WO2017050047A1 - Chipset and electronic device - Google Patents

Chipset and electronic device Download PDF

Info

Publication number
WO2017050047A1
WO2017050047A1 PCT/CN2016/094474 CN2016094474W WO2017050047A1 WO 2017050047 A1 WO2017050047 A1 WO 2017050047A1 CN 2016094474 W CN2016094474 W CN 2016094474W WO 2017050047 A1 WO2017050047 A1 WO 2017050047A1
Authority
WO
WIPO (PCT)
Prior art keywords
chipset
electronic device
inexpensive
chip
integrated circuit
Prior art date
Application number
PCT/CN2016/094474
Other languages
French (fr)
Chinese (zh)
Inventor
刘雪春
Original Assignee
深圳信炜科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳信炜科技有限公司 filed Critical 深圳信炜科技有限公司
Publication of WO2017050047A1 publication Critical patent/WO2017050047A1/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electronic Switches (AREA)

Abstract

A chipset (8) and an electronic device (100) comprising the chipset (8). The chipset (8) comprises: a first chip (81), which comprises an insulating substrate (811) and a first integrated circuit (813) provided on the insulating substrate (811); and a second chip (83), which comprises a semiconductor substrate (831) and a second integrated circuit (833) provided on the semiconductor substrate (831). The chipset (8) is inexpensive; correspondingly, the electronic device (100) comprising the chipset (8) also is inexpensive.
PCT/CN2016/094474 2015-09-23 2016-08-10 Chipset and electronic device WO2017050047A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201520744364.0U CN205028275U (en) 2015-09-23 2015-09-23 Chipset and electronic equipment
CN201520744364.0 2015-09-23

Publications (1)

Publication Number Publication Date
WO2017050047A1 true WO2017050047A1 (en) 2017-03-30

Family

ID=55260792

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/094474 WO2017050047A1 (en) 2015-09-23 2016-08-10 Chipset and electronic device

Country Status (2)

Country Link
CN (1) CN205028275U (en)
WO (1) WO2017050047A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205028275U (en) * 2015-09-23 2016-02-10 深圳信炜科技有限公司 Chipset and electronic equipment
WO2017206035A1 (en) * 2016-05-30 2017-12-07 深圳信炜科技有限公司 Biosensing module, biosensing chip, and electronic device
EP3316180A4 (en) 2016-05-30 2018-08-29 Shenzhen Xinwei Technology Co, Ltd. Biosensing chip and electronic device
CN106206549B (en) * 2016-05-30 2019-06-28 深圳信炜科技有限公司 Chip and electronic equipment

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1683960A (en) * 2004-04-14 2005-10-19 株式会社日立显示器 Display device and manufacturing method of the same
CN101162699A (en) * 2006-10-12 2008-04-16 株式会社瑞萨科技 Semiconductor device and manufacturing method of the same
CN103488361A (en) * 2012-06-08 2014-01-01 速博思股份有限公司 Embedded touch display panel system for increasing touch position accuracy
CN104536637A (en) * 2015-01-29 2015-04-22 京东方科技集团股份有限公司 Embedded touch screen and display device
CN104536603A (en) * 2014-12-18 2015-04-22 深圳市华星光电技术有限公司 Displayer and panel with touch function
CN105138203A (en) * 2015-09-23 2015-12-09 深圳信炜科技有限公司 Capacitive sensing system and electronic equipment
CN205028275U (en) * 2015-09-23 2016-02-10 深圳信炜科技有限公司 Chipset and electronic equipment
CN205080387U (en) * 2015-09-23 2016-03-09 深圳信炜科技有限公司 Electronic equipment

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1683960A (en) * 2004-04-14 2005-10-19 株式会社日立显示器 Display device and manufacturing method of the same
CN101162699A (en) * 2006-10-12 2008-04-16 株式会社瑞萨科技 Semiconductor device and manufacturing method of the same
CN103488361A (en) * 2012-06-08 2014-01-01 速博思股份有限公司 Embedded touch display panel system for increasing touch position accuracy
CN104536603A (en) * 2014-12-18 2015-04-22 深圳市华星光电技术有限公司 Displayer and panel with touch function
CN104536637A (en) * 2015-01-29 2015-04-22 京东方科技集团股份有限公司 Embedded touch screen and display device
CN105138203A (en) * 2015-09-23 2015-12-09 深圳信炜科技有限公司 Capacitive sensing system and electronic equipment
CN205028275U (en) * 2015-09-23 2016-02-10 深圳信炜科技有限公司 Chipset and electronic equipment
CN205080387U (en) * 2015-09-23 2016-03-09 深圳信炜科技有限公司 Electronic equipment

Also Published As

Publication number Publication date
CN205028275U (en) 2016-02-10

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