0.8mm인 것임을 특징으로 하는 평각코일을 이용한 휴대폰용 안테나 제조방법.Flat coil has a thickness of 0.08 ~ 0.13mm, a width of 0.5 ~ 0.8mm manufacturing method of the antenna for a mobile phone using a flat coil.
  4. 청구항 1에 있어서,The method according to claim 1,
    초음파 융착은 0.1A~1A의 전류세기 범위 내에서 이루어지고,Ultrasonic welding is performed within the current strength range of 0.1A ~ 1A,
    열융착은 50~80℃의 온도 범위 내에서 이루어지는 것임을 특징으로 하는 평각코일을 이용한 휴대폰용 안테나 제조방법.Thermal welding is a method for manufacturing an antenna for a mobile phone using a flat coil, characterized in that made in the temperature range of 50 ~ 80 ℃.
  5. 청구항 1에 있어서,The method according to claim 1,
    접착제는 비전도성 접착제로서,The adhesive is a nonconductive adhesive,
    에폭시 수지(Diglycidyl ether of bisphenol F; DGEBF) 100중량부에 대하여, To 100 parts by weight of epoxy resin (Diglycidyl ether of bisphenol F; DGEBF),
    강인화제(toughening agent)인 우레탄 변성레진(UME, urethane modified epoxy) 120~200중량부와,120-200 parts by weight of a urethane modified resin (UME), a toughening agent,
    경화제인 아디픽산 디하이드라자이드(adipic acid dihydrazide) 60~90중량부와,60 to 90 parts by weight of adipic acid dihydrazide which is a curing agent,
    촉매제인 이미다졸(imidazole) 10~50중량부를 혼합하여 조성된 것임을 특징으로 하는 평각코일을 이용한 휴대폰용 안테나 제조방법.Method of manufacturing an antenna for a mobile phone using a flat coil, characterized in that the composition is formed by mixing 10 to 50 parts by weight of imidazole which is a catalyst.
PCT/KR2016/010129 2016-01-20 2016-09-09 Method for manufacturing mobile phone antenna using flat coil WO2017126766A1 (en)

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KR1020160006749A KR101774811B1 (en) 2016-01-20 2016-01-20 Method for manufacturing antenna for cellphone using rectangular coil

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001143036A (en) * 1999-11-17 2001-05-25 Dainippon Printing Co Ltd Noncontact data carrier and ic chip used for the carrier, and method for fitting ic chip to the noncontact data carrier
KR20100063364A (en) * 2008-12-03 2010-06-11 한국조폐공사 Laminated sheet integrated with antenna coil including rf chip module and a method for manufacturing the same
KR101209562B1 (en) * 2011-08-18 2012-12-07 (주)이.씨테크날리지 Rf antenna and the method for fabricating the same
KR20140139996A (en) * 2013-04-09 2014-12-08 주식회사 아모그린텍 Antenna and method for manufacturing thereof
KR20150013199A (en) * 2012-05-14 2015-02-04 히타치가세이가부시끼가이샤 Antenna sheet for contactless charging device and charging device using said sheet

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001143036A (en) * 1999-11-17 2001-05-25 Dainippon Printing Co Ltd Noncontact data carrier and ic chip used for the carrier, and method for fitting ic chip to the noncontact data carrier
KR20100063364A (en) * 2008-12-03 2010-06-11 한국조폐공사 Laminated sheet integrated with antenna coil including rf chip module and a method for manufacturing the same
KR101209562B1 (en) * 2011-08-18 2012-12-07 (주)이.씨테크날리지 Rf antenna and the method for fabricating the same
KR20150013199A (en) * 2012-05-14 2015-02-04 히타치가세이가부시끼가이샤 Antenna sheet for contactless charging device and charging device using said sheet
KR20140139996A (en) * 2013-04-09 2014-12-08 주식회사 아모그린텍 Antenna and method for manufacturing thereof

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