WO2017110571A1

WO2017110571A1 - Device with built-in component, rfid tag, and method for producing device with built-in component

Info

Publication number: WO2017110571A1
Application number: PCT/JP2016/086968
Authority: WO
Inventors: 誠長村; 喜人大坪
Original assignee: 株式会社村田製作所
Priority date: 2015-12-21
Filing date: 2016-12-13
Publication date: 2017-06-29
Also published as: JPWO2017110571A1; CN208188872U; JP6394822B2

Abstract

This device with a built-in component is provided with a laminate (11) of a plurality of thermoplastic resin layers and with an RFID IC chip (50) that is embedded in the laminate (11), wherein the RFID IC chip has input/output terminals, and the laminate (11) is provided with pad electrodes (21a, 21b), which are formed on a thermoplastic resin layer, from among the plurality of thermoplastic resin layers, that is different from the layer on which the input/output terminals of the RFID IC chip (50) are located, and a plurality of first via conductors (35a1, 35a2, 35b1, 35b2), which electrically connect the input/output terminals and the pad electrodes (21a, 21b) in an interlayer direction.

Description

Component built-in device, RFID tag, and method of manufacturing component built-in device

The present invention relates to a component built-in device in which a chip-shaped electronic component is built in a laminate of resin layers, an RFID tag including the device, and a method for manufacturing the component built-in device.

An RFID tag used for article information management includes an RFID IC chip that holds predetermined information and processes predetermined radio signals, and an antenna element that transmits and receives high-frequency signals, and is a management target. Used by being applied to various articles and their packaging materials.

As the RFID system, an HF band RFID system using a 13.56 MHz band and a UHF band RFID system using a 900 MHz band are generally used. The UHF band RFID system is characterized in that the communication distance is relatively long and a plurality of tags can be collectively read. As a UHF band RFID tag, a tag having a structure disclosed in Patent Document 1 is known.

The RFID tag disclosed in Patent Document 1 includes a printed wiring board on which a radiating element is formed and an electromagnetic coupling module including an RFIC. The electromagnetic coupling module includes a power supply circuit board made of, for example, a ceramic substrate and a semiconductor RFIC chip. An external terminal is provided on the lower surface of the power supply circuit board, the RFIC chip is mounted on the upper surface, and the power supply is performed so as to cover the RFIC chip. A protective film is coated on the upper surface of the circuit board.

Japanese Patent Laying-Open No. 2015-133153

In a module having a structure in which an IC chip is mounted on a power supply circuit board as shown in Patent Document 1, the thickness of the power supply circuit board and the thickness of the IC chip cannot be made lower than the combined height. There was a limit to making the tag thinner.

On the other hand, even when a predetermined conductor pattern is formed in the laminate of the thermoplastic resin layers and an IC chip is embedded in the laminate, a module similar to the above module can be electrically configured. Since a module using a laminate of resin sheets is easily thinned and flexible, it is suitable for an RFID tag that is thin and requires flexibility.

However, in the structure in which the IC chip is embedded in the laminated body of the thermoplastic resin layer, the pad electrode through which the input / output terminal of the IC chip conducts is deformed and the pad electrode comes into contact with the edge of the IC chip when the resin sheets are collectively laminated. There is a fear. An example is shown in FIGS. FIG. 15A is a cross-sectional view of the main part of the RFID module, and FIG. 15B is a partially enlarged view thereof. Each resin sheet has a predetermined conductor pattern, and when a plurality of resin sheets are laminated together, the pad electrode is deformed (resin flow during pressing) particularly in the vicinity of the hard IC chip 50. 21a and 21b are deformed.

As shown in FIGS. 15A and 15B, when the

pad electrodes

21a and 21b come into contact with the edges of the IC chip 50, the

pad electrodes

21a and 21b are electrically connected to the IC chip 50, and the electrical characteristics are obtained. May deteriorate or malfunction.

The above-mentioned problems are not limited to RFID modules, but are common to all component-embedded devices having a structure in which chip-shaped electronic components are embedded in a laminate of thermoplastic resin layers.

An object of the present invention is a component-embedded device having a structure in which a chip-shaped electronic component is embedded in a laminate of thermoplastic resin layers, wherein the structure and electrical connection around the chip-shaped electronic component in the laminate are stabilized An object is to provide a built-in device, an RFID tag including the same, and a method for manufacturing a component built-in device.

(1) The component built-in device of the present invention is
A component built-in device comprising a laminate of a plurality of thermoplastic resin layers, and a chip-like electronic component embedded in the laminate,
The chip-shaped electronic component has input / output terminals,
In the laminate, among the plurality of thermoplastic resin layers, pad electrodes formed on a thermoplastic resin layer different from the layer where the input / output terminals of the chip-like electronic component are located, and
A plurality of first interlayer connection conductors for conducting the input / output terminal and the pad electrode in an interlayer direction are provided.

With the above configuration, since a plurality of first interlayer connection conductors are interposed between the input / output terminals of the chip-shaped electronic component and the pad electrode, deformation of the pad electrode due to stress concentration on the pad electrode is alleviated, and the pad electrode is chip-shaped. Contact with the edge of the electronic component can be avoided.

(2) The chip-shaped electronic component has a rectangular parallelepiped shape, and the input / output terminals are arranged along two parallel sides of the bottom surface of the chip-shaped electronic component,
The pad electrode has a shape extending along the two sides,
The plurality of first interlayer connection conductors are preferably arranged at symmetrical positions with respect to the longitudinal center of the input / output terminal along the two sides. Thereby, the inclination of the pad electrode is relaxed, and the structure and electrical connection around the chip-shaped electronic component in the stacked body are stabilized.

(3) In the above (1) or (2), it is preferable that adjacent first interlayer connection conductors among the plurality of first interlayer connection conductors are continuous. As a result, stress concentration on the pad electrode is further relaxed, and local deformation of the pad electrode is avoided.

(4) The component built-in device of the present invention is
A component built-in device comprising a laminate of a plurality of thermoplastic resin layers, and a chip-like electronic component embedded in the laminate,
The chip-shaped electronic component has input / output terminals,
In the laminate, among the plurality of thermoplastic resin layers, pad electrodes formed on a thermoplastic resin layer different from the layer where the input / output terminals of the chip-like electronic component are located, and
A first interlayer connection conductor having a long axis and a cross-sectional shape on a surface along the thermoplastic resin layer, which conducts the input / output terminal and the pad electrode in an interlayer direction, is provided. .

With the above configuration, deformation of the pad electrode due to stress concentration on the pad electrode is alleviated, and the pad electrode can be prevented from coming into contact with the edge of the chip-shaped electronic component.

(5) In the above (4), the chip electronic component is a rectangular parallelepiped, the input / output terminals are arranged along two mutually parallel sides of the bottom surface of the chip electronic component, and the pad electrode is the two sides It is preferable that the first interlayer connecting conductor is disposed along the two sides. Thereby, the freedom degree of the relative position of the chip-shaped electronic component with respect to a pad electrode increases, and it can apply to the chip-shaped electronic component of various sizes.

(6) In the above (5), it is preferable that the first interlayer connection conductor is disposed at a symmetrical position with respect to the center in the longitudinal direction of the input / output terminal along the two sides. Thereby, the stress applied to the pad electrode is easily balanced, and the tilt of the chip-shaped electronic component is suppressed.

(7) In any one of the above (1) to (6), the pad electrode has a larger area than the input / output terminal, and the chip-like electronic component in plan view from the lamination direction of the thermoplastic resin layer. It is preferable to have a region that does not overlap. Thereby, it can apply to the chip-shaped electronic components of various sizes, without changing each thermoplastic resin layer (sheet | seat).

(8) In any one of the above (1) to (7), the laminate includes a conductor pattern along an in-plane direction of the thermoplastic resin layer and a second interlayer connection conductor that conducts to the conductor pattern, It is preferable that an element is constituted by the conductor pattern and the second interlayer connection conductor, and a diameter of the plurality of first interlayer connection conductors is smaller than a diameter of the second interlayer connection conductor. Thereby, a buffering property is generated between the chip-shaped electronic component and the pad electrode, and the stress concentration on the pad electrode is further relaxed. Further, the present invention can be applied to a chip-shaped electronic component having a smaller input / output terminal.

(9) The RFID tag of the present invention is
A flexible insulator substrate having a radiating element with a conductor pattern, and an RFID module having an external terminal, wherein the RFID module is mounted on the insulator substrate, and the external terminal is connected to the radiating element. RFID tag,
The RFID module is
Comprising a laminate of a plurality of thermoplastic resin layers, a coiled conductor pattern made of a conductor formed in the thermoplastic resin layer, and an RFID IC embedded in the laminate,
The RFID IC has an input / output terminal,
The laminate includes a pad electrode that is electrically connected to an input / output terminal of the RFID IC and the external terminal.
The RFID IC and the coiled conductor pattern are connected by joining the input / output terminal and the pad electrode,
The pad electrode is formed in a thermoplastic resin layer different from a layer in which the input / output terminal of the RFID IC is located among the plurality of thermoplastic resin layers,
The input / output terminal and the pad electrode are electrically connected in the interlayer direction by a plurality of first interlayer connection conductors.

With the above configuration, a highly reliable RFID tag in which characteristic deterioration or malfunction of an RFID IC is prevented can be obtained.

(10) In (9) above,
The laminate has a longitudinal direction, the coiled conductor pattern includes a first coiled conductor pattern and a second coiled conductor pattern, and the first coiled conductor pattern is disposed near the first end in the longitudinal direction. The second coiled conductor pattern is disposed near the second end in the longitudinal direction, and the RFID IC is arranged in plan view from the lamination direction of the thermoplastic resin layer and the first coiled conductor pattern and the first coiled conductor pattern. It is preferable to arrange between two coil-shaped conductor patterns. Thereby, it can reduce in size and the unnecessary coupling | bonding of the coil by a 1st coil-shaped conductor pattern and the coil by a 2nd coil-shaped conductor pattern is suppressed.

(11) A method for manufacturing a component-embedded device according to the present invention is a method for manufacturing a component-embedded device comprising a laminate of a plurality of thermoplastic resin layers and a chip-like electronic component embedded in the laminate,
Forming a pad electrode to which an input / output terminal of the chip-shaped electronic component is connected to the predetermined thermoplastic resin sheet among the plurality of thermoplastic resin sheets; and
Forming a plurality of interlayer connection conductor forming holes for connecting the input / output terminals and the pad electrodes at a plurality of locations among the plurality of thermoplastic resin sheets, and filling the holes with a conductive paste; and
A step of laminating and pressing the plurality of thermoplastic resin sheets together with the chip-shaped electronic component to form a laminate; and
It is characterized by providing.

According to the above manufacturing method, a component built-in device in which the structure and electrical connection around the chip-shaped electronic component in the multilayer body is stabilized can be obtained.

According to the present invention, it is possible to obtain a component built-in device and an RFID tag including the same, in which the structure and electrical connection around the chip-shaped electronic component in the laminate are stabilized.

FIG. 1 is a perspective view of an RFID module 101 according to the first embodiment. FIG. 2 is a bottom view showing an example of a thermoplastic resin sheet and various conductor patterns formed in the RFID module 101. FIG. 3A is a cross-sectional view of the RFID module 101 taken along the line AA in FIG. FIG. 3B is a plan view of the RFID IC chip 50 as viewed from the input / output terminal side. FIG. 4 is a circuit diagram of the RFID module 101. FIG. 5 is a bottom view showing an example of a resin sheet and various conductor patterns formed on the RFID module constituting the RFID module according to the second embodiment. FIG. 6 is a bottom view showing an example of a resin sheet and various conductor patterns formed on them, which constitute another RFID module according to the second embodiment. FIG. 7 is a plan view showing an example of a thermoplastic resin sheet and various conductor patterns formed on the thermoplastic resin sheet constituting the RFID module 103 according to the third embodiment. FIG. 8A is a cross-sectional view of the RFID module 103 taken along the line AA in FIG. FIG. 8B is a partially enlarged cross-sectional view showing the structure of the connection portion from the input / output terminal of the RFID IC chip 50 to the

end electrodes

25a and 25b. FIG. 9 is a perspective view of an RFID tag 203 according to the fourth embodiment. FIG. 10 is a cross-sectional view showing the structure of the connection portion of the RFID module 101 with respect to the antenna substrate 91. FIG. 11 is a circuit diagram illustrating the operation of the RFID module 101 in the RFID tag 203. FIG. 12A is a perspective view of an RFID tag 204A according to the fifth embodiment. FIG. 12B is a perspective view showing the shape of the

radiation elements

81a and 81b with the RFID module 101 separated. FIG. 13 is a perspective view of another RFID tag 204B according to the fifth embodiment. FIG. 14 is a perspective view of still another RFID tag 204C according to the fifth embodiment. FIG. 15A is a cross-sectional view of the main part of the RFID module when an IC chip is simply embedded in a laminate of thermoplastic resin layers, and FIG. 15B is a partially enlarged view thereof.

Hereinafter, several specific examples will be given with reference to the drawings to show a plurality of modes for carrying out the present invention. In each figure, the same reference numerals are assigned to the same portions. In consideration of ease of explanation or understanding of the main points, the embodiments are shown separately for convenience, but the components shown in different embodiments can be partially replaced or combined. In the second and subsequent embodiments, description of matters common to the first embodiment is omitted, and only different points will be described. In particular, the same operation effect by the same configuration will not be sequentially described for each embodiment.

<< First Embodiment >>
FIG. 1 is a perspective view of an RFID module 101 according to the first embodiment. The RFID module 101 of this embodiment is typically an RFID module corresponding to a communication frequency in the 900 MHz band, that is, the UHF band, and includes a rectangular parallelepiped laminated body 11. The laminate 11 is obtained by laminating a heat-flexible resin layer such as a liquid crystal polymer or polyimide, and the laminate 11 itself also exhibits flexibility. The dielectric constant of each insulating layer made of these materials is smaller than the dielectric constant of a ceramic base layer represented by LTCC.

External terminals

24a and 24b are formed on the mounting surface (upper surface from the viewpoint in FIG. 1) of the laminate 11. The RFID module 101 is mounted on an antenna substrate described later. By this mounting, the

external terminals

24a and 24b are connected to the radiating elements on the antenna substrate.

FIG. 2 is a bottom view showing an example of a thermoplastic resin sheet and various conductor patterns formed on the thermoplastic resin sheet constituting the RFID module 101 (a view of each thermoplastic resin sheet looking up from the bottom surface).

In the thermoplastic resin sheet (hereinafter simply referred to as “resin sheet”) 11d, rectangular

spiral element patterns

20a and 20b are formed, respectively. A pad electrode 21a is formed at the first end of the element pattern 20a, and an end electrode 22a is formed at the second end. Similarly, a pad electrode 21b is formed at the first end of the element pattern 20b, and an end electrode 22b is formed at the second end. The

pad electrodes

21a and 21b have shapes extending from the end portions of the

element patterns

20a and 20b along the two sides where the input / output terminals of the RFID IC chip 50 are formed. An element pattern 20c having two rectangular spiral portions is formed on the resin sheet 11c.

End electrodes

23a and 23b are formed on both ends of the element pattern 20c.

External terminals

24a and 24b are formed on the resin sheet 11a. Another resin sheet exists on the outer surface of the resin sheet 11d.

The end electrode 22a of the element pattern 20a and the end electrode 23a of the element pattern 20c are connected via a via conductor 31a. The end electrode 22b of the element pattern 20b and the end electrode 23b of the element pattern 20c are connected through a via conductor 31b. The

end electrodes

23a, 23b of the element pattern 20c and the

external terminals

24a, 24b are connected via via

conductors

32a, 32b, 33a, 33b, 34a, 34b.

FIG. 3A is a cross-sectional view of the RFID module 101 taken along the line AA in FIG. The left rectangular spiral portion of the element pattern 20c and the element pattern 20a overlap in a substantially coaxial relationship. Similarly, the rectangular spiral portion on the right side of the element pattern 20c and the element pattern 20b overlap in a substantially coaxial relationship. The end electrode 23a is connected to the external terminal 24a via the via

conductors

32a, 33a, 34a. Similarly, the end electrode 23b is connected to the external terminal 24b via the via

conductors

32b, 33b, and 34b. With this structure, a left coil spiral portion of the element pattern 20c and the element pattern 20a constitute a first coil-shaped conductor pattern, and a right rectangular spiral portion of the element pattern 20c and the element pattern 20b are second. A coiled conductor pattern is formed.

FIG. 3B is a bottom view of the RFID IC chip 50 as viewed from the input / output terminal side. The RFID IC chip 50 has a rectangular parallelepiped shape, and the input / output terminals 50Ea and 50Eb are arranged along two parallel sides of the bottom surface of the RFID IC chip 50. The via conductors 35a1 and 35a2 are disposed at symmetrical positions with respect to the center in the longitudinal direction along the input / output terminals 50Ea and 50Eb along the two sides. A one-dot chain line in FIG. 3B indicates a central line in the longitudinal direction.

The input / output terminal 50Ea of the IC chip for RFID 50 is connected to the pad electrode 21a via the via conductors 35a1 and 35a2. Similarly, the input / output terminal 50Eb is connected to the pad electrode 21b via the via conductors 35b1 and 35b2.

In particular, the via conductors 35a1, 35a2, 35b1, and 35b2 are provided near the end portions of the

pad electrodes

21a and 21b.

With the above-described structure, the inclination of the

pad electrodes

21a and 21b is relaxed, and the structure and electrical connection around the RFID IC chip 50 in the multilayer body 11 are stabilized.

The via conductors 35a1, 35a2, 35b1, and 35b2 are examples of the “first interlayer connection conductor” according to the present invention. The diameter of the via conductors 35a1, 35a2, 35b1, and 35b2 is, for example, not less than 40 μm and not more than 90 μm, and preferably not less than 60 μm and not more than 70 μm. The via

conductors

31a, 32a, 33a, 34a, 31b, 32b, 33b, and 34b are examples of the “second interlayer connection conductor” according to the present invention. The diameters of the via

conductors

31a, 32a, 33a, 34a, 31b, 32b, 33b, and 34b are, for example, 60 μm or more and 140 μm or less, preferably 90 μm or more and 110 μm or less.

The laminate 11 has a longitudinal direction, the first coiled conductor pattern is disposed near the first end in the longitudinal direction, and the second coiled conductor pattern is disposed near the second end in the longitudinal direction, The RFID IC 50 is disposed between the first coiled conductor pattern and the second coiled conductor pattern in a plan view from the lamination direction of the thermoplastic resin layer. Thereby, the RFID module 101 can be reduced in size, and unnecessary coupling between the coil formed by the first coiled conductor pattern and the coil formed by the second coiled conductor pattern is suppressed.

FIG. 4 is a circuit diagram of the RFID module 101. Here, the inductors L1 and L2 correspond to the

element patterns

20a and 20b, and the inductors L3 and L4 correspond to the element pattern 20c.

2 and 3, a plurality of (two in this embodiment) via conductors 35a1 and 35a2 are provided between the input / output terminals 50Ea and 50Eb of the RFID IC chip 50 and the

pad electrodes

21a and 21b. , 35b1 and 35b2 are interposed.

According to the present embodiment, the deformation of the pad electrode due to the stress concentration on the

pad electrodes

21a and 21b is alleviated, and the

pad electrodes

21a and 21b are prevented from contacting the edge of the RFID IC chip 50.

In addition, if there is one interlayer connection conductor that conducts the input / output terminal and the pad electrode in the interlayer direction, if the relative positional relationship between the interlayer connection conductor and the chip-shaped electronic component is shifted, the chip-shaped electronic component is However, according to the present embodiment, since the input / output terminal and the pad electrode are connected by the plurality of interlayer connection conductors, the above inclination can be avoided.

Further, since the end portions of the pad electrode 21a are pressed by the via conductors 35a1 and 35a2 and the end portions of the pad electrode 21b are pressed by the via conductors 35b1 and 35b2, the deformation of the

pad electrodes

21a and 21b is effectively suppressed.

The

pad electrodes

21a and 21b have a larger area than the input / output terminals 50Ea and 50Eb, and have regions that do not overlap with the RFID IC chip 50 in plan view from the lamination direction of the thermoplastic resin layer. As described above, problems due to the deformation of the

pad electrodes

21a and 21b are avoided, so that various sizes of IC chips for RFID 50 can be embedded. That is, even when RFID IC chips having different sizes are used, a single type of laminate 11 can be used.

The first via conductors (via conductors 35a1, 35a2, 35b1, 35b2 that connect the input / output terminals 50Ea, 50Eb of the RFID IC chip 50 and the

pad electrodes

21a, 21b) are second via conductors (element pattern 20a). , 20b and the element pattern 20c are interlayer-connected via

conductors

31a and 31b, and the

end conductors

23a and 23b and the

external terminals

24a and 24b are interlayer-connected via

conductors

34a and 34b). Therefore, a buffering property is generated between the RFID IC chip 50 and the

pad electrodes

21a and 21b, and stress concentration on the

pad electrodes

21a and 21b is further alleviated. Further, the present invention can be applied to a chip-shaped electronic component having smaller input / output terminals 50Ea and 50Eb.

Further, since the

pad electrodes

21a and 21b and the input / output terminals 50Ea and 50Eb of the RFID IC chip 50 are connected via a plurality of via conductors, respectively, the surface of the RFID IC chip 50 with respect to the

pad electrodes

21a and 21b is increased. High tolerance for buried position shift. In other words, even if there is a positional deviation in the surface direction of the RFID IC chip 50 with respect to the

pad electrodes

21a and 21b, electrical conduction is ensured because the conduction is made through one or more via conductors.

The manufacturing method of the RFID module 101 of the present embodiment is as follows.

(1) A thermoplastic resin sheet with a Cu foil attached on one side is prepared, and the Cu foil is patterned by photolithography to form predetermined conductor patterns on the thermoplastic resin sheets 11a to 11e, respectively. That is, the

element patterns

20a and 20b and the

pad electrodes

21a and 21b are formed on the thermoplastic resin sheet 11e. An element pattern 20c is formed on the thermoplastic resin sheet 11d.

External terminals

24a and 24b are formed on the thermoplastic resin sheet 11a. The other thermoplastic resin sheet is formed with an electrode in contact with the via conductor.

(2) Subsequently, a via hole is formed at a predetermined position of the thermoplastic resin sheet by a laser processing method, and the conductive paste is charged in the via hole by a screen printing method or the like. These conductive pastes become via conductors in the subsequent heating / pressurizing process.

(3) The thermoplastic resin sheets 11a to 11e are laminated together with the RFID IC chip 50, and the laminate 11 is formed by applying pressure and heating.

(4) Each of the above processes is processed in a collective substrate state of a large number of RFID modules 101, and finally, a large number of RFID modules 101 are obtained by dividing into individual pieces.

<< Second Embodiment >>
The second embodiment shows several examples in which the shape of the first via is different from that of the first embodiment.

FIG. 5 is a bottom view (a view of each thermoplastic resin sheet looking up from the bottom surface) showing an example of a resin sheet and various conductor patterns formed in the RFID module according to the second embodiment. In this example, via

conductors

36a and 36b are provided to connect the input / output terminals of the RFID IC chip 50 to the

pad electrodes

21a and 21b. The via conductor 36a is composed of a plurality of via conductors. That is, via conductors adjacent to each other are connected. Similarly, the via conductors 36b are connected to adjacent via conductors. Laser processing is used to irradiate a predetermined position of a thermoplastic resin sheet with a laser beam many times to continuously form adjacent holes, and the conductive paste is filled therewith, so that via conductors adjacent to each other are formed. A via conductor having a continuous shape is formed. Other configurations are the same as those shown in the first embodiment.

FIG. 6 is a bottom view showing an example of a resin sheet and various conductor patterns formed on them, which constitute another RFID module according to the second embodiment. In this example, via

conductors

37a and 37b are provided to connect the input / output terminals of the RFID IC chip 50 to the

pad electrodes

21a and 21b. These via

conductors

37a and 37b have an oval cross-sectional shape and a long axis. That is, when a via hole is formed at a predetermined position of a thermoplastic resin sheet by a laser processing method, an oblong hole is formed by irradiating a laser beam substantially continuously and filled with a conductive paste. As a result, a via conductor having an oval cross-sectional shape is formed. Other configurations are the same as those shown in the first embodiment.

According to the present embodiment, stress concentration on the pad electrode is further relaxed, and local deformation of the pad electrode is avoided, so that the pad electrode can be prevented from contacting the edge of the chip-shaped electronic component.

In each of the embodiments described above, the plurality of first vias are arranged in a row in the longitudinal direction of the input / output terminals, but they may be arranged in a plurality of rows.

<< Third Embodiment >>
FIG. 7 is a plan view showing an example of a thermoplastic resin sheet and various conductor patterns formed on the thermoplastic resin sheet constituting the RFID module 103 according to the third embodiment. FIG. 8A is a cross-sectional view of the RFID module 103 taken along the line AA in FIG. FIG. 8B is a partial enlarged cross-sectional view showing the structure of the connection portion from the input / output terminals 50Ea, 50Eb to the

end electrodes

25a, 25b of the RFID IC chip 50.

Resin sheet 11e is formed with rectangular

spiral element patterns

20a and 20b, respectively. A pad electrode 25a is formed at the first end of the element pattern 20a, and an end electrode 22a is formed at the second end. Similarly, a pad electrode 25b is formed at the first end of the element pattern 20b, and an end electrode 22b is formed at the second end. The

pad electrodes

25a and 25b have shapes extending from the end portions of the

element patterns

20a and 20b along the two sides where the input / output terminals of the RFID IC chip 50 are formed. An element pattern 20c having two rectangular spiral portions is formed on the resin sheet 11d.

End electrodes

23a and 23b are formed on both ends of the element pattern 20c. Further,

pad electrodes

21a and 21b are formed on the resin sheet 11d.

External terminals

24a and 24b are formed on the resin sheet 11a. Another resin sheet exists between the resin sheet 11a and the resin sheet 11c.

The RFID IC chip 50 has input / output terminals 50Ea and 50Eb arranged at positions along two opposing sides of the bottom surface of the RFID IC chip 50. The input / output terminals 50Ea and 50Eb are connected to the

pad electrodes

21a and 21b via via conductors 35a1, 35a2, 35b1 and 35b2. The pad

electrode connection conductors

45a and 45b connect the

pad electrodes

21a and 21b and the

end electrodes

25a and 25b.

As shown in FIG. 8 (B), the regions where the via conductors 35a1, 35a2, 35b1, and 35b2 are present in the plan view from the lamination direction of the fat layer sheets 11a to 11e are represented by the first regions Z1a and Z1b. Regions where 45a and 45b exist are represented by second regions Z2a and Z2b. As shown in FIG. 8B, the second regions Z2a and Z2b are closer to the center of the RFID IC chip 50 than the first regions Z1a and Z1b.

With the above-described structure, even if the

pad electrodes

21a and 21b are deformed, the

pad electrodes

21a and 21b may come into contact with the edges of the RFID IC chip 50 (locations indicated by P in FIG. 8B) due to the deformation. Can be avoided. Since the regions other than the input / output terminals 50Ea and 50Eb are covered with the insulator film 50P on the surfaces where the input / output terminals 50Ea and 50Eb of the RFID IC chip 50 are formed, the

pad electrodes

21a and 21b are formed with via

conductors

45a and 45b. The

pad electrodes

21a and 21b are not electrically connected to the substrate of the RFID IC chip 50 even if they are pressed against the surface where the input / output terminals 50Ea and 50Eb of the RFID IC chip 50 are formed by the pressing force.

<< Fourth Embodiment >>
In the fourth embodiment, an example of an RFID tag is shown. The RFID tag of this embodiment is applied to, for example, a tag for linen management, a label tag for clothes used for uniform management, and various name tags.

FIG. 9 is a perspective view of the RFID tag 203 according to the fourth embodiment. The RFID tag 203 includes an antenna base 91 on which radiating

elements

81a and 81b with conductor patterns are formed, and an RFID module 101. The configuration of the RFID module 101 is as shown in the first embodiment.

Radiating elements

81a and 81b constitute a dipole antenna. The antenna substrate 91 is a resin sheet having flexibility such as PET. The radiating

elements

81a and 81b are flexible conductors such as aluminum foil or copper foil.

FIG. 10 is a cross-sectional view showing the structure of the connection portion of the RFID module 101 with respect to the antenna substrate 91.

External terminals

24a and 24b of the RFID module 101 are connected to the

radiating elements

81a and 81b via

solders

38a and 38b. In the RFID module 101, the formation region of the

external terminals

24a and 24b and the embedded region of the RFID IC chip 50 are rigid regions, and the rest are flexible regions. Therefore, even if the RFID tag 203 is curved, the antenna base 91 and the RFID module 101 are bent as shown in FIG. 10, and a large bending stress is not applied to the RFID IC chip 50.

FIG. 11 is a circuit diagram showing the operation of the RFID module 101 in the RFID tag 203. A capacitance Cp in the RFID IC chip 50 exists between the

external terminals

24 a and 24 b, and two resonances occur in the RFID tag 203. The first resonance is a resonance that occurs in the current path indicated by the current i1, which is composed of the

radiation elements

81a and 81b and the inductors L3 and L4, and the second resonance is composed of the inductors L1 to L4 and the capacitor Cp. This is resonance that occurs in the current path (current loop) indicated by current i2. The two resonances are coupled by inductors L3 to L4 shared by the respective current paths.

Both the resonance frequency due to the first resonance and the resonance frequency due to the second resonance are affected by the inductors L3 to L4. A difference of several tens of MHz (specifically, about 5 to 50 MHz) is caused between the resonance frequency due to the first resonance and the resonance frequency due to the second resonance. By combining the two resonances in this way, a broadband resonance frequency characteristic is obtained.

<< Fifth Embodiment >>
In the fifth embodiment, several RFID tags are shown in which the shapes of the antenna substrate and the radiating element are different from those shown in the fourth embodiment.

FIG. 12A is a perspective view of an RFID tag 204A according to the fifth embodiment. FIG. 12B is a perspective view showing the shape of the

radiation elements

81a and 81b with the RFID module 101 separated. A rectangular through hole HL2 is provided at the center in the length direction of the

radiation elements

82a and 82b, and a notch CT1 reaching the through hole HL2 from the outer edge is further provided. In this way, a matching conductor pattern may be formed at the mounting position of the RFID module.

FIG. 13 is a perspective view of another RFID tag 204B according to the fifth embodiment. The antenna base 92 is formed with a rectangular loop-shaped radiating element 83 which is partially opened, and an external terminal of the RFID module 101 is connected to the open portion.

FIG. 14 is a perspective view of still another RFID tag 204C according to the fifth embodiment. The antenna base 92 is formed with a rectangular loop-shaped radiating element 84 having a through hole HL2 and a notch CT1 similar to the radiating element shown in FIG. 12B, and RFID is provided at both ends of the notch CT1. An external terminal of the module 101 is connected.

As shown in FIGS. 12A and 12B and FIG. 14, a matching conductor pattern may be formed on the radiating element. Further, as shown in FIGS. 13 and 14, the radiating element may have a loop shape.

In the example described above, a via conductor is used as an example of an interlayer connection conductor that connects conductors formed in different layers. Via conductors are made by filling holes (via hole conductor holes) in a sheet with conductive materials such as conductive paste and then metallizing them, but as interlayer connection conductors, Examples thereof include through-hole conductors in which a metal film is formed by plating or the like, and metal bodies such as metal pins or stud-like solder.

Finally, the description of the above embodiment is illustrative in all respects and not restrictive. Modifications and changes can be made as appropriate by those skilled in the art. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention includes modifications from the embodiments within the scope equivalent to the claims.

Cp ... capacitance CT1 ... notch HL2 ... through holes L1 to L4 ... inductor 11 ... laminates 11a to 11e ... thermoplastic resin sheet (thermoplastic resin layer)
20a, 20b, 20c ...

element patterns

21a, 21b ...

pad electrodes

22a, 22b, 23a, 23b ...

end electrodes

24a, 24b ...

external terminals

31a, 32a, 33a, 34a, 31b, 32b, 33b, 34b ... via conductors ( Second interlayer connection conductor)
35a1, 35a2, 35b1, 35b2 ... via conductor (first interlayer connection conductor)
36a, 36b ... Via conductor (first interlayer connection conductor)
37a, 37b ... Via conductor (first interlayer connection conductor)
38a, 38b ...

solder

45a, 45b ... via conductor 50 ... RFID IC chip (chip-shaped electronic component)
50Ea, 50Eb ... I / O terminal 50P ...

Insulator films

81a, 81b, 82a, 82b, 83, 84 ...

Radiating elements

91, 92 ... Antenna substrate 101 ... RFID module (device with built-in components)
203 ... RFID tags 204A, 204B, 204C ... RFID tags

Claims

A component built-in device comprising a laminate of a plurality of thermoplastic resin layers, and a chip-like electronic component embedded in the laminate,
The chip-shaped electronic component has input / output terminals,
In the laminate, among the plurality of thermoplastic resin layers, pad electrodes formed on a thermoplastic resin layer different from the layer where the input / output terminals of the chip-like electronic component are located, and
A device with a built-in component, comprising: a plurality of first interlayer connection conductors that conduct the input / output terminal and the pad electrode in an interlayer direction.
The chip-shaped electronic component has a rectangular parallelepiped shape, and the input / output terminals are arranged along two parallel sides of the bottom surface of the chip-shaped electronic component,
The pad electrode has a shape extending along the two sides,
2. The component built-in device according to claim 1, wherein the plurality of first interlayer connection conductors are arranged symmetrically with respect to a longitudinal center of the input / output terminal along the two sides.
3. The component built-in device according to claim 1, wherein among the plurality of first interlayer connection conductors, adjacent first interlayer connection conductors are continuous.
A component built-in device comprising a laminate of a plurality of thermoplastic resin layers, and a chip-like electronic component embedded in the laminate,
The chip-shaped electronic component has input / output terminals,
In the laminate, among the plurality of thermoplastic resin layers, pad electrodes formed on a thermoplastic resin layer different from the layer where the input / output terminals of the chip-like electronic component are located, and
A first interlayer connection conductor having a long axis and a cross-sectional shape on a surface along the thermoplastic resin layer, which conducts the input / output terminal and the pad electrode in an interlayer direction, is provided. , Device with built-in components.
The chip-shaped electronic component is a rectangular parallelepiped, and the input / output terminals are arranged along two parallel sides of the bottom surface of the chip-shaped electronic component,
The pad electrode has a shape extending along the two sides,
The component built-in device according to claim 4, wherein the first interlayer connection conductor is disposed along the two sides.
The device with a built-in component according to claim 5, wherein the first interlayer connection conductor is disposed symmetrically with respect to the longitudinal center of the input / output terminal along the two sides.
7. The pad electrode according to claim 1, wherein the pad electrode has an area larger than that of the input / output terminal, and has a region that does not overlap the chip-shaped electronic component in a plan view from the lamination direction of the thermoplastic resin layer. Built-in device.
The laminate includes a conductor pattern along an in-plane direction of the thermoplastic resin layer and a second interlayer connection conductor conducting to the conductor pattern, and an element is configured by the conductor pattern and the second interlayer connection conductor,
8. The component built-in device according to claim 1, wherein a diameter of the plurality of first interlayer connection conductors is smaller than a diameter of the second interlayer connection conductor.
A flexible insulator substrate having a radiating element with a conductor pattern, and an RFID module having an external terminal, wherein the RFID module is mounted on the insulator substrate, and the external terminal is connected to the radiating element. RFID tag,
The RFID module is
Comprising a laminate of a plurality of thermoplastic resin layers, a coiled conductor pattern made of a conductor formed in the thermoplastic resin layer, and an RFID IC embedded in the laminate,
The RFID IC has an input / output terminal,
The laminate includes a pad electrode that is electrically connected to an input / output terminal of the RFID IC and the external terminal.
The RFID IC and the coiled conductor pattern are connected by joining the input / output terminal and the pad electrode,
The pad electrode is formed in a thermoplastic resin layer different from a layer in which the input / output terminal of the RFID IC is located among the plurality of thermoplastic resin layers,
The RFID tag, wherein the input / output terminal and the pad electrode are electrically connected in an interlayer direction by a plurality of first interlayer connection conductors.
The laminate has a longitudinal direction;
The coiled conductor pattern includes a first coiled conductor pattern and a second coiled conductor pattern,
The first coiled conductor pattern is disposed near the first end in the longitudinal direction, the second coiled conductor pattern is disposed near the second end in the longitudinal direction, and the RFID IC is formed on the thermoplastic resin layer. The RFID tag according to claim 9, wherein the RFID tag is disposed between the first coil-shaped conductor pattern and the second coil-shaped conductor pattern in a plan view from the stacking direction.
A laminate of a plurality of thermoplastic resin layers, and a method for producing a component built-in device comprising a chip-like electronic component embedded in the laminate,
Forming a pad electrode to which an input / output terminal of the chip-shaped electronic component is connected to the predetermined thermoplastic resin sheet among the plurality of thermoplastic resin sheets; and
Forming a plurality of interlayer connection conductor forming holes for interlayer connection between the input / output terminals and the pad electrode among the plurality of thermoplastic resin sheets, and filling the holes with a conductive paste;
A step of laminating and pressing the plurality of thermoplastic resin sheets together with the chip-shaped electronic component to form a laminate; and
A method of manufacturing a component built-in device.