WO2017118385A1 - Bâti secondaire à trois couches, planche unique et système de dissipation de chaleur - Google Patents

Bâti secondaire à trois couches, planche unique et système de dissipation de chaleur Download PDF

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Publication number
WO2017118385A1
WO2017118385A1 PCT/CN2017/070169 CN2017070169W WO2017118385A1 WO 2017118385 A1 WO2017118385 A1 WO 2017118385A1 CN 2017070169 W CN2017070169 W CN 2017070169W WO 2017118385 A1 WO2017118385 A1 WO 2017118385A1
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WO
WIPO (PCT)
Prior art keywords
subrack
board
heat dissipation
layer
veneer
Prior art date
Application number
PCT/CN2017/070169
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English (en)
Chinese (zh)
Inventor
叶兵
关童童
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2017118385A1 publication Critical patent/WO2017118385A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection

Definitions

  • the embodiments of the present invention relate to the field of communications, and in particular, to a three-layer subrack, a single board, and a heat dissipation system.
  • FIG. 1 a common single-sided three-layer heat dissipation air channel design is shown, in which a plurality of service boards are vertically inserted in the upper and lower layers, and a plurality of cross boards are inserted horizontally in the middle layer, the upper service boards are inserted, and the lower service boards are inverted.
  • the upper and lower backplane high-speed connectors of the upper and lower layers are as close as possible to the cross-board, and the upper, middle and lower sub-frame air passages are relatively independent and do not affect each other.
  • the sub-rack structure of the single-sided three-layer heat dissipation air duct is shown.
  • the upper and lower layers of the sub-frame are completely separated from the middle layer by the partition plate, so that the three-layer air passage of the sub-frame is relatively independent and does not affect each other;
  • the heat dissipation condition of the single board is good, because there is a 2U air supply hole between the upper layer, the lower layer and the middle layer of the subrack, the backplane of the service board and the cross board is connected at a high speed. Relatively more than 2U of space distance, for reducing backplane routing, reducing link loss is not good.
  • the embodiments of the present invention provide a three-layer subrack, a single board, and a heat dissipation system, so as to at least solve the problem of large link loss caused by the long trace of the backplane of the related technology board.
  • a three-layer subrack including an upper subrack 30, a middle subrack 31, a lower subrack 32, and the upper subrack 30 and the middle subrack 31.
  • the lower layer of the heat dissipation air holes 34 has a height of 0 to 1 U.
  • the upper subrack 30 is used for fixing the first single board, wherein the first board fixed on the upper subrack 30
  • the first board has a first air-filling hole having a height of 2 U, and the first air-filling hole is disposed on a side of the first board adjacent to the middle layer sub-frame 31, and the first single board
  • a board connector 41 is also disposed on a side of the first board adjacent to the middle subrack 31.
  • the upper subrack 30 is used for fixing the first single board, wherein the first one fixed on the upper subrack 30 is
  • the first board has a first air-filling hole having a height of 1 U, and the first air-filling hole is disposed on a side of the first board adjacent to the middle layer sub-frame 31, and the first single board A board connector 41 is also disposed on a side of the first board adjacent to the middle subrack 31.
  • the lower subrack 32 is used to fix the second veneer, wherein the second layer is fixed on the lower subrack 32.
  • the single board has a second air-filling hole having a height of 2 U, and the second air-filling hole is disposed on a side of the second board adjacent to the middle layer sub-frame 31, and the second single board is second.
  • a board connector 41 is also disposed on a side of the second board adjacent to the middle subrack 31.
  • the lower subrack 32 is used to fix the second veneer, wherein the second frame is fixed on the lower subrack 32.
  • the veneer has a second air-filling hole having a height of 1 U, the second air-filling hole is disposed on a side of the second veneer adjacent to the middle sub-frame 31, and the second veneer A board connector 41 is also disposed on a side of the second board adjacent to the middle subrack 31.
  • the three-layer subrack is a single-sided sub-frame or a double-sided sub-frame.
  • a board for the above-mentioned three-layer subrack, which includes a device area 40 and a single board connector 41, and the board further includes: a supplemental air hole, wherein The air-filling hole is disposed on a lower side of the device region 40, and the height of the air-filling hole is 2U to 1U; the single-board connector 41 is connected to the device region 40, and is disposed on the air supply The hole and/or the right side of the device region 40.
  • the height of the air filling hole is 2U.
  • the air filling hole has a height of 1 U.
  • a heat dissipation system comprising: the above three-layer subrack, and the first single board and/or the second single board, wherein the first The veneer and/or the second veneer are the veneers described above.
  • a three-layer subrack including an upper subrack 30, a middle subrack 31, a lower subrack 32, and an upper heat dissipation air hole 33 disposed between the upper subrack 30 and the middle subrack 31.
  • a lower heat dissipation air hole 34 disposed between the middle subrack 31 and the lower subrack 32, the height of the upper heat dissipation air hole 33 is 0 to 1 U, and/or the height of the lower heat dissipation air hole 34 is 0 to 1 U,
  • the problem of large link loss caused by the long trace of the backplane of the board shortens the backplane trace of the board and reduces link loss.
  • FIG. 1 is a schematic structural view of a heat dissipation air passage based on a single-sided subrack according to the related art
  • FIG. 2 is a schematic structural view of a single-sided subrack according to the related art
  • FIG. 3 is a schematic structural view of a three-layer subrack according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a single board according to an embodiment of the present invention.
  • FIG. 5 is a first schematic diagram of a heat dissipation air passage structure based on a single-sided subrack according to an alternative embodiment of the present invention
  • FIG. 6 is a second schematic diagram of a heat dissipation air passage structure based on a single-sided subrack according to an alternative embodiment of the present invention
  • FIG. 7 is a schematic structural view 1 of a heat dissipation air passage based on a double-sided subrack according to an alternative embodiment of the present invention
  • FIG. 8 is a second schematic diagram of a heat dissipation air passage structure based on a double-sided subrack according to an alternative embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a three-layer subrack according to an embodiment of the present invention.
  • the three-layer subrack includes: an upper subrack 30 and a middle layer. a subrack 31, a lower subrack 32, an upper heat dissipation air hole 33 disposed between the upper subrack 30 and the middle subrack 31, and a lower heat dissipation air hole 34 disposed between the middle subrack 31 and the lower subrack 32, among them,
  • the height of the upper heat dissipation air holes 33 is 0 to 1 U, and/or the height of the lower heat dissipation air holes 34 is 0 to 1 U.
  • the above-mentioned three-layer subrack solves the problem of large link loss caused by the long trace of the backplane of the board, shortens the backplane trace of the board, and reduces link loss.
  • the total height of the subrack is still a subrack of the same height of the related art, for example, a 42U subrack.
  • the upper heat dissipation air hole 33 or the lower heat dissipation air hole 34 is lowered in height, and accordingly, the upper subrack 30 or the lower subrack 32 is increased in height.
  • the increased height of the upper subrack 30 or the lower subrack 32 can be used to set the air supply holes of the single board, thereby ensuring that the overall heat dissipation effect of the subrack remains substantially unchanged.
  • the upper subrack 30 is used to fix the first veneer, wherein the first veneer fixed on the upper subrack 30 has the first compensation of 2 U in height.
  • the air hole, the first air hole is disposed on a side of the first board adjacent to the middle subrack 31, and the first board connector 41 of the first board is also disposed on the first board near the middle subrack 31. One side.
  • the upper subrack 30 is used to fix the first veneer, wherein the first veneer fixed on the upper subrack 30 has the first compensation of 1 U in height.
  • a wind hole the first air hole is disposed on a side of the first board adjacent to the middle subrack 31, and the first board connector 41 of the first board is also disposed on the first board near the middle layer One side of the frame 31.
  • the lower subrack 32 is used to fix the second veneer, wherein the second veneer fixed on the lower subrack 32 has a second complement having a height of 2 U.
  • the air hole, the second air hole is disposed on a side of the second board adjacent to the middle subrack 31, and the second board connector 41 of the second board is also disposed on the second board near the middle subrack 31.
  • the lower subrack 32 is used to fix the second veneer, wherein the second veneer fixed on the lower subrack 32 has a second complement having a height of 1 U.
  • the air hole, the second air hole is disposed on a side of the second board adjacent to the middle subrack 31, and the second board connector 41 of the second board is also disposed on the second board near the middle subrack 31.
  • the three-layer subrack described above may be a single-sided subrack or a double-sided subrack.
  • a single board applied to the above three-layer subrack is also provided in this embodiment.
  • 4 is a schematic structural diagram of a single board according to an embodiment of the present invention. As shown in FIG. 4, the board includes: a device area 40 and a single board connector 41. The board further includes: a wind filling hole 42 The hole 42 is disposed on the lower side of the device region 40, and the height of the air-filling hole 42 is 2U to 1U; the single-plate connector 41 is connected to the device region 40 and disposed on the right side of the air-filling hole 42 and/or the device region 40.
  • the board provided in this embodiment solves the problem of large link loss caused by the long cable length of the backplane of the board, shortens the backplane routing of the board, and reduces the link loss.
  • the heat dissipation performance of the subrack solves the problem of large link loss caused by the long cable length of the backplane of the board, shortens the backplane routing of the board, and reduces the link loss.
  • the height of the air filling hole 42 is 2U.
  • the height of the air filling hole 42 is 1U.
  • a heat dissipation system is further provided in the embodiment, comprising: the above three-layer subrack, and the first veneer inserted into the upper subrack 30 and/or the second veneer inserted into the lower subrack 32, wherein A single board and/or a second board is a single board applied to the above three-layer subrack.
  • An alternative embodiment of the present invention provides a heat dissipation air channel, which can be applied to data exchange devices of optical communication technologies such as OTN and PTN.
  • a data communication device based on an optical communication technology such as an OTN or a PTN generally includes a plurality of service boards (a single board) and a plurality of cross boards.
  • the service board establishes a data link with the cross board through a high-speed interconnect line on the backplane.
  • the belt-shaped sub-frame structure is used to form a special heat dissipation air channel, which can ensure the high-speed trace length of the back board as much as possible under the premise of good heat dissipation of the board, reduce link loss, and make the device have relatively good signal characteristics and Cross capacity.
  • an alternative embodiment of the present invention provides a heat dissipation air channel scheme to reduce the spatial distance between the service board and the cross board on a related basis, which is advantageous for shortening the high-speed line length of the back board and reducing the link. loss.
  • FIG. 5 Compared with the one-sided sub-rack heat dissipation air channel design shown in FIG. 1 , other dimensions and structures are not changed on the sub-rack structure, and the upper and lower slot heights of the sub-frame and the service board panel portion are improved.
  • Figure The guide rails of the service board slots shown in the figure extend 1U to the cross-board area, so that the service board size is relatively increased by 1U.
  • a 1U air-filling hole is left in the upper part of the service board panel, so that the high-speed connector of the lower board of the service board is relatively closer to the cross-board, and the space between the upper and lower layers of the sub-rack is reduced by 1U, which shortens the backplane.
  • High-speed trace length is beneficial for reducing losses.
  • the height of the air inlet hole area of the upper and lower layers is reduced to 1U, at the same time, the 1U air supply hole is added to the single-board panel, and the heat dissipation effect is not substantially reduced compared with the original.
  • a 2U air supply hole is left in the upper part of the service board panel, so that the service board and the cross board are directly connected in the slot, but the air duct is physically completely isolated, and the lower back board high speed connector is very close to the cross board, and the subrack upper and lower layers
  • the distance between the space and the middle layer is reduced to 0, which shortens the length of the high-speed trace of the backplane, which is very beneficial for reducing the loss.
  • the 2U air supply hole is added to the single board panel, and the heat dissipation effect is not substantially reduced compared with the original.
  • a 1U air-filling hole is left in the upper part of the service board panel, so that the high-speed connector of the lower board of the service board is relatively closer to the cross-board, and the space between the upper and lower layers of the sub-rack is reduced by 1U, which shortens the backplane.
  • High-speed trace length is beneficial for reducing losses.
  • the 1U air supply hole is added to the single-board panel, and the heat dissipation effect is not substantially reduced compared with the original. After expansion, the two sides of the double-sided sub-frame are independent of each other.
  • a 2U air supply hole is left in the upper part of the service board panel, so that the service board and the cross board are directly connected in the slot position, and the high speed connector of the lower back board is very close to the cross board, and the space distance between the upper and lower layers of the subrack is relatively small.
  • the original reduction to 0 shortens the length of the high-speed trace of the backplane, which is very beneficial for reducing the loss.
  • the 2U air supply hole is added to the single board panel, and the heat dissipation effect is not substantially reduced compared with the original. After expansion, the two sides of the double-sided sub-frame are independent of each other.
  • the foregoing solution used in the optional embodiment of the present invention adopts the method of optimizing the subrack structure to implement the improvement of the related air duct structure, and reduces the relative spatial distance between the service board and the cross board compared with the related art.
  • the length of the high-speed trace of the backplane is shortened, which is beneficial to reduce transmission loss.
  • modules or steps of the present invention described above can be implemented by a general-purpose computing device that can be centralized on a single computing device or distributed across a network of multiple computing devices. Alternatively, they may be implemented by program code executable by the computing device such that they may be stored in the storage device by the computing device and, in some cases, may be different from the order herein. Perform the steps shown or described, or separate them into individual integrated circuit modules, or make multiple modules or steps into a single The integrated circuit module is implemented. Thus, the invention is not limited to any specific combination of hardware and software.
  • a three-layer subrack including an upper subrack 30, a middle subrack 31, a lower subrack 32, and an upper heat dissipation air hole 33 disposed between the upper subrack 30 and the middle subrack 31.
  • a lower heat dissipation air hole 34 disposed between the middle subrack 31 and the lower subrack 32, the height of the upper heat dissipation air hole 33 is 0 to 1 U, and/or the height of the lower heat dissipation air hole 34 is 0 to 1 U,
  • the problem of large link loss caused by the long trace of the backplane of the board is solved.
  • the backplane trace of the board is shortened and the link loss is reduced.

Abstract

L'invention concerne un bâti secondaire à trois couches, une planche unique et un système de dissipation de chaleur. Le bâti secondaire à trois couches comprend un bâti secondaire de couche supérieure (30), un bâti secondaire de couche intermédiaire (31) et un bâti secondaire de couche inférieure (32), un orifice de dissipation de chaleur de couche supérieure (33) prévu entre le bâti secondaire de couche supérieure (30) et le bâti secondaire de couche intermédiaire (31) et un orifice de dissipation de chaleur de couche inférieure (34) prévu entre le bâti secondaire de couche intermédiaire (31) et le bâti secondaire de couche inférieure (32). La hauteur de l'orifice de dissipation de chaleur de couche supérieure (33) est de 0 à 1U et/ou la hauteur de l'orifice de dissipation de chaleur de couche inférieure (34) est de 0 à 1U. Les modes de réalisation de la présente invention résolvent le problème d'une perte de liaison élevée provoqué par un câblage long sur une plaque arrière d'une planche unique, raccourcissent le câble de la plaque arrière de la planche unique et réduisent la perte de liaison.
PCT/CN2017/070169 2016-01-06 2017-01-04 Bâti secondaire à trois couches, planche unique et système de dissipation de chaleur WO2017118385A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610013337.5 2016-01-06
CN201610013337.5A CN106954364B (zh) 2016-01-06 2016-01-06 三层子架、单板及散热系统

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WO2017118385A1 true WO2017118385A1 (fr) 2017-07-13

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JP2004228310A (ja) * 2003-01-22 2004-08-12 Nec Mobiling Ltd 放熱用キャビネット
US7633754B1 (en) * 2008-08-27 2009-12-15 Ciena Corporation Air cooling system for an electronics rack
WO2010148362A1 (fr) * 2009-06-18 2010-12-23 Intelicloud Technology, Inc. Châssis de serveur informatique amélioré
CN103677101A (zh) * 2012-09-21 2014-03-26 英业达科技有限公司 服务器
US8737067B1 (en) * 2011-04-01 2014-05-27 Juniper Networks, Inc. Connectivity scheme and cooling scheme for a large rack system

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CN101520680B (zh) * 2002-05-31 2011-11-23 韦拉里系统有限公司 安装计算机组件的方法和设备
CN200972785Y (zh) * 2006-11-02 2007-11-07 华为技术有限公司 硬盘阵列装置
GB2506017B (en) * 2011-05-25 2015-11-04 Hewlett Packard Development Co Blade computer system
CN102724848B (zh) * 2012-05-31 2014-12-03 华为技术有限公司 网络机柜
CN104812184B (zh) * 2014-01-23 2018-05-04 华为技术有限公司 一种导风系统
CN204906923U (zh) * 2015-09-18 2015-12-23 湖南科技大学 一种列车监控装置主机综合智能检测设备的机柜

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004228310A (ja) * 2003-01-22 2004-08-12 Nec Mobiling Ltd 放熱用キャビネット
US7633754B1 (en) * 2008-08-27 2009-12-15 Ciena Corporation Air cooling system for an electronics rack
WO2010148362A1 (fr) * 2009-06-18 2010-12-23 Intelicloud Technology, Inc. Châssis de serveur informatique amélioré
US8737067B1 (en) * 2011-04-01 2014-05-27 Juniper Networks, Inc. Connectivity scheme and cooling scheme for a large rack system
CN103677101A (zh) * 2012-09-21 2014-03-26 英业达科技有限公司 服务器

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