WO2017108390A1

WO2017108390A1 - Apparatus and method for positioning and transmitting electronic components

Info

Publication number: WO2017108390A1
Application number: PCT/EP2016/079877
Authority: WO
Inventors: Gerhard Schiller
Original assignee: Muehlbauer GmbH & Co. KG
Priority date: 2015-12-23
Filing date: 2016-12-06
Publication date: 2017-06-29
Also published as: DE102015016763B3

Abstract

An apparatus for positioning and transmitting electronic components which are provided on a substrate comprises a support for positioning the substrate which rests on the support. The support is provided with a passage opening which has a longitudinal axis which extends in a Z-direction and coincides with an optical axis of an image data recording device. The image data recording device is designed to record image data for determining the position of the electronic components through the passage opening and making them available to a control unit. An output device is provided for acting on the substrate in an operating direction through the passage opening. The control unit is designed to position the electronic component, which is to be transmitted, relative to the passage opening depending on the recorded image data. Furthermore, the control device is designed to move the output device between a first end position, in which the output device is situated outside the optical axis, and a second end position, in which the operating direction of the output device coincides approximately with the optical axis, in a controlled manner.

Description

DEVICE AND METHOD FOR POSITIONING AND TRANSFERRING

ELECTRONIC COMPONENTS

description

background

An apparatus and method for positioning and transmitting electronic components provided on a substrate are described.

When transferring electronic components, in particular when transferring isolated electronic components, there is generally the problem that they are subjected to continuous miniaturization, so that the requirements with regard to the accuracy in transferring the electronic components, for example from a carrier substrate to a receiving substrate, increase continuously.

State of the art

The prior art includes optical inspection systems for measuring electronic components, e.g. from DE 10 2006 027 663 A1, concepts for detecting the position of a substrate, e.g. from JP 2009 016455 A, and systems for transferring electronic components from a first to a second substrate, e.g. from DE 197 34 317 AI, known.

Thus, JP 05-029439 A describes a device for positioning and transmitting on a substrate provided electronic components. The substrate providing the electronic components rests on a support of the device and can be positioned relative thereto. The overlay is provided with a through opening through which a slider interacts with the substrate thereby releasing the electronic components from the substrate. In order to enable a precise positioning of the electronic components relative to the slider, an image data acquisition device for determining the position of an electronic component to be transmitted is provided. The image data acquisition device is provided for capturing image data of the electronic components to be transmitted through the passage opening. For this purpose, the image data acquisition device is arranged coaxially to the slider, which lies in an optical axis of the image data acquisition device. Devices are furthermore known from the state of the art, for example from DE 10 2011 104 225 A1, in which an image data acquisition device is positioned laterally offset from the passage opening and the slide. An optical axis of the image data acquisition device is arranged obliquely to the support and thereby with an angular offset to a direction of action of the slider. It can thereby be prevented that an area to be detected on the substrate by means of the image data acquisition device is at least partially covered by the slider.

DE 10 2011 017 218 A1 shows an apparatus and a method for positioning and transmitting electronic components provided on a substrate, comprising an image data acquisition device, wherein it has an optical axis which is inclined relative to the direction of action of a dispenser.

JP 3 228 959 B2 shows an apparatus for transmitting electronic components provided on a substrate, comprising an image data acquisition device which has an optical axis which is equal to the effective direction of a delivery device. However, it is not possible with the device shown to capture image data, without at least each part of the electronic components is covered by the dispenser.

Problem to be solved

The object now is to provide a device and a method that meet the requirements for accuracy in positioning and transmitting provided on a substrate electronic components.

Here presented solution

To solve this problem, a device having the features of claim 1 and a method having the features of claim 14 are proposed.

The device for positioning and transmitting electronic components provided on a substrate comprises a carrier for positioning the substrate to be received in the device. The carrier is configured such that the substrate bears against the carrier with a first side, the first side of the substrate to be picked up being arranged opposite to a second side of the male substrate carrying at least one electronic component. The carrier is provided with a through hole having a longitudinal axis extending in a Z direction. An image data acquisition device having an optical axis coincident with the longitudinal axis of the through-hole is configured to capture image data for determining the position of the at least one electronic component through the through opening and to provide it for a control unit available. A delivery device for transferring the electronic components from the substrate is configured to act on the substrate in a direction of action through the passage opening. The control unit is set up to move the carrier and the substrate in a controlled manner relative to one another in an X and Y direction by means of at least one first actuator in order to move the at least one electronic component received on the first side of the substrate relative to the passage opening in dependence on the to position image data acquired by the image data acquisition device. Furthermore, the control unit is set up, by means of at least one second actuator, the dispensing device between a first end position in which the dispenser is outside the optical axis of the image data acquisition device, and a second end position of the dispenser in which the direction of action of the dispenser approximately with the optical axis of the image data acquisition device coincides to move controlled.

For purposes of the present disclosure, the X, Y, and Z directions correspond to vectors that are not coplanar, i. are arranged linearly independent and preferably in each case perpendicular to each other.

The apparatus described herein for positioning and transferring to a sub ^¬ strat-provided electronic components enables a detection of the particular for determining the position of the electronic components image data in the Z-direction, ie perpendicular to the support without a to be detected by the image data acquisition device area at least partially , For example, by the dispenser or by side walls of the passage opening, is covered. As a result, an accurate determination of the position of the electronic components to be transmitted can take place, in particular in the case of small components.

Compared to the devices known from the prior art, in which the optical axis of the image data acquisition device is arranged obliquely to the carrier, the solution described here makes it possible for the passage opening formed in the carrier to have a smaller diameter, without losing access to the image data acquisition device obscuring the area of detection. This has the advantageous effect that, in particular when transferring the electronic components, a deformation or overstretching of the substrate in the region of the passage opening can be reduced. This allows the accuracy of the direction when positioning and transmitting the electronic components are increased. It is also advantageous that the electronic components to be transmitted can be arranged at a smaller distance from each other on the substrate. Such an arrangement may be particularly advantageous if the components to be transferred are transferred from the substrate to another substrate (wafer-to-wafer method). Furthermore, tilting away or premature detachment of components that adjoin the component to be transferred can be prevented, which, for example, can lead to undesirable contact with a component accommodating the electronic components.

A further advantage is that the acquisition of the image data for determining the position of the electronic component to be transmitted can take place at any distance in the Z direction between the carrier and the image data acquisition device. This allows the image data intended for position determination to be detected in different positions of the carrier.

Embodiments and properties

The present disclosure relates to an apparatus for positioning and transmitting electronic components provided on a substrate. An electronic component is understood in particular as meaning (electronic) semiconductor components, which are also referred to as "chips" or "the". Such a component usually has a prismatic shape with several lateral surfaces and two (lower and upper) contact surfaces in the form of a polygon, in particular a rectangle. The electronic components are preferably arranged with a first contact surface on the second side of the substrate. In order to fix the electronic components on the substrate, the electronic parts ^¬ construction between the first contact surface and the second side of the substrate, a releasable adhesive joint may be provided. For this purpose, the substrate may have an adhesive layer on the second side. The electronic components are preferably arranged individually on the substrate. In this case, the electronic components may have been arranged on the substrate before being singulated.

The substrate may be provided in the form of a wafer, in particular as a wafer film or wafer wafer. The substrate preferably comprises a transparent material. Transparent in the sense of the present disclosure means that the substrate is transparent to a wavelength range of electromagnetic radiation. This wavelength range can be, for example, in the ultraviolet (UV) range, in Range of visible to human radiation and / or in the infrared (IR) range lie.

The transparent material of the substrate may be provided for enabling acquisition of image data for determining the position of the at least one electronic component by means of the image data acquisition device through the substrate. Accordingly, the image data acquisition device can be configured to detect the image data for determining the position of the at least one electronic component accommodated on the substrate through the substrate.

Alternatively, markings may be provided on the first side of the substrate, allow conclusions on the position of the on the second side of the substrate being arrange ^¬ th electronic components. Such markings may be formed, for example, in the form of sawing streets, which may arise during the separation of the electronic components arranged on the substrate.

The apparatus may further comprise a receptacle for the substrate adapted to receive the substrate so as to abut the support with the first side. The substrate may be movable in the receptacle in the X and Y directions and / or rotatably mounted about an axis extending in the Z direction.

On a side facing the substrate, the carrier may have a support surface for the substrate. The support surface is preferably formed planar.

Alternatively, the support surface may be curved. The carrier is preferably a plate-shaped carrier, which is arranged substantially perpendicular to the Z-direction and the longitudinal axis of the passage opening.

In the sense of the present disclosure, a longitudinal axis of the passage opening is understood to mean any axis along which the passage opening extends and which is arranged within the passage opening, and preferably a central longitudinal axis of the passage opening.

The passage opening is preferably formed with a cylindrical or prismatic shape, wherein the passage opening has side walls which are arranged parallel to each other. Alternatively, the through-hole may have the shape of a conical or pyramidal portion or some other shape. In order to fix the substrate resting against the carrier relative to the carrier, the carrier can be subjected to negative pressure and be permeable to pressure on the side of the carrier facing the substrate. For this purpose, the carrier may have vacuum channels, which may extend within the carrier. The vacuum channels may be connected to a vacuum source. In a variant, the carrier may have a negative pressure act bare chamber, which may be connected to a first end of the respective vacuum channels. Furthermore, a second end of the respective vacuum channels may be connected to an opening formed on the support surface of the carrier. The bearing surface of the carrier can be provided with one or more openings. The design parameters of the openings, such as number, shape, dimensioning, arrangement, etc., can be made depending on the voltage applied to the support substrate and the electronic components to be arranged thereon. The provision of vacuum channels in combination with a smaller diameter of the through-hole, which is made possible by the solution proposed here, has the advantageous effect that the vacuum channels during the transfer of the electronic components can be arranged closer to the electronic component to be transferred. Thus, overstretching of the substrate in the region of the passage opening can be reduced, thereby improving the accuracy of the device.

In a variant of the device, the carrier may be adapted to be moved in the X and Y directions relative to the substrate, to be moved in the Z direction relative to the dispenser and / or to move in the Z direction. Direction extending axis to be rotated relative to the substrate.

In a further development, the carrier may comprise a transparent material. The transparent material of the carrier can be provided for enabling acquisition of image data for determining the position of the at least one electronic component by means of the image data acquisition device through the carrier.

In another embodiment of the device, the image data acquisition device is arranged such that its optical axis coincides with the central longitudinal axis of the passage opening. The image data acquisition device and the carrier can in this case be fixed relative to one another in the X and Y directions. In addition, they may be movable relative to each other in the Z direction. Alternatively, the image data acquirer and the carrier may be fixed relative to each other in the Z direction. The device further comprises the dispenser for transmitting the electronic components. The dispenser may be configured to individually disengage the electronic components to be transferred from the substrate and place them on a receiving substrate. In a preferred embodiment, the dispensing device is arranged on a side of the carrier facing away from the substrate, wherein the receiving substrate can be arranged opposite to the second side of the substrate carrying the electronic components. The receiving substrate can be, for example, an antenna web. Alternatively, the receiving substrate may be provided in the form of a wafer or a wafer at least partially populated with electronic components. On a side receiving the electronic components, the receiving substrate may have a further layer of adhesive material in order to fix the electronic components on the receiving substrate. In a further development ^¬ the apparatus may comprise a further recess for the receiving substrate, in which the receiving substrate in the X, Y and / or Z-direction can be movably supported.

The dispenser is configured to be moved by means of the second actuator between the first end position and the second end position. For this purpose, the dispensing device can be mounted pivotably relative to the carrier. In a variant, the delivery device can be mounted pivotably about a pivot axis, which intersects the optical axis of the image data acquisition device, in particular in the region of the image data acquisition device and / or between the image data acquisition device and the support. Preferably, the pivot axis has a clotting ^¬ closer distance to the image data acquisition device than to the carrier.

The first end position of the delivery device is characterized in that it permits acquisition of image data of at least one electronic component by the image data acquisition device along the optical axis, without parts of the delivery device optically covering parts of the component.

The second end position is characterized by allowing transfer of the component from the substrate through the dispenser along a direction of action.

Alternatively or additionally, the pivot axis may be arranged perpendicular to the optical axis of the image data acquisition device or at a different angle between 0 ° and 90 ° offset therefrom. In this case, the pivot axis in the same Angle offset from the direction of action of the dispenser as to the optical axis of the image data acquisition device. Alternatively or additionally, the dispensing device can be mounted so as to be translationally displaceable relative to the carrier, in particular in the X and / or Y direction.

In a further embodiment of the device, the dispensing device may comprise a plunger, for example in the form of a needle (the ejector) or a slide, which is adapted to act on the electronic components through the passage opening and the substrate mechanically. In a variant of the device, the plunger may be adapted to be moved in the second end position of the dispenser relative to the carrier in the Z-direction to act on the electronic components to be transmitted.

In an alternative embodiment, the dispenser may be provided to act without contact on the substrate through the passage opening in order to release the components to be transferred from the substrate. For this purpose, the dispenser may include a first radiation source such as a laser, a laser ^¬ pulser, etc., include that is adapted to release the adhesive bond between the electronic components and the substrate. In a variant, the first radiation source can be provided to emit electromagnetic radiation which dissolves the adhesive connection between the electronic components to be transmitted and the substrate. This can be done for example by a targeted melting of a used for the adhesive connection between the electronic components to be transmitted and the substrate pressure-sensitive adhesive. For example, the first radiation source can deliver UV radiation or IR radiation in a targeted manner in a region in the region of the passage opening in order to release the adhesive connection.

In a variant, the dispenser may be provided in the second end position to move the plunger or the first radiation source into an alignment position relative to the through-opening in the X and Y directions. As a result, the effective direction of the dispensing device can be arranged in a targeted manner relative to the passage opening.

In a further development of the device, the passage opening of the carrier and / or the plunger of the delivery device can be adapted in shape to the electronic components to be transferred. In particular, the shape of a cross-sectional area of the passage opening and / or a contact area can / may be the ram in shape to the second side of the substrate facing first contact surface of the electronic components to be transmitted to be adapted.

The control unit of the device is configured to move the carrier and the substrate relative to one another in the X and Y directions by means of the first actuator. For this purpose, the control unit is preferably set up to determine position data of the at least one electronic component and / or correction values for the position of the carrier and / or the substrate from the image data acquired by the image data acquisition device and to generate control commands on the basis thereof. The control commands can bring about a positioning of the at least one electronic component ^accommodated on the substrate relative to the passage ^{opening of} the carrier by means of the first actuator.

Depending on the configuration of the device, the positioning of the electronic components to be transmitted relative to the passage opening of the carrier can be effected by moving the carrier and / or the substrate in the X and Y directions. Accordingly, the term "positioning" refers in particular to a relative movement between the carrier and the substrate.

In a further development, the device may comprise a further image data acquisition device, which is set up to capture image data for determining the position of the recording substrate, in particular a recording position on the recording substrate for the electronic components to be transmitted, and to make it available to the control unit. For this purpose, the further image data acquisition device can be arranged on a side of the receiving substrate facing away from the carrier. The control unit may be set in accordance therewith, in depen ^¬ dependence of the captured image data of the further image data acquisition device

To determine position data of the receiving substrate, in particular the pick-up position and / or correction values for the position of the carrier, the substrate, the dispensing means and / or the receiving substrate and producing on the basis of operation command ^¬ le. The control commands may be provided for effecting an alignment of the dispensing device, the carrier and the at least one electronic component accommodated on the substrate relative to the receiving substrate in the X and Y directions.

Depending on the configuration of the device, the alignment of the dispensing device, the carrier, the at least one electronic component accommodated on the substrate and the receiving substrate can be achieved by moving the dispensing device, the Carrier, the substrate and / or the receiving substrate in the X and Y directions. Accordingly, the term "aligning" particularly refers to a relative movement between the dispenser, the carrier, the substrate and the receiving substrate in the X and Y directions, so that the effective direction of the dispenser, the electronic component to be transmitted and the receiving position of the receiving substrate in a longitudinal axis the passage opening are arranged.

The control commands thus generated may cause the dispenser, the carrier, the substrate, and / or the receiving substrate to be moved to a respective alignment position. For the purposes of the present disclosure, the alignment position of a component is understood to mean a position in which the component is aligned in the X and Y directions for the transfer of the electronic component.

In a further development, the control unit may be configured to rotate the carrier and the substrate relative to each other about an axis extending in the Z direction, in particular the longitudinal axis of the through opening, by means of a third actuator. For this purpose, the control unit can be set up as a function of the image data acquired by the image data acquisition device

To generate control commands that cause each other, rotating the substrate and / or the carrier rela tively ^¬ about the longitudinal axis of the passage opening to allow positioning of the male electronic component on the substrate relative to the passage opening.

In a variant, the control unit may also be configured to move the carrier and / or the dispenser relative to one another in the Z direction by means of a fourth actuator. Depending on the configuration of the device, the carrier and / or the delivery device can / can be moved in the Z direction. In particular, the control unit may be arranged to move the carrier and / or the plunger of the delivery device in the Z-direction into a transfer position in which the electronic component to be transferred is detached from the substrate, and / or into a detachment position, whereby detachment of the to be transmitted electronic component is to move.

In a further development, the control unit may be configured to use the second actuator to controllably move a guide element interacting with the dispensing device in the Z direction, thereby sequentially displacing the dispensing device between the first and second end positions of the dispensing device and the dispenser Move plunger relative to the carrier in the Z direction controlled. In other words, a movement of the guide element can first cause a movement of the Abga ^¬ device between the first end position and the second end position Bewir ^¬ ken and then moving the plunger in the Z direction.

The apparatus may further comprise a heating element which is adapted to heat, especially in the region of the passage opening of the carrier, to be output to the sub ^¬ strat and / or the at least one electronic component to the at least one electronic component of the substrate at least partially to to solve. The heating element is preferably provided in the form of a second radiation source and adapted to emit electromagnetic radiation which is suitable for at least partially releasing the at least one electronic component from the substrate. The second radiation source may be particularly suited to dispense elekt ^¬ romagnetische radiation which dissolves the adhesive connection between the electronic components to be transmitted and the substrate at least partially. Thus, the second radiation source can deliver, for example, UV radiation or IR radiation ge ^¬ targets in a region in the region of the passage opening.

In a further development, the receiving substrate, in particular with a side facing away from the substrate, may be arranged on a receiving carrier. On the assumption ^¬ carrier is provided with a further passage opening, which may comprise a further longitudinal central axis, which coincides with the central longitudinal axis of the passage ^¬ opening of the wearer. The receiving carrier can also be acted upon by negative pressure to fix the receiving substrate relative to the recording medium. For this purpose, the recording medium may have on a the receiving substrate delivered ^¬ side adjacent vacuum channels.

Furthermore, the device may have a receiving device with a receiving punch, which is intended to act through the further passage opening of the receiving carrier through the receiving substrate in a further effective direction. The further direction of action of the receiving temple can be set against ^¬ set to the effective direction of the dispenser.

The control unit can furthermore be set up, by means of at least one fifth actuator, the receiving device between a first end position, in which the receiving device lies outside an optical axis of the further image data ^acquisition device, and a second end position of the receiving device, in which the further Effective direction of the receiving device with the optical axis of further image data acquisition device coincides to move controlled. The receiving stamp is preferably configured to move the receiving substrate along the Z-axis in the direction of the substrate and thereby bring the receiving substrate into contact with a second contact surface of the electronic component to be transferred. Accordingly, the control unit may further be configured to move in a controlled manner by means of at least one sixth actuator, the receiving punch relative to the receiving carrier in the Z direction.

In order to ensure a reliable transfer of the electronic components from the substrate to the receiving substrate, the device may be provided such that an adhesive force between the substrate and the first contact surface of the electronic component to be transferred is less than a further adhesive force between the receiving substrate and the second contact surface of the electronic component to be transferred. For this purpose, the Kotaktfläche the plunger, by means of which the plunger acts on the substrate, be smaller than a contact surface of the recording stamp, by means of which the receiving punch acts on the receiving substrate. In other words, a contact area between the substrate and the electronic component to be transmitted can thereby be smaller than a further contact area between the receiving substrate and the electronic component to be transmitted.

Here, a method of positioning and transmitting electronic components provided on a substrate is further described. The method comprises a step of providing the substrate with a first side bearing on a support and a second side opposite the first side supporting at least one electronic component, the support being provided with a through-hole opening in one Having Z-direction extending longitudinal axis. Further, moving a dispenser adapted to transfer the electronic components from the substrate to a first end position where the dispenser is out of an optical axis of an image data acquirer, wherein the optical axis of the image data acquirer coincides with the longitudinal axis of the through aperture , and wherein the dispenser is adapted to act through the passage opening on the substrate in a direction of action. Furthermore, the method comprises a step of acquiring image data for determining the position of the at least one electronic component accommodated on the substrate, the image data being detected by the image data acquisition device through the through-opening. Furthermore, moving the substrate and / or the carrier relative to each other in an X and Y direction, so that the at least one on the second side of the substrate recorded electronic component relative to the passage opening in response to the image data detected by the image data acquisition device. Furthermore, the method comprises moving the dispensing device into a second end position, in which the effective direction of the dispensing device coincides approximately with the optical axis of the image data acquisition device.

In a further development, the method may further comprise the following steps:

- Providing a receiving substrate;

- acquiring image data for determining the position of the receiving substrate, in particular a receiving position on the receiving substrate for an electronic component to übertra ^¬ constricting;

- moving the carrier, of the substrate, the dispensing means and / or the receiving substrate in the X and Y directions relative to each other in an alignment ^¬ position in dependence on the detected by the image data acquisition unit image data;

- Moving the carrier and / or a plunger of the dispensing device relative to each other in the Z direction in a transfer position;

Applying vacuum to the carrier so that the substrate abutting the carrier is fixed relative to the carrier; and or

- Moving the carrier and / or the plunger relative to each other in the Z direction in a detaching position, so that the plunger is passed through the through hole and thereby the one electronic component is released from the substrate and transferred to the receiving substrate.

Brief description of the drawings

Other objects, features, advantages and applications will become apparent to those skilled in the art from the following description of non-limiting embodiments and the accompanying drawings. All described and / or illustrated features alone or in any combination form the subject matter disclosed herein, also independent of their grouping in the claims or their back references.

Fig.la shows a schematic side view of a first embodiment of a device for positioning and transmitting provided on a substrate electronic components. 1 shows a diagrammatic side view of the first embodiment of the device for positioning and transmitting electronic components provided on a substrate, as compared to the illustration shown in FIG. 1a. shows a schematic side view of a second embodiment of a device for positioning and transmitting provided on a substrate electronic components. shows another schematic side view of the second embodiment of the device for positioning and transmitting provided on a substrate electronic components. shows a schematic side view of a third embodiment of a device for positioning and transmitting provided on a substrate electronic components. shows an embodiment of a method for positioning and transmitting on a substrate provided electronic components.

Detailed description of Ausführunqsvarianten

1 a and 1 b show two schematic side views rotated by 90 ° relative to each other of a first embodiment of an apparatus 10 for positioning and transmitting electronic components 14 provided on a substrate 12. The substrate 12 comprises a first side 16 and an electronic component 14 opposite thereto supporting second side 18. The first side 16 abuts against a carrier 20. On the second side 18 of the substrate 12 a plurality of isolated electronic components 14 are arranged. Between the second side 18 of the substrate 12 and the plurality of electronic components 14, an adhesive layer is arranged, which fixes the plurality of electronic components 14 on the substrate 12. The substrate 12 is held in a first receptacle 22, which comprises a first linear drive LA1 and a first rotary drive DA1.

The device 10 has a control unit ECU which is set up to adjust the substrate 12 along an X and Y axis by means of the first linear drive LA1. trolls to move and controlled by the first rotary drive DA1 to rotate about an axis extending in a Z direction.

The carrier 20 is a plate-shaped carrier which is arranged perpendicular to a Z-axis. In an approximately central region, the carrier 20 is provided with a passage opening 24 which extends in a thickness direction of the carrier 20 and has a central longitudinal axis M extending in the Z direction. The carrier 20 can be subjected to negative pressure and is permeable to pressure on a side facing the substrate 12 in order to fix the substrate 12 relative to the carrier 20.

A housing 26 of the device 10 is rigidly connected to the carrier 20 and an image data acquisition device 28. The image data acquisition device 28 has an optical axis O, which coincides with the central longitudinal axis M of the passage opening 24. The image data acquisition device 28 is adapted to detect Bildda ^¬ th BD for determining the position of an electronic component 14 to be transmitted through the through opening 24 and to provide for the control unit ECU is available.

The substrate 12 and / or the carrier 20 can furthermore have a transparent material, which enables the image data acquisition device 28 to acquire image data BD for determining the position of the electronic component 14 to be transmitted through the substrate 12 and / or the carrier 20.

The device 10 further comprises a dispenser 30 for transmitting the electronic components 14, which is arranged in a region between the image data acquisition device 28 and the carrier 20. The dispensing device 30 comprises a plunger 34, which is intended to mechanically act on the substrate 12 through the passage opening 24 in a direction of action W in order to detach the electronic component 14 to be transferred from the substrate 12 and thereby transfer it to a receiving substrate 32 , For this purpose, the delivery device 30 furthermore comprises a second linear drive LA2, the control unit ECU being set up to move the plunger 34 in a controlled manner relative to the carrier 20 along the Z-axis by means of the second linear drive LA2. In a variant, the control unit ECU can be set up to move, by means of the second linear drive LA2, the plunger 34 in a controlled manner relative to the passage opening 24 of the carrier 20 along the X and Y axes in order to align the plunger 34 relative to the carrier 20. The receiving substrate 32 is held in a second receptacle 33 and is arranged opposite to the second side 18 of the substrate 12. The second receptacle 33 may be configured to move the receiving substrate 32 relative to the substrate 12 and the carrier 20. On a substrate 12 facing side of the receiving substrate 32, a further adhesive layer is arranged to fix the electronic components to be transmitted 14 on the receiving substrate 32 by means of an adhesive connection. The device 10 is provided such that an adhesive force between the substrate 12 and the electronic component 14 to be transmitted is smaller than a further adhesive force between the receiving substrate 32 and the electronic component 14 to be transferred

Transfer of the electronic components 14 are ensured by the substrate 12 on the receiving substrate 32. For example, it can be provided for this purpose that the adhesive layer arranged on the substrate 12 has a lower adhesive force than the further adhesive layer arranged on the receiving substrate 32.

The dispenser 30 is pivotally mounted about a pivot axis S via a second rotary drive DA2 relative to the carrier 20 in the housing 26. The pivot axis S extends in the X direction and is arranged perpendicular to the optical axis O of the image data acquisition device 28. Further, the pivot axis S intersects the optical axis O in a region between the image data acquisition device 28 and the carrier 20.

The control unit ECU is set up by means of the second rotary drive DA2, the dispenser 30 between a first end position - as indicated in Fig. Lb with dashed lines, in which the dispenser 30 is located outside the optical axis O of the image data acquisition device 28, and a second End position - as shown in Fig. La and lb, in which the direction of action W of the dispenser 30 approximately coincides with the optical axis O of the image data acquisition device 28, controlled to move. In the embodiment shown in FIGS. 1 a and 1 b, the delivery device 30 is moved between the first and second end positions by pivoting the delivery device 30 about the pivot axis S, by about 45 °, by means of the second rotary drive DA 2.

The first end position of the dispensing device 30 is characterized in that it allows detection of image data BD at least of the electronic component 14 by the image data acquisition device 28 along the optical axis O, without parts of the dispenser 30 covering parts of the component 14 optically. The second end position of the dispenser 30 is characterized in that it allows a transfer of the component 14 from the substrate 12 by the dispenser 30 along a direction of action W.

Arranged on the housing 26, the device 10 further comprises a third linear drive LA3. The control unit ECU is set up to 26 controlled by the third linear drive LA3 the housing with the carrier 20, the image data acquisition means 28 and the dispenser 30 relative to the substrate 12 ent ^¬ long the X, Y and Z axes to move.

The control unit ECU is further adapted to determine position data of at least one to be transmitted, the electronic component 14, and correction values for the position of the substrate 12 and the carrier 20 from the captured by the Bilddatenerfas ^¬ sungseinrichtung 28 image data BD and on the basis of the position data determined in this way and correction values to generate control commands for the first, second and third linear actuators LA1, LA2, LA3 as well as for the first and second rotary actuators DA1, DA2. The control commands cause the substrate 12 and / or the carrier 20 to move along the X and Y axes in order to position the electronic component 14 to be transmitted relative to the passage opening 24 of the carrier 20. Furthermore, the control commands may cause the substrate 12 and the carrier 20 to move relative to the receiving substrate 32 in order to move the electronic component 14 to be transmitted, the effective direction W of the tappet 34 and the central longitudinal axis M of the through-hole 24 relative to the receiving substrate 32 in the X-axis. and align Y-axis.

The apparatus 10 furthermore comprises a radiation source 35, which is set up to emit electromagnetic radiation in the region of the passage opening 24, which is suitable for at least partially releasing the adhesive connection provided between the electronic components 14 and the substrate 12. In one embodiment, the radiation source 35 may be arranged on a side of the carrier 20 facing away from the substrate 12. For this purpose, the substrate 12 and / or the carrier 20 may be permeable to the electromagnetic radiation emitted by the radiation source 35.

In the further embodiments described below, the same reference numerals as in the embodiment described above are used for the same or equivalent components. The components in the further embodiments are not described again, agree in their features with the components of the embodiment described above.

2a and 2b show a second embodiment of an apparatus 10 for positioning and transmitting on a substrate 12 provided electronic components 14. Compared with the embodiment shown in Fig. La and 1b is the

Dispenser 30 relative to the carrier 20 mounted translationally movable along the Y-axis. Correspondingly, instead of the second rotary drive DA2, the device 10 has a fourth linear drive LA4, which is set up to move a guide element 36 extending in the X direction along the Z axis. In the illustrations shown in FIGS. 2a and 2b, the housing 26 of the device 10 and the fourth linear drive LA4 are not shown for reasons of clarity.

The dispenser 30 is provided with a guide rail 38 which is in the form of an opening with a first portion 40 and a second portion 42 adjacent thereto, the guide member 36 and the guide rail 38 being engaged in common and the guide member 36 relative to the guide rail 38 is movable. The guide rail 38 comprises two opposite side walls 44, 46 which are formed parallel to each other and extend ent ^¬ long of the first and the second portion 40, 42.

In the first section 40 of the guide rail 38, the side walls 44, 46 are offset from the Z-direction by a certain angle, here about 25 °. The angle may alternatively assume a different value, for example a value of 5 ° to 45 °. The apparatus 10 is arranged such that moving the guide member 36 along the Z axis and along the first portion 40 of the guide rail 38 causes the dispenser 30 to move along the Y axis, as shown in FIG. 2a. By moving the guide element 36 along the Z axis in the direction of the carrier 20, as indicated by an arrow A in FIG. 2a, the dispenser 30 is moved along the Y axis in the direction of the optical axis O of the image data acquisition device 28, as shown in FIG. 2a indicated by an arrow B.

The movement of the guide member 36 along the first portion 40 thereby causes the dispenser 30 between the first end position in which the dispenser 30 is located outside the optical axis O of the image data acquisition device 28, and the second end position in which the direction of action W of the fault 34 coincides approximately with the optical axis 0 of the image data acquisition device 28 is moved.

In the second section 42 of the guide rail 38, the side walls 44, 46 are each arranged parallel to the Z-direction. As a result, moving the guide member 36 along the Z-axis and along the second portion 42 does not cause any further movement of the dispenser 30 along the Y-axis.

The dispensing device 30 further comprises a plunger holder 48, which is displaceably mounted in the dispensing device 30 translationally along the Z-axis. The plunger holder 48 has a guided in the second portion 42 of the guide rail 38 element 50 which is adapted to interact in the second portion 42 with the guide member 36. The guided member 50 is provided such that movement of the guide member 36 along the Z-axis and along the second portion 42 of the guide rail 38, as shown in Fig. 2b by the arrow A, moving the plunger holder 48 with the plunger 34 in causes the same direction, as indicated in Fig. 2b by an arrow C.

The control unit ECU is adapted to move by means of the fourth linear actuator LA4 both the dispenser 30 controlled between the first and second end position and to move the plunger 34 relative to the carrier 20 along the Z-axis so that it through the Through opening 24 of the carrier 20 through acting on the electronic component 14 to be transmitted. This arrangement has the advantageous effect that movement of the dispenser 30 between the first and second end positions and movement of the plunger 34 relative to the carrier 20 along the Z axis can be accomplished by a single actuator.

In the embodiment shown in Figs. 2a and 2b, the plunger 34 is provided in the form of a needle having a smaller diameter compared to the embodiment shown in Figs. 1a and 1b. Accordingly, the passage opening 24 of the carrier 20 also has a smaller diameter, which in particular is smaller than a diameter of a contact surface of the electronic component 14 to be transmitted.

FIG. 3 shows a third embodiment of an apparatus 10 for positioning and transmitting electronic components 14 provided on a substrate 12. Compared to the embodiment shown in FIGS. 1 a and 1 b, the apparatus 10 further comprises a receiving carrier 52 on which the receiving substrate 32 is provided with a Substrate 12 abuts the opposite side. On the receiving substrate 32 already transmitted electronic components 14 ^λ are arranged.

The receiving carrier 52 is provided with a further passage opening 54 which extends in the thickness direction of the carrier 52, i. extends in the direction of the Z-axis. The further passage opening 54 of the receiving carrier 52 has a further central longitudinal axis M ", which coincides with the central longitudinal axis M of the passage opening 24 of the carrier 20, wherein a diameter of the further passage opening 54 is greater than the diameter of the passage opening 24 of the carrier 20. The receiving carrier 32nd is subjected to negative pressure and on a the receiving substrate 32 side facing under pressure permeable to fix the receiving substrate 32 relative to the receiving carrier 52.

The device 10 further has a receiving device 56 with a receiving stamp 58. The receiving punch 58 is designed to mechanically act on the receiving substrate 32 through the through-opening 54 of the receiving carrier 52 in a further effective direction W in order to move the receiving substrate 32 along the Z-axis in the direction of the substrate 12 and thereby the electronic component 14 to be transferred to bring into contact with the receiving substrate 32. The further direction of action W of Aufnahmestempeis 58 points in the opposite direction of the direction of action W of the plunger 34. The receiving device 56 includes a fifth linear actuator LA5, wherein the control unit ECU is adapted to, by means of the fifth linear actuator LA5 the receiving punch 58 relative to the receiving carrier 52nd controlled to move along the Z-axis. Further, the receiving device 56 is pivotally mounted about a further pivot axis relative to the receiving carrier 52 via a third rotary drive DA3, which extends in the X direction and transverse to the other central longitudinal axis Μ ^{λ of} the through hole 54 of the receiving carrier 52 is arranged.

On a side facing away from the receiving substrate 32 side of the receiving substrate 32, a further image data acquisition device 60 is arranged, which has an optical axis Ο ^λ , which coincides with the further central longitudinal axis Μ ^{λ of} the further passage opening 54 of the receiving carrier 52. The further image data acquisition device 60 is set up to capture image data BD for determining the position of the receiving substrate 32 through the further passage opening 54 of the receiving carrier 52 and to make it available to the control unit ECU. The control unit ECU is set up, by means of the third rotary drive DA3, the receiving device 56 between a first end position, in which the receiving device 56 is outside the optical axis Ο ^{λ of} the further image data acquisition device 60, and a second end position of the receiving device, in the the further direction of action W of the receiving device 56 approximately coincides with the optical axis Ο ^{λ of} the further image data acquisition device 60, to move in a controlled manner

FIG. 3 illustrates an operating state of the device 10 in which the component 14 to be transferred is transferred from the substrate 12 to the receiving substrate 32. The component 14 to be transferred is in contact with the substrate 12 with a first contact surface and with the receiving substrate 32 with a second contact surface. The contact surface of the plunger 34 is in this case formed smaller than the first contact surface of the transmitted electronic components 14. In contrast, a contact surface of the female die 58 is substantially the second contact surface of the transmitted electronic component corresponds to 14 in FIG. 3 veran ^¬ illustrated, is a Contact surface between the first contact surface of the electronic component 14 and the substrate 12 thus smaller than a contact surface between the second contact surface of the electronic component 14 and the receiving substrate ^¬ 32. So it can be ensured that the adhesive force between the substrate 12 and the electronic to be transmitted Component 14 is less than the other adhesive force between the receiving substrate 32 and the electronic component 14 to be transmitted in order to transmit the electronic components 14 reliably.

This embodiment of the device 10 furthermore has the advantageous effect that the receiving punch 52 comes into contact with the plunger 34, so that deformation or overstretching of the substrate 12 during transfer of the electronic components 14 to the receiving substrate 32 can be reduced. Furthermore, premature detachment or tilting away of the electronic components 14 to be transmitted can be prevented.

Fig. 4 shows a flow diagram of an exemplary embodiment of a procedural ^¬ proceedings for positioning and transmitting on a substrate 12. provisioned electronic components 14, for example, with the embodiment shown in FIGS. 1 to 3 apparatus.

In a first method step S10, the substrate 12 is provided. The substrate 12 has a first side 16, which rests on a carrier 20, and an opposite set, the electronic components 14 supporting second side 18. The carrier 20 is provided with a through hole 24 which has a longitudinal axis M extending in a Z-direction.

In a parallel step S12, provision is made of a receiving substrate 32 which is provided for receiving the electronic component 14 to be transmitted at a pickup position. The receiving substrate 32 is in this case arranged opposite to the second side 18 of the substrate 12.

In a subsequent step S20, a movement of a delivery device 30, which is set up for transferring the electronic components 14 from the substrate 12 onto the receiving substrate 32, takes place. The dispenser 30 includes a Stö ^¬ Key 34 which is adapted through the through-opening 24 to the substrate 12 in a direction of action W act. In step S20, the dispenser 34 is moved to a first end position, in which the dispenser 30 is located outside an optical axis O of an image data acquisition device 28, wherein the optical axis O of the image data acquisition device 28 coincides with the longitudinal axis M of the through-hole 24.

In a further step S30, image data BD for determining the position of at least one electronic component 14 to be transmitted is detected on the substrate 12. This step takes place by means of the image data acquisition device 28, which detects the image data BD through the passage opening 24 of the carrier 20.

In a parallel method step S32, image data BD "for determining the position of the pickup position on the pickup substrate 32 are further detected. This is done by means of a further image data acquisition device 60, which can be arranged on a side of the pickup substrate 32 facing away from the substrate 12.

In a step S40, positioning and aligning the substrate 12 with the electronic component 14 to be transferred, the plunger 34, the carrier 20 and the receiving substrate 32 in an X and Y direction relative to each other in response to the image data acquisition device 28 and the For this purpose, the substrate 12, the plunger 34 and the carrier 20 in the X and Y directions are respectively moved to an alignment position, so that the electronic component 14, the plunger 34 and the Recording position on the receiving substrate 32 in the longitudinal axis M of the through hole 24 are arranged.

Subsequently, the dispenser 30 is moved to a second end position (step S50) in which the direction of action W of the dispenser 30 approximately coincides with the optical axis O of the image data acquisition device 28. In a variant of the method, step S50 may also take place prior to step S40 or in parallel thereto.

The carrier 20 with the substrate 12 abutting thereto is moved in the Z direction in a step S60, whereby the carrier 20 is moved in the direction of the receiving substrate 32 into a transfer position. Here, a gap between the substrate 12 and the receiving substrate 32 for transferring the electronic components 14 is reduced. In order to hold the substrate 12 in position during the transfer of the electronic component 14, in a step S70 a negative pressure is applied to the carrier 20 so that the substrate 12 is fixed relative to the carrier 20.

In a further step S80, the plunger 34 is moved in the Z direction through the passage opening 24 into a transfer position of the plunger 34, in which the plunger 34 is arranged in sections in the passage opening 24 and bears against the first side 16 of the substrate 12. The transmitted electronic component 14 is moved in this step, with the plunger 34 together, so that the elekt ^¬ tronic component 14 comes into contact with the receiving substrate 32nd

Finally, in a step S90, a detachment of the transferred electronic ^¬ rule component 14 is carried by the carrier 20 is moved along the Z-axis in the direction of the dispensing ^¬ device 30 in a release position, so that the tappet 34 is guided through the passage opening 24 and thereby the at least one electronic component 14 is detached from the substrate 12 and transferred to the receiving substrate 32.

In a variant of the method, the vacuum application of the carrier 20 according to step S70, for example, after step S80 or before step S50 or S60 take place.

Claims

claims

A device (10) for positioning and transmitting electronic components (14) provided on a substrate (12), comprising:

- a support (20) for positioning the substrate (12) to be received in the device (10), the support (20)

o is arranged such that the substrate (12) to be received bears against the carrier (20) with a first side (16) which is opposite to a second side (18) of the substrate (12) which carries at least one electronic component (14). and o is provided with a through hole (24) having a longitudinal axis (M) extending in a Z direction;

- An image data acquisition device (28) having a coincident with the longitudinal axis (M) of the passage opening (24) optical axis (O) and is adapted to image data (BD) for determining the position of the at least one electronic component (14) through the passage opening ( 24) and to provide for a control unit (ECU); and

- A dispenser (30) for transmitting the electronic components (14) from the substrate (12) which is adapted to act through the through hole (24) on the male substrate (12) in a direction of action (W), wherein

- The control unit (ECU) is adapted to, by means of at least

o a first actuator (LA1, LA3) to move the carrier (20) and the substrate (12) in a controlled manner relative to each other in an X and Y direction, so that at least one on the first side (16) of the substrate (12) recorded electronic component (14) relative to the passage opening (24) in response to the image data acquisition means (28) detected image data (BD) is to be positioned, and

o a second actuator (DA2, LA4) the dispenser (30) between a first end position for capturing the image data (BD) by the image data acquisition device (28), in which the dispenser (30) outside the optical axis (O) of the image data acquisition device (28), and a second end position of the electronic component transfer unit (30) in which the effective direction (W) of the output device (30) coincides with the optical axis (O) of the image data acquisition device (28) to move controlled.

2. Device according to claim 1, wherein the substrate (12) and / or the carrier (20) comprises a transparent material, and wherein

the image data acquisition device (28) acquires the image data (BD) for determining the position of the at least one electronic component (14) received on the substrate (12) through the substrate (12) and / or the carrier (20).

3. Device according to one of claims 1 to 2, wherein the carrier (20) acted upon by negative pressure and on a substrate (12) side facing underpressure permeable, so that the substrate (12) relative to the carrier (20) is fixie ^¬ ren.

4. Device according to one of claims 1 to 3, wherein the optical axis (0) of the image data acquisition device (28) coincides with a central longitudinal axis (M) of the through ^¬ opening (24).

5. Device according to one of claims 1 to 4, wherein the dispenser (30) relative to the carrier (20) to pivot and / or translationally to move, so that the dispenser (30) between the first and second end position to is moving,

the dispenser (30) comprises a plunger (34) or a first radiation source for acting on the substrate (12), and / or

the passage opening (24) of the carrier (20) and / or the plunger (34) of the delivery device (30) is / are adapted to the shape of the at least one electronic component (14).

6. Apparatus according to claim 5, wherein the dispenser (30) relative to the carrier (20) about a pivot axis (S) to pivot and the pivot axis ^¬ (S) the optical axis (O) of the image data acquisition device (28), insbeson ^¬ particular in the field of image data acquisition means (28) and / or between the image data acquisition means (28) and the support (20) cuts and / or perpendicular ^¬ right to the optical axis (O) of the image data acquisition device (28) is arranged, and / or

the dispenser (30) is translationally mounted relative to the carrier translationally in the X and / or Y direction.

7. Device according to one of claims 1 to 6, wherein the control unit (ECU) is further adapted to, from the image data acquisition device (28) detected image data (BD) position data of the at least one electronic component (14) and / or correction values for the position of the substrate (12), the carrier (20) and / or the delivery device (30) to determine, and on the basis of the position data and / or the correction values control commands, in particular for the first and to generate the second actuator (LA1, LA3, DA2, LA1, LA3, LA4).

8. Apparatus according to claim 7, wherein the control commands generated by the control unit (ECU):

o cause the substrate (12) and / or the carrier (20) to move in the X and Y directions, so that at least the one electronic component (14) accommodated on the substrate is positioned relative to the passage opening (24) is; and or

o cause the substrate (12), the carrier (20) and / or dispenser (30) to move relative to each other in the X and Y directions, so that at least the one electronic component (14) accommodated on the substrate (12), the through opening (24) of the carrier (20) and the direction of action (W) of the dispenser (30) are to be aligned relative to each other in the X and Y directions.

9. Device according to one of claims 1 to 8, wherein the control unit (ECU) is further adapted by means of

- the first or the second actuator (LA1, LA3, DA2, LA1, LA3, LA4) controls the dispenser (30), the carrier (20) and / or the substrate (12) relative to each other in the X and Y directions to move,

a third actuator (DA1) rotating the carrier (20) and the substrate (12) relative to each other about an axis extending in the Z-direction, and / or

- To move a fourth actuator (LA2, LA3), the carrier (20) and the dispenser (30) relative to each other in the Z-direction.

10. Device according to one of claims 1 to 9, wherein the control unit (ECU) is adapted to move by means of the second actuator (LA4) a guide member (36) in the Z direction controlled to move and thereby sequentially the discharge means (30). between the first and second end position of the dispenser (30), and to move the plunger (34) in a controlled manner relative to the carrier (20) in the Z direction.

A device according to any one of claims 1 to 10, further comprising a heating element (35) adapted to apply heat to the substrate (12) in the region of Insert through hole (24), so that at least one electronic component (14) from the substrate (12) is at least partially solved, wherein

the heating element (35) provided in the form of a second beam source (35) and adapted to emit electromagnetic radiation that is to geeig ^¬ net to solve the at least one electronic component (14) of the substrate (12) at least partially.

12. The device according to one of claims 1 to 11, further comprising an on ^¬ acquisition means (56) having a receiving die (58) for receiving of the transmitted electronic components (14) on one in the device (10) aufzu ^¬ receiving receiving substrate (32 ), in which

the receiving die (58) is adapted, supporting by a further through ^¬ hole (54) of the receiving substrate (32) receiving the carrier (52) onto the receiving substrate (32) in another direction of action (v \ t) to act, and

the control unit (ECU) is set up by means of at least

o a fifth actuator (DA3) the receiving device (56) between ei ^¬ ner first end position in which the receiving device (56) outside an optical axis (Ο ^λ ) of another image data acquisition device (60), and a second end position the receiving device (56), in which the further direction of action (W) of the

Receiving device (56) coincides with the optical axis (ö) of the further image data acquisition device (60) to move controlled, and

o a sixth actuator (LA5) the picking punch (58) relative to the receiving carrier (52) in the Z direction controlled to move.

13. The apparatus of claim 12, wherein a contact surface of the plunger (34), by means of which the plunger (34) acts on the substrate (12) is smaller than a contact surface of the receiving punch (58), by means of which the receiving punch (58). acting on the receiving substrate (32), and / or

in that an adhesive force between the substrate and the first contact surface of the electronic component to be transferred is less than a further adhesion force between the receiving substrate and the second contact surface of the electronic component to be transferred.

14. A method of positioning and transmitting electronic components (14) provided on a substrate (12) comprising the steps of: Providing the substrate (12) with a first side (16) resting on a support (20) and a second side (18) opposite the first side (16) carrying at least one electronic component (14) the carrier (20) is provided with a through hole (24) having a longitudinal axis (M) extending in a direction;

Moving a dispenser (30) arranged to transfer the electronic components (14) from the substrate (12) to a first end position in which the dispenser (30) is located outside an optical axis (0) of an image data acquisition device (30); 28), wherein the optical axis (0) of the image data acquisition means (28) coincides with the longitudinal axis (M) of the through hole (24), and wherein the dispenser (30) is adapted to pass through the through hole (24) onto the substrate (12) to act in a direction of action (W);

Detecting image data (BD) for determining the position of the at least one electronic component (14) accommodated on the substrate (12), the image data (BD) being detected by the image data acquisition device (28) through the passage opening (24);

Moving the substrate (12) and / or the carrier (20) relative to each other in an X and Y direction so that the at least one electronic component (14) received on the second side (18) of the substrate (12) is relative to the through opening (24) is positioned as a function of the image data (BD) acquired by the image data acquisition device (28); and

- Moving the dispenser (30) in a second end position in which the direction of action (W) of the dispenser (30) coincides with the optical axis (0) of the image data acquisition device (28).

15. The method of claim 14, further comprising the steps of:

- Providing a receiving substrate (32);

- Detecting image data (BD) for determining the position of the receiving substrate (32), in particular a receiving position on the receiving substrate (32) for an electronic component (14) to be transmitted;

- Moving the carrier (20), the substrate (12), the discharge device (30) and / or the receiving substrate (32) in the X and Y directions relative to each other in an alignment position in response to the detected by the image data acquisition device (28) Image data (BD);

- Moving the carrier (20) and / or a plunger (34) of the dispenser (30) relative to each other in the Z-direction in a transfer position; - applying vacuum to the carrier (20) so that the substrate (12) resting against the carrier (20) is fixed relative to the carrier (20); and or

- Moving the carrier (20) and / or the plunger (34) relative to each other in the Z-direction in a detachment position, so that the plunger (34) is passed through the passage opening (24) and thereby the at least one electronic component (14) is released from the substrate (12) and transferred to the receiving substrate (32).