CN208188872U - Built-in component device and RFID tag - Google Patents
Built-in component device and RFID tag Download PDFInfo
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- CN208188872U CN208188872U CN201690001476.XU CN201690001476U CN208188872U CN 208188872 U CN208188872 U CN 208188872U CN 201690001476 U CN201690001476 U CN 201690001476U CN 208188872 U CN208188872 U CN 208188872U
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- output terminal
- input
- rfid
- thermoplastic resin
- pad electrode
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model provides a kind of built-in component device and RFID tag.The built-in component device has the laminated body (11) of multiple thermoplastic resin layers, and RFID in laminated body (11) is embedded in IC chip (50), RFID has input and output terminal with IC chip (50), laminated body (11) has the pad electrode (21a being formed in multiple thermoplastic resin layers from RFID with the different thermoplastic resin layer of the layer where the input and output terminal of IC chip (50), 21b), and by input and output terminal and pad electrode (21a, multiple first via hole conductor (35a1 21b) be connected on interlayer direction, 35a2, 35b1, 35b2).
Description
Technical field
The utility model relates to the built-in component device of chip type electronic component built-in in the laminated body of resin layer and
The RFID tag for having the built-in component device.
Background technique
RFID tag for article information management etc. has for saving provisioning information and carrying out defined wireless communication
The RFID IC chip of number processing and carries out the antenna element of high-frequency signal transmitting-receiving, is attached to become and manages each of object
Kind article or the enterprising enforcement of its packaging material are used.
RFID system typically refers to the HF frequency band RFID system using 13.56MHz frequency band or utilizes 900MHz frequency band
UHF band RFID system.UHF band RFID system is characterized in that communication distance is longer, can disposably read multiple labels.
It has been known that there is the labels of structure disclosed in patent document 1 for UHF band RFID tag.
RFID tag shown in patent document 1 is by being formed with the printed wiring board of radiating element and comprising the electromagnetism of RFIC
Coupling module is constituted.Electromagnetic coupling module has the power supply circuit substrate for example formed by ceramic substrate and semiconductor RFIC core
Piece is equipped with external terminal in the lower surface of power supply circuit substrate, and RFIC chip is installed on surface on it, and to cover the RFIC
The mode of chip is covered with protective film in the upper surface of power supply circuit substrate.
Existing technical literature
Patent document
Patent document 1: Japanese Patent Laid-Open 2015-133153 bulletin
Utility model content
Utility model technical problem to be solved
In the module for installing the structure of IC chip shown in the patent document 1 on power supply circuit substrate, power supply circuit base
The thickness of plate and the thickness superposition of IC chip lead to not the reduction for realizing height, so that the slimming of RFID tag has
Limit.
On the other hand, conductive pattern and the inside in the laminated body as defined in being formed on the laminated body of thermoplastic resin layer
Electricity structure module identical with above-mentioned module also may be implemented in the structure of embedded IC chip.It is constituted using the laminated body of resin sheet
Module slimming easy to accomplish, also there is flexibility, therefore be suitable for slim and require flexible RFID tag.
But the structure that IC chip is buried in the laminated body of thermoplastic resin layer is carrying out total stacking to resin sheet
When, the pad electrode that the input and output terminal of IC chip is connected is likely to occur deformation, so as to cause pad electrode and IC core
The EDGE CONTACT of piece.Above-mentioned example is shown in Figure 15 (A), Figure 15 (B).Figure 15 (A) is cutting for the major part of RFID module
Face figure, Figure 15 (B) are its partial enlarged views.It is formed with defined conductive pattern on each resin sheet, is carried out to multi-disc resin sheet
When total stacking, especially with the deformation (resin when pressurization flows) of the resin layer near hard IC chip 50, pad
Electrode 21a, 21b will deform.
Shown in the example as shown in Figure 15 (A), Figure 15 (B), if the edge of pad electrode 21a, 21b and IC chip 50 connects
Touching, then pad electrode 21a, 21b and IC chip 50 conduct, bad so as to cause electrical characteristic deterioration or generation movement.
The above problem is not limited only to RFID module, is embedded with chip type electronic component in the laminated body of thermoplastic resin layer
The built-in component device of structure all there are problems that this.
The purpose of this utility model is to provide a kind of built-in component device, has the RFID of the built-in component device
The manufacturing method of label and built-in component device is embedded with chip type electronic member device in the laminated body of thermoplastic resin layer
In the built-in component device of the structure of part, the structure and electrical connection being laminated around intracorporal chip type electronic component is made to become steady
It is fixed.
Technical scheme applied to solve the technical problem
(1) the built-in component device of the utility model has:
The laminated body of multiple thermoplastic resin layers and it is embedded in the intracorporal chip type electronic component of the stacking,
The chip type electronic component has input and output terminal,
The laminated body has:
Pad electrode, the pad electrode are formed in the multiple thermoplastic resin layer and the chip type electronic component
The different thermoplastic resin layer of layer where input and output terminal；And
Multiple first interlayer connection conductors, multiple first interlayer connection conductor make the input and output terminal and the weldering
Disc electrode is connected on interlayer direction,
The laminated body have the conductive pattern that direction in the face along the thermoplastic resin layer is arranged and with the conductor
Second interlayer connection conductor of pattern conducting, the conductive pattern and second interlayer connection conductor constitute element,
The diameter of the multiple first interlayer connection conductor is less than the diameter of second interlayer connection conductor.
According to above structure, in the input and output terminal and the interlayer of pad electrode of chip type electronic component, there are multiple
First interlayer connection conductor, therefore the deformation of pad electrode caused by concentrating because of the stress on pad electrode is mitigated, it can
Avoid the EDGE CONTACT of pad electrode and chip type electronic component.
(2) preferably, the chip type electronic component is the shape of cuboid, and the input and output terminal is along described
2 to be parallel to each other the side of the bottom surface of shape electronic component configures,
The pad electrode is the shape extended along 2 sides,
Length of the multiple first interlayer connection conductor relative to the input and output terminal configured along 2 sides
The center configuration of edge direction is on symmetrical position.To which the inclination of pad electrode is mitigated, and intracorporal chip type electronic is laminated
Structure and electrical connection around component become stable.
(3) preferably, in above-mentioned (1) or (2), the first adjacent interlayer connects in the multiple first interlayer connection conductor
It is continuous for connecing conductor.To which the stress concentration on pad electrode is further mitigated, moreover it is possible to avoid the part of pad electrode
Deformation.
(4) the built-in component device of the utility model has:
The laminated body of multiple thermoplastic resin layers and it is embedded in the intracorporal chip type electronic component of the stacking,
The chip type electronic component has input and output terminal,
The laminated body has:
Pad electrode, the pad electrode are formed in the multiple thermoplastic resin layer and the chip type electronic component
The different thermoplastic resin layer of layer where input and output terminal；And
First interlayer connection conductor, first interlayer connection conductor make the input and output terminal and the pad electrode exist
Interlayer is connected on direction, and the cross sectional shape in the plane along the thermoplastic resin layer is ellipse and has length
Axis,
The laminated body have the conductive pattern that direction in the face along the thermoplastic resin layer is arranged and with the conductor
Second interlayer connection conductor of pattern conducting, the conductive pattern and second interlayer connection conductor constitute element,
The diameter of the multiple first interlayer connection conductor is less than the diameter of second interlayer connection conductor.
According to above structure, the deformation of pad electrode caused by the stress on pad electrode is concentrated is mitigated, and can be kept away
Exempt from the EDGE CONTACT of pad electrode and chip type electronic component.
(5) preferably, in above-mentioned (4), the chip type electronic component is the shape of cuboid, the input/output terminal
Son is configured along 2 to be parallel to each other the side of the bottom surface of the chip type electronic component, and the pad electrode is along described 2
The shape that side extends, first interlayer connection conductor are configured along 2 sides.To, chip type electronic component relative to
The freedom degree of the relative position of pad electrode is improved, and can be suitable for the chip type electronic component of various sizes.
(6) preferably, in above-mentioned (5), first interlayer connection conductor is relative to the institute configured along 2 sides
The center configuration of the longitudinal direction of input and output terminal is stated on symmetrical position.To the stress being applied on pad electrode
It is easy equilibrium, is able to suppress the inclination of chip type electronic component.
(7) preferably, in any one of above-mentioned (1)~(6), it is defeated that there is the pad electrode area to be greater than the input
Terminal and the not region Chong Die with chip type electronic component when being overlooked from the stacking direction of the thermoplastic resin layer out.From
And it just can be suitably used for the chip type electronic component of various sizes without changing each thermoplastic resin layer (piece).
(9) RFID tag of the utility model has:
Insulator substrate flexible with the radiating element formed by conductive pattern and with the RFID of external terminal
Module, the RFID module are mounted on the insulator substrate, and the external terminal is connect with the radiating element,
The RFID module has:
The laminated body of multiple thermoplastic resin layers is led by the coiled type that the conductor for being formed in the thermoplastic resin layer is constituted
Body pattern and it is embedded in the intracorporal RFID IC of the stacking,
The RFID has input and output terminal with IC,
The laminated body has and the RFID pad electrode be connected with the input and output terminal of IC and the outer end
Son,
The RFID passes through the input and output terminal and the pad electrode with IC and the coiled type conductive pattern
It engages and connects,
The pad electrode is formed in the input and output terminal in the multiple thermoplastic resin layer with the RFID IC
The different thermoplastic resin layer of the layer at place,
The input and output terminal is led on interlayer direction with the pad electrode by multiple first interlayer connection conductors
It is logical,
The laminated body has longitudinal direction,
The coiled type conductive pattern includes First Line round conductive pattern and the second coiled type conductive pattern,
Near the first end of the longitudinal direction, second coiled type is led for the First Line round conductive pattern configuration
Body pattern configures near the second end of the longitudinal direction, and the RFID is with IC in the stacking side from the thermoplastic resin layer
To configuration when overlooking between the First Line round conductive pattern and the second coiled type conductive pattern.
According to above structure, it can obtain preventing RFID with the deterioration in characteristics of IC and act the RFID of undesirable high reliability
Label.
According to above-mentioned manufacturing method, structure and electrical connection around the available intracorporal chip type electronic component of stacking become
Stable built-in component device.
Utility model effect
According to the utility model, the structure and electrical connection that can be obtained around the chip type electronic component in laminated body become steady
Fixed built-in component device and the RFID tag for having the built-in component device.
Detailed description of the invention
Fig. 1 is the perspective view of the RFID module 101 of embodiment 1.
Fig. 2 is to constitute the thermoplastic resin sheet of RFID module 101 and be formed in the various of these thermoplastic resin on pieces to lead
The exemplary bottom view of body pattern.
Fig. 3 (A) is the cross-sectional view of the RFID module 101 of the part A-A in Fig. 2.Fig. 3 (B) is from RFID IC chip 50
The top view observed of input and output terminal side.
Fig. 4 is the circuit diagram of RFID module 101.
Fig. 5 is the resin sheet for the RFID module for constituting embodiment 2 and the various conductor figures that are formed on these resin sheets
The exemplary bottom view of case.
Fig. 6 is the resin sheet for another RFID module for constituting embodiment 2 and be formed on these resin sheets various lead
The exemplary bottom view of body pattern.
Fig. 7 is the thermoplastic resin sheet for the RFID module 103 for constituting embodiment 3 and is formed in these thermoplastic resin sheets
On various conductive patterns exemplary top view.
Fig. 8 (A) is the cross-sectional view of the RFID module 103 of the part A-A in Fig. 7.Fig. 8 (B) is indicated from RFID IC core
The input and output terminal of piece 50 to tip electrodes 25a, 25b interconnecting piece structure enlarged partial sectional view.
Fig. 9 is the perspective view of the RFID tag 203 of embodiment 4.
Figure 10 is the cross-sectional view for indicating the interconnecting piece structure of RFID module 101 and antenna substrate 91.
Figure 11 is the circuit diagram for indicating the effect of the RFID module 101 in RFID tag 203.
Figure 12 (A) is the perspective view of the RFID tag 204A of embodiment 5.Figure 12 (B) is after separating RFID module 101
Indicate the perspective view of the shape of radiating element 81a, 81b.
Figure 13 is the perspective view of another RFID tag 204B of embodiment 5.
Figure 14 is the perspective view of the another RFID tag 204C of embodiment 5.
Figure 15 (A) is the main portion of RFID module when being simply embedded with IC chip in the laminated body of thermoplastic resin layer
The cross-sectional view divided, Figure 15 (B) is its partial enlarged view.
Specific embodiment
In the following, enumerating several specific examples referring to attached drawing multiple modes for implementing the utility model are presented.Each figure
In, same label is marked to same position.In view of the explanation of main points and the easness of understanding, divide different implementation for the sake of convenient
Mode indicates, but structure shown in different embodiments can be with partial replacement or combination.Since embodiment 2, for
The identical item of embodiment 1, the description thereof will be omitted, is only illustrated to difference.Especially same structure bring
Same function and effect no longer one by one refer in each embodiment.
(embodiment 1)
Fig. 1 is the perspective view of the RFID module 101 of embodiment 1.The RFID module 101 of present embodiment is typical
Corresponding to the RFID module of 900MHz frequency band, that is, UHF band communication frequency, the laminated body 11 with rectangular shape.Laminated body
11 are laminated by thermoplastic resin layers such as liquid crystal polymer, polyimides, and laminated body 11 itself also has flexibility.These materials
The dielectric constant of each insulating layer formed is less than using LTCC as the dielectric constant of the ceramic base material layer of representative.
External terminal 24a, 24b are formed on the mounting surface (being upper surface under the visual angle in Fig. 1) of laminated body 11.It should
RFID module 101 is mounted on aftermentioned antenna substrate.Spoke by the installation, on external terminal 24a, 24b and antenna substrate
Penetrate element connection.
Fig. 2 is to constitute the thermoplastic resin sheet of RFID module 101 and be formed in the various of these thermoplastic resin on pieces to lead
The exemplary bottom view (figure in terms of lower surface when each thermoplastic resin sheet) of body pattern.
The element pattern of respectively rectangular coil shape is formed on thermoplastic resin sheet (hereinafter referred to as " resin sheet ") 11d
20a,20b.It is formed with pad electrode 21a in the first end of element pattern 20a, is formed with tip electrodes 22a in second end.Together
Sample, is formed with pad electrode 21b in the first end of element pattern 20b, is formed with tip electrodes 22b in second end.Pad electrode
21a, 21b have has 2 sides of input and output terminal from element pattern 20a, 20b along the formation of RFID IC chip 50
The shape that end is extended.The element pattern 20c with 2 rectangular coil shape portions is formed on resin sheet 11c.In the part drawing
The both ends of case 20c are formed with tip electrodes 23a, 23b.External terminal 24a, 24b are formed on resin sheet 11a.In resin sheet
There are another resin sheets for the outside of 11d.
The tip electrodes 23a of the tip electrodes 22a and element pattern 20c of element pattern 20a connect via via hole conductor 31a
It connects.The tip electrodes 23b of the tip electrodes 22b and element pattern 20c of element pattern 20b are connected via via hole conductor 31b.Element
Tip electrodes 23a, 23b and external terminal 24a, 24b of pattern 20c is via via hole conductor 32a, 32b, 33a, 33b, 34a, 34b
Connection.
Fig. 3 (A) is the cross-sectional view of the RFID module 101 of the part A-A in Fig. 2.It is located at the square in left side in element pattern 20c
Shape spiral-form portion and element pattern 20a are overlapped with substantially coaxial relationship.Equally, positioned at right side in element pattern 20c
Rectangular coil shape part and element pattern 20b are overlapped with substantially coaxial relationship.Tip electrodes 23a and external terminal 24a is passed through
It is connected by via hole conductor 32a, 33a, 34a.Equally, tip electrodes 23b and external terminal 24b via via hole conductor 32b, 33b,
34b connection.According to this structure, first is constituted positioned at the rectangular coil shape part in left side and element pattern 20a in element pattern 20c
Coiled type conductive pattern, the rectangular coil shape part and element pattern 20b that right side is located in element pattern 20c constitute the second coil
Shape conductive pattern.
Fig. 3 (B) is the bottom view obtained from the input and output terminal side of IC chip 50 from RFID.RFID IC core
Piece 50 is the shape of cuboid, and input and output terminal 50Ea, 50Eb are parallel to each other along the bottom surface of RFID IC chip 50
2 side configurations.Length of via hole conductor 35a1, the 35a2 relative to input and output terminal 50Ea, the 50Eb configured along above-mentioned 2 sides
Edge direction center configures on symmetrical position.Chain-dotted line in Fig. 3 (B) indicates the line in above-mentioned longitudinal direction center.
The input and output terminal 50Ea and pad electrode 21a of RFID IC chip 50 connect via via hole conductor 35a1,35a2
It connects.Equally, input and output terminal 50Eb is connect with pad electrode 21b via via hole conductor 35b1,35b2.
Especially via hole conductor 35a1,35a2,35b1,35b2 are arranged near each end of pad electrode 21a, 21b.
According to above structure, the inclination of pad electrode 21a, 21b are mitigated, the RFID IC chip in laminated body 11
Structure and electrical connection around 50 stabilize.
Above-mentioned via hole conductor 35a1,35a2,35b1,35b2 are one of the utility model " the first interlayer connection conductor "
Example.The diameter of via hole conductor 35a1,35a2,35b1,35b2 are for example at 40 μm or more 90 μm hereinafter, preferably 60 μm or more
70 μm or less.Via hole conductor 31a, 32a, 33a, 34a, 31b, 32b, 33b, 34b are the utility model " the second interlayer connections
One example of conductor ".The diameter of via hole conductor 31a, 32a, 33a, 34a, 31b, 32b, 33b, 34b are for example at 60 μm or more
140 μm hereinafter, preferably 90 μm or more 110 μm or less.
Laminated body 11 has longitudinal direction, and above-mentioned First Line round conductive pattern configuration is attached in the first end of longitudinal direction
Closely, the configuration of above-mentioned second coiled type conductive pattern is near the second end of longitudinal direction, and RFID is with IC50 from thermoplastic resin
When the stacking direction of layer is overlooked, configure between First Line round conductive pattern and the second coiled type conductive pattern.To RFID
Module 101 can be realized miniaturization, and is able to suppress First Line round conductive pattern and is formed by coil and the second coiled type
Conductive pattern is formed by unnecessary coupling between coil.
Fig. 4 is the circuit diagram of RFID module 101.Here, inductor L1, L2 is equivalent to element pattern 20a, 20b, inductance
Device L3, L4 are equivalent to element pattern 20c.
As shown in Figure 2 and Figure 3, input and output terminal 50Ea, 50Eb and pad electrode 21a of RFID IC chip 50,
The interlayer of 21b is respectively present multiple (being 2 in present embodiment) via hole conductor 35a1,35a2,35b1,35b2.
According to the present embodiment, the deformation of pad electrode caused by the stress on pad electrode 21a, 21b is concentrated is delayed
With can be avoided pad electrode 21a, 21b and RFID EDGE CONTACT of IC chip 50.
In addition, if the interlayer connection conductor that input and output terminal and pad electrode are connected on interlayer direction is 1,
When the relative positional relationship of interlayer connection conductor and chip type electronic component changes, the chip type electronic member device in laminated body
Part is possible to tilt, and according to the present embodiment, since input and output terminal and pad electrode pass through multiple interlayer connection conductors
Connection, therefore can be avoided above-mentioned inclined generation.
In addition, the end of pad electrode 21a is compressed by via hole conductor 35a1,35a2, the end of pad electrode 21b is by mistake
Hole conductor 35b1,35b2 are compressed, therefore can effectively inhibit the deformation of pad electrode 21a, 21b.
There is area to be greater than input and output terminal 50Ea, 50Eb and the stacking from thermoplastic resin by pad electrode 21a, 21b
When direction is overlooked not with the Chong Die region of IC chip 50 RFID.As noted previously, as can be avoided because of pad electrode 21a, 21b
Problem caused by deformation, therefore the RFID IC chip 50 of various sizes can be buried.That is, even if using various sizes of
In the case where RFID IC chip, single laminated body 11 also can be used.
In addition, the first via hole conductor is (by input and output terminal 50Ea, 50Eb and pad electrode of RFID IC chip 50
21a, 21b interlayer connection via hole conductor 35a1,35a2,35b1,35b2) diameter less than the second via hole conductor (by part drawing
Case 20a, 20b and via hole conductor 31a, 31b of element pattern 20c interlayer connection, by tip electrodes 23a, 23b and external terminal
24a, 24b interlayer connection via hole conductor 34a, 34b) diameter.Therefore, RFID IC chip 50 and pad electrode 21a, 21b
Between have resiliency, stress on pad electrode 21a, 21b concentration is further mitigated.In addition, can also be suitable for tool
There are the chip type electronic component of smaller input and output terminal 50Ea, 50Eb.
Moreover, pad electrode 21a, 21b and RFID with input and output terminal 50Ea, 50Eb of IC chip 50 respectively via
Multiple via hole conductor connections, therefore RFID IC chip is inclined relative to the burial place of pad electrode 21a, 21b in the surface direction
The permission of difference is higher.That is, even if RFID is occurred with IC chip 50 relative to the position of pad electrode 21a, 21b in the surface direction
Deviation can also ensure that electrical connection due to being connected via 1 or more via hole conductor.
The manufacturing method of the RFID module 101 of present embodiment is as described below.
(1) prepare the thermoplastic resin sheet that single side posts Cu foil, pattern is formed on Cu foil by photoetching, thus in thermoplastic
Defined conductive pattern is respectively formed on property resin sheet 11a~11d.That is, forming element pattern on thermoplastic resin sheet 11d
20a, 20b and pad electrode 21a, 21b.Element pattern 20c is formed on thermoplastic resin sheet 11c.In thermoplastic resin sheet
External terminal 24a, 24b are formed on 11a.The electrode to connect with via hole conductor is formed in other thermoplastic resin on pieces.
(2) then, using laser processing method, via hole is formed at the specified position of thermoplastic resin sheet, and pass through silk screen
Print process etc. fills conductive paste in the via hole.These conductive pastes pass through after heating pressurization operation and become
Via hole conductor.
(3) RFID IC chip 50 and multiple thermoplastic resin sheets one including thermoplastic resin sheet 11a~11d will be included
And be laminated, pressurized, heated is to form laminated body 11.
(4) the above each process is handled under the assembly substrate state of multiple RFID modules 101, it is last another each and every one
Ground is split, to obtain multiple RFID modules 101.
(embodiment 2)
In embodiment 2, the shape for enumerating the first via hole is different from several examples of embodiment 1.
Fig. 5 is the resin sheet for the RFID module for constituting embodiment 2 and the various conductor figures that are formed on these resin sheets
The exemplary bottom view (figure when looking up from the lower surface of each thermoplastic resin sheet) of case.In this example, have RFID IC
Via hole conductor 36a, 36b that the input and output terminal of chip 50 is connect with pad electrode 21a, 21b interlayer.Via hole conductor 36a by
Multiple via hole conductors are constituted.That is, what adjacent via hole conductor was connected to.Equally, via hole conductor 36b is also to be led by adjacent via hole
Body is connected to be formed.By laser processing method, multiple laser is irradiated to the specified position of thermoplastic resin sheet, is continuously formed phase
Adjacent hole, and conductive paste is filled in hole, to form the via hole conductor of the connected shape of adjacent via hole conductor.Other
Structure is identical as shown in embodiment 1.
Fig. 6 is the resin sheet for another RFID module for constituting embodiment 2 and be formed on these resin sheets various lead
The exemplary bottom view of body pattern.In this example, have by the input and output terminal of RFID IC chip 50 and pad electrode 21a,
Via hole conductor 37a, 37b of 21b interlayer connection.The cross sectional shape of these via hole conductors 37a, 37b are ellipse and have long axis.
That is, substantially continuously irradiation swashs when forming via hole at the specified position of thermoplastic resin sheet using laser processing method
Light forms elliptical aperture, and conductive paste is filled in elliptical aperture, so that Formation cross-section shape is the via hole conductor of ellipse.
Other structures are identical as shown in embodiment 1.
According to the present embodiment, the stress on pad electrode, which is concentrated, further mitigates, and can be avoided the office of pad electrode
Portion's deformation, so as to avoid the EDGE CONTACT of pad electrode and chip type electronic component.
In each embodiment illustrated above, multiple first via holes line up one in the longitudinal direction of input and output terminal
Column, but multiple row can also be lined up.
(embodiment 3)
Fig. 7 is the thermoplastic resin sheet for the RFID module 103 for constituting embodiment 3 and is formed in these thermoplastic resin sheets
On various conductive patterns exemplary top view.Fig. 8 (A) is the cross-sectional view of the RFID module 103 of the part A-A in Fig. 7.Figure
8 (B) are indicated from input and output terminal 50Ea, 50Eb of RFID IC chip 50 to the interconnecting piece knot of tip electrodes 25a, 25b
The enlarged partial sectional view of structure.
Element pattern 20a, 20b of respectively rectangular coil shape are formed on resin sheet 11e.The of element pattern 20a
One end is formed with pad electrode 25a, is formed with tip electrodes 22a in second end.Equally, in the first end shape of element pattern 20b
At there is pad electrode 25b, tip electrodes 22b is formed in second end.Pad electrode 25a, 25b have along RFID IC core
The shape that the formation of piece 50 has 2 sides of input and output terminal to extend from the end of element pattern 20a, 20b.Resin sheet 11d
On be formed with the element pattern 20c with 2 rectangular coil shape portions.Tip electrodes are formed at the both ends of element pattern 20c
23a,23b.Be also formed on resin sheet 11d on pad electrode 21a, 21b resin sheet 11a be formed with external terminal 24a,
24b.There are another resin sheets between resin sheet 11a and resin sheet 11c.
Input and output terminal 50Ea, 50Eb of RFID IC chip 50 are configured in the bottom surface along RFID IC chip 50
Opposite 2 side position on.Input and output terminal 50Ea, 50Eb and pad electrode 21a, 21b are via via hole conductor
35a1,35a2,35b1,35b2 connection.Pad electrode connects conductor 45a, 45b for pad electrode 21a, 21b and tip electrodes
25a, 25b connection.
As shown in Fig. 8 (B), when being overlooked from the stacking direction of resin sheet 11a~11e, via hole conductor 35a1,35a2,
Region where 35b1,35b2 indicates with first area Z1a, Z1b, the region second area where via hole conductor 45a, 45b
Z2a, Z2b are indicated.As shown in Fig. 8 (B), second area Z2a, Z2b are than first area Z1a, Z1b closer to RFID IC chip
50 center.
According to above structure, even if pad electrode 21a, 21b deform, pad caused by also can be avoided because of the deformation
Electrode 21a, 21b are contacted with the edge (position indicated in Fig. 8 (B) with P) of RFID IC chip 50.RFID IC chip 50
Region insulated body film 50P in input and output terminal 50Ea, 50Eb forming face, in addition to input and output terminal 50Ea, 50Eb
Covering, therefore even if via via hole conductor 45a, 45b act on the pressure on pad electrode 21a, 21b by pad electrode 21a,
21b presses to input and output terminal 50Ea, 50Eb forming face of RFID IC chip 50, and pad electrode 21a, 21b will not be with
RFID is conducted with the substrate of IC chip 50.
(embodiment 4)
The example of RFID tag is enumerated in embodiment 4.The RFID tag of present embodiment is suitable for quality control of for example weaving
Label for clothing, the various Famous Labels etc. of reason label, uniform management etc..
Fig. 9 is the perspective view of the RFID tag 203 of embodiment 4.The RFID tag 203, which has, to be formed with by conductive pattern
The antenna substrate 91 and RFID module 101 of radiating element 81a, 81b of composition.The structure of RFID module 101 such as embodiment party
Shown in formula 1.
Radiating element 81a, 81b constitute dipole antenna.Antenna substrate 91 is that PET etc. has resin sheet flexible.Radiation element
Part 81a, 81b are that aluminium foil or copper foil etc. have conductor flexible.
Figure 10 is the cross-sectional view for indicating the interconnecting piece structure of RFID module 101 and antenna substrate 91.Outside RFID module 101
Portion terminal 24a, 24b and radiating element 81a, 81b are connected via scolding tin 38a, 38b.In RFID module 101, external terminal 24a,
The forming region of 24b and the embedded region of RFID IC chip 50 are respectively rigid region, and other is flexible region.Therefore, i.e.,
It is bent RFID tag 203, antenna substrate 91 and RFID module 101 can also be bent as illustrated in fig. 10, thus RFID IC core
Piece 50 not will receive very big bending stress.
Figure 11 is the circuit diagram for indicating the effect of the RFID module 101 in RFID tag 203.External terminal 24a, 24b it
Between have capacitor Cp of the RFID in IC chip 50, so that resonance at two occur in RFID tag 203.At first resonance be by
Resonance that radiating element 81a, 81b, inductor L3, L4 are constituted and occurring in the current path that is indicated with electric current i1, at second
Resonance is occurred in current path (current loop) that is being made of inductor L1~L4 and capacitor Cp and being indicated with electric current i2
Resonance.This inductor L3~L4 that resonance is shared by each current path at two is coupled.
At above-mentioned first at the resonance frequency of resonance and second resonance frequency of resonance by inductor L3~L4's
It influences.Can be generated between the resonance frequency of resonance at the resonance frequency of resonance and second at first number 10Mhz (specially 5~
50MHz or so) difference.By coupling resonance at above-mentioned two, wide band resonant frequency characteristic can be obtained.
(embodiment 5)
The shape that antenna substrate and radiating element are shown in embodiment 5 is different from the several of shape shown in embodiment 4
RFID tag.
Figure 12 (A) is the perspective view of the RFID tag 204A of embodiment 5.Figure 12 (B) is after separating RFID module 101
Indicate the perspective view of the shape of radiating element 81a, 81b.The length direction center of radiating element 82a, 82b are equipped with rectangular pass through
Through-hole HL2 is additionally provided with the notch CT1 that through hole HL2 is extended to from outer rim.In this way, in the installation site of RFID module
Matching conductive pattern can be formed.
Figure 13 is the perspective view of another RFID tag 204B of embodiment 5.Some is formed on antenna substrate 92 to open
The square ring radiating element 83 put, opening portion are connect with the external terminal of RFID module 101.
Figure 14 is the perspective view of the another RFID tag 204C of embodiment 5.It is formed on antenna substrate 92 and Figure 12 (B)
Shown in radiating element there is the square ring radiating element 84 of through hole HL2 and notch CT1 in the same manner, the two of notch CT1
End is connect with the external terminal of RFID module 101.
As shown in Figure 12 (A), Figure 12 (B), Figure 14, matching conductive pattern can also be formed on radiating element.In addition,
As shown in figs. 13 and 14, radiating element is also possible to cricoid.
In example illustrated above, the layer that via hole conductor is connected to each other as the conductor that will be formed in different layers is listed
Between connect conductor example.Via hole conductor is the conductions such as filling conductive paste in the hole (via hole conductor hole) opened on sheet material
Thickener simultaneously makes it metallize and is formed, but as interlayer connection conductor, in addition to this there are also the inner surfaces for example in hole to carry out
Plating etc. forms the metallic objects such as via conductors, metallic pin or stud shape scolding tin obtained from metal film.
Finally, the explanation of above embodiment should be regarded as in all respects being to illustrate and not limit.Art technology
Personnel can be suitably deformed and change.The scope of the utility model indicates by the scope of the claims, and not by
Above embodiment indicates.Moreover, the scope of the utility model further includes in the range being equal with the scope of the claims
The change of embodiment.
Label declaration
Cp capacitor
CT1 notch
HL2 through hole
L1~L4 inductor
11 laminated bodies
11a~11e thermoplastic resin sheet (thermoplastic resin layer)
20a, 20b, 20c element pattern
21a, 21b pad electrode
22a, 22b, 23a, 23b tip electrodes
24a, 24b external terminal
31a, 32a, 33a, 34a, 31b, 32b, 33b, 34b via hole conductor (the second interlayer connection conductor)
35a1,35a2,35b1,35b2 via hole conductor (the first interlayer connection conductor)
36a, 36b via hole conductor (the first interlayer connection conductor)
37a, 37b via hole conductor (the first interlayer connection conductor)
38a, 38b scolding tin
45a, 45b via hole conductor
50 RFID are with IC chip (chip type electronic component)
50Ea, 50Eb input and output terminal
50P insulator film
81a, 81b, the radiating element of 82a, 82b, 83,84
91,92 antenna substrate
101 RFID modules (built-in component device)
230 RFID tags
204A, 204B, 204C RFID tag.
Claims (8)
1. a kind of built-in component device has the laminated body of multiple thermoplastic resin layers and is embedded in the laminated body
Chip type electronic component, which is characterized in that
The chip type electronic component has input and output terminal,
The laminated body has:
Pad electrode, the pad electrode are formed in the input in the multiple thermoplastic resin layer with the chip type electronic component
The different thermoplastic resin layer of layer where output terminal；And
Multiple first interlayer connection conductors, multiple first interlayer connection conductor make the input and output terminal and pad electricity
Pole is connected on interlayer direction,
The laminated body have the conductive pattern that direction in the face along the thermoplastic resin layer is arranged and with the conductive pattern
Second interlayer connection conductor of conducting, the conductive pattern and second interlayer connection conductor constitute element,
The diameter of the multiple first interlayer connection conductor is less than the diameter of second interlayer connection conductor.
2. built-in component device as described in claim 1, which is characterized in that
The chip type electronic component is the shape of cuboid, and the input and output terminal is along the chip type electronic component
2 to be parallel to each other the side of bottom surface configures,
The pad electrode is the shape extended along 2 sides,
Long side side of the multiple first interlayer connection conductor relative to the input and output terminal configured along 2 sides
To center configuration on symmetrical position.
3. built-in component device as claimed in claim 1 or 2, which is characterized in that
The first adjacent interlayer connection conductor is continuous in the multiple first interlayer connection conductor.
4. a kind of built-in component device has the laminated body of multiple thermoplastic resin layers and is embedded in the laminated body
Chip type electronic component, which is characterized in that
The chip type electronic component has input and output terminal,
The laminated body has:
Pad electrode, the pad electrode are formed in the input in the multiple thermoplastic resin layer with the chip type electronic component
The different thermoplastic resin layer of layer where output terminal；And
First interlayer connection conductor, first interlayer connection conductor make the input and output terminal and the pad electrode in interlayer
It is connected on direction, and the cross sectional shape in the plane along the thermoplastic resin layer for ellipse and has long axis,
The laminated body have the conductive pattern that direction in the face along the thermoplastic resin layer is arranged and with the conductive pattern
Second interlayer connection conductor of conducting, the conductive pattern and second interlayer connection conductor constitute element,
The diameter of the multiple first interlayer connection conductor is less than the diameter of second interlayer connection conductor.
5. built-in component device as claimed in claim 4, which is characterized in that
The chip type electronic component is the shape of cuboid, and the input and output terminal is along the chip type electronic component
2 to be parallel to each other the side of bottom surface configures,
The pad electrode is the shape extended along 2 sides,
First interlayer connection conductor is configured along 2 sides.
6. built-in component device as claimed in claim 5, which is characterized in that
Longitudinal direction of first interlayer connection conductor relative to the input and output terminal that is configured along 2 sides
Center configuration is on symmetrical position.
7. built-in component device as described in claim 1 or 4, which is characterized in that
There is area to be greater than the input and output terminal and bow from the stacking direction of the thermoplastic resin layer for the pad electrode
The apparent time not region Chong Die with the chip type electronic component.
8. a kind of RFID tag, comprising: have the insulator substrate flexible and tool of the radiating element formed by conductive pattern
Have the RFID module of external terminal, the RFID module is mounted on the insulator substrate, and the external terminal with it is described
Radiating element connection, which is characterized in that
The RFID module has:
The laminated body of multiple thermoplastic resin layers, the coiled type conductor figure being made of the conductor for being formed in the thermoplastic resin layer
Case and it is embedded in the intracorporal RFID IC of the stacking,
The RFID has input and output terminal with IC,
The laminated body has the pad electrode and the external terminal be connected with the RFID with the input and output terminal of IC,
The engagement that the RFID passes through the input and output terminal and the pad electrode with IC and the coiled type conductive pattern
And connect,
The pad electrode is formed in the multiple thermoplastic resin layer with the RFID where the input and output terminal of IC
The different thermoplastic resin layer of layer,
The input and output terminal is connected on interlayer direction with the pad electrode by multiple first interlayer connection conductors,
The laminated body has longitudinal direction,
The coiled type conductive pattern includes First Line round conductive pattern and the second coiled type conductive pattern,
The First Line round conductive pattern configuration is near the first end of the longitudinal direction, the second coiled type conductor figure
Case configures near the second end of the longitudinal direction, and the RFID is bowed with IC from the stacking direction of the thermoplastic resin layer
Apparent time configures between the First Line round conductive pattern and the second coiled type conductive pattern.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015248705 | 2015-12-21 | ||
| JP2015-248705 | 2015-12-21 | ||
| PCT/JP2016/086968 WO2017110571A1 (en) | 2015-12-21 | 2016-12-13 | Device with built-in component, rfid tag, and method for producing device with built-in component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208188872U true CN208188872U (en) | 2018-12-04 |
Family
ID=59090212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201690001476.XU Active CN208188872U (en) | 2015-12-21 | 2016-12-13 | Built-in component device and RFID tag |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6394822B2 (en) |
| CN (1) | CN208188872U (en) |
| WO (1) | WO2017110571A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019152645A1 (en) * | 2018-02-01 | 2019-08-08 | Shockwatch, Inc. | Temperature indicator |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007034786A (en) * | 2005-07-28 | 2007-02-08 | Dainippon Printing Co Ltd | Composite ic card and its manufacturing method |
| JP2008140293A (en) * | 2006-12-05 | 2008-06-19 | Toppan Printing Co Ltd | Antenna sheet, ic card and manufacturing method for ic card |
| JP2009258943A (en) * | 2008-04-16 | 2009-11-05 | Omron Corp | Strap, tag inlet, and rfid tag |
-
2016
- 2016-12-13 CN CN201690001476.XU patent/CN208188872U/en active Active
- 2016-12-13 JP JP2017557890A patent/JP6394822B2/en active Active
- 2016-12-13 WO PCT/JP2016/086968 patent/WO2017110571A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017110571A1 (en) | 2017-06-29 |
| JPWO2017110571A1 (en) | 2018-07-12 |
| JP6394822B2 (en) | 2018-09-26 |
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