WO2017026194A1

WO2017026194A1 - Laser system and method for cooling laser device

Info

Publication number: WO2017026194A1
Application number: PCT/JP2016/069483
Authority: WO
Inventors: 洋平葛西
Original assignee: 株式会社フジクラ
Priority date: 2015-08-07
Filing date: 2016-06-30
Publication date: 2017-02-16
Also published as: JP2017037890A

Abstract

The present invention provides a laser system capable of externally releasing heat generated by a laser device using a simple and inexpensive configuration. The laser system 101 is provided with a semiconductor laser module 120 for emitting a laser beam, a heat transfer member 80 on which the semiconductor laser module 120 is placed, and heat absorption members 70A, 70B. The heat transfer member 80 has a heat transfer surface 80A through which heat generated by a laser element 54 of the semiconductor laser module 120 is transmitted. The heat absorption members 70A, 70B can be disposed in a heat absorption space E, which is formed adjacent to the heat transfer surface 80A of the heat transfer member 80, in contact with the heat transfer surface 80A. The heat absorption members 70A, 70B can be moved from the heat absorption space E to a heat release space R for releasing the heat absorbed in the heat absorption space E. The laser system 101 is provided with a movement mechanism 74 for moving the heat absorption members 70A, 70B from the heat absorption space E to the heat release space R.

Description

Laser system and laser apparatus cooling method

The present invention relates to a laser system, and more particularly to a method for cooling a laser device that emits laser light within the laser system.

With the recent increase in output of laser devices, the amount of heat generated by laser elements that emit laser light tends to increase. In general, a cooling method using water cooling is used to absorb heat generated from such a laser element (see, for example, Patent Document 1). That is, a heat sink having a flow path formed therein is installed in the vicinity of the laser element, and water is circulated through the flow path in the heat sink using a pump. The water flowing through the flow path in the heat sink absorbs heat generated from the laser element. The water whose temperature has risen due to absorption of heat from the laser element is guided to the tank, where it is cooled by a heat exchanger or the like and then circulated to the heat sink again. Examples of the heat exchanger used at this time include an air-cooled heat exchanger using a fan and a separate water-cooled heat exchanger.

However, in the method using the water-cooled heat sink described above, it is necessary to form a flow path inside the heat sink, which is more expensive than a simple metal block. Further, since a tank, a heat exchanger, and a pipe line connecting these with the heat sink are also required, the cost is further increased and the required space is increased. Furthermore, in order to prevent clogging of the flow path and the pipeline, it is necessary to periodically maintain the flow path and the pipeline.

JP 2010-135704 A

The present invention has been made in view of the above-described problems of the prior art, and provides a laser system and a laser device cooling method capable of releasing heat generated from the laser device to the outside with a simple and inexpensive configuration. For the purpose.

According to the first aspect of the present invention, there is provided a laser system capable of releasing heat generated from the laser device to the outside with a simple and inexpensive configuration. This laser system includes a laser device that emits laser light and a heat transfer member on which the laser device is placed. The heat transfer member has a heat transfer surface to which heat generated from the laser device is transmitted. The laser system can be disposed in a heat absorption space formed adjacent to the heat transfer surface in contact with the heat transfer surface of the heat transfer member, and heat absorbed from the heat absorption space in the heat absorption space. At least one heat absorbing member configured to be movable in the heat dissipation space for releasing the heat.

According to the first aspect of the present invention, the heat generated from the laser device can be absorbed by the heat absorption member disposed in the heat absorption space via the heat transfer surface of the heat transfer member, and the heated heat absorption member is It can move to the heat dissipation space and dissipate heat there. Therefore, the heat generated from the laser device can be released to the outside with a simple configuration without the need for a heat sink, tank, heat exchanger or the like in which the flow path is formed, thereby reducing the cost of the entire laser system. Can do. Moreover, since it is not what cools using a fluid and a flow path, it is not necessary to maintain frequently.

The laser system may further include a moving mechanism that moves the at least one heat absorbing member from the heat absorbing space to the heat radiating space. Further, the at least one heat absorbing member may include a plurality of heat absorbing members. In this case, the moving mechanism moves the heat absorbing member located in the heat absorbing space among the plurality of heat absorbing members to the heat radiating space, and moves the other heat absorbing members of the plurality of heat absorbing members to the heat absorbing member. It is preferable to move to space. By setting it as such a structure, it becomes possible to absorb heat continuously using the heat absorption member which has not been heated yet.

The laser device may include a laser element that generates the laser light. In this case, the area of the laser element when the laser element is viewed in plan is preferably equal to or less than the area of the at least one heat absorption member when the at least one heat absorbing member is viewed in plan. And the at least one endothermic member positioned in the endothermic space, the at least one endothermic member and the laser element coincide with each other, or the at least one endothermic member includes the laser element. It is preferable that Furthermore, it is preferable that an area of the laser element when the laser element is viewed in plan is smaller than an area of the at least one endothermic member when the at least one endothermic member is viewed in plan. By maintaining such a relationship, the heat generated by the laser element can be more reliably transmitted to the heat absorbing member.

According to the second aspect of the present invention, there is provided a method of cooling a laser device that can release heat generated from the laser device to the outside with a simple and inexpensive configuration. In this method, the laser device placed on the heat transfer member is cooled. At least one heat absorbing member in which heat from the laser device is disposed in a heat absorbing space formed adjacent to the heat transfer surface via a heat transfer surface of the heat transfer member to which heat generated from the laser device is transmitted. To absorb. After stopping the emission of the laser light from the laser device, the at least one heat absorbing member is moved from the heat absorbing space to the heat radiating space, and the heat absorbed by the at least one heat absorbing member in the heat radiating space is absorbed. Release.

According to the second aspect of the present invention, the heat generated from the laser device can be absorbed by the heat absorption member disposed in the heat absorption space formed at a position adjacent to the laser device, and the heated heat absorption member is It can move to the heat dissipation space and dissipate heat there. Therefore, the heat generated from the laser device can be released to the outside with a simple configuration without the need for a heat sink, tank, heat exchanger or the like in which the flow path is formed, thereby reducing the cost of the entire laser system. Can do. Moreover, since it is not what cools using a fluid and a flow path, it is not necessary to maintain frequently.

Here, when the laser beam is emitted again when an arbitrary time T has elapsed after the emission of the laser beam from the laser device is stopped, the at least one heat absorbing member (n is (An integer of 2 or more) is prepared, and before the time T has elapsed since the emission of the laser beam from the laser device is stopped, the heat absorption member that has absorbed the heat is removed from the heat absorption space. It is preferable to move to the heat radiating space and move the other heat absorbing member to the heat absorbing space so as to be in contact with the heat transfer surface. By doing in this way, a laser apparatus can be cooled continuously.

Further, if the n heat absorbing members are sequentially moved to the heat absorbing space or the heat radiating space, the cooling efficiency is improved. In this case, before the time T / n elapses after the emission of the laser beam from the laser device is stopped, the first heat absorbing member among the n heat absorbing members is changed from the heat absorbing space to the heat radiating space. If it moves, the heat from the laser device can be efficiently distributed to the n heat absorbing members, and the heat dissipation is improved.

According to the present invention, the heat generated from the laser device can be absorbed by the heat absorption member disposed in the heat absorption space via the heat transfer surface of the heat transfer member, and the heated heat absorption member is moved to the heat dissipation space. Heat can be dissipated there. Therefore, the heat generated from the laser device can be released to the outside with a simple configuration without the need for a heat sink, tank, heat exchanger or the like in which the flow path is formed, thereby reducing the cost of the entire laser system. Can do. Moreover, since it is not what cools using a fluid and a flow path, it is not necessary to maintain frequently.

FIG. 1 is a cross-sectional view showing a laser system according to a first embodiment of the present invention. 2 is a cross-sectional view taken along line AA ′ of FIG. 3 is a cross-sectional view taken along the line BB ′ of FIG. 4 is a cross-sectional view showing a state in which the heat absorbing member is moved in the laser system of FIG. 1, and corresponds to a cross section taken along line AA ′ of FIG. FIG. 5 is a cross-sectional view showing a state where the heat absorbing member is moved in the laser system of FIG. 1, and corresponds to a cross section taken along line BB ′ of FIG. FIG. 6 is a timing chart in the case of emitting laser light at regular time intervals in the laser system of FIG. FIG. 7 is a cross-sectional view schematically showing a laser system according to another embodiment of the present invention, and corresponds to a cross section taken along line AA ′ of FIG. FIG. 8 is a perspective view schematically showing a heat absorbing member used in the laser system of FIG. FIG. 9 is a cross-sectional view schematically showing a configuration of a laser system in the second embodiment of the present invention. 10 is a cross-sectional view taken along the line CC ′ of FIG. FIG. 11 is a plan view of FIG. FIG. 12 is a diagram schematically showing a fiber laser device in the laser system of FIG. FIG. 13 is a cross-sectional view schematically showing a laser system according to another embodiment of the present invention.

Hereinafter, embodiments of a laser system according to the present invention will be described in detail with reference to FIGS. 1 to 13. 1 to 13, the same or corresponding components are denoted by the same reference numerals, and redundant description is omitted. In addition, in FIGS. 1 to 13, the scale and dimensions of each component are exaggerated, and some components may be omitted.

1 is a cross-sectional view schematically showing a laser system 101 according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA ′ in FIG. 1, and FIG. 3 is a cross-sectional view taken along line BB ′ in FIG. It is line sectional drawing. As shown in FIGS. 1 to 3, the laser system 101 in this embodiment includes a semiconductor laser module 120 as a laser device that emits laser light. The semiconductor laser module 120 includes a frame body 40 having four side walls 41 to 44, a bottom plate 50 disposed below the frame body 40, a lid body 51 disposed above the frame body 40, and a bottom plate 50. A submount 52 mounted, a semiconductor laser element (semiconductor laser diode) 54 mounted on the submount 52, and a fiber mount 56 mounted on the bottom plate 50 are provided. The submount 52 and the fiber mount 56 are fixed on the bottom plate 50 by, for example, solder.

A fiber hole (not shown) for inserting an optical fiber 60 extending in the X direction is formed in the frame body 40, and an end portion of the optical fiber 60 inserted into the fiber hole is, for example, soldered on the fiber mount 56. 58 is fixed. At this time, the optical fiber 60 is arranged so that the laser light (excitation light) emitted from the semiconductor laser element 54 is coupled to the distal end portion 60 A of the optical fiber 60. The laser light emitted from the semiconductor laser element 54 is incident on the distal end portion 60A of the optical fiber 60, propagates in the optical fiber 60, and is guided to, for example, an amplification optical fiber.

As shown in FIGS. 1 to 3, the laser system 101 includes a heat transfer member 80 on which a semiconductor laser module 120 as a laser device is placed, and a flat plate shape on which two heat absorbing members 70 A and 70 B are placed on the upper surface. The tray 72 is provided. For example, the

heat absorbing members

70A and 70B are members made of metal or ceramic. A through hole 83 extending in the Y direction is formed below the semiconductor laser element 54 and the submount 52 in the heat transfer member 80, and a part of the tray 72 is inserted into the through hole 83.

Here, the heat generated from the semiconductor laser element 54 is transmitted to the heat transfer member 80 through the submount 52 and the bottom plate 50, and is transmitted to the surface 80A that forms the through hole 83. Thus, the heat transfer member 80 has the heat transfer surface 80A to which the heat generated from the semiconductor laser element 54 is transferred. A space adjacent to the surface 80A (in the through hole 83) is an endothermic space E. The heat transfer member 80 may be composed of a plurality of members as long as it has a heat transfer surface 80A through which heat generated from the semiconductor laser module 120 is transferred.

As shown in FIGS. 1 and 2, the tray 72 is movable in the Y direction by a moving mechanism 74 composed of a linear conveyor, an actuator, a motor, and the like. The moving mechanism 74 is connected to, for example, a control unit 76 having a built-in CPU. The control unit 76 controls the moving mechanism 74, so that the heat absorbing member 70 A is placed in the heat absorbing space E below the semiconductor laser element 54 and the submount 52. Any one of the heat absorbing member 70B is moved. 1 to 3 show a state in which the heat absorbing member 70A is positioned below the semiconductor laser element 54 and the submount 52, and the heat absorbing member 70B is positioned outside the heat transfer member 80.

In the state shown in FIGS. 1 to 3, when laser light is emitted from the semiconductor laser element 54, the semiconductor laser element 54 generates heat. This heat is transmitted to the heat transfer member 80 through the submount 52 and the bottom plate 50. Then, it is transmitted to the heat transfer surface 80A of the heat transfer member 80. The heat absorption member 70A in the heat absorption space E is in contact with the heat transfer surface 80A of the heat transfer member 80, and the heat generated from the semiconductor laser element 54 is absorbed by the heat absorption member 70A via the heat transfer surface 80A. At this time, grease (not shown) is applied between the upper surface of the heat absorbing member 70A and the heat transfer surface 80A of the heat transfer member 80 in order to easily transfer the heat from the semiconductor laser element 54 to the heat absorption member 70A. It is preferable.

Thus, while the laser beam is emitted from the semiconductor laser element 54, the heat generated from the semiconductor laser element 54 is arranged in the heat absorption space E via the submount 52, the bottom plate 50, and the heat transfer member 80. The absorbed heat absorbing member 70A is absorbed. After that, when the emission of the laser light from the semiconductor laser element 54 is stopped, the control unit 76 receives this and controls the moving mechanism 74 to move the tray 72 in the −Y direction. As shown, the endothermic member 70A that has absorbed the heat of the semiconductor laser element 54 is moved to the outside of the heat transfer member 80 (heat dissipation space R), and the new endothermic member 70B is moved to the lower end of the semiconductor laser element 54 and the submount 52. Move to space E.

Thereafter, when laser light is emitted again from the semiconductor laser element 54, the heat generated from the semiconductor laser element 54 comes into contact with the heat transfer surface 80A via the heat transfer surface 80A of the submount 52 and the heat transfer member 80. Is absorbed by the heat absorbing member 70B. At this time, the heat absorbing member 70A that has absorbed the heat of the semiconductor laser element 54 in the previous step is radiated and cooled outside the heat transfer member 80 (heat radiation space R). In addition, as a cooling method of the heat absorption member 70A moved to the outside of the heat transfer member 80, in addition to natural cooling, air cooling using a fan or the like, or water or ice is brought into contact with the surface of the heat absorption member 70A. Cooling by things can be considered.

When the emission of the laser light from the semiconductor laser element 54 is stopped again, the control unit 76 receives this and controls the moving mechanism 74 to move the tray 72 in the + Y direction and absorb the heat of the semiconductor laser element 54. The heat absorbing member 70B is moved to the outside (heat radiation space R) of the heat transfer member 80, and the cooled heat absorption member 70A is moved to the heat absorption space E below the semiconductor laser element 54 and the submount 52 (FIG. 2 and FIG. 2). 3).

Thereafter, when laser light is emitted again from the semiconductor laser element 54, the heat generated from the semiconductor laser element 54 comes into contact with the heat transfer surface 80A via the heat transfer surface 80A of the submount 52 and the heat transfer member 80. The heat absorbing member 70 A is absorbed by the heat absorbing member 70 A, and the heat absorbing member 70 B is radiated and cooled outside the heat transfer member 80 (heat radiation space R).

Thus, in this embodiment, the heat generated from the semiconductor laser module 120 as the laser device can be absorbed by the heat absorbing member 70A or the heat absorbing member 70B disposed inside the heat transfer member 80 (the heat absorbing space E). At the same time, the heated endothermic member 70B or endothermic member 70A can be dissipated outside the heat transfer member 80 (heat dissipating space R). Therefore, heat generated from the semiconductor laser element 54 can be released with a simple configuration without requiring a heat sink, a tank, a heat exchanger or the like in which a flow path is formed, and the cost of the entire laser system 101 is reduced. be able to. Moreover, since it is not what cools using a fluid and a flow path, it is not necessary to maintain frequently.

Here, in order to efficiently transfer heat from the semiconductor laser element 54 to the

heat absorbing members

70A and 70B, the area of the semiconductor laser element 54 when the semiconductor laser element 54 is viewed in plan is the same as that when the submount 52 is viewed in plan. The area of the submount 52 when the submount 52 is viewed in plan is less than the area of the

heat absorbing members

70A and 70B when each of the

heat absorbing members

70A and 70B is viewed in plan. Is preferred. At this time, when the semiconductor laser element 54, the submount 52, and the

heat absorbing members

70A and 70B located in the heat absorbing space E are viewed in plan view, the submount 52 is included inside the

heat absorbing members

70A and 70B. A semiconductor laser element 54 is preferably included inside. Alternatively, the heat absorbing members 70 A and 70 B may coincide with the submount 52, or the submount 52 may coincide with the semiconductor laser element 54. By maintaining such a relationship, the heat generated in the semiconductor laser element 54 is more reliably transmitted to the

heat absorbing members

70A and 70B.

In the above-described embodiment, the example in which the two

heat absorbing members

70A and 70B are provided has been described. However, three or more heat absorbing members may be used, or only one heat absorbing member may be used. In the above-described embodiment, the example in which the

heat absorbing members

70A and 70B are moved in the horizontal direction (Y direction) has been described. However, the

heat absorbing members

70A and 70B are endothermic by moving in the vertical direction (Z direction) or other directions. You may move to space and heat dissipation space. Further, the

endothermic members

70A and 70B may be moved by combining the movement in the horizontal direction (Y direction) and the movement in the vertical direction (Z direction). Further, in the above-described embodiment, the example in which the

endothermic members

70A and 70B are moved in parallel has been described. However, even if the

endothermic members

70A and 70B are rotated about a certain axis to move them to the endothermic space and the heat dissipation space. Good. Moreover, you may comprise so that the

heat absorption members

70A and 70B may be pressed and contacted to the heat-transfer surface 80A.

Here, as shown in FIG. 6, when the laser light is emitted at an arbitrary time interval T, the heat absorbing members 70 A and 70 B cannot be cooled to the environmental temperature in the heat radiation space R within the time T. In addition, it is preferable to replace the heat-absorbing

members

70A and 70B when T / 2 has elapsed after the emission of the laser light is stopped. In this way, by replacing the

heat absorbing members

70A and 70B when T / 2 has elapsed after the emission of the laser light is stopped, the heat from the semiconductor laser element 54 can be evenly distributed to the

heat absorbing members

70A and 70B. Improves.

When n heat absorbing members (n is an integer of 2 or more) are provided, heat is absorbed before the time T elapses after the emission of the laser beam is stopped, that is, until the next laser beam is emitted. It is preferable that the endothermic member thus moved is moved from the endothermic space E to the heat dissipating space R, and another endothermic member is moved to the endothermic space E so as to be in contact with the heat transfer surface 80A. In this case, it is preferable to move the n heat absorbing members sequentially to the heat absorbing space and the heat radiating space. In this way, heat from the semiconductor laser element 54 can be distributed to the n heat absorbing members, and heat dissipation is improved. Furthermore, it is preferable to move the first endothermic member out of the n endothermic members from the endothermic space E to the heat dissipating space R before the time T / n elapses after the emission of the laser light is stopped. Since the amount of heat transferred to the heat absorbing member depends on the temperature difference, the amount of heat transferred to the first heat absorbing member among the n heat absorbing members is the largest. Therefore, the heat from the semiconductor laser element 54 is more efficiently transferred to the n heat absorbing members by moving the first heat absorbing member to the heat radiating space R before the time T / n elapses after the emission of the laser light is stopped. It becomes possible to distribute to the heat and heat dissipation is improved.

In the embodiment described above, the

heat absorbing members

70A and 70B are moved using the moving mechanism 74 and the moving mechanism 74 is controlled using the control unit 76, but the moving mechanism 74 and the control unit 76 are not necessarily provided. For example, as shown in FIG. 7, an insertion hole 183 located below the semiconductor laser element 54 and the submount 52 is formed in the heat transfer member 80, and the heat absorption member 170 (see FIG. 8) provided with the handle 171 is attached to the heat absorption member 170. The insertion hole 183 may be pushed by hand. Also in this case, the heat absorption member 170 pushed into the heat absorption space E inside the insertion hole 183 of the heat transfer member 80 is in contact with the heat transfer surface 80A of the heat transfer member 80, and heat from the semiconductor laser element 54 is obtained. Is absorbed by the heat absorbing member 170. After the emission of the laser light from the semiconductor laser element 54 is stopped, the handle 171 of the heat absorbing member 170 is grasped by hand, the heat absorbing member 170 is taken out from the insertion hole 183 of the heat transfer member 80, and the heat transfer member 80 is exposed to the outside (heat radiation). The heat absorbing member 170 can be cooled in the space. At this time, the heat absorbing member 170 can be cooled by being immersed in, for example, water or seawater.

In the above-described embodiment, the example in which the cooling structure according to the present invention is applied to the semiconductor laser module 120 has been described. However, the cooling structure according to the present invention is not limited to the semiconductor laser module, and an arbitrary laser beam that emits laser light. It can be applied to a laser device. For example, the cooling structure according to the present invention can be applied to a fiber laser device. Hereinafter, an example in which the cooling structure according to the invention is applied to a fiber laser device will be described.

9 is a cross-sectional view schematically showing a configuration of a laser system 201 in the second embodiment of the present invention, FIG. 10 is a cross-sectional view taken along the line CC ′ of FIG. 9, and FIG. 11 is a plan view of FIG. It is. As shown in FIGS. 9 to 11, the laser system 201 in the present embodiment includes a fiber laser device 1 described below as a laser device that emits laser light.

FIG. 12 is a diagram schematically showing the fiber laser device 1. As shown in FIG. 12, the fiber laser device 1 according to the present embodiment includes an amplification optical fiber 10 to which a rare earth element such as Yb (ytterbium) is added, and the first end portion 10 A side of the amplification optical fiber 10. A high-reflection fiber Bragg grating (FBG) 12 connected to the optical fiber 10, a low-reflection FBG 14 connected to the second end portion 10 B side of the amplification optical fiber 10, and the first of the amplification optical fiber 10. A plurality of pumping light source units 20A for introducing pumping light into the amplifying optical fiber 10 from the end 10A, a combiner 22A for combining pumping light from the plurality of pumping light source units 20A, and a second of the amplifying optical fiber 10. From a plurality of pumping light source units 20B for introducing pumping light into the amplification optical fiber 10 from the end 10B of the optical fiber, and from the pumping light source units 20B Combiner 22B for multiplexing Okoshiko, and a laser emitting unit 30 for emitting toward the output laser beam from the amplification optical fiber 10 (the laser oscillation light), for example, the workpiece.

As the excitation

light source units

20A and 20B, for example, a high-power multimode semiconductor laser (LD) having a wavelength of 915 nm can be used, and the semiconductor laser module in the first embodiment described above as such excitation light source units 20A and 20B. 120 can also be used. Excitation light from the excitation light source unit 20A is combined by the combiner 22A and introduced into the amplification optical fiber 10 from the highly reflective FBG 12 side. Similarly, the excitation light from the excitation light source unit 20B is combined by the combiner 22B and introduced into the amplification optical fiber 10 from the low reflection FBG 14 side. The amplification optical fiber 10 preferably has a double clad structure having an inner clad and an outer clad lower than the refractive index of the inner clad. A single clad optical fiber (delivery fiber) 32 extending to the laser emitting section 30 is connected to the combiner 22B.

Here, the high reflection FBG 12 and the low reflection FBG 14 are configured to reflect light having a wavelength corresponding to the wavelength of the laser light, and are arranged so as to satisfy a predetermined resonance condition. The high-reflection FBG 12 and the low-reflection FBG 14 constitute an optical resonator 16 that oscillates the laser light generated in the amplification optical fiber 10. The reflectance of the high reflection FBG 12 is preferably 90% to 100%, and the reflectance of the low reflection FBG 14 is preferably 30% or less.

In such a configuration, when excitation light having a wavelength of, for example, 915 nm is introduced from the excitation

light source units

20A and 20B into the amplification optical fiber 10, Yb of the amplification optical fiber 10 is excited and spontaneous emission light (ASE light) is emitted. Is done. This ASE light is laser-oscillated at a wavelength (1000 nm band wavelength) reflected and amplified by the high reflection FBG 12 and the low reflection FBG 14 arranged so as to satisfy a predetermined resonance condition. A part of the laser light generated in the optical resonator 16 is reflected by the low reflection FBG 14 and returns to the amplification optical fiber 10, but passes through the low reflection FBG 14 and passes through the optical fiber 32 from the laser emitting unit 30. Irradiated as output laser light. For example, this output laser beam is used for processing a workpiece.

Returning to FIG. 9 to FIG. 11, the laser system 201 in the present embodiment is a flat plate shape in which the heat transfer member 280 on which the fiber laser device 1 is placed and the two heat absorbing members 270 A and 270 B are placed on the upper surface. A tray 272. For example, the

heat absorbing members

270A and 270B are members made of metal or ceramic. A through hole 283 extending in the Y direction is formed in the heat transfer member 280 below the fiber laser device 1, and a part of the tray 272 is inserted into the through hole 283.

Here, the heat generated in the fiber laser device 1 is transmitted to the heat transfer member 280 to be transmitted to the surface 280A forming the through hole 283. Thus, the heat transfer member 280 has the heat transfer surface 280A to which the heat generated in the fiber laser device 1 is transferred. A space adjacent to the surface 280A (in the through hole 283) is a heat absorption space E. The heat transfer member 280 may be composed of a plurality of members as long as it has a heat transfer surface 280A through which heat generated from the fiber laser device 1 is transferred.

The tray 272 can be moved in the Y direction by the moving mechanism 274 similarly to the tray 72 of the first embodiment. The moving mechanism 274 is connected to, for example, a control unit 276 having a built-in CPU, and the control unit 276 controls the moving mechanism 274 to move either the heat absorbing member 270A or the heat absorbing member 270B to the heat absorbing space E. It is like that.

The heat generated in the fiber laser device 1 is transmitted to the heat transfer member 280 and is transmitted to the heat transfer surface 280A of the heat transfer member 280. The heat absorption member 270A in the heat absorption space E is in contact with the heat transfer surface 280A of the heat transfer member 280, and the heat generated in the fiber laser device 1 is absorbed by the heat absorption member 270A via the heat transfer surface 280A. At this time, grease (not shown) is applied between the upper surface of the heat absorbing member 270A and the heat transfer surface 280A of the heat transfer member 280 in order to easily transfer the heat generated in the fiber laser device 1 to the heat absorption member 270A. It is preferable to do.

In this way, the heat generated in the fiber laser device 1 is absorbed by the heat absorbing member 270A disposed in the heat absorbing space E via the heat transfer member 280. Thereafter, when the operation of the fiber laser device 1 is stopped, the control unit 276 receives this and controls the moving mechanism 274 to move the tray 272 in the −Y direction and absorb the heat of the fiber laser device 1. The member 270A is moved to the outside of the heat transfer member 280 (heat radiation space R), and the new heat absorption member 270B is moved to the heat absorption space E below the fiber laser device 1.

Thereafter, when the fiber laser device 1 is driven, the heat generated in the fiber laser device 1 is absorbed by the heat absorbing member 270B in contact with the heat transfer surface 280A via the heat transfer surface 280A of the heat transfer member 280. At this time, the heat absorbing member 270A that has absorbed the heat of the fiber laser device 1 in the previous step is radiated and cooled outside the heat transfer member 280 (heat radiation space R).

When the operation of the fiber laser device 1 is stopped again, the control unit 276 controls the movement mechanism 274 in response to this, and moves the tray 272 in the + Y direction to absorb the heat of the fiber laser device 1. Is moved to the outside (heat radiation space R) of the heat transfer member 280, and the cooled heat absorption member 270A is moved to the heat absorption space E below the fiber laser device 1.

Thereafter, when the fiber laser device 1 is driven again, the heat generated in the fiber laser device 1 is absorbed by the heat absorbing member 270A in contact with the heat transfer surface 280A via the heat transfer surface 280A of the heat transfer member 280. At the same time, the heat absorbing member 270B is radiated and cooled outside the heat transfer member 280 (heat radiation space R).

Thus, the cooling structure according to the present invention can also be applied to the fiber laser device 1. By applying the cooling structure according to the present invention to the fiber laser device 1, the fiber laser device 1 can be cooled with a simple configuration without requiring a heat sink, a tank, a heat exchanger or the like in which a flow path is formed. The cost of the entire laser system 201 can be reduced.

Further, the laser system may be configured by mounting the excitation light source unit 20A, the excitation light source unit 20B, and the amplification optical fiber 10 of the second embodiment on the heat transfer member 80 of the first embodiment. Or you may comprise so that several excitation

light source unit

20A, 20B may be mounted on the heat-transfer member 80 of 1st Embodiment, and several excitation

light source unit

20A, 20B may be cooled simultaneously. For example, as in a laser system 301 shown in FIG. 13, a laser device 1 including a plurality of excitation light source units 20 A (20 B) is arranged on a heat transfer member 80, and a heat absorption member 70 A (or 70 B) located in the heat absorption space E. May be configured to straddle these excitation light source units 20A (20B).

Although the preferred embodiments of the present invention have been described so far, it is needless to say that the present invention is not limited to the above-described embodiments, and may be implemented in various forms within the scope of the technical idea.

The present invention is suitably used for a laser apparatus that emits laser light in a laser system.

DESCRIPTION OF SYMBOLS 1 Fiber laser apparatus 10 Optical fiber for amplification 12 High reflection FBG
14 Low reflection FBG
16

Optical resonators

20A and 20B Excitation

light source units

22A and 20B Combiner 30 Laser emission part 32 Optical fiber 40 Frame body 41 to 44 Side wall 50 Bottom plate 51 Lid body 52 Submount 54 Semiconductor laser element 56 Fiber mount 58 Solder 60

Optical fiber

70A, 70B Heat absorbing member 72 Tray 74 Moving mechanism 76 Control unit 80 Heat transfer member 80A Heat transfer surface 83 Through hole 101 Laser system 183 Insertion hole 170 Heat absorption member 171 Handle 201 Laser system 280 Heat transfer member 280A Heat transfer surface 283 Through hole 301 Laser system E Heat absorption space R Heat dissipation space

Claims

A laser device for emitting laser light;
A heat transfer member on which the laser device is mounted, the heat transfer member having a heat transfer surface to which heat generated from the laser device is transmitted; and
The heat transfer member can be disposed in a heat absorption space formed adjacent to the heat transfer surface in contact with the heat transfer surface, and for releasing the heat absorbed in the heat absorption space from the heat absorption space. At least one heat absorbing member configured to be movable to the heat dissipation space;
With a laser system.
The laser system according to claim 1, further comprising a moving mechanism for moving the at least one heat absorbing member from the heat absorbing space to the heat radiating space.
The at least one heat absorbing member includes a plurality of heat absorbing members;
The moving mechanism moves a heat absorbing member located in the heat absorbing space among the plurality of heat absorbing members to the heat radiating space, and moves another heat absorbing member of the plurality of heat absorbing members to the heat absorbing space. ,
The laser system according to claim 2.
The laser device includes a laser element that generates the laser light,
The area of the laser element when the laser element is viewed in plan is equal to or less than the area of the at least one heat absorption member when the at least one heat absorbing member is viewed in plan,
When the laser element and the at least one endothermic member located in the endothermic space are viewed in plan, the at least one endothermic member and the laser element coincide with each other, or the endothermic member includes the laser element. The
The laser system according to any one of claims 1 to 3.
5. The laser system according to claim 4, wherein an area of the laser element when the laser element is viewed in plan is smaller than an area of the at least one endothermic member when the at least one endothermic member is viewed in plan.
A method of cooling a laser device placed on a heat transfer member,
At least one heat absorbing member in which heat from the laser device is disposed in a heat absorbing space formed adjacent to the heat transfer surface via a heat transfer surface of the heat transfer member to which heat generated from the laser device is transmitted. To absorb,
After stopping the emission of the laser light from the laser device, the at least one heat absorbing member is moved from the heat absorbing space to the heat radiating space,
Releasing the heat absorbed by the at least one heat absorbing member in the heat dissipation space;
Laser device cooling method.
In the case of emitting the laser light again when an arbitrary time T has elapsed after stopping the emission of the laser light from the laser device,
N (n is an integer of 2 or more) endothermic members are prepared as the at least one endothermic member,
Before the time T elapses after the emission of the laser light from the laser device is stopped, the heat absorbing member that has absorbed the heat is moved from the heat absorbing space to the heat radiating space, and another heat absorbing member is mounted. Move to the endothermic space to contact the heat transfer surface;
The method for cooling a laser device according to claim 6.
The laser device cooling method according to claim 7, wherein the n heat absorbing members are sequentially moved to the heat absorbing space or the heat radiating space.
The first heat-absorbing member among the n heat-absorbing members is moved from the heat-absorbing space to the heat-dissipating space before the time T / n elapses after the emission of the laser light from the laser device is stopped. Item 9. A method for cooling a laser device according to Item 8.