JP6671392B2 - Component mounting head - Google Patents

Description

  The present invention relates to a component mounting head that moves components to mount components on a substrate, and more particularly, to a component mounting head mounted with a component feeder that supplies components one by one.

  As described in the following patent document, a component feeder is mounted on the component mounting head, and the component mounting head is moved together with the component feeder above the board, that is, a so-called component feeder mounting type. There is a component mounting head.

International Publication WO2014 / 045664 Pamphlet

Problems to be solved by the invention

  The component feeder-mounted component mounting head is configured to hold a component supplied from the mounted component feeder in its own mounting unit, and place the held component on a substrate. . Therefore, the component held by the mounting unit may be detached from the mounting unit for some reason, and when the detached component falls from the mounting head, the component is also expected to fall on the board. Such an event may also result in the production of a defective product. Therefore, in the component mounting head described in the above-mentioned patent document, a cover is provided at a lower portion in order to prevent a component from falling. However, such a component mounting head has much room for improvement, and a more practical component mounting head can be realized by making some improvements. The present invention has been made in view of such circumstances, and has as its object to provide a component feeder-mounted component mounting head with high practicality.

In order to solve the above problems, the component mounting head of the present invention is:
A component mounting head that is moved and mounts components on a substrate,
(a) a plurality of mounting units having suction nozzles at the lower end, (b) a component feeder for sequentially supplying components one by one, and (c) one of the plurality of mounting units is located at a component receiving position. And a mounting unit moving device that sequentially moves the plurality of mounting units simultaneously so that another one is positioned at the component mounting position, and supplies the mounting unit positioned at the component receiving position from the component feeder. Component to be held, the mounting unit located at the component mounting position is configured to mount the held component to the substrate,
A cover for preventing components from falling from the component mounting head is provided at a lower portion, and the cover has an opening for allowing mounting of a component by a mounting unit located at the component mounting position, and A flange is provided on the edge of the opening to prevent components existing on the cover from rolling down from the opening ,
Further, the component mounting head includes a supply pressure switching mechanism that switches between a negative pressure and a positive pressure supplied to each of the suction nozzles of the plurality of mounting units, and the component mounting head mounts in a state where the negative pressure is supplied to the suction nozzle. The unit holds the component, and a positive pressure is supplied to the suction nozzle, and the mounting unit is configured to mount the component,
A plurality of small holes smaller than components are provided in at least a part of the cover in order to release a flow of air generated by supplying a positive pressure to the suction nozzle .

In the component mounting head according to the present invention, the flange provided on the edge of the opening of the cover prevents the component detached from the mounting unit and existing on the cover from rolling down from the opening. Therefore, according to the component mounting head of the present invention, the drop of the component from the component mounting head is more reliably prevented.
In the component mounting head of the present invention, a positive pressure is supplied to the suction nozzle, and the mounting unit mounts the component. The flow of air generated by the supply of the positive pressure is released to the outside of the component mounting head by a plurality of small holes provided in the cover, and the plurality of small holes also allow the components existing on the cover to be opened. From falling off.

It is a perspective view showing the component mounting machine equipped with the component mounting head of an example. It is a perspective view showing the parts mounting head of an example in the state where an exterior panel was removed. FIG. 3 is a perspective view showing the component mounting head shown in FIG. 2 as viewed from the opposite side. It is a perspective view showing signs that a cover is provided in the lower part of the parts mounting head of an example from a viewpoint from the bottom. FIG. 5 is a perspective view illustrating the cover illustrated in FIG. 4 as viewed from above.

  Hereinafter, typical embodiments of the present invention will be described in detail as examples with reference to the drawings. The present invention can be carried out in various embodiments in which various modifications and improvements are made based on the knowledge of those skilled in the art, in addition to the following examples.

≫Configuration of component mounting machine≫
As shown in FIG. 1, the component mounting machine 10 provided with the component mounting head according to the embodiment roughly includes (a) a substrate holding device that holds a circuit board (hereinafter, may be simply referred to as a “substrate”) S. The device 12, (b) a plurality of component supply devices 14 each of which supplies an electronic component (hereinafter, may be simply referred to as a "component"), and (c) a component supplied from each component supply device 14. At the same time, the component mounting head 16 for mounting the component on the substrate S held by the substrate holding device 12 and (d) moving the component mounting head 16 between the substrate holding device 12 and the component supply device 14 And a mounting head moving device 18 to be moved. Incidentally, FIG. 1 shows a state in which the two component mounting machines 10 are arranged side by side on the base 20 (the exterior mounting panel of the component mounting machine 10 on the near side is removed). Each component supply device 14 shown in FIG. 1 is a tape feeder for sequentially supplying taped electronic components, that is, components arranged and held on a tape one by one.

≫Configuration of component mounting head≫
As can be seen from FIGS. 2 and 3 showing the component mounting head 16 with the exterior panel removed, the component mounting head 16 is a bulk component feeder (hereinafter, referred to as a bulk component feeder) that sequentially supplies bulk components one by one at the component supply position PS. , Simply referred to as “bulk feeder”) 30. That is, it is a bulk feeder-mounted component mounting head (a type of component feeder-mounted component mounting head). Incidentally, the bulk state means a state in which discrete components are assembled.

  The component mounting head 16 has a plurality of (more specifically, 12) mounting units 34 each having a suction nozzle 32 mounted at a lower end thereof. It is arranged on the circumference. The mounting unit 34 is simultaneously rotated intermittently by the mounting unit moving device 36, and is positioned at a component receiving position for receiving a component supplied from the bulk feeder 30, and mounts the received component on a substrate. An object located at a component mounting position for performing the operation is moved up and down.

  Incidentally, when the component mounting head 16 mounts the component supplied from the component supply device 14, the component supplied from the component supply device 14 is received by the mounting unit 34 located at the component mounting position. . When a negative pressure (pressure lower than the atmospheric pressure) is supplied to the suction nozzle 32, the mounting unit 34 holds the component, and when mounting the component on the substrate, the mounting nozzle 34 applies a positive pressure (atmospheric pressure) to the suction nozzle 32. Higher pressure).

≪Part fall prevention cover≫
As shown in FIG. 4, the component mounting head 16 is provided with a cover 50 at a lower portion for preventing components held by the mounting unit 34 from dropping from the component mounting head 16. In the component mounting machine 10, when the components supplied from the bulk feeder 30 are mounted on the substrate, it is not necessary to move the component mounting head 16 from above the substrate, and thus the dropped components are mounted on the substrate. Most likely, in that sense, the cover 50 plays an important role. The cover 50 functions as a receiving tray for receiving components dropped from the mounting unit 34, and can be called a tray.

  5 (a suction nozzle 32 attached to each mounting unit 34 is shown for convenience) showing a state where the lower part of the component mounting head 16 is viewed from above. On the cover 50, below the mounting unit 34 located at the component mounting position PP (in the drawing, the position of the suction nozzle 32 is used for convenience), mounting of the component by the mounting unit 34 is permitted. Opening 52 is provided. The component dropped from the mounting unit 34 is received by the cover 50 and rides on the upper surface of the cover 50, but is supplied by supplying a positive pressure to the suction nozzle 34 and moving the component mounting head 16 itself, which will be described later. The components on the cover 50 are also expected to move on the upper surface of the cover 50, and due to the movement, are likely to fall down from the opening 52.

  In view of the above, in the component mounting head 16, a flange 54 is provided upright on the edge of the opening 52 of the cover 50 over the entire circumference of the opening 52. The flange 54 effectively prevents components lying on the cover 50 from rolling down from the opening 52.

  To further explain the supply of the positive pressure and the supply of the negative pressure to the suction nozzle 32 described above, each mounting unit 34 is provided with a switching valve for switching between positive pressure and negative pressure. Switching is performed by operating the switching lever 60 (see FIGS. 2 and 3). The operation of the switching lever 60 is performed by the operation mechanism 62. Incidentally, a supply pressure switching mechanism for switching between the negative pressure and the positive pressure supplied to the suction nozzle 32 is configured to include the switching lever 60, the operating mechanism 62, and the like. On the other hand, although a detailed description is omitted, the negative pressure supply path is capable of supplying a negative pressure to the suction nozzle 32 even when the mounting unit 34 is located at any position. The supply path is configured to be supplied only to the suction nozzle 32 of the mounting unit 34 located in the positive pressure supply range R shown in FIG.

  The operation mechanism 62 switches the switching lever 60 so that a negative pressure is supplied to the mounting unit 34 located at the component receiving position PR (in FIG. 5, the position of the suction nozzle 32 is used for convenience). Is operated, and the switching lever 60 is operated so as to switch from the supply of the negative pressure to the supply of the positive pressure for the mounting unit 34 located at the component mounting position PP. Therefore, while the mounting unit 34 moves from the component receiving position PR to the component mounting position PP, a negative pressure is continuously supplied to the suction nozzle 32, and the component is held. On the other hand, after the component is switched to the positive pressure supply and the component is mounted on the substrate, a part of the time when the mounting unit 34 moves from the component mounting position PP to the component receiving position PR, more specifically, the component mounting position. During the period from PP to the end of the positive pressure supply range R (positive pressure release range R ′), air flows from the suction nozzle 32 as the positive pressure is released.

  When there is a component that has fallen on the upper surface of the cover 50, the air flow moves the component. That is, it may be one of the causes of parts falling down from the opening 52. Therefore, in the component mounting head 16, the cover 50 is provided with a large number of small holes 64 having a diameter such that the component does not pass. More specifically, a portion facing the movement path of the mounting unit 34 to which the positive pressure is supplied to the suction nozzle 32 between the component mounting position PP and the component receiving position PR, that is, the portion opposing the positive pressure release range R ′. A large number of small holes 64 are provided in the portion.

  Due to the large number of small holes 64, the flow of air generated by the supply of the positive pressure to the suction nozzle 32 is released to the outside of the component mounting head 16. 64 also effectively prevents components falling on the upper surface of the cover 50 from rolling down from the opening 52.

  10: Component mounting machine 16: Component mounting head 30: Bulk component feeder 32: Suction nozzle 34: Mounting unit 36: Mounting unit moving device 50: Cover 52: Opening 54: Flange 60: Switching lever [supply pressure switching mechanism] 62: Operation mechanism [supply pressure switching mechanism] 64: Small hole S: Circuit board PS: Component supply position PP: Component mounting position PR: Component receiving position R: Positive pressure supply range R ': Positive pressure release range

Claims (2)

A component mounting head that is moved and mounts components on a substrate,
(a) a plurality of mounting units having suction nozzles at the lower end, (b) a component feeder for sequentially supplying components one by one, and (c) one of the plurality of mounting units is located at a component receiving position. And a mounting unit moving device that sequentially moves the plurality of mounting units simultaneously so that another one is positioned at the component mounting position, and supplies the mounting unit positioned at the component receiving position from the component feeder. Component to be held, the mounting unit located at the component mounting position is configured to mount the held component to the substrate,
A cover for preventing components from falling from the component mounting head is provided at a lower portion, and the cover has an opening for allowing mounting of a component by a mounting unit located at the component mounting position, and A flange is provided on the edge of the opening to prevent components existing on the cover from rolling down from the opening ,
Further, the component mounting head includes a supply pressure switching mechanism that switches between a negative pressure and a positive pressure supplied to each of the suction nozzles of the plurality of mounting units, and the component mounting head mounts in a state where the negative pressure is supplied to the suction nozzle. The unit holds the component, and a positive pressure is supplied to the suction nozzle, and the mounting unit is configured to mount the component,
A component mounting head , wherein a plurality of small holes smaller than the component are provided in at least a part of the cover in order to release a flow of air generated by supplying a positive pressure to the suction nozzle . While the mounting unit moves from the component receiving position to the component mounting position, a negative pressure is supplied to the suction nozzle by the supply pressure switching mechanism, and the mounting unit moves from the component mounting position to the component receiving position. In at least a part between, the supply pressure switching mechanism is configured to supply a positive pressure to the suction nozzle,
2. The device according to claim 1, wherein the plurality of small holes are provided in a portion facing a movement path of the mounting unit to which a positive pressure is supplied to the suction nozzle between the component mounting position and the component receiving position. 3 . Component mounting head.

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