WO2017092220A1 - 一种光模块 - Google Patents

一种光模块 Download PDF

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Publication number
WO2017092220A1
WO2017092220A1 PCT/CN2016/080259 CN2016080259W WO2017092220A1 WO 2017092220 A1 WO2017092220 A1 WO 2017092220A1 CN 2016080259 W CN2016080259 W CN 2016080259W WO 2017092220 A1 WO2017092220 A1 WO 2017092220A1
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WO
WIPO (PCT)
Prior art keywords
pcb
gold finger
component
receiving
optical module
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PCT/CN2016/080259
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English (en)
French (fr)
Inventor
贲仕建
夏京盛
杨思更
Original Assignee
青岛海信宽带多媒体技术有限公司
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Publication of WO2017092220A1 publication Critical patent/WO2017092220A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]

Definitions

  • the present invention relates to the field of optical communication technologies, and in particular, to an optical module.
  • the optical module includes a transmitting component and a receiving component.
  • the transmitting component and the receiving component are generally disposed on an upper surface of a PCB (Printed Circuit Board), as shown in FIG.
  • a plurality of gold fingers are distributed on the gold finger end of the PCB, and both the transmitting component and the receiving component are connected with the gold finger.
  • the energy radiated from the wiring between the driver chip and the laser (ie, the gold wire) in the transmitting component can interfere with the receiving component, which affects the receiving sensitivity of the receiving component.
  • the transmitting component and the receiving component are generally arranged in a horizontal direction, as shown in FIG. 2 .
  • the energy field is the strongest in its lateral direction.
  • This arrangement enables the receiving component to effectively avoid the main energy radiated from the transmitting component, thereby reducing the interference of the transmitting component on the receiving component and improving the receiving component.
  • the receiving sensitivity will increase the length of the connection between the transmitting component and the gold finger (ie, the PCB trace), and the longer the PCB trace, the more severe the high frequency attenuation of the electrical signal on the PCB trace.
  • Embodiments of the present invention provide an optical module for reducing high frequency attenuation of an electrical signal on a PCB trace while ensuring reception sensitivity.
  • An optical module comprising:
  • PCB printed circuit board
  • the PCB comprising a first surface, a second surface, and a gold finger end distributed with a plurality of gold fingers
  • a firing assembly disposed on the first surface, the firing assembly being coupled to the gold finger;
  • the receiving component being coupled to the gold finger.
  • the optical module by providing a transmitting component on the first surface of the PCB and a receiving component on the second surface of the PCB, according to the spatial distribution theory of the radiation field energy, the energy field is the strongest in the horizontal direction.
  • the receiving component to effectively avoid the main energy radiated by the transmitting component, thereby being able to reduce the interference of the transmitting component to the receiving component, thereby ensuring the receiving sensitivity of the receiving component.
  • the transmitting component and the receiving component are disposed on different surfaces of the PCB, it is not necessary to consider the positional relationship of the transmitting component and the receiving component in the horizontal direction, and therefore, the emission can be shortened as much as possible within the range allowed by the process.
  • the length of the trace between the component and the gold finger thereby reducing the high frequency attenuation of the electrical signal on the trace between the firing component and the gold finger.
  • FIG. 1 is a schematic structural diagram of an optical module provided in the prior art
  • FIG. 2 is a schematic structural diagram of another optical module provided in the prior art
  • FIG. 3 is a top view of an optical module according to an embodiment of the present invention.
  • FIG. 4 is a side view of an optical module based on FIG. 3 according to an embodiment of the present invention.
  • FIG. 5 is a top view of another optical module according to an embodiment of the present invention.
  • FIG. 6 is a side view of the optical module shown in FIG. 5 according to an embodiment of the present invention.
  • FIG. 7 is a side view of another optical module according to an embodiment of the present invention.
  • FIG. 8 is a top view of another optical module according to an embodiment of the present invention.
  • the "and/or” in the embodiment of the present invention is merely an association relationship describing the associated object, indicating that there may be three relationships, for example, A and/or B, which may indicate that A exists separately, and A and B exist simultaneously. There are three cases of B alone.
  • “/” generally means that the contextual object is an “or” relationship.
  • Multilayer means two or more layers; “multiple” means two or more.
  • the concepts relating to direction and position, such as “upper surface”, “lower surface”, “upper end”, “lower end”, “left side”, “right side”, “lateral direction”, “longitudinal direction”, etc., are based on the implementation of the present invention.
  • the drawings provided in the examples are explained by way of example.
  • the basic principle of the technical solution provided by the embodiment of the present invention is to shield the transmitting component from the receiving component by placing the transmitting component and the receiving component on different two surfaces of the PCB and then passing through the grounding layer of the PCB.
  • FIGS. 3 and FIG. 4 are schematic structural diagrams of an optical module according to an embodiment of the present invention, wherein FIG. 3 is a top view of an optical module according to an embodiment of the present invention, and FIG. 4 is based on the light shown in FIG. Side view of the module.
  • the optical module shown in FIGS. 3 and 4 includes a PCB 11, a transmitting assembly 12, and a receiving assembly 13. among them:
  • the PCB 11 includes a first surface 111, a second surface 112, and a plurality of gold fingers distributed Gold finger end 113.
  • the firing assembly 12 is disposed on the first surface 111 and the firing assembly 12 is coupled to the gold finger.
  • the receiving assembly 13 is disposed on the second surface 112, and the receiving assembly 13 is coupled to the gold finger.
  • the "optical module” provided in the embodiment of the present invention may be a transceiver module, and may be a high-speed parallel optical module, such as a 25G high-speed parallel optical module or a 56G high-speed parallel optical module.
  • the PCB 11 is a multilayer PCB (for example, a four-layer PCB or a six-layer PCB).
  • the multilayer PCB includes an upper surface, a lower surface, and one or more intermediate layers, for example, the four-layer PCB includes an upper surface, a lower surface, and the first intermediate layer and the second intermediate layer; or the multilayer PCB includes a top signal layer , the underlying signal layer and one or more intermediate layers.
  • the upper surface of the PCB 11 refers to the upper surface of the top signal layer of the PCB 11
  • the lower surface of the PCB 11 refers to the lower surface of the underlying signal layer of the PCB 11.
  • the thickness of the PCB 11 follows the thickness standard of the PCB, for example, the thickness of the PCB 11 is approximately 1 mm (mm).
  • One end of the PCB 11 is a gold finger end, and the other end is used to connect the optical fiber.
  • the gold finger end is used to transmit communication electrical signals between the devices/modules disposed on the PCB 11 and devices/modules outside the PCB 11; the optical fibers are used to transmit communication optical signals between the optical module and other devices/modules.
  • the first surface 111 and the second surface 112 are different surfaces of the PCB 11.
  • the first surface 111 is an upper surface of the PCB 11, and the second surface 112 is a lower surface of the PCB 11; or, the first surface 111 is a lower surface of the PCB 11, and the second surface 112 is an upper surface of the PCB 11.
  • the drawings of the embodiments of the present invention are described by taking "the first surface 111 is the upper surface of the PCB 11 and the second surface 112 is the lower surface of the PCB 11" as an example.
  • a top view for example, FIG. 3, FIG. 5, FIG.
  • the optical module provided in the embodiment of the present invention, theoretically, only the emission set on the first surface 111 (ie, the upper surface) of the PCB 11 can be seen.
  • the component 13 emits the component 12 and each of the traces/gold wires, and the receiving component 13 and the traces/gold wires disposed on the second surface 112 (ie, the lower surface) of the PCB 11 cannot be seen, in order to clear
  • the technical solutions of the embodiments of the present invention are illustrated by the dashed box and the broken line, and the receiving component 13 on the second surface 112 of the PCB 11 and the wires/gold wires and the like are indicated.
  • the gold finger end 113 has a gold finger distributed on the first surface 111 and the second surface 112; wherein the "gold finger” is composed of a plurality of golden yellow conductive contacts, because the surface thereof is gold plated and the conductive contacts are arranged like a finger, so Called "Golden Finger".
  • the embodiment of the present invention does not limit the number of gold fingers distributed on the first surface 111 and the second surface 112 of the gold finger end, wherein the number of gold fingers distributed on the first surface 111 and the second surface 112 may be The same may be different; the first surface 111 and the gold fingers distributed on the second surface 112 may be disposed opposite to each other or may be staggered. It should be noted that, in FIG. 3, only eight gold fingers of the gold finger end 113 are schematically illustrated, including four gold fingers distributed on the first surface 111 and four roots distributed on the second surface 112. Gold finger.
  • the transmitting component 12 may include a transmitting chip and a laser, and may further include a driving chip or the like, wherein the laser may be a Vcsel (Vertical Cavity Surface Emitting Laser) or the like.
  • the receiving component 13 may include a receiving chip and a PD (Photo Devices, and may further include a driving chip, etc., each device of the transmitting component 12, and a connection relationship between the devices of the receiving component 13. And its function can refer to the prior art, and will not be described here.
  • the transmitting chip and the receiving chip are generally IC (Integrated Circuit) chips. As shown in FIG. 6, it is based on the side view of the optical module shown in FIG. .
  • the embodiment of the present invention does not limit the position of the transmitting component 12 and the receiving component 13 in the horizontal direction, wherein the transmitting component 12 in the optical module shown in FIG. 3 is in the same horizontal direction as the receiving component 13, and is vertical.
  • the directions do not overlap.
  • the two may not be in the same horizontal direction, and may also partially overlap or completely overlap in the vertical direction.
  • the optical module provided by the embodiment of the invention provides a transmitting component on a first surface of the PCB, and a receiving component is disposed on the second surface of the PCB, according to the radiation field energy
  • the inter-distribution theory knows that the energy field is strongest in its lateral direction. This arrangement enables the receiving component to effectively avoid the main energy radiated from the transmitting component, thereby reducing the interference of the transmitting component to the receiving component, thereby ensuring receiving of the receiving component. Sensitivity.
  • the transmitting component and the receiving component are disposed on different surfaces of the PCB, it is not necessary to consider the positional relationship of the transmitting component and the receiving component in the horizontal direction, and therefore, the emission can be shortened as much as possible within the range allowed by the process.
  • the length of the trace between the component and the gold finger thereby reducing the high frequency attenuation of the electrical signal on the trace between the firing component and the gold finger.
  • the firing assembly 12 is coupled to the gold finger by a first trace on the first surface 111.
  • the receiving assembly 13 is disposed on the second surface 112, and the receiving assembly 13 is coupled to the gold finger through a second trace on the second surface 112.
  • the PCB 11 further includes a ground layer, wherein the ground layer is disposed between the region where the first trace is located and the region where the second trace is located.
  • the ground layer is used to shield the energy radiated by the transmitting component 12 to the receiving component 13, and specifically includes: a gold wire between the driving chip and the laser in the shielding emitting component 12, and between the transmitting component 12 and the golden finger.
  • the PCB radiates energy radiated thereby shielding the energy radiated by the transmitting component 12 to the receiving component 13. This alternative implementation can further reduce or even eliminate interference from the transmitting component to the receiving component.
  • the grounding layer is disposed between the area where the first trace is located and the area where the second trace is located. It can be understood that the ground layer is disposed between the plane area where the first trace is located and the plane area where the second trace is located. Specifically, it can be realized that the ground layer is disposed between the first surface 111 and the second surface 112.
  • any one of the intermediate layers of the PCB 11 can be used as a ground layer.
  • a relatively large copper skin can be disposed as a ground layer on an intermediate layer between the plane area where the first trace is located and the plane area where the second trace is located.
  • the middle No etched wiring is performed on the layer.
  • the driver chip can adopt a flipchip packaging process
  • the transceiver device (such as Vcsel and PD) can adopt a gold wire bonding process.
  • the device usually makes Fixed on the PCB with silver paste. Due to the fluidity of the silver paste, 300-500 ⁇ m (micrometer) can be reserved between the IC chip (such as the transmitting chip and the receiving chip) and the optical device (such as the laser and the photodetector).
  • the safety distance is to avoid the flow of silver paste onto the gold wire pad of the PCB. Further, the distance of the gold wire between the IC chip and the optical device is shortened as much as possible within the range allowed by the process level, thereby reducing the energy radiated by the transmitting component 12.
  • the gold finger distributed on the gold finger end 113 includes a gold finger at the transmitting end and a gold finger at the receiving end, wherein the gold finger of the transmitting end is used for transmitting an electrical signal, and the golden finger of the receiving end is used for receiving.
  • the electrical signal; the transmitting component 12 is connected to the transmitting end gold finger through the first wire; the receiving component 13 is connected to the receiving end gold finger through the second wire.
  • the positional relationship between the transmitting end gold finger connected to the transmitting component 12 and the receiving end gold finger connected to the receiving component 13 may be any of the following:
  • the gold finger at the transmitting end and the gold finger at the receiving end are both disposed on the first surface 111.
  • the receiving component 13 and the receiving end gold finger can be realized by the via hole by punching a hole on the signal layer where the first surface 111 is located (ie, the top signal layer or the bottom signal layer) and each intermediate layer. the connection between.
  • the gold finger on the transmitting end and the gold finger on the receiving end are both disposed on the second surface 112.
  • the transmitting component 12 and the transmitting end gold finger can be realized by the via hole by punching a hole on the signal layer where the second surface 112 is located (ie, the underlying signal layer or the top signal layer) and each intermediate layer. the connection between.
  • the gold finger of the transmitting end is disposed on the second surface 112, and the gold finger of the receiving end is disposed on the first surface 111.
  • connection between the transmitting component 12 and the transmitting end gold finger, and the receiving component 13 and the receiving end gold finger can be realized by punching holes on each layer of the PCB 11 through the via holes.
  • the gold finger of the transmitting end is disposed on the first surface 111, and the gold finger of the receiving end is disposed on the second surface 112.
  • This implementation is a preferred implementation, and Figures 3, 5, and 8 are both This implementation will be described as an example.
  • the transmitting end gold finger and the receiving end gold finger may be disposed on both the first surface 111 and the second surface 112.
  • via holes may be provided on each layer of the PCB 11, so that the transmitting component 12 is connected to the gold finger of the transmitting end, and the receiving component 13 is connected with the gold finger of the receiving end.
  • the transmitting component 12 and the transmitting end gold finger are disposed on the first side of the PCB 11; the receiving component 13 and the receiving end gold finger are disposed on the second side of the PCB 11 opposite to the first side.
  • first side may be the left side
  • second side may be the right side
  • first side may be the right side
  • second side may be the left side
  • first The side may be the upper side
  • second side may be the lower side
  • first side may be the lower side and the “second side” may be the upper side.
  • the gold finger end 113 of the PCB 11 is referred to as the lower end of the PCB, that is, the side where the gold finger end 113 is located is referred to as the lower side of the PCB; thus, the "first side” may be the left side, "the first The two sides may be the right side; or, the “first side” may be the right side, and the “second side” may be the left side.
  • the “first side” is the right side
  • the “second side” is the left side, as shown in FIG.
  • the first side and the second side are distinguished by the central axis of the PCB 11. That is, when the "first side” and the “second side” indicate the left and right sides of the PCB 11, the areas of the left half and the right half of the PCB 11 are equal; or, when “the first side” and the "second side” When the upper and lower sides of the PCB 11 are indicated, the areas of the upper half and the lower half of the PCB 11 are equal.
  • the first surface 111 and the second surface 112 are respectively provided with a transmitting end gold finger and a receiving end gold finger; and the transmitting end gold finger is on the right side of the PCB, and the receiving end gold finger is on the left side of the PCB.
  • the distance between the transmitting component 12 and/or the receiving component 13 and the gold finger end is less than or equal to a preset threshold, wherein the distance refers to the transmitting component 12 and/or the receiving component 13
  • the distance from the lower end to the lower end of the PCB 11 is started.
  • the length of the trace between the transmitting component 12 and the receiving component 13 and the gold finger respectively is less than or equal to a preset threshold.
  • the length of the trace between the transmitting component 12 and/or the receiving component 13 and the gold finger is large, the high frequency attenuation of the electrical signal on the trace is large; if the transmitting component 12 and/or The length of the trace between the receiving component 13 and the gold finger end is small, and the arcs of different traces connected to the same component (including the transmitting component 12 and the receiving component 13) are different, so that the length between the different traces is The difference is large, which results in a large difference between the electrical signals obtained by the different traces.
  • the distance between the transmitting component 12 and/or the receiving component 13 and the gold finger end it is also necessary to consider The size of the DC blocking capacitor (for example, about 2mm).
  • the distance also needs to include the length of the gold finger. Therefore, in specific implementation, it is also necessary to consider the length of the gold finger (for example, about 5 mm).
  • an embodiment of the present invention provides an optional implementation manner, and the length of the trace between the transmitting component 12 and/or the receiving component 13 and the gold finger is in the range of [10 mm]. , 30mm].
  • the length of the trace between the firing assembly 12 and/or the receiving assembly 13 and the gold finger is about 16 mm.
  • the range allowed by the process The length of the trace between the firing assembly 12 and/or the receiving assembly 13 and the gold finger can be shortened as much as possible.
  • the SSF Committee (Small Form Factor Committee) specifies the pin definition of the QSFP interface plug and the overall size of the module.
  • the gold finger on the transmitting end is on the right side of the PCB 11, and the receiving end is gold.
  • the finger is on the left side of the PCB11. Therefore, in this scenario, the transmission component 12 is generally disposed on the first surface in view of the small difference between electrical signals obtained through different traces connected to the same component.
  • the receiving assembly 13 is disposed on the left side of the second surface 112.
  • the left and right sides of the PCB 11 are distinguished by the central axis of the PCB 11.
  • the maximum value of the distance between the left side of the transmitting assembly 12 and the right side boundary of the PCB 11 is half of the width of the PCB 11, between the right side of the receiving assembly 13 and the left side boundary of the PCB 11.
  • the maximum value of the distance is half the width of the PCB 11.
  • it is generally required to reserve a safe distance of about 2 mm on both sides of the PCB.
  • the width of the PCB 11 is 16.4 mm, as shown in FIG.
  • the transmitting component 12 may be disposed within a range between 2 mm and 8.2 mm from the right side boundary of the PCB 11; the receiving component The distance between the boundary with the left side of the PCB 11 may be set in a range between 2 mm and 8.2 mm.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

一种光模块，涉及光通信技术领域，用以在保证接收灵敏度的同时，减少PCB（11）走线上的电信号的高频衰减。光模块包括：PCB（11），PCB（11）包括第一表面（111）、第二表面（112）和分布有多个金手指的金手指端（113）；设置在第一表面（111）上的发射组件（12），发射组件（12）与金手指连接；设置在第二表面（112）上的接收组件（13），接收组件（13）与金手指连接；PCB（11）还包括接地层，该光模块可以是收发一体的光模块。

Description

一种光模块
本申请要求于2015年12月02日提交中国专利局，申请号为201510869580.2，发明名称为《一种光模块》的中国发明专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及光通信技术领域，尤其涉及一种光模块。
背景技术
光模块包括发射组件和接收组件，目前，一般将发射组件和接收组件设置在PCB(Printed Circuit Board，印制电路板)的上表面上，如图1所示。另外，PCB的金手指端上分布有多个金手指，发射组件与接收组件均与金手指连接。发射组件中的驱动芯片与激光器之间的连线(即金线)辐射出的能量会对接收组件造成干扰，这会影响接收组件的接收灵敏度。
为了解决上述问题，目前一般将发射组件与接收组件在水平方向上错开设置，如图2所示。根据辐射场能量空间分布理论可知能量场在其横向一周最强，这样设置能够使接收组件有效地避开发射组件辐射出的主要的能量，从而减小发射组件对接收组件的干扰，提高接收组件的接收灵敏度；但是，这样会使得发射组件与金手指之间的连线(即PCB走线)的长度增加，而PCB走线越长，PCB走线上的电信号的高频衰减越严重。
发明内容
本发明的实施例提供一种光模块，用以在保证接收灵敏度的同时，减少PCB走线上的电信号的高频衰减。
为达到上述目的，本发明的实施例采用如下技术方案：
一种光模块，包括：
印制电路板PCB，所述PCB包括第一表面、第二表面和分布有多个金手指的金手指端；
设置在所述第一表面上的发射组件，所述发射组件与所述金手指连接；
设置在所述第二表面上的接收组件，所述接收组件与所述金手指连接。
本发明实施例提供的光模块，通过在PCB的第一表面上设置发射组件，并在PCB的第二表面上设置接收组件，根据辐射场能量空间分布理论可知能量场在其横向一周最强，这样设置能够使接收组件有效地避开发射组件辐射出的主要的能量，从而能够减小发射组件对接收组件的干扰，从而保证接收组件的接收灵敏度。另外，由于发射组件和接收组件设置在PCB的不同的表面上，因此，不需要考虑发射组件和接收组件在水平方向上的位置关系，因此，在工艺允许的范围内，可以尽可能的缩短发射组件与金手指之间的走线的长度，从而减少发射组件与金手指之间的走线上的电信号的高频衰减。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对本发明实施例或现有技术中所需要使用的附图作简单地介绍，显然，下列附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中提供的一种光模块的结构示意图；
图2为现有技术中提供的另一种光模块的结构示意图；
图3为本发明实施例提供的一种光模块的俯视图；
图4为本发明实施例提供的一种基于图3所示的光模块的侧视 图；
图5为本发明实施例提供的另一种光模块的俯视图；
图6为本发明实施例提供的一种基于图5所示的光模块的侧视图；
图7为本发明实施例提供的另一种光模块的侧视图；
图8为本发明实施例提供的另一种光模块的俯视图。
具体实施方式
下面结合本发明实施例中的附图，对本发明实施例中的技术方案进行示例性描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明实施例中的“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。“/”一般表示前后关联对象是一种“或”的关系。“多层”是指两层或两层以上；“多个”是指两个或两个以上。“上表面”、“下表面”、“上端”、“下端”、“左侧”、“右侧”、“横向”、“纵向”等与方向和位置有关的概念，均是基于本发明实施例所提供的附图为例进行说明的。
本发明实施例提供的技术方案的基本原理是通过将发射组件和接收组件设置在PCB的不同的两个表面上，然后通过PCB的接地层来屏蔽发射组件对接收组件的干扰。
参见图3和图4，为本发明实施例提供的一种光模块的结构示意图，其中，图3是本发明实施例提供的一种光模块的俯视图，图4是基于图3所示的光模块的侧视图。图3和图4所示的光模块包括：PCB11，发射组件12和接收组件13。其中：
PCB11包括第一表面111、第二表面112和分布有多个金手指的 金手指端113。发射组件12设置在第一表面111上，发射组件12与金手指连接。接收组件13设置在第二表面上112，接收组件13与金手指连接。
其中，本发明实施例中提供的“光模块”可以是收发一体的光模块，具体可以是高速并行光模块，例如25G高速并行光模块或56G高速并行光模块等。
在本发明实施例中，PCB11是多层PCB(例如，四层PCB或六层PCB)。其中，多层PCB包括上表面、下表面以及一个/多个中间层，例如，四层PCB包括上表面、下表面以及第一中间层和第二中间层；或者，多层PCB包括顶层信号层、底层信号层以及一个/多个中间层。也就是说，PCB11的上表面是指PCB11的顶层信号层的上表面，PCB11的下表面是指PCB11的底层信号层的下表面。PCB11的厚度遵循PCB的厚度标准，例如，PCB11的厚度大致为1mm(毫米)。
PCB11的一端是金手指端，另一端用于连接光纤。其中，金手指端用于传输PCB11上设置的各器件/模块与PCB11之外的器件/模块之间的通信电信号；光纤用于传输光模块与其他设备/模块之间的通信光信号。
第一表面111与第二表面112是PCB11的不同的两个表面。可选的，第一表面111是PCB11的上表面，第二表面112是PCB11的下表面；或，第一表面111是PCB11的下表面，第二表面112是PCB11的上表面。本发明实施例的附图中均以“第一表面111是PCB11的上表面，第二表面112是PCB11的下表面”为例进行说明。这样，在本发明实施例中所提供的光模块的俯视图(例如图3、图5、图6)中，理论上，只能看到PCB11的第一表面111(即上表面)上设置的发射组件13发射组件12及各走线/金线，不能看到PCB11的第二表面112(即下表面)上设置的接收组件13及各走线/金线，为了清 楚说明本发明实施例的技术方案，均以虚线框和虚线表示PCB11的第二表面112上的接收组件13及各走线/金线等。
金手指端113在第一表面111和第二表面112上均分布有金手指；其中“金手指”由众多金黄色的导电触片组成，因其表面镀金而且导电触片排列如手指状，所以称为“金手指”。本发明实施例对金手指端在第一表面111和第二表面112上所分布的金手指的数目不进行限定，其中，第一表面111与第二表面112上所分布的金手指的数目可以相同也可以不同；第一表面111与第二表面112上所分布的金手指之间可以相对设置也可以错开设置。需要说明的是，图3中仅示意性地画出了金手指端113的8根金手指，其中包括第一表面111上所分布的4根金手指和第二表面112上所分布的4根金手指。
如图5所示，发射组件12可以包括发射芯片和激光器，另外还可以包括驱动芯片等，其中，激光器可以是Vcsel(Vertical Cavity Surface Emitting Laser，垂直腔面发射激光器)等。如图5所示，接收组件13可以包括接收芯片和PD(Photo Devices，光电探测器，另外还可以包括驱动芯片等。发射组件12的各器件，以及接收组件13的各器件之间的连接关系及其作用可以参考现有技术，此处不再描述。发射芯片与接收芯片一般是IC(Integrated Circuit，集成电路)芯片。如图6所示，是基于图5所示的光模块的侧视图。
本发明实施例对发射组件12和接收组件13在水平方向上的位置不进行限定，其中，图3所示的光模块中的发射组件12与接收组件13在同一水平方向上，并且在竖直方向上不重叠。具体实现时，二者可以不在同一水平方向上，另外，在竖直方向上也可以部分重叠或完全重叠。
本发明实施例提供的光模块，通过在PCB的第一表面上设置发射组件，并在PCB的第二表面上设置接收组件，根据辐射场能量空 间分布理论可知能量场在其横向一周最强，这样设置能够使接收组件有效地避开发射组件辐射出的主要的能量，从而能够减小发射组件对接收组件的干扰，从而保证接收组件的接收灵敏度。另外，由于发射组件和接收组件设置在PCB的不同的表面上，因此，不需要考虑发射组件和接收组件在水平方向上的位置关系，因此，在工艺允许的范围内，可以尽可能的缩短发射组件与金手指之间的走线的长度，从而减少发射组件与金手指之间的走线上的电信号的高频衰减。
在一种可选的实现方式中，发射组件12通过第一表面111上的第一走线与金手指连接。接收组件13设置在第二表面上112，接收组件13通过第二表面112上的第二走线与金手指连接。另外，PCB11还包括接地层，其中，接地层设置在第一走线所在的区域与第二走线所在的区域之间。
接地层用于屏蔽发射组件12对接收组件13所辐射的能量，具体可以包括的：用于屏蔽发射组件12中的驱动芯片和激光器之间的金线，以及发射组件12与金手指之间的PCB走线等所辐射的能量，从而屏蔽发射组件12对接收组件13所辐射的能量。该可选的实现方式能够进一步减少甚至消除发射组件对接收部件的干扰。
“接地层设置在第一走线所在的区域与第二走线所在的区域之间”可以理解为：接地层设置在第一走线所在的平面区域与第二走线所在的平面区域之间；具体可以实现为：接地层设置在第一表面111与第二表面112之间，可选的，可以将PCB11的任意一个中间层作为接地层。具体实现时，可以在第一走线所在的平面区域与第二走线所在的平面区域之间的一个中间层上设置较大面积较为完整的铜皮作为接地层，在PCB设计时，该中间层上不进行刻蚀布线。
可选的，在工艺上，驱动芯片可以采用flipchip封装工艺，收发器件(例如Vcsel和PD)可以采用金线打线工艺。由于器件通常使 用银浆固定在PCB上，由于银浆具有流动性，可以在IC芯片(例如发射芯片和接收芯片)与光器件(例如激光器和光电探测器)之间预留出300～500μm(微米)的安全距离，如图7所示，以避免银浆流动到PCB的打金线焊盘上。进一步地，在工艺水平允许的范围内，尽可能地缩短IC芯片与光器件之间的金线的距离，从而减少发射组件12所辐射出的能量。
在一种可选的实现方式中，金手指端113上所分布的金手指包括发射端金手指和接收端金手指，其中，发射端金手指用于发送电信号，接收端金手指用于接收电信号；发射组件12通过第一走线与发射端金手指连接；接收组件13通过第二走线与接收端金手指连接。在该实现方式中，与发射组件12所连接的发射端金手指，和，与接收组件13所连接的接收端金手指的位置关系可以为以下任一种：
1、发射端金手指和接收端金手指均设置在第一表面111上。
该情况下，可以通过在第一表面111所在的信号层(即：顶层信号层或底层信号层)以及每个中间层上打过孔，从而通过过孔来实现接收组件13与接收端金手指之间的连接。
2、发射端金手指和接收端金手指均设置在第二表面112上。
该情况下，可以通过在第二表面112所在的信号层(即：底层信号层或顶层信号层)以及每个中间层上打过孔，从而通过过孔来实现发射组件12与发射端金手指之间的连接。
3、发射端金手指设置在第二表面112上，接收端金手指设置在第一表面111上。
该情况下，可以通过在PCB11的每层上均打过孔，从而通过过孔来实现发射组件12与发射端金手指，以及接收组件13与接收端金手指之间的连接。
4、发射端金手指设置在第一表面111上，接收端金手指设置在第二表面112上。该实现方式为优选的实现方式，附图3、5、8均 以该实现方式为例进行说明。
需要说明的是，具体实现时，可以在第一表面111和第二表面112上均设置发送端金手指和接收端金手指。另外，可以在PCB11的各层上均设置过孔，从而实现发射组件12与发射端金手指连接，接收组件13与接收端金手指连接。
在一种可选的实现方式中，发射组件12和发射端金手指设置在PCB11的第一侧；接收组件13和接收端金手指设置在PCB11的与第一侧相对的第二侧。
理论上，“第一侧”可以是左侧，“第二侧”可以是右侧；或者，“第一侧”可以是右侧，“第二侧”可以是左侧；或者，“第一侧”可以是上侧，“第二侧”可以是下侧；或者，“第一侧”可以是下侧，“第二侧”可以是上侧。实际上，一般地，将PCB11的金手指端113称为PCB的下端，即：金手指端113所在的一侧称为PCB的下侧；这样，“第一侧”可以是左侧，“第二侧”可以是右侧；或者，“第一侧”可以是右侧，“第二侧”可以是左侧。下文中以“第一侧”是右侧，“第二侧”是左侧，如图8所示，为例进行说明。
可选的，以PCB11的中轴线区分第一侧和第二侧。也就是说，当“第一侧”和“第二侧”表示PCB11的左右侧时，PCB11的左半部分和右半部分的面积相等；或者，当“第一侧”和“第二侧”表示PCB11的上下侧时，PCB11的上半部分和下半部分的面积相等。
可选的，第一表面111和第二表面112上均设置发送端金手指和接收端金手指；且发射端金手指在PCB的右侧，接收端金手指在PCB的左侧。
另外，在布局发射组件12和接收组件13时，可以遵循以下规则：
1)、发射组件12和/或接收组件13与金手指端的距离小于或等于预设阈值，其中该距离是指，从发射组件12和/或接收组件13的 下端开始到PCB11的下端之间的距离。如图8所示，纵向上，发射组件12和接收组件13分别与金手指的之间的走线的长度小于或等于预设阈值。
需要说明的是，若发射组件12和/或接收组件13与金手指之间的走线的长度较大，则走线上的电信号的高频衰减就较大；若发射组件12和/或接收组件13与金手指端的之间的走线的长度较小，则同一组件(包括发射组件12和接收组件13)上连接的不同走线的弧度不同，使得该不同走线之间的长度的差异较大，这会导致经该不同的走线得到的电信号之间的差异较大。另外，具体实现时，一般需要在每根走线上设置一个隔直电容，用于隔离直流电信号；因此，在确定发射组件12和/或接收组件13与金手指端的距离时，还需要考虑到隔直电容的尺寸(例如，2mm左右)。另外，如图8所示，该距离还需要包括金手指的长度，因此，具体实现时，还需要考虑到金手指的长度(例如，5mm左右)。在综合考虑上述各因素的情况下，本发明实施例提供了一种可选的实现方式，发射组件12和/或接收组件13与金手指之间的走线的长度的取值范围是[10mm，30mm]。优选地，发射组件12和/或接收组件13与金手指之间的走线的长度在16mm左右。
另外需要说明的是，具体实现时，在考虑了经与同一组件连接的不同走线得到的电信号之间的差异、隔直电容的尺寸、金手指的尺寸等因素之后，在工艺允许的范围内，可以尽可能的缩短发射组件12和/或接收组件13与金手指之间的走线的长度。
2)、SSF Committee(Small Form Factor Committee，小型化委员会)规范了QSFP接口插头的引脚定义与模块整体尺寸，其中，如图8所示，发射端金手指在PCB11的右侧，接收端金手指在PCB11的左侧。因此，在该场景中，考虑到经与同一组件连接的不同走线得到的电信号之间的差异较小，一般将发射组件12设置在第一表面 111的右侧，接收组件13设置在第二表面112的左侧。可选的，以PCB11的中轴线区分PCB11的左侧和右侧。因此，一般地，在横向上，发射组件12的左侧与PCB11的右侧边界之间的距离的最大值是PCB11的宽度的一半，接收组件13的右侧与PCB11的左侧边界之间的距离的最大值是PCB11的宽度的一半。另外，在工艺上，一般需要在PCB两边预留大约2mm的安全距离。可选的，当PCB11宽度是16.4mm时，如图8所示，在横向上，发射组件12可以设置与PCB11的右侧边界之间的距离在2mm～8.2mm之间的范围内；接收组件可以设置在与PCB11的左侧边界之间的距离在2mm～8.2mm之间的范围内。
最后应说明的是：以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (10)

  1. 一种光模块，其特征在于，包括：
    印制电路板PCB，所述PCB包括第一表面、第二表面和分布有多个金手指的金手指端；
    设置在所述第一表面上的发射组件，所述发射组件与所述金手指连接；
    设置在所述第二表面上的接收组件，所述接收组件与所述金手指连接。
  2. 根据权利要求1所述的光模块，其特征在于，
    所述发射组件通过所述第一表面上的第一走线与所述金手指连接；
    所述接收组件通过所述第二表面上的第二走线与所述金手指连接；
    所述PCB还包括接地层，所述接地层设置在所述第一走线所在的区域与所述第二走线所在的区域之间。
  3. 根据权利要求1或2所述的光模块，其特征在于，所述多个金手指包括发射端金手指和接收端金手指；
    所述发射组件通过所述第一走线与所述发射端金手指连接；
    所述接收组件通过所述第二走线与所述接收端金手指连接。
  4. 根据权利要求3所述的光模块，其特征在于，所述发射端金手指设置在所述第一表面上，所述接收端金手指设置在所述第二表面上。
  5. 根据权利要求3所述的光模块，其特征在于，
    所述发射端金手指设置在所述第二表面，通过设置在所述第一表面所在的信号层和所述PCB的各中间层上的过孔，实现所述发射组件与所述发射端金手指之间的连接；
    和/或，
    所述接收端金手指设置在所述第一表面，通过设置在所述第二表面所在的信号层和所述PCB的各中间层上的过孔，实现所述接收组件与所述接收端金手指之间的连接。
  6. 根据权利要求3所述的光模块，其特征在于，
    所述发射组件和所述发射端金手指设置在所述PCB的第一侧；
    所述接收组件和所述接收端金手指设置在所述PCB的与所述第一侧相对的第二侧。
  7. 根据权利要求6所述的光模块，其特征在于，
    以所述PCB的中轴线区分所述第一侧和所述第二侧。
  8. 根据权利要求1所述的光模块，其特征在于，所述接地层是所述PCB的任意一个中间层。
  9. 根据权利要求1所述的光模块，其特征在于，所述发射组件和所述接收组件分别与所述金手指端之间的距离的取值范围是：[10毫米，30毫米]。
  10. 根据权利要求9所述的光模块，其特征在于，所述发射组件和所述接收组件分别与所述金手指端之间的距离是16毫米。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105425350B (zh) * 2015-12-02 2018-05-04 青岛海信宽带多媒体技术有限公司 一种光模块
CN106793455B (zh) * 2016-12-14 2019-06-14 广东海信宽带科技有限公司 一种光模块
CN106646777B (zh) * 2016-12-14 2019-05-28 青岛海信宽带多媒体技术有限公司 一种光模块及其设计方法
WO2019218978A1 (zh) * 2018-05-14 2019-11-21 青岛海信宽带多媒体技术有限公司 一种光模块
CN108598865A (zh) * 2018-06-06 2018-09-28 复旦大学 基于垂直腔面发射激光器的脉冲驱动电路
WO2020078432A1 (zh) * 2018-10-17 2020-04-23 青岛海信宽带多媒体技术有限公司 电路板和光模块
WO2021184844A1 (zh) * 2020-03-20 2021-09-23 青岛海信宽带多媒体技术有限公司 一种光模块
CN114217390B (zh) * 2021-12-24 2024-02-23 苏州浪潮智能科技有限公司 光交换机设计方法、光交换机、电子设备及存储介质

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060284816A1 (en) * 2005-06-21 2006-12-21 Lg Philips Lcd Co., Ltd. Apparatus and method for driving image display device
US20080171451A1 (en) * 2007-01-16 2008-07-17 Samsung Electro-Mechanics Co., Ltd. Printed circuit board connector for back light unit and chassis using the same
US20110242027A1 (en) * 2010-04-02 2011-10-06 Arolltech Co., Ltd. Display with in-cell touch sensor
CN103323921A (zh) * 2013-06-21 2013-09-25 武汉电信器件有限公司 一种高密集型的并行传输光器件
CN104503044A (zh) * 2014-12-31 2015-04-08 苏州旭创科技有限公司 光模块
CN104540319A (zh) * 2014-12-31 2015-04-22 苏州旭创科技有限公司 用于光模块的印刷电路板
CN104836619A (zh) * 2015-03-30 2015-08-12 青岛海信宽带多媒体技术有限公司 一种光器件
CN105425350A (zh) * 2015-12-02 2016-03-23 青岛海信宽带多媒体技术有限公司 一种光模块

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7476040B2 (en) * 2004-02-02 2009-01-13 Jds Uniphase Corporation Compact optical sub-assembly with ceramic package
JP5541483B2 (ja) * 2009-08-07 2014-07-09 日立金属株式会社 光電気変換モジュール
CN201867521U (zh) * 2010-11-17 2011-06-15 华为技术有限公司 一种收发一体光模块
CN102565965B (zh) * 2010-12-07 2014-04-02 中国科学院微电子研究所 一种叠层高密度光模块
JP2013093345A (ja) * 2011-10-24 2013-05-16 Hitachi Ltd 光モジュールおよび多層基板
TWI514699B (zh) * 2011-12-28 2015-12-21 Hon Hai Prec Ind Co Ltd 光纖連接器

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060284816A1 (en) * 2005-06-21 2006-12-21 Lg Philips Lcd Co., Ltd. Apparatus and method for driving image display device
US20080171451A1 (en) * 2007-01-16 2008-07-17 Samsung Electro-Mechanics Co., Ltd. Printed circuit board connector for back light unit and chassis using the same
US20110242027A1 (en) * 2010-04-02 2011-10-06 Arolltech Co., Ltd. Display with in-cell touch sensor
CN103323921A (zh) * 2013-06-21 2013-09-25 武汉电信器件有限公司 一种高密集型的并行传输光器件
CN104503044A (zh) * 2014-12-31 2015-04-08 苏州旭创科技有限公司 光模块
CN104540319A (zh) * 2014-12-31 2015-04-22 苏州旭创科技有限公司 用于光模块的印刷电路板
CN104836619A (zh) * 2015-03-30 2015-08-12 青岛海信宽带多媒体技术有限公司 一种光器件
CN105425350A (zh) * 2015-12-02 2016-03-23 青岛海信宽带多媒体技术有限公司 一种光模块

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