WO2017010449A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2017010449A1
WO2017010449A1 PCT/JP2016/070399 JP2016070399W WO2017010449A1 WO 2017010449 A1 WO2017010449 A1 WO 2017010449A1 JP 2016070399 W JP2016070399 W JP 2016070399W WO 2017010449 A1 WO2017010449 A1 WO 2017010449A1
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WO
WIPO (PCT)
Prior art keywords
substrate
antenna
inlet
covering member
main antenna
Prior art date
Application number
PCT/JP2016/070399
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English (en)
Japanese (ja)
Inventor
義博 水沼
加賀谷　仁
大石　教博
Original Assignee
トッパン・フォームズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by トッパン・フォームズ株式会社 filed Critical トッパン・フォームズ株式会社
Publication of WO2017010449A1 publication Critical patent/WO2017010449A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Definitions

  • the present invention relates to an electronic device.
  • This application claims priority based on Japanese Patent Application No. 2015-139720 filed in Japan on July 13, 2015, the contents of which are incorporated herein by reference.
  • An electronic device such as a non-contact type data receiving / transmitting body that can receive information from the outside using electromagnetic waves or radio waves as a medium, and can transmit information to the outside, such as an information recording medium for RFID (Radio Frequency IDentification) applications
  • an IC tag may be mentioned.
  • the IC tag includes, for example, an inlet including a base material, an antenna provided on one surface thereof, and an antenna and an IC chip connected to each other.
  • an IC tag receives an electromagnetic wave or radio wave from an information writing / reading device, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and the information in the IC chip is stored. It is converted into a signal and this signal is transmitted from the antenna of the IC tag.
  • the inlet a glass epoxy resin substrate and an antenna and an IC chip which are provided on one surface and connected to each other are generally used.
  • this inlet is covered with a covering member, for example, the resin is applied to the first covering member so that the inlet is accommodated in the first covering member made of resin having a recess for accommodating the IC chip, and the inlet is covered.
  • the 2nd coating member made from is arrange
  • the air is entrained in the internal space formed by the first covering member and the second covering member. If air is present in the internal space, for example, the air may be expanded by heat generated when the two covering members are joined or heat applied from the outside, and pressure may be applied to the inlet by the air. The same phenomenon appears when the sealed inlet is used in a high temperature environment. Then, the glass epoxy resin substrate was warped, and the antenna was cracked and disconnected. If the antenna is disconnected, the inlet is unable to communicate.
  • the present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic device that can maintain communication performance without disconnection of an antenna even when used in a high-temperature environment. .
  • An electronic device includes an electronic substrate having a substrate made of an insulating inorganic material, a main antenna formed on the substrate, and an electronic element connected to the main antenna; A booster sub-antenna that resonates upon contact; and a covering member that covers the electronic substrate and the sub-antenna, wherein the substrate has an area of 600 mm 2 or less and a ratio of a major axis to a minor axis length (minor axis) / Long axis) is 1 ⁇ 4 or more.
  • the thickness of the substrate is preferably 1 mm or more.
  • the substrate is preferably made of ceramics or zirconia.
  • FIG. 1 is a schematic plan view showing a non-contact type data transmitting / receiving body that is a first embodiment of an electronic apparatus of the present invention.
  • 1 is a schematic cross-sectional view taken along the line AA of FIG. 1A, showing a non-contact type data receiving / transmitting body as a first embodiment of the electronic apparatus of the present invention.
  • 1 is a schematic cross-sectional view taken along line BB of FIG. 1A, showing a non-contact type data receiving / transmitting body as a first embodiment of an electronic apparatus of the present invention.
  • FIG. 1A is a schematic plan view showing a non-contact type data receiving / transmitting body 10 which is a first embodiment of an electronic apparatus of the present invention.
  • FIG. 1B is a schematic cross-sectional view taken along line AA of FIG. 1A, showing a non-contact type data receiving / transmitting body which is a first embodiment of the electronic apparatus of the present invention.
  • FIG. 1C is a schematic cross-sectional view taken along line BB of FIG. 1A, showing a non-contact type data receiving / transmitting body as a first embodiment of the electronic apparatus of the present invention.
  • FIG. 1A is a schematic plan view showing a non-contact type data receiving / transmitting body 10 which is a first embodiment of an electronic apparatus of the present invention.
  • FIG. 1B is a schematic cross-sectional view taken along line AA of FIG. 1A, showing a non-contact type data receiving / transmitting body which is a first embodiment of the electronic apparatus of the present invention.
  • FIG. 1C is
  • the length direction of the substrate 15 is referred to as the X direction, and the direction orthogonal to the X direction in the plane along the first surface 15a of the substrate 15 (and the first surface 13a of the sub-antenna 13) is the Y direction (width). Direction).
  • the non-contact type data receiving / transmitting body 10 of the present embodiment is disposed in contact with the inlet (electronic board) 12 having the main antenna 11 and the main antenna 11.
  • the booster sub-antenna 13 and the covering member 14 that covers the inlet 12 and the sub-antenna 13 are schematically configured. Note that the covering member 14 covering the inlet 12 and the sub-antenna 13 means that the outer periphery of the inlet 12 and the sub-antenna 13 is covered with the covering member 14.
  • the inlet 12 includes a substrate 15, a main antenna 11 formed on the first surface 15 a of the substrate 15, and an IC chip (electronic element) 16 connected to the main antenna 11 on the first surface 15 a of the substrate 15.
  • IC chip electronic element
  • the area of the first surface 15a is a 600 mm 2 or less, preferably 444mm 2 or less, more preferably 250 mm 2 or less, and more preferably 127.5Mm 2 or less.
  • the area of the surface 15b opposite to the first surface 15a of the substrate 15 (hereinafter referred to as “second surface”) 15b is equal to the area of the first surface 15a. If the area of the first surface 15a of the substrate 15 is 600 mm 2 or less, even if the coating member 14 is bent and deformed in the thickness direction by heat when the non-contact type data receiving / transmitting body 10 is used in a high temperature environment. Since the substrate 15 (inlet 12) is difficult to bend and deform, the substrate 15 and the main antenna 11 are not cracked.
  • the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, even if a force in the thickness direction is applied to the substrate 15 by the pressure of the material resin, the bending deformation of the substrate 15 is suppressed. The Accordingly, the substrate 15 and the main antenna 11 are not cracked. Moreover, even if stress occurs when the covering member 14 contracts after the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, the substrate 15 (inlet 12) is hardly distorted. Accordingly, the substrate 15 and the main antenna 11 are not cracked.
  • the shape of the substrate 15 in plan view that is, the shape of the first surface 15a of the substrate 15 is not particularly limited as long as the main antenna 11 and the IC chip 16 can be provided on the first surface 15a.
  • a rectangle, a circle, an ellipse, etc. are mentioned.
  • the shape of the substrate 15 in plan view is a square.
  • the ratio of the length of the major axis to the minor axis of the first surface 15a of the substrate 15 is 1 ⁇ 4 or more, and is preferably 1/1.
  • the major axis of the first surface 15a is one side of the square, and the minor axis of the first surface 15a is adjacent to one side of the square and is orthogonal to the one side. It is the other side.
  • the length of the major axis is equal to the length of the minor axis, and the ratio of the major axis to the minor axis (short axis / major axis) is 1/1.
  • the shape of the substrate 15 is a rectangle
  • the long axis of the first surface 15a is the long side of the rectangle, and the short axis of the first surface 15a is adjacent to the long side of the rectangle and the long side thereof It is the short side orthogonal to.
  • the ratio of the length of the long axis (long side) to the short axis (short side) (short axis / long axis) is 1 ⁇ 4 or more.
  • the major axis of the first surface 15a is a diameter (first diameter)
  • the minor axis of the first surface 15a is a diameter orthogonal to the first diameter. (Second diameter).
  • the length of the major axis is equal to the length of the minor axis
  • the ratio of the major axis to the minor axis (short axis / major axis) is 1/1.
  • the major axis of the first surface 15a is the major axis of the ellipse
  • the minor axis of the first surface 15a is orthogonal to the major axis of the ellipse. It is the minor axis of the ellipse.
  • the ratio of the length of the long axis (long side) to the short axis (short side) (short axis / long axis) is 1 ⁇ 4 or more.
  • the non-contact type data transmitting / receiving body 10 is used in a high temperature environment.
  • the covering member 14 is bent and deformed in the thickness direction by heat, the substrate 15 (inlet 12) is not easily bent and deformed, so that the substrate 15 and the main antenna 11 are not cracked.
  • the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, even if a force in the thickness direction is applied to the substrate 15 by the pressure of the material resin, the bending deformation of the substrate 15 is suppressed.
  • the substrate 15 and the main antenna 11 are not cracked. Moreover, even if stress occurs when the covering member 14 contracts after the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, the substrate 15 (inlet 12) is hardly distorted. Accordingly, the substrate 15 and the main antenna 11 are not cracked.
  • the thickness of the substrate 15 is preferably 1 mm or more and 20 mm or less, more preferably 1 mm or more and 10 mm or less, and further preferably 2 mm or more and 5 mm or less. If the thickness of the substrate 15 is 1 mm or more, even if the coating member 14 is bent and deformed in the thickness direction by heat when the non-contact type data receiving / transmitting body 10 is used in a high temperature environment, the substrate 15 (inlet 12 ) Is difficult to bend and deform. For this reason, the substrate 15 and the main antenna 11 are not cracked.
  • the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, even if a force in the thickness direction is applied to the substrate 15 by the pressure of the material resin, the bending deformation of the substrate 15 is suppressed. The Accordingly, the substrate 15 and the main antenna 11 are not cracked. Moreover, even if stress occurs when the covering member 14 contracts after the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, the substrate 15 (inlet 12) is hardly distorted. Accordingly, the substrate 15 and the main antenna 11 are not cracked.
  • a substrate made of an insulating inorganic material is used.
  • a substrate made of an insulating inorganic material since it has excellent heat resistance and a low thermal expansion coefficient, a substrate made of ceramics (hereinafter referred to as “ceramic substrate”) or a substrate made of zirconia (hereinafter referred to as “zirconia”).
  • Ceramic substrate a substrate made of ceramics
  • zirconia a substrate made of zirconia
  • Substrate is preferred.
  • the substrate 15 and the main antenna 11 are not cracked. Further, when the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, even if a force in the thickness direction is applied to the substrate 15 by the pressure of the material resin, the bending deformation of the substrate 15 is suppressed. The Accordingly, the substrate 15 and the main antenna 11 are not cracked. Moreover, even if stress occurs when the covering member 14 contracts after the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, the substrate 15 (inlet 12) is hardly distorted. Accordingly, the substrate 15 and the main antenna 11 are not cracked.
  • the flexural modulus of the substrate 15 is preferably 74 GPa to 470 GPa.
  • the flexural modulus of the substrate 15 is preferably 74 GPa to 470 GPa.
  • the flexural modulus of the substrate 15 may be approximately equal to the Young's modulus. In that case, the value of Young's modulus can be regarded as the bending elastic modulus.
  • the IC chip 16 is not particularly limited, and information can be written and read out in a non-contact state via the main antenna 11.
  • a non-contact IC tag, a non-contact IC label, or a non-contact IC Anything applicable to RFID media such as a card can be used.
  • the IC chip 16 can be connected and fixed to the main antenna 11 formed on the first surface 15a of the substrate 15 via solder or the like.
  • the IC chip 16 connected to the main antenna 11 is sealed with a ceramic paste (not shown).
  • a ceramic paste By sealing the IC chip 16 with a ceramic paste, it is possible to prevent the IC chip 16 from deteriorating when the non-contact type data receiving / transmitting body 10 is used in a high temperature environment.
  • the main antenna 11 is a loop antenna formed along the outer edge of the substrate 15.
  • the shape when the substrate 15 is viewed in plan is a square
  • the shape when the main antenna 11 is viewed in plan is a square.
  • the shape of the main antenna 11 in plan view is a rectangle.
  • the shape of the main antenna 11 when viewed in plan is circular.
  • the shape of the main antenna 11 when viewed in plan is an ellipse.
  • the main antenna 11 has a feeding point (not shown), and an IC chip 16 is connected to the feeding point via solder or the like.
  • the main antenna 11 is made of a conductive material.
  • the sub-antenna 13 is provided in the vicinity of the main antenna 11 of the inlet 12 and along at least a part of the outer edge of the main antenna 11. Note that the sub-antenna 13 is provided along the outer edge of the main antenna 11 that both are arranged at a position where electrical connection (electromagnetic coupling) is possible between the main antenna 11 and the sub-antenna 13. Say that it is.
  • the sub-antenna 13 is provided along three sides of the loop-shaped main antenna 11 having a square shape in plan view, and the portion along the main antenna 11 has a U-shape in plan view.
  • the sub-antenna 13 includes a portion (a portion where the inlet 12 is disposed, a central portion) 13A formed along the outside of the inlet 12 (the main antenna 11), and the X direction of the substrate 15 from the central portion 13A. It is an antenna composed of linear or belt-shaped radiating elements 13B and 13B extending to both ends.
  • the central portion 13A of the sub-antenna 13 has a U-shaped plate-like or belt-like conductor in plan view. It is preferable that the central portion 13A of the sub-antenna 13 is formed in substantially the same shape as the inlet 12 (main antenna 11) arranged on the inner side.
  • the inlet 12 (main antenna 11) and the central portion 13A are provided in a non-contact manner, the central portion 13A is formed so that the gap between the two is as small as possible, and the gap between the two is It is preferable to arrange the inlet 12 (main antenna 11) in the central portion 13A so as to be as small as possible. Further, the distance between the main antenna 11 and the sub antenna 13 is not particularly limited as long as electrical connection (electromagnetic field coupling) is possible between them.
  • the main antenna 11 only needs to be arranged so that at least one side thereof is non-contact and substantially parallel to at least one side of the sub-antenna 13, and the sub-antenna 13 has substantially the same shape as the inlet 12 (main antenna 11). However, the same central portion 13A may not be formed.
  • the sub-antenna 13 is electrically connected to the main antenna 11 by electromagnetic coupling, so that the communication distance is longer than when non-contact communication is performed using only the main antenna 11 (long-distance communication is possible). belongs to.
  • the sub-antenna 13 has a length corresponding to a half wavelength of a frequency (300 MHz to 30 GHz) of an ultra-high frequency band ⁇ UHF> or a microwave band that can be used for a non-contact IC module such as a non-contact IC card. Yes. That is, when the radiating elements 13B and 13B are divided into two regions having the IC chip 16 as the center, the length in the longitudinal direction is a length corresponding to a quarter wavelength.
  • the sub-antenna 13 is a member made of a material having a small thermal expansion coefficient and having an outer shape that is plate-shaped or band-shaped.
  • Examples of the material having a small coefficient of thermal expansion include stainless steel and ordinary steel (SPCC) which is an extremely low carbon steel material defined in JIS G3141 “Cold rolled steel sheet and steel strip”.
  • the covering member 14 is made of a thermoplastic resin.
  • a thermoplastic resin is a resin that is fluidized by heating above the glass transition temperature or melting point and solidified by cooling.
  • the thermoplastic resin include engineering plastic (engineering plastic) and super engineering plastic (super engineering plastic).
  • engineering plastics include nylon, polycarbonate (PC), and polyethylene terephthalate (PET).
  • super engineering plastics include polyphenylene sulfide (PPS), polyether sulfone (PES), and polyether ether ketone (PEEK).
  • the thermoplastic resin constituting the covering member 14 is preferably an engineering plastic or super engineering plastic having high heat resistance.
  • the thickness of the covering member 14, that is, the thickness of the substrate 15 in the normal direction is not particularly limited, and is appropriately adjusted according to the intended heat resistance and communication characteristics.
  • the covering member 14 seals the first covering member having an accommodating recess for accommodating (fitting) the inlet 12 and the sub antenna 13 and the second covering member accommodating the inlet 12 and the sub antenna 13. You may be comprised from the coating
  • the inlet 12 and the sub-antenna 13 are disposed (fitted) in the housing recess of the first covering member obtained in advance by injection molding or the like.
  • the IC chip 16 is disposed on the bottom surface side of the housing recess of the first covering member.
  • the first covering member that accommodates the inlet 12 and the sub-antenna 13 is disposed in the mold, and the first surface that accommodates the inlet 12 and the sub-antenna 13 is formed on the second surface 15b side of the substrate 15 by injection molding.
  • a second covering member for sealing the covering member is formed.
  • the first covering member and the second covering member are integrated into the covering member 14, and the non-contact type data receiving / transmitting body 10 is obtained.
  • the covering member 14 By forming the covering member 14 by injection molding, the covering member 14 can be formed without any gap with respect to the inlet 12 and the sub-antenna 13. Therefore, air is not caught between the inlet 12 and the sub-antenna 13 and the covering member 14.
  • the method for forming the covering member 14 is not limited to the above method, and the covering member 14 may be formed so as to cover the inlet 12 and the sub-antenna 13 disposed in the mold by one injection molding. .
  • the substrate 15 made of an insulating inorganic material has an area of the first surface 15a of 600 mm 2 or less, and the lengths of the major axis and minor axis of the first surface 15a. Ratio (minor axis / major axis) is 1 ⁇ 4 or more. Therefore, when the non-contact type data receiving / transmitting body 10 is used in a high temperature environment, even if the covering member 14 is bent and deformed in the thickness direction by heat, the substrate 15 (inlet 12) is not easily bent and deformed. 15 and the main antenna 11 are not cracked.
  • the inlet 12 and the sub-antenna 13 are covered with the covering member 14 by injection molding or the like, even if a force in the thickness direction is applied to the substrate 15 by the pressure of the material resin, the bending deformation of the substrate 15 is suppressed. The Accordingly, the substrate 15 and the main antenna 11 are not cracked.
  • the substrate 15 (inlet 12) is hardly distorted. Accordingly, the substrate 15 and the main antenna 11 are not cracked.
  • the non-contact type data transmitting / receiving body 10 of the present embodiment has an area of the first surface 15a of 600 mm 2 or less, and a ratio between the major axis and the minor axis length of the first surface 15a (minor axis).
  • the substrate 15 having a / long axis) of 1/4 or more there is a technical significance in that deterioration of communication performance caused by bending deformation of the substrate 15 can be prevented.
  • FIG. 2 is a schematic plan view showing a non-contact type data receiving / transmitting body 20 which is a second embodiment of the electronic apparatus of the present invention, and is a view in which a part of the covering member 14 is cut away.
  • the non-contact type data receiving / transmitting body 20 of the present embodiment is different from the non-contact type data receiving / transmitting body 10 of the first embodiment described above in that the main antenna 21 of the inlet 12 has a feeding point (IC chip 16 and This is a point formed by a dipole antenna including a pair of radiating elements 22 and 22 having a connecting portion) and a short-circuit portion 23 that short-circuits the vicinity of the feeding point of the radiating elements 22 and 22.
  • non-contact type data receiving / transmitting body 20 of the present embodiment the same effect as the non-contact type data receiving / transmitting body 10 of the first embodiment described above can be obtained.
  • FIG. 3 is a schematic plan view showing a non-contact type data receiving / transmitting body 30 which is a third embodiment of the electronic apparatus of the present invention, and is a view in which a part of the covering member 14 is cut away.
  • the non-contact type data receiving / transmitting body 30 of the present embodiment is different from the non-contact type data receiving / transmitting body 10 of the first embodiment described above in that the inlet 12 is not the central portion of the sub-antenna 13 but the substrate 15. It is the point arrange
  • non-contact type data receiving / transmitting body 30 of the present embodiment the same effect as the non-contact type data receiving / transmitting body 10 of the first embodiment described above can be obtained.
  • FIG. 4 is a schematic plan view showing a non-contact type data receiving / transmitting body 40 according to a fourth embodiment of the electronic apparatus of the present invention, and is a view in which a part of the covering member 14 is cut away.
  • the non-contact type data receiving / transmitting body 40 of the present embodiment is different from the non-contact type data receiving / transmitting body 10 of the first embodiment described above in that the sub-antenna 43 is made of a member whose outer shape is linear. is there.
  • non-contact type data receiving / transmitting body 40 of the present embodiment the same effect as the non-contact type data receiving / transmitting body 10 of the first embodiment described above can be obtained.
  • FIG. 5 is a schematic plan view showing a non-contact type data receiving / transmitting body 50 according to the fifth embodiment of the electronic apparatus of the present invention, and is a view in which a part of the covering member 14 is cut away.
  • the non-contact type data receiving / transmitting body 50 according to the present embodiment is different from the non-contact type data receiving / transmitting body 10 according to the first embodiment described above in that the inlet 52 includes a substrate 55 having an elliptical shape in plan view, and a substrate 55.
  • the main antenna 51 has an elliptical shape in plan view formed on the first surface 55 a and an IC chip (electronic element) 56 connected to the main antenna 51 on the first surface 55 a of the substrate 55.
  • the central portion 53A of the sub-antenna 53 is that a plate-like or strip-like conductor has a semi-elliptical shape in plan view.
  • non-contact type data receiving / transmitting body 50 of the present embodiment the same effect as the non-contact type data receiving / transmitting body 10 of the first embodiment described above can be obtained.
  • main antennas 11 and 21 are formed on the first surface 15a (first surface 55a) of the substrate 15 (substrate 55) has been described.
  • it may be formed on the second surface (for example, the second surface 15b) of the substrate, or may be formed on the side surfaces (four surfaces intersecting the first surface and the second surface) of the substrate.
  • the IC chip 16 IC chip 56
  • IC chip 56 is provided on the first surface 15a (first surface 55a) of the substrate 15 (substrate 55) has been described. It may be provided on two surfaces or may be formed on the side surface of the substrate.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

La présente invention concerne un dispositif électronique (10) qui comporte : un substrat électronique (12) pourvu d'un substrat (15) comprenant un matériau inorganique isolant, une antenne principale (11) formée sur une première surface (15a) du substrat (15), et un élément électronique (16) connecté à l'antenne principale (11) ; une antenne auxiliaire (13) de renfort qui résonne avec l'antenne principale (11) de manière sans contact ; et un organe de revêtement (14) qui recouvre le substrat électronique (12) et l'antenne auxiliaire (13). Dans le substrat (15), l'aire de surface de la première surface (15a) est inférieure ou égale à 600 mm2, et le rapport (axe court/axe long) de l'axe court sur l'axe long de la première surface (15a) est supérieur ou égal à 1/4.
PCT/JP2016/070399 2015-07-13 2016-07-11 Dispositif électronique WO2017010449A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015139720A JP6399313B2 (ja) 2015-07-13 2015-07-13 電子機器
JP2015-139720 2015-07-13

Publications (1)

Publication Number Publication Date
WO2017010449A1 true WO2017010449A1 (fr) 2017-01-19

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200161748A1 (en) * 2017-07-05 2020-05-21 CommScope Technology LLC Base station antennas having radiating elements with sheet metal-on dielectric dipole radiators and related radiating elements
JP2021056650A (ja) * 2019-09-27 2021-04-08 トッパン・フォームズ株式会社 非接触型データ受送信体

Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2008123196A (ja) * 2006-11-10 2008-05-29 Hitachi Ltd Ｒｆｉｄタグ、及びｒｆｉｄタグの実装方法
JP2008217776A (ja) * 2007-02-09 2008-09-18 Semiconductor Energy Lab Co Ltd 半導体装置
JP2009266134A (ja) * 2008-04-29 2009-11-12 Shinwa Kogyo Kk 非接触カード又はタグ用アンテナの製造方法並びに非接触カード又はタグ用アンテナ
WO2011092752A1 (fr) * 2010-01-29 2011-08-04 株式会社サトー Etiquette rfid et procédé de traitement d'étiquette rfid
JP2014194596A (ja) * 2013-03-28 2014-10-09 Toyo Seikan Kaisha Ltd Ｒｆタグ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008123196A (ja) * 2006-11-10 2008-05-29 Hitachi Ltd Ｒｆｉｄタグ、及びｒｆｉｄタグの実装方法
JP2008217776A (ja) * 2007-02-09 2008-09-18 Semiconductor Energy Lab Co Ltd 半導体装置
JP2009266134A (ja) * 2008-04-29 2009-11-12 Shinwa Kogyo Kk 非接触カード又はタグ用アンテナの製造方法並びに非接触カード又はタグ用アンテナ
WO2011092752A1 (fr) * 2010-01-29 2011-08-04 株式会社サトー Etiquette rfid et procédé de traitement d'étiquette rfid
JP2014194596A (ja) * 2013-03-28 2014-10-09 Toyo Seikan Kaisha Ltd Ｒｆタグ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200161748A1 (en) * 2017-07-05 2020-05-21 CommScope Technology LLC Base station antennas having radiating elements with sheet metal-on dielectric dipole radiators and related radiating elements
US11870134B2 (en) * 2017-07-05 2024-01-09 Commscope Technologies Llc Base station antennas having radiating elements with sheet metal-on dielectric dipole radiators and related radiating elements
JP2021056650A (ja) * 2019-09-27 2021-04-08 トッパン・フォームズ株式会社 非接触型データ受送信体
JP7360292B2 (ja) 2019-09-27 2023-10-12 Ｔｏｐｐａｎエッジ株式会社 非接触型データ受送信体

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JP2017021640A (ja) 2017-01-26

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