WO2017051951A1

WO2017051951A1 - Embedded substrate having heat sink for heat dissipation and method for producing same

Info

Publication number: WO2017051951A1
Application number: PCT/KR2015/010156
Authority: WO
Inventors: 김현호; 차상석; 이종태
Original assignee: 재단법인 다차원 스마트 아이티 융합시스템 연구단; 주식회사 심텍
Priority date: 2015-09-25
Filing date: 2015-09-25
Publication date: 2017-03-30

Abstract

An embedded substrate for heat dissipation according to one embodiment of the present invention comprises: a metal core; a plurality of protruding columns forming, on the upper surface of the metal core, a concave-and-convex structure; and at least one heating element arranged on the upper surface of the metal core.

Description

Embedded substrate with heat sink for heat dissipation and its manufacturing method

The following embodiments relate to an embedded substrate using a heat sink for heat dissipation and a method of manufacturing the same. More specifically, the present invention relates to a technique for improving heat dissipation by embedding uneven pillars forming a heat sink together with a heating element. will be.

With the development of industry and the development of electronic technology, all electronic devices are aiming for thinning, miniaturization and multifunctionality. Due to such thinning, miniaturization, and multifunctionalization, many passive elements, active elements, integrated circuits, and the like are mounted on a semiconductor substrate, which generates a lot of heat in the semiconductor substrate. Therefore, recent semiconductor substrates require good heat dissipation characteristics.

In recent years, in order to improve the heat radiation characteristic of a semiconductor substrate, it is proposed to use a heat radiation material. In particular, copper, aluminum, and the like, which are inexpensive and have good heat dissipation, are used for the semiconductor substrate. However, the existing technologies are a method of inserting a heat-dissipating metal such as copper, aluminum, etc., a method of attaching a heat sink to the inside of the semiconductor substrate to improve heat dissipation characteristics.

In particular, the method of attaching the heat sink attaches a previously prepared heat sink to the metal core bottom surface of the metal printed circuit board, which may not be suitable for miniaturization of the semiconductor substrate.

Embodiments of the present invention provide a technology that can contribute to the miniaturization and thinning of a semiconductor substrate while improving heat dissipation characteristics.

Embodiments of the present invention can improve heat dissipation characteristics while miniaturizing an embedded substrate by embedding the heating element and the request pillars together with a metal core.

Embedded substrate for heat dissipation according to an embodiment of the present invention is a heating element; A metal core embedding the heating element; And a plurality of uneven pillars embedded with the heat generating element by the metal core.

The plurality of uneven pillars are formed of copper or aluminum.

The plurality of uneven pillars are formed by bonding to the metal core or by cutting the metal core.

The at least one heating element includes at least one of an active element, a passive element, and an integrated circuit.

An insulating material is filled between the uneven pillars.

The heat generating element and the plurality of uneven pillars are formed in the same layer.

Embedded substrate for heat dissipation according to an embodiment of the present invention is a metal core; A heating element embedded by the metal core; And a plurality of uneven pillars forming an uneven structure on the lower surface of the metal core.

The heating element and the plurality of uneven pillars are formed in different layers.

Embedded substrate for heat dissipation according to an embodiment of the present invention comprises a first heating element; A first insulating layer embedding the first heat generating element; A plurality of first uneven pillars embedded with the first heating element by the first insulating layer; A second heating element; A second insulating layer embedding the second heating element; And a plurality of second uneven pillars embedded with the second heating element by the first insulating layer. And a common metal core for the first heating element and the second heating element.

Embedded substrate manufacturing method for heat dissipation according to an embodiment of the present invention comprises the steps of preparing a metal core; Disposing a heating element and a plurality of uneven pillars on an upper surface of the metal core; Embedding the heating element and the plurality of uneven pillars; It includes.

The method further includes forming the plurality of uneven pillars by bonding metal pillars to the metal core or by shaving the metal core.

An embedded substrate for heat dissipation according to an embodiment of the present invention comprises the steps of preparing a metal core; Embedding a heating element using the metal core; And forming a plurality of uneven pillars on the lower surface of the metal core.

1 is a view showing an embedded substrate for heat dissipation according to an embodiment of the present invention.

2 and 3 illustrate an example of a manufacturing process of the embedded substrate illustrated in FIG. 1.

4 is a view showing that the heating element and the uneven pillars are embedded in different layers according to another embodiment of the present invention.

5 and 6 illustrate an example of a manufacturing process of the embedded substrate illustrated in FIG. 4.

7 is a view showing that the heating element and the uneven pillars are embedded in different layers according to another embodiment of the present invention.

8 is an operation flowchart illustrating a method of manufacturing an embedded substrate according to an exemplary embodiment of the present disclosure.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited or limited by the embodiments. Also, like reference numerals in the drawings denote like elements.

Referring to FIG. 1, the embedded substrate includes a metal core 110, an adhesive layer 120, an insulating layer 130, a heat generating element 140, and a plurality of uneven pillars 150. Here, the insulating layer 130 may be formed of a dielectric material or air. In particular, between the uneven pillars 150 may be filled with a dielectric material, or may be filled with air.

The metal core 110 may be formed of a metal having high thermal conductivity such as copper or aluminum. An adhesive layer 120 is formed on a top surface of the metal core 110 using a material such as a fixed adhesive, and a heat generating element 140 is disposed on the adhesive layer 120.

The heating element 140 may include at least one of an active element, a passive element, or an integrated circuit, an LED chip, and a camera chip. The heat generating element 140 may be embedded by the metal core 110 and the insulating layer 130.

As will be described in detail below, the uneven pillars 150 may be disposed on an upper surface or a lower surface of the metal core 110 to form a heat sink to dissipate heat generated by the heating element 140.

Referring to FIG. 2, the present invention prepares a metal core 110 to manufacture an embedded substrate. An adhesive layer 120 may be formed on an upper surface of the metal core 110, and the adhesive layer 120 may be formed through an adhesive, a tape, a solder paste, or the like. In addition, the adhesive layer 120 may be bonded through carbon nanotubes (CNT) material. Through this, the thermal conductivity is improved, and transparency, high strength, flame retardancy, glossiness, chemical resistance characteristics, and the like can be complexly implemented.

The heating element 140 is disposed on the adhesive layer 120, and the metal slug 141 is formed at an appropriate position of the heating element 140. In addition, uneven pillars 150 are formed on the same layer as the heat generating element 140.

The uneven pillars 150 form an uneven structure on the upper surface of the metal core 110. In this case, the uneven pillars 150 formed on the upper surface of the metal core 110 are formed on the same layer as the heating element 140 and embedded like the heating element 140. Accordingly, not only the heat dissipation characteristics can be improved, but also the miniaturization of the embedded substrate can be achieved.

In this case, the uneven pillars 150 may be formed of copper or aluminum, and may be formed by bonding to the metal core or by cutting the metal core. That is, the uneven pillars 150 may be individually bonded to the adhesive layer 120, and the uneven pillars 150 and the metal core 110 may be manufactured together as one frame. In particular, the uneven pillars 150 may be bonded through adhesive, tape, solder paste, and the like, and the uneven pillars 150 and the metal core 110 are formed in one frame through various processes such as drilling, etching, and punching. It can be produced together as.

In addition, after the uneven pillars 150 are formed on the metal core 110, the uneven pillars 150 and the heating element 140 are embedded together by an insulating layer 130 made of air or a dielectric material.

Referring to FIG. 3, after the insulating layer 130 is formed, vias are formed to electrically connect the heating elements 140, and the vias are plated with a conductive material (161). In addition, a pattern 162 having a predetermined shape is formed on the surface of the insulating layer 130 by a conductive material.

The formed pattern 163 is covered with the insulating layer 162, and another via 164 is formed on the insulating layer 163.

Through the process described above, an embedded substrate for embedding the uneven pillars 150 and the heating element 140 together is manufactured.

4 is a view illustrating that the heating element and the uneven pillars are embedded in different layers.

Referring to FIG. 4, the embedded substrate includes a metal core 310, an adhesive layer 320, an insulating layer 330, a heating element 340, and an uneven pillar 350.

The uneven pillar 350 forms an uneven structure on the lower surface of the metal core 310. At this time, the heating element 340 is disposed on the upper surface of the metal core 310, the heat generated by the embedded heating element 340 is radiated through the uneven pillar 350 bonded to the metal core 310 do. In addition, the uneven pillars 350 are filled with an insulating layer 331 including air or a dielectric material.

Referring to FIG. 5, the present invention prepares a metal core 310 to manufacture an embedded substrate. An adhesive layer 320 may be formed on the bottom surface of the metal core 310, and the adhesive layer 320 may be formed through an adhesive, a tape, a solder paste, or the like.

Uneven pillars 350 are formed under the adhesive layer 320. That is, the uneven pillars 350 form an uneven structure on the lower surface of the metal core 310, and the uneven pillars 350 formed on the lower surface of the metal core 310 have different layers from the heating element 340. Is formed. Accordingly, not only the heat dissipation characteristics can be improved, but also the miniaturization of the embedded substrate can be achieved.

In this case, the uneven pillars 350 may be formed of copper or aluminum, and may be formed by bonding to the metal core or by cutting the metal core. That is, the uneven pillars 350 may be individually bonded to the adhesive layer 320, and the uneven pillars 350 and the metal core 310 may be manufactured together as one frame. In particular, the uneven pillars 350 may be bonded through adhesive, tape, solder paste, and the like, and the uneven pillars 350 and the metal core 310 are formed in one frame through various processes such as drilling, etching, and punching. It can be produced together as.

In addition, after the uneven pillars 350 are formed on the bottom surface of the metal core 310, the uneven pillars 350 are covered by an insulating layer 331 made of air or a dielectric material.

In addition, independently of the uneven pillars 350 formed on the lower surface of the metal core 310, the heating element 340 is disposed on the upper surface of the metal core 310 through the adhesive layer 321. A metal slug 341 is formed at 340. The heat generating element 340 is covered by the insulating layer 330 made of air or a dielectric material.

Vias are formed for electrical connection of the heating element 340, and the vias are plated with a conductive material (361). In addition, a pattern 362 having a predetermined shape is formed on the surface of the insulating layer 330 by a conductive material. The formed pattern 362 is covered with an insulating layer 363, and another via 364 is formed on the insulating layer 363.

Referring to FIG. 7, one embedded substrate may embed two or more heating elements in different layers. That is, the first heating element 741 is disposed on the lower surface of the metal core 710 through the adhesive layer 721, while the second heating element 742 is disposed on the common metal core 710 through the adhesive layer 722. It is disposed on the upper surface of the). The first uneven pillars 751 are disposed on the same layer as the first heat generating element 741 and embedded together with the heat generating element 741, while the second uneven pillars 752 are formed of the second heat generating element ( It is disposed on the same layer as 742 and embedded with the heating element 742. The first uneven pillars 751 and the first heating element 741 are covered with the insulating layer 731, and the second uneven pillars 752 and the second heating element 742 are covered with the insulating layer 732. Lose.

Referring to FIG. 8, in the method of manufacturing an embedded substrate according to an embodiment of the present invention, a metal core is prepared (810). As mentioned above, the metal core may be formed of a metal having high thermal conductivity such as copper, aluminum, or the like.

In addition, in the present invention, in order to embed the heating element, the heating element is disposed on any one of the upper and lower surfaces of the metal core (820). In this case, an adhesive layer may be used to arrange the heating element.

In addition, the present invention forms the uneven pillars on the upper or lower surface of the metal core (830). That is, the uneven pillars may be formed on the same layer as the heating element, or may be formed on another layer.

In addition, the present invention embeds the heating element and the uneven pillar together (840). Of course, as shown in Figure 4, the heating element is located on the upper surface of the metal core, while the uneven pillar may be located on the lower surface of the metal core.

Since the contents described with reference to FIGS. 1 through 7 may be applied to the manufacturing method illustrated in FIG. 8, a detailed description thereof will be omitted.

Although the embodiments have been described by the limited embodiments and the drawings as described above, various modifications and variations are possible to those skilled in the art from the above description. For example, the described techniques may be performed in a different order than the described method, and / or components of the described systems, structures, devices, circuits, etc. may be combined or combined in a different form than the described method, or other components. Or even if replaced or substituted by equivalents, an appropriate result can be achieved.

Therefore, other implementations, other embodiments, and equivalents to the claims are within the scope of the claims that follow.

Claims

Heating element;

A metal core and an insulating layer embedding the heating element; And

A plurality of uneven pillars embedded with the heat generating element by the metal core and the insulating layer.

Embedded substrate for heat dissipation comprising a.
The method of claim 1,

The plurality of uneven pillars

Embedded substrate for heat dissipation, characterized in that formed of copper or aluminum.
The method of claim 1,

The plurality of uneven pillars

Bonded to the metal core, or formed by cutting the metal core embedded substrate for heat dissipation.
The method of claim 1,

The at least one heating element

Embedded substrate for heat dissipation comprising at least one of an active device, a passive device or an integrated circuit.
The method of claim 1,

Embedded substrate for heat dissipation, characterized in that the insulating material is filled between the uneven pillars.
The method of claim 1,

Embedded substrate for heat dissipation, characterized in that the heating element and the plurality of uneven pillars are formed in the same layer.
A first heating element;

A first insulating layer embedding the first heat generating element;

A plurality of first uneven pillars embedded with the first heating element by the first insulating layer;

A second heating element;

A second insulating layer embedding the second heating element; And

A plurality of second uneven pillars embedded with the second heating element by the first insulating layer; And

Common metal core for the first heating element and the second heating element

Embedded board for heat dissipation including
Metal cores;

A heating element embedded by the metal core and the insulating layer; And

A plurality of uneven pillars forming an uneven structure on the lower surface of the metal core

Embedded substrate for heat dissipation comprising a.
The method of claim 8,

The plurality of uneven pillars

Bonded to the metal core, or formed by cutting the metal core embedded substrate for heat dissipation.
The method of claim 8,

Embedded substrate for heat dissipation, characterized in that the heating element and the plurality of uneven pillars are formed in different layers.
Preparing a metal core;

Disposing a heating element and a plurality of uneven pillars on an upper surface of the metal core; And

Embedding the heating element and the plurality of uneven pillars;

Embedded substrate manufacturing method for heat dissipation comprising a.
The method of claim 11,

Bonding the metal pillars to the metal core or shaping the metal core to form the plurality of uneven pillars

Embedded substrate manufacturing method for heat dissipation, characterized in that it further comprises.
Preparing a metal core;

Embedding a heating element using the metal core; And

Forming a plurality of uneven pillars on the lower surface of the metal core

Embedded substrate manufacturing method for heat dissipation comprising a.