WO2017041710A1 - Substrat de del pour émission de lumière spatiale à angles multiples, boîtier et ampoule de lampe - Google Patents

Substrat de del pour émission de lumière spatiale à angles multiples, boîtier et ampoule de lampe Download PDF

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Publication number
WO2017041710A1
WO2017041710A1 PCT/CN2016/098301 CN2016098301W WO2017041710A1 WO 2017041710 A1 WO2017041710 A1 WO 2017041710A1 CN 2016098301 W CN2016098301 W CN 2016098301W WO 2017041710 A1 WO2017041710 A1 WO 2017041710A1
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WO
WIPO (PCT)
Prior art keywords
substrate
connecting member
led
intermediate connecting
spatial multi
Prior art date
Application number
PCT/CN2016/098301
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English (en)
Chinese (zh)
Inventor
葛铁汉
Original Assignee
葛铁汉
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201520703590.4U external-priority patent/CN205001878U/zh
Priority claimed from CN201520701365.7U external-priority patent/CN205001912U/zh
Priority claimed from CN201520703621.6U external-priority patent/CN205002061U/zh
Application filed by 葛铁汉 filed Critical 葛铁汉
Publication of WO2017041710A1 publication Critical patent/WO2017041710A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips

Definitions

  • the invention relates to an LED lighting device.
  • LED packaging methods including a LED package, a chip on board LED package, a surface mount device LED package, and a system (System In Package) LED package, etc., and different package substrates are used depending on the LED package method.
  • the substrate for chip on board LED packaging is a substrate made of a circuit board or a single material, such as metal, PVC, plexiglass, plastic, etc., and the shape is mostly a flat rectangle. , flat circular or flat strips, etc., and the edges of the substrate are usually smooth curves or straight lines.
  • the planar light is emitted, and even if the plurality of substrates are provided with the body shape, the overall structure design is not comprehensive, and it is easy to appear around the illuminator.
  • the phenomenon of uneven illumination when the substrate is a light-transmitting material, although it can emit light at 360 degrees, it usually encounters heat dissipation problems. When the substrate is an opaque material, such as metal, there is no light on the side where the LED chip is not disposed, and 360 degrees cannot be used. Azimuth illumination.
  • the existing chip on board LED package substrate and the bulb have insufficient illumination angle, can not be multi-angle, multi-level illumination, and are also prone to heat dissipation problems, affecting luminous efficiency.
  • the technical problem to be solved by the present invention is to provide an LED substrate, a package and a light bulb which are easy to dissipate heat, are easy to distribute LED chips, realize multi-level multi-color illumination, and can realize omnidirectional multi-angle illumination.
  • a spatial multi-angle light-emitting LED substrate comprising an intermediate connecting member and an outer bracket which are deployed in a plane, wherein the outer bracket is along an intermediate connecting member. a plurality of circumferentially evenly distributed, and the outer bracket is interconnected with the intermediate connecting member, the outer bracket includes a strip substrate, and the outer bracket is bendable to form a three-dimensional structure with respect to the intermediate connecting member to form a three-dimensional structure
  • the rear plurality of outer brackets are respectively located in different planes.
  • the intermediate connecting member is an annular strip substrate.
  • the outer bracket comprises a plurality of circular circumferentially extending circumferential substrates centered on the center of the intermediate connecting member, and a circular radially extending path centered on the center of the intermediate connecting member.
  • the radial substrate is connected to the ends of the circumferential substrate along a circular radial interval between the substrates centered on the center of the intermediate connecting member.
  • the radial substrate connects the circumferential substrates end to end.
  • the intermediate connecting member is a circular, polygonal annular substrate, or a circular planar substrate or a polygonal planar substrate.
  • the radial substrate and the circumferential substrate are both linear strip substrates.
  • the radial substrate is a linear strip substrate
  • the circumferential substrate is a curved substrate.
  • the intermediate connecting member comprises a plurality of staggered connecting wires, the outer brackets comprising a circular radial spaced distribution formed along a center of the intermediate connecting member and extending in a circular circumferential direction.
  • the substrate is connected between the curved substrate and the intermediate connecting member by a connecting wire.
  • the outer bracket is provided with a broken opening, and the opening is provided with a connecting member, the connecting member includes a non-conductive outer material covering the two ends of the connecting opening, and is located outside A conductive inner material within the material that does not contact each other at both ends of the opening.
  • a space multi-angle LED package having the above LED substrate, characterized in that: the outer bracket is provided with a plurality of LED chips connected in series and/or in parallel, and the plurality of LED chips are connected by a connecting line.
  • the intermediate connecting component is also provided with a plurality of LED chips connected in series and/or in parallel, and the plurality of LED chips are connected by a connecting wire.
  • a space multi-angle light-emitting LED bulb having the above-mentioned LED package comprising: a light-transmissive cover on the outer side; and a stem located in the transparent cover, wherein the stem is provided with a lead wire, and the lead wire At least one LED package is fixed thereon, and the transparent cover and the bottom of the stem are provided with an electrical connector, and the electrical connector is provided with a driver, and the lead wire is connected to the driver.
  • the invention has the advantages that the space multi-angle light emitting LED substrate, the package and the light bulb can realize the substrate arrangement of the spatial multi-angle three-dimensional structure, so that the LED chip can be disposed thereon, and the orientation is different.
  • the illuminating surface of the direction makes the illumination of the LED chip thereon more stereoscopic and easy to control.
  • FIG. 1 is a schematic view showing the spatial multi-angle LED substrate and package of the first embodiment of the present invention unfolded to a plane.
  • FIG. 2 is a schematic view showing a spatial multi-angle LED substrate and a package in a three-dimensional shape according to a first embodiment of the present invention.
  • Fig. 3 is a schematic view showing the connection of the connecting member and the outer bracket in the first embodiment of the present invention.
  • FIG. 4 is a schematic view showing the spatial multi-angle LED substrate and package of the second embodiment of the present invention unfolded to a plane.
  • FIG. 5 is a diagram showing the spatial multi-angle LED substrate and package of the third embodiment of the present invention unfolded to a plane; FIG. intention.
  • FIG. 6 is a schematic view showing the spatial multi-angle LED substrate and package of the fourth embodiment of the present invention unfolded to a plane.
  • FIG. 7 is a schematic diagram showing the spatial multi-angle LED substrate and package of the fifth embodiment of the present invention unfolded to a plane.
  • FIG. 8 is a schematic diagram of a spatial multi-angle light-emitting LED bulb according to a first embodiment of the present invention.
  • Figure 9 is a schematic illustration of a spatial multi-angle illuminated LED light bulb in accordance with a second embodiment of the present invention.
  • FIG. 1 and 2 are schematic views of an LED substrate according to a first embodiment of the present invention.
  • the LED substrate of FIG. 1 is expanded into a plane, including an intermediate connecting member 1 located in the middle, and an intermediate connecting member.
  • the outer side of 1 is surrounded by a plurality of outer brackets 2 distributed in the circumferential direction of the intermediate connecting member 1.
  • the intermediate connecting member 1 and the outer bracket 2 are of the same material, the intermediate connecting member 1 is annular, and the outer bracket 2 and the intermediate connecting member 1 are directly connected.
  • the outer bracket 2 can be bent relative to the intermediate connecting member 1 to form a three-dimensional structure, as shown in FIG. 2, in which case the plurality of outer brackets 2 are located in different planes and also in different planes with the intermediate connecting member 1. In order to form a stereo multi-angle illumination.
  • the outer bracket 2 in this embodiment is a folded-line substrate structure that is bent back and forth.
  • the intermediate connecting member 1 has a polygonal ring shape, and each side corresponds to one outer bracket 2.
  • the outer side of the outer side bracket 2 has a longer straight strip shape, that is, the outer side bracket 2 has a tendency to gradually increase toward the outer side. Therefore, as shown in FIG. 2, when the outer bracket 2 is bent relative to the intermediate connecting member 1 to form a three-dimensional structure, the radial dimension of the three-dimensional structure gradually increases from the top to the bottom, and the intermediate connecting member 1 is at the top. .
  • Both the intermediate connecting member 1 and the outer bracket 2 can be connected in series and/or a plurality of LED chips to form an LED package, thereby realizing multi-angle and multi-level illumination.
  • the material of the intermediate connecting member 1 and the outer bracket 2 may be one of metal, plexiglass, PVC, plastic, sapphire, ceramic or silica gel, or a plurality of materials of the above materials may be formed by splicing or nesting.
  • the outer bracket 2 includes a plurality of circular circumferentially extending circumferential substrates 21 centered on the center of the intermediate connecting member 1 and a radially extending radial substrate 22 extending in a circular shape, the circumferential substrate 21 A plurality of strips distributed in the radial direction are included, and the radial substrate 22 is connected to the circumferential substrate 21.
  • the circumferential substrate 21 and the radial substrate 22 are both strip-shaped substrates, and the circumferential substrate 21 and the radial substrate 22 are linear strip-shaped substrates.
  • each of the outer brackets 2 in this embodiment is provided with a connecting member 3 for forming the outer bracket 2 to be broken.
  • the outer bracket 2 is formed with a broken opening 20
  • the connecting member 3 includes an outer material 31 covering both ends of the connecting opening 20, and an inner material 32 located inside the outer material 31, the inner material 32 is not in contact with both ends of the opening 20, the outer material 31 only serves to connect the two ends of the opening 20 of the outer bracket 2 to be a non-conductive material, and the inner material 32 is a conductive material, and the conductive inner material 32 is also Can be connected to the outer bracket 2 through the connecting line
  • the LED chip is electrically connected to achieve various connection and control methods.
  • a plurality of LED chips 100 may be connected in series and/or in parallel on the strip substrate of the outer bracket 2, that is, the circumferential substrate 21 and the radial substrate 22, and a plurality of LED chips may be disposed on the intermediate connecting member 1. That is, the entire outer bracket 2 and the intermediate connecting member 1 are an integral substrate on which the LED chip 100 can be disposed to form a plurality of illumination surfaces to realize a multi-angle spatial light-emitting structure.
  • the LED chips 100 are connected by a connection line 200. As shown in FIG. 3, the LED chip 100 on the outer bracket 2 is connected to the conductive inner material 32 in the connecting member 3 through the connecting wire 200, and may not be connected to the inner material 32, thereby realizing the LED chip 100. Kind of control.
  • the LED package 100 and the connection line 200 are provided on the LED substrate to form the LED package 400.
  • the intermediate connecting member 1 in this embodiment is annular
  • the outer bracket 2 is three
  • each outer bracket 2 includes and the middle.
  • a plurality of circumferential substrates 21 arranged concentrically in a ring shape, and a radially extending path of the ring along the intermediate connecting member 1 connecting the plurality of circumferential substrates 21 and connecting the outer bracket 2 to the intermediate connecting member 1 respectively
  • the radial substrate 22 is also a strip substrate.
  • the radial substrate 22 sequentially connects both ends of the plurality of circumferential substrates 21, and the plurality of circumferential substrates 21 are sequentially connected end to end.
  • the circumferential substrate 21 is an arc-shaped substrate, and the center of the circle is located at the center of the intermediate connecting member 1, and the radial substrate 22 is a linear strip-shaped substrate.
  • a plurality of LED chips connected in series and/or in parallel may be provided on the outer bracket 2 and the intermediate connecting member 1.
  • the structure in this embodiment is basically the same as that of the LED substrate and the package structure in the first embodiment, except that the intermediate connecting member 1 has a hexagonal shape and the outer bracket 2 has six. And when the LED package is unfolded in one plane, each of the two outer brackets 2 has a small interval adjacent to each other. Also in this embodiment, a plurality of LED chips connected in series and/or in parallel may be provided on the outer bracket 2 and the intermediate connecting member 1.
  • the LED substrate and the package structure in the fourth embodiment are also substantially the same as the LED package structure of the second embodiment.
  • the intermediate connecting member 1 is annular, and the outer bracket 2 is six, each outer side.
  • the bracket 2 includes a plurality of circumferential substrates 21 disposed concentrically spaced apart from the center circular ring, and a plurality of circumferential substrates 21 are respectively connected and the outer bracket 2 is connected to the intermediate connecting member 1 at the center of the center connecting member 1 A circular radially extending radial substrate 22. And when the LED package is deployed in one plane, the spacing between each of the outer brackets 2 is small.
  • a plurality of LED chips connected in series and/or in parallel may be disposed on the outer bracket 2 and the intermediate connecting member 1.
  • the intermediate connecting member 1 includes a plurality of connecting wires 26, that is, the intermediate connecting member 1 is not necessarily a ring structure, and may be Other structures, such as a structure in which a plurality of connecting wires 26 are alternately formed, or a planar structure, may be a polygonal plane, a circular plane, or the like.
  • the outer bracket 2 is distributed in a plurality of circumferential directions centered on the center of the intermediate connecting member 1, and the outer bracket 2 includes a plurality of arc-shaped substrates 25 arranged concentrically, and two ends connecting the curved substrate 25 and the intermediate connecting member 1 Connection wire 26. Each of the outer brackets 2 may be the same or different.
  • outer brackets 2 there are six outer brackets 2, three of which include only one curved substrate 25, and the other three include two spaced apart curved substrates 25 having The outer bracket 2 of the two curved substrates 25 is spaced apart from the outer bracket having only one curved substrate 25.
  • a plurality of LED chips connected in series and/or in parallel may be disposed on the curved substrate 25.
  • the LED chips are electrically connected by a connecting line, and the LED chips at both ends of the curved substrate 25 are connected to the connecting wires 26, and further connected to the plurality of connecting wires 26 at the position of the intermediate connecting member 1, so as to realize the LED chips on the curved substrate 25.
  • Kind of control is possible to realize the LED chips on the curved substrate 25.
  • the outer bracket can also adopt other structures as long as the outer bracket includes a strip-shaped substrate on which an LED chip can be disposed.
  • the strip-shaped substrate may be a polygonal shape, or an irregularly curved strip shape, or a strip-like structure in which a plurality of structures are spliced.
  • the spatial multi-angle LED bulb of the first embodiment includes an outer transparent cover 300 and an LED package 400 located in the transparent cover 300.
  • the transparent cover 300 is disposed in the transparent cover 300.
  • a stem 500 with a lead wire 8 and a stem exhaust pipe 9 to which at least one LED package 400 is fixed, the bottom of the light transmissive cover 300 and the bottom of the stem 500 are fixed to the electrical connector 600
  • a driver 700 is disposed in the electrical connector 600, and the lead wire 8 is connected to the driver 700.
  • the sealed space formed by the light-transmitting bulb 20 is filled with a gas that protects the three-dimensional LED package and facilitates heat dissipation of the three-dimensional LED package, and the gas may be a helium gas or a hydroquinone mixture.
  • the transparent cover 300 is made of a transparent, opalescent, frosted, or colored blister, and may also be a blister partially having a reflective layer or partially having a small prism and a small lens.
  • the shape of the light transmissive cover 300 is A shape, G type, R type, PAR type, T type, candle type or other existing lamp bubble shell shape.
  • the electrical connector 90 is one of the existing electrical connectors such as E40, E27, E26, E14, GU, and the like.
  • the LED package 400 in this embodiment is the LED package in the first embodiment.
  • a schematic diagram of the LED bulb of the second embodiment includes an outer transparent cover 300 and an LED package 400 located in the transparent cover 300.
  • the transparent cover 300 is provided with a belt.
  • the lead wire 8 and the stem 500 of the stem exhaust pipe 9 are fixed on the lead wire 8 with two LED packages 400.
  • the bottom of the transparent cover 300 and the bottom of the stem 500 are fixed on the electrical connector 600.
  • a driver 700 is disposed in the electrical connector 600, and the lead wire 8 is connected to the driver 700.
  • the LED package is also the LED package in the first embodiment.
  • the spatial multi-angle light-emitting LED substrate, the package and the light bulb can realize the substrate arrangement of the spatial multi-angle three-dimensional structure, so that the LED chip can be disposed thereon, and the illumination surface facing the plurality of different directions is realized, so that the LED chip thereon
  • the illumination is more stereoscopic and easier to control.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

L'invention concerne un substrat de DEL pour une émission de lumière spatiale à angles multiples, un boîtier et une ampoule de lampe. L'invention concerne un substrat de DEL pour une émission de lumière spatiale à angles multiples, comprenant un composant de connexion intermédiaire (1) et des supports de côté externe (2), qui sont étendus et situés dans un plan, caractérisé en ce que la pluralité de supports de côté externe (2) est uniformément répartie dans la direction circonférentielle de la partie de connexion intermédiaire (1); les supports de côté externe (2) et la partie de connexion intermédiaire (1) sont mutuellement connectés; les supports de côté externe (2) comprennent un substrat en forme de bande; et les supports de côté externe (2) peuvent être pliés par rapport à la partie de connexion intermédiaire (1) pour former une structure tridimensionnelle, et les supports de côté externe de la pluralité de supports de côté externe (2) formant chacun une structure en trois dimensions sont respectivement situés dans des plans différents. Avec le substrat de DEL pour une émission de lumière spatiale à angles multiples, le boîtier et l'ampoule de lampe, un agencement de substrat d'une structure en trois dimensions spatiale à angles multiples peut être obtenu de manière à agencer une puce de DEL (100) sur celui-ci et à obtenir des faces d'éclairage dirigées dans une pluralité de directions différentes, de sorte que la puce de DEL (100) sur le substrat permette d'obtenir un degré supérieur d'émission de lumière en trois dimensions et soit facile à commander.
PCT/CN2016/098301 2015-09-11 2016-09-07 Substrat de del pour émission de lumière spatiale à angles multiples, boîtier et ampoule de lampe WO2017041710A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN201520703621.6 2015-09-11
CN201520703590.4U CN205001878U (zh) 2015-09-11 2015-09-11 一种空间多角度发光led封装
CN201520701365.7 2015-09-11
CN201520703590.4 2015-09-11
CN201520701365.7U CN205001912U (zh) 2015-09-11 2015-09-11 一种空间多角度发光led灯泡
CN201520703621.6U CN205002061U (zh) 2015-09-11 2015-09-11 一种空间多角度发光led基板

Publications (1)

Publication Number Publication Date
WO2017041710A1 true WO2017041710A1 (fr) 2017-03-16

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021083765A1 (fr) * 2019-10-31 2021-05-06 Signify Holding B.V. Agencement de filament(s) de del

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010141200A (ja) * 2008-12-12 2010-06-24 Sanyu Rec Co Ltd Ｌｅｄ光源及びその製造方法
CN203431614U (zh) * 2013-08-09 2014-02-12 冯雪珍 Led基板及采用该基板的led灯
CN203445147U (zh) * 2013-08-30 2014-02-19 冯善华 Led基板及其组成的led光源
CN203549432U (zh) * 2011-01-18 2014-04-16 松下电器产业株式会社 灯泡形灯及照明装置
CN203607409U (zh) * 2013-12-19 2014-05-21 开发晶照明（厦门）有限公司 3d集成式led光源模块
CN203848063U (zh) * 2014-05-23 2014-09-24 四川海金汇光电有限公司 防热岛效应伞形led灯丝
CN205002061U (zh) * 2015-09-11 2016-01-27 葛铁汉 一种空间多角度发光led基板
CN205001878U (zh) * 2015-09-11 2016-01-27 葛铁汉 一种空间多角度发光led封装
CN205001912U (zh) * 2015-09-11 2016-01-27 葛铁汉 一种空间多角度发光led灯泡
CN205508865U (zh) * 2016-03-07 2016-08-24 深圳市斯迈得半导体有限公司 一种可多方式弯折的多面出光的led基板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010141200A (ja) * 2008-12-12 2010-06-24 Sanyu Rec Co Ltd Ｌｅｄ光源及びその製造方法
CN203549432U (zh) * 2011-01-18 2014-04-16 松下电器产业株式会社 灯泡形灯及照明装置
CN203431614U (zh) * 2013-08-09 2014-02-12 冯雪珍 Led基板及采用该基板的led灯
CN203445147U (zh) * 2013-08-30 2014-02-19 冯善华 Led基板及其组成的led光源
CN203607409U (zh) * 2013-12-19 2014-05-21 开发晶照明（厦门）有限公司 3d集成式led光源模块
CN203848063U (zh) * 2014-05-23 2014-09-24 四川海金汇光电有限公司 防热岛效应伞形led灯丝
CN205002061U (zh) * 2015-09-11 2016-01-27 葛铁汉 一种空间多角度发光led基板
CN205001878U (zh) * 2015-09-11 2016-01-27 葛铁汉 一种空间多角度发光led封装
CN205001912U (zh) * 2015-09-11 2016-01-27 葛铁汉 一种空间多角度发光led灯泡
CN205508865U (zh) * 2016-03-07 2016-08-24 深圳市斯迈得半导体有限公司 一种可多方式弯折的多面出光的led基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021083765A1 (fr) * 2019-10-31 2021-05-06 Signify Holding B.V. Agencement de filament(s) de del

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