WO2017036057A1

WO2017036057A1 - Semiconductor air-conditioning card, cushion, chair and mattress

Info

Publication number: WO2017036057A1
Application number: PCT/CN2016/000480
Authority: WO
Inventors: 夏盛清
Original assignee: 夏盛清
Priority date: 2015-08-31
Filing date: 2016-08-29
Publication date: 2017-03-09
Also published as: CN105180503A; CN105180503B

Abstract

A semiconductor air-conditioning card comprises a semiconductor cooling chip (3), a cool-end heat dissipation fin (4), a warm-end heat dissipation fin (2) and a vapor chamber (6) having a solvent in a vacuum cavity. A cool surface of the cool-end heat dissipation fin (4) and a cool surface of the semiconductor cooling chip (3) are connected, a warm surface of the semiconductor cooling chip (3) is connected to one end of the vapor chamber (6) having a solvent in a vacuum cavity, and the warm-end heat dissipation fin (2) is connected to the other end of the vapor chamber (6) having a solvent in a vacuum cavity.

Description

Semiconductor air conditioner card and seat cushion, seat and mattress

Technical field

The invention relates to a semiconductor air conditioner card, a seat cushion, a seat and a mattress, and belongs to the field of high-tech electronic product manufacturing.

Background technique

Semiconductors have two important physical effects, the Seebeck effect and the Peltier effect, the former for power generation and temperature detection, while the latter for refrigeration. When the semiconductor chip operates in the cooling mode, by consuming electrical energy, a temperature difference is generated at both ends of the chip, that is, one end absorbs heat and one end radiates heat. If the heat generated by the hot end can be effectively carried away, the heat of the cold end can be It is continuously delivered to the hot end to produce a cooling effect. Therefore, although the semiconductor chip itself is small in size, in order to make the chip in a good working state, the hot end generally needs a large heat sink and a powerful fan, and some of the larger power chips even need to be water-cooled at the working end. These problems directly lead to the actual size of the semiconductor refrigeration module in the application is much larger than expected, the structure of the conventional semiconductor refrigeration module is shown in Figure 1.

The so-called semiconductor air conditioner cushion or seat is based on the above principle. Simply put, the semiconductor refrigeration module is combined with a seat cushion or a seat, and is equipped with a temperature control circuit and a safety control unit. The heat in the seat cushion or the seat is transmitted to the cold end through a heat transfer medium (such as air or water), and then passed through the semiconductor chip and discharged from the hot end to the outside of the seat or the seat to achieve a cooling effect. However, in practical applications, this function is only perfectly used in the seat system. The semiconductor air-conditioning seat system features a powerful turbo fan that passes high-speed airflow through the radiators at both ends of the semiconductor chip. When cooling, the cold airflow generated at one end is introduced into the sponge pad of the seat, while the hot air flow at the other end is Discharge the seat. Due to the large operational space inside the seat, larger turbo fans and heat sinks can be used to ensure the efficiency of the semiconductor chip. At present, air-conditioned seats have been promoted and popularized in some high-end series of high-end cars.

The Chinese patent document "a built-in temperature control seat for vehicles", bulletin No. 201989661, discloses a built-in temperature control seat for vehicles, which is a seat cushion, a back cushion, two leather sleeves with holes, two a perforated sponge, an intake fan, a retractable ventilated soft pipe, two semiconductor cooling and heating modules with a radiator, two wind separators, and a control device. This patent can only be used in the seat system by fan-driven hot and cold exchange.

The air-cushion cushion technology is very immature compared to the seat technology. Although similar products appear on the market occasionally, they have not been popularized due to obvious technical defects. The characteristics of the existing air-conditioning cushion technology can be summarized as follows: 1) The semiconductor refrigeration sheet works outside the seat cushion, because the refrigeration sheet is a fragile and non-pressure-resistant component, and therefore cannot withstand large mechanical pressure or deformation stress; Since the cooling sheet works outside the seat cushion, the heat exchange between the inside of the seat cushion and the cold end of the refrigerating sheet needs to be achieved by a solid or liquid heat transfer medium, such as a metal having a high heat transfer coefficient such as an aluminum copper plate, or a liquid medium such as water which is larger than heat. 3) The heat-dissipating end part is bulky, which is another important reason why the cooling piece needs to work outside the seat cushion. Since the working efficiency of the semiconductor refrigerating piece is relatively low, for example, the electric power efficiency of the refrigerating piece on the market is less than 60%. At the same time of cooling, a large amount of heat will be released. If the heat is not good, there will be no cooling effect. Therefore, the fins of the heat dissipation end are large, and even the computer graphics card and the CPU are used for heat dissipation. A thick heat pipe fin radiator is used to add heat to enhance heat dissipation.

The existing air-conditioning cushion technology has the following obvious problems: 1) In order to avoid the pressure of the semiconductor refrigeration chip and ensure good heat dissipation at the heat-dissipating end, the seat cushion must be made very thick, and the excessive thickness will greatly change the driving angle of the car seat, even The safety system that hinders the car seat; 2) The copper-aluminum plate is used to realize the heat exchange between the seat cushion and the cooling plate. The practical application is low, firstly to ensure the heat transfer power, the copper-aluminum plate is much thicker than expected, and secondly because of the obvious Temperature gradient (the heat transfer mechanism of copper-aluminum metal plate is to realize heat conduction through temperature difference, there is no heat conduction without temperature ladder), the temperature uniformity of the seat cushion is very poor, the area close to the cooling piece is very cold, and the area away from the cooling piece has basically no cooling effect. 3) The more feasible solution in the prior art is to use water as a heat transfer medium, that is, to cool the water with a semiconductor refrigeration technology outside the seat cushion, and to inject heat into the inside of the seat cushion by a water pump. The disadvantage of this working mode is obvious. The cooling rate is slow and the efficiency is low (the specific heat of water is large, and it is necessary to cool the water to a certain temperature to produce a significant cooling effect) Secondly, in order to make up for the lack of efficiency, it is often necessary to use a high-power semiconductor chip, which has high energy consumption. Finally, the water pipe is distributed in the seat cushion, and once a leak occurs, it may bring subsequent safety hazards.

Therefore, it is of great significance to innovate and develop a semiconductor air-conditioning cushion technology with good refrigeration effect, light weight, portability and easy promotion.

Summary of the invention

In view of the deficiencies of the prior art, the present invention provides a semiconductor air conditioner card;

The present invention also provides a seat cushion, a seat and a mattress including a semiconductor air conditioner card.

The semiconductor air conditioning card provided by the invention utilizes the characteristics of small size, light weight, fast cooling speed, environmental protection and no noise of the semiconductor refrigeration chip, and integrates the semiconductor refrigeration chip and the heat dissipation fin into a thin card, and directly works on the seat cushion and the seat. Wait for the interior to achieve fast cooling.

The technical solution of the present invention is as follows:

A semiconductor air conditioner card comprising a semiconductor refrigeration chip, a heat dissipation fin and a vacuum chamber solvent heat absorption plate, wherein the heat dissipation fin comprises a cold end heat dissipation fin and a heat end heat dissipation fin, and the cold end heat dissipation fin and the cold end fin The cold surface of the semiconductor refrigeration chip is connected, and the hot surface of the semiconductor refrigeration chip is connected to one end of the vacuum chamber solvent soaking plate, and the hot end heat dissipating fin is connected to the other end of the vacuum chamber solvent soaking plate. The combination of a semiconductor refrigeration chip, a heat sink fin, and a vacuum chamber solvent soaking plate into a new type of semiconductor air conditioner card achieves both excellent cooling performance and reduced size.

According to the preferred embodiment of the present invention, the semiconductor air conditioner card further includes a refrigerating end base, and the semiconductor refrigerating chip and the cold end fin are connected to one end of the vacuum chamber solvent soaking plate through the refrigerating end base.

Further preferably, the refrigerating end base is provided with an air inlet shunt flap.

The cooling end base is made of heat-insulating plastic material, and mainly functions as follows: a) mounting and fixing the semiconductor cooling chip and the cold-end heat-dissipating fin; b) the air inlet shunt blocking end of the cooling end base Divided into two parts, a part of the airflow generates cooling air through the cold-end heat-dissipating fins of the semiconductor air-conditioning card, and the other part of the airflow passes the heat-dissipating fins to remove the heat generated by the semiconductor cooling chip.

According to the preferred embodiment of the present invention, the semiconductor air conditioner card further includes a semiconductor air conditioner card housing, the semiconductor air conditioner card housing is located outside the semiconductor air conditioner card, and the semiconductor air conditioner card housing is a flat elongated box body with open ends, and the box body The middle part is provided with a semiconductor air-conditioning card slot for connecting the semiconductor air-conditioning card, the middle of the box body is provided with an air inlet, and the bottom of the box body is provided with an air inlet, an air outlet and a hot air outlet.

The semiconductor air conditioner card housing plays the following roles: c) preventing bad heat exchange between the semiconductor air conditioner card and the outside; d) distributing the air flow at the cold end and the hot end to achieve the best match; e) generating high-speed airflow on the surface of the heat sink fin, Improve the heat exchange ratio of the heat sink fins; f) Provide certain mechanical protection to the semiconductor air conditioner card to prevent the semiconductor air conditioner card from being damaged due to excessive pressure.

The working principle of the semiconductor air conditioner card is: when the semiconductor refrigeration chip is working, the heat generated by the hot end of the semiconductor refrigeration chip, that is, the heat generated by the hot surface, causes the low boiling point solvent in the cavity of the vacuum chamber solvent soaking plate to be quickly volatilized, and the generated steam can be quickly Diffusion into the vacuum chamber at the other end of the solvent soaking plate. Under the cooling of the high-speed flowing air of the heat-dissipating fins, the steam is recondensed and returned to the end of the solvent-heating plate of the vacuum chamber to which the semiconductor refrigeration chip is connected by capillary action. A fast heat exchange cycle. Compared with ordinary heat pipes, the vacuum chamber solvent soaking plate is more suitable for ultra-thin design, and the vacuum chamber solvent soaking plate has larger heat dissipation area and higher heat exchange efficiency.

A seat cushion comprising a mesh body and a semiconductor air conditioner card as described above, the semiconductor air conditioner card being located in a mesh The inside of the mat.

According to a preferred embodiment of the present invention, the seat cushion further includes a support lining for connecting the semiconductor air conditioner card and the mesh pad. The support lining connects the semiconductor air conditioner card to the mesh pad of the seat cushion, plays a role of buffering and heat transfer, and further increases the comfort and safety of the ride. The material is a flexible flame retardant organic polymer.

Further preferably, the support liner comprises a matchingly connected upper portion of the inner liner and a lower portion of the inner liner, and the semiconductor air conditioner card is disposed between the upper portion of the inner liner and the lower portion of the inner liner. The upper part of the inner liner is symmetrical with the structure of the lower part of the inner liner, and is fixed by the mounting hole.

Further preferably, the support liner is provided with micropores. The micro-pores are used to better dissipate the cold air generated by the semiconductor air-conditioning card evenly into the seat cushion.

Further preferably, the support liner is provided with a cushioning washer. The cushion washer is for added comfort.

According to the preferred embodiment of the present invention, the seat cushion further includes a circulation air passage system, the circulation air passage system is disposed outside the seat cushion, and the circulation air passage system includes a fan and a ventilation duct, and the ventilation air duct and the semiconductor air conditioner card outside the semiconductor air conditioner card Connected. The design of the circulating air system can quickly achieve heat dissipation, which effectively improves the uniform temperature performance of the seat cushion.

A seat comprising a seat body and a semiconductor air conditioner card as described above, the semiconductor air conditioner card being disposed inside the seat body.

A mattress comprising a mattress body and a semiconductor air conditioner card as described above, the semiconductor air conditioner card being disposed inside the mattress body.

The beneficial effects of the present invention are that the present invention carries out the following technological innovations:

1) By using the technical solution of the invention, the liquid such as water can be used as the heat transfer medium, and the semiconductor refrigeration chip can directly work inside the seat cushion, the seat, etc., thereby minimizing the heat loss in the refrigeration process and greatly improving the heat loss. The cooling efficiency of the semiconductor refrigeration chip is very high, and a good cooling effect can be achieved with a small power chip;

2) Since there is no indirect heat transfer medium with water specific heat capacity, the working speed is very fast, and the heat transfer of the semiconductor refrigeration chip power source can be effectively performed, and the cooling is rapid;

3) Technical Solution of the Invention In order to adapt to the thickness requirements of the application products, especially the seat cushion, the working mode and composition structure of the semiconductor refrigeration chip are innovatively designed, and the design concept of the semiconductor air conditioner card is proposed, and the semiconductor refrigeration chip is integrated and super Thinning and standardization, the card design, the design of the semiconductor air conditioning card thickness can be controlled at 1-2 cm, this design can be applied not only to the air conditioning cushion system, but also to the existing air conditioning seat system Innovative impact

4) The invention adopts an efficient heat exchange method and a unique heat dissipation design, and specially designs a circulation air passage system, which can not only form a natural circulation air passage inside the seat cushion, but also can improve the heat dissipation efficiency and greatly reduce the noise of the fan. The use of a smaller fan allows the semiconductor refrigeration chip to work efficiently, with low fan noise and noise <30dB, which is more environmentally friendly and energy efficient.

DRAWINGS

1 is a schematic structural view of a conventional semiconductor refrigeration module in the prior art;

2 is a schematic view showing the working principle and a three-dimensional structure of a semiconductor air conditioner card according to the present invention;

3 is a top plan view showing a structure of a semiconductor air conditioner card according to the present invention;

4 is a front view showing the structure of a semiconductor air conditioner card according to the present invention;

Figure 5 is a front elevational view showing the structure of a semiconductor air conditioner card housing of the present invention;

Figure 6 is a schematic cross-sectional view of Figure 5A-A;

7 is a schematic view showing the assembly of a semiconductor air conditioner card and a semiconductor air conditioner card housing according to the present invention;

Figure 8 is a schematic view of the lower part of the inner liner of the support liner of the present invention;

9 is a schematic view showing the assembly and separation of a semiconductor air conditioner card housing and a support lining according to the present invention;

FIG. 10 is a perspective view showing the structure of a semiconductor air conditioner card and a circulating air passage system in accordance with the present invention.

Among them: 1, the hot end fan in the prior art, 2, the hot end heat sink fin, 3, the semiconductor refrigeration chip, 4, the cold end heat sink fin, 5, the cold end fan in the prior art, 6, the vacuum chamber Solvent soaking plate, 7, vacuum chamber solvent soaking plate cavity solvent, 8, air outlet, 9, air inlet, 10, hot air outlet, 11, semiconductor air conditioning card housing, 12, micro air hole, 13 buffer washer, 14 , mounting hole, 15, upper lining, 16, lower lining, 17, semiconductor air conditioning card slot, 18, mesh pad, 19, support lining, 20, cooling end base, 21, air inlet shunt Sheet, 22, air inlet.

detailed description

The invention will be further illustrated by the following examples in conjunction with the accompanying drawings, but not limited thereto.

As shown in Figure 1-10:

Example 1:

A semiconductor air conditioning card comprises a semiconductor refrigeration chip, a heat dissipation fin and a vacuum cavity solvent heat absorption plate, wherein the heat dissipation fin comprises a cold end heat dissipation fin and a heat end heat dissipation fin, as shown in FIG. 2, the cold end heat dissipation The fin is connected to the cold surface of the semiconductor refrigerating chip, and the heating end of the semiconductor refrigerating chip, that is, the hot surface is connected to one end of the vacuum chamber solvent soaking plate, the maximum limit The low temperature generated by the semiconductor refrigeration chip is diffused out. When the semiconductor refrigeration chip is operated, the heat generated by the hot end of the semiconductor refrigeration chip, that is, the heat generated by the hot surface, rapidly evaporates the low boiling point solvent in the cavity of the solvent chamber of the vacuum chamber. The steam can be quickly diffused to the other end of the vacuum chamber solvent soaking plate; the other end of the vacuum chamber solvent soaking plate is connected with a heat-side heat-dissipating fin for discharging the heat of the vacuum chamber solvent soaking plate, and the heat-dissipating fin at the hot end Under the cooling of the high-speed flowing air, the steam is recondensed and returned to the vacuum chamber of the vacuum chamber to which the semiconductor refrigeration chip is connected by capillary action, thereby generating a rapid heat exchange cycle, taking away the heat generated by the semiconductor refrigeration chip.

Example 2;

A semiconductor air conditioner card having the structure as described in Embodiment 1, except that the semiconductor air conditioner card further includes a refrigerating end base, and the semiconductor refrigerating chip and the cold end fins pass through the refrigerating end base and The vacuum chamber solvent heating plate is connected at one end. As shown in FIG. 3 and FIG. 4, the semiconductor refrigeration chip is connected to one end of the vacuum chamber solvent soaking plate through the cooling end base, and the cold end heat sink fin is connected to the cold surface of the semiconductor refrigeration chip and fixed. On the cooling end base, the cooling end base is further provided with an air inlet shunt blocking piece, which divides the air flow into two parts, a part of the air flow passes through the cold end heat radiating fin of the semiconductor air conditioning card to generate an air conditioning card cold air flow, and the other part of the air flow passes through the heat. The heat-dissipating fins generate a hot air flow of the air-conditioning card to take away the heat generated by the semiconductor cooling chip.

Example 3:

In order for the semiconductor air conditioner card to work properly, it is necessary to add some auxiliary designs, which can be integrated into the semiconductor air conditioner card housing. A semiconductor air-conditioning card according to any one of the embodiments of the present invention, as defined in any one of the embodiments 1-2, further comprising a semiconductor air-conditioning card housing, as shown in FIG. 5-7, the semiconductor The air-conditioning card housing is located outside the semiconductor air-conditioning card, and the semiconductor air-conditioning card housing is a flat and long-shaped box body with open ends. The middle part of the box body is provided with a semiconductor air-conditioning card slot for connecting the semiconductor air-conditioning card, and the middle portion of the box body is provided with The air port flows through the air inlet to the semiconductor air conditioner card, and the bottom of the box body is provided with an air inlet, an air outlet and a hot air outlet, thereby forming a wind path inside the box body, which is suitable for air flow.

Example 4:

A seat cushion comprising a mesh body and a semiconductor air conditioner card according to any one of embodiments 1-3, the semiconductor air conditioner card being located inside the mesh body. The structural characteristics of the semiconductor air conditioner card make it excellent for use in the seat cushion. The mesh pad is made of organic polymer material and has the following requirements for materials; i) high elastic porous structure for airflow and heat dissipation; ii) low specific heat, fast cooling start-up speed; iii) flame retardant, safety high.

Example 5:

A seat cushion, as described in embodiment 4, except that the seat cushion further includes a support liner for the support liner Connecting the semiconductor air conditioner card and the mesh pad body, as shown in Figure 8-9, the support lining includes the upper part of the inner liner and the lower part of the inner lining which are matched and connected, and the upper part of the inner lining and the lower part of the inner lining are symmetrically symmetrical, and the lining is lining through the mounting hole The upper part is fixedly connected with the lower part of the inner liner, and the semiconductor air conditioner card is disposed between the upper part of the inner liner and the lower part of the inner liner, and the supporting inner liner connects the semiconductor air conditioner card and the mesh pad body of the seat cushion to play the role of buffering and heat transfer, and Further increase the heat dissipation, comfort and safety of the ride, and the support lining material is a flexible flame retardant organic polymer.

Example 6

A seat cushion is as described in Embodiment 5, except that the support lining is provided with micro air holes for better dispersing the cold air generated by the semiconductor air conditioner card to the seat cushion.

Example 7

A seat cushion, as described in embodiment 5, except that the support liner is provided with a cushioning washer to increase ride comfort.

Example 8

A seat cushion, as described in Embodiment 4, except that the seat cushion further includes a circulation air passage system, the circulation air passage system is disposed outside the seat cushion, and the circulation air passage system includes a fan and a ventilation duct, the ventilation duct and the semiconductor air conditioner card. The external semiconductor air-conditioning card housing is connected at one end, that is, connected to the air inlet and the air outlet of the semiconductor air-conditioning card housing.

Since the thickness of the seat cushion is very limited, although the semiconductor air conditioner card can make the refrigeration chip work directly inside the seat cushion, the cold air flow is only released from one end of the semiconductor air conditioner card, and there is still some resistance to diffuse to the entire mesh cushion body. In one case, the temperature of the seat cushion near the end of the cold air outlet of the semiconductor air conditioner card is lower, and the temperature of the seat cushion near the end of the hot air outlet is higher, thereby affecting the temperature uniformity of the entire seat cushion. In order to improve this situation, the circulation air path structure is constructed inside and outside the seat cushion, and the design circulation air path system is added to ensure the uniform temperature performance of the seat cushion. As shown in Fig. 10, the ventilation duct is connected at the front position of the seat cushion, and the air inside the seat cushion is first extracted by the fan, that is, the air is extracted by the air outlet under the extraction action of the fan, and then the semiconductor air conditioner is passed through the circulation air passage system. The air inlet of the card housing is sent to the air inlet of the semiconductor air conditioner card, and the air flow is divided into two by the air inlet shunt at the air inlet, respectively, through the cold end fins and the hot end of the semiconductor air conditioner card. Cooling fins. The cold air flow through the cold-end heat-dissipating fins is blown into the middle and rear parts of the seat cushion, and is sucked into the front part of the seat cushion and re-extracted by the fan in the seat cushion; and the air-conditioning card through the hot-end heat-dissipating fins passes through the heat. The air outlet exits the seat cushion directly. This way of working, the airflow in the seat cushion can form a circulation loop, quickly achieve heat dissipation, and can ensure good temperature uniform performance.

Example 9

A seat comprising a seat body and a semiconductor air conditioner card according to any one of embodiments 1-3, The semiconductor air conditioner card described above is disposed inside the seat body. The number of semiconductor air conditioner cards installed and the like can be selected according to the size of the seat, etc., and the installation and maintenance are more convenient, and the safety can be greatly improved.

Example 10:

A mattress comprising a mattress body and the semiconductor air conditioner card according to any one of embodiments 1-3, wherein the semiconductor air conditioner card is disposed inside the mattress body.

Claims

A semiconductor air conditioning card includes a semiconductor cooling chip, a heat dissipating fin and a heat equalizing plate, wherein the heat dissipating fin comprises a cold end heat sink fin and a hot end heat sink fin, and the cold end heat sink fin Connected to the cold surface of the semiconductor refrigeration chip, the hot surface of the semiconductor cooling chip is connected to one end of the heat equalizing plate, and the hot end heat radiating fin is connected to the other end of the heat equalizing plate.
The semiconductor air conditioner card according to claim 1, wherein the semiconductor air conditioner card further comprises a refrigerating end base, and the semiconductor refrigerating chip and the cold end fins pass through the refrigerating end base and the vacuum chamber solvent soaking plate Connected at one end.
The semiconductor air conditioner card according to claim 2, wherein said refrigerating end base is provided with an air inlet choke.
The semiconductor air conditioner card according to claim 1, wherein said semiconductor air conditioner card further comprises a semiconductor air conditioner card housing, said semiconductor air conditioner card housing being located outside said semiconductor air conditioner card, said semiconductor air conditioner card housing being open at both ends The flat elongated box body is provided with a semiconductor air conditioner card slot for connecting the semiconductor air conditioner card in the middle of the box body, and the air inlet is provided in the middle of the box body, and the air inlet, the air outlet and the hot air outlet are provided at the bottom of the box body.
A seat cushion, characterized in that the seat cushion comprises a mesh cushion body and the semiconductor air conditioner card according to any one of claims 1 to 4, the semiconductor air conditioner card being located inside the mesh cushion body.
The seat cushion according to claim 5, wherein the seat cushion further comprises a support lining for connecting the semiconductor air conditioner card and the mesh pad.
The seat cushion according to claim 6, wherein said support lining comprises a mating upper portion of the inner liner and a lower portion of the inner liner, and the semiconductor air conditioner card is disposed between the upper portion of the inner liner and the lower portion of the inner liner; preferably, said The support liner is provided with micropores: Further preferably, the support liner is provided with a cushioning gasket.
The seat cushion according to claim 5, wherein the seat cushion further comprises a circulation air passage system, the circulation air passage system is disposed outside the seat cushion, and the circulation air passage system comprises a fan and a ventilation duct, the ventilation duct and the semiconductor The semiconductor air conditioner card housing outside the air conditioner card is connected.
A seat characterized by comprising a seat body and a semiconductor air conditioner card according to any one of claims 1 to 4, wherein the semiconductor air conditioner card is disposed inside the seat body.
A mattress comprising a mattress body and a claim according to any of claims 1-4 The semiconductor air conditioner card is disposed inside the mattress body.
The semiconductor air conditioner card according to claim 1, wherein the heat equalizing plate is a solvent soaking plate, a cavity is provided in the soaking plate, and a heat transfer solvent is disposed in the cavity.
The semiconductor air conditioner card according to claim 11, wherein the heat equalizing plate is a vacuum chamber solvent soaking plate, and the cavity in the cavity is provided with a vacuum chamber solvent soaking plate cavity solvent.