CN106980588A - A kind of equipment heat treatment method and device - Google Patents
A kind of equipment heat treatment method and device Download PDFInfo
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- CN106980588A CN106980588A CN201610031629.1A CN201610031629A CN106980588A CN 106980588 A CN106980588 A CN 106980588A CN 201610031629 A CN201610031629 A CN 201610031629A CN 106980588 A CN106980588 A CN 106980588A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
- G06F13/4081—Live connection to bus, e.g. hot-plugging
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
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Abstract
The invention discloses a kind of equipment heat treatment method and device.Equipment heat treatment method in the present invention includes：The first event information and the first groove position information are obtained, first event information is that equipment execution hot drawing goes out operation；According to the first event information and the first groove position information acquisition apparatus information, the facility information includes the functions of the equipments that hot drawing goes out equipment；Hot drawing is called to go out the business interface of equipment, and the business for stopping running on business interface according to the first event information according to functions of the equipments.The present invention is solved to be gone out in the processing procedure of operation by prior art progress hot drawing, the problem of related service of external equipment has been extracted due to being likely to occur still in the phenomenon of operation, and has caused hot plug system exception.
Description
Technical field
Go out the present invention relates to the hot drawing of hardware device and heat insertion technical field, espespecially a kind of equipment heat treatment
Method and apparatus.
Background technology
EBI (Peripheral Component Interface Express, referred to as：PCIE) conduct
A kind of local bus, (Central Processing Unit are referred to as overwhelming majority central processing unit at present：
CPU external equipment all) is connected by PCIE controllers, the PCIE controllers are used to carry out external equipment
Data transfer between CPU.
Hot plug is hot plugging, and warm connection function is exactly to allow user not closing system, do not cutting off electricity
Extracted in the case of source and change external equipment, so as to improve the recovery capability and autgmentability of system.Generally
Ground, local bus interface (Native PCIE) hot plug system of complete set needs the mutual of several respects
Coordinate, respectively hardware elements, firmware elements and software element；Wherein, hardware elements refer to that mainboard is total
Support in terms of the electrical characteristic of linear system system, firmware elements refer to the basic input output system of mainboard
(Basic Input Output System, referred to as：BIOS) support that must be provided hot plug, soft
Part element refers to that (Operating System are referred to as operating system：OS it is) comprehensive to be inserted using PCIE heat
The functional unit that must be provided is provided.The heat for having kernel for the software operation of hot plug in current OS is inserted
The communication mechanism (being referred to as uevent) of driving and kernel and user's space is pulled out, when producing hot plug events,
By uevent by reporting events to user, however, during by uevent reported events, having
Be likely to occur extracted external equipment associated drives it is deleted, and the related service of the external equipment
Actually still in the phenomenon of operation.
In summary, carry out hot drawing by prior art to go out in the processing procedure of operation, due to being likely to occur
The related service of external equipment has been extracted still in the phenomenon of operation, and has caused asking for hot plug system exception
Topic.
The content of the invention
In order to solve the above-mentioned technical problem, the invention provides a kind of equipment heat treatment method and device, with
Solve to go out in the processing procedure of operation by prior art progress hot drawing, outside has been extracted due to being likely to occur
The related service of equipment is still in the phenomenon of operation, and the problem of cause hot plug system exception.
In a first aspect, the present invention provides a kind of equipment heat treatment method, including：
The first event information and the first groove position information are obtained, first event information is that equipment performs hot drawing
Go out operation；
According to first event information and first groove position information acquisition apparatus information, the equipment letter
Breath includes the functions of the equipments that hot drawing goes out equipment；
The hot drawing is called to go out the business interface of equipment according to the functions of the equipments, and according to first thing
Part information stops the business being run on the business interface.
It is described to stop running on the business interface in the first possible implementation of first aspect
Business after, in addition to：
Device-dependent configuration information is gone out with the hot drawing according to functions of the equipments cleaning.
In second of possible implementation of first aspect, the facility information also includes described first
The corresponding N number of EBI PCIE of groove position information, the hot drawing, which goes out, has N number of chip, institute in equipment
Stating functions of the equipments includes the chip functions of each chip, N number of chip and N number of PCIE
For one-to-one relation, wherein, N is the integer more than 1；
It is described that the business interface that the hot drawing goes out equipment is called according to the functions of the equipments, and according to described
One event information stops the business being run on the business interface, including：
The business interface of each chip is called according to the chip functions of each PCIE correspondences chip,
And stop calling the business run on business interface according to first event information；
After the business for stopping running on the business interface, including：
According to the chip functions of each PCIE correspondences chip, cleaning is related to each chip
Configuration information.
According to any one in the first and second of possible implementation of first aspect, first aspect,
In the third possible implementation, after the business for stopping running on the business interface, also
Including：
Device-dependent drive is gone out with the hot drawing according to first groove position information and functions of the equipments unloading
Dynamic program, and discharge the system resource that the hot drawing goes out hold facility.
According to any one in the first and second of possible implementation of first aspect, first aspect,
In the 4th kind of possible implementation, in addition to：
Second event information and the second groove position information are obtained, the second event information is that equipment performs hot insert
Enter operation, wherein, there is at least one chip in heat insertion equipment；
Obtain the chip functions of each chip and second groove position information in the heat insertion equipment corresponding
Whole PCIE, and whole PCIE and the corresponding relation of the heat insertion equipment chips are determined, its
In, the PCIE is one-to-one relation with the chip；
According to identified corresponding relation is each corresponding chip distributing system resource of the PCIE and adds
Carry driving；
According to the second event information updating resource information related to each chip and with confidence
Breath；
Start the business related to each chip according to acquired second event information and chip functions
Function.
Second aspect, the present invention provides a kind of equipment annealing device, including：
Heat treatment module, for obtaining the first event information and the first groove position information, the first event letter
Cease and go out operation for equipment execution hot drawing；
Pretreatment module, for the first event information obtained according to the heat treatment module and the first groove position
Information acquisition apparatus information, the facility information includes the functions of the equipments that hot drawing goes out equipment；
Service management module, the functions of the equipments for being obtained according to the pretreatment module call the hot drawing
Go out the business interface of equipment, and the first event information obtained according to the heat treatment module stops the industry
The business run on business interface.
In the first possible implementation of second aspect, the service management module is additionally operable to
Stop after business that being run on the business interface, gone out according to functions of the equipments cleaning with the hot drawing
Device-dependent configuration information.
In second of possible implementation of second aspect, the equipment letter that the pretreatment module is obtained
Breath also includes the corresponding N number of EBI PCIE of first groove position information, and the hot drawing goes out in equipment
With N number of chip, the functions of the equipments include the chip functions of each chip, N number of chip
It is one-to-one relation with N number of PCIE, wherein, N is the integer more than 1；
The service management module, described in being called according to the functions of the equipments that the pretreatment module is obtained
Hot drawing goes out the business interface of equipment, and the first event information obtained according to the heat treatment module stops institute
The business run on business interface is stated, is referred to：According to the chip functions of each PCIE correspondences chip
The business interface of each chip is called, and calls business to connect according to first event information stopping
The business run on mouth；
The service management module, is additionally operable to after the business run on the business interface is stopped, root
According to the chip functions of each PCIE correspondence chip, cleaning it is related with each chip with confidence
Breath.
According to any one in the first and second of possible implementation of second aspect, second aspect,
In the third possible implementation, the service management module is additionally operable to connect in the stopping business
After the business run on mouth, the first groove position information and the business obtained according to the heat treatment module
The functions of the equipments unloading that management module is obtained goes out device-dependent driver with the hot drawing, and discharges institute
State the system resource that hot drawing goes out hold facility.
According to any one in the first and second of possible implementation of second aspect, second aspect,
In the 4th kind of possible implementation, the equipment annealing device also includes：
The heat treatment module, is additionally operable to obtain second event information and the second groove position information, described second
Event information is that equipment performs hot insertion operation, wherein, there is at least one chip in heat insertion equipment；
The pretreatment module, be additionally operable to obtain in the heat insertion equipment chip functions of each chip and
The corresponding whole PCIE of second groove position information, and determine that whole PCIE are set with the heat insertion
The corresponding relation of standby chips, wherein, the PCIE is one-to-one relation with the chip；
The heat treatment module, it is each institute to be additionally operable to according to the corresponding relation that the pretreatment module is determined
State the corresponding chip distributing system resources of PCIE and load driver；
The pretreatment module, is additionally operable to the second event information updating obtained according to the heat treatment module
The resource information related to each chip and configuration information；
The service management module, be additionally operable to according to the heat treatment module obtain second event information and
The chip functions that the pretreatment module is obtained start the business function related to each chip.
Equipment heat treatment method and device that the present invention is provided, the is obtained by going out operation to the hot drawing of equipment
After one event information and the first groove position information, according to first event information and the first groove position acquisition of information heat
The functions of the equipments of equipment are extracted, so that call the hot drawing to go out the business interface of equipment by the functions of the equipments,
And stop having called the business run on business interface according to the first event information；The embodiment of the present invention is provided
Equipment heat treatment method, when performing equipment hot drawing and going out to operate, realize and extracted in equipment and system
The uniformity of related service, goes out in the processing procedure of operation so as to solve and carry out hot drawing by prior art,
The related service of external equipment has been extracted due to being likely to occur still in the phenomenon of operation, and has caused hot plug
The problem of system exception.
Brief description of the drawings
Accompanying drawing is used for providing further understanding technical solution of the present invention, and constitutes one of specification
Point, it is used to explain technical scheme together with embodiments herein, does not constitute to the present invention
The limitation of technical scheme.
Fig. 1 is a kind of flow chart of equipment heat treatment method provided in an embodiment of the present invention；
Fig. 2 is the flow chart of another equipment heat treatment method provided in an embodiment of the present invention；
Fig. 3 is the flow chart of another equipment heat treatment method provided in an embodiment of the present invention；
Fig. 4 is a kind of structural representation of equipment annealing device provided in an embodiment of the present invention.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, below in conjunction with accompanying drawing
Embodiments of the invention are described in detail.It should be noted that in the case where not conflicting, this Shen
Please in embodiment and the feature in embodiment can mutually be combined.
The step of the flow of accompanying drawing is illustrated can such as one group computer executable instructions computer
Performed in system.And, although logical order is shown in flow charts, but in some cases,
Can be with the step shown or described by being performed different from order herein.
The evolution of PCIE specifications is briefly introduced first., peripheral parts interconnected special interest group in 1997
(Peripheral Component Interconnect Special Interest Group, referred to as：PCI SIG)
First PCI hot plug specification has been formulated, wherein, define platform, plate necessary to support hot plug
Card and software element.PCI SIG are proposed standard hot-plug controller specification (Standard Hot Swap
Controller specification, referred to as：SHPC SPEC), wherein, it specify that the mark of hot plug
Quasi- use pattern and strict register group requirement, and allow operating system provider specific in platform
Hot plug is provided outside software to support, hot plug standard formulation work has been gradually completing, into the complete of technology
Promote the stage in face.After 2002, Intel (Intel) assigns using hot plug as a kind of natural attribute
The PCIE specifications newly released.
Hardware elements, firmware elements and soft are needed for the PCIE hot plug systems described in background technology
The mutual cooperation of the aspect of part element three.Existing patent is improved in hardware elements and firmware elements,
Including：Number of patent application is CN201310400629, entitled《Resource allocation methods and system》；
Number of patent application is CN201210094722, entitled《It is a kind of real by CPLD or FPGA
The method of existing PCIE device hot plug》.Wherein, CN201310400629 is directed to the money in firmware elements
Source allocation strategy is improved, and CN201210094722 is carried out for the implementation method of hardware elements
Improve.However, for mentioned in background technology due to software element is brought the problem of, i.e., go out in hot drawing
Processing procedure in, the related service of external equipment has been extracted due to being likely to occur still in the phenomenon of operation,
And the problem of cause hot plug system exception, therefore, how to avoid hot plug system from occurring abnormal turning into mesh
The technical problem of preceding urgent need to resolve.
Technical scheme is described in detail below by specific embodiment, the present invention is following
It is that may be inserted into the groove position of terminal device or from end that hot drawing in each embodiment, which goes out equipment and heat insertion equipment,
The external equipment extracted in the groove position of end equipment, for example, can be network interface card, hard disk or external drive (Optical
Disk Driver, referred to as：ODD) etc., its can be based on a certain item technical field or
Include the content of multinomial technical field.The present invention provides following specific embodiment and can be combined with each other,
It may be repeated no more for same or analogous concept or process in some embodiments.
Fig. 1 is a kind of flow chart of equipment heat treatment method provided in an embodiment of the present invention.The present embodiment is carried
In the case of the external equipment progress hot drawing that the equipment heat treatment method of confession is applied to heat treatment system goes out,
This method can be performed by equipment annealing device, and the equipment annealing device is combined by hardware and software
Mode realize that the device can be integrated in the processor of terminal device, call and use for processor.
As shown in figure 1, the method for the present embodiment can include：
S110, obtains the first event information and the first groove position information, and first event information performs for equipment
Hot drawing goes out operation.
In the equipment heat treatment method that various embodiments of the present invention are provided, the hot drawing of equipment goes out operation or heat insertion
Operation corresponds to the operation that the groove position of a certain terminal device is performed, in the specific implementation, on terminal device
Entity button can be provided with, user triggers hot plug events by pressing or ejecting the button, and terminal is set
It is standby to carry out analysis to the operation of button and parse current button operating corresponding event type, can be with
Know that current button operates corresponding event type by preset rule, the event type generally includes to set
Standby heat insertion or equipment hot drawing go out；For example, when the user's control button is ejection state, getting
First event information is that hot drawing goes out from groove position with the equipment in the button corresponding groove position, meanwhile, terminal
Equipment can get the groove position information that current hot drawing goes out operation, you can know current event type and correlation
Groove position information.The information got after user operates to button in the present embodiment is：First groove position
In equipment perform hot drawing go out operation.
S120, according to the first event information and the first groove position information acquisition apparatus information, the facility information bag
Include the functions of the equipments that hot drawing goes out equipment.
, can be further according to the first groove position for the hot drawing outgoing event information obtained in embodiment
Information parses and the functions of the equipments of equipment has been extracted in the first groove position, and the functions of the equipments are generally and device type
Correspondence, if for example, equipment is network interface card, its functions of the equipments connects to provide wireless network；If equipment is hard
Disk, its functions of the equipments are offer and the data interaction of external equipment；If equipment is ODD, its functions of the equipments
To provide with digital versatile disc, (Digital Versatile Disc are referred to as：DVD data interaction).
It should be noted that the groove position in various embodiments of the present invention inserts equipment or hot drawing with heat and goes out equipment and is
It is only capable of inserting an equipment in the one-to-one groove position of relation, i.e., one；In addition, the present embodiment is not limited
The functions of the equipments of each equipment are made, it can be the equipment of simple function or with multiple functions
Equipment, the functions of the equipments of each equipment are for example related to the number of chips having in equipment.
S130, calls hot drawing to go out the business interface of equipment according to functions of the equipments, and according to first event
Information stops the business being run on the business interface.
The purpose for the equipment heat treatment method that the present embodiment is provided is to solve asking for hot plug system exception
Topic, i.e., after execution equipment hot drawing goes out operation, can stop having extracted the corresponding service of equipment, to keep
The uniformity of external equipment and operation program in hot plug system；In the specific implementation, terminal device can be with
Go out the functions of the equipments of equipment according to hot drawing, call the business interface related to the functions of the equipments, that is, extracted
The business interface of equipment, and because known first event information is hot drawing outgoing event, then can stop institute
Call the business run on business interface.It is apparent that the method that the present embodiment is provided, can effectively keep away
Exempt from hot drawing to go out during operation, due to having extracted the related service of the equipment still system caused by operation
It is abnormal, it is a kind of safer heat treatment mode, and this method can control realization by software, just
Operated in user.
The equipment heat treatment method that the present embodiment is provided, goes out operation by the hot drawing to equipment and obtains first
After event information and the first groove position information, according to first event information and the position acquisition of information hot drawing of the first groove
Go out the functions of the equipments of equipment, so that call the hot drawing to go out the business interface of equipment by the functions of the equipments,
And stop having called the business run on business interface according to the first event information；What the present embodiment was provided sets
Standby heat treatment method, when performing equipment hot drawing and going out to operate, realizes that to have extracted equipment related to system
The uniformity of business, goes out in the processing procedure of operation so as to solve and carry out hot drawing by prior art, by
In being likely to occur the related service for having extracted external equipment still in the phenomenon of operation, and cause hot plug system
The problem of system is abnormal.
Further, the equipment heat treatment method that the present embodiment is provided, runs on business interface is stopped
After business, i.e., after S130, in addition to：S140, goes out to set according to functions of the equipments cleaning with hot drawing
Standby related configuration information.In the present embodiment, equipment has been extracted, and be stopped and extracted equipment
Related service, however, the business of above-mentioned stopping usually requires to carry out business configuration in normal operation, i.e.,
It is stored with terminal device and has stopped the configuration information of business, at this point it is possible to which further cleaning goes out with hot drawing
Device-dependent configuration information, so that the storage resource of terminal device is discharged, while improving terminal device
Performance.
The present embodiment is in the specific implementation, terminal device generally can be according to functions of the equipments to each and hot drawing
Go out device-dependent business process dispatch messages, completed by the business process for receiving message for functions of the equipments
Related business processing, such as the above-mentioned processing for understanding configuration information can also be the industry such as switch between master and slave machines
Business is handled.
Alternatively, Fig. 2 is the flow chart of another equipment heat treatment method provided in an embodiment of the present invention.
Facility information in the present embodiment also includes the corresponding N number of PCIE of the first groove position information, and hot drawing goes out
There can be N number of chip in equipment, correspondingly, functions of the equipments include the chip functions of each chip, N
Individual chip is one-to-one relation with N number of PCIE, wherein, N is the integer more than 1, the present invention
In the case that each embodiment is multiple in the corresponding PCIE in groove position, and equipment has multiple chips, tool
Body is explained so that N is 2 as an example.
The present embodiment is on the basis of method shown in above-mentioned Fig. 1, and S130 could alternatively be：According to each
The chip functions of PCIE correspondence chips call the business interface of each chip, and are stopped according to the first event information
The business only run on called business interface；Correspondingly, S140 could alternatively be：According to each PCIE
The chip functions of correspondence chip, clear up the configuration information related to each chip.It should be noted that this
Embodiment in the specific implementation, the business related to each chip can be stopped successively, and successively cleaning with
The related configuration information of each chip, aforesaid operations can also be performed simultaneously.
Further, the above embodiment of the present invention provide method after S130, in addition to：S150,
Device-dependent driver is gone out with hot drawing according to the first groove position information and functions of the equipments unloading, and discharges heat
Extract the system resource of hold facility.In the present embodiment, because equipment has been extracted, i.e., set with having extracted
Standby corresponding driver is the idle driver in system, then can be entered by unloading driver
One step improves the systematic function of terminal device, while the system resource extracted shared by equipment can be discharged,
For example discharging hold facility CPU address resource, i.e. input and output, (Input/Output is referred to as：
IO)MEM。
The present embodiment is in the specific implementation, no matter hot drawing, which goes out, has several chips in equipment, due to needing to unload
Carry and go out the driver that all chips are related in equipment to hot drawing, and the chip gone out in equipment due to hot drawing
It is one-to-one relation with the PCIE in the information of the first groove position, you can so that the first groove position information to be changed
To go out the one-to-one PCIE of equipment chips with hot drawing, so that by traveling through all be converted to
PCIE unloads driver and free system resources.In addition, the various embodiments described above of the present invention are in execution
State after each operating procedure, can also be lower to the first groove position electric, and in the graphic user interface of terminal device
(Graphical User Interface, referred to as：GUI display processing result on).
It should be noted that the S150 in the present embodiment is the further processing scheme after stopping business,
Be conducive to improving the scheme integrality of heat treatment method, S150 can be performed after S130,
It can be performed after S140；In addition, when hot drawing goes out and has multiple chips in equipment, can be with
S130~S150 is performed successively for each chip, can also perform S130~S150 simultaneously to all chips,
It may be arranged as other implementation procedures.
The various embodiments described above are that the improvement in software element is carried out for hot drawing outgoing event, in order to ensure heat
The integrality of processing scheme, and improve to having the processing mode of more than one chip in heat insertion equipment,
There is provided the specific implementation for hot insertion event in the basis of the various embodiments described above by the present invention.Tool
Body, Fig. 3 is the flow chart of another equipment heat treatment method provided in an embodiment of the present invention, this implementation
The method that example is provided also includes：
S210, obtains second event information and the second groove position information, and the second event information performs for equipment
Hot insertion operation, wherein, there is at least one chip in heat insertion equipment.
The specific implementation of S210 in the present embodiment is referred to the S110 in above-described embodiment, and
And terminal device again may be by operation of the user to entity button and obtain second event information, for example originally
When the user's control button in embodiment is pressed state, the second event information got is equipment heat
Insertion and the button corresponding groove position, meanwhile, terminal device can get the groove position of current hot insertion operation
Information, you can know current event type and related groove position information.User enters to button in the present embodiment
The information that gets is after row operation：Equipment performs the operation in heat the second groove of insertion position, now can be with
Groove position is powered up.It should be noted that same as the previously described embodiments, the execution heat insertion in the present embodiment
Chip in the equipment of operation can be one or more.
S220, obtains the chip functions of each chip and the second groove position information in heat insertion equipment corresponding complete
Portion PCIE, and whole PCIE and the corresponding relation of heat insertion equipment chips are determined, wherein, PCIE
It is one-to-one relation with chip.
The present embodiment is explained so that heat insertion equipment has at least two chips as an example, groove position and heat insertion
Equipment is one-to-one, and the PCIE in chip and the second groove position in heat insertion equipment is one-to-one corresponding
, the present embodiment is each again by PCIE traversals heat insertion equipment corresponding with the second groove position information
Chip, therefore, before corresponding business processing is carried out to heat insertion equipment, it is thus necessary to determine that PCIE with
The corresponding relation of chip.
For example, there is two chips, respectively chip A and chip B in heat insertion equipment, this sets
Also there are two PCIE ports, PCIE ports A and PCIE ports B in the groove position of standby insertion, now,
It can determine that chip and the corresponding relation of PCIE ports are：Chip A links PCIE port A, core
Piece B link PCIE port B.
S230, according to identified corresponding relation be the corresponding chip distributing system resources of each PCIE and
Load driver.
S240, according to the second event information updating resource information related to each chip and configuration information.
S250, the industry related to each chip is started according to acquired second event information and chip functions
Business function.
It should be noted that the present embodiment collects heat insertion equipment chips and insertion groove is determined
After PCIE corresponding relation, it again may be by traveling through place of each PCIE ports execution to each chip
Process content in reason, i.e. S230~S250；For example S230~S250 can be performed to each chip successively,
S230~S250 can also be performed simultaneously to whole chips, as long as can be achieved on to every in heat insertion equipment
Individual chip is carried out between aforesaid operations.
It should also be noted that, heat insertion equipment can be each shown in above-mentioned Fig. 1 and Fig. 2 in the present embodiment
Hot drawing goes out in embodiment equipment or different external equipments, and carried performing the present embodiment
After the method for confession, hot drawing further can also be performed to the equipment and gone out；And in the present embodiment
S110~S150 in S210~S250 and the various embodiments described above does not have clear and definite sequencing, can be pair
Same groove position different time sections perform or different slots position performed in the same period,
Therefore, execution step S210~S250 of heat insertion is only shown in Fig. 3, may be performed before S210
S110~S150, may also perform S110~S150 after S250.
Fig. 4 is a kind of structural representation of equipment annealing device provided in an embodiment of the present invention.This implementation
The equipment annealing device that example is provided is applied to carry out the external equipment of heat treatment system the situation that hot drawing goes out
In, the equipment annealing device can be realized by way of hardware and software is combined, and the device can be with
It is integrated in the processor of terminal device, calls and use for processor.As shown in figure 4, the present embodiment is carried
The tunnel traffic control device of confession is specifically included：Heat treatment module 11, pretreatment module 12 and business pipe
Manage module 13.
Wherein, heat treatment module 11, for obtaining the first event information and the first groove position information, this first
Event information is that equipment execution hot drawing goes out operation.
In equipment annealing device provided in an embodiment of the present invention, the hot drawing of equipment goes out operation or heat insertion behaviour
The operation that the groove position of a certain terminal device is performed is corresponded to, again may be by setting on terminal device
The state change of entity button go out or hot insertion event to recognize hot drawing, specific implementation and above-mentioned reality
Apply identical in example, therefore will not be repeated here.The module is additionally operable to complete the power-on and power-off to groove position.
Pretreatment module 12, for the first event information and the first groove obtained according to heat treatment module 11
Position information acquisition apparatus information, the facility information includes the functions of the equipments that hot drawing goes out equipment.
The present embodiment is in the specific implementation, pretreatment module 12, which can receive heat treatment module 11, sends heat
Request is extracted, the hot drawing goes out in request to carry above-mentioned first event information and the first groove position information, so that
Parse the function type that hot drawing goes out equipment.
It should be noted that the groove position in various embodiments of the present invention inserts equipment or hot drawing with heat and goes out equipment and is
It is only capable of inserting an equipment in the one-to-one groove position of relation, i.e., one；In addition, the present embodiment is not limited
The functions of the equipments of each equipment are made, it can be the equipment of simple function or with multiple functions
Equipment, the functions of the equipments of each equipment are for example related to the number of chips having in equipment.
Service management module 13, the functions of the equipments for being obtained according to pretreatment module 12 call hot drawing to go out
The business interface of equipment, and stopped according to the first event information of the acquisition of heat treatment module 11 on business interface
The business of operation.
Equipment annealing device provided in an embodiment of the present invention, can go out the functions of the equipments of equipment according to hot drawing,
The business interface related to the functions of the equipments is called, that is, has extracted the business interface of equipment, and due to
It is hot drawing outgoing event to know the first event information, then can stop the business being run on called business interface.
Further, the service management module 13 in the present embodiment, is additionally operable to transport on business interface is stopped
After capable business, device-dependent configuration information is gone out with hot drawing according to functions of the equipments cleaning.The module is led to
Cross cleaning and go out device-dependent configuration information with hot drawing, realize the effect of the storage resource of release terminal device
Really, while improving the performance of terminal device.
Equipment annealing device provided in an embodiment of the present invention is carried for performing embodiment illustrated in fig. 1 of the present invention
The equipment heat treatment method of confession, possesses corresponding functional module, and its implementing principle and technical effect is similar,
Here is omitted.
Alternatively, in the equipment annealing device that the present embodiment is provided, the equipment that pretreatment module 12 is obtained
Information also includes the corresponding N number of PCIE of the first groove position information, and hot drawing goes out to have N number of core in equipment
Piece, correspondingly, functions of the equipments include the chip functions of each chip, and N number of chip is with N number of PCIE
One-to-one relation, wherein, N is the integer more than 1, and various embodiments of the present invention are corresponding in groove position
In the case that PCIE is multiple, and equipment has multiple chips, specifically said so that N is 2 as an example
It is bright.
The specific implementation of the present embodiment is：Service management module 13 in above-mentioned embodiment illustrated in fig. 4,
Functions of the equipments for being obtained according to pretreatment module 12 call hot drawing to go out the business interface of equipment, and according to
The first event information that heat treatment module 11 is obtained stops the business being run on business interface, refers to：According to
The chip functions of each PCIE correspondences chip call the business interface of each chip, and according to the first event
Information stops calling the business run on business interface；Correspondingly, run on business interface is stopped
After business, service management module 13, specifically for clearing up the configuration information related to each chip.
Further, in the device that the above embodiment of the present invention is provided, service management module 13 is additionally operable to
On business interface is stopped after business that running, according to heat treatment module 11 obtain the first groove position information and
The functions of the equipments unloading that pretreatment module 12 is obtained goes out device-dependent driver with hot drawing, and discharges heat
Extract the system resource of hold facility.
Equipment annealing device provided in an embodiment of the present invention is carried for performing embodiment illustrated in fig. 2 of the present invention
The equipment heat treatment method of confession, possesses corresponding functional module, and its implementing principle and technical effect is similar,
Here is omitted.
The various embodiments described above are that the improvement in software element is carried out for hot drawing outgoing event, in order to ensure heat
The integrality of processing scheme, and improve to having the processing mode of more than one chip in heat insertion equipment,
There is provided the specific implementation for hot insertion event in the basis of the various embodiments described above by the present invention.
Each Implement of Function Module of equipment annealing device shown in above-mentioned Fig. 4 is again may be by, specifically,
Heat treatment module 11, is additionally operable to obtain second event information and the second groove position information, the second event information
Hot-plug operation is performed for equipment, wherein, there is at least one chip in heat insertion equipment.In the present embodiment
Second event information be：Equipment performs the operation in heat the second groove of insertion position, now can also be to groove position
Power-up.It should be noted that same as the previously described embodiments, the hot insertion operation of execution in the present embodiment
Chip in equipment can be one or more.
Pretreatment module 12, is additionally operable to obtain the chip functions and the second groove of each chip in heat insertion equipment
The corresponding whole PCIE of position information, and determine that whole PCIE insert the corresponding relation of equipment chips with heat,
Wherein, PCIE and chip are one-to-one relation.
With the various embodiments described above identical, groove position in the present embodiment be with heat insertion equipment it is one-to-one,
The PCIE in chip and the second groove position in heat insertion equipment is one-to-one.
Heat treatment module 11, it is each PCIE to be additionally operable to according to the corresponding relation that pretreatment module 12 is determined
Corresponding chip distributing system resource and load driver.
In the present embodiment, pretreatment module 12, can be by each PCIE after corresponding relation is determined
Port information passes to heat treatment module 11, by heat treatment module 11 is chip distributing system resource and adds
Carry driving.
Pretreatment module 12, be additionally operable to according to heat treatment module 11 obtain second event information updating with
The related resource information of each chip and configuration information.
Service management module 13, is additionally operable to the second event information that is obtained according to heat treatment module 11 and pre-
The chip functions that processing module 12 is obtained start the business function related to each chip.
It should be noted that the present embodiment collects heat insertion equipment chips and insertion groove is determined
After PCIE corresponding relation, it again may be by traveling through place of each PCIE ports execution to each chip
Reason, that is, perform the above-mentioned process content related to hot insertion；For example each chip can be performed successively
Processing mode is stated, above-mentioned processing mode can also be performed simultaneously to whole chips, as long as can be achieved on pair
Each chip is carried out between aforesaid operations in heat insertion equipment.
It should also be noted that, heat insertion equipment can go out in above-described embodiment in hot drawing in the present embodiment
Equipment or different external equipments, and after the method that the present embodiment is provided is performed, may be used also
Gone out with further performing hot drawing to the equipment.
Equipment annealing device provided in an embodiment of the present invention is carried for performing embodiment illustrated in fig. 3 of the present invention
The equipment heat treatment method of confession, possesses corresponding functional module, and its implementing principle and technical effect is similar,
Here is omitted.
Although disclosed herein embodiment as above, described content is only to readily appreciate the present invention
And the embodiment used, it is not limited to the present invention.Technology people in any art of the present invention
Member, do not depart from disclosed herein spirit and scope on the premise of, can be in the form of implementation and thin
Any modification and change, but the scope of patent protection of the present invention are carried out on section, still must be with appended right
The scope that claim is defined is defined.
Claims (10)
1. a kind of equipment heat treatment method, it is characterised in that including：
The first event information and the first groove position information are obtained, first event information is that equipment performs hot drawing
Go out operation；
According to first event information and first groove position information acquisition apparatus information, the equipment letter
Breath includes the functions of the equipments that hot drawing goes out equipment；
The hot drawing is called to go out the business interface of equipment according to the functions of the equipments, and according to first thing
Part information stops the business being run on the business interface.
2. equipment heat treatment method according to claim 1, it is characterised in that described in the stopping
After the business run on business interface, in addition to：
Device-dependent configuration information is gone out with the hot drawing according to functions of the equipments cleaning.
3. equipment heat treatment method according to claim 1, it is characterised in that the facility information
Also include the corresponding N number of EBI PCIE of first groove position information, the hot drawing, which goes out in equipment, to be had
N number of chip, the functions of the equipments include the chip functions of each chip, N number of chip and institute
N number of PCIE is stated for one-to-one relation, wherein, N is the integer more than 1；
It is described that the business interface that the hot drawing goes out equipment is called according to the functions of the equipments, and according to described
One event information stops the business being run on the business interface, including：
The business interface of each chip is called according to the chip functions of each PCIE correspondences chip,
And stop calling the business run on business interface according to first event information；
After the business for stopping running on the business interface, including：
According to the chip functions of each PCIE correspondence chip, cleaning with each the chip is related matches somebody with somebody
Confidence ceases.
4. according to equipment heat treatment method according to any one of claims 1 to 3, it is characterised in that institute
After stating the business for stopping being run on the business interface, in addition to：
Device-dependent drive is gone out with the hot drawing according to first groove position information and functions of the equipments unloading
Dynamic program, and discharge the system resource that the hot drawing goes out hold facility.
5. according to equipment heat treatment method according to any one of claims 1 to 3, it is characterised in that also
Including：
Second event information and the second groove position information are obtained, the second event information is that equipment performs hot insert
Enter operation, wherein, there is at least one chip in heat insertion equipment；
Obtain the chip functions of each chip and second groove position information in the heat insertion equipment corresponding
Whole PCIE, and whole PCIE and the corresponding relation of the heat insertion equipment chips are determined, its
In, the PCIE is one-to-one relation with the chip；
According to identified corresponding relation is each corresponding chip distributing system resource of the PCIE and adds
Carry driving；
According to the second event information updating resource information related to each chip and with confidence
Breath；
Start the business related to each chip according to acquired second event information and chip functions
Function.
6. a kind of equipment annealing device, it is characterised in that including：
Heat treatment module, for obtaining the first event information and the first groove position information, the first event letter
Cease and go out operation for equipment execution hot drawing；
Pretreatment module, for the first event information obtained according to the heat treatment module and the first groove position
Information acquisition apparatus information, the facility information includes the functions of the equipments that hot drawing goes out equipment；
Service management module, the functions of the equipments for being obtained according to the pretreatment module call the hot drawing
Go out the business interface of equipment, and the first event information obtained according to the heat treatment module stops the industry
The business run on business interface.
7. equipment annealing device according to claim 6, it is characterised in that the service management
Module, is additionally operable to after the business run on the business interface is stopped, clear according to the functions of the equipments
Reason goes out device-dependent configuration information with the hot drawing.
8. equipment annealing device according to claim 6, it is characterised in that the pretreatment mould
The facility information that block is obtained is described also including the corresponding N number of EBI PCIE of first groove position information
Hot drawing, which goes out, has N number of chip in equipment, the functions of the equipments include the chip functions of each chip,
N number of chip is one-to-one relation with N number of PCIE, wherein, N is whole more than 1
Number；
The service management module, described in being called according to the functions of the equipments that the pretreatment module is obtained
Hot drawing goes out the business interface of equipment, and the first event information obtained according to the heat treatment module stops institute
The business run on business interface is stated, is referred to：Adjusted according to the chip functions of each PCIE correspondences chip
With the business interface of each chip, and stopped according to first event information calling business interface
The business of upper operation；
The service management module, is additionally operable to after the business run on the business interface is stopped, root
According to the chip functions of each PCIE correspondence chip, cleaning it is related with each chip with confidence
Breath.
9. the equipment annealing device according to any one of claim 6~8, it is characterised in that institute
Service management module is stated, is additionally operable to after the business run on the business interface is stopped, according to described
Heat treatment module obtain the first groove position information and the service management module obtain functions of the equipments unloading with
The hot drawing goes out device-dependent driver, and discharges the system resource that the hot drawing goes out hold facility.
10. the equipment annealing device according to any one of claim 6~8, it is characterised in that
Also include：
The heat treatment module, is additionally operable to obtain second event information and the second groove position information, described second
Event information is that equipment performs hot insertion operation, wherein, there is at least one chip in heat insertion equipment；
The pretreatment module, be additionally operable to obtain in the heat insertion equipment chip functions of each chip and
The corresponding whole PCIE of second groove position information, and determine that whole PCIE are set with the heat insertion
The corresponding relation of standby chips, wherein, the PCIE is one-to-one relation with the chip；
The heat treatment module, it is each institute to be additionally operable to according to the corresponding relation that the pretreatment module is determined
State the corresponding chip distributing system resources of PCIE and load driver；
The pretreatment module, is additionally operable to the second event information updating obtained according to the heat treatment module
The resource information related to each chip and configuration information；
The service management module, be additionally operable to according to the heat treatment module obtain second event information and
The chip functions that the pretreatment module is obtained start the business function related to each chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610031629.1A CN106980588A (en) | 2016-01-18 | 2016-01-18 | A kind of equipment heat treatment method and device |
| PCT/CN2017/000072 WO2017124918A1 (en) | 2016-01-18 | 2017-01-03 | Hot-processing method and device for apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610031629.1A CN106980588A (en) | 2016-01-18 | 2016-01-18 | A kind of equipment heat treatment method and device |
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| CN106980588A true CN106980588A (en) | 2017-07-25 |
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| CN201610031629.1A Pending CN106980588A (en) | 2016-01-18 | 2016-01-18 | A kind of equipment heat treatment method and device |
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| CN (1) | CN106980588A (en) |
| WO (1) | WO2017124918A1 (en) |
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| CN111124970A (en) * | 2018-10-31 | 2020-05-08 | 杭州海康威视数字技术股份有限公司 | Daughter board hot plug method and device |
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