WO2017033698A1 - Élément bobine, dispositif d'antenne, support d'informations du type carte, dispositif de circuit intégré sans fil et dispositif électronique - Google Patents

Élément bobine, dispositif d'antenne, support d'informations du type carte, dispositif de circuit intégré sans fil et dispositif électronique Download PDF

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Publication number
WO2017033698A1
WO2017033698A1 PCT/JP2016/072890 JP2016072890W WO2017033698A1 WO 2017033698 A1 WO2017033698 A1 WO 2017033698A1 JP 2016072890 W JP2016072890 W JP 2016072890W WO 2017033698 A1 WO2017033698 A1 WO 2017033698A1
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WIPO (PCT)
Prior art keywords
substrate
conductor pattern
main surface
antenna
coil
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Application number
PCT/JP2016/072890
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English (en)
Japanese (ja)
Inventor
天野　信之
真大 小澤
Original Assignee
株式会社村田製作所
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201690001054.2U priority Critical patent/CN207909619U/zh
Publication of WO2017033698A1 publication Critical patent/WO2017033698A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Definitions

  • the present invention relates to a coil element or an antenna device, and more particularly to a coil element or antenna device including a first conductor pattern formed on a first substrate, a second conductor pattern formed on a second substrate, and a bonding wire.
  • the present invention also relates to a card type information medium, and more particularly, to a card type information medium and a wireless IC device provided with these coil elements or antenna elements.
  • the present invention further relates to an electronic device, and more particularly to an electronic device including the coil element, the antenna element, a card type information medium, or a wireless IC device.
  • Patent Document 1 discloses an inductor element including a plurality of wiring patterns arranged on a wiring board and a plurality of wires.
  • a helical coil is configured by connecting (wire bonding) both ends of an arc-shaped wire formed so as to rise on the main surface of the wiring board to adjacent wiring patterns.
  • Patent Document 1 when a coil having a large opening is to be formed, it is necessary to lengthen the wire formed in an arc shape, and when one wire is lengthened, the wire is easily bent. Therefore, it becomes easy for adjacent wires to contact each other (short circuit between lines). Moreover, the characteristic of a coil will change because a wire bends.
  • An object of the present invention is to suppress contact between adjacent wires without increasing the occupied area and to change coil characteristics in a configuration in which a wire is used as a part of a coil, while having a large coil opening.
  • An object of the present invention is to provide a coil element, an antenna device, and a card type information medium that can be suppressed. It is another object of the present invention to provide a wireless IC device and an electronic apparatus including them.
  • the coil element of the present invention is An insulating first substrate having a first main surface and a second main surface; A second substrate having a third main surface and a fourth main surface, wherein the fourth main surface is disposed to face the first main surface; A first conductor pattern formed on the first substrate; A second conductor pattern formed on the second substrate; A first bonding wire; A second bonding wire; With A first end of the first conductor pattern is connected to a first end of the second conductor pattern via the first bonding wire; A second end of the first conductor pattern is connected to a second end of the second conductor pattern via the second bonding wire; A coil including the first conductor pattern, the second conductor pattern, the first bonding wire, and the second bonding wire is configured.
  • the first conductor pattern formed on the first substrate, the second conductor pattern formed on the second substrate, the first bonding wire, and the second bonding wire are used as part of the coil. Therefore, the length of each bonding wire can be shortened compared with the case where a coil is formed by connecting both ends of a bonding wire formed in an arc shape to both ends of the first conductor pattern.
  • each bonding wire becomes short, it becomes difficult to bend. Therefore, with this configuration, while having a large coil opening, a change in coil characteristics due to bending of the bonding wire is suppressed, and contact between adjacent bonding wires (inter-line short) can be suppressed.
  • the number of the first conductor patterns, the number of the second conductor patterns, the number of the first bonding wires, and the number of the second bonding wires are each plural.
  • the length in the X-axis direction of the orthogonal X, Y, Z coordinate system of the second substrate is longer than the length in the Z-axis direction
  • the plurality of first conductor patterns are arranged in the Y-axis direction and extend in the X-axis direction
  • the plurality of second conductor patterns are arranged in the Y-axis direction and extend in the X-axis direction
  • the distance in the X-axis direction between the first end and the second end of the first conductor pattern is longer than the length in the X-axis direction of the second substrate
  • the coil preferably has a helical shape including the plurality of first conductor patterns, the plurality of second conductor patterns, the plurality of first bonding wires, and the plurality of second bonding wires.
  • the plurality of first conductor patterns, the plurality of second conductor patterns, the plurality of first bonding wires, and the plurality of second bonding wires constitute a multi-turn helical coil.
  • the length of the second substrate in the Z-axis direction is short, the length of each first bonding wire and the length of each second bonding wire can be shortened.
  • the ratio of the conductor pattern constituting the coil can be further increased. Further, this configuration can reduce the height of the coil element.
  • the length of each of the first bonding wires is shorter than the length of the first conductor pattern in the X-axis direction, and the length of each of the second bonding wires. Is preferably shorter than the length of the first conductor pattern in the X-axis direction.
  • the length of each bonding wire (the first bonding wire 31 or the second bonding wire 32) is configured by connecting both ends of the bonding wire formed in an arc shape to both ends of the first conductor pattern. Shorter than the case. Therefore, a change in coil characteristics due to the bending of the bonding wire is suppressed, and contact between adjacent bonding wires (short circuit between lines) can be suppressed.
  • the antenna device of the present invention An insulating first substrate having a first main surface and a second main surface; A second substrate having a third main surface and a fourth main surface, wherein the fourth main surface is disposed to face the first main surface; A first conductor pattern formed on the first substrate; A second conductor pattern formed on the second substrate; A first bonding wire; A second bonding wire; With A first end of the first conductor pattern is connected to a first end of the second conductor pattern via the first bonding wire; A second end of the first conductor pattern is connected to a second end of the second conductor pattern via the second bonding wire; A coil including the first conductor pattern, the second conductor pattern, the first bonding wire, and the second bonding wire is configured.
  • the first conductor pattern formed on the first substrate, the second conductor pattern formed on the second substrate, the first bonding wire, and the second bonding wire are used as part of the coil. Therefore, the length of each bonding wire can be shortened compared with the case where a coil is formed by connecting both ends of a bonding wire formed in an arc shape to both ends of the first conductor pattern.
  • each bonding wire becomes short, it becomes difficult to bend. Therefore, with this configuration, while having a large coil opening, a change in coil characteristics due to bending of the bonding wire is suppressed, and contact between adjacent bonding wires (short between lines) can be suppressed (6)
  • the second substrate is a dielectric and can be an electric field antenna.
  • the second substrate is a magnetic body and can be a magnetic field antenna.
  • the wireless IC device of the present invention Any one of the antenna devices of (5) to (7) above; An RFIC element connected to the coil element; It is characterized by providing.
  • the card type information medium of the present invention is The coil element according to any one of (1) to (4) is provided.
  • the card-type information medium of the present invention is The antenna device according to (7) is provided.
  • the card type information medium of the present invention is The wireless IC device according to (8) is provided.
  • the electronic apparatus of the present invention A housing, The coil element of any one of (1) to (4), the antenna device of any of (5) to (7), the wireless IC device of (8), or the above ( 9) to any one of the card type information media of (11), It is characterized by providing.
  • an electronic device including any of the coil element, the antenna device, the wireless IC device, and the card type information medium of the present invention can be realized.
  • a wire in a configuration in which a wire is used as a part of a coil, contact between adjacent wires is suppressed without increasing the occupation area while having a large coil opening, and a change in coil characteristics can be achieved.
  • a coil element, an antenna device, and a card type information medium that can be suppressed can be realized.
  • a wireless IC device and an electronic device including them can be realized.
  • FIG. 1A is an external perspective view of the coil element 101 according to the first embodiment
  • FIG. 1B is an exploded perspective view of the coil element 101
  • FIG. 2 is a plan view of the coil element 102 according to the second embodiment
  • FIG. 3A is an external perspective view of a communication terminal device 301 according to the third embodiment
  • FIG. 3B is a partially enlarged view showing an antenna device 201 provided in the communication terminal device 301.
  • FIG. 4 is an external perspective view of a communication terminal apparatus 302 according to the fourth embodiment.
  • FIG. 5A is an external perspective view of the wireless IC device 401 according to the fifth embodiment
  • FIG. 5B is a circuit diagram of the wireless IC device 401.
  • FIG. 6A is a plan view of a wireless IC device 402 according to the sixth embodiment
  • FIG. 6B is a cross-sectional view taken along the line AA in FIG. 7A is a plan view of the first substrate 1F included in the wireless IC device 402
  • FIG. 7B is a cross-sectional view taken along the line BB in FIG. 7A
  • 8A is a plan view of the second substrate 2F included in the wireless IC device 402
  • FIG. 8B is a cross-sectional view taken along the line CC in FIG. 8A
  • FIG. 9A is a plan view of a wireless IC device 403 according to the seventh embodiment
  • FIG. 9B is a DD cross-sectional view in FIG. 9A.
  • FIG. 10A is a plan view of the first substrate 1G included in the wireless IC device 403, and FIG. 10B is a cross-sectional view taken along line EE in FIG. 10A.
  • FIG. 11A is a plan view of the second substrate 2G included in the wireless IC device 403, and FIG. 11B is a cross-sectional view taken along line FF in FIG. 11A.
  • FIG. 12 is a plan view of an electronic device 501 according to the eighth embodiment.
  • the coil elements according to some embodiments described below are provided in an electronic device or the like typified by a mobile phone terminal (including a smartphone), and can be used, for example, as a magnetic flux radiation element in the HF band or the like.
  • a radiating element of an electric field antenna that can be used in a UHF band that radiates electromagnetic waves (radio waves) by forming an electric field around the radiating element.
  • the coil element can also be used as an inductor element. Therefore, unless otherwise specified, some embodiments described below are examples for both the radiating element and the inductor element of the antenna.
  • FIG. 1A is an external perspective view of the coil element 101 according to the first embodiment
  • FIG. 1B is an exploded perspective view of the coil element 101.
  • the first bonding wire 31 and the second bonding wire 32 are not shown.
  • the coil element 101 is formed on the first substrate 1, the second substrate 2, the first conductor patterns 11 a, 11 b, 11 c, 11 d, 11 e, 11 f, 11 g, 11 h formed on the first substrate 1.
  • the first substrate 1 is a rectangular insulating flat plate whose longitudinal direction coincides with the X-axis direction of the orthogonal X, Y, Z coordinate system and whose short direction coincides with the Y-axis direction, and includes the first main surface VS1 and the second main surface VS1. It has a main surface VS2.
  • the first substrate 1 is, for example, a printed wiring board.
  • the first conductor patterns 11a, 11b, 11c, 11d, 11e, 11f, 11g, and 11h are formed on the first main surface VS1 of the first substrate 1 and arranged in the Y-axis direction.
  • the first conductor patterns 11a and 11h are rectangular conductor patterns.
  • the first conductor patterns 11b, 11c, 11d, 11e, 11f, and 11g are linear conductor patterns that extend substantially in the X-axis direction and are parallel to each other.
  • the first conductor patterns 11a, 11b, 11c, 11d, 11e, 11f, 11g, and 11h are, for example, Cu foil patterns.
  • the meaning of “extending in the X-axis direction” is not limited to the fact that the first conductor patterns 11b, 11c, 11d, 11e, 11f, and 11g are all parallel to the X-axis direction. It also includes that the directions in which the patterns 11b, 11c, 11d, 11e, 11f, and 11g extend are generally directed in the X-axis direction, that is, extend substantially in the X-axis direction.
  • the second substrate 2 is a rectangular magnetic plate whose short side direction coincides with the X-axis direction and whose long side direction coincides with the Y-axis direction, and has a third main surface VS3 and a fourth main surface VS4. As shown in FIG. 1A, the length X2 of the second substrate 2 in the X-axis direction is shorter than the length X1 of the first substrate 1 in the X-axis direction (X2 ⁇ X1). The length Y2 of the second substrate 2 in the Y-axis direction is shorter than the length Y1 of the first substrate 1 in the Y-axis direction (Y2 ⁇ Y1).
  • the second substrate 2 is, for example, a magnetic ferrite plate.
  • the second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, and 21g are formed over substantially the entire third main surface VS3 of the second substrate 2 and arranged in the Y-axis direction.
  • the second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, and 21g are linear conductor patterns that extend in the X-axis direction and are parallel to each other.
  • the second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, and 21g are patterns obtained by solidifying (metalizing) a conductor paste containing Cu, for example.
  • the meaning of “extending in the X-axis direction” is not limited to the fact that the second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, and 21g are all parallel to the X-axis direction. It also includes that the direction in which the two-conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, and 21g extend approximately in the X-axis direction, that is, substantially extends in the X-axis direction.
  • the fourth main surface VS4 of the second substrate 2 is mounted (attached) to the center of the first main surface VS1 of the first substrate 1 via a resin adhesive (not shown). That is, the fourth main surface VS4 of the second substrate 2 is disposed to face the first main surface of the first substrate 1, and the fourth main surface VS4 of the second substrate 2 is the first main surface VS of the first substrate 1. Connected to the main surface. Further, the length X2 in the X-axis direction of the second substrate 2 mounted (attached) on the first main surface VS1 of the first substrate 1 is longer than the length Z2 in the Z-axis direction (X2> Z2).
  • the length X11 in the X-axis direction of the first conductor patterns 11b, 11c, 11d, 11e, 11f, and 11g is longer than the length X2 in the X-axis direction of the second substrate 2 (X11> X2). Therefore, even if the second substrate 2 is mounted (attached) to the center of the first main surface VS1 of the first substrate 1, the first end of the first conductor pattern (the first conductor pattern 11a in FIG. 1B), and The left ends of the first conductor patterns 11b to 11g) and the second ends (the right ends of the first conductor patterns 11b to 11g and the first conductor pattern 11h in FIG. 1B) are the first main pattern of the first substrate 1. It is exposed on the surface VS1.
  • the first end of the first conductor pattern (the first conductor pattern 11a in FIG. 1B and the left end of the first conductor patterns 11b to 11g) is connected to the first end of the second conductor pattern via the first bonding wire 31. It is connected to the end (the left end of the second conductor patterns 21a to 21g in FIG. 1A).
  • the first conductor pattern 11 a is connected to the first end of the second conductor pattern 21 a via the first bonding wire 31.
  • the first end of the first conductor pattern 11b is connected to the first end of the second conductor pattern 21b via the first bonding wire 31.
  • the first end of the first conductor pattern 11 c is connected to the first end of the second conductor pattern 21 c via the first bonding wire 31.
  • the first end of the first conductor pattern 11d is connected to the first end of the second conductor pattern 21d via the first bonding wire 31.
  • the first end of the first conductor pattern 11e is connected to the first end of the second conductor pattern 21e via the first bonding wire 31.
  • the first end of the first conductor pattern 11f is connected to the first end of the second conductor pattern 21f via the first bonding wire 31.
  • the first end of the first conductor pattern 11g is connected to the first end of the second conductor pattern 21g via the first bonding wire 31.
  • the second end of the first conductor pattern (the right end portion of the first conductor patterns 11b to 11g and the first conductor pattern 11h in FIG. 1B) is connected to the second conductor pattern via the second bonding wire 32. It is connected to the second end (the right end of the second conductor patterns 21a to 21g in FIG. 1A).
  • the second end of the first conductor pattern 11b is connected to the second end of the second conductor pattern 21a via the second bonding wire 32.
  • the second end of the first conductor pattern 11c is connected to the second end of the second conductor pattern 21b via the second bonding wire 32.
  • the second end of the first conductor pattern 11d is connected to the second conductor pattern 21c via the second bonding wire 32.
  • the second end of the first conductor pattern 11e is connected to the second end of the second conductor pattern 21d via the second bonding wire 32.
  • the second end of the first conductor pattern 11f is connected to the second end of the second conductor pattern 21e via the second bonding wire 32.
  • the second end of the first conductor pattern 11g is connected to the second end of the second conductor pattern 21f via the second bonding wire 32.
  • the first conductor pattern 11h is connected to the second end of the second conductor pattern 21g via the second bonding wire 32.
  • the first conductor patterns 11a, 11b, 11c, 11d, 11e, 11f, 11g, the second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, 21g, the plurality of first bonding wires 31 and the plurality of The second bonding wire 32 forms a 6.5-turn rectangular helical coil.
  • the “first end of the first conductor pattern” in the present invention refers to a portion where the first bonding wire 31 is connected to the first conductor pattern, and is referred to as “the second end of the first conductor pattern” in the present invention. Indicates a portion where the second bonding wire 32 is connected to the first conductor pattern.
  • the “first end of the second conductor pattern” in the present invention indicates a portion where the first bonding wire 31 is connected to the second conductor pattern, and the “second end of the second conductor pattern” in the present invention. Indicates a portion where the second bonding wire 32 is connected to the second conductor pattern. The same applies to the following embodiments.
  • the coil element 101 according to the present embodiment has the following effects.
  • the first conductor pattern formed on the first substrate 1, the second conductor pattern formed on the second substrate 2, the first bonding wire 31 and the second bonding wire 32. is used as part of the coil. Therefore, the length of each bonding wire (each first bonding wire 31 or each second bonding wire 32) is configured by connecting both ends of the arc-shaped bonding wire to both ends of the first conductor pattern. Shorter than the case. When each bonding wire becomes short, it becomes difficult to bend. Therefore, with this configuration, while having a large coil opening, a change in coil characteristics due to bending of the bonding wire is suppressed, and contact between adjacent bonding wires (inter-line short) can be suppressed.
  • the length of each first bonding wire is shorter than the length X11 of the first conductor pattern in the X-axis direction, and the length of each second bonding wire is the first conductor.
  • the length is preferably shorter than the length X11 in the X-axis direction of the pattern.
  • the length of each bonding wire (the first bonding wire 31 or the second bonding wire 32) is configured by connecting both ends of the bonding wire formed in an arc shape to both ends of the first conductor pattern. Shorter than the case. Therefore, a change in coil characteristics due to the bending of the bonding wire is suppressed, and contact between adjacent bonding wires (short circuit between lines) can be suppressed.
  • the coil element is more preferably configured such that the total length of each first bonding wire 31 and each second bonding wire 32 is shorter than the length X11 of the first conductor pattern in the X-axis direction.
  • the first conductor pattern and the second conductor pattern used for a part of the coil are not a wire or the like, but are both conductor patterns formed on the substrate.
  • the possibility of contact (short between lines) between the second conductor patterns is low. Therefore, the gap between the first conductor patterns arranged in the Y-axis direction can be easily reduced, and the gap between the second conductor patterns arranged in the Y-axis direction can be easily reduced. Therefore, with this configuration, the dimension (occupied area) in the Y-axis direction of the coil can be reduced for the number of turns.
  • the 1st conductor pattern and 2nd conductor pattern utilized for a part of coil are conductor patterns formed on the board
  • the length X2 of the second substrate 2 in the X-axis direction is longer than the length Z2 in the Z-axis direction (X2> Z2).
  • the length Z2 of the Z-axis method of the second substrate 2 is short, the length of each first bonding wire 31 and the length of each second bonding wire can be shortened.
  • the ratio of the conductor pattern constituting the coil can be further increased. Further, this configuration can reduce the height of the coil element.
  • the second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, and 21g of the coil element 101 are formed on the third main surface VS3 of the second substrate 2. With this configuration, the effective coil opening in the case of the coil element 101 can be increased as compared with the case where the second conductor pattern is formed inside the second substrate 2.
  • the second substrate 2 is a magnetic body.
  • the coil element 101 having a predetermined inductance value can be obtained without increasing the size of the coil.
  • substrate 2 is not limited to what the whole is a magnetic body. At least a part of the second substrate 2 may be a magnetic material.
  • the second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, and 21g are formed on the third main surface VS3 of the second substrate 2 that is a magnetic body.
  • the inductance of the coil element 101 is increased and the coil is increased.
  • Magnetic flux can be efficiently radiated to the outside of the element 101.
  • the fourth main surface VS4 of the second substrate 2 is connected to the first main surface of the first substrate 1, the fourth main surface VS4 of the second substrate 2 that is a magnetic material is connected to the fourth main surface VS4 as described above. 1 conductor pattern 11a, 11b, 11c, 11d, 11e, 11f, 11g adjoins. Therefore, the magnetic flux can be efficiently radiated to the outside of the coil element 101 while increasing the inductance of the coil element 101.
  • FIG. 2 is a plan view of the coil element 102 according to the second embodiment.
  • the coil element 102 has a configuration of first conductor patterns 11a, 11b, 11c, 11d, 11e, 11f, 11g, 11h, and 11i formed on the first substrate 1B with respect to the coil element 101 according to the first embodiment. Is different.
  • the coil element 102 differs from the coil element 101 in the configuration of the second substrate 2B and the second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, 21g, and 21h formed on the second substrate.
  • Other configurations are substantially the same as those of the coil element 101 according to the first embodiment.
  • the coil element 102 is formed on the first substrate 1B, the second substrate 2B, the first conductor patterns 11a, 11b, 11c, 11d, 11e, 11f, 11g, 11h, and 11i formed on the first substrate 1B.
  • the second conductor patterns 21 a, 21 b, 21 c, 21 d, 21 e, 21 f, 21 g, 21 h to be formed are provided with a plurality of first bonding wires 31 and a plurality of second bonding wires 32.
  • the first substrate 1B is a square insulating flat plate having two sides orthogonal to the X-axis direction and two sides orthogonal to the Y-axis direction.
  • the first conductor patterns 11a, 11b, 11c, 11d, 11e, 11f, 11g, 11h, and 11i are formed on the first main surface of the first substrate 1B.
  • the first conductor patterns 11a and 11h are rectangular conductor patterns.
  • the first conductor patterns 11b, 11c, 11d, 11e, 11f, 11g, and 11h are linear conductor patterns that extend radially from the approximate center of the first main surface of the first substrate 1B.
  • the second substrate 2B is a donut-shaped (annular) magnetic flat plate in which a hole is formed in the center of a circle. As shown in FIG. 2, the outer diameter of the second substrate 2B is shorter than any side of the first substrate 1B.
  • the second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, 21g, and 21h are formed on the third main surface of the second substrate 2B.
  • the second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, 21g, and 21h are linear conductor patterns that extend radially from the center of the second substrate 2B.
  • the second substrate 2B is mounted (attached) at the center of the first main surface VS1 of the first substrate 1.
  • the length of the first conductor patterns 11b, 11c, 11d, 11e, 11f, 11g, and 11h in the radial direction from the center of the second substrate 2B is larger than the length in the radial direction from the center of the second substrate 2B. short. Therefore, even if the second substrate 2B is mounted (attached) to the center of the first main surface of the first substrate 1B, the first end of the first conductor pattern (the first conductor pattern 11a in FIG. 2 and the second substrate 2B). Of the first conductor patterns 11b, 11c, 11d, 11e, 11f, 11g, and 11h) and the second end (the first conductor pattern located inside the hole of the second substrate 2B in FIG. 2). The ends of 11b, 11c, 11d, 11e, 11f, 11g, and 11h and the first conductor pattern 11i) are exposed on the first main surface of the first substrate 1B.
  • the first end of the first conductor pattern is connected to the first end of the second conductor pattern via the first bonding wire 31 (second conductor patterns 21a, 21b, 21c located on the outer peripheral side of the second substrate 2B in FIG. 2). , 21d, 21e, 21f, and 21g).
  • the second end of the first conductor pattern is connected to the second end of the second conductor pattern via the second bonding wire 32 (the second conductor pattern located on the inner peripheral side of the hole of the second substrate 2B in FIG. 2).
  • the first conductor patterns 11a, 11b, 11c, 11d, 11e, 11f, 11g, 11h, 11i, the second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, 21g, 21h, the plurality of first The bonding wire 31 and the plurality of second bonding wires 32 constitute a toroidal coil.
  • Third Embodiment shows about the communication terminal device 301 provided with the antenna device 201 which is a helical antenna (electric field type antenna).
  • the helical antenna is a normal mode type helical antenna, a kind of monopole antenna, and an electric field type antenna. That is, the antenna device 201 radiates electromagnetic waves (radio waves) by forming an electric field around it.
  • the electric field type antenna is used for communication (far field communication) by electromagnetic waves (radio waves) with the antenna on the communication partner side.
  • electromagnetic waves radio waves
  • it is used for telephone calls and data communication in mobile phone terminals, wireless LAN communication, satellite signal reception in GPS, and the like.
  • FIG. 3A is an external perspective view of the communication terminal device 301 according to the third embodiment
  • FIG. 3B is a partially enlarged view showing the antenna device 201 provided in the communication terminal device 301.
  • the antenna device 201 is different from the coil element 101 according to the first embodiment in the number of turns of the coil. Other configurations are substantially the same as those of the coil element 101.
  • the communication terminal device 301 further includes an RFIC element 61 and a ground conductor 40 in addition to the antenna device 201.
  • the first substrate 1C is a rectangular insulating flat plate whose longitudinal direction coincides with the Y-axis direction and whose transverse direction coincides with the X-axis direction.
  • the first conductor patterns 11a, 11b, 11c, 11d, 11e, 11f, and 11g are formed near one corner (upper left corner in FIG. 3A) of the first main surface VS1 of the first substrate 1, and in the Y-axis direction. It is arranged.
  • the first conductor pattern 11g is a rectangular conductor pattern.
  • the first conductor patterns 11a, 11b, 11c, 11d, 11e, and 11f are linear conductor patterns that extend substantially in the X-axis direction and are parallel to each other.
  • the second substrate 2 is a rectangular dielectric flat plate in which the short side direction coincides with the X-axis direction and the long side direction coincides with the Y-axis direction.
  • the second substrate 2 is, for example, a sheet obtained by filling a PPE resin base with a high dielectric constant inorganic filler.
  • the second conductor patterns 21a, 21b, 21c, 21d, 21e, and 21f are formed over substantially the entire area of the third main surface VS3 of the second substrate 2 and are arranged in the Y-axis direction.
  • the second conductor patterns 21a, 21b, 21c, 21d, 21e, and 21f are linear conductor patterns that extend in the X-axis direction and are parallel to each other.
  • the second substrate 2 is mounted (attached) on the first main surface VS1 of the first substrate 1.
  • the length of the first conductor patterns 11a, 11b, 11c, 11d, 11e, and 11f in the X-axis direction is longer than the length of the second substrate 2 in the X-axis direction. Therefore, even if the second substrate 2 is mounted (attached) near one corner of the first main surface VS1 of the first substrate 1, the first conductor patterns 11a to 11a in the first end of the first conductor pattern (FIG. 3B). 11f) and the second end (the left ends of the first conductor patterns 11b to 11f in FIG. 3B and the first conductor pattern 11g) are exposed on the first main surface VS1 of the first substrate 1.
  • the first end of the first conductor pattern is connected to the first end of the second conductor pattern via the first bonding wire 31 (the left end of the second conductor patterns 21a, 21b, 21c, 21d, 21e, and 21f in FIG. 3B). Connected).
  • the second end of the first conductor pattern is connected to the second end of the second conductor pattern via the second bonding wire 32 (second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f in FIG. 3B). To the right end).
  • the bonding wire 32 constitutes a 6-turn rectangular helical coil.
  • the RFIC element 61 is mounted on the first main surface VS1 of the first substrate 1C.
  • the RFIC element 61 is an RFIC for UHF band or SHF band, for example, and is a power supply circuit for a 2.4 GHz band wireless LAN communication system.
  • One of the input / output parts of the RFIC element 61 is connected to the second end of the first conductor pattern 11a of the antenna device 201 via the conductor pattern 41 formed on the first main surface VS1 of the first substrate 1C.
  • the other input / output portion of the RFIC element 61 is connected to the ground conductor 40 formed on the first main surface VS1 of the first substrate 1C via the conductor pattern 42 formed on the first main surface of the first substrate 1C.
  • the ground conductor 40 is, for example, a Cu foil pattern. Note that the first conductor pattern 11 g of the antenna device 201 is open to the RFIC element 61.
  • the antenna device 201 functions as a radiating element of the helical antenna.
  • the antenna device 201 includes a helical antenna that is a kind of monopole antenna by having a coil with an electrical length of about 1 ⁇ 4 wavelength or more of the used frequency. Since the coil is formed in a helical shape, the antenna device 201 can be made small.
  • the communication terminal device 301 showed about the structural example provided with the antenna device 201 which functions as a radiating element of a helical antenna (electric field type antenna), it is not limited to this.
  • the communication terminal device may include a coil element 101 that functions as an inductor element.
  • the antenna device 201 and the ground conductor 40 are connected to the input / output unit of the RFIC element 61, and an example of an antenna device that is a monopole antenna type helical antenna (electric field antenna) is shown. It is not limited to this. Two antenna devices 201 may be connected to the input / output portion of the RFIC element 61 to constitute a so-called dipole antenna type helical antenna (electric field antenna).
  • FIG. 4 is an external perspective view of a communication terminal apparatus 302 according to the fourth embodiment.
  • the communication terminal device 302 is different from the communication terminal device 301 according to the third embodiment in the planar shape of the first substrate 1D.
  • the planar shape of the first conductor pattern 11 g included in the antenna device 202 is different from that of the antenna device 201 of the communication terminal device 301.
  • Other configurations are substantially the same as those of the communication terminal device 301.
  • the communication terminal device 302 includes an antenna device 202, an RFIC element 62, and a ground conductor 40 formed on the first main surface VS1 of the first substrate 1D.
  • the first substrate 1D is a rectangular insulating flat plate further extended in the longitudinal direction (Y-axis direction) than the first substrate 1C of the third embodiment.
  • the first conductor pattern 11g is a linear conductor pattern extending in the Y-axis direction.
  • the antenna device 202 of this embodiment includes a rectangular helical coil and a linear conductor pattern (first conductor pattern 11g) connected to the tip of the coil. With this configuration, the antenna device 201 functions as a so-called coil-loaded antenna (electric field antenna).
  • a wireless IC device 401 including an antenna device 203 that is a coil antenna (magnetic field type antenna) that is a kind of a minute loop antenna will be described.
  • the wireless IC device 401 according to the present embodiment is, for example, a card type information medium.
  • the “card type information medium” in the present invention is a card type device including the above-described coil element.
  • an SD (registered trademark) memory card or a SIM (registered trademark) card Subscriber Identity Module Module, mini-SIM, micro -Including flash memory cards such as SIM and nano-SIM.
  • the “magnetic field antenna” is an antenna that radiates magnetic flux.
  • the magnetic field type antenna is an antenna used for near field communication (near field communication) by magnetic field coupling with an antenna on the communication partner side, and is used for communication such as NFC (Near Field Communication).
  • FIG. 5A is an external perspective view of the wireless IC device 401 according to the fifth embodiment
  • FIG. 5B is a circuit diagram of the wireless IC device 401.
  • the antenna device 203 is illustrated as a coil antenna ANT.
  • the wireless IC device 401 is different from the communication terminal device 301 according to the third embodiment in that the wireless IC device 401 includes an antenna device 203, an RFIC element 62, and a chip capacitor 63.
  • the wireless IC device 401 is different from the communication terminal device 301 in that the ground conductor 40 is not provided.
  • the configuration of the antenna device 203 is substantially the same as that of the antenna device 201.
  • conductor patterns 43, 44, 45, and 46, electrodes 51 and 52, and power supply terminals 53 and 54 are formed on the first main surface VS1 of the first substrate 1E.
  • the conductor patterns 43, 44, 45, 46, the electrodes 51, 52, and the power feeding terminals 53, 54 are, for example, Cu foil patterns.
  • the first conductor pattern 11 a is connected to the electrode 51 through the conductor pattern 44, and the electrode 51 is connected to the power supply terminal 54 through the conductor pattern 46. That is, the first conductor pattern 11 a is connected to the power supply terminal 54 via the conductor pattern 44, the electrode 51, and the conductor pattern 46.
  • the first conductor pattern 11 g is connected to the electrode 52 through the conductor pattern 43, and the electrode 52 is connected to the power supply terminal 53 through the conductor pattern 45. That is, the first conductor pattern 11 g is connected to the power supply terminal 53 via the conductor pattern 43, the electrode 52, and the conductor pattern 45.
  • the RFIC element 62 is connected (mounted) to the power supply terminals 53 and 54 via the bonding wire 33. As shown in FIG. 5A, the RFIC element 62 is mounted on the first main surface VS1 of the first substrate 1E.
  • the RFIC element 62 is, for example, a packaged RFIC chip (bare chip) for an RFID tag, but may be a bare chip RFIC.
  • the chip capacitor 63 is mounted on the first substrate 1E.
  • the chip capacitor 63 is connected (mounted) to the electrodes 51 and 52 via a conductive bonding material such as solder.
  • the chip capacitor 63 is, for example, a multilayer ceramic chip component.
  • the coil antenna ANT is connected to the RFIC element 62, and the chip capacitor 63 is connected in parallel to the coil antenna ANT.
  • An LC resonance circuit is constituted by the coil antenna ANT, the chip capacitor 63, and the capacitance component inside the RFIC element 62.
  • the capacitance of the chip capacitor 63 is selected so that the resonance frequency of the LC resonance circuit is substantially equal to the communication frequency of the RFID system (for example, 13.56 MHz).
  • a plurality of chip capacitors 63 may be provided.
  • the antenna device 203 since the coil of the antenna device 203 is sufficiently short compared to the wavelength (for example, 1 ⁇ 4 wavelength or less of the used frequency), the antenna device 203 is a coil antenna (magnetic field type antenna) that is a kind of minute loop antenna. Function as. Note that the second substrate 2C of the present embodiment is preferably a magnetic ferrite plate, for example.
  • the step of connecting the input / output portion of the RFIC element 62 to the power supply terminals 53 and 54 via the bonding wire 33 is connected to the first end of the first conductor pattern via the first bonding wire 31.
  • the step of connecting to one end and the step of connecting the second end of the first conductor pattern to the second end of the second conductor pattern via the second bonding wire 32 may be performed simultaneously.
  • the wireless IC device 401 itself is a “card type information medium” (the wireless IC device 401 is formed in a card type) is shown, but the present invention is not limited to this configuration.
  • the “card type information medium” of the present invention may have a configuration including a wireless IC device and an antenna device individually.
  • the “card type information medium” of the present invention is not limited to only a wireless IC device including an antenna device (coil antenna) which is a magnetic field type antenna.
  • the “card type information medium” of the present invention may be configured to include a coil element that functions as an inductor element.
  • FIG. 6A is a plan view of a wireless IC device 402 according to the sixth embodiment
  • FIG. 6B is a cross-sectional view taken along the line AA in FIG. 7A is a plan view of the first substrate 1F included in the wireless IC device 402
  • FIG. 7B is a cross-sectional view taken along the line BB in FIG. 7A
  • 8A is a plan view of the second substrate 2F included in the wireless IC device 402
  • FIG. 8B is a cross-sectional view taken along the line CC in FIG. 8A.
  • the wireless IC device 402 according to the present embodiment is a wireless IC tag used for, for example, food or toys.
  • the wireless IC device 402 is different from the wireless IC device 401 according to the fifth embodiment in that it does not include the chip capacitor 63 but includes the resin members 71 and 72.
  • the wireless IC device 402 is different from the wireless IC device 401 in that the structure of the coil antenna (magnetic field type antenna) and the RFIC element 62 is provided inside the coil antenna (magnetic field type antenna). Other configurations are substantially the same as those of the wireless IC device 401.
  • the wireless IC device 402 includes a coil antenna (described in detail later), an RFIC element 62, and a resin member 72.
  • the antenna device includes a first substrate 1F, a second substrate 2F, first conductor patterns 11a, 11b, 11c, 11d, 11e, and 11f formed on the first substrate 1F, and a second conductor formed on the second substrate 2F. Patterns 21a, 21b, 21c, 21d, 21e, 21f, 21g, a plurality of first bonding wires 31 and a plurality of second bonding wires 32 are provided.
  • the first substrate 1F is a rectangular insulating flat plate whose longitudinal direction coincides with the Y-axis direction and whose transverse direction coincides with the X-axis direction, and has a first main surface VS1 and a second main surface VS2.
  • the first conductor patterns 11a, 11b, 11c, 11d, 11e, and 11f are formed on the first main surface VS1 of the first substrate 1F and arranged in the Y-axis direction.
  • the first conductor patterns 11a, 11b, 11c, 11d, 11e, and 11f are linear conductor patterns that extend substantially in the X-axis direction and are substantially parallel to each other.
  • the other end of the first conductor pattern 11c (the right end of the first conductor pattern 11c in FIG. 7A) and the one end of the first conductor pattern 11d (the left end of the first conductor pattern 11d in FIG. 7A) Is connected to the RFIC element 62 through a conductive bonding material such as solder.
  • the RFIC element 62 is mounted (mounted) at the center of the first main surface VS1 of the first substrate 1F.
  • the resin member 71 is mounted (attached) at the center of the first main surface VS1 of the first substrate 1F.
  • the area of the resin member 71 viewed from the Z-axis direction is larger than the area of the RFIC element 62 viewed from the Z-axis direction.
  • the length (thickness) of the resin member 71 in the Z-axis direction is larger than the length (thickness) of the RFIC element 62 in the Z-axis direction. Therefore, the RFIC element 62 is embedded in the resin member 71 by mounting (mounting) the resin member 71 on the center of the first main surface VS1 of the first substrate 1F.
  • the planar shape of the resin member 71 is substantially the same as that of the second substrate 2F.
  • the second substrate 2F is a rectangular magnetic plate whose longitudinal direction coincides with the Y-axis direction and whose transverse direction coincides with the X-axis direction, and has a third main surface VS3 and a fourth main surface VS4.
  • the second conductor patterns 21a, 21b, 21c, 21d, 21e, and 21f are formed on the third main surface VS3 of the second substrate 2F and arranged in the Y-axis direction.
  • the second conductor patterns 21a, 21b, 21c, 21d, 21e, and 21f are linear conductor patterns that extend in the X-axis direction and are parallel to each other.
  • the second conductor pattern 21g is formed on the fourth main surface VS4 of the second substrate 2F, and from one corner (the upper left corner of the second substrate 2F in FIG. 8A) to another angle (the second substrate in FIG. 8A). 2F is a conductor pattern extending toward the lower right corner).
  • One end portion of the second conductor pattern 21g (the upper left end portion of the second conductor pattern 21g in FIG. 8A) is the other end portion of the second conductor pattern 21f (the second conductor pattern 21g in FIG. 8A) via the interlayer connection conductor. 2 conductor pattern 21f).
  • the other end of the second conductor pattern 21g (the lower right end of the second conductor pattern 21g in FIG. 8A) is connected to the other end of the second conductor pattern 21a via the interlayer connection conductor (FIG. 8A). It is connected to the right end portion of the second conductor pattern 21a.
  • the fourth main surface VS4 of the second substrate 2F is mounted (attached) on the resin member 71. Therefore, as shown in FIG. 6B, the fourth main surface VS4 of the second substrate 2F is disposed to face the first main surface of the first substrate 1F.
  • the length X11 in the X-axis direction of the first conductor patterns 11a, 11b, 11e, and 11f is longer than the length X71 (X2) in the X-axis direction of the resin member 71 (second substrate 2F) (X11> X71). Therefore, even if the resin member 71 (second substrate 2F) is mounted (attached) at the center of the first main surface VS1 of the first substrate 1F, the first end of the first conductor pattern (first in FIG. 7A).
  • the left ends of the conductor patterns 11a, 11b, 11c, 11e, and 11f) and the second end are formed on the first substrate 1F. It is exposed to the first main surface VS1.
  • the first end of the first conductor pattern is the first end of the second conductor pattern via the first bonding wire 31 (the left end portion of the second conductor patterns 21a, 21b, 21c, 21d, and 21e in FIG. 8A). Connected to.
  • the second end of the first conductor pattern is connected to the second end of the second conductor pattern via the second bonding wire 32 (the right end of the second conductor patterns 21b, 21c, 21d, 21e, and 21f in FIG. 8A). Connected).
  • the bonding wire 32 forms a rectangular helical coil antenna (magnetic field type antenna).
  • the RFIC element 62 is disposed inside the coil antenna (magnetic field type antenna) and embedded in the resin member 71.
  • the resin member 72 is mounted (attached) on the entire surface of the first main surface VS1 of the first substrate 1F.
  • the planar shape of the resin member 72 is substantially the same as that of the first substrate 1F.
  • the length (thickness) of the resin member 72 in the Z-axis direction is the Z-axis direction of the coil antenna (a combination of the resin member 71, the second substrate 2F, the first bonding wire 31, and the second bonding wire 32). It is larger than the length (thickness). Therefore, the coil antenna is embedded in the resin member 72 by mounting (mounting) the resin member 72 on the entire surface of the first main surface VS1 of the first substrate 1F.
  • the wireless IC device 402 including the antenna device (coil antenna) that is a magnetic field antenna can be realized.
  • the RFIC element 62 Since the RFIC element 62 is disposed inside the antenna device (coil antenna), the entire wireless IC device is robust. In particular, since the RFIC element 62 can be easily configured so as not to be exposed to the outside of the wireless IC device 402, the protection function of the RFIC element 62 is enhanced, and an increase in size caused by mounting the RFIC element 62 outside can be avoided.
  • a high temperature resin for example, a high temperature resin of 300 ° C. or higher
  • the RFIC element 62 includes the first conductor patterns 11a, 11b, 11c, 11d, 11e, and 11f, the second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, and 21g, and a plurality of first bonding wires 31. And disposed in an area surrounded by the plurality of second bonding wires 32 and surrounded by the resin member 71 and the first substrate 1F. Therefore, it is difficult to apply a large thermal load to the connection part between the mounting component (RFIC element 62) and the power supply terminal (first conductor patterns 11c and 11d) and the mounting component (RFIC element 62).
  • the wireless IC device in which the RFIC element 62 is disposed inside the antenna device is shown, but the present invention is not limited to this configuration.
  • a mounting component such as a chip capacitor for configuring the LC resonance circuit may be disposed inside the antenna device (coil antenna).
  • the present invention is not limited to this configuration.
  • the resin member 72 may be mounted (attached) on a part of the first main surface VS1 of the first substrate 1F.
  • the shape and thickness of the resin member 72 can be changed as appropriate.
  • the resin member 72 is not essential.
  • FIG. 9A is a plan view of a wireless IC device 403 according to the seventh embodiment, and FIG. 9B is a DD cross-sectional view in FIG. 9A.
  • 10A is a plan view of the first substrate 1G included in the wireless IC device 403, and FIG. 10B is a cross-sectional view taken along line EE in FIG. 10A.
  • FIG. 11A is a plan view of the second substrate 2G included in the wireless IC device 403, and FIG. 11B is a cross-sectional view taken along line FF in FIG. 11A.
  • the wireless IC device 403 according to the present embodiment is a wireless IC tag used for, for example, food or toys.
  • the wireless IC device 403 is different from the wireless IC device 402 according to the sixth embodiment in the configuration of the first conductor pattern and the second conductor pattern. Other configurations are substantially the same as those of the wireless IC device 402.
  • the antenna device of this embodiment includes a first substrate 1G, a second substrate 2G, and first conductor patterns 11a, 11b, 11c, 11d, 11e, 11f, 11g, 12a, 12b, 12c, and the like formed on the first substrate 1G. 12d, 12e, 12f, 12g, 12h, 13a, 13b, 13c, 13d, 13e, 13f, 13g, 13h, second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, formed on the second substrate 2G, 21g, 21h, a plurality of first bonding wires 31 and a plurality of second bonding wires 32 are provided.
  • the first conductor patterns 11a, 11b, 11c, 11d, 11e, 11f, and 11g are formed on the second main surface VS2 of the first substrate 1G and arranged in the Y-axis direction.
  • the first conductor patterns 11a, 11b, 11c, 11d, 11e, 11f, and 11g are linear conductor patterns that extend substantially in the X-axis direction and are parallel to each other.
  • the first conductor patterns 12a, 12b, 12c, 12d, 12e, 12f, 12g, and 12h are formed on the side of the first main surface VS1 of the first substrate 1G (the left side of the first substrate 1G in FIG. 10A). And arranged in the Y-axis direction.
  • the first conductor patterns 12a, 12b, 12c, 12d, 12e, 12f, and 12g are elliptical conductor patterns.
  • the first conductor pattern 12h extends from one corner of the first substrate 1G (the upper left corner of the first substrate 1G in FIG. 10A) toward the other corner (the lower right corner of the first substrate 1G in FIG. 10A). It is a linear conductor pattern.
  • the first conductor patterns 13a, 13b, 13c, 13d, 13e, 13f, 13g, and 13h are on the other side (the right side of the first substrate 1G in FIG. 10A) of the first main surface VS1 of the first substrate 1G. Formed and arranged in the Y-axis direction.
  • the first conductor patterns 13b, 13c, 13d, 13e, 13f, 13g, and 13h are elliptical conductor patterns.
  • the first conductor pattern 13a is a linear conductor pattern extending from one corner to the other corner of the first substrate 1G.
  • One end portions of the first conductor patterns 11a to 11g are connected to the first conductor patterns 12a, 12b, 12c, 12d, 12e, and the like via the interlayer connection conductors. 12f and 12g are connected to each other.
  • the other end portions of the first conductor patterns 11a to 11g are connected to the first conductor patterns 13b, 13c, 13d, 13e, and 13f via the interlayer connection conductor. , 13g, and 13h, respectively.
  • the other end of the first conductor pattern 12h (the lower right end of the first conductor pattern 12h in FIG.
  • the RFIC element 62 is mounted (mounted) at the center of the first main surface VS1 of the first substrate 1G.
  • the resin member 71 is mounted (mounted) on the center of the first main surface VS1 of the first substrate 1G, whereby the RFIC element 62 is attached to the resin member 71. Buried.
  • the area of the resin member 71 viewed from the Z-axis direction is smaller than the area of the second substrate 2G viewed from the Z-axis direction.
  • the second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, 21g, and 21h are formed on the third main surface VS3 of the second substrate 2G and arranged in the Y-axis direction.
  • the second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, 21g, and 21h are linear conductor patterns that extend in the X-axis direction and are parallel to each other.
  • the fourth main surface VS4 of the second substrate 2G is mounted (attached) on the resin member 71. Therefore, as shown in FIGS. 9B and 11B, the fourth main surface VS4 of the second substrate 2G is disposed to face the first main surface of the first substrate 1G.
  • the length X11 in the X-axis direction of the first conductor patterns (11a to 11g, 12a to 12h, 13a to 13h and interlayer connection conductors) formed on the first substrate 1G is the resin member 71 (second substrate 2G).
  • X71 X2
  • X11> X71 X71
  • the first substrate 1G is exposed on the first main surface VS1.
  • the first end of the first conductor pattern is connected to the first end of the second conductor pattern via the first bonding wire 31 (second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, 21g in FIG. 11A). , 21h).
  • the second end of the first conductor pattern is connected to the second end of the second conductor pattern via the second bonding wire 32 (second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f in FIG. 11A). , 21g, 21h).
  • the rectangular helical coil antenna includes 13g, 13h, interlayer connection conductors, second conductor patterns 21a, 21b, 21c, 21d, 21e, 21f, 21g, 21h, a plurality of first bonding wires 31 and a plurality of second bonding wires 32.
  • Magnetic field type antenna is configured.
  • the RFIC element 62 is disposed inside the coil antenna (magnetic field type antenna) and embedded in the resin member 71.
  • the resin member 72 is mounted (attached) on the entire surface of the first main surface VS1 of the first substrate 1G.
  • the planar shape of the resin member 72 is substantially the same as that of the first substrate 1G.
  • the length (thickness) of the resin member 72 in the Z-axis direction is the Z-axis direction of the coil antenna (a combination of the resin member 71, the second substrate 2G, the first bonding wire 31, and the second bonding wire 32). It is larger than the length (thickness). Therefore, the coil antenna (antenna device) is embedded in the resin member 72 by mounting (mounting) the resin member 72 on the entire surface of the first main surface VS1 of the first substrate 1G.
  • the wireless IC device 403 including an antenna device that is a coil antenna (magnetic field type antenna) can be realized.
  • the first conductor patterns 11a, 11b, 11c, 11d, 11e, 11f, and 11g extending in the X-axis direction are formed on the second main surface VS2 of the first substrate 1G.
  • the effective coil opening of the coil antenna can be increased as compared with the case where the first conductor pattern is formed inside the first substrate 1G or on the first main surface VS1.
  • the planar shape of the resin member 71 located between the first substrate 1G and the second substrate 2G does not have to be substantially the same as the second substrate 2G.
  • the shape and thickness of the resin member 71 can be changed as appropriate.
  • the resin member 71 is not essential.
  • FIG. 12 is a plan view of an electronic device 501 according to the eighth embodiment.
  • the “electronic device” in the present invention includes a device including a housing and the coil element described above, a device including the housing and the electric field antenna described above, a device including the housing and the magnetic field antenna described above, and a housing.
  • the electronic device is, for example, a mobile phone terminal, a so-called smart phone, a tablet terminal, a PDA, a notebook PC, or a wearable terminal (so-called smart watch, smart glass, or the like).
  • the electronic device 501 includes a rectangular parallelepiped casing 81 and a wireless IC device 402 that is a card type information medium.
  • the wireless IC device 402 is the same as that shown in the fifth embodiment.
  • the housing 81 has a display 82, a button part 83, and a speaker part 84.
  • the casing 81 has a slot 86 and a storage portion 85 therein.
  • the wireless IC device 401 is inserted into the slot 86 of the housing 81 and stored in the storage unit 85. That is, the wireless IC device 402 is housed in the housing 81.
  • NFC near field communication
  • the electronic device 501 has a configuration in which the wireless IC device 402 that is a card-type information medium is inserted into the slot 86 of the housing 81 and stored in the storage unit 85, but is not limited to this configuration. It is not something.
  • the slot 86 and the storage portion 85 are not essential components.
  • the wireless IC device 402 does not have to be a card type information medium, and the wireless IC device 402 may be simply housed inside the housing 81. Further, the wireless IC device 402 may be configured to be connected to an internal circuit of the electronic device 501 through an electrode or the like.
  • the configuration in which the wireless IC device 402 is accommodated in the housing 81 is shown, but the configuration is not limited to this configuration.
  • a configuration may be adopted in which a coil element that functions as an inductor element is housed in the housing 81.
  • the antenna device may be housed in the housing 81. In this manner, an electronic apparatus including any one of the coil element, the antenna device, the wireless IC device, and the card type information medium according to the present invention can be realized.
  • the casing 81 of the electronic device 501 has a rectangular parallelepiped shape is shown, but the present invention is not limited to this configuration. If the above-described coil element (antenna device, wireless IC device) can be housed in the housing, the shape of the housing (electronic device) can be changed as appropriate.
  • first substrate and the second substrate are flat plates such as a rectangle or a square
  • the planar shapes of the first substrate and the second substrate can be changed as appropriate, such as polygonal, L-shaped, T-shaped, circular, elliptical, and the like.
  • the first substrate and the second substrate are not limited to flat plates, and may have a three-dimensional structure or the like as long as the operations and effects of the present invention are achieved.
  • the main surfaces (first main surface VS1, second main surface VS2, third main surface VS3, and fourth main surface VS4) of the first substrate and the second substrate are not limited to planes, but are curved surfaces or the like. It may be.
  • the Y-axis length Y1 of the first substrate is longer than the Y-axis length Y2 of the second substrate (Y1> Y2).
  • the present invention is not limited to this. is not. If the length X1 of the first substrate in the X-axis direction is longer than the length X2 of the second substrate in the X-axis direction (X1> X2), the length Y1 of the first substrate in the Y-axis direction is It may be shorter than the length Y2 of the two substrates in the Y-axis direction (Y1 ⁇ Y2).
  • the antenna apparatus and the electronic device in the communication system such as NFC mainly using magnetic field coupling have been described.
  • the apparatus and the electronic device can be used in the same manner in a non-contact power transmission system (electromagnetic induction method, magnetic field resonance method) using magnetic field coupling.
  • the antenna devices according to the fifth to eighth embodiments described above include a power receiving antenna of a power receiving device of a magnetic resonance type contactless power transmission system used at a frequency in the HF band (especially in the vicinity of 6.78 MHz or 6.78 MHz). It can be applied as a power transmission antenna for power transmission devices.
  • the antenna device functions as a power receiving antenna or a power transmitting antenna device. Both ends of the coil in the antenna device are connected to a power receiving circuit or a power transmitting circuit that operates a used frequency band (HF band, particularly around 6.78 MHz).
  • the power receiving circuit includes, for example, a matching circuit for supplying power from the power receiving antenna to a load (secondary battery or the like), a smoothing circuit, a DC / DC converter, and the like.
  • the power receiving circuit is cascaded between the power receiving antenna and the load.
  • the power transmission circuit includes, for example, a rectifier circuit for supplying power from a commercial power source to the power transmission antenna, a smoothing circuit, a switch circuit that functions as a DC / AC inverter, and the like.
  • the power transmission circuit is connected in cascade between the commercial power source and the power transmission antenna.
  • ANT Coil antenna VS1: First main surface VS2 of the first substrate ... Second main surface VS3 of the first substrate ... Third main surface VS4 of the second substrate ... Fourth main surface X1 of the second substrate ... of the first substrate X-axis length X2 X-axis length X11 of second substrate X-axis length X71 of first conductor pattern X-axis length Y1 of resin member 71 Y-first substrate Y Length Y2 in the axial direction ... Length Z2 in the Y-axis direction of the second substrate ... Length 1,2B, 1C, 1D, 1E, 1F, 1G in the Z-axis direction of the second substrate ...

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  • Coils Or Transformers For Communication (AREA)

Abstract

L'invention concerne un élément bobine (101) qui est pourvu d'un premier substrat (1) présentant une première surface principale (VS1), d'un second substrat (2) présentant une quatrième surface principale (VS4), de premiers motifs conducteurs (11a à 11g) formés sur le premier substrat (1), de seconds motifs conducteurs (21a à 21g) formés sur le second substrat (2), d'une pluralité de premiers fils de connexion (31) et d'une pluralité de seconds fils de connexion (32) ; et ledit élément bobine (101) constitue une bobine. Le second substrat (2) est disposé de manière que la quatrième surface principale (VS4) soit située en regard la première surface principale (VS1). Les premiers motifs conducteurs (11a à 11g) sont connectés à des premières extrémités des seconds motifs conducteurs (21a à 21g) par l'intermédiaire des premiers fils de connexion (31), tout en étant connectés à des secondes extrémités des seconds motifs conducteurs (21a à 21g) par l'intermédiaire des seconds fils de connexion (32).
PCT/JP2016/072890 2015-08-26 2016-08-04 Élément bobine, dispositif d'antenne, support d'informations du type carte, dispositif de circuit intégré sans fil et dispositif électronique WO2017033698A1 (fr)

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CN201690001054.2U CN207909619U (zh) 2015-08-26 2016-08-04 天线装置、卡型信息介质以及无线ic器件

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JP2015-166527 2015-08-26

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019130811A1 (fr) * 2017-12-28 2019-07-04 日本発條株式会社 Dispositif de communication sans fil portable et appareil d'identification d'informations utilisant un dispositif de communication sans fil portable
TWI703914B (zh) * 2018-08-27 2020-09-01 日商東芝記憶體股份有限公司 半導體記憶裝置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110994142A (zh) 2019-11-14 2020-04-10 广东通宇通讯股份有限公司 微带线滤波辐射振子、滤波辐射单元及天线

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745435A (ja) * 1993-07-29 1995-02-14 Kyocera Corp インダクタ構造
JPH11251147A (ja) * 1998-02-27 1999-09-17 Omron Corp インダクタとこのインダクタを用いたトランス
JP2001024418A (ja) * 1999-07-06 2001-01-26 Nec Shizuoka Ltd 携帯無線機の基板構成
US20100259350A1 (en) * 2009-04-14 2010-10-14 Biar Jeff Inductor or transformer for microelectric system
WO2013168558A1 (fr) * 2012-05-09 2013-11-14 株式会社 村田製作所 Élément d'antenne à cadre et module d'antenne

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745435A (ja) * 1993-07-29 1995-02-14 Kyocera Corp インダクタ構造
JPH11251147A (ja) * 1998-02-27 1999-09-17 Omron Corp インダクタとこのインダクタを用いたトランス
JP2001024418A (ja) * 1999-07-06 2001-01-26 Nec Shizuoka Ltd 携帯無線機の基板構成
US20100259350A1 (en) * 2009-04-14 2010-10-14 Biar Jeff Inductor or transformer for microelectric system
WO2013168558A1 (fr) * 2012-05-09 2013-11-14 株式会社 村田製作所 Élément d'antenne à cadre et module d'antenne

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019130811A1 (fr) * 2017-12-28 2019-07-04 日本発條株式会社 Dispositif de communication sans fil portable et appareil d'identification d'informations utilisant un dispositif de communication sans fil portable
CN111492536A (zh) * 2017-12-28 2020-08-04 日本发条株式会社 便携式无线通信装置及使用便携式无线通信装置的信息识别装置
KR20200098675A (ko) * 2017-12-28 2020-08-20 닛폰 하츠죠 가부시키가이샤 휴대형 무선 통신 장치 및 휴대형 무선 통신 장치를 이용한 정보 식별 장치
KR102382309B1 (ko) * 2017-12-28 2022-04-04 닛폰 하츠죠 가부시키가이샤 휴대형 무선 통신 장치 및 휴대형 무선 통신 장치를 이용한 정보 식별 장치
TWI703914B (zh) * 2018-08-27 2020-09-01 日商東芝記憶體股份有限公司 半導體記憶裝置

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