Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
  • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
  • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
  • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
  • G01J5/0096—Radiation pyrometry, e.g. infrared or optical thermometry for measuring wires, electrical contacts or electronic systems
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
  • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
  • G01J5/02—Constructional details
  • G01J5/0205—Mechanical elements; Supports for optical elements
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
  • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
  • H02B1/26—Casings; Parts thereof or accessories therefor
  • H02B1/30—Cabinet-type casings; Parts thereof or accessories therefor
  • H02B1/306—Accessories, e.g. windows
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
  • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
  • H02B1/26—Casings; Parts thereof or accessories therefor
  • H02B1/40—Wall-mounted casings; Parts thereof or accessories therefor
  • H02B1/42—Mounting of devices therein

Definitions

• This disclosure relates to thermal monitoring systems and assemblies. More particularly, at least one of an infrared sensor and a plurality of infrared sensors arranged in an array are employed either alone or in combination with one or more additional sensors in an electrical panel.
• the infrared sensor, the plurality of infrared sensors, and the one or more additional sensors are configured to monitor various parameters including a temperature of electrical components within the electrical panel.
• Infrared sensors can be used in a variety of applications to measure infrared light radiating from objects within a field of view of the infrared sensor.
• objects emit heat energy in the form of radiation
• infrared sensors can detect infrared wavelengths radiating from the object.
• the heat energy can indicate a temperature of the object as well as a change, such as an increase or a decrease in a temperature, of the object or a part of the object.
• electrical components e.g., circuit breakers
• a thermal monitoring system in a first example of the disclosure, includes an infrared sensor having a resolution including a plurality of pixels.
• the thermal monitoring system also includes a controller configured to create a thermal image of an area to be monitored based at least in part on the plurality of pixels of the infrared sensor.
• the thermal monitoring system includes an additional sensor including at least one of a current transformer and an ambient temperature sensor configured to respectively determine at least one of a current and an ambient temperature with respect to the area to be monitored;
• the infrared sensor is arranged inside an electrical panel, and the area to be monitored includes an electrical component located within the electrical panel;
• the thermal monitoring system further includes a plurality of infrared sensors arranged in an array, wherein each of the plurality of infrared sensors has a resolution including a plurality of pixels, the area to be monitored includes an entire area within the electrical panel including a plurality of electrical components located within the electrical panel, and the controller is configured to create a thermal image of the entire area to be monitored based at least in part on the plurality of pixels of each of the plurality of infrared sensors; the controller is further configured to digitally overlay the thermal image onto a visual representation of the area to be monitored; the visual representation of the area to be monitored includes at least one of a picture of the area to be monitored,
• a thermal monitoring assembly includes an electrical panel including a plurality of electrical components located within the electrical panel; a plurality of infrared sensors arranged in an array, wherein each of the plurality of infrared sensors has a resolution including a plurality of pixels, wherein the array is located inside the electrical panel; an additional sensor located inside the electrical panel configured to determine additional data with respect to an area to be monitored; and a controller configured to map each of the plurality of pixels of each of the plurality of infrared sensors to a corresponding plurality of points, wherein each of the plurality of infrared sensors is configured to determine a temperature at each of the corresponding plurality of points, and each of the corresponding plurality of points is located within the area to be monitored, wherein the area to be monitored is located inside the electrical panel and includes the plurality of electrical components, and wherein the controller is further configured to determine a characteristic of the electrical panel based at least in part on the temperature and the additional data.
• the additional sensor is at least one of a current transformer configured to measure a current of the plurality of electrical components and an ambient temperature sensor configured to measure an ambient temperature with respect to the area to be monitored; the controller is further configured to at least one of report and analyze the characteristic to at least one of diagnose and predict at least one of a status or problem of the electrical panel; the controller is configured to create a thermal image of the area to be monitored based at least in part on the temperature at each of the corresponding plurality of points; the controller is configured to associate the temperature at each of the corresponding plurality of points with the area to be monitored, and the controller is configured to create a composite thermal map including the thermal image and a visual representation of the area to be monitored; the visual representation of the area to be monitored includes a visual representation of the electrical components, and the controller is configured to create the composite thermal map by digitally overlaying the thermal image onto the visual representation of the electrical components; the thermal monitoring assembly also includes a monitor and the controller is configured to at least one of display the thermal image on
• a method of monitoring a temperature of a plurality of electrical components located inside an electrical panel includes providing a plurality of infrared sensors arranged in an array inside the electrical panel, wherein each of the plurality of infrared sensors has a resolution including a plurality of pixels; and mapping each of the plurality of pixels from each of the plurality of infrared sensors to a corresponding plurality of points, wherein each of the corresponding plurality of points is located within an area to be monitored, and the area to be monitored is located inside the electrical panel and includes the plurality of electrical components.
• the method further includes determining a temperature at each of the corresponding plurality of points and creating a thermal image of the area to be monitored based at least in part on the temperature at each of the corresponding plurality of points; the method further includes providing an additional sensor inside the electrical panel, where the additional sensor is configured to determine additional data with respect to the area to be monitored; the method further includes creating a composite thermal map of the area to be monitored including digitally overlaying the thermal image onto at least one of a picture of the area to be monitored, a wireframe drawing of the area to be monitored, a block diagram of the area to be monitored, and a photograph of the area to be monitored; and/or the method further includes identifying at least one of the plurality of electrical components in the composite thermal map based at least in part on at least one of the temperature of at least one of the corresponding plurality of points and the additional data.
• a thermal monitoring system includes a thermal monitoring device and an electrical panel, wherein the thermal monitoring device comprises an infrared sensor arranged inside the electrical panel, and wherein the infrared sensor is configured to sense a temperature of one or more electrical components located within the electrical panel, wherein the infrared sensor has a resolution comprising a plurality of pixels; and wherein the thermal monitoring system further comprises a controller, wherein the controller is configured to create a thermal image of an area to be monitored based at least in part on the plurality of pixels of the infrared sensor.
• the thermal monitoring device is positioned at an angle with respect to a front face of an interior of the electrical panel, the front face comprising the one or more electrical components; the thermal monitoring device is configured to be rotatable with respect to a front face of an interior of the electrical panel, the front face comprising the one or more electrical components; the thermal monitoring device is configured to be translatable with respect to a front face of an interior of the electrical panel, the front face comprising the one or more electrical components; and/or the thermal monitoring system further includes a guide along which the thermal monitoring device is configured to translate.
• a method of monitoring a temperature of one or more electrical components located inside an electrical panel includes providing a thermal monitoring device comprising an infrared sensor inside the electrical panel, wherein the infrared sensor has a resolution comprising a plurality of pixels; and mapping each of the plurality of pixels from the infrared sensor to a corresponding plurality of points, wherein each of the corresponding plurality of points is located within an area to be monitored, and wherein the area to be monitored is located inside the electrical panel and comprises the one or more electrical components.
• the method further includes determining a temperature at each of the corresponding plurality of points, and creating a thermal image of the area to be monitored based at least in part on the temperature at each of the corresponding plurality of points; the method further includes positioning the thermal monitoring device at an angle with respect to a front face of an interior of the electrical panel, the front face comprising the one or more electrical components; the method further includes rotating the thermal monitoring device with respect to a front face of an interior of the electrical panel, the front face comprising the one or more electrical components; and/or the method further includes translating the thermal monitoring device with respect to a front face of an interior of the electrical panel, the front face comprising the one or more electrical components.
• FIG. 1 is an illustration of an example thermal monitoring system arranged in an electrical panel as described herein;
• FIG. 2 is an illustration of an example thermal monitoring array including a plurality of infrared sensors and one or more additional sensors as described herein;
• FIG. 3 is an illustration of an infrared sensor as described herein;
• FIG. 4 is an illustration of electrical components within an electrical panel as described herein;
• FIG. 5 is an illustration of the electrical components within an electrical panel shown in FIG. 4 having a temperature profile determined by the example thermal monitoring arrays as described herein;
• FIG. 6 is an illustration of an electrical component shown in FIG. 5 having a temperature profile determined by the example thermal monitoring arrays as described herein;
• FIG. 7 is another illustration of the electrical components within an electrical panel shown in FIG. 4 having a temperature profile determined by the example thermal monitoring arrays as described herein;
• FIG. 8 is another illustration of the electrical components within an electrical panel shown in FIG. 4 having a temperature profile determined by the example thermal monitoring arrays in accordance with embodiments described herein;
• FIG. 9 is an illustration of an example user interface displaying a temperature profile of electrical components within an electrical panel as described herein.
• FIG. 10 is an illustration of a top view of a first example thermal monitoring device as arranged at various angles in accordance with embodiments described herein;
• FIG. 11 is an illustration of a top view of a second example thermal monitoring device as arranged at various angles in accordance with embodiments described herein;
• FIG. 12 is an illustration of a top view of a third example thermal monitoring device as arranged at various angles in accordance with embodiments described herein.
• Electrical panels can be installed or mounted in any one or more of a variety of locations and environments where electrical components are used, including, but not limited to, commercial and residential buildings, factories, industrial plants, and other structures or locations having electrical components.
• Infrared (IR) sensors can be placed inside such electrical cabinets or panel boards and used to remotely monitor hotspots within the cabinet or board.
• Hotspots can include regions where an increase in temperature of a wire, connector, or other electrical component (e.g. switchgear) occurs.
• an electrical load that draws excess current can generate heat.
• Corroded or loose contacts that increase contact resistance can also cause heating of the electrical components.
• Monitoring the cabinet or board for such heat can help to reduce maintenance costs and can also provide the ability to detect problem areas, wires, connectors, or other electrical components before failure or other faults occur.
• a thermal monitoring system 100 is arranged inside an electrical panel 200.
• the thermal monitoring system 100 includes one or more arrays 105 of thermal monitoring devices, examples of which are shown in FIGS. 2 and 3 and discussed in detail below.
• the electrical panel 200 includes a cabinet 205 that houses a plurality of electrical components 230 (e.g., circuit breakers, wires, transistors, diodes, receivers, circuits, semiconductors, resistors, capacitors, transducers, antennas, terminals, connectors, cables, switches, and any other electrical or mechanical components or devices).
• the electrical panel 200 can include a connection point 250 configured to provide input and output connection to and from the electrical panel 200, respectively.
• the electrical panel 200 can be connected to a main power source (e.g., input connection) and distribute the main power to various components connected to the electrical power (e.g., output connection or connections).
• the electrical panel 200 can include a door 210 configured to selectively provide and restrict access to an interior 245 of the electrical panel 200.
• the array 105 can be arranged on the door 210, either permanently or releasably detachable, such that each infrared sensor 115 of the plurality of infrared sensors 110, or other device of the array 105, faces the interior 245 of the electrical panel 200 when the door 210 is arranged to restrict access to the interior 245 of the electrical panel 200 (e.g., when the door 210 is closed).
• the array 105 can be mounted in the electrical cabinet 200 using a bracket or other structural mount or frame that is separate from and not connected to the door 210.
• a single infrared sensor 1 15 can be employed.
• the thermal monitoring assembly 101 and the thermal monitoring system 100 can be employed without having to open or access the electrical panel 200.
• the thermal monitoring system 100 can be configured to determine a position of the door 210 with respect to the interior 245 of the electrical panel 200.
• the thermal monitoring system 100 can be configured to monitor whether the door 210 of the electrical panel 200 is open or closed to ensure proper closure of safety critical equipment.
• the thermal monitoring system 100 can detect the existence of a gap or opening between the door 210 and the interior 245 of the electrical panel 200.
• a gap or opening may be desirable to, for example, permit heat to escape the interior 245 of the electrical panel 200.
• the electrical panel 200 can also be configured to be explosion-proof such that in the event of an explosion interior to or exterior to the electrical panel 200, the explosion can be respectively retained within the interior 245 of the electrical panel 200 or prevented from entering the interior 245 of the electrical panel 200.
• the electrical panel 200 it may be desirable to determine that the door 210 is properly closed to restrict access to the interior 245 of the electrical panel 200.
• a thermal image of the area to be monitored 215 (e.g., the entire area 220 to be monitored) can be created irrespective of the particular electrical components 230 located within the electrical panel 200.
• a controller 300 can be configured to display the thermal image on a monitor 400 or other communication interface (e.g., computer, tablet, cellular phone, or any other electronic or visual display or screen)
• each array 105 of the thermal monitoring system 100 can include at least one of an infrared sensor 115 (or a plurality of infrared sensors 110 as shown in FIG. 2) and/or other thermal monitoring devices. While the thermal monitoring system 100 is described herein with respect to arrays 105 of devices, it should be understood that the scope of this disclosure is not limited to arrangement in an array. Rather, the thermal monitoring devices of the discussed arrays may be arranged in any number or in any geographic pattern. In other words, the array 105 can include any number infrared sensors 115 or other devices arranged in any pattern, orientation, or configuration. For example, a cascaded array as illustrated in FIG. 1 may be desirable for application where the area to be monitored is rectangular.
• the array 105 can have any shape or arrangement including arrangements not explicitly disclosed herein.
• Each infrared sensor 115 (shown in FIG. 3) of the plurality of infrared sensors 110 has a resolution of a plurality of pixels.
• the controller 300 can be further configured to create the thermal image (e.g., as shown in FIGS. 5-8) of an area to be monitored 215 based at least in part on at least one of the plurality of pixels of each infrared sensor 115 and the plurality of pixels of each infrared sensor 115 of the plurality of infrared sensors 110.
• the thermal monitoring devices other than infrared sensors can (schematically illustrated as additional sensors 150, in FIG. 2) include current transformers or ambient temperature sensors as well as other sensors not explicitly disclosed herein.
• the one or more additional sensors 150 can be associated with one or more of the plurality of infrared sensors 110 or can be disposed adjacent to or within the electrical panel 200 to sense, for example, over-current situations where one or more of the plurality of electrical components 230 is experiencing a current that is above a threshold current.
• An ambient temperature sensor can be used to determine a temperature of an environment in which the electrical panel 200 is employed such that a comparison or determination to differentiate whether a temperature is attributable to an overheating of one or more of the plurality of electrical components 230 or a generally increased ambient temperature from the surrounding environment. Based at least on data measured, detected, or otherwise determined by the additional sensor 150 (e.g. a temperature, a current, or other data point), the thermal monitoring system 100 can be configured to report or analyze the data to predict or diagnose a status or problem of the electrical panel.
• the additional sensor 150 e.g. a temperature, a current, or other data point
• the area to be monitored 215 includes an electrical component 225 located within the electrical panel 200.
• the area to be monitored 215 includes an entire area 220 within the electrical panel 200 including a plurality of electrical components 230 located within the electrical panel 200.
• the area to be monitored can include any portion and any portion size in the interior of the electrical panel, for example, the area can include a plurality of electrical components.
• the thermal monitoring system 100 can therefore provide a full diagnostic assessment of the electrical panel 200 including the plurality of electrical components 230.
• a specific issue e.g. over- current, excessive ambient temperature, a loose connection, a corroded or poor connection, and high resistance
• other specific issues e.g. over-current, excessive ambient temperature, a loose connection, a corroded or poor connection, and high resistance.
• unsafe or unreliable conditions within the electrical panel 200 can be identified and addressed based at least in part on the particular specific issue or issues that are detected.
• thermal monitoring system 100 are described herein as being employed with respect to an electrical panel 200, other applications of thermal monitoring exist for the thermal monitoring system 100.
• the thermal monitoring system 100 can be used to monitor a temperature of any object or objects that emit heat energy. Because any object with a temperature above absolute zero emits heat energy in the form of radiation, the thermal monitoring system 100 disclosed herein has a variety of applications that are within the scope of the present disclosure, including those not explicitly described herein.
• a wired or wireless connection between any one or more of the components disclosed herein is contemplated.
• the controller 300 can communicate via a wired or wireless connection with the thermal monitoring system 100.
• the thermal monitoring system 100 can communicate via a wired or wireless connection with the monitor 400. Such communication can occur at any distance, including remote communication transmitted over a network or other system. Any one or more of the components and features of the thermal monitoring system 100 can be configured to operate manually or automatically as well as one time, periodically, or continuously.
• FIG. 2 an example infrared sensor 115 of the array 105 of the thermal monitoring system 100 are shown.
• the infrared sensor 115 can be electronically mounted onto a circuit board 140 (e.g., printed circuit board or PCB).
• the circuit board 140 can include one or more additional components (e.g., a driver 130) configured to power or communicate with each of the infrared sensors 115 as well as electrical connections and terminals configured to electrically connect with each infrared sensor 115 of the plurality of infrared sensors 110.
• additional components e.g., a driver 130
• the infrared sensor 115 includes a main body 116 that houses sensor electronics (not shown) to which terminals 117 that connect the infrared sensor 115, including the sensor electronics to the circuit board 140, are attached.
• the infrared sensor 115 includes a sensor face 118, which can include a lens or filter, through which infrared radiation enters.
• the sensor face 118 or faces in a plurality or array of sensors, preferably faces the interior of the electrical panel 200.
• the infrared sensor 115 detects infrared radiation emitted or reflected from an object, for example, electrical components 230 in the electrical panel.
• the infrared sensor 115 can be any suitable infrared sensor known in the art or otherwise available, including those infrared sensors not explicitly disclosed herein.
• a MELEXIS® brand infrared sensor can output 64 pixels (e.g., 16 x 4 pixel resolution) and can cover a 60 degree field of view.
• an array e.g., 7 sensors wide by 1 sensor tall
• a continuous 112 x 4 pixel resolution array can be created.
• a field of view of the infrared sensor 115 can be approximately 3 inches.
• each infrared sensor 115 of the plurality of infrared sensors 110 arranged in an array 105 can have approximately 5 x 4 pixel resolution dedicated to each electrical component 225 (e.g., circuit breaker).
• the specific pixel resolution dedicated to each electrical component 225 can be more or less than the specific example disclosed herein and can include other pixel resolutions including those not explicitly described herein. It is to be understood that by distributing each infrared sensor 115 of the plurality of infrared sensors 110 in an array 105 that a field of view otherwise unable to be achieved with, for example, traditional infrared cameras can be achieved.
• a wide angle lens e.g.
• an array 105 including a plurality of infrared sensors 110, wherein each of the infrared sensors 115 includes a plurality of pixels, can detect infrared radiation emitted or reflected from one or more objects.
• the controller 300 is configured to map each of the plurality of pixels of each infrared sensor 115 of the plurality of infrared sensors 110 to a corresponding plurality of points (e.g., locations or coordinates) within the area to be monitored 215 (e.g., the entire area 220 to be monitored). Furthermore, each infrared sensor 115 of the plurality of infrared sensors 110 is configured to determine a temperature (e.g., an absolute temperature or a relative temperature) at each of the corresponding plurality of points. The controller 300 is configured to create a thermal map (e.g., as shown in FIGS. 5-8) of the area to be monitored 215 based at least in part on the temperature at each of the corresponding plurality of points.
• a thermal map e.g., as shown in FIGS. 5-8
• the plurality of electrical components 230 within the electrical panel 200 has a uniform temperature profile 500 (schematically illustrated by boundary 500 as a monitored area). That is, the temperature at any one given point (e.g. pixel) does not exceed a threshold temperature (e.g., a temperature at which degradation to the plurality of electrical components 230 may occur) although the temperature at any one given point (e.g. pixel) may be different.
• a threshold temperature e.g., a temperature at which degradation to the plurality of electrical components 230 may occur
• an increased temperature profile 505 (schematically illustrated by boundary 505) where a temperature at a particular one or more locations (e.g., location 510) is at or above the threshold temperature (e.g., a temperature at which degradation to the plurality of electrical components 230 may occur).
• the controller 300 is configured to associate the temperature at each of the corresponding plurality of points with the area to be monitored 215 (e.g., the entire area 220 to be monitored). For example, as illustrated in FIG. 6, with respect to the electrical panel 200, if a circuit breaker 600 has a loose connection 601, there can be a point of increased resistance that can cause increased or excessive heating over time.
• the connection can, for example, become loosened or corroded over time or can become loosened due to improper installation, maintenance, or replacement, rendering the circuit breaker 600 or the connection 601 faulty.
• the heat generated inside the faulty circuit breaker 600 or connection 601 will cause the circuit breaker 600 and any connected wires 605 or electrically conductive components to have a temperature that is disproportionate to (e.g., greater than) a temperature of other circuit breakers (e.g., other circuit breaker 610) within the electrical panel 200 with, for example, better electrical connections.
• the circuit breaker 600 and any connected wires 605 or electrically conductive components can have first, second, and third temperature profiles (schematically illustrated with reference numerals 625, 630, and 635, respectively) where the first temperature profile 625 is greater than the second temperature profile 630, which is greater than the third temperature profile 635.
• the faulty circuit breaker 600, wire 605, or connection 601 can be identified and appropriate correction (e.g., maintenance, repair, or replacement) can be performed.
• appropriate correction e.g., maintenance, repair, or replacement
• a maintenance interval with respect to the plurality of electrical components 230 can be extended, and potential safety concerns arising from faulty electrical components or connections can be corrected, prevented, or otherwise identified.
• the controller 300 is configured to create a composite thermal map 700 including a thermal image 705 and a visual representation 710 (e.g., a picture, a wireframe drawing, a block diagram, a photograph, a model, a computer or software generated image, a simplified block diagram, a graphic, rendering, schematic, or other visual or pictorial representation or depiction) of the area to be monitored 215 (e.g., the entire area 220 to be monitored).
• the visual representation 710 can also be generated based at least in part on a catalog, product, model, or serial number of the electrical panel 200, including a known or predetermined configuration of the plurality of electrical components 230 therein.
• the visual representation 710 of the area to be monitored 215 includes a photograph 805 (schematically illustrated in FIG. 8) of the plurality of electrical components 230, including the electrical component 225.
• a visual representation 710 can be stored electronically within a memory of the controller 300, or other memory either local to or remote from the thermal monitoring system 100.
• the controller 300 is configured to digitally overlay the thermal image 705 onto the visual representation 710 of the area to be monitored 215.
• thermal image 705 and/or data extracted from the thermal image 705 can be used individually or solely without associating the thermal image 705 and/or the data extracted from the thermal image 705 with the visual representation 710 and/or data extracted from the visual representation 710.
• the visual representation 710 of the area to be monitored 215 includes a photograph 805 (schematically illustrated in FIG. 8) of the plurality of electrical components 230, including the electrical component 225.
• the photograph 805 can be a snapshot produced with a standard optical or visual-light camera.
• the photograph 805 can be taken prior to installation of the electrical panel 200.
• One or more optical cameras (not shown) can be arranged inside the electrical panel 200 or integrated with one or more of each of the infrared sensors 115 of the plurality of infrared sensors 110 arrange in the array 105 and can capture one or more photographs (e.g., photograph 805) of the area to be monitored 215.
• the one or more photographs can capture structural details or other visual information associated with one or more of the plurality of electrical components 230 and can represent actual physical components present in the electrical panel 200.
• the visual representation 710 can provide a consistent and recognizable image upon which the thermal image 705 can be digitally overlaid.
• a user e.g., a person, computer, or other device
• a user can identify a temperature at a single point as well as a temperature profile of one or more of a specific structural detail or other visual information associated with one or more of the plurality of electrical components 230.
• a spatial or geographic coordinate of each infrared sensor 115 can be known, assigned, or otherwise determined and associated with one or more features of the thermal image 705.
• the controller 300 can be configured to patch or stitch together a plurality of adjacent images from each infrared sensor 115 of the plurality of infrared sensors 110 to produce a combined thermal image from the plurality of adjacent thermal images.
• the controller 300 can compensate for pixel overlap or gap between one or more of the plurality of adjacent thermal images when patching or stitching together the plurality of adjacent images to produce an improved combined thermal image.
• the combined thermal image is thus formed from the plurality of pixels from each infrared sensor 115 of the plurality of infrared sensors 110 arranged in an array 105.
• the controller 300 can be configured to perform additional manipulation or calculations with any information obtained with the one or more infrared sensors 115 of the plurality of infrared sensors 110.
• the controller 300 can store (e.g., save) data and information, perform image processing or rendering functions to correct or enhance the thermal images, provide status alerts or warnings, disable or adjust an operation of one or more of the plurality of electrical components 230 as well as other functions including those not explicitly disclosed herein.
• controller 300 could be integral to one or more of the infrared sensors 115 or to the plurality of infrared sensors 110 arranged in an array 105 as well as to the one or more additional sensors 150. Further, the controller 300 could be integral to the electrical panel 200, the monitor 400, or any other component of the thermal monitoring assembly 101 and the thermal monitoring system 100. Additionally, the controller 300 can include any one or more of a microcontroller, programmable logic controller (PLC), discrete controller, circuit, computer, or other controller.
• PLC programmable logic controller
• the controller 300 can be configured to display the thermal image 705 on a monitor 400 or other communication interface.
• the controller 300 can display the thermal image (e.g., the composite thermal map 700 or the realistic composite thermal map 800) on a user interface 900 (e.g., an active, passive, or interactive user interface) having a representation of the one or more electrical components identified as exceed a temperature threshold.
• a user interacting with the user interface 900 would visually see that circuit breaker 901 (corresponding to "15 LOAD 3") requires attention (e.g. repair, replacement, or other maintenance).
• thermal monitoring devices and arrays will now be described with the understanding that each of the examples can be included with each other and/or any one or more features of the thermal monitoring system 100 described above, as well as any other features including those features not explicitly disclosed herein.
• FIG. 10 a top view of the first example thermal monitoring device or array 1000 is shown connected to the controller 300 and the monitor 400, as described above.
• the first example device or array 1000 is positioned or mounted at an angle with respect to a front face of the interior 245 of the electrical panel 200.
• the first example thermal monitoring device or array 1000 is arranged at an angle 175 (e.g. 30 degrees, within a range of 1-30 degrees, 30-45 degrees, greater than 45 degrees, or any other angle) about a plane 176 that is parallel to the front face of the interior 245 of the electrical panel 200.
• the plane 176 can be parallel to, for example, the door (not shown) of the electrical panel 200.
• the first example device or array 1000 When the first example device or array 1000 is positioned or mounted at an angle 175 with respect to the electrical components 225 (e.g. a first switchgear 225a, a second switchgear 225b, a third switchgear 225c, a fourth switchgear 225d, and a fifth switchgear 225e) to be monitored, the first example device or array 1000 can cover a larger area and therefore monitor more electrical components 225 than a device or array (e.g. device or array 1000a schematically illustrated in dashed lines) that is, for example, not positioned or mounted at an angle with respect to the electrical panel 200 and the electrical components 225 to be monitored.
• a device or array e.g. device or array 1000a schematically illustrated in dashed lines
• a field of view 177 of the first example thermal monitoring device or array 1000 that is positioned at an angle 175 is increased with respect to the area and electrical components 225 to be monitored without compromising pixel resolution.
• the field of view 177 of the first example thermal monitoring device or array 1000 covers (e.g. monitors or distinguishes) four electrical components 225, including the first switchgear 225a, the second switchgear 225b, the third switchgear 225c, and the fourth switchgear 225d, as compared to a field of view 117' of the device or array 1000a which covers three electrical components 225, including the third switchgear 225c, the fourth switchgear 225d, and the fifth switchgear 225e.
• the first example thermal monitoring device or array 1000 by mounting the first example thermal monitoring device or array 1000 at an angle 175, fewer thermal monitoring devices are required to monitor a comparative area.
• the specific number and arrangement of electrical components 225 is provided for exemplary purposes and is not intended to limit the number or arranged of electrical device to be monitored by the first example thermal monitoring device or array 1000 that is positioned or mounted at an angle with respect to the electrical panel 200.
• the first example thermal monitoring device or array 1000 can be positioned or mounted at an angle 175 using any fastener, hardware, or other structural component configured to support the first example thermal monitoring device or array 1000 at the angle 175.
• FIG. 11 a top view of the second example thermal monitoring device or array 1100 is shown connected to the controller 300 and the monitor 400, as described above.
• the second example thermal monitoring device or array 1100 is attached to a rail, moveable head, or other mounting hardware 180 and is configured to rotate or swivel with respect to a front face of the interior 245 of the electrical panel 200 as illustrated by arrows 181.
• various rotated positions of the second example thermal monitoring device or array 1100 are shown using dashed lines including a first rotated position 1100a, a second rotated position 1100b, a third rotated position 1100c, and a fourth rotated position 1 lOOd.
• a corresponding field of view of the second example thermal monitoring device or array 1100 is illustrated as field of view 178 corresponding to a non-rotated position, where the second example thermal monitoring device or array 1100 is parallel with the plane 176 that is parallel to a front face of the interior 245 of the electrical panel 200.
• the field of view of the second example thermal monitoring device or array 1100 also rotates.
• a first rotated field of view 178 corresponding to the first rotated position 1100a, a second rotated field of view 178b corresponding to the second rotated position 1100b, a third rotated field of view 178c corresponding to the third rotated position 1100c, and a fourth rotated field of view 178d corresponding to the fourth rotated position HOOd are provided.
• the second example thermal monitoring device or array 1100 can cover a larger area and therefore monitor more electrical components 225 than, for example, a stationary device that does not rotate. It is to be understood that the various rotated position of the second example thermal monitoring device or array 1100 are exemplary of examples of non-limiting rotated positions.
• a stepper motor, actuator, servo, or other mechanism may be used to control the rotation of the second example thermal monitoring device or array 1100 about the mounting hardware 180.
• the rotation can be controlled in predetermined increments (e.g. 10 degrees, 20 degrees, 30 degrees, or any other angle) to cover (e.g. monitor or distinguish) five electrical components 225, including the first switchgear 225a, the second switchgear 225b, the third switchgear 225c, the fourth switchgear 225d, and the fifth switchgear 225e.
• the second example thermal monitoring device or array 1100 when in the first rotated position 1100a, can cover the first switchgear 225a and the second switchgear 225b— corresponding to the first rotated field of view 178a.
• the second example thermal monitoring device or array 1100 can cover the first switchgear 225a, the second switchgear 225b, and the third switchgear 225c— corresponding to the second rotated field of view 178b.
• the second example thermal monitoring device or array 1100 can cover the second switchgear 225b, the third switchgear 225c, and the fourth switchgear 225d— corresponding to field of view 178.
• the second example thermal monitoring device or array 1100 When in the third rotated position 1100c, the second example thermal monitoring device or array 1100 can cover the third switchgear 225c, the fourth switchgear 225d, and the fifth switchgear 225e— corresponding to the third rotated field of view 178c. Likewise, when in the fourth rotated position HOOd, the second example thermal monitoring device or array 1100 can cover the fourth switchgear 225d and the fifth switchgear 225e— corresponding to the fourth rotated field of view 178d.
• the second example thermal monitoring device or array 1100 by configuring the second example thermal monitoring device or array 1100 to be pivotable or rotatable with respect to the electrical panel 200, fewer thermal monitoring devices and/or arrays are required to fully monitor a comparative area. It is to be understood that the specific number and arrangement of electrical components 225 is provided for exemplary purposes and is not intended to limit the number or arrangement of electrical devices and/or arrays to be monitored by the second example thermal monitoring device or array 1100 that is configured to be pivotable or rotatable with respect to the electrical panel 200.
• the second example thermal monitoring device or array 1100 can be positioned or mounted in a pivotable or rotatable configuration using any fastener, hardware, or other structural component such that the second example thermal monitoring device or array 1100 is rotatable with respect to the electrical panel 200.
• FIG. 12 a top view of the third example thermal monitoring device or array 1200 is shown connected to the controller 300 and the monitor 400, as described above.
• the third example thermal monitoring device or array 1200 is mounted to a rail or guide 185 and is linearly moveable along the guide 185 as shown by arrow 183.
• the guide 185 can include a stepper motor (schematically illustrated as motor 186) configured to linearly translate the third example thermal monitoring device or array 1200 with respect to the front face of the interior 245 of the electrical panel 200.
• a belt 188 and pulley 187 assembly may also be used to translate the third example thermal monitoring device or array 1200.
• a threaded screw and linear support bar system assembly may be used to translate the third example thermal monitoring device or array 1200, including the guide 185 in a horizontal direction (e.g. arrow 183) and/or a vertical direction (e.g. in and out of the plane of the paper) to adjust an elevation of the guide 185 and third example thermal monitoring device or array 1200.
• a threaded screw and linear support bar system assembly may be used to translate the third example thermal monitoring device or array 1200, including the guide 185 in a horizontal direction (e.g. arrow 183) and/or a vertical direction (e.g. in and out of the plane of the paper) to adjust an elevation of the guide 185 and third example thermal monitoring device or array 1200.
• one rotation of the threaded screw can translate the third example thermal monitoring device or array 1200 along the guide 185 or along the linear support bar system a predetermined distance.
• the third example thermal monitoring device or array 1200 can be translated vertically and/or horizontally to cover an entire area or a portion of an entire
• the third example thermal monitoring device or array 1200 can have a field of view 182 that covers an area to be monitored.
• multiple electrical components 225 can be covered (e.g. monitored or distinguished), including the first switchgear 225a, and the second switchgear 225b, the third switchgear 225c, the fourth switchgear 225d, and the fifth switchgear 225e.
• the third example thermal monitoring device or array 1200 can be translatable with respect to the electrical panel 200.
• the specific number and arrangement of electrical components 225 is provided for exemplary purposes and is not intended to limit the number or arrangement of electrical device to be monitored by the third example thermal monitoring device or array 1200 that is configured to be translatable with respect to the electrical panel 200.
• the third example thermal monitoring device or array 1200 can be positioned or mounted a translatable configuration using any fastener, hardware, or other structural component such that the third example thermal monitoring device or array 1200 is translatable with respect to the electrical panel 200.
• any one or more features of any one or more of the thermal monitoring system 100, the thermal monitoring array 105, the first example thermal monitoring device or array 1000, the second example thermal monitoring device or array 1100, and the third example thermal monitoring device or array 1200, can be combined together to form a hotspot monitoring system in accordance with the examples disclosed herein.
• a method of monitoring a temperature of a plurality of electrical components 230 located inside an electrical panel 200 includes providing one or more thermal monitoring devices 105, 1000, 1100, 1200 inside the electrical panel 200.
• Each of the one or more thermal monitoring devices or arrays 105, 1000, 1100, 1200 can include an infrared sensor 115 with a resolution including a plurality of pixels.
• the method further includes mapping each of the plurality of pixels from each infrared sensor 115 to a corresponding plurality of points.
• Each of the corresponding plurality of points is located within an area to be monitored 215.
• the area to be monitored 215 is located inside the electrical panel 200 and includes an electrical component 225 (e.g.
• the method can include mounting or positioning the one or more thermal monitoring devices or arrays 105, 1000, 1100, 1200 at an angle with respect to the electrical panel 200, configuring the one or more thermal monitoring devices or array 105, 1000, 1100, 1200 to be pivotable or rotatable with respect to the electrical panel 200, and configuring the one or more thermal monitoring devices or array 1200 105, 1000, 1100, 1200 to be translatable with respect to the electrical panel.
• the method also includes determining a temperature at each of the corresponding plurality of points and creating a thermal image (shown in FIGS. 5-8) of the area to be monitored 215 (e.g., the entire area 220 to be monitored) based at least in part on the temperature at each of the corresponding plurality of points.
• the method includes providing an additional sensor 150 inside the electrical panel 200.
• the additional sensor 150 is configured to determine additional data with respect to the area to be monitored 215 (e.g., the entire area 220 to be monitored).
• the method includes creating a composite thermal map (shown in FIGS. 5-8) of the area to be monitored 215 including digitally overlaying the thermal image onto a picture of the area to be monitored.
• the method also includes identifying at least one of the plurality of electrical components 230 in the composite thermal map based at least in part on at least one of the temperature of at least one of the corresponding plurality of points and the additional data.

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• 2016
  • 2016-09-02 WO PCT/US2016/050042 patent/WO2017040886A1/en active Application Filing
  • 2016-09-02 DE DE112016003422.9T patent/DE112016003422T5/de active Pending
  • 2016-09-02 CA CA2996636A patent/CA2996636C/en active Active
  • 2016-09-02 MX MX2018002464A patent/MX2018002464A/es unknown

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