WO2017041964A1 - Système et procédé pour vérifier des points de brasage - Google Patents

Système et procédé pour vérifier des points de brasage Download PDF

Info

Publication number
WO2017041964A1
WO2017041964A1 PCT/EP2016/068545 EP2016068545W WO2017041964A1 WO 2017041964 A1 WO2017041964 A1 WO 2017041964A1 EP 2016068545 W EP2016068545 W EP 2016068545W WO 2017041964 A1 WO2017041964 A1 WO 2017041964A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
solder joint
inspection
automatic
determined
Prior art date
Application number
PCT/EP2016/068545
Other languages
German (de)
English (en)
Inventor
Marco Braun
Udo Welzel
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2017041964A1 publication Critical patent/WO2017041964A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes

Definitions

  • the invention is based on a system or a method for solder joint inspection according to the preamble of the independent claims.
  • SPI Solder Paste Inspection
  • the components to be soldered are placed on the printed circuit board and the solder paste is melted in a soldering oven, so that the resulting solder solid electrically conductive connections between the components and the corresponding solder pads of the circuit board can arise.
  • AOI automatic optical inspection systems
  • AXI automatic X-ray inspection
  • the printed circuit board continues on the production line
  • the corresponding solder joint of the printed circuit board is usually judged manually by a human examiner in a post-inspection process indeed A poor solder joint is present or the classification of the automatic solder joint inspection was incorrect and there is a so-called "pseudo-error.”
  • Manual post-evaluation is common because in the solder joint inspection systems known from the prior art without manual re-evaluation too high scrap costs due to pseudo-errors would arise in the automatic solder point inspection process.
  • solder joint inspection system and method having the features of independent claims 1 and 10, respectively, has the advantage that the effects of variations in the design of a solder wettable solder surface due to different layout layouts, such as different Dimensions of the pads and / or tolerances for a conductor pattern and / or applied solder mask may occur, on the at least one quality feature for assessing the solder joint in the automatic solder joint inspection can be considered. This is done by specifying a threshold value of the at least one quality characteristic for solder joint inspection adapted to at least one geometric parameter of the solder wettable solder surface. The size of the wettable with solder
  • Soldering surface is dependent on the dimensions of the electrically conductive contact surface and / or on the applied solder resist.
  • the applied solder resist can reduce the solder wettable solder surface of the electrically conductive contact surface when solder mask is on the electrically conductive contact surface.
  • it can be distinguished advantageously for different geometric parameters of the solder wettable solder between good and bad solder joints. With a fixed threshold value, it is not possible in the automatic solder joint inspection to distinguish between good and bad solder joints, taking into account all possible geometrical parameters of the solder wettable solder surface.
  • the values of the at least one quality feature for a good solder joint with a minimum allowable width of the solder wettable solder surface are in the same range as the values of the at least one quality characteristic for a bad solder joint with a maximum allowable width of the solder-wettable solder pad.
  • the attempt to distinguish between good and bad soldering would lead to pseudo error rates and / or high percentile slip rates.
  • rates in the ppm range are required for automatic monitoring.
  • Embodiments of the present invention incorporate the automatic pad inspection information directly into the automatic solder joint inspection, thus enabling the direct, flexible adaptation of the corresponding evaluation algorithm to the information supplied about the current solderable solder pad.
  • Embodiments of the present invention perform an adaptive solder joint inspection in which the threshold value with which the device for automatic solder joint inspection decides on good or bad soldering is adapted to the solder-wettable solder surface present at the respective solder joint.
  • slippage and pseudo-errors can advantageously be massively reduced compared to a standard solder joint inspection.
  • embodiments of the present invention may allow verification of the solder joints of SMT designs which heretofore can not be tested for lack of separability of good and bad parts over process tolerances of solder wettable surfaces.
  • the pseudo error rate can be reduced to such an extent that a manual review can be dispensed with.
  • the device for automatic solder joint inspection can, for example, evaluate the solder joint to be tested as a good solder joint if the at least one quality characteristic is equal to the predetermined threshold value or above the predetermined threshold value, or evaluate it as a bad solder joint. if the at least one quality feature is below the predetermined threshold.
  • the device for automatic Lötstellenin- inspection evaluate the solder joint to be tested depending on the selected at least one quality feature, for example, as a good solder joint, if the at least one quality feature is below the predetermined threshold, or evaluate as a bad solder joint, if the at least one quality characteristic equal to predetermined threshold or is above the predetermined threshold.
  • Embodiments of the present invention provide an apparatus for solder joint inspection, which comprises an apparatus for automatic solder joint inspection, which detects at least one quality feature of a solder joint to be tested and compares it with a predetermined threshold value in a predetermined inspection region of the solder surface.
  • the device for automatic solder joint inspection evaluates the solder joint to be tested depending on the comparison result as a good solder joint or as a poor solder joint.
  • a device for automatic soldering surface inspection is provided, which determines at least one geometric parameter of the solder wettable soldering surface of the solder joint to be tested.
  • An evaluation and control unit determines the threshold value for the at least one quality feature as a function of the at least one geometric parameter of the solder wettable surface determined by the solder joint and predefines it for checking the corresponding solder joint to the device for automatic solder joint inspection.
  • a method for solder joint inspection with an automatic solder joint inspection is proposed, by which at least one quality characteristic of a solder joint to be tested is detected in a predetermined inspection region of the soldering surface and compared with a predetermined threshold value.
  • the solder joint to be tested is evaluated as a good solder joint or as a poor solder joint depending on the comparison result.
  • an automatic soldering surface inspection is carried out, by which at least one geometric parameter of the solder wettable soldering surface of the solder joint to be tested is determined.
  • the threshold value for the at least one quality feature for automatic solder joint inspection is determined as a function of the at least one geometric parameter of the solder-wettable soldering surface determined for the solder joint to be tested and specified for checking the corresponding solder joint.
  • the system according to the invention and the method according to the invention can be used, for example, in a system for equipping a printed circuit board for solder joint inspection.
  • Embodiments of the invention may be implemented, for example, in software or hardware or in a hybrid of software and hardware, for example in the evaluation and control unit.
  • the evaluation and control unit can be understood as meaning an electrical device, such as a control unit, which processes or evaluates detected sensor signals.
  • the evaluation and control unit may have at least one interface, which may be formed in hardware and / or software.
  • the interfaces can be part of a so-called system ASIC, for example, which contains a wide variety of functions of the evaluation and control unit.
  • the interfaces are their own integrated circuits or at least partially consist of discrete components.
  • the interfaces may be software modules that are present, for example, on a microcontroller in addition to other software modules.
  • a computer program product with program code which is stored on a machine-readable carrier such as a semiconductor memory, a hard disk memory or an optical memory and is used to carry out the evaluation when the program is executed by the evaluation and control unit.
  • the evaluation and control unit may be implemented as part of the automatic pad inspection apparatus or as part of the automatic solder inspection apparatus or as an independent assembly.
  • the device for automatic solder joint inspection can be carried out, for example, as an optical system or as an X-ray system.
  • a device for automatic solder paste inspection can be provided, which can determine a quantity of solder paste applied to the soldering surface of the solder joint to be tested.
  • a device for automatic component verification can determine at least one geometric parameter of a component to be soldered.
  • the evaluation and control unit can use the solder paste quantity determined for the solder joint to be tested and / or the determined at least one geometric parameter of the component to be soldered in determining the threshold value for the at least one quality feature.
  • embodiments of the present invention can additionally integrate the information of the automatic solder paste inspection directly into the automatic solder joint inspection and thus enable the direct, flexible adaptation of the corresponding evaluation algorithm with respect to the supplied information about the current solder paste quantity.
  • slippage and pseudo-errors can advantageously be further reduced in comparison to a standard solder joint inspection.
  • the evaluation and control unit can then position and / or dimensions of the at least one corresponding inspection area for the Lötstelleninspektion depending on the specific at least one geometric parameter of the wettable with solder
  • the device for automatic solder joint inspection as the at least one quality feature a width and / or height and / or length of the solder joint and / or within the inspection area a number of pixels with a predetermined property and / or sections with a predetermined Determine property.
  • the inspection area represents the solder joint area, in which typically the formation of a solder meniscus can be tested as a quality feature for a good solder joint.
  • the brightness and / or color and / or size of the inspection area for example, can be defined as the predetermined property Detected pixels are determined and evaluated.
  • gray scale gradients and / or average gray values can be determined within the inspection area at least for sections of the inspection area or for the entire inspection area. Regardless of the current solder wettable surface and / or the actual amount of solder paste, a "good” solder joint, for example, contains significantly more pixels than a "bad” solder joint. By means of a three-dimensional detection of the solder joint to be checked, it is possible in particular to evaluate information about the height or the height profile of the soldering miniscus as a quality feature for the solder joint to be tested.
  • the device for automatic Löt vomerschreibage a checked solder surface as a good soldering surface evaluate if the at least one determined geometric parameters of the solder wettable soldering surface is within a predetermined range.
  • an optimum width of the solder wettable surface can be specified as 100% for the solder joint to be tested.
  • the automatic pad inspection apparatus may evaluate a solder wettable pad having a determined width in a predetermined range of, for example, 50 to 150% as a good pad and a solder wettable pad having a detected width out of the predetermined range as a bad pad.
  • the automatic solder paste inspection apparatus may rate a certain amount of solder paste as a good amount of solder paste if the determined amount of solder paste is within a predetermined range. For example, an optimal amount of solder paste can be specified as 100% for the solder joint to be tested. Then, the automatic solder paste inspection apparatus may evaluate a certain amount of solder paste in the predetermined range of, for example, 50 to 150% as a good solder paste amount and a certain amount of solder paste outside the predetermined range as a poor solder paste amount.
  • a Nachüberleitersplatz be present at which a human examiner re-evaluated the rated as a bad solder joints solder joints.
  • for the solder joint to be checked in advance corresponding to a predetermined number of different geometric parameters and / or Lotpastenmengen corresponding supporting values are determined and stored, which can be used to determine the threshold for the at least one quality feature.
  • the threshold value used for the solder joint inspection for the determined geometrical parameter and / or for the specific solder paste quantity can be interpolated between the determined interpolation points. By specifying support points, the time for determining or calculating the threshold value can be advantageously reduced.
  • a threshold value characteristic can be determined and stored in advance for the solder joint to be checked as a function of the geometric parameter and / or of the quantity of solder paste in the predetermined range.
  • the threshold value used for the solder joint inspection for the determined geometric parameter and / or the specific solder paste quantity can be read from the characteristic curve. As a result, the time for determining the threshold value can be further reduced.
  • Fig. 1 shows a schematic block diagram of a first embodiment of a system according to the invention for solder joint inspection.
  • FIG. 2 shows a schematic flow diagram of a first exemplary embodiment of a method for equipping a printed circuit board, in which an exemplary embodiment of a method according to the invention for checking solder joints is integrated.
  • FIG. 3 shows schematic illustrations of a plurality of solder joints to be checked.
  • 4 shows schematic representations of the solder joints to be checked from FIG. 3, which were produced by a solder joint inspection system according to the invention.
  • FIG. 5 shows a schematic diagram of normal distributions of good solder joints and of bad solder joints for a first solder-wettable soldering area and a corresponding first threshold value.
  • FIG. 6 shows a schematic diagram of normal distributions of good solder joints and of bad solder joints for a second solder wettable soldering area and a corresponding second threshold value.
  • Fig. 7 shows a schematic diagram of normal distributions of good solder joints and of bad solder joints for a third solder wettable soldering area and a corresponding third threshold value.
  • FIG. 8 shows a schematic diagram of normal distributions of good solder joints and poor solder joints for a fourth solder wetted area and a corresponding fourth threshold.
  • FIG. 9 shows a schematic block diagram of a second exemplary embodiment of a solder joint inspection system according to the invention.
  • FIG. 10 shows a schematic flow diagram of a second exemplary embodiment of a method for equipping a printed circuit board, in which an exemplary embodiment of a method according to the invention for checking solder joints is integrated.
  • the exemplary embodiments of a system 1, 1A according to the invention for solder joint inspection each comprise a device 5 for automatic solder joint inspection which detects at least one quality feature QM of a solder joint 11 to be inspected in a predetermined inspection region 12 of the soldering surface 14 with a predetermined threshold value SW1, SW2, SW3, SW4 compares.
  • the device 5 for automatic solder joint inspection evaluates the solder joint 11 to be tested as a good solder joint ASJI RG or as a bad solder joint ASJI RB as a function of the comparison result.
  • a device 2 for automatic Löthotelschreibage which determines at least one geometric parameter of the solder 15 wettable soldering surface 14 of the solder joint 11 to be tested.
  • An evaluation and control unit 10, 10A determines the threshold value SW1, SW2, SW3, SW4 for the at least one quality feature QM as a function of the at least one geometric parameter of the solder wettable solder 15, as determined by solder 15, and outputs the threshold value SW1 , SW2, SW3, SW4 for checking the corresponding solder joint to the device 5 for automatic solder joint inspection.
  • the device 5 for automatic solder joint inspection is designed as an optical system which has a number of pixels recognized in the inspection area 12 or a current width Bl, B2, B3 of the solder joint 11 determined therefrom as the at least one quality feature QM for evaluating the corresponding solder joint 11 determined.
  • the device 5 for automatic solder joint inspection can be performed as an X-ray system.
  • other predetermined properties such as brightness and / or color and / or size of the pixels detected in the inspection area 12 and / or sections with predetermined properties can be detected within the inspection area to distinguish between a good solder joint GSJ and a bad solder joint BSJ and evaluated.
  • gray scale gradients and / or average gray values can be determined at least for sections of the inspection area or for the entire inspection area.
  • the height and / or length of the solder joint to be tested for distinguishing between a good solder joint GSJ and a bad solder joint BSJ can be detected and evaluated.
  • the system 1, 1A for checking solder joints in the exemplary embodiments illustrated comprises in each case a post-inspection station 7, on which a human examiner checks the bad soldering test. ASJI RB evaluated soldered joints.
  • the system 1, 1A is integrated into a system for assembling printed circuit boards for solder joint inspection. In this case, printed circuit boards with soldering points ASJ IRG which are rated as good by the device 5 for automatic solder joint inspection are transferred directly to a subsequent production process 9A. Printed circuit boards with at least one solder joint ASJ IRB rated as poor by the device 5 for automatic solder joint inspection are transferred to the post-inspection station 7.
  • the printed circuit board is likewise transferred to the subsequent production process 9A. If the reviewer also judges that the at least one solder joint ASJ IRB considered poor by the automatic solder joint inspection device 5 is a bad solder joint HSJ IRB, then the printed circuit board is transferred to a post-processing process or scrap process 9B.
  • solder surfaces 14 of the printed circuit board 18 are printed with solder paste 15 in a step S100.
  • Step S110 an automatic verification of the solder wettable 15 Lot surface 14 of the circuit board 18 is performed by which at least one geometric parameter of the respective solder 15 wettable solder 14, such as width and / or length of the solder 15 wettable solder 14, etc., is detected and determined.
  • step S120 it is checked whether the at least one determined geometric parameter of the soldering surface 14 which can be wetted with solder 15 lies within a predetermined range.
  • the width of the soldering surface 14 which can be wetted with solder 15 is detected as a geometric parameter for the soldering surface 14 to be checked, with an optimum width of the soldering surface wettable with solder 15 being specified as 100%.
  • the tested solder surface 14 is judged to be a good soldering area LFIG at step S120 when the width of the solderable pad 15 is within a predetermined range of 50% to 150%.
  • the checked soldering surface 14 is evaluated as a poor soldering surface LFIB in step S120 if the width of the soldering surface wettable with solder 15 is outside the predetermined soldering surface. given area lies.
  • the corresponding circuit board 18 is given to the post-processing process, which is performed in step S600.
  • the size of solder pad 14 wettable with solder 15 depends on the dimensions of the electrically conductive contact surface and / or on the applied solder mask.
  • the applied solder resist can reduce the solder wettable surface 14 of solder 15 of the electrically conductive contact surface when solder mask is on the electrically conductive contact surface.
  • the at least one geometrical parameter of solderable surface 14 which can be wetted with solder 15 may alternatively also be printed prior to printing
  • Printed circuit board 18 can be determined with solder paste in step S100.
  • step S120 If the solder surfaces 14 of the printed circuit board 18 wettable with solder 15 have been evaluated as good solder surfaces LFIG in step S120, then the components 16 to be soldered are placed on the printed circuit board 18 in step S170.
  • step S180 the printed circuit board 18 is supplied with the placed components 16 to a soldering oven, in which the solder paste is melted so that the resulting solder 15, a solid electrically conductive connection between the components 16 and the solder pads 14 of the circuit board 18 is formed.
  • the threshold value SW1, SW2, SW3, SW4 for the at least one quality feature QM for automatic solder joint inspection is determined in step S200 as a function of the specific dimensions of the solder surface 14 wettable with solder 15 and for checking the corresponding solder joint 11 specified.
  • the automatic solder joint inspection is performed, through which in a predetermined inspection area 12 of the soldering surface
  • the at least one quality feature QM of the solder joint to be tested is detected.
  • step S310 the value of the at least one quality feature QM is compared with the predetermined threshold value SW1, SW2, SW3, SW4.
  • the solder joint 11 to be checked is evaluated as good solder joint ASJI RG in step S310 if the at least one quality characteristic QM is equal to the predetermined threshold value SW1, SW2, SW3, SW4 or lies above the predetermined threshold value SW1, SW2, SW3, SW4 ,
  • the solder joint 11 to be checked is rated as a bad solder joint ASJI RB if the at least one quality characteristic QM is below the predetermined threshold value SW1, SW2, SW3, SW4.
  • the solder joint to be tested 11 may alternatively be evaluated as a good solder joint, if the at least one quality feature QM is below the predetermined threshold, or evaluated as a bad solder joint, if the at least one quality feature QM is equal to the predetermined threshold or above the predetermined
  • step S310 If the solder joints 11 are evaluated as good solder joints ASJ IRG in step S310, then the corresponding printed circuit board 18 is transferred directly to the subsequent production process 9A, which is carried out in step S500. If at least one soldering point 11 of the printed circuit board has been evaluated as a bad solder joint AS J IRB, then the printed circuit board is transferred to the post-inspection station 7 in step S400. If in the automatic solder joint inspection the poorly evaluated at least one solder joint ASJ IRB is evaluated by the inspector in the inspection as a good solder joint HSJ IRG in step S410, then the printed circuit board is likewise transferred to the subsequent production process 9A, which is carried out in step S500.
  • the board is transferred to the post-processing process 9B performed in step S600.
  • solder joints 11 are shown in the illustrated section of a printed circuit board 18 and an electronic component 16.
  • the solder joints 11 are each formed between a contact element 16. 1 of the electronic component 16 and a soldering surface 14 of the printed circuit board 18.
  • solder joint geometries In test algorithms known from the prior art, a sequence of test steps with the parameters required therefor and the fixed threshold values for the solder joint inspection used for the separation of good and bad solder joints 11 are generally determined at selected solder joint geometries. In subsequent test tasks on the solder joints 11 to be tested in different products, variations in the solder joint geometries of good and bad solder joints 11 can occur, which in the one-time creation the parameters and thresholds for the solder joint inspection can not be taken into account comprehensively and consequently can lead to increased slip and / or higher pseudo error rates. Variations in the solder joint geometries are caused, for example, by different geometries of the solder surfaces 14 of the printed circuit boards 18 which can be wetted with solder 15.
  • the solder wettable surface 14 on the printed circuit board may vary due to different layout layouts such as dimensions of the wettable solder pad 14 and the different thickness of the pad forming the solder pad 14.
  • variations can be caused by PCB tolerances.
  • the solderable surface 15 wettable with solder 15 on the printed circuit board 18 of a solder joint 11 to be tested may vary due to the tolerances for the conductive pattern and / or the solder resist, so that the soldering surface 14 that is currently wettable with solder 15 can also vary. In combination, these variations in variations may cause more than 50% change in the current solder wettable surface 14 as compared to a nominal state.
  • FIG. 3 various defect images a), b) and c) of bad solder joints 11 and an image d) of a good solder joint 11 are shown by way of example.
  • the solder joints 11 are shown in connection with a by way of example QFP (Quad Flat Package) executed component 16 with gull-wing terminals designed as contact elements 16.1.
  • QFP Quad Flat Package
  • the device 5 for automatic solder joint inspection perpendicular to the printed circuit board 18 receives from above an image of the solder joint 11 to be examined, shown in FIG.
  • the defect images a) each show a contact element 11 lifted off the soldering surface 14 which is not wetted with solder 15.
  • the defect images b) each show a contact element 11 resting on the soldering surface 14 which is not wetted with solder 15.
  • the defect images c) each show a contact element 11 resting on the soldering surface 14, wherein no soldering paste 15 is present. Such an error can already be detected at an earlier time when a solder paste inspection is performed.
  • the images d) each show a good solder joint 11, which is recognized in the illustrated exemplary embodiment by the fact that te B3 of the bright area of the Lothügels the specific width of the corresponding solderable with Lot 15 soldering surface 14 corresponds.
  • the distributions for distributions of the measured solder joint widths for good solder joints GSJ and for bad solder joints BSJ, for example, can be approximated by the normal distributions shown in Figs. 5-8.
  • a threshold for distinguishing good solder joints GSJ and bad solder joints BSJ is chosen according to the pseudo error or slip rate to be achieved. Changes in the width of the solder surfaces 14 wettable with solder 15 on the printed circuit board 18 result in displacements of these distributions, as can be seen from FIGS.
  • a remedy for the described problem is provided by embodiments of the present invention which use a test pattern adapted to the respective printed circuit board geometry, ie, adaptation of the parameters and / or threshold values SW1 used by the printed circuit board used for the product to be tested.
  • SW2, SW3, SW4 for differentiation or separation of good solder joints Make GSJ and bad solder joints BSJ.
  • the test algorithm with which the automatic solder point inspection device 5 distinguishes automatic solder point inspection device 5 between a good solder joint GSJ or a bad solder joint BSJ is referred to the actual solder joint inspection. borrowed adapted for the solder joint 11 to be examined on the circuit board 18 present geometry.
  • An example is the displacement of the threshold values SW1, SW2, SW3, SW4 shown in FIGS. 6 to 9 for the separation of good solder joints GSJ and bad solder joints BSJ as a function of the width of the solder pad 14 currently wettable with solder 15 on the printed circuit board 18.
  • Slip and pseudo-errors can be massively reduced compared to a solder joint inspection without corresponding adjustment of the threshold values. It is conceivable that the pseudo error rate can thereby be reduced to such an extent that a manual reclassification can be dispensed with.
  • soldering surface 14 which is currently wettable with solder 15 on printed circuit board 18 can be provided, for example, by a device 3 for automatic solder paste inspection, which determines a quantity of solder paste applied to soldering surface 14 of solder joint 11 to be tested.
  • a device 3 for automatic solder paste inspection which determines a quantity of solder paste applied to soldering surface 14 of solder joint 11 to be tested.
  • other analysis systems preferably camera-based analysis systems, which measure the soldering surface 14 which can be wetted with solder 15
  • Circuit board 18 allow.
  • soldering area 14 which can be wetted with solder 15, for example for 60%, 80%, 100% and 120% of the soldering area 11 to be tested beforehand, is used for a given number of different widths
  • Nominal value of the width, corresponding supporting values are determined and stored, which are used to determine the threshold value SW1, SW2, SW3, SW4 for the at least one quality feature QM.
  • the threshold value used for the solder joint inspection for the specific dimensions of solderable surface 14 which can be wetted with solder 15 can then be interpolated between the determined interpolation points.
  • the solder wettable area of 60%, 80%, 100%, 120% based on the quality feature QM such as "number of dark pixels” and / or “number of bright pixels” and / or “ratio of the number of dark pixels to the number of bright pixels” and / or width Bl, B2, B3 of a bright area of the solder bump in the inspection area 12 between a good solder joint GSJ and a bad solder joint
  • the number of pixels would also be te width of the solder wettable solder 15 14 vary, so that for each width of the solder 15 wettable soldering area of 60%, 80%, 100%, 120% a certain probability in the form of a typical normal distribution for the number of pixels for good Solder points GSJ and for bad solder joints BSJ results, as can be seen from Fig. 5 to 8 further.
  • the quality feature QM in the inspection area 12 for a good solder joint GSJ with 60% area width which is shown in FIG. 6, is in the same range as the quality feature QM in the inspection area 12 for a bad solder joint BSJ with 120% area width, which is shown in FIG. 8 is shown.
  • the attempt to distinguish between good and bad solder joints GSJ and BSJ would lead to pseudo error rates and / or high percentile slip rates.
  • the illustrated second exemplary embodiment of a system 1 according to the invention for solder joint inspection comprises a device 3 for automatic solder paste inspection, in contrast to the first exemplary embodiment of a device 1 according to the invention for solder joint inspection shown in FIG which determines a quantity of solder paste applied on the soldering surface 14 of the soldering point 11 to be checked, and an apparatus 4 for automatic component checking, which determines at least one geometric parameter of a component 16 to be soldered.
  • the automatic solder joint inspection device 5 detects the at least one quality feature QM of the solder joint 11 to be inspected in a predetermined inspection region 12 of the soldering surface 14 and compares the at least one quality characteristic QM with a predetermined threshold value SW1, SW2, SW3, SW4. In this case, the device 5 for automatic solder joint inspection evaluates the solder joint 11 to be tested as a good solder joint ASJI RG or as a bad solder joint ASJI RB as a function of the comparison result.
  • solder surfaces 14 of the printed circuit board 18 are printed with solder paste 15.
  • step S110 an automatic check of solderable surface 15 of solderable surface 14 of printed circuit board 18 is carried out, by which at least one current geometric parameter of solderable surface 14 wettable with solder 15, such as width and / or length of soldering surface 14 wettable with solder 15 etc., recorded and determined.
  • the size of solder pad 14 wettable with solder 15 depends on the dimensions of the electrically conductive contact surface and / or on the applied solder mask.
  • the applied solder resist can reduce the solder wettable surface 14 of solder 15 of the electrically conductive contact surface when solder mask is on the electrically conductive contact surface.
  • the at least one geometrical parameter of the soldering surface 14 which can be wetted with solder 15 can alternatively also be determined before the printing on the printed circuit board 18 with solder paste in step S100.
  • step S120 it is checked whether the at least one specific geometric parameter of the soldering surface 14 which can be wetted with solder 15 is within a predetermined range.
  • step S130 If the solder wettable surfaces 14 of the printed circuit board 18 have been evaluated as good solder surfaces LFIG in step S120, an automatic solder paste inspection is carried out in step S130, by which the amount of solder paste applied to a soldering surface 14 is determined. In step S140, it is checked whether the determined solder paste amount is within a predetermined range. In the illustrated embodiment, an optimal Lotpastenmenge is specified as 100% for the solder joint 11 to be tested. In the automatic solder paste inspection is carried out in step S130, by which the amount of solder paste applied to a soldering surface 14 is determined. In step S140, it is checked whether the determined solder paste amount is within a predetermined range. In the illustrated embodiment, an optimal Lotpastenmenge is specified as 100% for the solder joint 11 to be tested. In the automatic solder paste inspection is carried out in step S130, by which the amount of solder paste applied to a soldering surface 14 is determined. In step S140, it is checked whether the determined solder paste amount is within
  • the specific Lotpastenmenge is evaluated in step S140 as a good Lotpastenmenge SPIG, for example, if it is in the predetermined range of 50 to 150%.
  • the determined solder paste amount is judged to be a bad solder paste amount SPIB in step S160 if it is out of the predetermined range. In this case, the corresponding circuit board
  • step S600 the post-processing process 18 to the post-processing process, which is performed in step S600.
  • other areas for assessing the Lotpastenmenge can be specified.
  • the solder paste inspection may also be performed prior to the solder pad inspection.
  • step S150 an automatic component check is carried out, by which the geometric parameters of the respective component 16, such as dimensions of the component 16 and / or the contact elements 16.1 and / or degree of bending of the contact elements 16.1, etc., and / or damage to the component 16 detected and be determined.
  • step S160 it is checked if the geometric parameters of the respective component 16, such as dimensions of the component 16 and / or the contact elements 16.1 and / or degree of bending of the contact elements 16.1, etc., and / or damage to the component 16 detected and be determined.
  • step S160 it is checked if the geometric parameters of the respective component 16, such as dimensions of the component 16 and / or the contact elements 16.1 and / or degree of bending of the contact elements 16.1, etc., and / or damage to the component 16 detected and be determined.
  • Component 16 corresponds to the specified requirements. If it is determined in step S160 that the component 16 does not meet the predetermined requirements, the component 16 is evaluated as a bad component BTIB and handed over to a post-processing process, which is performed in step S600. If the component becomes a good component in step S160 BTIG evaluated, then depending on the specific geometric parameters of the respective component 16 position and / or dimensions of the at least one corresponding inspection area 12 for solder joint inspection of the component 16 for the further process specified.
  • step S160 The components BTIG evaluated as good in step S160 are placed on the printed circuit board 18 in step S170.
  • step S180 the printed circuit board 18 is supplied with the placed components 16 to a soldering oven, in which the solder paste is melted, so that by the resulting solder 15 a fixed electrically conductive connection between the contact elements 16.1 of the components
  • step S200 depending on the at least one specific geometrical parameter of the respective component 16 and / or the determined at least one geometrical parameter, solder pad 14 wettable with solder 15 and / or the particular amount of solder paste applied to solder pad 14 / or the dimensions of the at least one corresponding inspection area 12.1,
  • step S300 the automatic solder joint inspection is carried out, by means of which the at least one quality feature QM of the solder joint 11 to be inspected is detected in a predetermined inspection region 12 of the soldering surface 14. For the position and / or dimensions of the inspection area 12, the specifications determined in step S200 are used.
  • step S310 the value of the at least one quality feature QM is compared with the predetermined threshold value SW1, SW2, SW3, SW4.
  • the solder joint 11 to be checked is in the illustrated embodiment in step S310 as a good solder joint ASJI RG evaluates when the at least one quality feature QM is equal to the predetermined threshold value SW1, SW2, SW3, SW4 or above the predetermined threshold value SW1, SW2, SW3, SW4.
  • step S310 If the solder joints are evaluated as good solder joints ASJ IRG in step S310, then the corresponding printed circuit board is transferred directly to the subsequent production process 9A, which is carried out in step S500. If at least one solder joint 14 of the printed circuit board has been evaluated as a bad solder joint ASJ IRB, then the printed circuit board is transferred to the post-inspection station 7 in step S400. If in the automatic solder joint inspection the poorly evaluated at least one solder joint ASJ IRB is evaluated by the inspector in the inspection as a good solder joint HSJ IRG in step S410, then the printed circuit board is likewise transferred to the subsequent production process 9A, which is carried out in step S500.
  • the board is transferred to the post-processing process 9B performed in step S600.

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

L'invention concerne un système (1) pour vérifier des points de brasage, comportant un dispositif (5) qui permet de vérifier automatiquement des points de brasage, et qui détecte au moins une caractéristique de qualité d'un point de brasage à vérifier dans une zone de vérification prédéfinie et la compare à une valeur de seuil prédéfinie. Le dispositif (5) de vérification automatique des points de brasage évalue le point de brasage à vérifier en fonction du résultat de la comparaison comme étant un bon point de brasage (ASJIRG) ou un mauvais point de brasage (ASJIRB). L'invention concerne également un procédé pour la vérification des points de brasage. Selon l'invention, un dispositif (2) de vérification automatique des points de brasage détermine au moins un paramètre géométrique de la surface du point de brasage à vérifier, sur laquelle peut être appliqué le métal d'apport, une unité d'évaluation et de commande (10) déterminant la valeur de seuil pour ladite caractéristique en fonction de l'au moins un paramètre géométrique déterminé pour le point de brasage à vérifier de la surface (14) sur laquelle peut être appliqué le métal d'apport, et transmettant ladite valeur pour la vérification du point de brasage correspondant au dispositif (5) de vérification automatique de points de brasage.
PCT/EP2016/068545 2015-09-09 2016-08-03 Système et procédé pour vérifier des points de brasage WO2017041964A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015217181.7 2015-09-09
DE102015217181.7A DE102015217181A1 (de) 2015-09-09 2015-09-09 Anlage und Verfahren zur Lötstellenüberprüfung

Publications (1)

Publication Number Publication Date
WO2017041964A1 true WO2017041964A1 (fr) 2017-03-16

Family

ID=56686786

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/068545 WO2017041964A1 (fr) 2015-09-09 2016-08-03 Système et procédé pour vérifier des points de brasage

Country Status (3)

Country Link
DE (1) DE102015217181A1 (fr)
TW (1) TW201714515A (fr)
WO (1) WO2017041964A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112326655A (zh) * 2020-10-26 2021-02-05 广州兴森快捷电路科技有限公司 焊接性检测方法、检测装置及存储介质
US11935221B2 (en) 2019-11-27 2024-03-19 AT&S (Chongqing) Company Limited User interface for judgment concerning quality classification of displayed arrays of component carriers

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110132960B (zh) 2018-02-09 2021-12-14 飞旭电子(苏州)有限公司 电路板组件的检测方法
US11625820B2 (en) * 2020-05-28 2023-04-11 Applied Materials Israel Ltd. Evaluating an inspection algorithm for inspecting a semiconductor specimen
CN112261866A (zh) * 2020-09-28 2021-01-22 西南电子技术研究所（中国电子科技集团公司第十研究所） 智能决策pcb质量的smt工艺预测工具

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1388738A1 (fr) * 2002-08-06 2004-02-11 Omron Corporation Méthode de production de données d'inspection et appareil d'inspection de plaquettes utilisant ce procédé
EP1578186A2 (fr) * 2004-03-01 2005-09-21 Omron Corporation Procédé et appareil d'inspection et procédé de fabrication d'un substrat muni de composants
EP1619494A1 (fr) * 2004-07-21 2006-01-25 Omron Corporation Procédé et dispositif pour inspecter un substrat

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1388738A1 (fr) * 2002-08-06 2004-02-11 Omron Corporation Méthode de production de données d'inspection et appareil d'inspection de plaquettes utilisant ce procédé
EP1578186A2 (fr) * 2004-03-01 2005-09-21 Omron Corporation Procédé et appareil d'inspection et procédé de fabrication d'un substrat muni de composants
EP1619494A1 (fr) * 2004-07-21 2006-01-25 Omron Corporation Procédé et dispositif pour inspecter un substrat

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11935221B2 (en) 2019-11-27 2024-03-19 AT&S (Chongqing) Company Limited User interface for judgment concerning quality classification of displayed arrays of component carriers
CN112326655A (zh) * 2020-10-26 2021-02-05 广州兴森快捷电路科技有限公司 焊接性检测方法、检测装置及存储介质
CN112326655B (zh) * 2020-10-26 2023-01-17 广州兴森快捷电路科技有限公司 焊接性检测方法、检测装置及存储介质

Also Published As

Publication number Publication date
DE102015217181A1 (de) 2017-03-09
TW201714515A (zh) 2017-04-16

Similar Documents

Publication Publication Date Title
WO2017041964A1 (fr) Système et procédé pour vérifier des points de brasage
EP3348125B1 (fr) Système et procédé de vérification de points de brasage
DE102013206927B4 (de) Verfahren zur Inspektion des Zustands der Benetzung mit Lot, Gerät zur automatischen optischen Inspektion, welches dieses Verfahren verwendet, sowie Leiterplatteninspektionssystem
DE112005000401B4 (de) Systeme und Verfahren zur Erfassung von Fehlern in aufgedruckter Lötpaste
US6891967B2 (en) Systems and methods for detecting defects in printed solder paste
DE69207689T2 (de) Verfahren zur Prüfung eines elektrischen Drahts im abisolierten Zustand
DE112011104725B4 (de) Lötstelleninspektionsverfahren, Leiterplatteninspektionssystem und Lötstelleninspektionsgerät
EP3070674B1 (fr) Procédé d'évaluation de qualité d'un composant fabriqué selon le procédé de fabrication additive
DE10127854B4 (de) Verfahren zur Überprüfung des Crimpzustands einer Crimpanschlußklemme und Crimpanschlußklemme hierfür
EP1212583B1 (fr) Dispositif pour inspecter une structure superficielle tridimensionnelle
DE112007002181T5 (de) Vorrichtung zur Herstellung von mit Bauteilen bestückten Leiterplatten und Verfahren zur Positionssteuerung von elektronischen Bauteilen in einer Vorrichtung zur Herstellung von mit Bauteilen bestückten Leiterplatten
DE102015110339A1 (de) Leiterplattenverzugsmessvorrichtung und leiterplattenverzugsmessverfahren derselben
DE102009017695B3 (de) Verfahren zur Inspektion von Lötstellen an elektrischen und elektronischen Bauteilen
EP0980520B1 (fr) Procede et agencement de circuits pour controler des points de soudure
DE112017007435T5 (de) Komponentenbestückungssystem und klebemitteluntersuchungsvorrichtung
DE102015212690B3 (de) Anlage und Verfahren zur Lötstellenüberprüfung
US10736221B2 (en) Circuit board assembly inspection method
DE102012207045B4 (de) Bildverarbeitungsvorrichtung und Bildverarbeitungsverfahren
WO1997017605A1 (fr) Procede et circuiterie pour tester des brasures
DE112013002024T5 (de) Farbsichtinspektionssystem und Verfahren zum Inspizieren eines Fahrzeugs
DE102005037348A1 (de) Ein Maschinensichtanalysesystem und -verfahren
DE112020005163T5 (de) Vorrichtung zur prüfung eines erscheinungsbildes und verfahren zur prüfung eines fehlers
DE102018117312A1 (de) Aufnahmevorrichtung und Verfahren zum Erkennen von Bauteilträgern in einer Aufnahmevorrichtung
DE102004001605A1 (de) Verfahren zur Prüfung von Fügegeometrien
DE102022207983A1 (de) Verfahren zur Oberflächenmontage einer Sensoreinrichtung

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16751538

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16751538

Country of ref document: EP

Kind code of ref document: A1