WO2017098550A1 - Component mounting head - Google Patents
Component mounting head Download PDFInfo
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- WO2017098550A1 WO2017098550A1 PCT/JP2015/084257 JP2015084257W WO2017098550A1 WO 2017098550 A1 WO2017098550 A1 WO 2017098550A1 JP 2015084257 W JP2015084257 W JP 2015084257W WO 2017098550 A1 WO2017098550 A1 WO 2017098550A1
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- component
- mounting
- component mounting
- mounting head
- suction nozzle
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- the present invention relates to a component mounting head that is moved by itself and mounts components on a substrate, and more particularly to a component mounting head that includes a component feeder that supplies components one by one.
- a component feeder is mounted on the component mounting head, and the component mounting head is moved above the substrate together with the component feeder, that is, a so-called component feeder mounting type.
- a component mounting head There is a component mounting head.
- the component feeder mounting type component mounting head is configured to hold a component supplied from a mounted component feeder by its mounting unit and place the held component on a substrate. . Therefore, the component held by the mounting unit may be detached from the mounting unit for some reason, and when the detached component falls from the mounting head, the component is expected to fall on the substrate. Such an event can also result in the manufacture of defective products. Therefore, in the component mounting head described in the above-mentioned patent document, a cover is provided at the lower part in order to prevent the component from falling. However, such component mounting heads still have room for improvement, and by making some improvements, a more practical component mounting head is realized. This invention is made
- the component mounting head of the present invention is A component mounting head that moves itself and mounts a component on a board, (a) a plurality of mounting units having suction nozzles at the lower end, (b) a component feeder for sequentially supplying components one by one, and (c) one of the plurality of mounting units is located at a component receiving position. And a mounting unit moving device that sequentially moves the plurality of mounting units simultaneously so that another one is positioned at the component mounting position, and is supplied from the component feeder to the mounting unit positioned at the component receiving position.
- a cover for preventing the component from dropping from the component mounting head is provided at a lower portion, and the cover has an opening for allowing the component to be mounted by the mounting unit located at the component mounting position.
- the edge of the opening is characterized in that a hook for preventing parts existing on the cover from rolling down from the opening is provided.
- the hooks standing on the edge of the opening of the cover prevent the component existing on the cover from falling off the mounting unit from rolling off from the opening. Therefore, according to the component mounting head of the present invention, the falling of the component from the component mounting head is more reliably prevented.
- the component mounting machine 10 in which the component mounting head according to the embodiment is arranged roughly includes (a) circuit board holding (hereinafter, simply referred to as “substrate”) S.
- component holding a component supplied from each component supply device 14.
- a component mounting head 16 for mounting the component on the substrate S held by the substrate holding device 12 and (d) the component mounting head 16 is moved across the substrate holding device 12 and the component supply device 14.
- a mounting head moving device 18 to be moved.
- Each component supply device 14 shown in FIG. 1 is a tape feeder that sequentially supplies taped electronic components, that is, components arranged and held on a tape one by one.
- the component mounting head 16 is a bulk component feeder (hereinafter referred to as “bulk component feeder”) that sequentially supplies the bulk components one by one at the component supply position PS. , Sometimes referred to simply as “bulk feeder”) 30. That is, it is a bulk feeder-mounted component mounting head (a kind of component feeder-mounted component mounting head).
- the bulk state means a state in which discrete parts are gathered.
- the component mounting head 16 has a plurality (specifically, 12) of mounting units 34 each having a suction nozzle 32 attached to the lower end portion thereof. It is arranged on the circumference.
- the mounting unit 34 is intermittently rotated all at once by the mounting unit moving device 36, and is positioned at a component receiving position for receiving components supplied from the bulk feeder 30, and the received components are mounted on the board. What is located at the component mounting position for this purpose can be moved up and down. .
- the component mounting head 16 mounts a component supplied from the component supply device 14
- the component supplied from the component supply device 14 is received by the mounting unit 34 positioned at the component mounting position.
- the mounting unit 34 holds the component, and when the component is mounted on the substrate, the suction nozzle 32 has a positive pressure (atmospheric pressure). Higher pressure).
- the component mounting head 16 is provided with a cover 50 at the bottom for preventing the components held by the mounting unit 34 from falling from the component mounting head 16.
- a cover 50 plays an important role in that sense.
- the cover 50 functions as a tray for receiving the parts dropped from the mounting unit 34 and can be called a tray.
- FIG. 5 the drawing shows the suction nozzle 32 attached to each mounting unit 34 for the sake of convenience showing a state in which the lower part of the component mounting head 16 is viewed from above.
- the mounting unit 34 allows components to be mounted below the mounting unit 34 located at the component mounting position PP (in the drawing, the position of the suction nozzle 32 is used for convenience).
- An opening 52 is provided for this purpose.
- the component dropped from the mounting unit 34 is received by the cover 50 and rides on the upper surface of the cover 50.
- the parts riding on the cover 50 are also expected to move on the upper surface of the cover 50 and are also expected to fall from the opening 52 due to the movement.
- a flange 54 is erected on the edge of the opening 52 of the cover 50 over the entire circumference of the opening 52.
- the flange 54 effectively prevents the component on the cover 50 from falling from the opening 52.
- each mounting unit 34 is provided with a switching valve for switching between positive pressure and negative pressure. Switching is performed by operating the switching lever 60 (see FIGS. 2 and 3). The operation of the switching lever 60 is performed by the operation mechanism 62.
- a supply pressure switching mechanism for switching between a negative pressure and a positive pressure supplied to the suction nozzle 32 is configured including the switching lever 60, the operation mechanism 62, and the like.
- the negative pressure supply path can supply negative pressure to the suction nozzle 32 even when the mounting unit 34 is located at any position.
- the supply path is configured to supply only to the suction nozzle 32 of the mounting unit 34 located in the positive pressure supply range R shown in FIG.
- the cover 50 is provided with a large number of small holes 64 having a diameter that does not allow components to pass. More specifically, the portion facing the moving path of the mounting unit 34 to which positive pressure is supplied to the suction nozzle 32 between the component mounting position PP and the component receiving position PR, that is, facing the positive pressure discharge range R ′. A large number of small holes 64 are provided in the portion.
- component mounting machine 16 component mounting head 30: bulk component feeder
- suction nozzle 34 mounting unit 36: mounting unit moving device 50: cover 52: opening 54: ⁇ 60: switching lever [supply pressure switching mechanism]
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
A component mounting head equipped with a component feeder that supplies components at a component supply position (PS). While being moved, the component mounting head causes a mounting unit (34) to mount onto a base plate a component supplied from the component feeder. Provided in a lower portion is a cover (50) for preventing the component from falling from the component mounting head, the cover being provided with an opening (52) for enabling component mounting by the mounting unit positioned at the component mounting position (PP). In addition, erected at the edge of the opening is a guard (54) for preventing a component present on the cover from tumbling down from the opening thereof. The component mounting head constituted in this manner ensures that the component is prevented from falling from the component mounting head.
Description
本発明は、自身が移動させられて基板上に部品を装着する部品装着ヘッドに関し、詳しくは、部品を１つずつ供給する部品フィーダを搭載した部品装着ヘッドに関する。
The present invention relates to a component mounting head that is moved by itself and mounts components on a substrate, and more particularly to a component mounting head that includes a component feeder that supplies components one by one.
部品装着ヘッドには、下記特許文献に記載されているように、部品フィーダが搭載されて、その部品フィーダと一緒に、基板の上方において移動させられる部品装着ヘッド、つまり、いわゆる部品フィーダ搭載型の部品装着ヘッドが存在する。
As described in the following patent document, a component feeder is mounted on the component mounting head, and the component mounting head is moved above the substrate together with the component feeder, that is, a so-called component feeder mounting type. There is a component mounting head.
部品フィーダ搭載型部品装着ヘッドは、搭載されている部品フィーダから供給される部品を、自身が有する装着ユニットにて保持して、その保持された部品を基板上に載置するように構成される。したがって、装着ユニットによって保持された部品が何らかの原因によって装着ユニットから離脱することもあり得、その離脱した部品が当該装着ヘッドから落下すると、その部品が基板上に落ちることも予想される。そのような事象は、不良品を製造することにも成りかねない。そこで、上記特許文献に記載の部品装着ヘッドでは、部品の落下を防止するために、下部にカバーが設けられている。しかしながら、そのような部品装着ヘッドは、改良の余地が充分に残されており、何らかの改良を加えることで、より実用的な部品装着ヘッドが実現される。本発明は、そのような実情に鑑みてなされたものであり、実用性の高い部品フィーダ搭載型部品装着ヘッドを提供することを課題とする。
The component feeder mounting type component mounting head is configured to hold a component supplied from a mounted component feeder by its mounting unit and place the held component on a substrate. . Therefore, the component held by the mounting unit may be detached from the mounting unit for some reason, and when the detached component falls from the mounting head, the component is expected to fall on the substrate. Such an event can also result in the manufacture of defective products. Therefore, in the component mounting head described in the above-mentioned patent document, a cover is provided at the lower part in order to prevent the component from falling. However, such component mounting heads still have room for improvement, and by making some improvements, a more practical component mounting head is realized. This invention is made | formed in view of such a situation, and makes it a subject to provide a component feeder mounting-type component mounting head with high practicality.
上記課題を解決するために、本発明の部品装着ヘッドは、
自身が移動させられて基板上に部品を装着する部品装着ヘッドであって、
(a) 下端部に吸着ノズルを有する複数の装着ユニットと、(b) 部品を１つずつ順次供給する部品フィーダと、(c) 前記複数の装着ユニットのうちの１つが部品受取位置に位置し、かつ、別の１つが部品装着位置に位置するように、前記複数の装着ユニットを一斉に順次移動させる装着ユニット移動装置とを備え、前記部品受取位置に位置する装着ユニットに前記部品フィーダから供給される部品を保持させ、前記部品装着位置に位置する装着ユニットにその保持された部品を基板に装着させるように構成され、
当該部品装着ヘッドからの部品の落下を防止するためのカバーが、下部に設けられ、そのカバーが、前記部品装着位置に位置する装着ユニットによる部品の装着を許容するための開口を有するとともに、その開口の縁に、カバー上に存在する部品がその開口から転がり落ちることを防止するための鍔が立設されたことを特徴とする。 In order to solve the above problems, the component mounting head of the present invention is
A component mounting head that moves itself and mounts a component on a board,
(a) a plurality of mounting units having suction nozzles at the lower end, (b) a component feeder for sequentially supplying components one by one, and (c) one of the plurality of mounting units is located at a component receiving position. And a mounting unit moving device that sequentially moves the plurality of mounting units simultaneously so that another one is positioned at the component mounting position, and is supplied from the component feeder to the mounting unit positioned at the component receiving position. Configured to hold the component to be mounted, and to mount the held component on the board in the mounting unit located at the component mounting position,
A cover for preventing the component from dropping from the component mounting head is provided at a lower portion, and the cover has an opening for allowing the component to be mounted by the mounting unit located at the component mounting position. The edge of the opening is characterized in that a hook for preventing parts existing on the cover from rolling down from the opening is provided.
自身が移動させられて基板上に部品を装着する部品装着ヘッドであって、
(a) 下端部に吸着ノズルを有する複数の装着ユニットと、(b) 部品を１つずつ順次供給する部品フィーダと、(c) 前記複数の装着ユニットのうちの１つが部品受取位置に位置し、かつ、別の１つが部品装着位置に位置するように、前記複数の装着ユニットを一斉に順次移動させる装着ユニット移動装置とを備え、前記部品受取位置に位置する装着ユニットに前記部品フィーダから供給される部品を保持させ、前記部品装着位置に位置する装着ユニットにその保持された部品を基板に装着させるように構成され、
当該部品装着ヘッドからの部品の落下を防止するためのカバーが、下部に設けられ、そのカバーが、前記部品装着位置に位置する装着ユニットによる部品の装着を許容するための開口を有するとともに、その開口の縁に、カバー上に存在する部品がその開口から転がり落ちることを防止するための鍔が立設されたことを特徴とする。 In order to solve the above problems, the component mounting head of the present invention is
A component mounting head that moves itself and mounts a component on a board,
(a) a plurality of mounting units having suction nozzles at the lower end, (b) a component feeder for sequentially supplying components one by one, and (c) one of the plurality of mounting units is located at a component receiving position. And a mounting unit moving device that sequentially moves the plurality of mounting units simultaneously so that another one is positioned at the component mounting position, and is supplied from the component feeder to the mounting unit positioned at the component receiving position. Configured to hold the component to be mounted, and to mount the held component on the board in the mounting unit located at the component mounting position,
A cover for preventing the component from dropping from the component mounting head is provided at a lower portion, and the cover has an opening for allowing the component to be mounted by the mounting unit located at the component mounting position. The edge of the opening is characterized in that a hook for preventing parts existing on the cover from rolling down from the opening is provided.
本発明の部品装着ヘッドでは、上記カバーの開口の縁に立設された鍔により、装着ユニットから離脱してカバー上に存在する部品がその開口から転がり落ちることが防止されている。したがって、本発明の部品装着ヘッドによれば、当該部品装着ヘッドからの部品の落下が、より確実に防止されることになる。
In the component mounting head according to the present invention, the hooks standing on the edge of the opening of the cover prevent the component existing on the cover from falling off the mounting unit from rolling off from the opening. Therefore, according to the component mounting head of the present invention, the falling of the component from the component mounting head is more reliably prevented.
以下、本発明の代表的な実施形態を、実施例として、図を参照しつつ詳しく説明する。なお、本発明は、下記実施例の他、当業者の知識に基づいて種々の変更、改良を施した種々の態様で実施することができる。
Hereinafter, typical embodiments of the present invention will be described in detail with reference to the drawings as examples. It should be noted that the present invention can be implemented in various modes in which various changes and improvements have been made based on the knowledge of those skilled in the art, in addition to the following examples.
≪部品装着機の構成≫
実施例の部品装着ヘッドが配備された部品装着機１０は、図１に示すように、大まかには、(a) 回路基板（以下、単に「基板」という場合がある）Ｓを保持する基板保持装置１２と、(b) それぞれが電子部品（以下、単に「部品」という場合がある）を供給する複数の部品供給装置１４と、(c) 各部品供給装置１４から供給された部品を保持するとともに、その部品を、基板保持装置１２に保持された基板Ｓに装着するための部品装着ヘッド１６と、(d) 部品装着ヘッド１６を、基板保持装置１２と部品供給装置１４とに渡って移動させる装着ヘッド移動装置１８とを含んで構成されている。ちなみに、図１では、２つの部品装着機１０がベース２０上に並んで配置されている状態（手前側の部品装着機１０は、外装パネルが取り外されている）が示されており、また、図１に示す各部品供給装置１４は、テープ化電子部品、つまり、テープに配列して保持された部品を１つずつ順次供給するテープフィーダとされている。 ≪Configuration of parts mounting machine≫
As shown in FIG. 1, thecomponent mounting machine 10 in which the component mounting head according to the embodiment is arranged roughly includes (a) circuit board holding (hereinafter, simply referred to as “substrate”) S. A device 12; (b) a plurality of component supply devices 14 each supplying an electronic component (hereinafter, simply referred to as “component”); and (c) holding a component supplied from each component supply device 14. In addition, a component mounting head 16 for mounting the component on the substrate S held by the substrate holding device 12, and (d) the component mounting head 16 is moved across the substrate holding device 12 and the component supply device 14. And a mounting head moving device 18 to be moved. Incidentally, FIG. 1 shows a state in which two component mounting machines 10 are arranged side by side on the base 20 (the front component mounting machine 10 has an exterior panel removed), and Each component supply device 14 shown in FIG. 1 is a tape feeder that sequentially supplies taped electronic components, that is, components arranged and held on a tape one by one.
実施例の部品装着ヘッドが配備された部品装着機１０は、図１に示すように、大まかには、(a) 回路基板（以下、単に「基板」という場合がある）Ｓを保持する基板保持装置１２と、(b) それぞれが電子部品（以下、単に「部品」という場合がある）を供給する複数の部品供給装置１４と、(c) 各部品供給装置１４から供給された部品を保持するとともに、その部品を、基板保持装置１２に保持された基板Ｓに装着するための部品装着ヘッド１６と、(d) 部品装着ヘッド１６を、基板保持装置１２と部品供給装置１４とに渡って移動させる装着ヘッド移動装置１８とを含んで構成されている。ちなみに、図１では、２つの部品装着機１０がベース２０上に並んで配置されている状態（手前側の部品装着機１０は、外装パネルが取り外されている）が示されており、また、図１に示す各部品供給装置１４は、テープ化電子部品、つまり、テープに配列して保持された部品を１つずつ順次供給するテープフィーダとされている。 ≪Configuration of parts mounting machine≫
As shown in FIG. 1, the
≪部品装着ヘッドの構成≫
外装パネルを外した状態の部品装着ヘッド１６を示す図２および図３から解るように部品装着ヘッド１６は、バルク状態の部品を１個ずつ、部品供給位置ＰＳにおいて順次供給するバルク部品フィーダ（以下、単に「バルクフィーダ」という場合がある）３０を搭載している。つまり、バルクフィーダ搭載型部品装着ヘッド（部品フィーダ搭載型部品装着ヘッドの一種）である。ちなみに、バルク状態とは、ばらばらの部品が集合した状態を意味する。 ≪Component mounting head configuration≫
As shown in FIG. 2 and FIG. 3 showing thecomponent mounting head 16 with the exterior panel removed, the component mounting head 16 is a bulk component feeder (hereinafter referred to as “bulk component feeder”) that sequentially supplies the bulk components one by one at the component supply position PS. , Sometimes referred to simply as “bulk feeder”) 30. That is, it is a bulk feeder-mounted component mounting head (a kind of component feeder-mounted component mounting head). Incidentally, the bulk state means a state in which discrete parts are gathered.
外装パネルを外した状態の部品装着ヘッド１６を示す図２および図３から解るように部品装着ヘッド１６は、バルク状態の部品を１個ずつ、部品供給位置ＰＳにおいて順次供給するバルク部品フィーダ（以下、単に「バルクフィーダ」という場合がある）３０を搭載している。つまり、バルクフィーダ搭載型部品装着ヘッド（部品フィーダ搭載型部品装着ヘッドの一種）である。ちなみに、バルク状態とは、ばらばらの部品が集合した状態を意味する。 ≪Component mounting head configuration≫
As shown in FIG. 2 and FIG. 3 showing the
部品装着ヘッド１６は、下端部に吸着ノズル３２が取り付けられた複数（詳しくは、１２である）の装着ユニット３４を有しており、それら装着ユニット３４は、各々が軸状をなすとともに、一円周上に配置されている。装着ユニット３４は、装着ユニット移動装置３６によって、一斉に間欠回転させられるとともに、バルクフィーダ３０から供給される部品を受け取るための部品受取位置に位置するもの、および、その受け取った部品を基板に装着するための部品装着位置に位置するものが、昇降させられるようになっている。
The component mounting head 16 has a plurality (specifically, 12) of mounting units 34 each having a suction nozzle 32 attached to the lower end portion thereof. It is arranged on the circumference. The mounting unit 34 is intermittently rotated all at once by the mounting unit moving device 36, and is positioned at a component receiving position for receiving components supplied from the bulk feeder 30, and the received components are mounted on the board. What is located at the component mounting position for this purpose can be moved up and down. .
ちなみに、部品装着ヘッド１６が、上述の部品供給装置１４から供給される部品を装着する場合には、上記部品装着位置に位置する装着ユニット３４によって、部品供給装置１４から供給される部品が受け取られる。また、吸着ノズル３２に負圧（大気圧より低い圧力）が供給されることで、装着ユニット３４は部品を保持し、部品の基板への装着に際し、吸着ノズル３２には、正圧（大気圧より高い圧力）が供給されるようにされている。
Incidentally, when the component mounting head 16 mounts a component supplied from the component supply device 14, the component supplied from the component supply device 14 is received by the mounting unit 34 positioned at the component mounting position. . Further, by supplying negative pressure (pressure lower than atmospheric pressure) to the suction nozzle 32, the mounting unit 34 holds the component, and when the component is mounted on the substrate, the suction nozzle 32 has a positive pressure (atmospheric pressure). Higher pressure).
≪部品落下防止カバー≫
部品装着ヘッド１６は、図４に示すように、下部に、装着ユニット３４が保持した部品が当該部品装着ヘッド１６から落下することを防止するためのカバー５０が設けられている。本部品装着機１０では、バルクフィーダ３０から供給される部品を基板に装着する際に、基板の上方から部品装着ヘッド１６を移動させる必要がないため、落下した部品が基板上に載置される可能性が高く、その意味において、カバー５０は、重要な役割を果たす。カバー５０は、装着ユニット３４から脱落した部品を受け止める受け皿として機能するのであり、トレイと呼ぶことのできるものである。 ≪Part fall prevention cover≫
As shown in FIG. 4, thecomponent mounting head 16 is provided with a cover 50 at the bottom for preventing the components held by the mounting unit 34 from falling from the component mounting head 16. In the component mounting machine 10, when mounting a component supplied from the bulk feeder 30 on the substrate, it is not necessary to move the component mounting head 16 from above the substrate, and thus the dropped component is placed on the substrate. The cover 50 plays an important role in that sense. The cover 50 functions as a tray for receiving the parts dropped from the mounting unit 34 and can be called a tray.
部品装着ヘッド１６は、図４に示すように、下部に、装着ユニット３４が保持した部品が当該部品装着ヘッド１６から落下することを防止するためのカバー５０が設けられている。本部品装着機１０では、バルクフィーダ３０から供給される部品を基板に装着する際に、基板の上方から部品装着ヘッド１６を移動させる必要がないため、落下した部品が基板上に載置される可能性が高く、その意味において、カバー５０は、重要な役割を果たす。カバー５０は、装着ユニット３４から脱落した部品を受け止める受け皿として機能するのであり、トレイと呼ぶことのできるものである。 ≪Part fall prevention cover≫
As shown in FIG. 4, the
部品装着ヘッド１６の下部を上方から見た状態を示す図５（図では、各装着ユニット３４に取り付けられている吸着ノズル３２が便宜的に示されている）を参照して、さらに説明すれば、カバー５０には、部品装着位置ＰＰ（図では、便宜的に、吸着ノズル３２の位置で代用している）に位置する装着ユニット３４の下方には、その装着ユニット３４による部品の装着を許容するための開口５２が設けられている。装着ユニット３４から脱落した部品は、カバー５０によって受け止められて、カバー５０の上面に乗ることになるが、後に説明する吸着ノズル３４への正圧の供給、当該部品装着ヘッド１６自体の移動等によって、カバー５０上に乗っている部品は、カバー５０の上面を移動することも予想され、その移動によって、開口５２から転げ落ちることも予想される。
Further description will be given with reference to FIG. 5 (the drawing shows the suction nozzle 32 attached to each mounting unit 34 for the sake of convenience) showing a state in which the lower part of the component mounting head 16 is viewed from above. In the cover 50, the mounting unit 34 allows components to be mounted below the mounting unit 34 located at the component mounting position PP (in the drawing, the position of the suction nozzle 32 is used for convenience). An opening 52 is provided for this purpose. The component dropped from the mounting unit 34 is received by the cover 50 and rides on the upper surface of the cover 50. However, by supplying positive pressure to the suction nozzle 34 described later, moving the component mounting head 16 itself, and the like. The parts riding on the cover 50 are also expected to move on the upper surface of the cover 50 and are also expected to fall from the opening 52 due to the movement.
上記のことに鑑み、本部品装着ヘッド１６では、カバー５０の開口５２の縁に、その開口５２の全周に渡って、鍔５４が立設されている。この鍔５４によって、開口５２から、カバー５０上に乗っかっている部品が転げ落ちることが効果的に防止されるのである。
In view of the above, in the component mounting head 16, a flange 54 is erected on the edge of the opening 52 of the cover 50 over the entire circumference of the opening 52. The flange 54 effectively prevents the component on the cover 50 from falling from the opening 52.
上述した吸着ノズル３２への正圧の供給と負圧の供給に関してさらに説明すれば、各装着ユニット３４には、正圧と負圧とを切り換える切換弁が設けられており、その切換弁は、切換レバー６０の操作によって切り換えられる（図２，図３参照）。切換レバー６０の操作は、操作機構６２によって行われる。ちなみに、それら切換レバー６０，操作機構６２等を含んで、吸着ノズル３２に供給する負圧と正圧とを切り換える供給圧切換機構が構成されているのである。一方で、詳しい説明は省略するが、負圧の供給経路は、装着ユニット３４がいずれの位置に位置しているときでも、吸着ノズル３２に負圧を供給可能とされているが、正圧の供給経路は、図５に示す正圧供給範囲Ｒに位置する装着ユニット３４の吸着ノズル３２にしか供給されないようにされている。
To further explain the supply of positive pressure and negative pressure to the suction nozzle 32 described above, each mounting unit 34 is provided with a switching valve for switching between positive pressure and negative pressure. Switching is performed by operating the switching lever 60 (see FIGS. 2 and 3). The operation of the switching lever 60 is performed by the operation mechanism 62. Incidentally, a supply pressure switching mechanism for switching between a negative pressure and a positive pressure supplied to the suction nozzle 32 is configured including the switching lever 60, the operation mechanism 62, and the like. On the other hand, although the detailed description is omitted, the negative pressure supply path can supply negative pressure to the suction nozzle 32 even when the mounting unit 34 is located at any position. The supply path is configured to supply only to the suction nozzle 32 of the mounting unit 34 located in the positive pressure supply range R shown in FIG.
操作機構６２は、部品受取位置ＰＲ（図５では、便宜的に、吸着ノズル３２の位置で代用している）に位置する装着ユニット３４に対して、負圧が供給されるように切換レバー６０を操作し、部品装着位置ＰＰに位置する装着ユニット３４に対して、負圧の供給から正圧の供給に切り換るように切換レバー６０を操作する。したがって、装着ユニット３４が部品受取位置ＰＲから部品装着位置ＰＰに移動する間、吸着ノズル３２には負圧が供給され続けて、部品が保持される。その一方で、正圧の供給に切り換えられて部品が基板に装着された後は、装着ユニット３４が部品装着位置ＰＰから部品受取位置ＰＲに移動する間の一部分において、詳しく言えば、部品装着位置ＰＰから正圧供給範囲Ｒの終端に至る間（正圧放出範囲Ｒ’）、吸着ノズル３２からは、正圧の開放に伴って、空気が流れ出すことになる。
The operation mechanism 62 switches the switching lever 60 so that negative pressure is supplied to the mounting unit 34 located at the component receiving position PR (in FIG. 5, for convenience, the position of the suction nozzle 32 is substituted). And the switching lever 60 is operated so as to switch the negative pressure supply to the positive pressure supply for the mounting unit 34 located at the component mounting position PP. Therefore, while the mounting unit 34 moves from the component receiving position PR to the component mounting position PP, negative pressure is continuously supplied to the suction nozzle 32 and the components are held. On the other hand, after the component is mounted on the substrate by switching to the supply of positive pressure, more specifically, the component mounting position in a part during the mounting unit 34 moves from the component mounting position PP to the component receiving position PR. During the period from PP to the end of the positive pressure supply range R (positive pressure release range R ′), air flows out from the suction nozzle 32 as the positive pressure is released.
上記空気の流れは、カバー５０の上面に落ちた部品が存在するときには、その部品を移動させることになる。つまり、上記開口５２から部品が転げ落ちることの一因ともなり得る。そこで、本部品装着ヘッド１６では、カバー５０に、部品が通過しない程度の径を有する多数の小孔６４が設けられている。詳しく言えば、部品装着位置ＰＰから部品受取位置ＰＲまでの間において吸着ノズル３２に正圧が供給される装着ユニット３４の移動経路と対向する部分に、つまり、正圧放出範囲Ｒ’と対向する部分に、多数の小孔６４が設けられているのである。
The air flow moves the parts when there are parts dropped on the upper surface of the cover 50. That is, it may be a cause of the parts falling from the opening 52. Therefore, in the component mounting head 16, the cover 50 is provided with a large number of small holes 64 having a diameter that does not allow components to pass. More specifically, the portion facing the moving path of the mounting unit 34 to which positive pressure is supplied to the suction nozzle 32 between the component mounting position PP and the component receiving position PR, that is, facing the positive pressure discharge range R ′. A large number of small holes 64 are provided in the portion.
上記多数の小孔６４によって、吸着ノズル３２への正圧の供給によって生じる空気の流れが、当該部品装着ヘッド１６の外に逃がされることになり、本部品装着ヘッド１６では、それら多数の小孔６４によっても、カバー５０の上面に落ちた部品が開口５２から転げ落ちることが、効果的に防止されているのである。
Due to the large number of small holes 64, the air flow generated by the supply of positive pressure to the suction nozzle 32 is released to the outside of the component mounting head 16. 64 also effectively prevents parts falling on the upper surface of the cover 50 from falling from the opening 52.
１０：部品装着機 １６：部品装着ヘッド ３０：バルク部品フィーダ ３２：吸着ノズル ３４：装着ユニット ３６：装着ユニット移動装置 ５０：カバー ５２：開口 ５４：鍔 ６０：切換レバー〔供給圧切換機構〕 ６２：操作機構〔供給圧切換機構〕 ６４：小孔 Ｓ：回路基板 ＰＳ：部品供給位置 ＰＰ：部品装着位置 ＰＲ：部品受取位置 Ｒ：正圧供給範囲 Ｒ’：正圧放出範囲
10: component mounting machine 16: component mounting head 30: bulk component feeder 32: suction nozzle 34: mounting unit 36: mounting unit moving device 50: cover 52: opening 54: 鍔 60: switching lever [supply pressure switching mechanism] 62: Operation mechanism [supply pressure switching mechanism] 64: Small hole S: Circuit board PS: Component supply position PP: Component mounting position PR: Component receiving position R: Positive pressure supply range R ': Positive pressure release range
Claims (3)
- 自身が移動させられて基板上に部品を装着する部品装着ヘッドであって、
(a) 下端部に吸着ノズルを有する複数の装着ユニットと、(b) 部品を１つずつ順次供給する部品フィーダと、(c) 前記複数の装着ユニットのうちの１つが部品受取位置に位置し、かつ、別の１つが部品装着位置に位置するように、前記複数の装着ユニットを一斉に順次移動させる装着ユニット移動装置とを備え、前記部品受取位置に位置する装着ユニットに前記部品フィーダから供給される部品を保持させ、前記部品装着位置に位置する装着ユニットにその保持された部品を基板に装着させるように構成され、
当該部品装着ヘッドからの部品の落下を防止するためのカバーが、下部に設けられ、そのカバーが、前記部品装着位置に位置する装着ユニットによる部品の装着を許容するための開口を有するとともに、その開口の縁に、カバー上に存在する部品がその開口から転がり落ちることを防止するための鍔が立設されたことを特徴とする部品装着ヘッド。 A component mounting head that moves itself and mounts a component on a board,
(a) a plurality of mounting units having suction nozzles at the lower end, (b) a component feeder for sequentially supplying components one by one, and (c) one of the plurality of mounting units is located at a component receiving position. And a mounting unit moving device that sequentially moves the plurality of mounting units simultaneously so that another one is positioned at the component mounting position, and is supplied from the component feeder to the mounting unit positioned at the component receiving position. Configured to hold the component to be mounted, and to mount the held component on the board in the mounting unit located at the component mounting position,
A cover for preventing the component from dropping from the component mounting head is provided at a lower portion, and the cover has an opening for allowing the component to be mounted by the mounting unit located at the component mounting position. A component mounting head, wherein a flange for preventing a component existing on the cover from rolling off from the opening is provided at an edge of the opening. - 当該部品装着ヘッドが、前記複数の装着ユニットの各々の前記吸着ノズルに供給する負圧と正圧とを切り換える供給圧切換機構を備えて、吸着ノズルに負圧が供給された状態で装着ユニットが部品を保持し、吸着ノズルに正圧が供給されて装着ユニットが部品を装着するように構成され、
前記吸着ノズルへの正圧の供給によって生じる空気の流れを逃がすために、部品より小さい複数の小孔が、前記カバーの少なくとも一部に設けられた請求項１に記載の部品装着ヘッド。 The component mounting head includes a supply pressure switching mechanism that switches between a negative pressure and a positive pressure supplied to each suction nozzle of each of the plurality of mounting units, and the mounting unit is in a state in which a negative pressure is supplied to the suction nozzle. The component is held, and the mounting unit is configured to mount the component by supplying positive pressure to the suction nozzle,
2. The component mounting head according to claim 1, wherein a plurality of small holes smaller than the component are provided in at least a part of the cover in order to escape air flow generated by supplying positive pressure to the suction nozzle. - 前記装着ユニットが前記部品受取位置から前記部品装着位置に移動する間、前記供給圧切換機構により前記吸着ノズルに負圧が供給され、前記装着ユニットが前記部品装着位置から前記部品受取位置に移動する間の少なくとも一部において、前記供給圧切換機構により前記吸着ノズルに正圧が供給されるように構成され、
前記複数の小孔が、前記部品装着位置から前記部品受取位置までの間において前記吸着ノズルに正圧が供給される前記装着ユニットの移動経路と対向する部分に設けられた請求項２に記載の部品装着ヘッド。 While the mounting unit moves from the component receiving position to the component mounting position, negative pressure is supplied to the suction nozzle by the supply pressure switching mechanism, and the mounting unit moves from the component mounting position to the component receiving position. At least in part, the positive pressure is supplied to the suction nozzle by the supply pressure switching mechanism,
The said some small hole is provided in the part facing the movement path | route of the said mounting unit in which a positive pressure is supplied to the said suction nozzle between the said component mounting position and the said component receiving position. Component mounting head.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2017554672A JP6671392B2 (en) | 2015-12-07 | 2015-12-07 | Component mounting head |
| PCT/JP2015/084257 WO2017098550A1 (en) | 2015-12-07 | 2015-12-07 | Component mounting head |
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| PCT/JP2015/084257 WO2017098550A1 (en) | 2015-12-07 | 2015-12-07 | Component mounting head |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011152996A (en) * | 2010-01-27 | 2011-08-11 | Toshiba Elevator Co Ltd | Elevator |
| WO2014045664A1 (en) * | 2012-09-20 | 2014-03-27 | 富士機械製造株式会社 | Electronic circuit component mounting machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011152996A (en) * | 2010-01-27 | 2011-08-11 | Toshiba Elevator Co Ltd | Elevator |
| WO2014045664A1 (en) * | 2012-09-20 | 2014-03-27 | 富士機械製造株式会社 | Electronic circuit component mounting machine |
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