WO2017039083A1 - 적외선 온도 측정 방식을 이용한 패치형 온도계 - Google Patents

적외선 온도 측정 방식을 이용한 패치형 온도계 Download PDF

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Publication number
WO2017039083A1
WO2017039083A1 PCT/KR2016/000157 KR2016000157W WO2017039083A1 WO 2017039083 A1 WO2017039083 A1 WO 2017039083A1 KR 2016000157 W KR2016000157 W KR 2016000157W WO 2017039083 A1 WO2017039083 A1 WO 2017039083A1
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WO
WIPO (PCT)
Prior art keywords
temperature
substrate
infrared
heat
sensing device
Prior art date
Application number
PCT/KR2016/000157
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
엄성수
오준재
윤여은
이태진
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020150125832A external-priority patent/KR102457451B1/ko
Priority claimed from KR1020150125834A external-priority patent/KR20170028783A/ko
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to CN201690001134.8U priority Critical patent/CN208818370U/zh
Publication of WO2017039083A1 publication Critical patent/WO2017039083A1/ko

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/01—Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02—Means for indicating or recording specially adapted for thermometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Definitions

  • the present invention relates to a patch thermometer and a temperature sensing device included in the patch thermometer.
  • the present invention utilizes a medium having high thermal conductivity so as to measure a temperature using infrared rays or to more efficiently sense heat emitted from an object in implementing a patch-type thermometer that is easily adhered to an object, particularly a human skin. It relates to a patch-type thermometer and a temperature sensing device included therein.
  • body temperature depends on the body's immunity and should be measured and managed accurately because it is an important measure in determining whether or not there is abnormal health.
  • the temperature of the body tells the state of the body is very important in the health of the infant.
  • the conventional barometric thermometer has been used a lot of bar-type thermometer because of less detection error and lower cost than other thermometers.
  • this conventional bar scale thermometer has the inconvenience of having to stand in the armpit of the subject and wait for a long time due to the glass rod shape, and fixed to the armpit because the body temperature measurement subject unconsciously or withstand the long wait time When the old thermometer was released, various problems such as the measurement of temperature became impossible or the mercury leaked due to breakage occurred.
  • thermometer for directly detecting heat emitted from an infrared thermometer or an object has appeared.
  • thermometer is manufactured in the form of an instrument that can be inserted into the user's ear. This type of thermometer is inconvenient to carry due to its small volume. There is a disadvantage that it is not easy to measure body temperature.
  • the substrate on which the temperature sensing means is mounted, and the adhesive layer existing between the substrate and the object are made of materials having low thermal conductivity, so that the thermal energy emitted from the object, particularly the human skin, is properly transferred to the temperature sensing means.
  • the present invention has been invented on the basis of this technical background, and in order to meet the salping technical needs in the above, as well as to provide additional technical elements that cannot be easily invented by those skilled in the art.
  • An object of the present invention is to provide a patch-type thermometer suitable for monitoring the temperature of an object, especially a human body temperature at all times.
  • the present invention is characterized by implementing the temperature sensing method of the patch-type thermometer divided into an infrared method, a heat sensing method.
  • thermometer In the case of an infrared patch type thermometer, a patch type of an infrared type thermometer which was previously manufactured only in the form of a bulky device is proposed to provide a methodology for measuring temperature without directly contacting a user's skin with a temperature sensing means. The purpose.
  • an object having a high thermal conductivity is formed or disposed between the object and the heat sensing unit, so that the heat energy emitted from the object can be more effectively detected.
  • the temperature sensing device is a substrate; An infrared receiver provided on the substrate and receiving infrared light emitted from an object; A temperature calculator configured to calculate a temperature of the object from the received infrared light; And a control unit (MCU) for controlling the infrared receiver and the temperature calculator, wherein the substrate includes an infrared transmission region through which infrared rays emitted from the object are transmitted, and the infrared transmission region includes the temperature sensing device. It is present between the infrared receiver and the object when driven.
  • MCU control unit
  • the infrared ray transmitting region may be an area in which a cavity is formed in the substrate, and may include an infrared ray transmitting material.
  • the substrate may be transparent and may include an infrared ray transmissive material.
  • the infrared receiver, the temperature calculator, and the controller may be included in a chip, and the chip may be disposed on the substrate.
  • the temperature sensing device is a substrate; A heat sensing unit provided on the substrate and sensing heat emitted from an object; A temperature calculator configured to calculate a temperature of the object when heat is detected by the heat detector; And a control unit (MCU) for controlling the heat sensing unit and the temperature computing unit, wherein the substrate includes a heat transfer area in which heat emitted from the object is transferred between the heat sensing unit and the object. can do.
  • MCU control unit
  • the heat transfer region may include a medium capable of heat transfer, wherein the medium has a thermal conductivity of 150 W / m ⁇ K to 220 W / m ⁇ K.
  • the medium may be aluminum nitride (AlN) or silicon carbide (SiC).
  • the substrate itself may include a heat transfer material.
  • the temperature sensing device may further include a communication unit for transmitting the temperature calculated by the temperature calculator to a remote terminal.
  • thermometer that can be easily detached to an object, in particular, the skin of a person, there is an effect that can easily measure the temperature for the object, and unlike the conventional thermometers to always measure the temperature for the object There is also an effect that can be done.
  • the patch-type thermometer even if the patch-type thermometer is attached to the user's skin, the user can freely act so that there is an effect that can solve the conventional inconvenience that the behavior is restricted according to the body temperature measurement.
  • thermometer by allowing only the temperature sensing device in the patch-type thermometer to be recycled, there is an effect that can be used semi-permanently patch-type thermometer when replacing the adhesive portion.
  • the infrared method means for sensing the temperature can detect the temperature without directly contacting the object, in particular the user's skin can reduce the heterogeneity that the user feels, and at the same time increase the life of the product It can be effective.
  • the present invention has the effect of maximizing the heat conduction efficiency by forming a medium having high thermal conductivity in the adhesive layer which is a layer in direct contact with the skin in addition to the substrate on which the heat sensing unit is disposed.
  • FIG. 1 is a conceptual diagram of a patch-type thermometer according to the present invention and a temperature measurement using the same.
  • Figure 2 shows a view from the side of the patch-type thermometer of the infrared receiving method of the patch-type thermometer according to the invention in particular.
  • 3 and 4 illustrate an example in which a chip including an infrared receiver is mounted on a substrate.
  • Figure 5 shows a side view of the patch-type thermometer of the heat-sensing type of the patch-type thermometer according to the invention from the side.
  • Figure 6 shows the heat transfer region formed on the substrate and the appearance of the medium formed thereon.
  • FIG. 7 is a block diagram showing the detailed configuration of the temperature sensing device according to the present invention.
  • FIG. 8 shows a state in which vent holes are formed in the substrate and the adhesive layer in the patch-type thermometer of the infrared reception method.
  • FIG. 9 illustrates a heat transfer region formed in the adhesive layer and a plurality of vent holes in the patch-type thermometer of a heat sensing method.
  • FIG. 10 illustrates an embodiment of a method in which the temperature sensing device and the patch unit are combined.
  • an expression such as 'first' and 'second' is used only for distinguishing a plurality of components, and does not limit the order or other features between the components.
  • each layer (film), region, pattern or structure may be “top” or “under” the substrate, each layer (film), region, pad or pattern.
  • the base material formed at ") includes all those formed directly or through another layer. Criteria for the top / bottom or bottom / bottom of each layer are described with reference to the drawings.
  • Figure 1 shows an example of the use of the patch-type thermometer 100 according to the present invention attached to the object, the human skin.
  • the patch-type thermometer 100 includes two components, that is, a patch portion for adhering the patch-type thermometer 100 to the skin and a temperature sensing device 200 that substantially senses the temperature of the object.
  • the patch-type thermometer 100 is driven by using infrared rays or directly detecting the heat emitted from the object when measuring the temperature of the object to calculate the current object temperature therefrom.
  • the former will be referred to as an infrared reception method and the latter as a heat transfer method.
  • Figure 1 (a) shows a patch-type thermometer of the infrared reception method, (b) shows a patch-type thermometer of the heat transfer method.
  • the present invention relates to a pyroelectric infrared temperature sensing device using a pyroelectric effect, more specifically, heat sensing.
  • the pyroelectric infrared temperature sensing device uses the pyroelectric properties of the pyroelectric material, which detects infrared energy emitted from an object.
  • Pyroelectric means, titanate zirconate (PZT) as a characteristic that the surface charge changes in response to temperature changes in the crystal structure, such as, in the case where the infrared light and temperature changes of the PZT, lithium tantalate, PVF 2, PbTaO 3 including pyroelectric element
  • PZT titanate zirconate
  • the phenomenon in which charge is induced on the surface of the crystal This is the nature of crystals with spontaneous polarization. As temperature changes, the magnitude of polarization changes and the change in surface charge is observed.
  • the present invention is to detect the temperature based on the infrared rays emitted from the object, in particular the human body.
  • the infrared ray emitted from the human body has a wavelength range of 6 to 14 um, and the infrared receiver 311 according to the present invention is preferably implemented to have a measurement band of 0.2 to 20 um.
  • the temperature sensing device 200 is manufactured in a form in which the module or chip 300 is disposed on one substrate 210, wherein the substrate 210 is more effective in the infrared radiation emitted from the object
  • the present invention proposes a patch-type thermometer 100 that can be attached to an object, characterized in that for measuring the temperature of the object using infrared rays, furthermore, the substrate 210 to effectively receive the infrared rays It is characterized by separately providing an infrared transmission region on the image.
  • the heat energy sensing unit more specifically, the heat sensing unit in the patch-type thermometer 100
  • the principle that the volume or length increases that is, the thermal expansion principle
  • the heat-transfer patch-type thermometer is also produced in the form of a module or chip 300 is disposed on one substrate 210, this time,
  • the substrate 210 has a separate heat transfer area so as to more efficiently receive the heat emitted from the object, more specifically, the heat emitted from the object can be better transferred to the temperature sensing device. That is, the present invention proposes a patch-type thermometer 100 that can be attached to the object, characterized in that for measuring the temperature of the object in a heat transfer method, furthermore, the substrate 210 to effectively detect the heat It is characterized by separately providing a heat transfer region on the phase.
  • the patch-type thermometer 100 may further include a communication unit 330 for communicating with the external terminal 500, the heat energy detected by the temperature or heat transfer method calculated from the infrared of the object.
  • the calculated temperature may be provided to the external terminal 500 wirelessly.
  • the patch-type thermometer 100 is attached to the infant's skin, the infant's body temperature may be continuously detected, and such monitoring information may be transmitted to the infant's parent terminal, that is, a terminal such as a smartphone or a PC. It can provide an environment where parents can easily check the health of the infant.
  • the patch-type thermometer 100 of the infrared light receiving method according to the present invention includes a release film 110, an adhesive layer 120, a substrate 210, and a chip 300 from below.
  • the cover film 130 for protecting the temperature sensing device 200 may be implemented in a stacked form.
  • the patch thermometer according to the present invention includes two components, namely, a patch part and a temperature sensing device 200. At this time, the patch part includes all components except the temperature sensing device 200 that measures substantially the temperature, that is, the release film 110. ), An adhesive layer 120 and a cover film 130.
  • the temperature sensing device 200 will be described in detail.
  • the infrared ray sensing temperature sensing apparatus 200 includes a substrate 210 and a heat energy sensing unit.
  • the heat energy sensing unit more specifically means the infrared receiver 311.
  • the substrate 210 includes an infrared transmission region through which infrared light emitted from an object may pass.
  • the substrate 210 may be rigid or flexible.
  • the substrate 210 may include glass or plastic.
  • the substrate 210 may include chemically strengthened / semi-hardened glass such as soda lime glass or aluminosilicate glass, polyimide (PI), polyethylene terephthalate (PET) ), Propylene glycol (PPG) polycarbonate (PC), such as reinforced or soft plastics, or may include sapphire.
  • PI polyimide
  • PET polyethylene terephthalate
  • PPG Propylene glycol
  • PC polycarbonate
  • the substrate 210 may include a light isotropic film.
  • the substrate 210 may include a cyclic olefin copolymer (COC), a cyclic olefin polymer (COP), an isotropic polycarbonate (PC), or an isotropic polymethyl methacrylate (PMMA).
  • COC cyclic olefin copolymer
  • COP cyclic olefin polymer
  • PC isotropic polycarbonate
  • PMMA isotropic polymethyl methacrylate
  • the substrate 210 may be bent while having a partially curved surface. That is, the substrate 210 may be partially curved and partially curved. In detail, an end of the substrate 210 may have a curved surface, or may have a curved surface or a surface including a random curvature.
  • the substrate 210 may be a flexible substrate 210 having flexible characteristics, or a curved or bent substrate 210. That is, the patch-type thermometer 100 including the substrate 210 may also be formed to have a flexible, curved or bent characteristic.
  • the patch-type thermometer according to the embodiment is easy to carry, can be changed to various designs, and the shape can be modified according to the movement of the body to continuously detect the body temperature.
  • the substrate 210 may include a plurality of perforated vent holes having a size to allow ventilation and sweat discharge, and the vent holes may be used for the normal operation of the temperature sensing device 200. Perforations may be formed only in regions other than the electrode portions formed on the substrate.
  • the size of the vent hole formed on the substrate 210 may be formed in various sizes.
  • the diameter is 1.0 mm or more, the durability of the substrate 210 is weakened, so that the substrate 210 is damaged when bent or impacted. If the diameter is less than 0.3mm, there may be a phenomenon that the evaporated moisture is formed in the ventilation hole and the ventilation hole is blocked and the ventilation is not smooth. Therefore, it is appropriate to manufacture the size of the diameter between 0.3mm ⁇ 1.0mm for durability and smooth ventilation of the substrate 210.
  • the diameter is 1.0mm, after about 24 hours after wearing the patch on the body, a problem occurs that the damage to the substrate 210 due to the movement of the body.
  • the diameter is 0.7mm, the damage of the substrate 210 hardly occurs even when used for 24 hours or more, but when 7 days or more are used, fine dust in the air easily penetrates to block the ventilation holes. This occurred.
  • the diameter of 0.5mm was produced, the penetration of foreign matters while maintaining long durability, it was confirmed that the sweat is discharged smoothly. Therefore, the ventilation hole of the present invention was confirmed that the diameter of 0.3mm ⁇ 0.5mm is most suitable for durability and smooth skin breathing.
  • the patch having a conventional temperature sensor may cause problems with the skin when the infant or a person who is sensitive to the skin may not be able to smoothly ventilate and release sweat when it is attached for a long time. Therefore, the present invention can perforate the vent hole in the substrate 210 to facilitate the ventilation and sweat discharge to the patch attachment site can reduce the possibility of causing problems on the skin even if the infant or a person sensitive to the patch attach the patch for a long time.
  • the substrate 210 of the temperature sensing device 200 may be made of a material of various physical properties, and particularly has a flexible property to prevent damage due to movement when attached to the skin of a person. It is desirable to.
  • a ventilation hole may be further included in order to accurately measure body temperature and improve a user's wearing comfort.
  • the substrate 210 may further include an infrared transmission region to more effectively receive the infrared radiation emitted from the object.
  • 3 and 4 exemplarily show an embodiment in which an infrared transmission region is implemented on the substrate 210.
  • FIG. 3 illustrates a state in which an infrared transmission region is realized by forming a cavity having a predetermined size in a substrate 210 and filling a material through which infrared light can pass through the cavity.
  • the cavity refers to a predetermined volume of empty space formed on the substrate 210, and the cavity may be filled by filling a material through which infrared light can pass, for example, transparent plastic.
  • the cavity may be formed on the substrate 210 to be matched with the chip 300, more precisely the infrared receiver 311, which is preferably disposed on the substrate 210, the interior of the cavity.
  • the medium filled in may also allow the infrared receiver 311 to match its area.
  • the cavity may be filled with a material capable of transmitting infrared rays therein, but also for the purpose of simply passing the infrared rays while filled with no material and, in other words, filled with air.
  • a cavity having a predetermined size is formed in the substrate 210, and the infrared receiver 311 directly transmits infrared rays from the object by allowing the cavity, that is, the empty space (or air layer), to pass infrared rays generated from the object. Can be received.
  • FIG. 4 shows that the substrate 210 itself is made of a transparent material so that infrared rays can pass through any area, and the chip 300, more precisely, the infrared receiver 311 is provided on the transparent substrate 210. By doing so, the infrared receiver 311 can effectively receive the infrared rays emitted from the object.
  • the substrate 210 itself is transparent, it is not necessary to form a cavity as shown in FIG. 3, and the chip 300, that is, the infrared receiver 311 is mounted at any position on the substrate 210 to sense temperature.
  • the device 200 can be completed.
  • the infrared transmission region in FIG. 4 is to be understood that the area where the chip 300, more precisely the infrared receiver 311 abuts the transparent substrate 210 is the infrared transmission region.
  • the material of the substrate itself as a medium for filling the cavity or for transmitting infrared rays is preferably i) having a large refractive index ii) having low thermal dispersion iii) having low dispersion and absorption iv) It is required that the antireflective coating be easy and durable.
  • Materials satisfying the above conditions include germanium (Ge), silicon (Si), zinc sulfide (ZnS), zinc ceranide (ZnSe), magnesium fluoride (MgF 2 ), sapphire, and the like. Materials may be included as material in the cavity or as material of the substrate itself.
  • the infrared receiver 311 is provided on the substrate 210 described above.
  • the infrared receiver 311 receives the infrared rays emitted from the object through the substrate 210 and the infrared transmission region of the substrate 210 described above.
  • the infrared receiver 311 may include, as a detailed configuration, a lens for concentrating infrared rays into a single point, a filter for filtering an area other than a wavelength of a required region among the infrared rays, and a photon detector for hitting photons in the infrared rays.
  • the infrared receiver 311 may be present in a form included in one configuration of the chip 300 mounted on the substrate 210. 2 to 4, a chip 300 is mounted on the substrate 210, where the chip 300 may include a module for measuring a temperature of an object.
  • the infrared receiver 311 may be mounted on the substrate 210 while being provided in the chip 300 as one of these modules.
  • the patch-type thermometer structure of the heat transfer method will be described with reference to FIGS. 5 and 6.
  • the patch-type thermometer of the heat transfer method is composed of two components, the patch portion and the temperature sensing device 200.
  • the temperature sensing device 200 will be described.
  • the temperature sensing device 200 includes a substrate 210 and a heat energy sensing unit, more specifically, a heat sensing unit 313, in particular, the substrate 210 is heat emitted from an object.
  • the heat transfer region capable of being transferred (in the drawing, the heat transfer region on the substrate 210 is indicated as the first heat transfer region and the heat transfer region on the adhesive layer 120 as the second heat transfer region).
  • FIG. 6 exemplarily illustrates a state in which a heat transfer region is implemented in the substrate 210.
  • a cavity having a predetermined size is formed in the substrate 210, and a heat transfer region is implemented by filling a medium 400 through which heat can be transferred to the cavity.
  • the cavity refers to a predetermined volume of empty space formed on the substrate 210, and the cavity may be filled with a material capable of conducting heat, for example, a metallic medium 400.
  • the cavity may be formed on the substrate 210 to match the chip 300, more precisely the thermal sensing unit 313, which is preferably disposed on the substrate 210.
  • An internal medium may also allow the thermal sensing unit 313 to match its area.
  • the medium 400 for heat conduction may be formed larger than the contact surface with the heat sensing unit 313.
  • the medium 400 it is preferable to use a ceramic material having a high thermal conductivity and at the same time being insulated from the heat sensing unit 313.
  • Examples of media that can be filled in the cavity as having thermal conductivity are as follows. In Table 1 below, the unit of thermal conductivity is W / (mK).
  • AlN aluminum nitride
  • SiC silicon carbide
  • the compound whose thermal conductivity is 150 W / m * K or more and 220 W / m * K.
  • the higher the thermal conductivity the higher the price of a material that can be used as a medium, and considering the cost, the compound within the above range including the thermal conductivity of aluminum nitride and silicon carbide, which can be synthesized at a relatively low cost. Preference is given to using.
  • Aluminum nitride is a compound having a thermal conductivity of 170 to 220 W / m ⁇ K, and has a thermal expansion coefficient close to that of silicon, and thus is a medium having excellent compatibility with silicon. Generally, it is used as a material for a heat dissipation substrate, but in the present invention, as a material to fill the heat transfer region, it functions to efficiently transfer heat emitted from an object.
  • silicon carbide is a compound having a thermal conductivity of 150 W / m ⁇ K and is characterized by high hardness, high decomposition temperature, and high thermal conductivity. Silicon carbide is also generally utilized for many purposes for refractory purposes, but in the present invention, it effectively transfers heat emitted from the object to the heat sensing unit 313.
  • the medium is not necessarily limited to aluminum nitride, silicon carbide, it is to be understood that all of the metallic medium having a certain level of thermal conductivity can be utilized.
  • a compound having a property of thermal conductivity of 20 W / m ⁇ K or more and 300 W / m ⁇ K may be utilized.
  • the heat transfer to the heat sensing unit 313 can be efficiently performed by forming a medium having high thermal conductivity as a heat transfer region on the substrate, and as will be described later.
  • a cavity is formed in the substrate 210 and a metal medium is not filled therein, ie, air is used as a medium is considered.
  • a cavity is formed on the substrate 210, but no material is artificially filled, and an air medium may be implemented to transfer heat energy generated from an object.
  • the thermal sensing unit 313 is provided on the substrate 210 described above.
  • the heat detector 313 receives and transmits heat emitted from the object through the substrate 210 and the heat transfer region of the substrate 210 described above.
  • the thermal sensing unit 313 may be present in a form included in one configuration of the chip 300 disposed on the substrate 210. 5 to 6, a chip 300 is disposed on the substrate 210, where the chip 300 may include a module for measuring a temperature of an object. The thermal sensing unit 313 may be disposed on the substrate 210 while being provided in the chip 300 as one of such modules.
  • Figure 7 shows a detailed configuration of the temperature sensing device 200 according to the present invention in a block diagram.
  • the temperature sensing device 200 is a means for detecting thermal energy from an object (thermal energy sensing unit 310), in addition to the infrared receiver 311 or the thermal sensing unit 313, the temperature calculating unit 320,
  • the communication unit 330 and the control unit 340 may further include.
  • the temperature calculator 320 functions to calculate the temperature of the object from the infrared rays received by the infrared receiver 311 or the heat detector 313, that is, calculate the temperature of the object as one value.
  • the infrared receiver 311 may know the magnitude of the light amount according to the extent to which the infrared rays emitted from the object hit the detector, and the temperature calculator 320 may recognize the magnitude of the light amount. Convert to a temperature value.
  • the process of converting the amount of light into a specific value may be performed by, for example, measuring the magnitude of voltage and current generated in proportion to the amount of light and comparing it with a predetermined temperature value.
  • the heat detector 313 may know the amount of heat according to the degree of expansion of the heat detector 313 made of metal according to the heat energy emitted from the object, and the temperature calculator 320 The magnitude of the calories is converted into a temperature value that can be perceived by humans.
  • the process of converting the amount of heat into a specific value may be performed by, for example, measuring a volume expansion amount of the heat sensing unit 313 made of metal and comparing the temperature with a preset temperature value. have.
  • abnormal temperature calculator 320 An operation example of the abnormal temperature calculator 320 has been described. However, this has been described with reference to some embodiments for calculating the temperature calculating unit 320 temperature value, in addition to that it will be understood that the temperature of the object can be calculated in various ways.
  • the temperature sensing device 200 may further include a communication unit 330.
  • the communicator 330 is provided to enable the temperature sensing device 200 to transmit and receive data with the external terminal 500.
  • the temperature sensing device 200 may be a target of the object previously calculated through the communication unit 330. The temperature can be transmitted.
  • the communication unit 330 may transmit and receive data through wireless communication, and may include NFC, Bluetooth, Wi-Fi, etc.
  • the communication unit 330 may include a mobile communication network provided by a mobile communication company.
  • the temperature sensing device 200 may further include a controller 340 for controlling the infrared receiver 311 or the heat detector 313, the temperature calculator 320, and the communicator 330 described above.
  • the controller 340 may include at least one arithmetic means and storage means, wherein the arithmetic means may be a general-purpose central processing unit (CPU), or a programmable device element (CPLD, FPGA) implemented for a specific purpose. ), Or an ASIC or a microcontroller chip 300.
  • the storage means a volatile memory device, a nonvolatile memory device, or a nonvolatile electromagnetic storage device may be utilized.
  • the infrared receiver 311 or the heat detector 313, the temperature calculator 320, and the controller 340 may exist as a module in one chip 300, and according to the design, the communication unit ( 330 may be further included.
  • the substrate 210 and each functional unit of the temperature sensing device 200 according to the present invention have been described above.
  • the patch-type thermometer 100 includes a release film 110, an adhesive layer 120, and a cover film 130 in addition to the temperature sensing device 200.
  • the release film 110 has a uniform thickness and is a film used for protecting a temporary support or an adhesive layer of an adhesive component material, and serves to protect the adhesive layer 120 attached to a user's skin. That is, when the patch-type thermometer 100 is attached to the user's skin, the adhesive layer 120 is exposed when the release film 110 is removed, and the exposed adhesive layer 120 is attached to the user's skin.
  • the adhesive layer 120 refers to a layer directly touching the user's skin as described above. One surface of the adhesive layer 120 is adhered to the user's skin, and at the same time, the substrate 210 of the temperature sensing device 200 is adhered to the rear surface of the adhesive layer 120.
  • an infrared ray transmitting region for passing infrared rays may also be formed in the adhesive layer 120 in the infrared ray sensing temperature sensing device 200.
  • the infrared transmission region formed on the substrate 210 is referred to as a first infrared transmission region and the infrared transmission region formed on the adhesive layer 120 is referred to as a second infrared transmission region.
  • the second infrared transmission region may be formed in a manner similar to that of forming the first infrared transmission region on the substrate 210. That is, the predetermined region of the adhesive layer 120 may be vacant, that is, the predetermined region of the adhesive layer 120 may be freely passed through the region through which the infrared rays are perforated. Alternatively, by forming a predetermined region of the adhesive layer 120 as an adhesive layer made of a transparent material, infrared rays may pass through, or by forming the adhesive layer itself as a transparent material, the infrared rays emitted from the object may pass therethrough.
  • the second infrared transmission region may also allow the infrared light to pass through the ventilation hole by densely forming a ventilation hole in a predetermined region of the adhesive layer 120.
  • the adhesive layer 120 may be formed in the entire surface ventilating holes for ventilation and sweat discharge, in particular in the second infrared transmission region by increasing the number of ventilation holes per unit area, that is, density compared to other areas This allows the infrared to pass through smoothly.
  • FIG. 8 illustrates a vent hole formed in the substrate 210 and the adhesive layer 120 in the infrared ray sensing temperature sensing device 200.
  • vent holes may be formed in the substrate 210 to improve breathability when attached to the user's skin, and vent holes may be formed on the entire surface of the substrate except for the first infrared transmission region.
  • vent holes may be formed in the substrate region except for the portion where the electrode is formed.
  • vent holes may also be formed in the adhesive layer 120, and vent holes may be formed over the entire area of the adhesive layer.
  • vent holes may be formed on the surface of the adhesive layer 120 except for the second infrared ray transmitting region of the adhesive layer 120, or a portion of the second infrared ray transmitting region may have more vent holes per unit area. That is, vent holes may be formed more densely.
  • a heat transfer area for transferring heat to the adhesive layer 120 may also be formed in the heat transfer type temperature sensing device 200.
  • a heat transfer region formed on the substrate 210 is referred to as a first heat transfer region and a heat transfer region formed on the adhesive layer 120 as a second heat transfer region.
  • the second heat transfer region may be formed in a manner similar to that of forming the first heat transfer region on the substrate 210.
  • the predetermined region of the adhesive layer 120 is made void of the void region, that is, the predetermined region of the adhesive layer 120, and is filled from the object by filling a medium having high thermal conductivity thereto. The heat can be transferred effectively through the area.
  • a plurality of vent holes may be formed in the adhesive layer 120. That is, the adhesive layer 120 is a part directly contacting an object, in particular, a human skin, and in particular, the presence of moisture on the adhesive surface may cause a user's wearing feeling to be disturbed or a trouble may occur in the corresponding skin region, as shown in FIG. 9.
  • the plurality of vent holes 450 are formed at 120, moisture may escape through the vent holes 450, thereby improving the fit.
  • the cover film 130 is a film for covering and protecting the temperature sensing device 200 as a whole.
  • the cover film 130 surrounds the upper portion of the temperature sensing device 200 to block exposure to the outside to maintain mechanical and electrical functions of the device. And protects from infiltration of foreign matter so that the patch-type thermometer 100 functions normally.
  • FIG. 10 shows an embodiment of a structure in which the temperature sensing device according to the present invention can be combined with a patch part.
  • FIG. 10A illustrates an embodiment in which the patch part, among which the cover film 130 and the adhesive layer 120 are independently present, surrounds the temperature sensing device 200. That is, the temperature sensing device 200 may be disposed on the adhesive layer 120, and the completed patch-type thermometer may be realized by covering the cover film 130 over the temperature sensing device 200. In this case, the second infrared ray passing region or the second heat transfer region may be formed in the adhesive layer 120 as described above.
  • FIG. 10 (b) shows an embodiment in which the patch part, especially the cover film 130 and the adhesive layer 120, are integrally present to enclose the temperature sensing device 200. That is, the temperature sensing device 200 may be disposed in a space created therein in a state where the cover film 130 and the adhesive layer 120 are integrally formed. In addition, at this time, the cover film 130 may be implemented so that one side can be detached from the adhesive layer 120 so that the user can replace the temperature sensing device 200 if necessary.
  • a second infrared ray passing region or a second heat transfer region may be formed in the adhesive layer 120, and unlike (a), a plurality of second infrared ray passing regions or second heat transfer regions may be formed. Will have to understand.
  • the formation region of the second infrared ray passing region or the second heat transfer region may be changed according to the arrangement of the infrared receiver 311 or the heat sensing unit 313 included in the temperature sensing device 200.

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PCT/KR2016/000157 2015-09-04 2016-01-08 적외선 온도 측정 방식을 이용한 패치형 온도계 WO2017039083A1 (ko)

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KR1020150125832A KR102457451B1 (ko) 2015-09-04 2015-09-04 제1레이어 및 제2레이어의 합착구조로 이루어진 온도 감지 장치 및 상기 온도 감지 장치를 포함하는 패치형 온도계
KR1020150125834A KR20170028783A (ko) 2015-09-04 2015-09-04 통기성이 개선된 패치형 온도계
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108362391A (zh) * 2018-01-12 2018-08-03 杭州柯氏音医疗器械有限公司 一种带导热装置的贴片式体温计
CN110006532A (zh) * 2019-04-15 2019-07-12 高兴莲 基于物联的远程监控温度贴控制系统及控制方法、温度贴
US20230022237A1 (en) * 2019-12-10 2023-01-26 Seerstechnology Co., Ltd. Body temperature measuring patch using infrared temperature sensor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6220750B1 (en) * 1999-03-29 2001-04-24 Yoram Palti Non-invasive temperature measurement method and apparatus
JP2008503307A (ja) * 2004-05-20 2008-02-07 メディシム リミテッド 温度測定装置
WO2009051863A1 (en) * 2007-10-16 2009-04-23 Welch Allyn, Inc. Temperature patch and method of using the same
JP2011027591A (ja) * 2009-07-27 2011-02-10 Medisim Ltd 表面温度プロファイル
KR20150066560A (ko) * 2012-11-01 2015-06-16 블루 스파크 테크놀러지스, 인크. 체온 기록 패치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6220750B1 (en) * 1999-03-29 2001-04-24 Yoram Palti Non-invasive temperature measurement method and apparatus
JP2008503307A (ja) * 2004-05-20 2008-02-07 メディシム リミテッド 温度測定装置
WO2009051863A1 (en) * 2007-10-16 2009-04-23 Welch Allyn, Inc. Temperature patch and method of using the same
JP2011027591A (ja) * 2009-07-27 2011-02-10 Medisim Ltd 表面温度プロファイル
KR20150066560A (ko) * 2012-11-01 2015-06-16 블루 스파크 테크놀러지스, 인크. 체온 기록 패치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108362391A (zh) * 2018-01-12 2018-08-03 杭州柯氏音医疗器械有限公司 一种带导热装置的贴片式体温计
CN110006532A (zh) * 2019-04-15 2019-07-12 高兴莲 基于物联的远程监控温度贴控制系统及控制方法、温度贴
US20230022237A1 (en) * 2019-12-10 2023-01-26 Seerstechnology Co., Ltd. Body temperature measuring patch using infrared temperature sensor

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