WO2017124918A1

WO2017124918A1 - Hot-processing method and device for apparatus

Info

Publication number: WO2017124918A1
Application number: PCT/CN2017/000072
Authority: WO
Inventors: 谢焕军; 尹旭全
Original assignee: 中兴通讯股份有限公司
Priority date: 2016-01-18
Filing date: 2017-01-03
Publication date: 2017-07-27
Also published as: CN106980588A

Abstract

Disclosed are a hot-processing method and device for an apparatus. The hot-processing method for an apparatus comprises: acquiring first event information and first slot information, the first event information being a hot swapping operation executed by the apparatus (S110); acquiring apparatus information according to the first event information and the first slot information, the apparatus information comprising an apparatus function of a hot-swappable apparatus (S120); calling a service interface of the hot-swappable apparatus according to the apparatus function, and stopping a service running on the service interface according to the first event information (S130). The method and device solve the problem of a hot-swapping system abnormality in the prior art caused by the running of a service related to an external apparatus that has already been unplugged that may occur during a hot-swapping operation.

Description

Device heat treatment method and device

Technical field

The invention relates to the technical field of hot extraction and hot insertion of hardware devices, in particular to a heat treatment method and device for equipment.

Background technique

The Peripheral Component Interface Express (PCIE) is a local bus. At present, most central processing units (CPUs) are connected to external devices through PCIE controllers. Perform data transfer between the external device and the CPU.

Hot plugging is hot plugging. The hot plug function allows the user to remove and replace external devices without shutting down the system and cutting off the power, thus improving the system's resilience and scalability. Generally, a complete native bus interface (Native PCIE) hot-swap system requires several aspects of hardware, firmware elements, and software elements; the hardware elements refer to the electrical characteristics of the motherboard bus system. Support, firmware element refers to the motherboard's basic input and output system (Basic Input Output System, BIOS for short) must support the hot plug, the software element refers to the operating system (Operating System, referred to as: OS) integrated PCIE The functional components that must be provided for hot plugging. Currently, the software for hot plugging in the OS has a hot swap driver of the kernel and a communication mechanism between the kernel and the user space (called uevent). When a hot plug event is generated, the event is reported to the user through uevent, however, During the process of reporting an event through uevent, it may happen that the related driver that has been pulled out of the external device has been deleted, and the related service of the external device is still running.

In summary, during the process of performing the hot-pull operation by the prior art, the related business that has been pulled out of the external device may still be running, causing the abnormality of the hot-swap system.

Summary of the invention

In order to solve the above technical problem, the present invention provides a method and a device for heat treatment of a device to solve the phenomenon that the related service that has been pulled out of the external device is still in operation during the process of performing the hot extraction operation by the prior art. , causing an abnormality in the hot swap system.

In a first aspect, the present invention provides a method of heat treatment of a device, comprising:

Acquiring the first event information and the first slot information, where the first event information is a hot pull operation performed by the device;

Obtaining device information according to the first event information and the first slot information, where the device information includes a device function of the hot extraction device;

The service interface of the hot-pull device is invoked according to the device function, and the service running on the service interface is stopped according to the first event information.

In a first possible implementation manner of the first aspect, after the stopping the service running on the service interface, the method further includes:

The configuration information related to the hot-pull device is cleaned according to the device function.

In a second possible implementation manner of the first aspect, the device information further includes N bus interfaces PCIE corresponding to the first slot information, where the hot extraction device has N chips, and the device The function includes a chip function of each of the chips, and the N chips have a one-to-one correspondence with the N PCIEs, where N is an integer greater than 1;

The service interface of the hot-pull device is invoked according to the device function, and the service running on the service interface is stopped according to the first event information, including:

Calling a service interface of each of the chips according to a chip function of each of the PCIE corresponding chips, and stopping a service running on the invoked service interface according to the first event information;

After the stopping the service running on the service interface, the method includes:

The configuration information associated with each of the chips is cleaned according to the chip function of each of the PCIE-compatible chips.

According to the first aspect, the first and second possible implementation manners of the first aspect, in a third possible implementation, after the stopping the service running on the service interface, the method further includes :

And uninstalling, according to the first slot information and the device function, a driver related to the hot-pull device, and releasing system resources occupied by the hot-pull device.

According to the first aspect, the first and the second possible implementation manners of the first aspect, in a fourth possible implementation, the method further includes:

Acquiring the second event information and the second slot information, where the second event information is a device performing a hot plug operation, wherein the hot plug device has at least one chip;

Obtaining a chip function of each chip in the hot plug device and all PCIEs corresponding to the second slot information, and determining a correspondence between the entire PCIE and a chip in the hot plug device, where the PCIE and the PCIE The chips have a one-to-one correspondence;

Allocating system resources and loading drivers for each chip corresponding to the PCIE according to the determined correspondence relationship;

Updating resource information and configuration information related to each of the chips according to the second event information;

A business function associated with each of the chips is initiated based on the acquired second event information and chip functionality.

In a second aspect, the present invention provides a device heat treatment apparatus comprising:

a heat treatment module, configured to acquire first event information and first slot information, where the first event information is a hot pull operation performed by the device;

a pre-processing module, configured to acquire device information according to the first event information acquired by the heat treatment module and the first slot information, where the device information includes a device function of the hot-pull device;

The service management module is configured to invoke the service interface of the hot-pull device according to the device function acquired by the pre-processing module, and stop the service running on the service interface according to the first event information obtained by the heat treatment module.

In a first possible implementation manner of the second aspect, the service management module is further configured to: after the service running on the service interface is stopped, clear the device related to the hot-pull device according to the device function Configuration information.

In a second possible implementation manner of the second aspect, the device information acquired by the pre-processing module further includes N bus interfaces PCIE corresponding to the first slot information, and the hot extraction device has N a chip, the device function includes a chip function of each of the chips, and the N chips have a one-to-one correspondence with the N PCIEs, where N is an integer greater than 1;

The service management module is configured to invoke a service interface of the hot-pull device according to the device function acquired by the pre-processing module, and stop the service running on the service interface according to the first event information acquired by the heat treatment module. And means: calling a service interface of each of the chips according to a chip function of each of the PCIE corresponding chips, and stopping a service running on the invoked service interface according to the first event information;

The service management module is further configured to: after stopping the service running on the service interface, clear configuration information related to each of the chips according to a chip function of each PCIE corresponding chip.

According to the second aspect, the first and second possible implementation manners of the second aspect, in a third possible implementation, the service management module is further configured to stop the service interface Discharging the driver associated with the hot-pull device according to the first slot information acquired by the heat treatment module and the device function acquired by the service management module, and releasing the hot-plug device occupation System resources.

According to the second aspect, the first and second possible implementation manners of the second aspect, in the fourth possible implementation, the device heat treatment device further includes:

The heat treatment module is further configured to acquire second event information and a second slot information, wherein the second event information is a device performing a hot plug operation, wherein the hot plug device has at least one chip;

The pre-processing module is further configured to acquire a chip function of each chip in the hot-plug device and all PCIEs corresponding to the second slot information, and determine all the PCIEs and chips in the hot-plug device Corresponding relationship, wherein the PCIE has a one-to-one correspondence with the chip;

The heat processing module is further configured to allocate system resources and load drivers for each chip corresponding to the PCIE according to the correspondence determined by the preprocessing module;

The preprocessing module is further configured to update resource information and configuration information related to each of the chips according to the second event information acquired by the heat processing module;

The service management module is further configured to start a service function related to each of the chips according to the second event information acquired by the heat processing module and the chip function acquired by the preprocessing module.

The device heat treatment method and device provided by the present invention, after acquiring the first event information and the first slot information by the hot extraction operation of the device, acquiring the device of the hot extraction device according to the first event information and the first slot information The function, so that the service interface of the hot-pull device is invoked by the device function, and the service running on the service interface is stopped according to the first event information; the device heat treatment method provided by the embodiment of the invention is hot-extracted in the execution device In operation, the consistency between the extracted device and the related services in the system is realized, thereby solving the problem of passing the prior art. During the process of performing the hot extraction operation, the related business that has been pulled out of the external device may still be running, causing the abnormality of the hot swap system.

DRAWINGS

The drawings are used to provide a further understanding of the technical solutions of the present invention, and constitute a part of the specification, which together with the embodiments of the present application are used to explain the technical solutions of the present invention, and do not constitute a limitation of the technical solutions of the present invention.

1 is a flowchart of a method for heat treatment of a device according to an embodiment of the present invention;

2 is a flowchart of another method for heat treatment of a device according to an embodiment of the present invention;

3 is a flowchart of still another method for heat treatment of a device according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a heat treatment device for a device according to an embodiment of the present invention.

detailed description

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that, in the case of no conflict, the features in the embodiments and the embodiments in the present application may be arbitrarily combined with each other.

The steps illustrated in the flowchart of the figures may be executed in a computer system such as a set of computer executable instructions. Also, although logical sequences are shown in the flowcharts, in some cases the steps shown or described may be performed in a different order than the ones described herein.

First, a brief introduction to the development process of the PCIE specification. In 1997, the Peripheral Component Interconnect Special Interest Group (PCI SIG) developed the first PCI hot plug specification, which defines the platforms, boards, and boards necessary to support hot plugging. Software element. The PCI SIG introduces the Standard Hot Swap Controller specification (SHPC SPEC), which clarifies the standard use mode of hot swap and strict register set requirements, and allows operating system providers to Hot-plug support is provided in addition to platform-specific software, and the hot-swap standard-setting work is gradually completed, entering the comprehensive promotion phase of technology. Since 2002, Intel has given hot plugging as a natural attribute to the new PCIE specification.

The PCIE hot plug system described in the background art requires cooperation of three elements: hardware elements, firmware elements, and software elements. The existing patents have been improved on hardware elements and firmware elements, including: patent application number is CN201310400629, the invention name is "resource allocation method and system"; patent application number is CN201210094722, and the invention name is "a CPLD or FPGA" Method for implementing hot plugging of PCIE devices. Among them, CN201310400629 has improved the resource allocation strategy in the firmware element, and CN201210094722 has improved the implementation method of hardware elements. However, the problems caused by the software elements mentioned in the background art, that is, during the hot-pull processing, the hot-swapping system is caused by the phenomenon that the related services that have been pulled out of the external device are still running. Abnormal problems, therefore, how to avoid the abnormality of the hot-swap system has become an urgent technical problem.

The technical solutions of the present invention are described in detail in the following embodiments. The hot-extracting device and the hot-plugging device in the following embodiments of the present invention can be inserted into the slot of the terminal device or pulled out from the slot of the terminal device. The external device may be, for example, a network card, a hard disk or an external optical disk drive (ODD), which may be based on a certain technical field or may include a plurality of technical fields. The following specific embodiments of the present invention may be combined with each other, and the same or similar concepts or processes may not be described in some embodiments.

FIG. 1 is a flowchart of a method for heat treatment of a device according to an embodiment of the present invention. The device heat treatment method provided in this embodiment is applicable to the case where the external device of the heat treatment system is hot-extracted, and the method may be performed by a device heat treatment device, which is realized by a combination of hardware and software, and the device may be Integrated in the processor of the terminal device for use by the processor. As shown in FIG. 1, the method in this embodiment may include:

S110: Acquire first event information and first slot information, where the first event information is a hot pull operation performed by the device.

In the device heat treatment method provided by the embodiments of the present invention, the hot extraction operation or the hot insertion operation of the device is performed corresponding to the slot of a certain terminal device. In a specific implementation, the terminal device may be provided with a physical button. The user can trigger the hot plug event by pressing or popping the button, and the terminal device can analyze the operation of the button to parse out the event type corresponding to the current button operation, and can also learn the event type corresponding to the current button operation through the preset rule, the event. The type of the device is usually hot-plugged or hot-plugged. For example, when the user controls the button to be in the pop-up state, the first event information obtained is that the device in the slot corresponding to the button is hot-drawn from the slot. At the same time, the terminal device can obtain the slot information of the current hot-out operation, and the current event type and related slot information can be known. The information obtained after the user operates the button in this embodiment is: the device in the first slot performs a hot pull operation.

S120. Acquire device information according to the first event information and the first slot information, where the device information includes a device function of the hot-pull device.

In an embodiment, the device function of the extracted device in the first slot is further parsed according to the first slot information, and the device function generally corresponds to the device type, for example, if The device is a network card, and its device function is to provide a wireless network connection; if the device is a hard disk, the device function is to provide data interaction with the external device; if the device is an ODD, the device function is to provide a digital Versatile Disc (Digital Versatile Disc) For: DVD) data interaction.

It should be noted that the slots in the embodiments of the present invention have a one-to-one correspondence with the hot insertion device or the hot extraction device, that is, only one device can be inserted into one slot; in addition, the embodiment does not limit each The device function of a device, which may be a single-function device, or a device with multiple functions, such as the device function of the device, for example, related to the number of chips in the device.

S130. The service interface of the hot-pull device is invoked according to the device function, and the service running on the service interface is stopped according to the first event information.

The purpose of the heat treatment method of the device provided in this embodiment is to solve the problem of the abnormality of the hot plug system, that is, after the hot pull operation of the device is performed, the corresponding service of the extracted device can be stopped to maintain the external device in the hot plug system. The consistency of the running program; in a specific implementation, the terminal device can invoke the service interface related to the function of the device according to the device function of the hot-plugging device, that is, the service interface of the device has been pulled out, and the first event information is known because To hot-plug an event, you can stop the business running on the invoked business interface. Obviously, the method provided in this embodiment can effectively avoid the system abnormality caused by the operation of the device being pulled out during the hot extraction operation, which is a relatively safe heat treatment mode, and the method is It can be implemented by software control, which is convenient for users to operate.

After the first event information and the first slot information are obtained by the hot extraction operation of the device, the device for obtaining the hot extraction device is obtained according to the first event information and the first slot information. The function, so that the service interface of the hot-pull device is invoked by the device function, and the service running on the service interface is stopped according to the first event information; the device heat treatment method provided in this embodiment performs the device hot extraction operation When the unplugged device is consistent with the related services in the system, the process of hot-extracting operations through the existing technology is solved, and the related services that have been pulled out of the external device may still be running. , causing an abnormality in the hot swap system.

Further, the device heat treatment method provided in this embodiment, after stopping the service running on the service interface, that is, after S130, further includes: S140, and clearing configuration information related to the hot-pull device according to the device function. In this embodiment, the device has been pulled out, and the related service of the device has been disconnected. However, the service that is stopped normally needs to be configured during normal operation, that is, the configuration information of the stopped service is stored in the terminal device. At this time, the configuration information related to the hot-plugged device can be further cleaned, thereby releasing the storage resources of the terminal device and improving the use performance of the terminal device.

In a specific implementation, the terminal device can generally distribute a message to each service process related to the hot-pull device according to the device function, and complete the service processing related to the device function by the service process of receiving the message, for example, the above clear configuration. The processing of information can also be handled by the main standby machine.

Optionally, FIG. 2 is a flowchart of another method for heat treatment of a device according to an embodiment of the present invention. The device information in this embodiment further includes N PCIEs corresponding to the first slot information, and the hot extraction device may have N chips. Correspondingly, the device functions include chip functions of each chip, and N chips and N The PCIE is a one-to-one correspondence, where N is an integer greater than 1. In the embodiment of the present invention, when the number of PCIEs corresponding to the slot is multiple, and the device has multiple chips, the specific example is N is 2. Explain.

In this embodiment, based on the method shown in FIG. 1 , S130 may be replaced by: calling a service interface of each chip according to a chip function of each PCIE corresponding chip, and stopping running on the invoked service interface according to the first event information. Service; accordingly, the S140 can be replaced with: cleaning the configuration information associated with each chip according to the chip function of each PCIE corresponding chip. It should be noted that, in the specific implementation, the services related to each chip may be sequentially stopped, and the configuration information related to each chip may be sequentially cleaned, or the foregoing operations may be simultaneously performed.

Further, the method provided by the foregoing embodiment of the present invention, after S130, further includes: S150, uninstalling a driver related to the hot-pull device according to the first slot information and the device function, and releasing the system resource occupied by the hot-pull device . In this embodiment, since the device is unplugged, that is, the driver corresponding to the extracted device is an idle driver in the system, the system performance of the terminal device can be further improved by uninstalling the driver, and the released device can be released at the same time. The system resources occupied by the device, for example, release the address resource occupied by the device, that is, input/output (abbreviation: IO) MEM.

In this implementation, in the specific implementation, regardless of the number of chips in the hot-pull device, the driver related to all the chips in the hot-pull device needs to be unloaded, and the chip and the first slot information in the device are hot-extracted. The PCIE has a one-to-one correspondence, that is, the first slot information can be converted into a PCIE corresponding to the chip in the hot-plugging device, thereby unloading the driver and releasing system resources by traversing all converted PCIEs. In addition, after performing the foregoing various operation steps, the foregoing embodiments of the present invention can also power off the first slot and display the processing result on a graphical user interface (GUI) of the terminal device.

It should be noted that S150 in this embodiment is a further processing solution after the service is stopped, which is beneficial to improving the solution integrity of the heat treatment method. S150 may be performed after S130, or may be performed after S140; When there are multiple chips in the hot-pull device, S130-S150 may be sequentially executed for each chip, or S130-S150 may be simultaneously executed for all chips, and other execution processes may be set.

Each of the above embodiments is an improvement on the software element for the hot pull event. In order to ensure the integrity of the heat treatment scheme and to improve the processing manner of having more than one chip in the hot plug device, the present invention is based on the above embodiments. A specific implementation for hot insertion events is provided. Specifically, FIG. 3 is a flowchart of still another method for heat treatment of a device according to an embodiment of the present invention. The method provided in this embodiment further includes:

S210. Acquire second event information and second slot information, where the second event information is a device performing a hot plug operation, wherein the hot plug device has at least one chip.

For the specific implementation of the S210 in this embodiment, refer to the S110 in the foregoing embodiment, and the terminal device can also obtain the second event information by using the operation of the physical button by the user. For example, the user in the embodiment controls the button to be in the pressed state. The second event information obtained is that the device is hot-inserted in the slot corresponding to the button, and the terminal device can obtain the slot information of the current hot-plug operation, and the current event type and related slot information can be known. The information obtained after the user operates the button in this embodiment is: the device performs hot insertion into the second slot, and the slot can also be powered. It should be noted that, as in the above embodiment, the chips in the device performing the hot insertion operation in this embodiment may be one or more.

S220, obtaining the chip function of each chip in the hot plugging device and all the PCIEs corresponding to the second slot information, and determining the correspondence between all the PCIEs and the chips in the hot plugging device, wherein the PCIE and the chip have a one-to-one correspondence.

In this embodiment, the hot plug device has at least two chips as an example. The slot is in one-to-one correspondence with the hot plug device, and the chip in the hot plug device has a one-to-one correspondence with the PCIE in the second slot. The same is true for the embodiment The PCIE traverses each chip of the hot-plug device through the PCIE corresponding to the second slot information. Therefore, before performing corresponding service processing on the hot-plug device, it is necessary to determine the correspondence between the PCIE and the chip.

For example, the hot plug device has two chips, namely chip A and chip B. The slot inserted in the device also has two PCIE ports, PCIE port A and PCIE port B. At this time, the chip and the chip can be determined. The correspondence between PCIE ports is: chip A links PCIE port A, and chip B links PCIE port B.

S230. Allocate system resources and load drivers for each chip corresponding to the PCIE according to the determined correspondence.

S240. Update resource information and configuration information related to each chip according to the second event information.

S250. Start a service function related to each chip according to the acquired second event information and the chip function.

It should be noted that, after determining the correspondence between the chip and the inserted slot aggregation PCIE in the hot insertion device, the processing of each chip can be performed by traversing each PCIE port, that is, the processing in S230 to S250. For example, S230 to S250 may be sequentially performed for each chip, or S230 to S250 may be simultaneously performed for all chips, as long as the above operation can be performed for each chip in the hot insertion device.

It should be noted that the hot-plugging device in this embodiment may be a device that is hot-extracted in the embodiments shown in FIG. 1 and FIG. 2, or may be a different external device, and the method provided in this embodiment is performed. After the hot swapping is performed on the device, the S110-S250 in the embodiment and the S110-S150 in the foregoing embodiments have no clear sequence, and the same slot can be executed in different time segments. It is also possible to perform different slots in the same time period. Therefore, only the execution steps S210 to S250 of hot insertion are shown in FIG. 3, S110 to S150 may be performed before S210, and S110 to S150 may be performed after S250. .

FIG. 4 is a schematic structural diagram of a heat treatment device for a device according to an embodiment of the present invention. In the case where the device heat treatment device provided in this embodiment is suitable for hot extraction of the external device of the heat treatment system, the device heat treatment device can be implemented by a combination of hardware and software, and the device can be integrated into the processor of the terminal device. For use by the processor. As shown in FIG. 4, the tunnel flow control device provided in this embodiment specifically includes: a heat treatment module 11, a preprocessing module 12, and a service management module 13.

The heat treatment module 11 is configured to acquire the first event information and the first slot information, where the first event information is a hot pull operation performed by the device.

In the device heat treatment apparatus provided by the embodiment of the present invention, the hot extraction operation or the hot insertion operation of the device is an operation performed corresponding to a slot of a certain terminal device, and can also be identified by a state change of a physical button set on the terminal device. The hot-extraction or hot-insertion event is the same as that in the above embodiment, and therefore will not be described here. The module is also used to power on and off the slot.

The pre-processing module 12 is configured to acquire device information according to the first event information acquired by the heat treatment module 11 and the first slot information, where the device information includes a device function of the hot-pull device.

In a specific implementation, the pre-processing module 12 can receive the hot-pull-out request, and the hot-extraction request carries the first event information and the first slot information, thereby parsing the hot-pull device. The type of function.

It should be noted that the slots in the embodiments of the present invention are in one-to-one correspondence with the hot insertion device or the hot extraction device. Relationship, that is, only one device can be inserted in one slot; in addition, this embodiment does not limit the device function of each device, and may be a single-function device or a device having multiple functions, each of which The device function of the device is for example related to the number of chips in the device.

The service management module 13 is configured to invoke the service interface of the hot-pull device according to the device function acquired by the pre-processing module 12, and stop the service running on the service interface according to the first event information obtained by the heat treatment module 11.

The device heat treatment device according to the embodiment of the present invention can invoke a service interface related to the function of the device according to the device function of the hot-pull device, that is, the service interface of the device has been pulled out, and the first event information is known as hot-plugging. When an event occurs, the business running on the invoked business interface can be stopped.

Further, the service management module 13 in this embodiment is further configured to: after stopping the service running on the service interface, clear the configuration information related to the hot-pull device according to the device function. By clearing the configuration information related to the hot-plugged device, the module achieves the effect of releasing the storage resources of the terminal device and improving the performance of the terminal device.

The device heat treatment device provided by the embodiment of the present invention is used to perform the heat treatment method of the device provided by the embodiment shown in FIG. 1 of the present invention, and has a corresponding functional module, and the implementation principle and technical effect thereof are similar, and details are not described herein again.

Optionally, in the device heat treatment device provided by the embodiment, the device information acquired by the preprocessing module 12 further includes N PCIEs corresponding to the first slot information, and the hot extraction device has N chips, and correspondingly, the device The function includes a chip function of each chip, and the N chips have a one-to-one correspondence with the N PCIEs, where N is an integer greater than 1. In each embodiment of the present invention, the number of PCIEs corresponding to the slots is multiple, and the device has In the case of a plurality of chips, a specific example of N is 2 will be described.

The specific implementation of the embodiment is as follows: the service management module 13 in the embodiment shown in FIG. 4 is configured to invoke the service interface of the hot-pull device according to the device function acquired by the pre-processing module 12, and obtain the service interface according to the heat treatment module 11. The first event information stops the service running on the service interface, which means: calling the service interface of each chip according to the chip function of each PCIE corresponding chip, and stopping the service running on the invoked service interface according to the first event information; After the service running on the service interface is stopped, the service management module 13 is specifically configured to clean configuration information related to each chip.

Further, in the device provided by the foregoing embodiment of the present invention, the service management module 13 is further configured to acquire the first slot information and the device function acquired by the pre-processing module 12 according to the heat treatment module 11 after the service running on the service interface is stopped. Uninstall the drivers associated with the hot-plugged device and release the system resources occupied by the hot-plugged device.

The device heat treatment device provided by the embodiment of the present invention is used to perform the heat treatment method of the device provided by the embodiment shown in FIG. 2 of the present invention, and has a corresponding function module, and the implementation principle and technical effect thereof are similar, and details are not described herein again.

Each of the above embodiments is an improvement on the software element for the hot pull event. In order to ensure the integrity of the heat treatment scheme and to improve the processing manner of having more than one chip in the hot plug device, the present invention is based on the above embodiments. A specific implementation for hot insertion events is provided.

The same can be achieved by the various functional modules of the device heat treatment device shown in FIG. 4 above, specifically, heat treatment. The module 11 is further configured to acquire the second event information and the second slot information, the second event information is a hot plug operation performed by the device, wherein the hot plug device has at least one chip. The second event information in this embodiment is that the device performs hot insertion into the second slot, and the slot can also be powered. It should be noted that, as in the above embodiment, the chips in the device performing the hot insertion operation in this embodiment may be one or more.

The pre-processing module 12 is further configured to obtain a chip function of each chip in the hot-plug device and all PCIEs corresponding to the second slot information, and determine a correspondence between all PCIEs and chips in the hot-plug device, wherein the PCIE and the chip are One-to-one correspondence.

In the same manner as the above embodiments, the slots in the embodiment are in one-to-one correspondence with the hot-plug devices, and the chips in the hot-plug device have a one-to-one correspondence with the PCIEs in the second slot.

The heat treatment module 11 is further configured to allocate system resources and load drivers for the chips corresponding to each PCIE according to the correspondence determined by the pre-processing module 12.

In this embodiment, after determining the correspondence, the pre-processing module 12 can transmit each PCIE port information to the heat treatment module 11, and the heat treatment module 11 allocates system resources and load drivers for the chip.

The pre-processing module 12 is further configured to update resource information and configuration information related to each chip according to the second event information acquired by the heat treatment module 11.

The service management module 13 is further configured to start a service function related to each chip according to the second event information acquired by the heat processing module 11 and the chip function acquired by the preprocessing module 12.

It should be noted that, after determining the correspondence between the chip and the inserted slot aggregation PCIE in the hot insertion device, the processing of each chip can also be performed by traversing each PCIE port, that is, performing the above-mentioned hot insertion correlation. For example, the above processing manner may be performed for each chip in turn, or the above processing manner may be simultaneously performed for all the chips, as long as the above operation can be performed for each chip in the hot insertion device.

It should be noted that, in this embodiment, the hot-plugging device may be a device that is hot-extracted in the above embodiment, or may be a different external device, and after performing the method provided in this embodiment, the device may be further Perform a hot pull.

The device heat treatment device provided by the embodiment of the present invention is used to perform the heat treatment method of the device provided by the embodiment shown in FIG. 3 of the present invention, and has a corresponding functional module, and the implementation principle and technical effect thereof are similar, and details are not described herein again.

The above-mentioned heat treatment module, pre-processing module, business management module and the like may include hardware components, software modules or a combination of hardware and software. The same unit may be implemented by the same hardware/software or by a combination of different hardware/software. The above modules or units may all be located in the same hardware structure; or, the above modules or units are respectively located in a plurality of different hardware structures, and may interact through a communication connection. While the embodiments of the present invention have been described above, the described embodiments are merely for the purpose of understanding the invention and are not intended to limit the invention. Any modification and variation in the form and details of the embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention. The scope defined by the appended claims shall prevail.

Industrial applicability

The present invention relates to the field of hot-extraction and hot-plugging of hardware devices, which is used to implement the hot-extraction operation of the related services in the system when the device is hot-extracted. In the process of processing, the hot-swapping system is abnormal due to the fact that the related services that have been pulled out of the external device are still running.

Claims

A method of heat treatment of a device, comprising:

Acquiring the first event information and the first slot information, where the first event information is a hot pull operation performed by the device;

Obtaining device information according to the first event information and the first slot information, where the device information includes a device function of the hot extraction device;

The service interface of the hot-pull device is invoked according to the device function, and the service running on the service interface is stopped according to the first event information.
The device heat treatment method according to claim 1, wherein after the stopping the service running on the service interface, the method further comprises:

The configuration information related to the hot-pull device is cleaned according to the device function.
The device heat treatment method according to claim 1, wherein the device information further comprises N bus interfaces PCIE corresponding to the first slot information, and the hot extraction device has N chips, the device function Including a chip function of each of the chips, the N chips have a one-to-one correspondence with the N PCIEs, where N is an integer greater than 1;

The service interface of the hot-pull device is invoked according to the device function, and the service running on the service interface is stopped according to the first event information, including:

Calling a service interface of each of the chips according to a chip function of each of the PCIE corresponding chips, and stopping a service running on the invoked service interface according to the first event information;

After the stopping the service running on the service interface, the method includes:

The configuration information associated with each of the chips is cleaned according to the chip function of each of the PCIE-compatible chips.
The device heat treatment method according to any one of claims 1 to 3, wherein after the stopping the service running on the service interface, the method further comprises:

And uninstalling, according to the first slot information and the device function, a driver related to the hot-pull device, and releasing system resources occupied by the hot-pull device.
The heat treatment method for a device according to any one of claims 1 to 3, further comprising:

Acquiring the second event information and the second slot information, where the second event information is a device performing a hot plug operation, wherein the hot plug device has at least one chip;

Obtaining a chip function of each chip in the hot plug device and all PCIEs corresponding to the second slot information, and determining a correspondence between the entire PCIE and a chip in the hot plug device, where the PCIE and the PCIE The chips have a one-to-one correspondence;

Allocating system resources and loading drivers for each chip corresponding to the PCIE according to the determined correspondence relationship;

Updating resource information and configuration information related to each of the chips according to the second event information;

A business function associated with each of the chips is initiated based on the acquired second event information and chip functionality.
A device heat treatment device comprising:

a heat treatment module, configured to acquire first event information and first slot information, where the first event information is a hot pull operation performed by the device;

a pre-processing module, configured to acquire device information according to the first event information acquired by the heat treatment module and the first slot information, where the device information includes a device function of the hot-pull device;

The service management module is configured to invoke the service interface of the hot-pull device according to the device function acquired by the pre-processing module, and stop the service running on the service interface according to the first event information obtained by the heat treatment module.
The device heat treatment apparatus according to claim 6, wherein the service management module is further configured to: after stopping the service running on the service interface, clear the configuration related to the hot-pull device according to the device function information.
The device heat treatment apparatus according to claim 6, wherein the device information acquired by the preprocessing module further comprises N bus interfaces PCIE corresponding to the first slot information, and the hot extraction device has N chips. The device function includes a chip function of each of the chips, and the N chips have a one-to-one correspondence with the N PCIEs, where N is an integer greater than 1;

The service management module is configured to invoke a service interface of the hot-pull device according to the device function acquired by the pre-processing module, and stop the service running on the service interface according to the first event information acquired by the heat treatment module. And means: calling a service interface of each of the chips according to a chip function of each of the PCIE corresponding chips, and stopping a service running on the invoked service interface according to the first event information;

The service management module is further configured to: after stopping the service running on the service interface, clear configuration information related to each of the chips according to a chip function of each PCIE corresponding chip.
The device heat treatment apparatus according to any one of claims 6 to 8, wherein the service management module is further configured to: after stopping the service running on the service interface, the first slot acquired according to the heat treatment module The bit information and the device function acquired by the service management module uninstall the driver related to the hot-plug device, and release the system resources occupied by the hot-plug device.
The apparatus heat treatment apparatus according to any one of claims 6 to 8, further comprising:

The heat treatment module is further configured to acquire second event information and a second slot information, wherein the second event information is a device performing a hot plug operation, wherein the hot plug device has at least one chip;

The pre-processing module is further configured to acquire a chip function of each chip in the hot-plug device and all PCIEs corresponding to the second slot information, and determine all the PCIEs and chips in the hot-plug device Corresponding relationship, wherein the PCIE has a one-to-one correspondence with the chip;

The heat processing module is further configured to allocate system resources and load drivers for each chip corresponding to the PCIE according to the correspondence determined by the preprocessing module;

The preprocessing module is further configured to update resource information and configuration information related to each of the chips according to the second event information acquired by the heat processing module;

The service management module is further configured to: according to the second event information acquired by the heat processing module, The chip function acquired by the pre-processing module initiates the business functions associated with each of the chips.