WO2017036057A1 - Semiconductor air-conditioning card, cushion, chair and mattress - Google Patents

Semiconductor air-conditioning card, cushion, chair and mattress Download PDF

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Publication number
WO2017036057A1
WO2017036057A1 PCT/CN2016/000480 CN2016000480W WO2017036057A1 WO 2017036057 A1 WO2017036057 A1 WO 2017036057A1 CN 2016000480 W CN2016000480 W CN 2016000480W WO 2017036057 A1 WO2017036057 A1 WO 2017036057A1
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semiconductor
air conditioner
card
conditioner card
semiconductor air
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PCT/CN2016/000480
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French (fr)
Chinese (zh)
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夏盛清
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夏盛清
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Publication of WO2017036057A1 publication Critical patent/WO2017036057A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect

Definitions

  • the invention relates to a semiconductor air conditioner card, a seat cushion, a seat and a mattress, and belongs to the field of high-tech electronic product manufacturing.
  • the so-called semiconductor air conditioner cushion or seat is based on the above principle. Simply put, the semiconductor refrigeration module is combined with a seat cushion or a seat, and is equipped with a temperature control circuit and a safety control unit. The heat in the seat cushion or the seat is transmitted to the cold end through a heat transfer medium (such as air or water), and then passed through the semiconductor chip and discharged from the hot end to the outside of the seat or the seat to achieve a cooling effect.
  • a heat transfer medium such as air or water
  • this function is only perfectly used in the seat system.
  • the semiconductor air-conditioning seat system features a powerful turbo fan that passes high-speed airflow through the radiators at both ends of the semiconductor chip.
  • the Chinese patent document "a built-in temperature control seat for vehicles”, bulletin No. 201989661, discloses a built-in temperature control seat for vehicles, which is a seat cushion, a back cushion, two leather sleeves with holes, two a perforated sponge, an intake fan, a retractable ventilated soft pipe, two semiconductor cooling and heating modules with a radiator, two wind separators, and a control device.
  • This patent can only be used in the seat system by fan-driven hot and cold exchange.
  • the air-cushion cushion technology is very immature compared to the seat technology. Although similar products appear on the market occasionally, they have not been popularized due to obvious technical defects.
  • the characteristics of the existing air-conditioning cushion technology can be summarized as follows: 1) The semiconductor refrigeration sheet works outside the seat cushion, because the refrigeration sheet is a fragile and non-pressure-resistant component, and therefore cannot withstand large mechanical pressure or deformation stress; Since the cooling sheet works outside the seat cushion, the heat exchange between the inside of the seat cushion and the cold end of the refrigerating sheet needs to be achieved by a solid or liquid heat transfer medium, such as a metal having a high heat transfer coefficient such as an aluminum copper plate, or a liquid medium such as water which is larger than heat.
  • a solid or liquid heat transfer medium such as a metal having a high heat transfer coefficient such as an aluminum copper plate, or a liquid medium such as water which is larger than heat.
  • the heat-dissipating end part is bulky, which is another important reason why the cooling piece needs to work outside the seat cushion. Since the working efficiency of the semiconductor refrigerating piece is relatively low, for example, the electric power efficiency of the refrigerating piece on the market is less than 60%. At the same time of cooling, a large amount of heat will be released. If the heat is not good, there will be no cooling effect. Therefore, the fins of the heat dissipation end are large, and even the computer graphics card and the CPU are used for heat dissipation. A thick heat pipe fin radiator is used to add heat to enhance heat dissipation.
  • the existing air-conditioning cushion technology has the following obvious problems: 1) In order to avoid the pressure of the semiconductor refrigeration chip and ensure good heat dissipation at the heat-dissipating end, the seat cushion must be made very thick, and the excessive thickness will greatly change the driving angle of the car seat, even The safety system that hinders the car seat; 2) The copper-aluminum plate is used to realize the heat exchange between the seat cushion and the cooling plate.
  • the practical application is low, firstly to ensure the heat transfer power, the copper-aluminum plate is much thicker than expected, and secondly because of the obvious Temperature gradient (the heat transfer mechanism of copper-aluminum metal plate is to realize heat conduction through temperature difference, there is no heat conduction without temperature ladder), the temperature uniformity of the seat cushion is very poor, the area close to the cooling piece is very cold, and the area away from the cooling piece has basically no cooling effect. 3)
  • the more feasible solution in the prior art is to use water as a heat transfer medium, that is, to cool the water with a semiconductor refrigeration technology outside the seat cushion, and to inject heat into the inside of the seat cushion by a water pump. The disadvantage of this working mode is obvious.
  • the cooling rate is slow and the efficiency is low (the specific heat of water is large, and it is necessary to cool the water to a certain temperature to produce a significant cooling effect)
  • the efficiency is low (the specific heat of water is large, and it is necessary to cool the water to a certain temperature to produce a significant cooling effect)
  • it is often necessary to use a high-power semiconductor chip, which has high energy consumption.
  • the water pipe is distributed in the seat cushion, and once a leak occurs, it may bring subsequent safety hazards.
  • the present invention provides a semiconductor air conditioner card
  • the present invention also provides a seat cushion, a seat and a mattress including a semiconductor air conditioner card.
  • the semiconductor air conditioning card provided by the invention utilizes the characteristics of small size, light weight, fast cooling speed, environmental protection and no noise of the semiconductor refrigeration chip, and integrates the semiconductor refrigeration chip and the heat dissipation fin into a thin card, and directly works on the seat cushion and the seat. Wait for the interior to achieve fast cooling.
  • a semiconductor air conditioner card comprising a semiconductor refrigeration chip, a heat dissipation fin and a vacuum chamber solvent heat absorption plate, wherein the heat dissipation fin comprises a cold end heat dissipation fin and a heat end heat dissipation fin, and the cold end heat dissipation fin and the cold end fin
  • the cold surface of the semiconductor refrigeration chip is connected, and the hot surface of the semiconductor refrigeration chip is connected to one end of the vacuum chamber solvent soaking plate, and the hot end heat dissipating fin is connected to the other end of the vacuum chamber solvent soaking plate.
  • the semiconductor air conditioner card further includes a refrigerating end base, and the semiconductor refrigerating chip and the cold end fin are connected to one end of the vacuum chamber solvent soaking plate through the refrigerating end base.
  • the refrigerating end base is provided with an air inlet shunt flap.
  • the cooling end base is made of heat-insulating plastic material, and mainly functions as follows: a) mounting and fixing the semiconductor cooling chip and the cold-end heat-dissipating fin; b) the air inlet shunt blocking end of the cooling end base Divided into two parts, a part of the airflow generates cooling air through the cold-end heat-dissipating fins of the semiconductor air-conditioning card, and the other part of the airflow passes the heat-dissipating fins to remove the heat generated by the semiconductor cooling chip.
  • the semiconductor air conditioner card further includes a semiconductor air conditioner card housing, the semiconductor air conditioner card housing is located outside the semiconductor air conditioner card, and the semiconductor air conditioner card housing is a flat elongated box body with open ends, and the box body
  • the middle part is provided with a semiconductor air-conditioning card slot for connecting the semiconductor air-conditioning card
  • the middle of the box body is provided with an air inlet
  • the bottom of the box body is provided with an air inlet, an air outlet and a hot air outlet.
  • the semiconductor air conditioner card housing plays the following roles: c) preventing bad heat exchange between the semiconductor air conditioner card and the outside; d) distributing the air flow at the cold end and the hot end to achieve the best match; e) generating high-speed airflow on the surface of the heat sink fin, Improve the heat exchange ratio of the heat sink fins; f) Provide certain mechanical protection to the semiconductor air conditioner card to prevent the semiconductor air conditioner card from being damaged due to excessive pressure.
  • the working principle of the semiconductor air conditioner card is: when the semiconductor refrigeration chip is working, the heat generated by the hot end of the semiconductor refrigeration chip, that is, the heat generated by the hot surface, causes the low boiling point solvent in the cavity of the vacuum chamber solvent soaking plate to be quickly volatilized, and the generated steam can be quickly Diffusion into the vacuum chamber at the other end of the solvent soaking plate. Under the cooling of the high-speed flowing air of the heat-dissipating fins, the steam is recondensed and returned to the end of the solvent-heating plate of the vacuum chamber to which the semiconductor refrigeration chip is connected by capillary action. A fast heat exchange cycle. Compared with ordinary heat pipes, the vacuum chamber solvent soaking plate is more suitable for ultra-thin design, and the vacuum chamber solvent soaking plate has larger heat dissipation area and higher heat exchange efficiency.
  • a seat cushion comprising a mesh body and a semiconductor air conditioner card as described above, the semiconductor air conditioner card being located in a mesh The inside of the mat.
  • the seat cushion further includes a support lining for connecting the semiconductor air conditioner card and the mesh pad.
  • the support lining connects the semiconductor air conditioner card to the mesh pad of the seat cushion, plays a role of buffering and heat transfer, and further increases the comfort and safety of the ride.
  • the material is a flexible flame retardant organic polymer.
  • the support liner comprises a matchingly connected upper portion of the inner liner and a lower portion of the inner liner, and the semiconductor air conditioner card is disposed between the upper portion of the inner liner and the lower portion of the inner liner.
  • the upper part of the inner liner is symmetrical with the structure of the lower part of the inner liner, and is fixed by the mounting hole.
  • the support liner is provided with micropores.
  • the micro-pores are used to better dissipate the cold air generated by the semiconductor air-conditioning card evenly into the seat cushion.
  • the support liner is provided with a cushioning washer.
  • the cushion washer is for added comfort.
  • the seat cushion further includes a circulation air passage system, the circulation air passage system is disposed outside the seat cushion, and the circulation air passage system includes a fan and a ventilation duct, and the ventilation air duct and the semiconductor air conditioner card outside the semiconductor air conditioner card Connected.
  • the design of the circulating air system can quickly achieve heat dissipation, which effectively improves the uniform temperature performance of the seat cushion.
  • a seat comprising a seat body and a semiconductor air conditioner card as described above, the semiconductor air conditioner card being disposed inside the seat body.
  • a mattress comprising a mattress body and a semiconductor air conditioner card as described above, the semiconductor air conditioner card being disposed inside the mattress body.
  • the liquid such as water can be used as the heat transfer medium, and the semiconductor refrigeration chip can directly work inside the seat cushion, the seat, etc., thereby minimizing the heat loss in the refrigeration process and greatly improving the heat loss.
  • the cooling efficiency of the semiconductor refrigeration chip is very high, and a good cooling effect can be achieved with a small power chip;
  • the invention adopts an efficient heat exchange method and a unique heat dissipation design, and specially designs a circulation air passage system, which can not only form a natural circulation air passage inside the seat cushion, but also can improve the heat dissipation efficiency and greatly reduce the noise of the fan.
  • the use of a smaller fan allows the semiconductor refrigeration chip to work efficiently, with low fan noise and noise ⁇ 30dB, which is more environmentally friendly and energy efficient.
  • FIG. 1 is a schematic structural view of a conventional semiconductor refrigeration module in the prior art
  • FIG. 2 is a schematic view showing the working principle and a three-dimensional structure of a semiconductor air conditioner card according to the present invention
  • FIG. 3 is a top plan view showing a structure of a semiconductor air conditioner card according to the present invention.
  • FIG. 4 is a front view showing the structure of a semiconductor air conditioner card according to the present invention.
  • Figure 5 is a front elevational view showing the structure of a semiconductor air conditioner card housing of the present invention.
  • Figure 6 is a schematic cross-sectional view of Figure 5A-A;
  • FIG. 7 is a schematic view showing the assembly of a semiconductor air conditioner card and a semiconductor air conditioner card housing according to the present invention.
  • Figure 8 is a schematic view of the lower part of the inner liner of the support liner of the present invention.
  • FIG. 9 is a schematic view showing the assembly and separation of a semiconductor air conditioner card housing and a support lining according to the present invention.
  • FIG. 10 is a perspective view showing the structure of a semiconductor air conditioner card and a circulating air passage system in accordance with the present invention.
  • the hot end fan in the prior art 2, the hot end heat sink fin, 3, the semiconductor refrigeration chip, 4, the cold end heat sink fin, 5, the cold end fan in the prior art, 6, the vacuum chamber Solvent soaking plate, 7, vacuum chamber solvent soaking plate cavity solvent, 8, air outlet, 9, air inlet, 10, hot air outlet, 11, semiconductor air conditioning card housing, 12, micro air hole, 13 buffer washer, 14 , mounting hole, 15, upper lining, 16, lower lining, 17, semiconductor air conditioning card slot, 18, mesh pad, 19, support lining, 20, cooling end base, 21, air inlet shunt Sheet, 22, air inlet.
  • a semiconductor air conditioning card comprises a semiconductor refrigeration chip, a heat dissipation fin and a vacuum cavity solvent heat absorption plate, wherein the heat dissipation fin comprises a cold end heat dissipation fin and a heat end heat dissipation fin, as shown in FIG. 2, the cold end heat dissipation The fin is connected to the cold surface of the semiconductor refrigerating chip, and the heating end of the semiconductor refrigerating chip, that is, the hot surface is connected to one end of the vacuum chamber solvent soaking plate, the maximum limit The low temperature generated by the semiconductor refrigeration chip is diffused out.
  • the heat generated by the hot end of the semiconductor refrigeration chip that is, the heat generated by the hot surface, rapidly evaporates the low boiling point solvent in the cavity of the solvent chamber of the vacuum chamber.
  • the steam can be quickly diffused to the other end of the vacuum chamber solvent soaking plate; the other end of the vacuum chamber solvent soaking plate is connected with a heat-side heat-dissipating fin for discharging the heat of the vacuum chamber solvent soaking plate, and the heat-dissipating fin at the hot end
  • the steam is recondensed and returned to the vacuum chamber of the vacuum chamber to which the semiconductor refrigeration chip is connected by capillary action, thereby generating a rapid heat exchange cycle, taking away the heat generated by the semiconductor refrigeration chip.
  • the semiconductor refrigeration chip is connected to one end of the vacuum chamber solvent soaking plate through the cooling end base, and the cold end heat sink fin is connected to the cold surface of the semiconductor refrigeration chip and fixed.
  • the cooling end base On the cooling end base, the cooling end base is further provided with an air inlet shunt blocking piece, which divides the air flow into two parts, a part of the air flow passes through the cold end heat radiating fin of the semiconductor air conditioning card to generate an air conditioning card cold air flow, and the other part of the air flow passes through the heat.
  • the heat-dissipating fins generate a hot air flow of the air-conditioning card to take away the heat generated by the semiconductor cooling chip.
  • a semiconductor air-conditioning card according to any one of the embodiments of the present invention, as defined in any one of the embodiments 1-2, further comprising a semiconductor air-conditioning card housing, as shown in FIG. 5-7, the semiconductor The air-conditioning card housing is located outside the semiconductor air-conditioning card, and the semiconductor air-conditioning card housing is a flat and long-shaped box body with open ends.
  • the middle part of the box body is provided with a semiconductor air-conditioning card slot for connecting the semiconductor air-conditioning card, and the middle portion of the box body is provided with The air port flows through the air inlet to the semiconductor air conditioner card, and the bottom of the box body is provided with an air inlet, an air outlet and a hot air outlet, thereby forming a wind path inside the box body, which is suitable for air flow.
  • a seat cushion comprising a mesh body and a semiconductor air conditioner card according to any one of embodiments 1-3, the semiconductor air conditioner card being located inside the mesh body.
  • the structural characteristics of the semiconductor air conditioner card make it excellent for use in the seat cushion.
  • the mesh pad is made of organic polymer material and has the following requirements for materials; i) high elastic porous structure for airflow and heat dissipation; ii) low specific heat, fast cooling start-up speed; iii) flame retardant, safety high.
  • the seat cushion further includes a support liner for the support liner Connecting the semiconductor air conditioner card and the mesh pad body, as shown in Figure 8-9
  • the support lining includes the upper part of the inner liner and the lower part of the inner lining which are matched and connected, and the upper part of the inner lining and the lower part of the inner lining are symmetrically symmetrical, and the lining is lining through the mounting hole
  • the upper part is fixedly connected with the lower part of the inner liner
  • the semiconductor air conditioner card is disposed between the upper part of the inner liner and the lower part of the inner liner
  • the supporting inner liner connects the semiconductor air conditioner card and the mesh pad body of the seat cushion to play the role of buffering and heat transfer, and Further increase the heat dissipation, comfort and safety of the ride
  • the support lining material is a flexible flame retardant organic polymer.
  • a seat cushion is as described in Embodiment 5, except that the support lining is provided with micro air holes for better dispersing the cold air generated by the semiconductor air conditioner card to the seat cushion.
  • a seat cushion as described in embodiment 5, except that the support liner is provided with a cushioning washer to increase ride comfort.
  • a seat cushion as described in Embodiment 4, except that the seat cushion further includes a circulation air passage system, the circulation air passage system is disposed outside the seat cushion, and the circulation air passage system includes a fan and a ventilation duct, the ventilation duct and the semiconductor air conditioner card.
  • the external semiconductor air-conditioning card housing is connected at one end, that is, connected to the air inlet and the air outlet of the semiconductor air-conditioning card housing.
  • the semiconductor air conditioner card can make the refrigeration chip work directly inside the seat cushion, the cold air flow is only released from one end of the semiconductor air conditioner card, and there is still some resistance to diffuse to the entire mesh cushion body.
  • the temperature of the seat cushion near the end of the cold air outlet of the semiconductor air conditioner card is lower, and the temperature of the seat cushion near the end of the hot air outlet is higher, thereby affecting the temperature uniformity of the entire seat cushion.
  • the circulation air path structure is constructed inside and outside the seat cushion, and the design circulation air path system is added to ensure the uniform temperature performance of the seat cushion. As shown in Fig.
  • the ventilation duct is connected at the front position of the seat cushion, and the air inside the seat cushion is first extracted by the fan, that is, the air is extracted by the air outlet under the extraction action of the fan, and then the semiconductor air conditioner is passed through the circulation air passage system.
  • the air inlet of the card housing is sent to the air inlet of the semiconductor air conditioner card, and the air flow is divided into two by the air inlet shunt at the air inlet, respectively, through the cold end fins and the hot end of the semiconductor air conditioner card. Cooling fins.
  • the cold air flow through the cold-end heat-dissipating fins is blown into the middle and rear parts of the seat cushion, and is sucked into the front part of the seat cushion and re-extracted by the fan in the seat cushion; and the air-conditioning card through the hot-end heat-dissipating fins passes through the heat.
  • the air outlet exits the seat cushion directly. This way of working, the airflow in the seat cushion can form a circulation loop, quickly achieve heat dissipation, and can ensure good temperature uniform performance.
  • a seat comprising a seat body and a semiconductor air conditioner card according to any one of embodiments 1-3,
  • the semiconductor air conditioner card described above is disposed inside the seat body.
  • the number of semiconductor air conditioner cards installed and the like can be selected according to the size of the seat, etc., and the installation and maintenance are more convenient, and the safety can be greatly improved.
  • a mattress comprising a mattress body and the semiconductor air conditioner card according to any one of embodiments 1-3, wherein the semiconductor air conditioner card is disposed inside the mattress body.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mattresses And Other Support Structures For Chairs And Beds (AREA)
  • Chair Legs, Seat Parts, And Backrests (AREA)
  • Air-Conditioning For Vehicles (AREA)

Abstract

A semiconductor air-conditioning card comprises a semiconductor cooling chip (3), a cool-end heat dissipation fin (4), a warm-end heat dissipation fin (2) and a vapor chamber (6) having a solvent in a vacuum cavity. A cool surface of the cool-end heat dissipation fin (4) and a cool surface of the semiconductor cooling chip (3) are connected, a warm surface of the semiconductor cooling chip (3) is connected to one end of the vapor chamber (6) having a solvent in a vacuum cavity, and the warm-end heat dissipation fin (2) is connected to the other end of the vapor chamber (6) having a solvent in a vacuum cavity.

Description

一种半导体空调卡及坐垫、座椅、床垫Semiconductor air conditioner card and seat cushion, seat and mattress 技术领域Technical field
本发明涉及一种半导体空调卡及坐垫、座椅、床垫,属于高新技术电子产品制造领域。The invention relates to a semiconductor air conditioner card, a seat cushion, a seat and a mattress, and belongs to the field of high-tech electronic product manufacturing.
背景技术Background technique
半导体具有两个重要的物理效应,即塞贝克效应和帕尔帖效应,前者可用于发电和温度检测,而后者则用于制冷。当半导体芯片工作在制冷模式时,通过消耗电能,在芯片的两端产生温度差,即一端吸热,一端放热,如果热端产生的热量能够被有效的带走,那么冷端的热量就可以持续地输送到热端,从而产生制冷效果。因此半导体芯片虽然本身尺寸较小,但是为了使芯片处于良好的工作状态,热端一般都需要一个较大的散热器和强力的风扇,某些较大功率的芯片甚至需要在工作端采用水冷方式,这些问题直接导致了在应用中,半导体制冷模组的实际尺寸比想象中大得多,常规半导体制冷模组的结构如图1所示。Semiconductors have two important physical effects, the Seebeck effect and the Peltier effect, the former for power generation and temperature detection, while the latter for refrigeration. When the semiconductor chip operates in the cooling mode, by consuming electrical energy, a temperature difference is generated at both ends of the chip, that is, one end absorbs heat and one end radiates heat. If the heat generated by the hot end can be effectively carried away, the heat of the cold end can be It is continuously delivered to the hot end to produce a cooling effect. Therefore, although the semiconductor chip itself is small in size, in order to make the chip in a good working state, the hot end generally needs a large heat sink and a powerful fan, and some of the larger power chips even need to be water-cooled at the working end. These problems directly lead to the actual size of the semiconductor refrigeration module in the application is much larger than expected, the structure of the conventional semiconductor refrigeration module is shown in Figure 1.
所谓半导体空调坐垫或者座椅都是基于上述原理,简单地说,就是将半导体制冷模组与坐垫或座椅结合,配以温控电路和安全控制单元。通过传热媒介(如空气或者水)将坐垫或座椅内的热量传递到冷端,再经过半导体芯片,由热端排放到坐垫或座椅外部,以实现制冷效果。然而在实际应用中,只有在座椅系统中,这一功能才得到了较为完美的运用。半导体空调座椅系统的特点是通过一个强力的涡轮风扇,将高速气流通过半导体芯片两端的散热器,制冷时,将一端产生的冷气流导入座椅的海绵垫内,而另一端的热气流则排出座椅。由于座椅内部具有较大的可操作空间,因此可以使用较大的涡轮风扇和散热器,以确保半导体芯片的工作效率。目前空调座椅已在某些高端车的高配系列开始推广和普及。The so-called semiconductor air conditioner cushion or seat is based on the above principle. Simply put, the semiconductor refrigeration module is combined with a seat cushion or a seat, and is equipped with a temperature control circuit and a safety control unit. The heat in the seat cushion or the seat is transmitted to the cold end through a heat transfer medium (such as air or water), and then passed through the semiconductor chip and discharged from the hot end to the outside of the seat or the seat to achieve a cooling effect. However, in practical applications, this function is only perfectly used in the seat system. The semiconductor air-conditioning seat system features a powerful turbo fan that passes high-speed airflow through the radiators at both ends of the semiconductor chip. When cooling, the cold airflow generated at one end is introduced into the sponge pad of the seat, while the hot air flow at the other end is Discharge the seat. Due to the large operational space inside the seat, larger turbo fans and heat sinks can be used to ensure the efficiency of the semiconductor chip. At present, air-conditioned seats have been promoted and popularized in some high-end series of high-end cars.
中国专利文件“一种内置式车用温控座椅”,公告号201989661,公开了一种内置式车用温控座椅,是由座垫,靠背垫,二个带孔真皮套,二个带孔海绵,进气风扇,可伸缩式通风软管道,二个带散热器半导体冷热模块,二个风分离器,控制装置所组合构成, 通过风扇带动冷热交换,该专利只能运用在座椅系统中。The Chinese patent document "a built-in temperature control seat for vehicles", bulletin No. 201989661, discloses a built-in temperature control seat for vehicles, which is a seat cushion, a back cushion, two leather sleeves with holes, two a perforated sponge, an intake fan, a retractable ventilated soft pipe, two semiconductor cooling and heating modules with a radiator, two wind separators, and a control device. This patent can only be used in the seat system by fan-driven hot and cold exchange.
而空调坐垫技术相对座椅技术来说显得非常不成熟,虽然市面上偶尔也有类似的产品出现,但是由于存着明显的技术缺憾而一直未能普及。现有的空调坐垫技术的特征可概括如下:1)半导体制冷片工作在坐垫外部,这是由于制冷片是一个易碎不耐压的部件,因此无法承受较大的机械压力或形变应力;2)由于制冷片工作在坐垫外部,因此坐垫内部和制冷片冷端的换热需通过固体或者液体传热媒介实现,如采用传热系数高的金属如铝铜板,或者比热大的液体介质如水等;3)散热端部件体积庞大,这是制冷片需要工作在坐垫外部的另一个重要原因,由于半导体制冷片的工作效率相对较低,如目前市面上制冷片的电功效率不到60%,制冷的同时将放出大量热,如果散热不良,将无制冷效果,因此散热端翅片较大,甚至借鉴电脑显卡和CPU散热,采用厚重的热管翅片散热器加风扇以增强散热。The air-cushion cushion technology is very immature compared to the seat technology. Although similar products appear on the market occasionally, they have not been popularized due to obvious technical defects. The characteristics of the existing air-conditioning cushion technology can be summarized as follows: 1) The semiconductor refrigeration sheet works outside the seat cushion, because the refrigeration sheet is a fragile and non-pressure-resistant component, and therefore cannot withstand large mechanical pressure or deformation stress; Since the cooling sheet works outside the seat cushion, the heat exchange between the inside of the seat cushion and the cold end of the refrigerating sheet needs to be achieved by a solid or liquid heat transfer medium, such as a metal having a high heat transfer coefficient such as an aluminum copper plate, or a liquid medium such as water which is larger than heat. 3) The heat-dissipating end part is bulky, which is another important reason why the cooling piece needs to work outside the seat cushion. Since the working efficiency of the semiconductor refrigerating piece is relatively low, for example, the electric power efficiency of the refrigerating piece on the market is less than 60%. At the same time of cooling, a large amount of heat will be released. If the heat is not good, there will be no cooling effect. Therefore, the fins of the heat dissipation end are large, and even the computer graphics card and the CPU are used for heat dissipation. A thick heat pipe fin radiator is used to add heat to enhance heat dissipation.
现有空调坐垫技术存在下述明显问题:1)为了避免半导体制冷片受压和保证散热端良好散热,坐垫必须做得非常厚,过厚的厚度将极大改变汽车座椅的驾驶视角,甚至妨碍汽车座椅的安全系统;2)采用铜铝板实现坐垫和制冷片之间的热交换实际应用中可行性低,首先为确保传热功率,铜铝板远比想象中的厚,其次由于存在明显温度梯度(铜铝金属板传热机制就是通过温度差异实现热传导,没有温梯就没有热传导),坐垫的均温性很差,靠近制冷片的区域很冷,远离制冷片的区域基本没有制冷效果;3)现有技术较可行的方案是通过水作为传热介质,即在坐垫外部用半导体制冷技术将水冷却,通过水泵注入坐垫内部进行热交换,这样的工作方式,缺点是显而易见的,首先制冷速率慢,效率低下(水的比热大,需要将水冷却到一定温度才能产生明显的制冷效果);其次,为了弥补效率不足,往往需采用大功率的半导体芯片,能耗高;最后,坐垫内遍布水管,一旦发生泄漏,可能带来后续的安全隐患。The existing air-conditioning cushion technology has the following obvious problems: 1) In order to avoid the pressure of the semiconductor refrigeration chip and ensure good heat dissipation at the heat-dissipating end, the seat cushion must be made very thick, and the excessive thickness will greatly change the driving angle of the car seat, even The safety system that hinders the car seat; 2) The copper-aluminum plate is used to realize the heat exchange between the seat cushion and the cooling plate. The practical application is low, firstly to ensure the heat transfer power, the copper-aluminum plate is much thicker than expected, and secondly because of the obvious Temperature gradient (the heat transfer mechanism of copper-aluminum metal plate is to realize heat conduction through temperature difference, there is no heat conduction without temperature ladder), the temperature uniformity of the seat cushion is very poor, the area close to the cooling piece is very cold, and the area away from the cooling piece has basically no cooling effect. 3) The more feasible solution in the prior art is to use water as a heat transfer medium, that is, to cool the water with a semiconductor refrigeration technology outside the seat cushion, and to inject heat into the inside of the seat cushion by a water pump. The disadvantage of this working mode is obvious. The cooling rate is slow and the efficiency is low (the specific heat of water is large, and it is necessary to cool the water to a certain temperature to produce a significant cooling effect) Secondly, in order to make up for the lack of efficiency, it is often necessary to use a high-power semiconductor chip, which has high energy consumption. Finally, the water pipe is distributed in the seat cushion, and once a leak occurs, it may bring subsequent safety hazards.
因此,研发一种制冷效果好、轻小便携又易于推广的半导体空调坐垫技术具有十分重要的创新意义及商业价值。Therefore, it is of great significance to innovate and develop a semiconductor air-conditioning cushion technology with good refrigeration effect, light weight, portability and easy promotion.
发明内容Summary of the invention
针对现有技术的不足,本发明提供了一种半导体空调卡;In view of the deficiencies of the prior art, the present invention provides a semiconductor air conditioner card;
本发明还提供了一种包括半导体空调卡的坐垫、座椅及床垫。The present invention also provides a seat cushion, a seat and a mattress including a semiconductor air conditioner card.
本发明提供的半导体空调卡利用了半导体制冷芯片体积小,质量轻,制冷速度快,环保无噪音等特点,将半导体制冷芯片与散热鳍片集成为薄卡,直接工作于坐垫和座椅 等内部,达到快速制冷的效果。The semiconductor air conditioning card provided by the invention utilizes the characteristics of small size, light weight, fast cooling speed, environmental protection and no noise of the semiconductor refrigeration chip, and integrates the semiconductor refrigeration chip and the heat dissipation fin into a thin card, and directly works on the seat cushion and the seat. Wait for the interior to achieve fast cooling.
本发明的技术方案如下:The technical solution of the present invention is as follows:
一种半导体空调卡,包括半导体制冷芯片、散热鳍片和真空腔溶剂均热板,所述的散热鳍片包括冷端散热鳍片和热端散热鳍片,所述的冷端散热鳍片与半导体制冷芯片冷面相连,半导体制冷芯片热面与真空腔溶剂均热板一端相连,所述的热端散热鳍片与所述真空腔溶剂均热板另一端相连。通过半导体制冷芯片、散热鳍片和真空腔溶剂均热板的组合成新型半导体空调卡,既达到优良的制冷效果又降低了体积尺寸。A semiconductor air conditioner card comprising a semiconductor refrigeration chip, a heat dissipation fin and a vacuum chamber solvent heat absorption plate, wherein the heat dissipation fin comprises a cold end heat dissipation fin and a heat end heat dissipation fin, and the cold end heat dissipation fin and the cold end fin The cold surface of the semiconductor refrigeration chip is connected, and the hot surface of the semiconductor refrigeration chip is connected to one end of the vacuum chamber solvent soaking plate, and the hot end heat dissipating fin is connected to the other end of the vacuum chamber solvent soaking plate. The combination of a semiconductor refrigeration chip, a heat sink fin, and a vacuum chamber solvent soaking plate into a new type of semiconductor air conditioner card achieves both excellent cooling performance and reduced size.
根据本发明优选的,所述的半导体空调卡还包括制冷端底座,所述的半导体制冷芯片和冷端散热鳍片通过制冷端底座与真空腔溶剂均热板一端相连。According to the preferred embodiment of the present invention, the semiconductor air conditioner card further includes a refrigerating end base, and the semiconductor refrigerating chip and the cold end fin are connected to one end of the vacuum chamber solvent soaking plate through the refrigerating end base.
进一步优选的,所述的制冷端底座设有进气口分流挡片。Further preferably, the refrigerating end base is provided with an air inlet shunt flap.
所述的制冷端底座为隔热塑料材质,主要起以下两方面作用:a)对半导体制冷芯片和冷端散热鳍片进行安装固定;b)制冷端底座一端的进气口分流挡片将气流分为两部分,一部分气流通过半导体空调卡的冷端散热鳍片产生制冷空气,另一部分气流则通过热端散热鳍片,将半导体制冷芯片产生的热量带走。The cooling end base is made of heat-insulating plastic material, and mainly functions as follows: a) mounting and fixing the semiconductor cooling chip and the cold-end heat-dissipating fin; b) the air inlet shunt blocking end of the cooling end base Divided into two parts, a part of the airflow generates cooling air through the cold-end heat-dissipating fins of the semiconductor air-conditioning card, and the other part of the airflow passes the heat-dissipating fins to remove the heat generated by the semiconductor cooling chip.
根据本发明优选的,所述的半导体空调卡还包括半导体空调卡壳体,所述半导体空调卡壳体位于半导体空调卡外部,半导体空调卡壳体为一个两端开口的扁长形盒体,盒体的中部设置有半导体空调卡插槽用于连接半导体空调卡,盒体的中部设有进气口,盒体底部设有进风口、出风口和热气流出口。According to the preferred embodiment of the present invention, the semiconductor air conditioner card further includes a semiconductor air conditioner card housing, the semiconductor air conditioner card housing is located outside the semiconductor air conditioner card, and the semiconductor air conditioner card housing is a flat elongated box body with open ends, and the box body The middle part is provided with a semiconductor air-conditioning card slot for connecting the semiconductor air-conditioning card, the middle of the box body is provided with an air inlet, and the bottom of the box body is provided with an air inlet, an air outlet and a hot air outlet.
半导体空调卡壳体起以下几方面作用:c)防止半导体空调卡和外部发生不良热交换;d)分配冷端和热端的气流量,实现最佳匹配;e)在散热鳍片表面产生高速气流,提升散热鳍片的热交换比;f)对半导体空调卡提供一定的机械防护,防止半导体空调卡因压力过大而损坏。The semiconductor air conditioner card housing plays the following roles: c) preventing bad heat exchange between the semiconductor air conditioner card and the outside; d) distributing the air flow at the cold end and the hot end to achieve the best match; e) generating high-speed airflow on the surface of the heat sink fin, Improve the heat exchange ratio of the heat sink fins; f) Provide certain mechanical protection to the semiconductor air conditioner card to prevent the semiconductor air conditioner card from being damaged due to excessive pressure.
半导体空调卡的工作原理为:当半导体制冷芯片工作时,半导体制冷芯片的发热端即热面产生的热量会使真空腔溶剂均热板一端腔体内的低沸点溶剂迅速挥发,产生的蒸汽可以迅速扩散到真空腔溶剂均热板另一端,在热端散热鳍片高速流动空气的冷却下,蒸汽被重新冷凝,通过毛细作用回流到连接有半导体制冷芯片的真空腔溶剂均热板一端,从而产生一个快速的热交换循环。与普通热管相比,真空腔溶剂均热板更适合进行超薄设计,并且真空腔溶剂均热板具有更大的散热面积、更高的热交换效率。The working principle of the semiconductor air conditioner card is: when the semiconductor refrigeration chip is working, the heat generated by the hot end of the semiconductor refrigeration chip, that is, the heat generated by the hot surface, causes the low boiling point solvent in the cavity of the vacuum chamber solvent soaking plate to be quickly volatilized, and the generated steam can be quickly Diffusion into the vacuum chamber at the other end of the solvent soaking plate. Under the cooling of the high-speed flowing air of the heat-dissipating fins, the steam is recondensed and returned to the end of the solvent-heating plate of the vacuum chamber to which the semiconductor refrigeration chip is connected by capillary action. A fast heat exchange cycle. Compared with ordinary heat pipes, the vacuum chamber solvent soaking plate is more suitable for ultra-thin design, and the vacuum chamber solvent soaking plate has larger heat dissipation area and higher heat exchange efficiency.
一种坐垫,包括网状垫体和如上所述的半导体空调卡,所述半导体空调卡位于网状 垫体内部。A seat cushion comprising a mesh body and a semiconductor air conditioner card as described above, the semiconductor air conditioner card being located in a mesh The inside of the mat.
根据本发明优选的,所述坐垫还包括支撑内衬,所述支撑内衬用于连接半导体空调卡和网状垫体。支撑内衬将半导体空调卡和坐垫的网状垫体连接,起着缓冲和传热的作用,并进一步增加乘坐的舒适性和安全性,材质为柔性阻燃的有机聚合物。According to a preferred embodiment of the present invention, the seat cushion further includes a support lining for connecting the semiconductor air conditioner card and the mesh pad. The support lining connects the semiconductor air conditioner card to the mesh pad of the seat cushion, plays a role of buffering and heat transfer, and further increases the comfort and safety of the ride. The material is a flexible flame retardant organic polymer.
进一步优选的,所述支撑内衬包括匹配连接的内衬上部与内衬下部,半导体空调卡设置于内衬上部与内衬下部之间。内衬上部与内衬下部的结构对称,通过安装孔连接固定。Further preferably, the support liner comprises a matchingly connected upper portion of the inner liner and a lower portion of the inner liner, and the semiconductor air conditioner card is disposed between the upper portion of the inner liner and the lower portion of the inner liner. The upper part of the inner liner is symmetrical with the structure of the lower part of the inner liner, and is fixed by the mounting hole.
进一步优选的,所述支撑内衬设置有微气孔。微气孔用于更好的使半导体空调卡产生的冷气均匀的散向坐垫中。Further preferably, the support liner is provided with micropores. The micro-pores are used to better dissipate the cold air generated by the semiconductor air-conditioning card evenly into the seat cushion.
进一步优选的,所述支撑内衬设置有缓冲垫圈。缓冲垫圈是为增加乘坐的舒适性。Further preferably, the support liner is provided with a cushioning washer. The cushion washer is for added comfort.
根据本发明优选的,所述的坐垫还包括循环风路系统,所述的循环风路系统设置于坐垫外部,循环风路系统包括风机和通风管道,通风管道与半导体空调卡外部的半导体空调卡壳体相连。循环风路系统的设计能够迅速地实现散热,有效改善了坐垫的均温性能。According to the preferred embodiment of the present invention, the seat cushion further includes a circulation air passage system, the circulation air passage system is disposed outside the seat cushion, and the circulation air passage system includes a fan and a ventilation duct, and the ventilation air duct and the semiconductor air conditioner card outside the semiconductor air conditioner card Connected. The design of the circulating air system can quickly achieve heat dissipation, which effectively improves the uniform temperature performance of the seat cushion.
一种座椅,包括座椅本体和如上所述的半导体空调卡,所述的半导体空调卡设置于座椅本体内部。A seat comprising a seat body and a semiconductor air conditioner card as described above, the semiconductor air conditioner card being disposed inside the seat body.
一种床垫,包括床垫本体和如上所述的半导体空调卡,所述的半导体空调卡设置于床垫本体内部。A mattress comprising a mattress body and a semiconductor air conditioner card as described above, the semiconductor air conditioner card being disposed inside the mattress body.
本发明的有益效果在于,本发明进行了以下几项技术革新:The beneficial effects of the present invention are that the present invention carries out the following technological innovations:
1)利用本发明的技术方案,可以不使用水等液体作为传热媒介,半导体制冷芯片可以直接工作于坐垫、座椅等内部,最大限度的降低了制冷过程中的热损失,极大提升了半导体制冷芯片的制冷效率,工作效率非常高,可以用小功率的芯片就达到很好的制冷效果;1) By using the technical solution of the invention, the liquid such as water can be used as the heat transfer medium, and the semiconductor refrigeration chip can directly work inside the seat cushion, the seat, etc., thereby minimizing the heat loss in the refrigeration process and greatly improving the heat loss. The cooling efficiency of the semiconductor refrigeration chip is very high, and a good cooling effect can be achieved with a small power chip;
2)由于不存在水等高比热容间接传热介质,工作速度非常快,半导体制冷芯片电源一启动热传递就能有效进行,制冷迅速;2) Since there is no indirect heat transfer medium with water specific heat capacity, the working speed is very fast, and the heat transfer of the semiconductor refrigeration chip power source can be effectively performed, and the cooling is rapid;
3)本发明的技术方案为了适应应用产品尤其是坐垫的厚度要求,对半导体制冷芯片的工作方式和组成结构进行了创新设计,提出了半导体空调卡的设计概念,将半导体制冷芯片集成化、超薄化和标准化,采用卡式设计,该设计的半导体空调卡厚度可以控制在1-2厘米,这样的设计不仅可以应用到空调坐垫系统,还可对现有空调座椅系统产生 革新性影响;3) Technical Solution of the Invention In order to adapt to the thickness requirements of the application products, especially the seat cushion, the working mode and composition structure of the semiconductor refrigeration chip are innovatively designed, and the design concept of the semiconductor air conditioner card is proposed, and the semiconductor refrigeration chip is integrated and super Thinning and standardization, the card design, the design of the semiconductor air conditioning card thickness can be controlled at 1-2 cm, this design can be applied not only to the air conditioning cushion system, but also to the existing air conditioning seat system Innovative impact
4)本发明采用了高效的热交换方式和独特的散热设计,特别设计了循环风路系统,不但可以在坐垫内部形成一个自然的循环风道,提升散热效率,同时可以大大降低风机的噪音,使用较小的风机就可以使半导体制冷芯片高效工作,风机噪音低,噪音<30dB,更为环保和节能。4) The invention adopts an efficient heat exchange method and a unique heat dissipation design, and specially designs a circulation air passage system, which can not only form a natural circulation air passage inside the seat cushion, but also can improve the heat dissipation efficiency and greatly reduce the noise of the fan. The use of a smaller fan allows the semiconductor refrigeration chip to work efficiently, with low fan noise and noise <30dB, which is more environmentally friendly and energy efficient.
附图说明DRAWINGS
图1为现有技术中常规半导体制冷模组结构示意图;1 is a schematic structural view of a conventional semiconductor refrigeration module in the prior art;
图2为本发明半导体空调卡工作原理及立体结构示意图;2 is a schematic view showing the working principle and a three-dimensional structure of a semiconductor air conditioner card according to the present invention;
图3为本发明半导体空调卡结构俯视示意图;3 is a top plan view showing a structure of a semiconductor air conditioner card according to the present invention;
图4为本发明半导体空调卡结构前视示意图;4 is a front view showing the structure of a semiconductor air conditioner card according to the present invention;
图5为本发明半导体空调卡壳体结构前视示意图;Figure 5 is a front elevational view showing the structure of a semiconductor air conditioner card housing of the present invention;
图6为图5A-A剖面示意图;Figure 6 is a schematic cross-sectional view of Figure 5A-A;
图7为本发明半导体空调卡与半导体空调卡壳体组装示意图;7 is a schematic view showing the assembly of a semiconductor air conditioner card and a semiconductor air conditioner card housing according to the present invention;
图8为本发明支撑内衬内衬下部示意图;Figure 8 is a schematic view of the lower part of the inner liner of the support liner of the present invention;
图9为本发明半导体空调卡壳体与支撑内衬装配分离示意图;9 is a schematic view showing the assembly and separation of a semiconductor air conditioner card housing and a support lining according to the present invention;
图10为本发明半导体空调卡及循环风路系统搭配坐垫工作的结构透视示意图。FIG. 10 is a perspective view showing the structure of a semiconductor air conditioner card and a circulating air passage system in accordance with the present invention.
其中:1、现有技术中的热端风扇,2、热端散热鳍片,3、半导体制冷芯片,4、冷端散热鳍片,5、现有技术中的冷端风扇,6、真空腔溶剂均热板,7、真空腔溶剂均热板腔内溶剂,8、出风口,9、进风口,10、热气流出口,11、半导体空调卡壳体,12、微气孔,13缓冲垫圈,14、安装孔,15、内衬上部,16、内衬下部,17、半导体空调卡插槽,18、网状垫体,19、支撑内衬,20、制冷端底座,21、进气口分流挡片,22、进气口。Among them: 1, the hot end fan in the prior art, 2, the hot end heat sink fin, 3, the semiconductor refrigeration chip, 4, the cold end heat sink fin, 5, the cold end fan in the prior art, 6, the vacuum chamber Solvent soaking plate, 7, vacuum chamber solvent soaking plate cavity solvent, 8, air outlet, 9, air inlet, 10, hot air outlet, 11, semiconductor air conditioning card housing, 12, micro air hole, 13 buffer washer, 14 , mounting hole, 15, upper lining, 16, lower lining, 17, semiconductor air conditioning card slot, 18, mesh pad, 19, support lining, 20, cooling end base, 21, air inlet shunt Sheet, 22, air inlet.
具体实施方式detailed description
下面通过实施例并结合附图对本发明做进一步说明,但不限于此。The invention will be further illustrated by the following examples in conjunction with the accompanying drawings, but not limited thereto.
如图1-10所示:As shown in Figure 1-10:
实施例1:Example 1:
一种半导体空调卡,包括半导体制冷芯片、散热鳍片和真空腔溶剂均热板,所述的散热鳍片包括冷端散热鳍片和热端散热鳍片,如图2所示,冷端散热鳍片与半导体制冷芯片冷面相连,半导体制冷芯片发热端即热面连接于真空腔溶剂均热板的一端,最大限 度的将半导体制冷芯片产生的低温扩散出去,当半导体制冷芯片工作时,半导体制冷芯片的发热端即热面产生的热量会使真空腔溶剂均热板一端腔体内的低沸点溶剂迅速挥发,产生的蒸汽可以迅速扩散到真空腔溶剂均热板另一端;真空腔溶剂均热板的另一端连接有热端散热鳍片,用以排出真空腔溶剂均热板的热量,在热端散热鳍片高速流动空气的冷却下,蒸汽被重新冷凝,通过毛细作用回流到连接有半导体制冷芯片的真空腔溶剂均热板一端,从而产生一个快速的热交换循环,带走半导体制冷芯片产生的热量。A semiconductor air conditioning card comprises a semiconductor refrigeration chip, a heat dissipation fin and a vacuum cavity solvent heat absorption plate, wherein the heat dissipation fin comprises a cold end heat dissipation fin and a heat end heat dissipation fin, as shown in FIG. 2, the cold end heat dissipation The fin is connected to the cold surface of the semiconductor refrigerating chip, and the heating end of the semiconductor refrigerating chip, that is, the hot surface is connected to one end of the vacuum chamber solvent soaking plate, the maximum limit The low temperature generated by the semiconductor refrigeration chip is diffused out. When the semiconductor refrigeration chip is operated, the heat generated by the hot end of the semiconductor refrigeration chip, that is, the heat generated by the hot surface, rapidly evaporates the low boiling point solvent in the cavity of the solvent chamber of the vacuum chamber. The steam can be quickly diffused to the other end of the vacuum chamber solvent soaking plate; the other end of the vacuum chamber solvent soaking plate is connected with a heat-side heat-dissipating fin for discharging the heat of the vacuum chamber solvent soaking plate, and the heat-dissipating fin at the hot end Under the cooling of the high-speed flowing air, the steam is recondensed and returned to the vacuum chamber of the vacuum chamber to which the semiconductor refrigeration chip is connected by capillary action, thereby generating a rapid heat exchange cycle, taking away the heat generated by the semiconductor refrigeration chip.
实施例2;Example 2;
一种半导体空调卡,其结构如实施例1所述,区别在于,进一步的,所述的半导体空调卡还包括制冷端底座,所述的半导体制冷芯片和冷端散热鳍片通过制冷端底座与真空腔溶剂均热板一端相连,如图3、图4所示,半导体制冷芯片通过制冷端底座连接于真空腔溶剂均热板一端,冷端散热鳍片与半导体制冷芯片的冷面相连并固定于制冷端底座上,制冷端底座还设有进气口分流挡片,将气流分为两部分,一部分气流通过半导体空调卡的冷端散热鳍片产生空调卡冷气流,另一部分气流则通过热端散热鳍片,产生空调卡热气流,将半导体制冷芯片产生的热量带走。A semiconductor air conditioner card having the structure as described in Embodiment 1, except that the semiconductor air conditioner card further includes a refrigerating end base, and the semiconductor refrigerating chip and the cold end fins pass through the refrigerating end base and The vacuum chamber solvent heating plate is connected at one end. As shown in FIG. 3 and FIG. 4, the semiconductor refrigeration chip is connected to one end of the vacuum chamber solvent soaking plate through the cooling end base, and the cold end heat sink fin is connected to the cold surface of the semiconductor refrigeration chip and fixed. On the cooling end base, the cooling end base is further provided with an air inlet shunt blocking piece, which divides the air flow into two parts, a part of the air flow passes through the cold end heat radiating fin of the semiconductor air conditioning card to generate an air conditioning card cold air flow, and the other part of the air flow passes through the heat. The heat-dissipating fins generate a hot air flow of the air-conditioning card to take away the heat generated by the semiconductor cooling chip.
实施例3:Example 3:
为了使半导体空调卡正常工作,需要加入一些辅助的设计,这些设计可以集中到半导体空调卡壳体实现。如本实施例所述的一种半导体空调卡,其结构如实施例1-2任意一项实施例所述,区别在于,还包括半导体空调卡壳体,如图5-7所示,所述半导体空调卡壳体位于半导体空调卡外部,半导体空调卡壳体为一个两端开口的扁长形盒体,盒体的中部设置有半导体空调卡插槽用于连接半导体空调卡,盒体的中部设有进气口,空气通过进气口流向半导体空调卡,盒体底部设有进风口、出风口和热气流出口,以此在盒体内部形成风路,适于空气流动。In order for the semiconductor air conditioner card to work properly, it is necessary to add some auxiliary designs, which can be integrated into the semiconductor air conditioner card housing. A semiconductor air-conditioning card according to any one of the embodiments of the present invention, as defined in any one of the embodiments 1-2, further comprising a semiconductor air-conditioning card housing, as shown in FIG. 5-7, the semiconductor The air-conditioning card housing is located outside the semiconductor air-conditioning card, and the semiconductor air-conditioning card housing is a flat and long-shaped box body with open ends. The middle part of the box body is provided with a semiconductor air-conditioning card slot for connecting the semiconductor air-conditioning card, and the middle portion of the box body is provided with The air port flows through the air inlet to the semiconductor air conditioner card, and the bottom of the box body is provided with an air inlet, an air outlet and a hot air outlet, thereby forming a wind path inside the box body, which is suitable for air flow.
实施例4:Example 4:
一种坐垫,包括网状垫体和如实施例1-3任意一项实施例所述的半导体空调卡,所述半导体空调卡位于网状垫体内部。利用半导体空调卡的结构特性使其能够极好的应用在坐垫中。网状垫体采用有机高聚物材料制作,对材质有以下要求;i)高弹性多孔结构,以利于气流传输和散热;ii)低比热,制冷启动速度快;iii)阻燃,安全性高。A seat cushion comprising a mesh body and a semiconductor air conditioner card according to any one of embodiments 1-3, the semiconductor air conditioner card being located inside the mesh body. The structural characteristics of the semiconductor air conditioner card make it excellent for use in the seat cushion. The mesh pad is made of organic polymer material and has the following requirements for materials; i) high elastic porous structure for airflow and heat dissipation; ii) low specific heat, fast cooling start-up speed; iii) flame retardant, safety high.
实施例5:Example 5:
一种坐垫,如实施例4所述,区别在于,坐垫还包括支撑内衬,所述支撑内衬用于 连接半导体空调卡和网状垫体,如图8-9所示,支撑内衬包括匹配连接的内衬上部与内衬下部,内衬上部与内衬下部的结构对称,通过安装孔将内衬上部与内衬下部连接固定,半导体空调卡设置于内衬上部与内衬下部之间,支撑内衬将半导体空调卡和坐垫的网状垫体连接起来,起着缓冲和传热的作用,并进一步增加乘坐的散热性、舒适性和安全性,支撑内衬材质为柔性阻燃有机聚合物。A seat cushion, as described in embodiment 4, except that the seat cushion further includes a support liner for the support liner Connecting the semiconductor air conditioner card and the mesh pad body, as shown in Figure 8-9, the support lining includes the upper part of the inner liner and the lower part of the inner lining which are matched and connected, and the upper part of the inner lining and the lower part of the inner lining are symmetrically symmetrical, and the lining is lining through the mounting hole The upper part is fixedly connected with the lower part of the inner liner, and the semiconductor air conditioner card is disposed between the upper part of the inner liner and the lower part of the inner liner, and the supporting inner liner connects the semiconductor air conditioner card and the mesh pad body of the seat cushion to play the role of buffering and heat transfer, and Further increase the heat dissipation, comfort and safety of the ride, and the support lining material is a flexible flame retardant organic polymer.
实施例6:Example 6
一种坐垫,如实施例5所述,区别在于,支撑内衬设置有微气孔,用以更好的使半导体空调卡产生的冷气均匀的散向坐垫。A seat cushion is as described in Embodiment 5, except that the support lining is provided with micro air holes for better dispersing the cold air generated by the semiconductor air conditioner card to the seat cushion.
实施例7:Example 7
一种坐垫,如实施例5所述,区别在于,支撑内衬设置有缓冲垫圈,以增加乘坐的舒适性。A seat cushion, as described in embodiment 5, except that the support liner is provided with a cushioning washer to increase ride comfort.
实施例8:Example 8
一种坐垫,如实施例4所述,区别在于,坐垫还包括循环风路系统,所述的循环风路系统设置于坐垫外部,循环风路系统包括风机和通风管道,通风管道与半导体空调卡外部的半导体空调卡壳体一端相连,即与半导体空调卡壳体的进风口、出风口相连。A seat cushion, as described in Embodiment 4, except that the seat cushion further includes a circulation air passage system, the circulation air passage system is disposed outside the seat cushion, and the circulation air passage system includes a fan and a ventilation duct, the ventilation duct and the semiconductor air conditioner card. The external semiconductor air-conditioning card housing is connected at one end, that is, connected to the air inlet and the air outlet of the semiconductor air-conditioning card housing.
由于坐垫的厚度很有限,虽然采用半导体空调卡可以使制冷芯片直接在坐垫内部工作,但是冷气流仅是从半导体空调卡的一端释放,要扩散到整个网状垫体仍存在一定的阻力,这一情况会导致靠近半导体空调卡冷气流出口一端的坐垫温度较低,而靠近热气流出口一端的坐垫则温度则较高,从而影响了整个坐垫的均温性。为了改善这一状况,在坐垫内部、外部进行循环风路构造,增加设计循环风路系统用以确保坐垫的均温性能。如图10所示,通风管道连接在坐垫前部位置,利用风机,首先将坐垫内部的空气抽出,即空气在风机的抽取作用下由出风口被抽出,经循环风路系统后再由半导体空调卡壳体的进风口送至半导体空调卡的进气口,在进气口处的进气口分流挡片的作用下气流一分为二,分别经过半导体空调卡的冷端散热鳍片和热端散热鳍片。经过冷端散热鳍片的空调卡冷气流吹入坐垫的中后部,并在坐垫内被抽吸到坐垫前部重新被风机抽出;而经过热端散热鳍片的空调卡热气流则经由热气流出口直接排出坐垫。这样的工作方式,使得坐垫内的气流可以形成一个循环回路,迅速地实现散热,并能保证良好的均温性能。Since the thickness of the seat cushion is very limited, although the semiconductor air conditioner card can make the refrigeration chip work directly inside the seat cushion, the cold air flow is only released from one end of the semiconductor air conditioner card, and there is still some resistance to diffuse to the entire mesh cushion body. In one case, the temperature of the seat cushion near the end of the cold air outlet of the semiconductor air conditioner card is lower, and the temperature of the seat cushion near the end of the hot air outlet is higher, thereby affecting the temperature uniformity of the entire seat cushion. In order to improve this situation, the circulation air path structure is constructed inside and outside the seat cushion, and the design circulation air path system is added to ensure the uniform temperature performance of the seat cushion. As shown in Fig. 10, the ventilation duct is connected at the front position of the seat cushion, and the air inside the seat cushion is first extracted by the fan, that is, the air is extracted by the air outlet under the extraction action of the fan, and then the semiconductor air conditioner is passed through the circulation air passage system. The air inlet of the card housing is sent to the air inlet of the semiconductor air conditioner card, and the air flow is divided into two by the air inlet shunt at the air inlet, respectively, through the cold end fins and the hot end of the semiconductor air conditioner card. Cooling fins. The cold air flow through the cold-end heat-dissipating fins is blown into the middle and rear parts of the seat cushion, and is sucked into the front part of the seat cushion and re-extracted by the fan in the seat cushion; and the air-conditioning card through the hot-end heat-dissipating fins passes through the heat. The air outlet exits the seat cushion directly. This way of working, the airflow in the seat cushion can form a circulation loop, quickly achieve heat dissipation, and can ensure good temperature uniform performance.
实施例9:Example 9
一种座椅,包括座椅本体和如实施例1-3任意一项实施例所述的半导体空调卡,所 述的半导体空调卡设置于座椅本体内部。可以根据座椅的大小等具体情况选择半导体空调卡的安装个数等要素,在安装和维护上更为便利,安全性也可以大幅度提升。A seat comprising a seat body and a semiconductor air conditioner card according to any one of embodiments 1-3, The semiconductor air conditioner card described above is disposed inside the seat body. The number of semiconductor air conditioner cards installed and the like can be selected according to the size of the seat, etc., and the installation and maintenance are more convenient, and the safety can be greatly improved.
实施例10:Example 10:
一种床垫,包括床垫本体和如实施例1-3任意一项实施例所述的半导体空调卡,所述的半导体空调卡设置于床垫本体内部。 A mattress comprising a mattress body and the semiconductor air conditioner card according to any one of embodiments 1-3, wherein the semiconductor air conditioner card is disposed inside the mattress body.

Claims (12)

  1. 一种半导体空调卡,其特征在于,包括半导体制冷芯片、散热鳍片和均热板,所述的散热鳍片包括冷端散热鳍片和热端散热鳍片,所述的冷端散热鳍片与半导体制冷芯片冷面相连,半导体制冷芯片热面与均热板一端相连,所述的热端散热鳍片与所述均热板另一端相连。A semiconductor air conditioning card includes a semiconductor cooling chip, a heat dissipating fin and a heat equalizing plate, wherein the heat dissipating fin comprises a cold end heat sink fin and a hot end heat sink fin, and the cold end heat sink fin Connected to the cold surface of the semiconductor refrigeration chip, the hot surface of the semiconductor cooling chip is connected to one end of the heat equalizing plate, and the hot end heat radiating fin is connected to the other end of the heat equalizing plate.
  2. 根据权利要求1所述的半导体空调卡,其特征在于,所述的半导体空调卡还包括制冷端底座,所述的半导体制冷芯片和冷端散热鳍片通过制冷端底座与真空腔溶剂均热板一端相连。The semiconductor air conditioner card according to claim 1, wherein the semiconductor air conditioner card further comprises a refrigerating end base, and the semiconductor refrigerating chip and the cold end fins pass through the refrigerating end base and the vacuum chamber solvent soaking plate Connected at one end.
  3. 根据权利要求2所述的半导体空调卡,其特征在于,所述的制冷端底座设有进气口分流挡片。The semiconductor air conditioner card according to claim 2, wherein said refrigerating end base is provided with an air inlet choke.
  4. 根据权利要求1所述的半导体空调卡,其特征在于,所述的半导体空调卡还包括半导体空调卡壳体,所述半导体空调卡壳体位于半导体空调卡外部,半导体空调卡壳体为一个两端开口的扁长形盒体,盒体的中部设置有半导体空调卡插槽用于连接半导体空调卡,盒体的中部设有进气口,盒体底部设有进风口、出风口和热气流出口。The semiconductor air conditioner card according to claim 1, wherein said semiconductor air conditioner card further comprises a semiconductor air conditioner card housing, said semiconductor air conditioner card housing being located outside said semiconductor air conditioner card, said semiconductor air conditioner card housing being open at both ends The flat elongated box body is provided with a semiconductor air conditioner card slot for connecting the semiconductor air conditioner card in the middle of the box body, and the air inlet is provided in the middle of the box body, and the air inlet, the air outlet and the hot air outlet are provided at the bottom of the box body.
  5. 一种坐垫,其特征在于,所述坐垫包括网状垫体和如权利要求1-4任意一项权利要求所述的半导体空调卡,所述半导体空调卡位于网状垫体内部。A seat cushion, characterized in that the seat cushion comprises a mesh cushion body and the semiconductor air conditioner card according to any one of claims 1 to 4, the semiconductor air conditioner card being located inside the mesh cushion body.
  6. 根据权利要求5所述的坐垫,其特征在于,所述坐垫还包括支撑内衬,所述支撑内衬用于连接半导体空调卡和网状垫体。The seat cushion according to claim 5, wherein the seat cushion further comprises a support lining for connecting the semiconductor air conditioner card and the mesh pad.
  7. 根据权利要求6所述的坐垫,其特征在于,所述支撑内衬包括匹配连接的内衬上部与内衬下部,半导体空调卡设置于内衬上部与内衬下部之间;优选的,所述支撑内衬设置有微气孔:进一步优选的,所述支撑内衬设置有缓冲垫圈。The seat cushion according to claim 6, wherein said support lining comprises a mating upper portion of the inner liner and a lower portion of the inner liner, and the semiconductor air conditioner card is disposed between the upper portion of the inner liner and the lower portion of the inner liner; preferably, said The support liner is provided with micropores: Further preferably, the support liner is provided with a cushioning gasket.
  8. 根据权利要求5所述的坐垫,其特征在于,所述的坐垫还包括循环风路系统,所述的循环风路系统设置于坐垫外部,循环风路系统包括风机及通风管道,通风管道与半导体空调卡外部的半导体空调卡壳体相连。The seat cushion according to claim 5, wherein the seat cushion further comprises a circulation air passage system, the circulation air passage system is disposed outside the seat cushion, and the circulation air passage system comprises a fan and a ventilation duct, the ventilation duct and the semiconductor The semiconductor air conditioner card housing outside the air conditioner card is connected.
  9. 一种座椅,其特征在于,包括座椅本体和如权利要求1-4任意一项权利要求所述的半导体空调卡,所述的半导体空调卡设置于座椅本体内部。A seat characterized by comprising a seat body and a semiconductor air conditioner card according to any one of claims 1 to 4, wherein the semiconductor air conditioner card is disposed inside the seat body.
  10. 一种床垫,其特征在于,包括床垫本体和如权利要求1-4任意一项权利要求所述的 半导体空调卡,所述的半导体空调卡设置于床垫本体内部。A mattress comprising a mattress body and a claim according to any of claims 1-4 The semiconductor air conditioner card is disposed inside the mattress body.
  11. 根据权利要求1所述的半导体空调卡,其特征在于,所述均热板为溶剂均热板,均热板内设有空腔,空腔内设有传热溶剂。The semiconductor air conditioner card according to claim 1, wherein the heat equalizing plate is a solvent soaking plate, a cavity is provided in the soaking plate, and a heat transfer solvent is disposed in the cavity.
  12. 根据权利要求11所述的半导体空调卡,其特征在于,所述均热板为真空腔溶剂均热板,空腔内设有真空腔溶剂均热板腔内溶剂。 The semiconductor air conditioner card according to claim 11, wherein the heat equalizing plate is a vacuum chamber solvent soaking plate, and the cavity in the cavity is provided with a vacuum chamber solvent soaking plate cavity solvent.
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