JPH09321186A - Method for manufacturing heat sink - Google Patents
Method for manufacturing heat sinkInfo
- Publication number
- JPH09321186A JPH09321186A JP15186196A JP15186196A JPH09321186A JP H09321186 A JPH09321186 A JP H09321186A JP 15186196 A JP15186196 A JP 15186196A JP 15186196 A JP15186196 A JP 15186196A JP H09321186 A JPH09321186 A JP H09321186A
- Authority
- JP
- Japan
- Prior art keywords
- plate fin
- fin member
- plate
- base member
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 238000003825 pressing Methods 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【０００１】[0001]
【発明が属する技術分野】本発明は、取付けベースとプ
レートフィンとの材質が同一または異質で、特にプレー
トフィンが薄く、放熱性の優れたヒートシンクの製造方
法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a heat sink having the same or different materials for the mounting base and the plate fins, particularly the thin plate fins and excellent heat dissipation.
【０００２】[0002]
【従来の技術】従来、高密度集積回路（ＬＳＩ等）にお
いては、特に熱的性能が部品の信頼性および寿命に影響
される。そのＬＳＩが高密度の集積化や高速化されるこ
とに伴い、それから発生する熱の増大により従来のヒー
トシンクでは表面積が小さく、放熱性に限界があり、対
応できなかった。また、ヒートシンクに小型のファンを
組み込み強制的に冷却をするものもあるが、ファンの振
動によるＬＳＩへの影響や故障等により冷却ができなく
なるという弊害があった。2. Description of the Related Art Conventionally, in a high-density integrated circuit (LSI or the like), especially thermal performance is affected by reliability and life of parts. As the LSI is highly integrated and the speed is increased, the heat generated from the LSI has a small surface area due to the increase in heat, and there is a limit in heat dissipation, which cannot be dealt with. Some heat sinks incorporate a small fan to forcibly cool the heat sink, but there is an adverse effect that the cooling cannot be performed due to influence of vibration of the fan on the LSI, failure, or the like.
【０００３】[0003]
【発明が解決しようとする課題】以上のように現在の技
術では、１ｍｍ程度の肉厚のプレートフィンを高密度で
ベース部材に移植することは困難とされている。また、
ダイキャスト等による成型では、プレートフィンの肉厚
が薄くなると、型に設けたスリット状の穴内にアルミニ
ウム等の溶湯が充分に回らず、整然としたプレートフィ
ンの形成ができない等の欠点があった。As described above, according to the current technology, it is difficult to implant a plate fin having a wall thickness of about 1 mm into the base member at a high density. Also,
In the molding by die casting or the like, when the thickness of the plate fin becomes thin, there is a drawback that the molten metal such as aluminum does not sufficiently flow into the slit-shaped hole provided in the mold, so that an orderly plate fin cannot be formed.
【０００４】そこで、発明者は、前記課題を解決するた
めに鋭意、研究を重ねた結果、本発明を、ヒートシンク
において、放熱部であるプレートフィン部材を取付ける
ためのプレートフィン部材の板厚より若干広い幅であっ
て、プレートフィン部材を植設するための充分な深さを
有する溝加工したベース部材にプレートフィン部材を植
設し、プレートフィン部材の板厚方向からベース部材に
対して圧力を加え、プレートフィン部材とベース部材と
を物理的に固定することにより前記課題を解決したもの
である。Therefore, as a result of earnest studies to solve the above-mentioned problems, the inventor has found that the present invention is a little more than the plate thickness of the plate fin member for attaching the plate fin member which is the heat radiating portion in the heat sink. The plate fin member is implanted in a grooved base member having a wide width and sufficient depth for implanting the plate fin member, and pressure is applied to the base member from the plate thickness direction of the plate fin member. In addition, the above-mentioned problem is solved by physically fixing the plate fin member and the base member.
【０００５】また、放熱部であるプレートフィン部材を
取付けるためのプレートフィン部材の板厚より若干広い
幅であって、プレートフィン部材を植設するための充分
な深さを有する溝加工した円弧状のベース部材に、プレ
ートフィン部材を植設し、プレートフィン部材の高さ方
向からベース部材に対して圧力を加え、プレートフィン
部材とベース部材とを物理的に固定することとすること
により、前記課題を解決した。Further, a grooved arc shape having a width slightly wider than the plate thickness of the plate fin member for mounting the plate fin member which is a heat radiating portion and having a sufficient depth for implanting the plate fin member. By implanting the plate fin member in the base member, applying pressure to the base member from the height direction of the plate fin member, and physically fixing the plate fin member and the base member, Solved the problem.
【０００６】また、放熱部であるプレートフィン部材を
Ｕ字状に折曲げ、取付けるための幅とフィン部材を植設
するための充分な深さを有する溝加工したベース部材
と、プレートフィン部材を植設固定するための固定部材
をプレートフィン部材の中間に挿入し、プレートフィン
部材の高さ方向から固定部材をベース部材に対して圧力
を加え、プレートフィン部材とベース部材とを物理的に
固定することにより前記課題を解決した。Further, the plate fin member, which is a heat dissipating portion, is bent into a U-shape, and has a grooved base member having a width for mounting and a sufficient depth for implanting the fin member, and the plate fin member. A fixing member for fixing by implantation is inserted in the middle of the plate fin member, and pressure is applied to the base member from the height direction of the plate fin member to physically fix the plate fin member and the base member. By doing so, the above problem was solved.
【０００７】[0007]
【実施例の形態】以下、本発明の第１の製造方法の実施
の形態について図１から図１１に基づいて説明する。ま
ず、その製造方法にかかる構成部品およびその製造方法
による製品について説明する。BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a first manufacturing method of the present invention will be described below with reference to FIGS. First, a component according to the manufacturing method and a product manufactured by the manufacturing method will be described.
【０００８】図１および図２に示すように、本発明のＬ
ＳＩ用ヒートシンクＡは、アルミニウムまたは銅等の熱
伝導性の優れた非鉄金属による板状のベース部材１と、
この上面にベース部材と同一または異質の非鉄金属によ
るプレートフィン部材２が多数植設されたものとから構
成されている。そのヒートシンクＡは、方形状の板片と
してのベース部材１に対して、薄肉の板厚で、所定の板
長さ、所定の板高さのプレートフィン部材２が所定間隔
Ｐをおいて並列状に多数植設されている。As shown in FIG. 1 and FIG.
The SI heat sink A is a plate-shaped base member 1 made of a non-ferrous metal having excellent thermal conductivity such as aluminum or copper,
A large number of plate fin members 2 made of the same or different non-ferrous metal as the base member are implanted on this upper surface. The heat sink A has a thin plate thickness, a predetermined plate length, and a predetermined plate height with respect to the base member 1 as a rectangular plate piece, and the plate fin members 2 are arranged in parallel at predetermined intervals P. Many have been planted.
【０００９】プレートフィン部材２は、薄ければベース
部材１に植設できる枚数が多くなり、その放熱面積は増
大する。そのため、薄い程よく、しかも多ければ多い程
よくなる。しかしながら、そのプレートフィン部材２を
薄くし過ぎると、植設した場合に倒れてしまい、プレー
トフィン同志が接触してしまうため、充分な放熱性が得
られなくなる。If the plate fin member 2 is thin, the number of the plate fin member 2 that can be planted in the base member 1 increases, and the heat radiation area increases. Therefore, the thinner the better, the more the better. However, if the plate fin member 2 is made too thin, it will fall down when it is planted, and the plate fins come into contact with each other, so that sufficient heat dissipation cannot be obtained.
【００１０】また、プレートフィン部材２の肉厚が厚く
なったり、プレートフィン部材２の設置間隔Ｐが粗くな
ると、伝熱面積が小さくなり、ヒートシンクとしての放
熱性能が低下する。このため流動抵抗と伝熱面積の調和
から決定される適正なプレートフィン部材２の設置間隔
Ｐを求めることが必要である。Further, if the plate fin member 2 becomes thicker or the plate fin member 2 installation interval P becomes rougher, the heat transfer area becomes smaller, and the heat dissipation performance as a heat sink deteriorates. For this reason, it is necessary to obtain an appropriate installation interval P of the plate fin members 2 determined from the harmony of the flow resistance and the heat transfer area.
【００１１】ここでは、アルミニウムや銅からなるベー
ス部材１に所望の幅の溝を形成させる。溝形成にあたっ
ては、本実施例では、メタルソー、カッターやエンドミ
ル等により切削形成したものとして説明するが、鋳造や
プレスによって成型することも可能である。 溝の幅
は、プレートフィン部材２よりも若干幅の広いものと
し、プレートフィン部材２の挿入および植設が可能な幅
とする。溝の深さは、プレートフィン部材２を植設した
場合において、倒れない範囲の深さのものであればよ
い。Here, a groove having a desired width is formed in the base member 1 made of aluminum or copper. In forming the groove, in the present embodiment, it is described that the groove is formed by cutting with a metal saw, a cutter, an end mill, or the like, but it may be formed by casting or pressing. The width of the groove is slightly wider than the plate fin member 2 so that the plate fin member 2 can be inserted and planted. The depth of the groove may be such that it does not fall when the plate fin member 2 is planted.
【００１２】プレートフィン部材２は、金型によるプレ
スの打ち抜きやプラズマ放電加工機等により所定の板長
さ、所定の板高さ（植設用の溝深さ部分を含めたもの）
に作製する。The plate fin member 2 has a predetermined plate length and a predetermined plate height (including a groove depth portion for planting) by punching with a press using a die or a plasma electric discharge machine.
To make.
【００１３】次に本発明の第１の製造方法の実施の形態
について図３により説明すると、まず前記したように、
ベース部材３に溝４の形成を行う。溝４の幅は、プレー
トフィン部材５の板幅よりも若干広く形成する。形成さ
れた溝４に、プレートフィン部材５を挿入し、植設す
る。挿入は、１枚ずつ手で行う場合や必要な枚数を一旦
別の金型等の取付けモジュールに確保して、一度に植設
してもよい。Next, referring to FIG. 3, an embodiment of the first manufacturing method of the present invention will be described.
The groove 4 is formed in the base member 3. The width of the groove 4 is formed slightly wider than the plate width of the plate fin member 5. The plate fin member 5 is inserted into the formed groove 4 and implanted. The insertion may be carried out one by one, or the necessary number may be temporarily secured in another mounting module such as a mold and then implanted at one time.
【００１４】植設されたプレートフィン部材５は、所定
の板高さを確保するため、電動プレスや油圧機械等によ
り一定の荷重で高さ方向より押圧する。これにより植設
されたプレートフィン部材５は、高さのバラツキが補正
され、所定の高さとなる。The planted plate fin member 5 is pressed from the height direction with a constant load by an electric press or a hydraulic machine in order to secure a predetermined plate height. As a result, the plate fin member 5 thus planted has a predetermined height corrected for variations in height.
【００１５】次に図４のように、ヒートシンクのベース
部材３の側面（矢印で示した方向）をプレス機械等によ
り加圧する。ベース部材３は、アルミニウムまたは銅の
ためプレス機械の加圧により塑性加工され、プレートフ
ィン部材５を挟み、固定する。また、図５のようにプレ
ートフィン部材５が倒れたり、変形しない様に、補助金
型６等によりベース部材３の上面７を固定する。Next, as shown in FIG. 4, the side surface (the direction indicated by the arrow) of the base member 3 of the heat sink is pressed by a press machine or the like. The base member 3 is made of aluminum or copper and is plastically processed by pressurizing a press machine to sandwich and fix the plate fin member 5. Further, as shown in FIG. 5, the upper surface 7 of the base member 3 is fixed by an auxiliary mold 6 or the like so that the plate fin member 5 does not fall or deform.
【００１６】次に第２の製造方法は、アルミニウム等か
らなる平板ベース部材をロールフォーミングで円弧状の
ベース部材８の様に形成させ、溝９はその円弧に対応す
るように放射状にカッターやエンドミル等で形成させる
ものである。Next, in the second manufacturing method, a flat plate base member made of aluminum or the like is roll-formed to form an arc-shaped base member 8, and the grooves 9 are radially cut so as to correspond to the arc, and a cutter or an end mill. And the like.
【００１７】プレートフィン部材１０は、その形成され
た溝に添って挿入、植設される。この状態になったヒー
トシンクを油圧機械で図７プレートフィン部材の高さ方
向から押圧する。ベース部材８は、平板へ塑性加工され
る過程で、プレートフィン部材１０を挟み、しっかりと
固定する。この場合、ベース部材８に掘られた溝９は、
図７のようになりベース部材８の尖端部１１がプレート
フィン部材１０に食い込むようになる。The plate fin member 10 is inserted and implanted along the formed groove. The heat sink in this state is pressed from the height direction of the plate fin member in FIG. 7 by a hydraulic machine. The base member 8 sandwiches the plate fin member 10 and is firmly fixed in the process of being plastically processed into a flat plate. In this case, the groove 9 dug in the base member 8 is
As shown in FIG. 7, the tip 11 of the base member 8 bites into the plate fin member 10.
【００１８】次に第３の製造方法は、図８および図９に
示すように、アルミニウム等からなる平板ベース部材１
２に溝１３を形成する。この溝１３は、プレートフィン
部材１４の板厚の２枚分と固定部材１５の厚みを加えた
幅より若干狭い幅に形成する。 プレートフィン部材１
４は、図１１に示すようにベンダー等でＵ字状に折曲げ
て形成する。Next, in the third manufacturing method, as shown in FIGS. 8 and 9, the flat plate base member 1 made of aluminum or the like is used.
A groove 13 is formed in 2. The groove 13 is formed to have a width slightly narrower than the total width of the plate fin member 14 and the fixing member 15. Plate fin member 1
As shown in FIG. 11, 4 is formed by bending it into a U-shape with a bender or the like.
【００１９】１８はプレートフィン部材Ｕ字状に折曲げ
るための金型である。ここに平板の状態のプレートフィ
ン部材１９を載せ、上金型２１で押圧する。プレートフ
ィン部材は、溝部２２に挿入され、折曲げられた状態２
０となる。プレートフィン部材２０は、このまま上金型
２１の厚さを保持しながら、Ｕ字状に加工される。Reference numeral 18 is a die for bending the plate fin member into a U-shape. The plate fin member 19 in a flat plate state is placed on this and pressed by the upper die 21. The plate fin member is inserted into the groove 22 and bent 2
It becomes 0. The plate fin member 20 is processed into a U shape while maintaining the thickness of the upper mold 21 as it is.
【００２０】次に、図８のように、形成したプレートフ
ィン部材１４を前記ベース部材１２の溝１３に植設す
る。プレートフィン部材１４の間に、線材等からなる固
定部材１５をプレス機械等の嵌入板１６により挿入さ
せ、固定部材１５嵌入させる。これによりプレートフィ
ン部材１４は、ベース部材１２に固着される。Next, as shown in FIG. 8, the formed plate fin member 14 is planted in the groove 13 of the base member 12. A fixing member 15 made of a wire or the like is inserted between the plate fin members 14 by a fitting plate 16 such as a press machine, and the fixing member 15 is fitted. As a result, the plate fin member 14 is fixed to the base member 12.
【００２１】また、固着性能を高めるため、ベース部材
１２側面を図１０に示すように、プレス機械で加圧す
る。これにより、ベース部材１２は、プレートフィン部
材１４を挟み、より強固に固定するものである。Further, in order to improve the fixing performance, the side surface of the base member 12 is pressed by a press machine as shown in FIG. As a result, the base member 12 sandwiches the plate fin member 14 and more firmly fixes it.
【００２２】[0022]
【発明の効果】請求項１の発明においては、アルミニウ
ム板や銅板からなるプレートフィン部材を、プレートフ
ィン部材の板厚より若干広い幅の溝加工したベース部材
に挿入植設し、プレートフィンの板厚方向からベース部
材に対してプレス機械により圧力を加え、プレートフィ
ン部材とベース部材と圧着させるという製造方法とした
ために、プレートフィン部材とベース部材とが同質また
は異質な非鉄金属であっても製造が容易にでき、また放
熱性を高めるためにプレートフィン部材を薄くしても良
好に形成できる利点がある。ベース部材の加工もカッタ
ー等で行えることから、その大きさやフィンの間隔を自
由に簡単に変更できる。According to the first aspect of the present invention, a plate fin member made of an aluminum plate or a copper plate is inserted and planted in a grooved base member having a width slightly wider than the plate thickness of the plate fin member. Since the manufacturing method is such that pressure is applied to the base member from the thickness direction by a press machine and the plate fin member and the base member are pressure-bonded, even if the plate fin member and the base member are made of the same or different non-ferrous metal And the plate fin member can be satisfactorily formed even if the plate fin member is thin in order to improve heat dissipation. Since the base member can be processed with a cutter or the like, the size and the interval between the fins can be freely and easily changed.
【００２３】次に請求項２の発明では、ベース部材を円
弧に形成させ、プレートフィン部材を嵌合させ、より固
着性を高めることができた。ダイキャスト成形による鋳
造品とは異なり、熱伝導率が大幅に改善でき、金属の溶
湯を使用しないため安全で清潔な作業環境が作れる。ま
た、薄板のフィンを使用することができるために放熱面
積が増大し、放熱性が格段に向上し、高速のＬＳＩに対
応できるものとなった。Next, according to the second aspect of the present invention, the base member is formed into an arc and the plate fin member is fitted therein, and the fixing property can be further enhanced. Unlike cast products made by die-cast molding, the thermal conductivity can be greatly improved and a safe and clean working environment can be created because no molten metal is used. Further, since the thin plate fins can be used, the heat radiation area is increased, the heat radiation performance is remarkably improved, and the high speed LSI can be dealt with.
【００２４】次に請求項３の発明では、プレートフィン
部材をＵ字状に折曲げ加工したことにより、取付ける幅
を広くすることが可能となり、フィン部材を植設するた
めの充分な溝の形成が楽に行えるものとなった。また固
定するための固定部材をプレートフィン部材の中間に挿
入し、固定することから、そのプレス工程も簡単にな
り、プレートフィン部材の板厚が変更されても、固定部
材を変更するだけですぐに対応ができる。また、これら
はプレート状のものならばすべて加工可能であり、例え
ば銅線で編みあげたメッシュ状のものにも対応できる。In the third aspect of the invention, since the plate fin member is bent into a U shape, the mounting width can be widened, and a sufficient groove can be formed for implanting the fin member. Can be done easily. Also, since the fixing member for fixing is inserted in the middle of the plate fin member and fixed, the pressing process is also simplified, and even if the plate thickness of the plate fin member is changed, it is only necessary to change the fixing member. Can handle. Also, any of these can be processed as long as they are plate-shaped, and for example, mesh-shaped ones woven with copper wires can also be applied.
【図１】本発明のヒートシンクの斜視図FIG. 1 is a perspective view of a heat sink of the present invention.
【図２】本発明のヒートシンクの断面図FIG. 2 is a sectional view of a heat sink of the present invention.
【図３】本発明の一実施例におけるプレートフィン部材
を挿入している状態の要部断面図FIG. 3 is a cross-sectional view of an essential part of a state in which a plate fin member is inserted in an embodiment of the present invention
【図４】プレス機械によるヒートシンクのプレートフィ
ン部材を固着するために、ベース部材を押圧せんとする
要部断面図FIG. 4 is a cross-sectional view of a main part in which a base member is pressed to fix a plate fin member of a heat sink by a press machine.
【図５】プレートフィン部材の倒れ防止のための補助金
型を装着せんとする要部断面図FIG. 5 is a cross-sectional view of a main part in which an auxiliary mold for preventing the plate fin member from falling is attached.
【図６】円弧状のベース部材の断面図FIG. 6 is a sectional view of an arc-shaped base member.
【図７】円弧状のベース部材を高さ方向から押圧し、プ
レートフィン部材の植設が完了した要部断面図FIG. 7 is a cross-sectional view of a main part in which the plate fin member is completely planted by pressing the arcuate base member from the height direction.
【図８】Ｕ字状に折曲げたプレートフィン部材を取付け
た要部断面図FIG. 8 is a cross-sectional view of a main part with a plate fin member bent in a U shape attached.
【図９】Ｕ字状に折曲げたプレートフィン部材を取付け
る工程を示す斜視分解図FIG. 9 is an exploded perspective view showing a process of attaching a plate fin member bent in a U shape.
【図１０】プレス機械によりヒートシンクのベース部材
を押圧せんとする斜視図FIG. 10 is a perspective view in which the base member of the heat sink is pressed by the press machine.
【図１１】プレス機械によれプレートフィン部材をＵ字
状に加工せんとする要部断面図FIG. 11 is a cross-sectional view of an essential part in which a plate fin member is processed into a U shape by a press machine.
Ａ：ヒートシンク，１：ベース部材，２：プレートフィ
ン部材，３：ベース部材 ４：溝，５：プレートフィン部材：６：補助金型，７：
押圧面，８：円弧状に形成したベース部材，９：溝，１
０：プレートフィン部材，１１：尖端部，１２：ベース
部材，１３：広幅に形成された溝，１４：Ｕ字状に折曲
げ形成されたプレートフィン部材，１５：固定部材，１
６：嵌入板A: heat sink, 1: base member, 2: plate fin member, 3: base member 4: groove, 5: plate fin member: 6: auxiliary mold, 7:
Pressing surface, 8: base member formed in an arc shape, 9: groove, 1
0: plate fin member, 11: pointed portion, 12: base member, 13: wide groove formed, 14: plate fin member bent and formed in U shape, 15: fixing member, 1
6: Fitting plate
Claims (3)
ートフィン部材と、プレートフィン部材を取付けるため
のプレートフィン部材の板厚より若干広い幅であって、
プレートフィン部材を植設するための充分な深さを有す
る溝加工したベース部材と、プレートフィン部材をベー
ス部材に植設し、プレートフィン部材の板厚方向からベ
ース部材に対して圧力を加え、プレートフィン部材とベ
ース部材とを物理的に固定することを特徴とするヒート
シンクの製造方法。1. A heat sink having a plate fin member as a heat radiating portion and a width slightly wider than the plate thickness of the plate fin member for mounting the plate fin member,
A grooved base member having a sufficient depth for implanting the plate fin member and the plate fin member are implanted in the base member, and pressure is applied to the base member from the plate thickness direction of the plate fin member, A method for manufacturing a heat sink, comprising physically fixing a plate fin member and a base member.
ートフィン部材と、プレートフィン部材を取付けるため
のプレートフィン部材の板厚より若干広い幅であって、
プレートフィン部材を植設するための充分な深さを有す
る溝加工した円弧状のベース部材に、プレートフィン部
材を植設し、フィンの高さ方向からベース部材に対して
圧力を加え、プレートフィン部材とベース部材とを物理
的に固定することを特徴とするヒートシンクの製造方
法。2. A heat sink having a plate fin member as a heat radiating portion and a width slightly wider than the plate thickness of the plate fin member for mounting the plate fin member,
The plate fin member is planted on a grooved arcuate base member having a sufficient depth for implanting the plate fin member, and pressure is applied to the base member from the height direction of the fin to plate the plate fin member. A method for manufacturing a heat sink, comprising physically fixing a member and a base member.
放熱部であるプレートフィン部材と、取付けるための幅
とフィン部材を植設するための充分な深さを有する溝加
工したベース部材と、プレートフィン部材を植設固定す
るための固定部材をプレートフィン部材の中間に挿入す
るとともに、固定部材をプレートフィン部材の高さ方向
からベース部材に対して圧力を加え、プレートフィン部
材とベース部材とを物理的に固定することを特徴とする
ヒートシンクの製造方法。3. In a heat sink, a plate fin member which is a heat dissipation portion bent in a U shape, a grooved base member having a width for mounting and a sufficient depth for implanting the fin member, A fixing member for implanting and fixing the plate fin member is inserted in the middle of the plate fin member, and a pressure is applied to the fixing member from the height direction of the plate fin member to the base member to form the plate fin member and the base member. A method for manufacturing a heat sink, characterized in that the heat sink is physically fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15186196A JP3597640B2 (en) | 1996-05-24 | 1996-05-24 | Heat sink manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15186196A JP3597640B2 (en) | 1996-05-24 | 1996-05-24 | Heat sink manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09321186A true JPH09321186A (en) | 1997-12-12 |
| JP3597640B2 JP3597640B2 (en) | 2004-12-08 |
Family
ID=15527853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15186196A Expired - Fee Related JP3597640B2 (en) | 1996-05-24 | 1996-05-24 | Heat sink manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3597640B2 (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001162341A (en) * | 1999-12-09 | 2001-06-19 | Furukawa Electric Co Ltd:The | Fin heat dessipater and its manufacturing method |
| JP2001308231A (en) * | 2000-02-14 | 2001-11-02 | Mizutani Denki Kogyo Kk | Electronic component radiator and method of manufacturing it |
| JP2002172447A (en) * | 2000-11-30 | 2002-06-18 | Furukawa Electric Co Ltd:The | Heat sink |
| WO2003061000A1 (en) * | 2002-01-02 | 2003-07-24 | Alcan Technology & Management Ltd. | Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method |
| US6924983B2 (en) | 2002-08-05 | 2005-08-02 | Nidec Corporation | Heat sink fan |
| JP2010103418A (en) * | 2008-10-27 | 2010-05-06 | Furukawa-Sky Aluminum Corp | Heatsink having louver, and assembling method therefor |
| JP2012044129A (en) * | 2010-08-20 | 2012-03-01 | ▲黄▼ 崇賢 | Core tube seat of heat exhauster and method for manufacturing the same |
| JP2012146801A (en) * | 2011-01-12 | 2012-08-02 | Mitsubishi Materials Corp | Heat sink, substrate for power module with heat sink, power module, and manufacturing method of heat sink |
| WO2017051951A1 (en) * | 2015-09-25 | 2017-03-30 | 재단법인 다차원 스마트 아이티 융합시스템 연구단 | Embedded substrate having heat sink for heat dissipation and method for producing same |
| WO2017057093A1 (en) * | 2015-09-29 | 2017-04-06 | 三菱電機株式会社 | Semiconductor device and method for manufacturing same |
| JP2021506587A (en) * | 2017-12-13 | 2021-02-22 | フォイト パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングＶＯＩＴＨ ＰＡＴＥＮＴ ＧｍｂＨ | Screen manufacturing method |
| US11561051B2 (en) | 2019-03-22 | 2023-01-24 | Fujitsu Limited | Heat sink, board module, transmission device, and method of manufacturing the heat sink |
-
1996
- 1996-05-24 JP JP15186196A patent/JP3597640B2/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001162341A (en) * | 1999-12-09 | 2001-06-19 | Furukawa Electric Co Ltd:The | Fin heat dessipater and its manufacturing method |
| JP2001308231A (en) * | 2000-02-14 | 2001-11-02 | Mizutani Denki Kogyo Kk | Electronic component radiator and method of manufacturing it |
| JP2002172447A (en) * | 2000-11-30 | 2002-06-18 | Furukawa Electric Co Ltd:The | Heat sink |
| CN100352044C (en) * | 2002-01-02 | 2007-11-28 | 艾尔坎技术及管理有限公司 | Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method |
| US7009290B2 (en) | 2002-01-02 | 2006-03-07 | Alcan Technology & Management Ltd. | Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method |
| WO2003061000A1 (en) * | 2002-01-02 | 2003-07-24 | Alcan Technology & Management Ltd. | Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method |
| US6924983B2 (en) | 2002-08-05 | 2005-08-02 | Nidec Corporation | Heat sink fan |
| JP2010103418A (en) * | 2008-10-27 | 2010-05-06 | Furukawa-Sky Aluminum Corp | Heatsink having louver, and assembling method therefor |
| JP2012044129A (en) * | 2010-08-20 | 2012-03-01 | ▲黄▼ 崇賢 | Core tube seat of heat exhauster and method for manufacturing the same |
| JP2012146801A (en) * | 2011-01-12 | 2012-08-02 | Mitsubishi Materials Corp | Heat sink, substrate for power module with heat sink, power module, and manufacturing method of heat sink |
| WO2017051951A1 (en) * | 2015-09-25 | 2017-03-30 | 재단법인 다차원 스마트 아이티 융합시스템 연구단 | Embedded substrate having heat sink for heat dissipation and method for producing same |
| WO2017057093A1 (en) * | 2015-09-29 | 2017-04-06 | 三菱電機株式会社 | Semiconductor device and method for manufacturing same |
| JP2021506587A (en) * | 2017-12-13 | 2021-02-22 | フォイト パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングＶＯＩＴＨ ＰＡＴＥＮＴ ＧｍｂＨ | Screen manufacturing method |
| US11561051B2 (en) | 2019-03-22 | 2023-01-24 | Fujitsu Limited | Heat sink, board module, transmission device, and method of manufacturing the heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3597640B2 (en) | 2004-12-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3529358B2 (en) | Finned heat sink | |
| US7040388B1 (en) | Heat sink, method of manufacturing the same and cooling apparatus using the same | |
| JP4355412B2 (en) | Heat sink and manufacturing method thereof | |
| JP3597640B2 (en) | Heat sink manufacturing method | |
| TW201118331A (en) | Heat dissipating device and method for making a heat dissipating device | |
| US20050000682A1 (en) | Heat dissipating fins of heat sink and manufacturing method thereof | |
| US6861293B2 (en) | Stacked fin heat sink and method of making | |
| US20070147005A1 (en) | Heat sink board and manufacturing method thereof | |
| JPH09298259A (en) | Heat sink and manufacture thereof | |
| GB2367946A (en) | Heat sink assembly | |
| JPH1117080A (en) | Radiator | |
| EP1729342A1 (en) | Heat sink board and manufacturing method thereof | |
| JPH037956Y2 (en) | ||
| JP3453612B2 (en) | Manufacturing method of pin fin heat sink | |
| JP2002093961A (en) | Heat sink and semiconductor device | |
| JP3019251B2 (en) | Radiator and manufacturing method thereof | |
| JPH1168359A (en) | Heat radiator and manufacture therefor | |
| JP2003234443A (en) | Heat sink with fin | |
| EP0777270B1 (en) | Heat dissipator for electronic devices | |
| US20060227508A1 (en) | Heat sink assembly | |
| JPS6123349A (en) | Radiator | |
| JP2002026200A (en) | Radiator for electronic component | |
| JP2001308231A (en) | Electronic component radiator and method of manufacturing it | |
| CN1326236C (en) | Radiator fin and manufacturing method thereof | |
| JP2003078081A (en) | Forming method of heatsink |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Effective date: 20040615 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040622 |
|
| A521 | Written amendment |
Effective date: 20040728 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Effective date: 20040824 Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20040909 |
|
| R150 | Certificate of patent (=grant) or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080917 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090917 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090917 Year of fee payment: 5 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100917 Year of fee payment: 6 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 6 Free format text: PAYMENT UNTIL: 20100917 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110917 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 7 Free format text: PAYMENT UNTIL: 20110917 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120917 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 9 Free format text: PAYMENT UNTIL: 20130917 |
|
| LAPS | Cancellation because of no payment of annual fees |