M384298 五、新型說明： 【新型所屬之技術領域】 本新型是涉及一種冷熱雙用調溫裝置。 【先前技術】 隨著環境的驟變，四季時的溫度變化，與其溫度的高低 點’更是屢屢刷新記錄’為了解決這問題，為了舒適的生活環 境，大多數室内場所，都安裝了空調系統。 - 因為氣溫的上升與驟降，造成空調使用頻繁，更多的能源 • 被消耗，更多的電力用在空調，更多的電力用在冷卻，更多的 水用在電廠的冷卻’造成一個惡性循環，並進一步加速了溫室 效應（Greenhouse Effect)’每年空調的電費費用更是十分龐 大’而且溫室效應(GreenhouseEffect)嚴重時，還會產生如： 海平面上升、糧食危機、經濟損失、危害人體健康、降低集中 力及工作效率、及水資源危機等問題。 在此同時，傳統空調系統在使用時，還是會產生噪音污 染、和空氣污染等種種的問題。 • 有鑑於此，如何在不使用傳統空調系統的架構下，提供一 種可對空氣快速降低或提昇其溫度的冷熱雙用調溫裝置，並降 低對自然環境的不良影響，便成為本新型欲改進的目的。 【新型内容】 —、本新型的技術手段： 本新型目的在於提供一種能用於降低空氣溫度的冷熱雙 用調溫裝置。 為解決前述問題及達到本新型的目的，本新型技術手段是 這樣實現的，為-種冷熱_調溫裝置，其特徵在於包括： 3 M384298 至少一冷卻器模組（1)，該冷卻器模組（1)是由一水盤 (12)、一與水盤（12)連接的水泵（13)、一以流體管路(11)與水 盤（12)和水泵（13)串接的韓片部（14)、及至少一設於铸片部 (14) 一側端的散熱風扇（15)所組成； S ° 至；一致冷晶片（2)，該致冷晶片（2)的第一接觸面（21)， 為與§玄水盤（12)的底面（121)緊密貼合；以及 一散熱風管（3)，該散熱風管（3)是由一外壁面與該致冷晶 片（2)之第二接觸面（22)緊密貼合的風管（31)、及至少一 該風管（31)—端的風扇（32)所組成，且該風管（31)内，更固設 有一能增加散熱面積、為低空氣阻抗、與該風管（31)管壁相連 的蜂巢形鰭片（33)。 根據上述的冷熱雙用調溫裝置’所述風扇（32)是為設於該 風管（31)的下列之一處及其混合：入風口（311)端、出風口 (312)端。 根據上述的冷熱雙用調溫裝置，所述風管（31)的材質是為 下列之一：紹材、銅材、不鏽鋼材。 根據上述的冷熱雙用調溫裝置，所述蜂巢形鰭片（33)的材 質是為下列之一：鋁材、銅材、不鏽鋼材。 根據上述的冷熱雙用調溫裝置，所述風管與蜂巢形鰭 片（33)為以一體成型所製成。 根據上述的冷熱雙用調溫裝置，所述蜂巢形鰭片（33)至少 一個以上的内側壁’更分別具有一能增加散熱面積的垂直鰭片 (331)。 根據上述的冷熱雙用調溫裝置，所述水盤（12)的四個頂 角’更分別設有一能讓水盤（12)固定於風管（31)頂面，以使水 盤（12)之底面（121)’可緊密貼合於致冷晶片（2)之第一接觸面 4 M384298 (21)的螺栓（16)。 根據上述的冷熱雙用調溫裝置，所述水盤（12)設有螺栓 (16)之處，於該處水盤（12)的頂側與底側，非分別套設有能避 免水盤（12)溫度、藉由螺栓（16)傳遞至風管（31)、能隔絕溫度 傳遞的一頂墊片（17)和一底墊片（18)。 根據上述的冷熱雙用調溫裝置，所述風管（31)與致冷晶片 (2)之第一接觸面（22)緊密貼合的一面，更設有一能供容置、 定位致冷晶片（2)用的開槽（314)。 根據上述的冷熱雙用調溫裝置，所述風管（31)不與致冷晶 片（2)之第二接觸面（22)緊密貼合的至少一面，更分別設有一 能避免風管（31)降溫或昇溫緩慢的凹槽（313)。 一、對照先前技彳标之功效： 1.本新型中最大的特點就是，透過冷卻器模組〇)、致冷 晶片（Thermoelectric Cooling Module)(2)、與含有蜂巢形鰭 片（H〇neycombFin)(33)的散熱風管（3)，來達到將空氣溫度降 低或提高的效果，不使用傳統空調系統的架構，透過利用致冷 晶片（2)配合冷卻器模組（1)，將其第一接觸面（21)的溫度，迅 速的帶走，隨後讓致冷晶片（2)的第二接觸面（22)，將風管（31) 降溫’再利用蜂巢形縛片⑽，對散熱風管⑶所吸入的空氣 降溫’而且因為蜂巢形，鰭片⑽的散熱面積大、空氣阻抗低， 所以此降低吸入空氣與排出空氣時的阻力，更能迅速的降低或 提高空氣的溫度。 2·本新型中，沒有使用冷媒與壓縮機，其中的動件只有冷 卻器模組(1)的水泵（13)、散熱風扇⑽、及散熱風管⑶的風 扇（32)，其他的裝置構件，如：水盤（12)、鰭片部（14)、致冷 晶片⑵、及風管（31)，都是非可動件，因此無驗機的噪^ 5 影二無染的問題，最重要的是，整體對環境的 ⑵相對於—般 1 使^的空氣冷卻方式，是使用致冷晶片 能以最f機為主雜件的佩㈣系統， 果，除了能r〜Γ 4成取问的冷部散熱效果與提昇室溫效 低使費r外’能避免進入用電的惡性循環，更能降 便性ii:::因為，的體積小巧’不佔空間，具安裝方 处彈，^M絲在傳統空㈣統無法安置的位置， 月匕弹的μ與使用，直接安裝於重點位置，直接對需要降溫 =域敕進订降溫’能降低無效的功耗；而且相較於傳統空調 系，’先’ JE_體的價性比高。 【實施方式】 以下依據圖面所示的實施例詳細說明如後： 一如圖1所示為本新型第一實施例的立體示意圖，如圖_ 福圖1的部分放大示意圖，如圖2所示為本新型第一實施例的 立體分解示意圖’如圖4卿為本新縣二實_的立體示意 圖’如圖5所示為本新型第三實施例的立體示意圖。 圖式中揭示出，為一種冷熱雙用調溫裝置，其特徵在於包 括： 至少一冷卻器模組（1)，該冷卻器模組G)是由一水盤 (12)、一與水盤（12)連接的水泵（13)、一以流體管路(11)與水 盤（12)和水泵（13)串接的鰭片部（η)、及至少一設於鰭片部 (14) 一側端的散熱風扇（15)所組成； 至少一致冷晶片（2)，該致冷晶片（2)的第一接觸面（21)， 為與該水盤（12)的底面（121)緊密貼合；以及 M384298 - 一散熱風管（3)，該散熱風管（3)是由一外壁面與該致冷晶 片（2)之第二接觸面（22)緊密貼合的風管（31)、及至少一 該風管（31)—端的風扇（32)所組成，且該風管（31)内，更^設 有一能增加散熱面積、為低空氣阻抗、與該風管（31)管壁相連 的蜂巢形鰭片（33)。 其中，透過冷卻器模組（1)、致冷晶片（2)、與含有锋巢形 鰭片（33)的散熱風管（3)，來達到主動將空氣溫度降低或提昇 的效果，完全不會使用到傳統空調系統架構中的冷媒與壓縮 φ 機，而是透過利用致冷晶片（2)配合冷卻器模組（1)，來達到降 低或提昇空氣溫度的效果。 其次，利用液冷式的冷卻器模組（1)配合致冷晶片（2)，能 將致冷晶片（2)之第一接觸面（21)的熱量或溫度，迅速的帶 走；更利用風管（31)，配合致冷晶片（2)的第二接觸面（22)， 將其内的空氣降溫；而且因為冷卻器模組（U中的各裝置，是 以流體管路（11)所串接而成，所以能將其安裝於'不會影響到 所要降低或提昇空氣溫度之區域的位置。 • 還有’利用風管（31)内的蜂巢形鰭片（33)，加大風管（31) • 整體與風扇（32)所吸入之空氣的接觸面積，也就是說能增加整 體的散熱面積，以迅速降低或提昇其内空氣的溫度，好輸出更 低溫或更溫暖的空氣，達到快速降低或提昇空氣溫度的目標， 而且蜂巢形鰭片（33)，與其他形狀的鰭片相比，在一相同面積 下，機械強度最高、所需材料最少、可讓空氣流量最大、風壓 損失最少，讓本新型能以較低的價格，獲得更好的空氣降溫或 什溫效果。 另一方面，藉由蜂巢形鰭片（33)的使用，更能減少空氣的 阻抗’降低風扇（32)的無效作功’降低出風時的壓損（pressure 7 M384298 loss)，進一步降低整體的功耗。 再者，整體的體積小巧，成本 與傳統空調系統相比，更 更不佔工間及可攜帶性， 調系統，離法安置的位的方便性，可以安裝在傳統空 置的位置，能彈性的安裝盥使用，能首接tf 耗，i目較於傳統空調系統，整體的價性比高。… 使用卻11模組⑴中’沒有使用傳統·系統會M384298 V. New description: [New technical field] The present invention relates to a dual-purpose temperature and humidity device. [Prior Art] With the sudden changes in the environment, the temperature changes in the four seasons, and the high and low points of its temperature are 'repeated records repeatedly'. In order to solve this problem, most indoor places are equipped with air conditioning systems for a comfortable living environment. . - Because of rising temperatures and sudden drops, air conditioners are used frequently, more energy is consumed, more electricity is used in air conditioners, more electricity is used for cooling, and more water is used in cooling of power plants. The vicious circle further accelerates the Greenhouse Effect. 'The annual electricity bill for air conditioners is very large' and the greenhouse effect (GreenhouseEffect) is severe, such as: sea level rise, food crisis, economic loss, harm to the human body Health, reducing concentration and work efficiency, and water crisis. At the same time, when the conventional air conditioning system is used, it still causes various problems such as noise pollution and air pollution. • In view of this, how to provide a hot and cold dual-purpose temperature control device that can quickly reduce or raise the temperature of the air without using the traditional air conditioning system, and reduce the adverse effects on the natural environment, becomes the novel to be improved. the goal of. [New content] —, the technical means of the new model: The purpose of the novel is to provide a cold and heat dual temperature regulating device which can be used for reducing the air temperature. In order to solve the foregoing problems and achieve the object of the present invention, the novel technical means is realized as a kind of cold heat_temperature regulating device, characterized in that: 3 M384298 at least one cooler module (1), the cooler mold The group (1) is a water pump (12) connected to the water tray (12), a water pump (12), and a Korean tube unit connected in series with the water tray (12) and the water pump (13). 14), and at least one heat dissipating fan (15) disposed at one end of the casting portion (14); S ° to; uniform cold wafer (2), the first contact surface of the refrigerating wafer (2) (21 ), in order to closely fit the bottom surface (121) of the shui water tray (12); and a heat dissipation air duct (3), the heat dissipation air duct (3) is composed of an outer wall surface and the refrigerating wafer (2) The two contact surfaces (22) are closely combined with the air duct (31) and at least one of the air duct (31) and the end of the fan (32), and the air duct (31) is further provided with a heat dissipation device. The area is a low air impedance, and a honeycomb fin (33) connected to the wall of the duct (31). According to the above-mentioned hot and cold dual-purpose temperature regulating device, the fan (32) is provided at one of the following points of the air duct (31) and mixed: the air inlet (311) end and the air outlet (312) end. According to the above-mentioned hot and cold dual-purpose temperature regulating device, the material of the air duct (31) is one of the following: a material, a copper material, a stainless steel material. According to the above-described hot and cold dual-purpose temperature regulating device, the material of the honeycomb fin (33) is one of the following: aluminum material, copper material, and stainless steel material. According to the above-described cold and heat dual temperature regulating device, the duct and the honeycomb fin (33) are formed by integral molding. According to the above-described cold and heat dual temperature regulating device, at least one or more inner side walls of the honeycomb fins (33) each have a vertical fin (331) capable of increasing a heat dissipating area. According to the above-mentioned hot and cold dual-purpose temperature regulating device, the four apex angles of the water tray (12) are respectively provided with a water tray (12) fixed to the top surface of the air duct (31) so that the bottom surface of the water tray (12) (121) 'Bolts (16) that can be closely attached to the first contact surface 4 M384298 (21) of the chilled wafer (2). According to the above-mentioned hot and cold dual-purpose temperature regulating device, the water tray (12) is provided with a bolt (16) where the top side and the bottom side of the water tray (12) are not separately provided to prevent the water tray (12) The temperature is transmitted to the air duct (31) by bolts (16), a top gasket (17) capable of isolating temperature transfer, and a bottom gasket (18). According to the above-mentioned hot and cold dual-purpose temperature regulating device, the side of the air duct (31) and the first contact surface (22) of the cooling chip (2) are closely attached, and a heat-dissipating and positioning cooling chip is further provided. (2) Slotted (314). According to the above-mentioned hot and cold dual-purpose temperature regulating device, at least one side of the air duct (31) not closely contacting the second contact surface (22) of the refrigerating wafer (2) is further provided with a duct (31). a groove (313) that cools or warms slowly. First, the effect of the previous technical standards: 1. The biggest feature of this model is that through the cooler module 〇), the Thermoelectric Cooling Module (2), and the honeycomb-containing fins (H〇neycombFin (33) the heat dissipation duct (3) to achieve the effect of reducing or increasing the air temperature, without using the architecture of the conventional air conditioning system, by using the cooling chip (2) with the cooler module (1) The temperature of the first contact surface (21) is quickly taken away, and then the second contact surface (22) of the cooled wafer (2) is cooled, and the air duct (31) is cooled to reuse the honeycomb chip (10) to dissipate heat. The air sucked by the air duct (3) cools down and because of the honeycomb shape, the heat dissipation area of the fin (10) is large and the air impedance is low, so that the resistance when sucking air and discharging air is reduced, and the temperature of the air can be quickly reduced or increased. 2. In this new type, the refrigerant and the compressor are not used, and the moving parts are only the water pump (13) of the cooler module (1), the cooling fan (10), and the fan (32) of the heat dissipation air duct (3), and other device components. For example, the water tray (12), the fin portion (14), the cooling chip (2), and the air duct (31) are all non-movable parts, so there is no problem of no noise of the inspection machine, the most important Yes, the overall air-cooling method for the environment (2) relative to the general one is the Pei (four) system that uses the cold-wafer chip to be the most miscellaneous machine, but it can be used in addition to r~Γ4. The cooling effect of the cold part and the improvement of the room temperature effect make it possible to avoid entering the vicious circle of electricity consumption, and it is more capable of defecation ii::: Because, the volume is small, it does not occupy space, and it has a mounting side, ^ M wire can not be placed in the traditional empty (four) system, the μ and use of the moon rifle, directly installed in the key position, directly to the need to cool down = domain 敕 booking cooling 'can reduce the inefficient power consumption; and compared to the traditional air conditioner Department, 'first' JE_ body has a high price-to-price ratio. [Embodiment] The following is a detailed description of the following embodiments in accordance with the drawings: FIG. 1 is a perspective view of the first embodiment of the present invention, as shown in FIG. FIG. 5 is a perspective view showing a third embodiment of the present invention. FIG. 5 is a perspective view showing a third embodiment of the present invention. The figure discloses a hot and cold dual temperature regulating device, characterized in that it comprises: at least one cooler module (1), which is composed of a water tray (12), a water tray (12) a connected water pump (13), a fin portion (n) connected in series with the water tray (12) and the water pump (13) by a fluid line (11), and at least one end portion provided at a side of the fin portion (14) a heat dissipating fan (15); at least a cold wafer (2), the first contact surface (21) of the refrigerating wafer (2) is closely attached to the bottom surface (121) of the water tray (12); and M384298 a heat dissipating duct (3), the duct (31) having an outer wall surface closely contacting the second contact surface (22) of the refrigerating wafer (2), and at least one The air duct (31) is composed of a fan (32) at the end, and the air duct (31) is further provided with a honeycomb which can increase the heat dissipation area, is low in air resistance, and is connected to the wall of the air duct (31). Fin (33). Among them, through the cooler module (1), the cooling chip (2), and the cooling air duct (3) containing the front-end fins (33), the effect of actively reducing or raising the air temperature is achieved. The refrigerant and compression φ machine in the traditional air conditioning system architecture will be used, and the cooling module (1) can be used to reduce or increase the air temperature by using the cooling chip (2). Secondly, by using the liquid-cooled cooler module (1) in combination with the cryogenic wafer (2), the heat or temperature of the first contact surface (21) of the cooled wafer (2) can be quickly taken away; The air duct (31) cooperates with the second contact surface (22) of the refrigerating wafer (2) to cool the air therein; and because the cooler module (the device in the U is a fluid line (11) It is connected in series, so it can be installed in a position that does not affect the area where the air temperature is to be lowered or raised. • There is also the use of honeycomb fins (33) in the duct (31) to increase Duct (31) • The contact area of the air that is absorbed by the fan (32) as a whole, which means that the overall heat dissipation area can be increased to quickly reduce or raise the temperature of the air inside it, so as to output a cooler or warmer air. To achieve the goal of rapidly reducing or raising the air temperature, and the honeycomb fins (33) have the highest mechanical strength, the least amount of material required, and the largest air flow rate under the same area compared with fins of other shapes. The wind pressure loss is the least, so that the new model can be obtained at a lower price. Better air cooling or even temperature effect. On the other hand, the use of honeycomb fins (33) can reduce the impedance of the air 'reducing the ineffective work of the fan (32)' to reduce the pressure loss during the wind. (pressure 7 M384298 loss), further reducing the overall power consumption. Moreover, the overall size is small, the cost is less than the traditional air conditioning system, and does not occupy the work space and portability, the adjustment system, the position of the separation method Convenience, can be installed in the traditional vacant position, can be used for flexible installation, can be used for the first tf consumption, i is better than the traditional air conditioning system, the overall price ratio is high.... Use 11 modules (1) in 'not used Traditional system
水ιαϋίίί ’而"3'其中的動件只有冷卻器模組⑴的 ί 〇5)、及散熱風管⑶的風扇(32)，其他 署媒1丨入則部04)、致冷晶片⑵、及風管(31)的裝 =構7’都疋非可動件’因此本新型的噪音源較少，整體的噪 :和，、更沒有空氣污染的可能，而a整體對環境的影響有 限，且整體的可動件少，不易故障，就算故障了，維護上也較 傳統空調系統方便與便宜。 —再其次，當需要較高速的降溫或昇溫速度時，雜透過於 風管(31)的其他面，增設冷卻器模組⑴和致冷晶片⑵的方式Water ιαϋίίί 'and the '3' of the moving parts only the cooler module (1) ί ) 5), and the cooling duct (3) fan (32), other media 1 into the department 04), cooling chip (2) And the air duct (31) is not a movable part. Therefore, the noise source of this new type is less, the overall noise is: and, more, there is no possibility of air pollution, and the overall impact of a on the environment is limited. And the overall movable parts are few, it is not easy to malfunction, even if it is faulty, the maintenance is also convenient and cheaper than the traditional air conditioning system. - Secondly, when a higher speed cooling or heating rate is required, the way of passing through the other side of the duct (31), adding the cooler module (1) and the cooling chip (2)
[圖未揭示]，來達成上述的目標，能在較低耗能與成本的狀態 下，提供一能更快速調溫的本新型。 —當然’如果要更大的出風量’―樣能透過更換更大的散熱 風官（3) ’再於風管（31)的其他面，增設冷卻器模組（丨）和致冷 晶片（2)的方式[圖未揭示]，來達成上述的目標，一樣能在較 低耗能與成本的狀態下，提供一更大、更高出風量的本新型。 上述中，所述風扇（32)是為設於該風管（31)的下列之一處 及其混合：入風口（311)端、出風口（312)端。 其次，風扇（32)的裝置，能依使用者的需求來決定，其風 扇（32)裝置方式，如以下所示： 8 第一實施例：裝設於入風口（311)端，提供一般風速、一 般風量[如圖1]。 第二實施例：裝設於出風口（312)端，提供大風速、一般 風量[如圖4]。 第二實施例：裝設於入風口（311)端和出風口（312)端，提 供大風速、大風量[如圖5]。 透過不同的裝置方式，能提供不同的風速、風量效果’以 提供更多元化的應用與選擇。 上述中，所述風管（31)的材質是為下列之一：鋁材、銅材、 不鑛鋼材。 又上述中，所述蜂巢形鰭片（33)的材質是為下列之一：鋁 材、銅材、不鏽鋼材。 其中，依據使用者的需求，加上成本與效果的考量，使用 散熱效果相同或是利目同的㈣，[如：銅觀f(3i)配銅材 蜂巢形鯖片（33)、紹材風管(31)配銅材蜂巢形鰭片⑽]，來 風s (31)和蜂巢形韓片（33)用，能產生不同程度的溫度傳 導效果，可以提供更多元化的應用與選擇。 一如圖6所示為本新型第四實施例的立體示意圖，如圖6A 所不為圖6的部分放大示賴，如圖7所示為本新型第四實施 例^體分解示賴，如圖8所示為本新鄕四實施例的前視 不思圖 圖式中揭示出’上述中，所述風管⑶）與蜂巢形鰭片⑽ 為以一體成型所製成[如圖6]。 昇敕ί ^ΓΓ31)與蜂跡則（33)為—體成贿，能提 ===、率’讓空氣能更快的被降溫或被昇溫， 、此心生產的工序’與廢_產生，回收易較方便且較不 M384298 - 易產生空氣阻抗。 上述中，所述蜂巢形鰭片（33)至少一個以上的内側壁，更 分別具有一能增加散熱面積的垂直鰭片（331)[如圖8]。 其中，透過垂直鰭片（331)的設置，能將散熱面積進一步 的增加，雖然也會提高整體出風時的壓損（pressure l〇ss)， 但是相對於其他型式的散熱鰭片，仍舊有較好的壓損表現，能 • 在壓抽與散熱、昇溫效果之間，取得一較佳的平衡點。 上述中’所述水盤（12)的四個頂角，更分別設有一能讓水 φ 盤（12)固定於風管（31)頂面，以使水盤（12)之底面（121)，可 緊密貼合於致冷晶片（2)之第一接觸面（21)的螺栓（16)。 其中’透過螺栓(16)的使用，能讓水盤（12)與致冷晶片（2) 緊密的貼合，並提供一充足的下壓力，讓致冷晶片（2)與水盤 (12)，不會因為一點晃動而自風管（31)頂面脫離或產生間隙。 上述中，所述水盤（12)設有螺栓（16)之處，於該處水盤 (12)的頂側與底側，非分別套設有能避免水盤（12)溫度、藉由 螺栓（16)傳遞至風管（31)、能隔絕溫度傳遞的一頂墊片（17) 和一底墊片（18)。 - 其中，透過頂墊片（H)與底墊片（18)，讓水盤（12)所吸收 到致冷晶片（2)之第一接觸面（21)的熱量或溫度，不會藉由螺 栓（16)傳遞至風管(31)，而影響賴f (31)的降溫或昇溫速 度，使致冷晶片®無法快速的將風管（31)降溫或昇溫。 上述中，所述風管（31)與致冷晶片（2)之第二接觸面（22) 緊密貼合的-面，更設有一能供容置、定位致冷晶片⑵用的 開槽（314)。 、其中’透過開槽(314)的設置，能方便生產過程中，快速 的進行致冷晶片（2)的定位與安裝，不易偏移。 10 上述中’所述風管（31)不與致冷晶片（2)之第二接觸面 (22)緊密貼合的至少—面，更分別設有—能魏風管⑶）降溫 或昇溫緩慢的凹槽（313)。 其中，透過凹槽（313)的設置，能將整體溫度的變化，集 中以避免不與致冷晶片（2)緊密貼合之其他面的影響，讓前 述其他各_蓄溫量降低，更㈣免風管(31)回溫度的速度過 快，而且因為凹槽（313)的設置，更能減少風管（31)的體積， 降低材料成本’並讓風管(31)能更快崎溫或昇溫。 如圖3所示為本新型的實施剖面示意圖。圖式中揭示出， 首先’當冷卻器模組⑴、致冷晶片⑵、及散熱風管⑶啟動 後’冷卻H模組⑴的水泵（13)’藉由流鮮路(11)對水盤⑽ 輸入流體，以透過水盤（12)，將致冷晶片⑵之第一接觸面⑻ 的溫度，以流體迅速的帶走。 隨後，經由水盤（12)輸出的流體，會流至鰭片部（14)，以 透過韓片σρ(14)與散熱風扇（15)的配合，將熱量傳遞發散至外 界透過上述步驟’能提南致冷晶片⑵之第一接觸面⑵）的 運作效率。 其次，而受到致冷晶片（2)特性的影響，第一接觸面（21) 的運作效率越好’致冷晶片⑵之第二接觸面（22)的致冷、致 熱效果就越佳，所以與致冷晶片⑵之第二接觸面（22)連接的 散熱風管⑶，其降溫或昇溫速度也就能越穩定與快速。 在致冷晶片⑵對散熱風管⑶之風管（31)降溫或昇溫的 同時’其風扇（32)也是不斷的將空氣自人風叫⑴端吸入。 ―因此’利用蜂巢綱片（33)散熱面積大的特性，對散教風 官⑶之風管⑻⑽空氣降溫或昇溫，並自 出’以達到將空氣溫度降低或昇溫的目標。 M384298 此外，因為所使用的蜂巢形鰭片（33)，更具有空氣阻抗低 的特性，所以能降低吸入空氣與排出空氣時的阻力，整體的壓 損月&被降低，更能讓空氣順暢的流動，以降低風扇（32)的耗 能，實際能獲得的出風量大。 最後應說明的是，本新型吹冷風或吹熱風的效果，為透過 致冷晶片（2)來達成，也就是說讓第一接觸面（21)與第二接觸 面（22)的溫度表現，能於第一接觸面高溫/第二接觸面 «2)低溫’或是第-接觸面⑼低溫/第二接觸面（22)高溫間 切換，好對風官（31)降溫或昇溫，以達到冷熱雙用的目標，但 是其控制方式’是為-種電控方式，且為—般所知悉的傳統技 術，故於此即不予詳加敘述。 由上述能得知，本新型中，透過冷卻器模組（1)、致冷晶 片（2)、與含有蜂巢形鰭片（33)的散熱風管（3)，來達到將空氣 溫度降低或提昇的效果，不使用傳統空調系統的架構，與傳統 空調系統相比’整财置省電、無科 用性、功效性與產業利用性。 更八有貫[The figure is not disclosed], in order to achieve the above objectives, the present invention can be provided with a more rapid temperature adjustment at a lower energy consumption and cost. - Of course 'if you want a larger amount of airflow' - you can add a cooler module (丨) and a cooling chip by replacing the larger heat sink (3) 'on the other side of the duct (31) 2) The method [not shown], in order to achieve the above objectives, can provide a larger and higher air volume in the state of lower energy consumption and cost. In the above, the fan (32) is disposed at one of the following air ducts (31) and mixed: the air inlet (311) end and the air outlet (312) end. Secondly, the device of the fan (32) can be determined according to the needs of the user, and the fan (32) device mode is as follows: 8 First embodiment: installed at the air inlet (311) end, providing general wind speed The general air volume [Figure 1]. The second embodiment is installed at the end of the air outlet (312) to provide a large wind speed and a general air volume [Fig. 4]. The second embodiment is installed at the air inlet (311) end and the air outlet (312) end to provide a large wind speed and a large air volume [Fig. 5]. Through different means of installation, different wind speeds and air volume effects can be provided to provide more diversified applications and choices. In the above, the material of the air duct (31) is one of the following: aluminum material, copper material, and non-mine steel material. In the above, the honeycomb fin (33) is made of one of the following materials: aluminum, copper, and stainless steel. Among them, according to the needs of users, plus the cost and effect considerations, the use of the same heat dissipation effect or the same (4), [such as: Tongguan f (3i) with copper honeycomb honeycomb (33), Shaocai The air duct (31) is equipped with copper honeycomb fins (10)], and the wind s (31) and honeycomb-shaped Korean film (33) can produce different degrees of temperature conduction effects, which can provide more diversified applications and choices. . FIG. 6 is a perspective view of the fourth embodiment of the present invention. FIG. 6A is not a partial enlarged view of FIG. 6. FIG. 7 is a schematic view of the fourth embodiment of the present invention. FIG. 8 shows a front view of the fourth embodiment of the present invention. The above description shows that the air duct (3) and the honeycomb fin (10) are integrally formed [FIG. 6]. .升敕ί ^ΓΓ31) and the bee trace (33) is a body bribe, can raise ===, rate 'allows the air to be cooled or warmed up faster, the process of production of this heart' and waste _ generation It is easy to recycle and less than M384298 - easy to generate air impedance. In the above, the honeycomb fins (33) have at least one or more inner sidewalls, and each has a vertical fin (331) capable of increasing the heat dissipation area [Fig. 8]. Among them, through the arrangement of the vertical fins (331), the heat dissipation area can be further increased, and although the pressure loss (pressure l〇ss) during the overall air blowing is improved, compared with other types of heat dissipation fins, Better pressure loss performance, can achieve a better balance between pressure pumping and heat dissipation. The four apex angles of the water tray (12) are respectively provided with a water φ disc (12) fixed to the top surface of the air duct (31) so that the bottom surface (121) of the water tray (12) can be A bolt (16) that closely fits the first contact surface (21) of the chilled wafer (2). Among them, the use of the bolt (16) allows the water tray (12) to closely fit the cooling chip (2) and provides a sufficient downforce to allow the cold wafer (2) and the water tray (12) to It will detach from the top surface of the air duct (31) or create a gap due to a slight sway. In the above, the water tray (12) is provided with a bolt (16) where the top side and the bottom side of the water tray (12) are not respectively sleeved to prevent the temperature of the water tray (12) from being bolted (16). ) is transmitted to the duct (31), a top gasket (17) capable of isolating temperature transfer, and a bottom gasket (18). - wherein, through the top gasket (H) and the bottom gasket (18), the heat or temperature absorbed by the water tray (12) to the first contact surface (21) of the cooled wafer (2) is not caused by the bolt (16) Transfer to the duct (31), which affects the cooling or heating rate of the f (31), so that the cryo wafer® cannot quickly cool or warm the duct (31). In the above, the surface of the air duct (31) and the second contact surface (22) of the cooling chip (2) are closely attached, and a slot for accommodating and positioning the cold chip (2) is further provided ( 314). The setting by the slotting (314) can facilitate the positioning and installation of the cooled wafer (2) during the production process, and is not easily offset. 10 In the above, the air duct (31) does not closely adhere to at least the surface of the second contact surface (22) of the refrigerating wafer (2), and is further provided with a cooling duct or a warming temperature. Groove (313). Through the arrangement of the grooves (313), the change in the overall temperature can be concentrated to avoid the influence of other surfaces that do not closely adhere to the cooling chip (2), so that the other _the temperature storage amount is reduced, and (4) The temperature of the duct (31) is too fast, and because of the setting of the groove (313), the volume of the duct (31) can be reduced, the material cost can be reduced, and the duct (31) can be heated more quickly. Or warm up. FIG. 3 is a schematic cross-sectional view showing the implementation of the present invention. The figure reveals that first, 'When the chiller module (1), the chilled wafer (2), and the heat dissipating duct (3) are activated, the 'water pump (13)' that cools the H module (1) is immersed in the water tray (10) by the fresh road (11). The fluid is introduced to pass the water tray (12), and the temperature of the first contact surface (8) of the cooled wafer (2) is quickly carried away by the fluid. Then, the fluid outputted through the water tray (12) flows to the fin portion (14) to transmit the heat transfer to the outside through the above steps through the cooperation of the Korean chip σρ(14) and the heat dissipation fan (15). The operating efficiency of the first contact surface (2) of the south-cooled wafer (2). Secondly, the better the operating efficiency of the first contact surface (21) is affected by the characteristics of the cooled wafer (2), the better the cooling and heating effect of the second contact surface (22) of the cooled wafer (2). Therefore, the cooling air duct (3) connected to the second contact surface (22) of the cooling chip (2) can be cooled and heated at a faster and faster speed. While the cooling chip (2) cools or heats up the air duct (31) of the heat dissipating duct (3), the fan (32) constantly draws air from the wind (1) end. ― Therefore, using the characteristics of the large heat dissipation area of the honeycomb module (33), the air of the air duct (8) (10) of the scholastic winder (3) is cooled or warmed up, and the target of lowering or warming the air temperature is achieved. M384298 In addition, because the honeycomb fins (33) used have the characteristics of low air resistance, the resistance when sucking air and exhausting air can be reduced, and the overall pressure loss month & is reduced, and the air is smoother. The flow is to reduce the energy consumption of the fan (32), and the actual amount of air that can be obtained is large. Finally, it should be noted that the effect of blowing the cold air or blowing hot air of the present invention is achieved by passing the cold wafer (2), that is, the temperature of the first contact surface (21) and the second contact surface (22). It can switch between the low temperature of the first contact surface/the second contact surface «2) or the low temperature of the first contact surface (9) and the low temperature of the second contact surface (22), so that the wind officer (31) can be cooled or warmed up to reach The target of both hot and cold use, but its control method is a kind of electronic control method, and it is a traditional technology known to all, so it will not be described in detail here. As can be seen from the above, in the present invention, the air temperature is lowered or the temperature of the air is lowered through the cooler module (1), the cooled wafer (2), and the heat dissipating duct (3) containing the honeycomb fins (33). The effect of the upgrade is not to use the structure of the traditional air-conditioning system, compared with the traditional air-conditioning system, the whole economy has power saving, no utility, efficacy and industrial utilization. More eight
/以上依據®式所示的實施例詳細說明瞭本新型的構造、特 徵^収果，由於符合職及進步性要件，遂銳法提出新 里專利中請；惟以上所述僅為本新型之較佳實施例，但本新型 不以，面所示限定實施範圍，因此舉凡與本新型意旨相符的修 飾1·生I：化/、要在均等範圍内都應涵屬於本新型專利範圍内。 12 M384298 【圖式簡單說明】 圖1 :本新型第一實施例的立體示意圖。 圖1A :為圖1的部分放大示意圖。 圖2 :本新型第一實施例的立體分解示意圖。 圖3 :本新型的實施剖面示意圖。 圖4 :本新型第二實施例的立體示意圖。 圖5 :本新型第三實施例的立體示意圖。 圖6 :本新型第四實施例的立體示意圖。 ' 圖6A :為圖6的部分放大示意圖。 • 圖7 :本新型第四實施例的立體分解示意圖。 圖8 :本新型第四實施例的前視示意圖。 【主要元件符號說明】 1 冷卻器模組 11 流體管路 12 水盤 121 底面 13 水泵 14 鰭片部 15 散熱風扇 16 螺栓 17 頂墊片 18 底墊片 2 致冷晶片 21 第一接觸面 22 第二接觸面 3 散熱風管 13 M384298 31 風管 311 入風口 312 出風口 313 凹槽 314 開槽 32 風扇 33 蜂巢形鰭片 331 垂直鰭片/ The above embodiment according to the formula indicates the structure and characteristics of the present invention in detail. Due to the compliance with the requirements and the progressive requirements, the company has proposed the new patent; however, the above description is only for the present invention. The preferred embodiment, but the present invention is not limited to the scope of implementation of the present invention. Therefore, the modifications 1 and 1 of the present invention are intended to fall within the scope of the present patent. 12 M384298 [Simple description of the drawings] Fig. 1 is a perspective view of the first embodiment of the present invention. Fig. 1A is a partially enlarged schematic view of Fig. 1. Fig. 2 is a perspective exploded view of the first embodiment of the present invention. Figure 3 is a schematic cross-sectional view showing the implementation of the present invention. Figure 4 is a perspective view of a second embodiment of the present invention. Figure 5 is a perspective view of a third embodiment of the present invention. Figure 6 is a perspective view of a fourth embodiment of the present invention. Figure 6A is a partial enlarged view of Figure 6. • Figure 7 is a perspective exploded view of the fourth embodiment of the present invention. Figure 8 is a front elevational view of a fourth embodiment of the present invention. [Main component symbol description] 1 Cooler module 11 Fluid line 12 Water tray 121 Bottom surface 13 Water pump 14 Fin section 15 Cooling fan 16 Bolt 17 Top spacer 18 Base gasket 2 Cooling wafer 21 First contact surface 22 Second Contact surface 3 Cooling duct 13 M384298 31 Duct 311 Air inlet 312 Air outlet 313 Groove 314 Slot 32 Fan 33 Honeycomb fin 331 Vertical fin