WO2017070828A1 - 一种扬声器模组、音频补偿方法和装置 - Google Patents

一种扬声器模组、音频补偿方法和装置 Download PDF

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Publication number
WO2017070828A1
WO2017070828A1 PCT/CN2015/092873 CN2015092873W WO2017070828A1 WO 2017070828 A1 WO2017070828 A1 WO 2017070828A1 CN 2015092873 W CN2015092873 W CN 2015092873W WO 2017070828 A1 WO2017070828 A1 WO 2017070828A1
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Prior art keywords
contact
gpio
audio
state parameter
speaker module
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PCT/CN2015/092873
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English (en)
French (fr)
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唐栋
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华为技术有限公司
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Priority to CN201580083439.8A priority Critical patent/CN108141677B/zh
Priority to US15/771,035 priority patent/US10667052B2/en
Priority to PCT/CN2015/092873 priority patent/WO2017070828A1/zh
Publication of WO2017070828A1 publication Critical patent/WO2017070828A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H04R3/04—Circuits for transducers, loudspeakers or microphones for correcting frequency response
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R29/00—Monitoring arrangements; Testing arrangements
    • H04R29/001—Monitoring arrangements; Testing arrangements for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2420/00—Details of connection covered by H04R, not provided for in its groups
    • H04R2420/05—Detection of connection of loudspeakers or headphones to amplifiers

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  • the present invention relates to the field of terminal technologies, and in particular, to a speaker module, an audio compensation method, and a device.
  • the speaker module is indispensable, and the speaker module includes audio. Components and speaker attachments. Since the same mobile terminal may be equipped with speaker modules produced by different manufacturers in the production process, the technical specifications of the speaker modules produced by different manufacturers are different, so that the audio parameters of the audio components are different. When the same mobile terminal is equipped with a speaker module produced by different manufacturers, the audio parameters of the mobile terminal may be different. Therefore, in order to ensure the consistency of the audio performance of the mobile terminal, the audio component production technical indicator may be selected.
  • Embodiments of the present invention provide a speaker module, an audio compensation release method, and a device for compensating audio parameters of the same device configured with different speaker modules to ensure consistency of audio performance of the device.
  • a speaker module including an audio component and a speaker attachment plate, the speaker attachment plate being provided with a power contact, a ground contact, and a universal input/output GPIO contact, and the audio component is A connecting member is interposed between the speaker attachment plates, wherein a connection state of the GPIO contacts is any one of the following connection states:
  • the connecting component is a conductor, and the GPIO contact is electrically connected between the connecting component and the power contact.
  • the connection state of the GPIO contact may be referred to as a pull-up state; or
  • the connecting component is a conductor, and the GPIO contact is electrically connected between the connecting component and the ground contact.
  • the connection state of the GPIO contact may be referred to as a pull-down state; or
  • the connecting component is a non-conductor, and the connection between the GPIO contact and the power contact, and between the GPIO contact and the ground contact is in a disconnected state. At this time, the connection state of the GPIO contact may be called a floating state. status.
  • each of the connection states may correspond to a speaker module. Therefore, the embodiment of the present invention can provide up to three different speaker modules, and the three The speaker module can be distinguished by the connection status of the GPIO contacts.
  • the connecting component is a conductor
  • the GPIO contact is electrically connected between the connecting component and the power contact
  • a resistor is provided between the power contact and the power source to which the power contact is connected.
  • the resistance between the power contact and the power source connected to the power contact is 10K.
  • the connecting component is a foam, and when the connecting component is a conductor, the connecting component is a conductive foam; In the case of a non-conductor, the connecting member is a non-conductive foam.
  • the conductive foam is a conductive foam without filaments.
  • the foam has a thickness of 0.40-0.70 mm when the foam is interposed in the audio
  • the thickness of the foam after being compressed between the assembly and the speaker attachment plate is 0.25-0.45 mm.
  • an audio compensation method is provided, the method being applied to an audio compensation device, the audio compensation device comprising any one of the first aspect to the fourth possible implementation of the first aspect
  • the speaker module the method comprising:
  • the audio parameter of the device is compensated.
  • the different connection states of the GPIO contacts correspond to different state parameters
  • the actual state parameters may be parameters such as voltage, current or level of the GPIO contacts.
  • connection state of the GPIO contact is set in advance.
  • the audio parameter of the device is not compensated.
  • the audio parameter of the device is compensated, including:
  • an identification identifier of the speaker module Determining, according to a connection state of the GPIO contact indicated by an actual state parameter of the GPIO contact, an identification identifier of the speaker module, where the identification identifier is a manufacturer identifier of the speaker module;
  • the correspondence between the identification identifier and the compensation parameter is set in advance.
  • an audio compensation device comprising the speaker module, the processor and the memory, the memory according to any one of the implementation manners of the first aspect to the fourth aspect of the first aspect,
  • the code and data are stored, and the processor can execute the code in the memory, and the processor is specifically configured to:
  • the audio parameter of the device is compensated.
  • the processor is further configured to:
  • the audio parameters of the device are not compensated.
  • the processor is further configured to:
  • connection of the GPIO contacts based on actual status parameters of the GPIO contacts And determining an identification identifier of the speaker module, where the identification identifier is a manufacturer identifier for producing the speaker module;
  • the audio compensation method provided by the embodiment of the present invention is simple and effective, has high reliability, and can effectively reduce the production cost.
  • FIG. 1 is a schematic structural diagram of hardware of a terminal according to an embodiment of the present disclosure
  • FIG. 2 is a schematic structural diagram of a speaker module according to an embodiment of the present invention.
  • FIG. 3 is a flowchart of an audio compensation method according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of an audio compensation apparatus according to an embodiment of the present invention.
  • connection component 1: audio component, 2: speaker attachment plate, 3: connection component;
  • the application scenario of the present invention will first be described.
  • the speaker module is Indispensable, the speaker module includes an audio component and a speaker attachment plate.
  • the technical specifications or production processes of these manufacturers may be different, so that the audio parameters of the audio components are different.
  • the same mobile terminal is configured with a speaker module produced by a different manufacturer, in order to ensure the consistency of the audio parameters of the mobile terminal, it is necessary to compensate the audio parameters of the mobile terminal for different audio components, that is, Yes, the audio parameters of the mobile terminal are compensated for the manufacturers of different speaker modules.
  • the speaker module and the audio compensation method provided by the embodiments of the present invention can be applied to an audio compensation device, and the audio compensation device can be any device including the speaker module, for example, a terminal and other electronic devices.
  • the terminal can be a mobile phone, a tablet computer, a notebook computer, a UMPC (Ultra-mobile Personal Computer), a netbook, a PDA (Personal Digital Assistant), and the like.
  • the embodiment of the present invention is described by taking a terminal as an example.
  • FIG. 1 is a block diagram showing a partial structure of a terminal related to each embodiment of the present invention.
  • FIG. 1 is merely illustrative and does not limit the structure of the terminal.
  • the terminal may also include more or fewer components than those shown in FIG. 1, or have a different configuration than that shown in FIG.
  • FIG. 1 is a schematic structural diagram of a terminal used in an embodiment of the present invention, as shown in FIG.
  • the terminal includes a processor 101, a memory 102, a speaker module 103, a power supply component 104, a multimedia component 105, an input/output interface 106, and a communication component 107.
  • the processor 101 generally controls the overall operations of the terminal, such as display, communication, data transmission, and the like.
  • the memory 102 can be used to store various types of data, which can be applications, instructions, messages, pictures, and the like.
  • the speaker module 103 can include an audio component and a speaker attachment for inputting/outputting audio signals and the like.
  • the power component 104 is used to provide power to various components of the terminal
  • the multimedia component 105 can be used to play multimedia files and the like
  • the input/output interface 106 provides an interface between the processor 101 and the peripheral interface module.
  • the peripheral interface module can be a keyboard or a mouse.
  • the communication component 107 can be used to enable communication between the terminal and other devices, and the like.
  • FIG. 2 is a schematic structural diagram of a speaker module according to an embodiment of the present invention.
  • the speaker module can be applied to an audio compensation device.
  • the speaker module includes an audio component 1 and a speaker attachment plate 2
  • the speaker attachment plate 2 is provided with a power contact 21, a ground contact 22, and a general purpose input output (GPIO) contact 23, and a connection member 3 is interposed between the audio component 1 and the speaker attachment plate 2.
  • the connection state of the GPIO contact 23 may be any one of the following three connection states:
  • the first type, the connecting member 3 is a conductor, and the GPIO contact 23 is electrically connected between the connecting member 3 and the power contact 21. At this time, the connection state of the GPIO contact 23 can be referred to as a pull-up state.
  • a resistor may be disposed between the power contact 21 and the power source connected to the power contact 21, and by setting the resistor, the power contact 21 and the power contact 21 may be reduced.
  • the leakage current between the connected power supplies protects the power supply and also facilitates subsequent identification of the status parameters at the GPIO contact 23.
  • the resistance of the resistor between the power contact 21 and the power source connected to the power contact 21 may be 10K.
  • the connecting member 3 is a conductor
  • the GPIO contact 23 is electrically connected between the connecting member 3 and the ground contact 22.
  • the connection state of the GPIO contact 23 can be referred to as a pull-down state.
  • the connecting member 3 is a non-conductor, and the connection between the GPIO contact 23 and the power contact 21, and between the GPIO contact 23 and the ground contact 22 is in an off state.
  • the connection state of the GPIO contact 23 may be referred to as floating. status.
  • the connecting member 3 can also be omitted. That is, when the connecting member 3 is not interposed between the audio component 1 and the speaker attachment board 2, the connection state of the GPIO contact 23 is also in a floating state.
  • the speaker attachment plate 2 refers to a circuit board provided with a power contact 21, a ground contact 22 and a GPIO contact 23, and the circuit on the speaker attachment 2 can be directly designed not only on the main board of the audio compensation device but also It can be designed on a separate circuit board, which is not limited by the embodiment of the present invention.
  • each of the connection states may correspond to a speaker module. Therefore, the embodiment of the present invention can provide up to three different speaker modules, and the three speakers are provided.
  • the module can be distinguished by the connection status of the GPIO contacts 23.
  • connection state of the GPIO contact 23 since the GPIO contacts 23 are in different connection states, the size of the corresponding state parameter is different, and therefore, the state parameter at the GPIO contact 23 can be determined.
  • the status parameter may be an electrical parameter corresponding to the GPIO contact 23 when the GPIO contact 23 is in a different connection state, for example, a level value at the GPIO contact 23, and the like.
  • the connecting member 3 can be divided into two types of conductors and non-conductive, and when the connecting member 3 is sandwiched between the audio component 1 and the speaker attachment plate 2, the audio component 1 and the The sounder attachment plate 2 is sufficiently contacted by the connecting member 3.
  • the connecting member 3 may be foamed, and when the connecting member 3 is a conductor, the connecting member 3 is a conductive foam; when the connecting member 3 is a non-conductor, the connecting member 3 is a non-conductive foam.
  • the connecting member 3 is a non-conductor
  • the connecting member can be omitted, which is merely a simple replacement of the embodiment of the present invention.
  • the connecting member 3 is a conductive foam
  • the conductive foam is a conductive foam without filaments.
  • the thickness of the foam in the natural state is 0.40-0.70 mm, and when the foam is interposed between the audio component 1 and the speaker attachment plate 2, the foam is compressed. The thickness thereafter is 0.25-0.45 mm.
  • the thickness of the foam when it is in a natural state is 0.50 mm, and when the foam is sandwiched between the audio component 1 and the speaker attachment plate 2, the foam is compressed The thickness is 0.30 mm.
  • connection member is interposed between the audio component and the speaker attachment plate, and the GPIO contact on the speaker attachment plate is placed in three different connection states by the connection member, that is, by the connection member.
  • the power contact and the GPIO contact are turned on, or the ground contact and the GPIO contact are electrically connected through the connection portion, or the connection between the power contact and the GPIO contact, and between the ground contact and the GPIO contact are disconnected through the connection portion,
  • different connection states correspond to a different speaker module, and three different speaker modules are generated.
  • audio compensation device When the same type of audio compensation device is configured with the different speaker modules described above in FIG. 2, in order to keep the audio parameters of the audio compensation device consistent, audio compensation can be performed for different speaker modules.
  • FIG. 3 is a flowchart of an audio compensation method according to an embodiment of the present invention. The method may be applied to an audio compensation device, where the audio compensation device includes the speaker module described in FIG. 2, as shown in FIG. 2,
  • the audio compensation method includes the following steps.
  • Step 301 Obtain the actual state parameter of the GPIO contact, the actual GPIO contact
  • the status parameter is used to indicate the connection status of the GPIO contact.
  • the audio compensation device can acquire the actual state parameters of the GPIO contacts, and the actual state parameters can be used to indicate the current connection state of the GPIO contacts.
  • the actual state parameter may be a voltage, a current, a level, or the like of the GPIO contact.
  • the actual state parameter may also be other parameters, which is not limited in the embodiment of the present invention.
  • the actual state parameter when the actual state parameter is level, if the actual state parameter obtained is 1, it indicates that the current connection state of the GPIO contact is a pull-up state; if the obtained actual state parameter is 0, it indicates that the current connection state of the GPIO contact is a pull-down state. If the actual status parameter obtained is NA, it indicates that the current connection status of the GPIO contact is floating.
  • Step 302 Query the connection state of the GPIO contact and the preset state parameter based on the connection state of the GPIO contact indicated by the actual state parameter of the GPIO contact, and obtain the preset state parameter corresponding to the connection state of the GPIO contact.
  • connection state of the GPIO contact is set in advance.
  • the preset state parameter of the pull-up state of the GPIO contact is 1, and the preset state parameter of the pull-down state of the GPIO contact is 0.
  • the preset state parameter of the suspended state of the GPIO contact is NA or the like, which is not limited in this embodiment of the present invention.
  • the audio compensation device acquires the actual state parameter of the GPIO contact, in order to determine whether the actual state parameter is consistent with the preset state parameter set in advance, the device sets the connection state of the GPIO contact based on the actual state parameter of the GPIO contact from the GPIO set in advance. Corresponding relationship between the connection state of the contact and the preset state parameter, querying and obtaining the preset state parameter corresponding to the connection state of the GPIO contact.
  • Step 303 If the actual state parameter of the GPIO contact is equal to the preset state parameter, the audio parameter of the device is compensated.
  • the device can determine the connection state of the GPIO contact based on the actual state parameter of the GPIO contact.
  • the identification identifier of the speaker module is determined, and the identification identifier is the manufacturer identifier of the speaker module.
  • the compensation parameter corresponding to the identification identifier of the speaker module is obtained from the correspondence between the preset identification identifier and the compensation parameter, and is based on the identification identifier of the speaker module. Compensation parameters to compensate for the audio parameters of the device.
  • the manufacturer's logo of the speaker module can be identified not only by the name, code, etc. of the manufacturer, but also by the color or special material of the connecting component in the speaker module, for example, the speaker of the manufacturer 1
  • the color of the connecting component in the module is red
  • the color of the connecting component in the speaker module of the manufacturer 2 is green or the like, which is not limited in the embodiment of the present invention.
  • the identification identifier of the speaker module is the manufacturer identifier of the speaker module, and the audio parameters corresponding to the speaker modules of different manufacturers are certain, the compensation parameters for compensating the device based on the audio parameter are also certain. Therefore, the identification identifier of the speaker module and the corresponding compensation parameter can be stored in the correspondence between the identification identifier and the compensation parameter in advance.
  • Step 304 If the actual state parameter of the GPIO contact is not equal to the preset state parameter, the audio parameter of the device is not compensated.
  • the audio compensation method provided by the embodiment of the invention is simple and effective, has high reliability, and can effectively reduce the production cost.
  • FIG. 4 is an audio compensation device according to an embodiment of the present invention.
  • the device includes the speaker module 401, the processor 402 and the memory 403, the memory 403 stores code and data, and the processor 402 can run the memory.
  • Code in processor 402 Specifically used for:
  • the audio parameter of the device is compensated.
  • the audio parameter of the device is not compensated.
  • the processor 402 is specifically configured to:
  • an identification identifier of the speaker module Determining, according to a connection state of the GPIO contact indicated by an actual state parameter of the GPIO contact, an identification identifier of the speaker module, where the identification identifier is a manufacturer identifier for producing the speaker module;
  • the processor in the device obtains the preset state parameter corresponding to the actual state parameter of the GPIO contact and the connection state of the GPIO contact, if the actual state parameter and the preset state of the GPIO contact point If the parameters are equal, the audio parameters of the device are compensated, thereby ensuring the consistency of the audio performance of the same device configured with different speaker modules, and effectively reducing the production cost.

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Abstract

本发明公开了一种扬声器模组、音频补偿方法和装置，涉及终端技术领域，用于对配置有不同扬声器模组的同一种装置的音频参数进行补偿，保证该种装置音频性能的一致性。所述扬声器模组包括音频部件和扬声器附板，扬声器附板上设置有电源接点、地接点和GPIO接点，且音频组件和扬声器附板之间夹设有连接部件。其中，GPIO接点的连接状态为下述任意一种连接状态：连接部件为导体，GPIO接点通过连接部件和电源接点之间导通；或者，连接部件为导体，GPIO接点通过连接部件和地接点之间导通；或者，连接部件为非导体，GPIO接点与电源接点之间、以及GPIO接点和所述地接点之间均处于断开状态。

Description

一种扬声器模组、音频补偿方法和装置 技术领域
本发明涉及终端技术领域，尤其涉及一种扬声器模组、音频补偿方法和装置。
背景技术
随着终端技术的快速发展，出现了越来越多的移动终端，这些移动终端最基本的功能为通信功能，在移动终端通信过程中扬声器模组是必不可少的，该扬声器模组包括音频组件和扬声器附板。由于同一种移动终端在生产过程中可能配置有不同厂家生产的扬声器模组，而不同厂家生产扬声器模组的技术指标不同，从而使音频组件的音频参数存在一定的差异。当同一种移动终端配置有不同厂家生产的扬声器模组时，会导致该种移动终端的音频参数产生差异，因此，为了保证该种移动终端的音频性能的一致性，可以选择音频组件生产技术指标相近的厂家，但是，这样就限制了该种移动终端的选择范围，且未彻底消除音频性能的差异，如果以技术指标较低的厂家生产的音频组件的音频参数为准，又降低了该种移动终端的音频性能，因此，亟需一种扬声器模组、音频补偿方法和装置。
发明内容
本发明的实施例提供一种扬声器模组、音频补偿放方法和装置，用于对配置有不同扬声器模组的同一种装置的音频参数进行补偿，以保证该种装置音频性能的一致性。
为达到上述目的，本发明的实施例采用如下技术方案：
第一方面，提供一种扬声器模组，所述扬声器模组包括音频组件和扬声器附板，所述扬声器附板上设置有电源接点、地接点和通用输入输出GPIO接点，且所述音频组件与所述扬声器附板之间夹设有连接部件，其中，所述GPIO接点的连接状态为下述任意一种连接状态：
所述连接部件为导体，所述GPIO接点通过所述连接部件和所述电源接点之间导通，此时，GPIO接点的连接状态可以称为上拉状态；或者，
所述连接部件为导体，所述GPIO接点通过所述连接部件和所述地接点之间导通，此时，GPIO接点的连接状态可以称为下拉状态；或者，
所述连接部件为非导体，所述GPIO接点与所述电源接点之间、以及所述GPIO接点和所述地接点之间均处于断开状态，此时，GPIO接点的连接状态可以称为悬空状态。
其中，当GPIO接点分别处于上述三种不同的连接状态时，每一种连接状态可以对应一种扬声器模组，因此，本发明实施例可以最多提供三种不同的扬声器模组，且该三种扬声器模组可以通过GPIO接点的连接状态进行区分。
结合第一方面，在第一方面的第一种可能的实现方式中，当所述连接部件为导体，且所述GPIO接点通过所述连接部件和所述电源接点之间导通时，所述电源接点与所述电源接点所连接的电源之间设置有电阻。
进一步，所述电源接点与所述电源接点所连接的电源之间的电阻为10K。
结合第一方面，在第一方面的第二种可能的实现方式中，所述连接部件为泡棉，当所述连接部件为导体时，所述连接部件为导电泡棉；当所述连接部件为非导体时，所述连接部件为非导电泡棉。
结合第一方面的第二种可能的实现方式，在第一方面的第三种可能的实现方式中，所述导电泡棉为不带丝状的导电泡棉。
结合第一方面的第二种可能的实现方式，在第一方面的第四种可能的实现方式中，所述泡棉的厚度为0.40-0.70mm，当所述泡棉夹设在所述音频组件与所述扬声器附板之间时，所述泡棉被压缩之后的厚度为0.25-0.45mm。
第二方面，提供一种音频补偿方法，所述方法应用于音频补偿装置中，所述音频补偿装置包括上述第一方面至第一方面的第四种可能的实现方式中的任意中实现方式所述的扬声器模组，所述方法包括：
获取所述GPIO接点的实际状态参数，所述GPIO接点的实际状态参数用于指示所述GPIO接点的连接状态；
基于所述GPIO接点的实际状态参数指示的所述GPIO接点的连接状态，查询所述GPIO接点的连接状态与预设状态参数的对应关系，获取所述GPIO接点的连接状态对应的预设状态参数；
若所述GPIO接点的实际状态参数与预设状态参数相等，补偿所述装置的音频参数。
其中，GPIO接点不同的连接状态对应不同的状态参数，且实际状态参数可以为GPIO接点的电压、电流或者电平等参数。
另外，所述GPIO接点的连接状态与预设状态参数的对应关系是事先设置的。
结合第二方面，在第二方面的第一种可能的实现方式中，若所述GPIO接点的实际状态参数与预设状态参数不相等，对所述装置的音频参数不进行补偿。
结合第二方面，在第二方面的第二种可能的实现方式中，所述若所述GPIO接点的实际状态参数与预设状态参数相等，补偿所述装置的音频参数，包括：
基于所述GPIO接点的实际状态参数指示的所述GPIO接点的连接状态，确定所述扬声器模组的识别标识，所述识别标识为所述扬声器模组的生产厂家标识；
基于所述扬声器模组的识别标识，从预设的识别标识与补偿参数的对应关系中，获取所述扬声器模组的识别标识对应的补偿参数；
基于所述扬声器模组的识别标识对应的所述补偿参数，对所述装置的音频参数进行补偿。
其中，识别标识与补偿参数的对应关系是事先设置的。
第三方面，提供一种音频补偿装置，所述装置包括第一方面至第一方面的第四种可能的实现方式中的任一种实现方式所述的扬声器模组，处理器和存储器，存储器中存储代码和数据，处理器可运行存储器中的代码，所述处理器具体用于：
获取所述GPIO接点的实际状态参数，所述GPIO接点的实际状态参数用于指示所述GPIO接点的连接状态；
基于所述GPIO接点的实际状态参数指示的所述GPIO接点的连接状态，查询所述GPIO接点的连接状态与预设状态参数的对应关系，获取所述GPIO接点的连接状态对应的预设状态参数；
若所述GPIO接点的实际状态参数与预设状态参数相等，补偿所述装置的音频参数。
结合第三方面，在第三方面的第一种可能的实现方式中，所述处理器具体还用于：
若所述GPIO接点的实际状态参数与预设状态参数不相等，对所述装置的音频参数不进行补偿。
结合第三方面，在第三方面的第二种可能的实现方式中，所述处理器具体还用于：
基于所述GPIO接点的实际状态参数指示的所述GPIO接点的连 接状态，确定所述扬声器模组的识别标识，所述识别标识为生产所述扬声器模组的厂家标识；
基于所述扬声器模组的识别标识，从预设的识别标识与补偿参数的对应关系中，获取所述扬声器模组的识别标识对应的补偿参数；
基于所述扬声器模组的识别标识对应的所述补偿参数，对所述装置的音频参数进行补偿。
上述技术方案中，通过获取GPIO接点的实际状态参数和GPIO接点的连接状态对应的预设状态参数，若GPIO接点的实际状态参数与预设状态参数相等，则补偿装置的音频参数，从而保证了配置有不同扬声器模组的同一种装置音频性能的一致性，另外，本发明实施例提供的音频补偿方法简单有效，可靠性高，同时还能有效的降低生产成本。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的一种终端的硬件结构示意图；
图2为本发明实施例提供的一种扬声器模组的结构示意图；
图3为本发明实施例提供的一种音频补偿方法的流程图；
图4为本发明实施例提供的一种音频补偿装置的结构示意图。
附图标记：
1：音频部件，2：扬声器附板，3：连接部件；
21：电源接点，22：地接点，23：GPIO接点。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在介绍本发明之前，首先对本发明的应用场景进行说明。随着终端技术的快速发展，移动终端的使用越来越普遍，对于移动终端的需求数量也在不断增加，而这些移动终端最基本的功能为通信功能，在移动终端通信过程中扬声器模组是必不可少的，该扬声器模组包括音频组件和扬声器附板。目前，由于同一种移动终端在生产过程中可能配置有不同厂家生产的扬声器模组，而这些生产厂家的技术指标或者生产工艺会有不同，从而使音频组件的音频参数存在一定的差异。因此，当同一种移动终端配置有不同厂家生产的扬声器模组时，为了保证该种移动终端的音频参数的一致性，需要针对不同的音频组件，对移动终端的的音频参数进行补偿，也即是，针对不同的扬声器模组的生产厂家，对移动终端的音频参数进行补偿。
本发明实施例提供的扬声器模组、音频补偿方法可以应用于音频补偿装置，该音频补偿装置可以为任何包含该扬声器模组的装置，例如，终端及其他电子设备。其中终端可以为手机、平板电脑、笔记本电脑、UMPC(Ultra-mobile Personal Computer，超级移动个人计算机)、上网本、PDA(Personal Digital Assistant，个人数字助理)等等。本发明实施例以终端为例进行说明，图1示出的是与本发明各实施例相关的终端的部分结构的框图。
本领域普通技术人员可以理解，图1所示的结构仅为示意，其并不对终端的结构造成限定。例如，该终端还可包括比图1中所示更多或者更少的组件，或者具有与图1所示不同的配置。
图1为本发明实施例所应用的终端的结构示意图，如图1所示，该终 端包括处理器101、存储器102、扬声器模组103、电源组件104、多媒体组件105、输入\输出接口106，以及通信组件107。
其中，处理器101通常控制终端的整体操作，诸如显示、通信、数据传输等操作。存储器102可用于存储各种类型的数据，这些数据可以为应用程序、指令、消息、图片等等。扬声器模组103可以包括音频组件和扬声器附板，用于输入\输出音频信号等。电源组件104用于为终端的各个组件提供电源，多媒体组件105可用于播放多媒体文件等，输入\输出接口106为处理器101和外围接口模块之间提供接口，比如，外围接口模块可以键盘、鼠标等等，通信组件107可用于使终端与其他设备之间进行通信等。
图2为本发明实施例提供的一种扬声器模组的结构示意图，该扬声器模组可应用于音频补偿装置中，如图2所示，该扬声器模组包括音频部件1和扬声器附板2，扬声器附板2上设置有电源接点21、地接点22和通用输入输出(英文：General Purpose Input Output，简称：GPIO)接点23，且音频组件1和扬声器附板2之间夹设有连接部件3。其中，GPIO接点23的连接状态可以为下述三种连接状态中的任意一种：
第一种、连接部件3为导体，GPIO接点23通过连接部件3和电源接点21之间导通，此时，GPIO接点23的连接状态可以称为上拉状态。
进一步，当GPIO接点23的连接状态为上拉状态时，可以在电源接点21与该电源接点21所连接的电源之间设置有电阻，通过设置电阻，可以减小电源接点21与电源接点21所连接的电源之间的漏电流，起到保护电源的作用，同时，也有助于后续对GPIO接点23处状态参数的识别。
可选的，电源接点21与该电源接点21所连接的电源之间电阻的阻值可以为10K。
第二种，连接部件3为导体，GPIO接点23通过连接部件3和地接点22之间导通，此时，GPIO接点23的连接状态可以称为下拉状态。
第三种，连接部件3为非导体，GPIO接点23与电源接点21之间、以及GPIO接点23和地接点22之间均处于断开状态，此时，GPIO接点23的连接状态可以称为悬空状态。
进一步，当GPIO接点23为悬空状态时，GPIO接点23、电源接点21和地接点22三者之间都是断开的，因此，该连接部件3也可以省略。也即是，在音频部件1和扬声器附板2之间不夹设有连接部件3时，GPIO接点23的连接状态也为悬空状态。
需要说明的是，上述扬声器附板2是指设置有电源接点21、地接点22和GPIO接点23的电路板，该扬声器附板2上的电路不仅可以直接设计在音频补偿装置的主板上，还可以设计在单独的电路板上，本发明实施例对此不作限定。
当GPIO接点23分别处于上述三种不同的连接状态时，每一种连接状态可以对应一种扬声器模组，因此，本发明实施例可以最多提供三种不同的扬声器模组，且该三种扬声器模组可以通过GPIO接点23的连接状态进行区分。
当通过GPIO接点23的连接状态区分扬声器模组时，由于GPIO接点23处于不同的连接状态，其对应的状态参数的大小是不一样，因此，可以通过获取GPIO接点23处的状态参数，来确定GPIO接点23的连接状态，进而来区分不同的扬声器模组。
需要说明的是，该状态参数可以是GPIO接点23处于不同的连接状态时，GPIO接点23对应的电参数，比如，GPIO接点23处的电平值等。
其中，连接部件3可以分为导体和非导电两种，且当连接部件3夹设于音频部件1和扬声器附板2之间时，可以使音频部件1和扬 声器附板2通过连接部件3充分接触。可选的，该连接部件3可以泡棉，且当连接部件3为导体时，连接部件3为导电泡棉；当连接部件3为非导体时，连接部件3为非导电泡棉。
当然，容易理解的是，当连接部件3为非导体时，连接部件可以省略，这只是本发明实施例的简单替换。
进一步，当连接部件3为导电泡棉时，为了保证连接部件3的导电性和安全性，导电泡棉为不带丝状的导电泡棉。
另外，当连接部件3为泡棉时，该泡棉处于自然状态时的厚度为0.40-0.70mm，当该泡棉夹设在音频部件1与扬声器附板2之间时，该泡棉被压缩之后的厚度为0.25-0.45mm。
优选的，当连接部件3为泡棉时，该泡棉处于自然状态时的厚度为0.50mm，当该泡棉夹设在音频部件1与扬声器附板2之间时，该泡棉被压缩之后的厚度为0.30mm。
在本发明实施例中，通过在音频组件与扬声器附板之间夹设连接部件，以及通过连接部件使扬声器附板上的GPIO接点处于三种不同的连接状态，也即是，通过连接部件使电源接点和GPIO接点之间导通，或者通过连接部使地接点和GPIO接点之间导通，或者通过连接部使电源接点和GPIO接点之间、以及地接点和GPIO接点之间均断开，从而使不同的连接状态对应一种不同的扬声器模组，进而产生了三种不同的扬声器模组。
当同一种音频补偿装置配置有上述图2所述的不同的扬声器模组时，为了使该种音频补偿装置的音频参数保持一致，可以针对不同的扬声器模组，进行音频补偿。
图3为本发明实施例提供的一种音频补偿方法的流程图，该方法可应用于音频补偿装置中，该音频补偿装置包括上述图2所述的扬声器模组，如图2所示，该音频补偿方法包括以下步骤。
步骤301：获取GPIO接点的实际状态参数，GPIO接点的实际 状态参数用于指示GPIO接点的连接状态。
由于GPIO接点不同的连接状态对应的状态参数是不同的，因此，音频补偿装置可以获取GPIO接点的实际状态参数，实际状态参数可用于指示GPIO接点当前的连接状态。
需要说明的是，实际状态参数可以为GPIO接点的电压、电流或者电平等，当然，在实际应用中，实际状态参数也可以为其他的参数，本发明实施例对此不作限定。
比如，当实际状态参数为电平时，若获取的实际状态参数为1，表示GPIO接点当前的连接状态为上拉状态；若获取的实际状态参数为0，表示GPIO接点当前的连接状态为下拉状态；若获取的实际状态参数为NA，表示GPIO接点当前的连接状态为悬空状态。
步骤302：基于GPIO接点的实际状态参数指示的GPIO接点的连接状态，查询GPIO接点的连接状态与预设状态参数的对应关系，获取GPIO接点的连接状态对应的预设状态参数。
需要说明的是，GPIO接点的连接状态与预设状态参数的对应关系是事先设置的，比如，GPIO接点的上拉状态的预设状态参数为1，GPIO接点的下拉状态的预设状态参数为0，GPIO接点的悬空状态的预设状态参数为NA等，本发明实施例对此不做限定。
当音频补偿装置获取GPIO接点的实际状态参数时，为了确定实际状态参数与事先设置的预设状态参数是否一致，装置基于GPIO接点的实际状态参数指示的GPIO接点的连接状态，从事先设置的GPIO接点的连接状态与预设状态参数的对应关系，查询并获取GPIO接点的连接状态对应的预设状态参数。
步骤303：若GPIO接点的实际状态参数与预设状态参数相等，补偿装置的音频参数。
当GPIO接点的实际状态参数与预设状态参数相等时，装置可以基于GPIO接点的实际状态参数指示的GPIO接点的连接状态，确 定扬声器模组的识别标识，该识别标识为该扬声器模组的生产厂家标识。
之后，装置基于该扬声器模组的识别标识，从预设的识别标识与补偿参数的对应关系中，获取该扬声器模组的识别标识对应的补偿参数，并基于该扬声器模组的识别标识对应的补偿参数，对装置的音频参数进行补偿。
需要说明的是，扬声器模组的生产厂家标识不仅可以通过该生产厂家的名称、代码等进行标识，还可以通过扬声器模组中连接部件的颜色或特殊材质进行标识，比如，生产厂家1的扬声器模组中连接部件的颜色为红色，生产厂家2的扬声器模组中连接部件的颜色为绿色等等，本发明实施例对此不做限定。
另外，由于扬声器模组的识别标识为该扬声器模组的生产厂家标识，而不同生产厂家的扬声器模组对应的音频参数是一定的，基于该该音频参数对装置进行补偿的补偿参数也是一定的，从而可以事先将扬声器模组的识别标识与对应的补偿参数存储在识别标识与补偿参数的对应关系中。
步骤304：若GPIO接点的实际状态参数与预设状态参数不相等，对装置的音频参数不进行补偿。
在本发明实施例中，通过获取GPIO接点的实际状态参数和GPIO接点的连接状态对应的预设状态参数，若GPIO接点的实际状态参数与预设状态参数相等，则补偿装置的音频参数，从而保证了配置有不同扬声器模组的同一种装置音频性能的一致性，另外，本发明实施例提供的音频补偿方法简单有效，可靠性高，同时还能有效的降低生产成本。
图4是本发明实施例提供的一种音频补偿装置，该装置包括上述图2所述的扬声器模组401，处理器402和存储器403，存储器403中存储代码和数据，处理器402可运行存储器中的代码，处理器402 具体用于：
获取所述GPIO接点的实际状态参数，所述GPIO接点的实际状态参数用于指示所述GPIO接点的连接状态；
基于所述GPIO接点的实际状态参数指示的所述GPIO接点的连接状态，查询所述GPIO接点的连接状态与预设状态参数的对应关系，获取所述GPIO接点的连接状态对应的预设状态参数；
若所述GPIO接点的实际状态参数与预设状态参数相等，补偿装置的音频参数。
可选的，若所述GPIO接点的实际状态参数与预设状态参数不相等，对所述装置的音频参数不进行补偿。
其中，所述处理器402，具体还用于：
基于所述GPIO接点的实际状态参数指示的所述GPIO接点的连接状态，确定所述扬声器模组的识别标识，所述识别标识为生产所述扬声器模组的厂家标识；
基于所述扬声器模组的识别标识，从预设的识别标识与补偿参数的对应关系中，获取所述扬声器模组的识别标识对应的补偿参数；
基于所述扬声器模组的识别标识对应的所述补偿参数，对所述装置的音频参数进行补偿。
本发明实施例提供的一种音频补偿装置，该装置中的处理器通过获取GPIO接点的实际状态参数和GPIO接点的连接状态对应的预设状态参数，若GPIO接点的实际状态参数与预设状态参数相等，则补偿装置的音频参数，从而保证了配置有不同扬声器模组的同一种装置音频性能的一致性，也有效地降低生产成本。
最后应说明的是：以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明， 本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (11)

  1. 一种扬声器模组，其特征在于，所述扬声器模组包括音频组件和扬声器附板，所述扬声器附板上设置有电源接点、地接点和通用输入输出GPIO接点，且所述音频组件与所述扬声器附板之间夹设有连接部件，其中，所述GPIO接点的连接状态为下述任意一种连接状态：
    所述连接部件为导体，所述GPIO接点通过所述连接部件和所述电源接点之间导通；或者，
    所述连接部件为导体，所述GPIO接点通过所述连接部件和所述地接点之间导通；或者，
    所述连接部件为非导体，所述GPIO接点与所述电源接点之间、以及所述GPIO接点和所述地接点之间均处于断开状态。
  2. 如权利要求1所述的扬声器模组，其特征在于，当所述连接部件为导体，且所述GPIO接点通过所述连接部件和所述电源接点之间导通时，所述电源接点与所述电源接点所连接的电源之间设置有电阻。
  3. 如权利要求1所述的扬声器模组，其特征在于，所述连接部件为泡棉，当所述连接部件为导体时，所述连接部件为导电泡棉；当所述连接部件为非导体时，所述连接部件为非导电泡棉。
  4. 如权利要求3所述的扬声器模组，其特征在于，所述导电泡棉为不带丝状的导电泡棉。
  5. 如权利要求3所述的扬声器模组，其特征在于，所述泡棉的厚度为0.40-0.70mm，当所述泡棉夹设在所述音频组件与所述扬声器附板之间时，所述泡棉被压缩之后的厚度为0.25-0.45mm。
  6. 一种音频补偿方法，其特征在于，所述方法应用于音频补偿装置中，所述音频补偿装置包括上述权利要求1-5任一权利要求所述的扬声器模组，所述方法包括：
    获取所述GPIO接点的实际状态参数，所述GPIO接点的实际状态参数用于指示所述GPIO接点的连接状态；
    基于所述GPIO接点的实际状态参数指示的所述GPIO接点的连接状态，查询所述GPIO接点的连接状态与预设状态参数的对应关系，获取所述GPIO接点的连接状态对应的预设状态参数；
    若所述GPIO接点的实际状态参数与预设状态参数相等，补偿所述装置的音频参数。
  7. 如权利要求6所述的方法，其特征在于，所述方法还包括：
    若所述GPIO接点的实际状态参数与预设状态参数不相等，对所述装置的音频参数不进行补偿。
  8. 如权利要求6所述的方法，其特征在于，所述若所述GPIO接点的实际状态参数与预设状态参数相等，补偿所述装置的音频参数，包括：
    基于所述GPIO接点的实际状态参数指示的所述GPIO接点的连接状态，确定所述扬声器模组的识别标识，所述识别标识为所述扬声器模组的生产厂家标识；
    基于所述扬声器模组的识别标识，从预设的识别标识与补偿参数的对应关系中，获取所述扬声器模组的识别标识对应的补偿参数；
    基于所述扬声器模组的识别标识对应的所述补偿参数，对所述装置的音频参数进行补偿。
  9. 一种音频补偿装置，其特征在于，所述装置包括上述权利要求1-5任一权利要求所述的扬声器模组，处理器和存储器，存储器中存储代码和数据，处理器可运行存储器中的代码，所述处理器具体用于：
    获取所述GPIO接点的实际状态参数，所述GPIO接点的实际状态参数用于指示所述GPIO接点的连接状态；
    基于所述GPIO接点的实际状态参数指示的所述GPIO接点的连接状态，查询所述GPIO接点的连接状态与预设状态参数的对应关系，获取所述GPIO接点的连接状态对应的预设状态参数；
    若所述GPIO接点的实际状态参数与预设状态参数相等，补偿所述装置的音频参数。
  10. 如权利要求9所述的装置，其特征在于，所述处理器具体还用于：
    若所述GPIO接点的实际状态参数与预设状态参数不相等，对所述装置的音频参数不进行补偿。
  11. 如权利要求9所述的装置，其特征在于，所述处理器还具体用于：
    基于所述GPIO接点的实际状态参数指示的所述GPIO接点的连接状态，确定所述扬声器模组的识别标识，所述识别标识为生产所述扬声器模组的厂家标识；
    基于所述扬声器模组的识别标识，从预设的识别标识与补偿参数的对应关系中，获取所述扬声器模组的识别标识对应的补偿参数；
    基于所述扬声器模组的识别标识对应的所述补偿参数，对所述装置的音频参数进行补偿。
PCT/CN2015/092873 2015-10-26 2015-10-26 一种扬声器模组、音频补偿方法和装置 WO2017070828A1 (zh)

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