WO2017053714A1 - Dispositif électronique de sortie audio compact à dissipation de chaleur - Google Patents

Dispositif électronique de sortie audio compact à dissipation de chaleur Download PDF

Info

Publication number
WO2017053714A1
WO2017053714A1 PCT/US2016/053326 US2016053326W WO2017053714A1 WO 2017053714 A1 WO2017053714 A1 WO 2017053714A1 US 2016053326 W US2016053326 W US 2016053326W WO 2017053714 A1 WO2017053714 A1 WO 2017053714A1
Authority
WO
WIPO (PCT)
Prior art keywords
bent
enclosure
vent end
bass port
audio output
Prior art date
Application number
PCT/US2016/053326
Other languages
English (en)
Inventor
Wayne Foletta
Original Assignee
Polycom, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polycom, Inc. filed Critical Polycom, Inc.
Publication of WO2017053714A1 publication Critical patent/WO2017053714A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/022—Cooling arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2815—Enclosures comprising vibrating or resonating arrangements of the bass reflex type
    • H04R1/2823—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material
    • H04R1/2826—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
    • H04R2201/028—Structural combinations of loudspeakers with built-in power amplifiers, e.g. in the same acoustic enclosure

Definitions

  • the present invention relates to a compact audio output electronic device, such as a speakerphone, that effectively dissipates heat, without increasing the size or complexity of the audio device, or degrading the sound quality thereof.
  • a type of compact audio output electronic device may be a speaker, speakerphone, portable speakers with wireless links, any sealed enclosure with a speaker, or the like.
  • a conventional speakerphone typically includes several microphones, a loudspeaker and a control module coupled to the loudspeaker and microphones.
  • the control module may also have a keyboard and a display screen.
  • a cable can be coupled to a network interface of the speakerphone to provide power and network connections.
  • Some conventional audio devices may also include a straight tube member for improving the bass frequency of the sound of the audio device that is located far away from the electronics of the device.
  • Such audio devices are increasing in complexity and power consumption while decreasing in size. As a result, more heat is being produced by the audio device that requires dissipation.
  • Conventional solutions to heat dissipation such as heat sinks and fans which exchange the heat with the ambient environment, are either not effective or not practical.
  • Fans, for example, cannot be used with a speakerphone because the noise from the fans would be picked up by the microphones and would degrade the acoustic echo canceller performance of the speakerphone.
  • heat sinks would not fit a compact design and may be uncomfortable to touch if too hot.
  • the present invention may provide a compact audio output electronic device that includes a compact enclosure that has a cover and a base and supports a speaker. At least one heat emitting device is located within the enclosure.
  • a bent bass port is located within the enclosure for enhancing bass frequency.
  • the bent bass port has an external vent end and an opposite internal vent end, and a curved body therebetween. The external vent end is located at the cover and the internal vent end is positioned proximate the heat emitting device.
  • a bidirectional air flow path is defined through the bent bass port such that heat from the heat emitting device exits at the external vent end of the bent bass port, and air flows from the internal vent end of the bent bass port toward the heat emitting device, thereby providing cooling to the at least one heat emitting device.
  • the compact audio output electronic device is a speakerphone.
  • the present invention may further provide a speakerphone that includes an enclosure that has a cover and a base and supports a speaker. At least one heat emitting device is located within the enclosure. The at least one heat emitting device is preferably a high power dissipation device.
  • a bent bass port is coupled to the cover for enhancing bass frequency.
  • the bent bass port has an external vent end and an opposite internal vent end, and a curved body therebetween. The external vent end aligns with an opening in the cover and the internal vent end is positioned proximate the at least one heat emitting device.
  • a bidirectional air flow path is defined through the bent bass port such that heat from the at least one heat emitting device exits at the external vent end of the bent bass port, and air flows from the internal vent end of the bent bass port toward the at least one heat emitting device, thereby providing cooling to the at least one heat emitting device.
  • the present invention may also provide a speakerphone that includes an enclosure that has a cover and a base and supports a speaker. At least one high power dissipation device is located within the enclosure.
  • the speakerphone includes means for heat dissipation that dissipates heat emitting from the at least one high power dissipation device and cools the at least one high power dissipation device by creating a bidirectional air flow path such that heat from the high power dissipation device exits the enclosure and air flows toward the high power dissipation device to provide said cooling.
  • FIG. 1 is a top perspective view of a compact audio output electronic device according to an exemplary embodiment of the present invention, showing the device with its top grill removed;
  • FIG. 2 is a bottom perspective view of the compact audio output electronic device illustrated in FIG. 1, showing the device with its base removed;
  • FIG. 3 is an enlarged partial perspective view of the compact audio output electronic device illustrated in FIG. 2;
  • FIG. 4 is a cross-sectional view of the compact audio output electronic device according to an exemplary embodiment of the present invention.
  • FIG. 5 is another cross-sectional view of the compact audio output electronic device according to an exemplary embodiment of the present invention. Detailed Description of the Exemplary Embodiments
  • the present invention relates to an audio device 100, particularly to a compact audio output electronic device, such as a speakerphone, that has improved heat dissipation and cooling without negatively impacting sound quality while also maintaining a compact design.
  • An audio device may be considered compact when the physical volume of the electronic components thereof is a significant part of the available volume defined by the industrial design.
  • the audio device 100 of the present invention preferably includes a bass port 110 that both enhances the bass frequency of the sound of the device and provides heat dissipation and cooling without degrading sound quality or increasing the size of the device.
  • the high flow velocity created by the speaker bass port 110 of the present invention directs air exchange cooling towards critical sources of heat in the compact audio device 100.
  • the audio device or speakerphone 100 generally includes an enclosure 102, a control module 104, at least one speaker 106, and one or more microphones 108.
  • the bass port 110 resides within the enclosure 102, preferably adjacent to the speaker 106, as best seen in Figs. 2 and 3.
  • the enclosure 102 may include a cover 112 and a base 114 that are coupled at a perimeter thereof in a conventional manner to form the enclosure 102.
  • the enclosure 102, including the cover 112 and the base 114 may have a generally Y-shape, as seen in Figs. 1 and 2.
  • the enclosure 112 may have any desired shape that fits a compact design, such as square, rectangular, or circular.
  • the cover 112 of the enclosure 102 includes opposite inner and outer surfaces 118 and 120 and the base 114 likewise includes inner and outer surfaces 122 and 124, as best seen in Figs. 4 and 5.
  • the inner surfaces 118 and 122 define an inner space 116 of the enclosure 102 that holds the electronics of the audio device 100.
  • An ornamental grill 126 may be optionally provided over the cover 112 such that the grill 126 is spaced from the outer surface 120 of the cover 112.
  • the cover's outer surface 120 may support a display panel 128 (FIG. 1) of the control module 104.
  • the inner surface 118 of the cover 112 supports one or more print circuit boards 130 of the control module 104, as seen in Fig. 2.
  • the printed circuit boards 130 and their associated circuitry and components provide audio processing for the device 100, as is known in the art.
  • the electronic components supported by the printed circuit boards 130 may include, for example, a power supply 132 and power amplifier 134, which are high power dissipation devices.
  • High power dissipation devices are those that dissipate more than about one watt in volume of about one cubic centimeter or less.
  • the power supply 132 and/or power amplifier 134 are the highest power dissipation devices and therefore emit the most heat and require the most cooling.
  • Other high power dissipation devices may include a DC/DC converter, display backlights, WiFi or other radio transmitters, and the like.
  • the speaker 106 is coupled to the cover 112 and is preferably centrally located within the enclosure 102.
  • the bass port 110 is also coupled to the cover 112 and is preferably located proximate the heat emitting devices of the enclosure 102, particularly near the highest power dissipation devices, such as the power supply 132 or the power amplifier 134, as best seen in Figs. 2 and 3.
  • the bass port 110 is bent such that it has a curved body 140 between an external vent end 142 and an internal vent end 144.
  • the curved body 140 preferably has a substantially tubular structure with a curved side portion 146 and an opposite bend portion 148. As seen in Fig. 5, the bass port 110 is bent such that the bend portion 148 preferably forms around a 90 degree bend.
  • Such curvature allows the internal vent end 144 of the bass port 110 to be directed towards the heat emitting devices in the enclosure 102, particularly the highest power dissipation devices, like the power supply 132 and power amplifier 134.
  • the bend portion 148 may be more or less than 90 degrees as long as the internal vent end 144 points toward the highest power dissipation devices of the enclosure.
  • the internal vent end 144 of the bass port 110 may include a flared lip 150 at its end, as seen in Fig. 5.
  • the external vent end 142 corresponds and aligns with a vent opening 152 in the cover 112.
  • the external vent end 142 and the vent opening 152 are spaced from the grill 126, thereby allowing air to escape the enclosure 102.
  • the bass port 110 is oriented such that the external vent end 142 is elevated with respect to the internal vent end 144 to create convection air flow through the port 110.
  • the external vent end 142 is located at the highest point of the enclosure 102.
  • the bent bass port 110 is designed and positioned to create a thermal venting bidirectional air flow path, as illustrated by the arrows in Figs. 4 and 5, through the curved body 140 thereof such that heat from the heat emitting devices, particularly the highest heat emitting devices, like the power supply 132 or amplifier 134, exits at the external vent end 142 of the bass port 110, and air flows from the internal vent end 144 towards the power supply 132 or amplifier 134.
  • the inner surface 154 of the curved body 140 is preferably smooth to prevent premature air turbulence in the air flow through the port 110.
  • the bent shape and the location of the base port 110 proximate the high power dissipation devices in the enclosure 102 creates this bidirectional air flow, as described above, at little or no bass port audio output, which is the audio signal frequency content centered around the resonant frequency of the bass port 110.
  • the high air flow velocity of the bass port 110 provides air exchange cooling towards the highest sources of heat in the compact enclosure 102, thereby cooling the audio device 100. This lowers the electronic system operating temperatures of the device 100, thereby extending the lifetime of the audio device and it components for a more long-term reliable audio device.
  • the length and inner diameter of the body 140 of the bass port 110 are preferably defined by Helmholtz's equation for a resonator as determined by the enclosure's 102 air volume.
  • An enclosure having both volume and one or more openings will have a point of resonance described by the Helmholtz resonator effects.
  • the opening In bass-reflex speaker systems, at and near resonance, the opening generates sound radiation which is approximately in-phase with the front radiation, and hence, adds to the total bass output. Whereas above resonance, the speaker system behaves as a sealed enclosure with little or no output from the ports.
  • the resonance of enclosure 102 which is open to the atmosphere through vent opening 152, and which includes the bass port 110 of selected length and inner diameter define a Helmholtz resonator, and will resonate acoustically at a selected frequency which is a function, among other factors, of the volume of the enclosure, the mass of the air in the enclosure, and the dimensions of the opening 152.
  • the sound radiates to the outside of the enclosure 102 to a resonance frequency of the port 110 according to the Helmholtz resonance effect.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif électronique de sortie audio compact, qui comprend une enceinte compacte qui a un couvercle et une base et supporte un haut-parleur. Au moins un dispositif d'émission de chaleur est situé à l'intérieur de l'enceinte. Un port de graves courbé est situé à l'intérieur de l'enceinte pour améliorer la fréquence des graves. Le port de graves courbé comporte une extrémité d'évent externe et une extrémité d'évent interne opposée, et un corps incurvé entre elles. L'extrémité d'évent externe est située au niveau du couvercle et l'extrémité d'évent interne est positionnée près du dispositif d'émission de chaleur. Un trajet de flux d'air bidirectionnel est défini à travers le port de graves courbé de telle sorte que la chaleur provenant du dispositif d'émission de chaleur sort au niveau de l'extrémité d'évent externe du port de graves courbé, et l'air s'écoule depuis l'extrémité d'évent interne du port de graves courbé vers le dispositif d'émission de chaleur, en assurant ainsi le refroidissement dudit dispositif d'émission de chaleur.
PCT/US2016/053326 2015-09-25 2016-09-23 Dispositif électronique de sortie audio compact à dissipation de chaleur WO2017053714A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201514866261A 2015-09-25 2015-09-25
US14/866,261 2015-09-25

Publications (1)

Publication Number Publication Date
WO2017053714A1 true WO2017053714A1 (fr) 2017-03-30

Family

ID=58387380

Family Applications (1)

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PCT/US2016/053326 WO2017053714A1 (fr) 2015-09-25 2016-09-23 Dispositif électronique de sortie audio compact à dissipation de chaleur

Country Status (1)

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WO (1) WO2017053714A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10951748B2 (en) * 2019-04-18 2021-03-16 Lenovo (Singapore) Pte. Ltd. Electronic device for use in a teleconference

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060039571A1 (en) * 2005-09-08 2006-02-23 Brookstone Purchasing, Inc. Heat dissipating audio systems and methods thereof
US20080268793A1 (en) * 2007-04-26 2008-10-30 Motorola, Inc. Arrangement for variable bass reflex cavities
US20100027828A1 (en) * 2008-07-22 2010-02-04 Rode Microphones Llc Loudspeaker slotted duct port
US20120019223A1 (en) * 2007-06-05 2012-01-26 Sri International Miniature high-voltage power supplies
US20140226845A1 (en) * 2013-02-13 2014-08-14 Pellisari, LLC Ported Speaker and Circuit Board
JP2015019245A (ja) * 2013-07-11 2015-01-29 ヤマハ株式会社 バスレフポート

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060039571A1 (en) * 2005-09-08 2006-02-23 Brookstone Purchasing, Inc. Heat dissipating audio systems and methods thereof
US20080268793A1 (en) * 2007-04-26 2008-10-30 Motorola, Inc. Arrangement for variable bass reflex cavities
US20120019223A1 (en) * 2007-06-05 2012-01-26 Sri International Miniature high-voltage power supplies
US20100027828A1 (en) * 2008-07-22 2010-02-04 Rode Microphones Llc Loudspeaker slotted duct port
US20140226845A1 (en) * 2013-02-13 2014-08-14 Pellisari, LLC Ported Speaker and Circuit Board
JP2015019245A (ja) * 2013-07-11 2015-01-29 ヤマハ株式会社 バスレフポート

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10951748B2 (en) * 2019-04-18 2021-03-16 Lenovo (Singapore) Pte. Ltd. Electronic device for use in a teleconference

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