WO2017054245A1 - Led发光模组及led发光设备 - Google Patents

Led发光模组及led发光设备 Download PDF

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Publication number
WO2017054245A1
WO2017054245A1 PCT/CN2015/091414 CN2015091414W WO2017054245A1 WO 2017054245 A1 WO2017054245 A1 WO 2017054245A1 CN 2015091414 W CN2015091414 W CN 2015091414W WO 2017054245 A1 WO2017054245 A1 WO 2017054245A1
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Prior art keywords
chip
led lighting
lighting module
blocking structure
light
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PCT/CN2015/091414
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English (en)
French (fr)
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魏晓敏
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魏晓敏
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Priority to CN201590000169.5U priority Critical patent/CN206130550U/zh
Priority to PCT/CN2015/091414 priority patent/WO2017054245A1/zh
Publication of WO2017054245A1 publication Critical patent/WO2017054245A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

Definitions

  • the present application relates to the field of light emitting diodes, and in particular, to an LED lighting module and an LED lighting device.
  • a Light Emitting Diode is a semiconductor light emitting device fabricated using the principle of semiconductor P-N junction electroluminescence. LED has the advantages of environmental protection, high brightness, low power consumption, long life, low operating voltage, easy integration, etc. It is followed by incandescent lamps, fluorescent lamps and high-intensity discharge (HID) lamps (such as high-pressure sodium lamps and metal halide lamps). After the fourth generation of new light sources. In recent years, due to the breakthrough of materials and technology, the brightness of the light-emitting diode has been greatly improved, especially the appearance of white light-emitting diodes, which makes the light-emitting diodes gradually replace the current traditional lighting equipment.
  • the LED assembly can include a plurality of LED chips that are electrically connected by parallel, series, or any combination, and the LEDs can be a single primary color or a plurality of different colors.
  • Traditional LED light engines include red and blue LEDs. Because the red light and the blue chip are placed at the same level, the light engine has the following problems: the blue light is easily absorbed by the red light chip, resulting in low light output efficiency; the heat generated by the blue light directly affects the red light chip, because the red light chip is heated The effect is significant, so color temperature control is not easy.
  • the present application aims to solve at least one of the above technical problems to some extent.
  • the present application provides an LED lighting module, including: a substrate and an LED lighting unit disposed on one side of the substrate, the LED lighting unit comprising: a first chip having a first spectrum and having a second chip of the second spectrum on which a blocking structure for blocking illumination of the second chip light to the first chip while maintaining the light output of the first chip is grown.
  • the blocking structure is a spherical structure having a receiving cavity and a light exit of the first chip.
  • the blocking structure is a partition wall structure.
  • the blocking structure is a predetermined distance from the first chip.
  • the height of the blocking structure is equal to or slightly lower than the height of the light emitting surface of the first chip.
  • the first chip is a red chip
  • the second chip is a blue chip.
  • the first chip is a blue chip
  • the second chip is a red chip
  • the blocking structure is integrally formed with the substrate or formed separately.
  • the barrier structure is made of epoxy resin, ceramic or plastic material.
  • the present application provides an LED lighting device, including: an LED lighting module and a power supply for supplying power to the LED lighting module, the LED lighting module comprising: a substrate and being disposed in the An LED lighting unit on one side of the substrate, the LED lighting unit comprising: a first chip having a first spectrum and a second chip having a second spectrum, wherein the surface is grown for ensuring light emission of the first chip Blocking the second chip light from illuminating the blocking structure of the first chip.
  • the blocking structure is a spherical structure having a receiving cavity and a light exit of the first chip.
  • the blocking structure is a partition wall structure.
  • the blocking structure is a predetermined distance from the first chip.
  • the height of the blocking structure is equal to or slightly lower than the height of the light emitting surface of the first chip.
  • the first chip is a red chip
  • the second chip is a blue chip.
  • the first chip is a blue chip
  • the second chip is a red chip
  • the blocking structure is integrally formed with the substrate or formed separately.
  • the barrier structure is made of epoxy resin, ceramic or plastic material.
  • the LED lighting device is an LED lighting, an LED signal light or an LED display.
  • An LED lighting module includes: a substrate and an LED lighting unit disposed on one side of the substrate, the LED lighting unit comprising: a first chip having a first spectrum and a second chip having a second spectrum on which a barrier structure for blocking illumination of the second chip light to the first chip while maintaining light emission from the first chip is grown.
  • the blocking structure can block a part of the light of the second chip from being irradiated onto the first chip, thereby preventing the second chip light from being absorbed by the first chip, thereby improving the light extraction efficiency; and the heat generated by the second chip is blocked by the blocking structure. Does not directly affect the first chip, improving the color temperature controllability.
  • FIG. 1 is a schematic structural diagram of an LED lighting module according to Embodiment 1 of the present application.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” and “second” may include one or more of the features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • installation shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the specific meanings of the above terms in the present application can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature “above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.
  • the first embodiment provides an LED lighting device, which mainly provides functions such as LED illumination, signal indication or display. Accordingly, the LED lighting device can be an LED lighting, an LED signal light or an LED display. .
  • the LED lighting device mainly comprises: an LED lighting module and a power supply for supplying power to the LED lighting module.
  • the LED lighting device may further comprise components such as a casing.
  • the LED lighting module of the embodiment mainly includes a substrate 1 and an LED lighting unit 2 disposed on one side of the substrate 1 .
  • the LED lighting unit 2 specifically includes: a first chip 21 having a first spectrum and a second chip 22 having a second spectrum, wherein the surface is grown to block the light irradiation of the second chip 22 while ensuring the light output of the first chip 21 To the blocking structure 11 of the first chip 21.
  • the blocking structure 11 is a spherical structure having the accommodating cavity 111 and the light exiting opening 112 of the first chip 21 .
  • the blocking structure 11 is spaced apart from the first chip 21 by a predetermined distance to ensure that the light output angle of the first chip 21 can meet the predetermined requirement, thereby mixing the light with the second chip 22.
  • the height of the blocking structure 11 is equal to or slightly lower than that of the first chip 21. The height of the face, thereby ensuring that the light emitted by the first chip 21 is substantially unaffected by the barrier structure 11.
  • the light output of the second chip 22 can also form a reflection on the arc surface of the spherical structure, which increases the light exit angle and ensures the area of the mixed color area.
  • the above-described barrier structure 11 may also be a partition wall structure.
  • the first chip 21 is a red chip
  • the second chip 22 is a blue chip.
  • the first chip 21 is a blue chip
  • the second chip 22 is a red chip
  • a color spectrum chip of another spectrum is used.
  • the barrier structure may be formed integrally with the substrate or formed in combination with the substrate.
  • the barrier structure in the material matching, in order to adapt the substrate material, may be epoxy resin, ceramic or plastic material.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种LED发光模组及LED发光设备，LED发光模组包括：基板（1）以及布设于基板（1）一面的LED发光单元（2）。LED发光单元（2）包括：具有第一光谱的第一芯片（21）及具有第二光谱的第二芯片（22），所述基板（1）一面上生长出用于在保证第一芯片（21）出光的同时阻挡第二芯片（22）光照射到第一芯片（21）的阻挡结构（11）。这样，阻挡结构（11）可阻挡第二芯片（22）的一部分光照射到第一芯片（21）上，从而避免第二芯片（22）出光被第一芯片（21）吸收，提高了出光效率；第二芯片（22）所产生的热由于阻挡结构（11）的阻挡作用，不会直接影响到第一芯片（21），提高了色温可控度。

Description

LED发光模组及LED发光设备 技术领域
本申请涉及发光二极管领域，尤其涉及一种LED发光模组及LED发光设备。
背景技术
发光二极管(Light Emitting Diode，LED)是利用半导体的P-N结电致发光原理制成的一种半导体发光器件。LED具有环保、亮度高、功耗低、寿命长、工作电压低、易集成化等优点，是继白炽灯、荧光灯和高强度放电(英文缩写为HID)灯(如高压钠灯和金卤灯)之后的第四代新光源。近年来，由于材料及技术的突破，发光二极体的发光亮度已经有了非常多的提升，尤其是白光发光二极体的出现，更使得发光二极体渐渐的取代目前传统照明设备。
LED组件可以包括多个通过并联、串联或者任意组合地电连接的LED芯片，LED可以是单基色或者许多不同的颜色。传统的LED光引擎包括红光LED和蓝光LED。该光引擎由于红光与蓝光芯片放置于同一水平高度，存在以下问题：蓝光容易被红光芯片吸收,造成出光效率低下；蓝光所产生的热会直接影响到红光芯片，因红光芯片受热的影响显着，因此会造成色温控制不易。
发明内容
本申请旨在至少在一定程度上解决上述技术问题之一。
根据本申请的第一方面，本申请提供一种LED发光模组，包括：基板以及布设于所述基板一面的LED发光单元，所述LED发光单元包括：具有第一光谱的第一芯片及具有第二光谱的第二芯片，所述面上生长出用于在保证所述第一芯片出光的同时阻挡所述第二芯片光照射到所述第一芯片的阻挡结构。
进一步地，所述阻挡结构为具有所述第一芯片的容置腔及出光口的球体结构。
进一步地，所述阻挡结构为隔墙结构。
进一步地，所述阻挡结构离所述第一芯片预定距离。
进一步地，所述阻挡结构高度等于或略低于所述第一芯片出光面的高度。
进一步地，所述第一芯片为红光芯片，所述第二芯片为蓝光芯片。
进一步地，所述第一芯片为蓝光芯片，所述第二芯片为红光芯片。
进一步地，所述阻挡结构与所述基板一体成型或分体组合成型。
进一步地，所述阻挡结构采用环氧树脂、陶瓷或塑胶材料。
根据本申请的第二方面，本申请提供一种LED发光设备，包括：LED发光模组及为所述LED发光模组供电的供电电源，所述LED发光模组包括：基板以及布设于所述基板一面的LED发光单元，所述LED发光单元包括：具有第一光谱的第一芯片及具有第二光谱的第二芯片，所述面上生长出用于在保证所述第一芯片出光的同时阻挡所述第二芯片光照射到所述第一芯片的阻挡结构。
进一步地，所述阻挡结构为具有所述第一芯片的容置腔及出光口的球体结构。
进一步地，所述阻挡结构为隔墙结构。
进一步地，所述阻挡结构离所述第一芯片预定距离。
进一步地，所述阻挡结构高度等于或略低于所述第一芯片出光面的高度。
进一步地，所述第一芯片为红光芯片，所述第二芯片为蓝光芯片。
进一步地，所述第一芯片为蓝光芯片，所述第二芯片为红光芯片。
进一步地，所述阻挡结构与所述基板一体成型或分体组合成型。
进一步地，所述阻挡结构采用环氧树脂、陶瓷或塑胶材料。
进一步地，所述LED发光设备为LED照明灯、LED信号灯或LED显示屏。
本申请的有益效果是：
通过提供一种LED发光模组及LED发光设备，所述LED发光模组包括：基板以及布设于所述基板一面的LED发光单元，所述LED发光单元包括：具有第一光谱的第一芯片及具有第二光谱的第二芯片，所述面上生长出用于在保证所述第一芯片出光的同时阻挡所述第二芯片光照射到所述第一芯片的阻挡结构。这样，阻挡结构可阻挡第二芯片的一部分光照射到第一芯片上，从而避免第二芯片出光被第一芯片吸收，提高了出光效率；第二芯片所产生的热由于阻挡结构的阻挡作用，不会直接影响到第一芯片，提高了色温可控度。
附图说明
图1为本申请实施例一的LED发光模组的结构示意图。
具体实施方式
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本申请，而不能理解为对本申请的限制。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置 关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度小于第二特征。
下面通过具体实施方式结合附图对本申请作进一步详细说明。
请参考图1，本实施例一提供了一种LED发光设备，其主要可提供LED照明、信号指示或显示等功能，相应地，LED发光设备可为LED照明灯、LED信号灯或LED显示屏等。
上述LED发光设备主要包括：LED发光模组及为LED发光模组供电的供电电源，当然，为了实现固定以及支撑作用，LED发光设备还可以包括有外壳等组件。
而本实施例的LED发光模组主要包括：基板1以及布设于基板1一面的LED发光单元2。LED发光单元2具体包括：具有第一光谱的第一芯片21及具有第二光谱的第二芯片22，上述面上生长出用于在保证第一芯片21出光的同时阻挡第二芯片22光照射到第一芯片21的阻挡结构11。
具体地，在本实施例中，阻挡结构11为具有第一芯片21的容置腔111及出光口112的球体结构。阻挡结构11离第一芯片21预定距离，以保证第一芯片21出光角度能满足预定要求，从而与第二芯片22出光混色。而阻挡结构11高度等于或略低于第一芯片21出光 面的高度，从而保证第一芯片21出光基本不会受到阻挡结构11的过多影响。第二芯片22的出光还可以在球体结构的弧面上形成反射，增大了出光角度并保证了混色区域面积。
作为第二实施例，上述阻挡结构11还可以为隔墙结构。
在具体应用时，第一芯片21为红光芯片，第二芯片22为蓝光芯片。或者，第一芯片21为蓝光芯片，第二芯片22为红光芯片，或者分别采用其他光谱的色系芯片。
在成型上述阻挡结构时，阻挡结构可采用与基板一体成型的方式，或与基板分体组合成型的方式。在材料搭配上，为适配基板材料，阻挡结构可采用环氧树脂、陶瓷或塑胶材料等。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上内容是结合具体的实施方式对本申请所作的进一步详细说明，不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干简单推演或替换。

Claims (10)

  1. 一种LED发光模组，包括：基板以及布设于所述基板一面的LED发光单元，所述LED发光单元包括：具有第一光谱的第一芯片及具有第二光谱的第二芯片，其特征在于，所述面上生长出用于在保证所述第一芯片出光的同时阻挡所述第二芯片光照射到所述第一芯片的阻挡结构。
  2. 如权利要求1所述的LED发光模组，其特征在于，所述阻挡结构为具有所述第一芯片的容置腔及出光口的球体结构。
  3. 如权利要求1所述的LED发光模组，其特征在于，所述阻挡结构为隔墙结构。
  4. 如权利要求1所述的LED发光模组，其特征在于，所述阻挡结构离所述第一芯片预定距离。
  5. 如权利要求1所述的LED发光模组，其特征在于，所述阻挡结构高度等于或略低于所述第一芯片出光面的高度。
  6. 如权利要求1所述的LED发光模组，其特征在于，所述第一芯片为红光芯片，所述第二芯片为蓝光芯片。
  7. 如权利要求1所述的LED发光模组，其特征在于，所述第一芯片为蓝光芯片，所述第二芯片为红光芯片。
  8. 如权利要求1-7中任一项所述的LED发光模组，其特征在于，所述阻挡结构与所述基板一体成型或分体组合成型。
  9. 如权利要求1-7中任一项所述的LED发光模组，其特征在于，所述阻挡结构采用环氧树脂、陶瓷或塑胶材料。
  10. 一种LED发光设备，包括：LED发光模组及为所述LED发光模组供电的供电电源，所述LED发光模组包括：基板以及布设于所述基板一面的LED发光单元，所述LED发光单元包括：具有第一光谱的第一芯片及具有第二光谱的第二芯片，其特征在于，所述面上生长出用于在保证所述第一芯片出光的同时阻挡所述第二芯片光照射到所述第一芯片的阻挡结构。
PCT/CN2015/091414 2015-10-02 2015-10-02 Led发光模组及led发光设备 WO2017054245A1 (zh)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001134205A (ja) * 1999-11-04 2001-05-18 Casio Comput Co Ltd 光源装置及びそれを用いた表示装置
CN101126485A (zh) * 2006-08-18 2008-02-20 蒋承庭 具发光二极管的光源模块及其形成方法
CN201100902Y (zh) * 2008-03-24 2008-08-13 刘振亮 Led显示模组面罩及其显示模组
CN101562174A (zh) * 2008-04-16 2009-10-21 宏齐科技股份有限公司 用于背光模块的发光二极管芯片封装结构及其制作方法
CN101909865A (zh) * 2008-01-08 2010-12-08 Lg伊诺特有限公司 透镜单元、透镜组件、相机模块、相机模块和透镜组件的制造方法、光学部件的制造方法以及光学部件的制造设备
CN103175034A (zh) * 2013-03-26 2013-06-26 南京中电熊猫液晶显示科技有限公司 Led背光模组
CN204740813U (zh) * 2015-05-15 2015-11-04 弘凯光电(深圳)有限公司 模块化led显示板及led发光板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001134205A (ja) * 1999-11-04 2001-05-18 Casio Comput Co Ltd 光源装置及びそれを用いた表示装置
CN101126485A (zh) * 2006-08-18 2008-02-20 蒋承庭 具发光二极管的光源模块及其形成方法
CN101909865A (zh) * 2008-01-08 2010-12-08 Lg伊诺特有限公司 透镜单元、透镜组件、相机模块、相机模块和透镜组件的制造方法、光学部件的制造方法以及光学部件的制造设备
CN201100902Y (zh) * 2008-03-24 2008-08-13 刘振亮 Led显示模组面罩及其显示模组
CN101562174A (zh) * 2008-04-16 2009-10-21 宏齐科技股份有限公司 用于背光模块的发光二极管芯片封装结构及其制作方法
CN103175034A (zh) * 2013-03-26 2013-06-26 南京中电熊猫液晶显示科技有限公司 Led背光模组
CN204740813U (zh) * 2015-05-15 2015-11-04 弘凯光电(深圳)有限公司 模块化led显示板及led发光板

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