WO2016206595A1 - Cadre de support de module d'appareil photographique basé sur un procédé de fabrication et de moulage par injection de poudre métallique et application associée - Google Patents

Cadre de support de module d'appareil photographique basé sur un procédé de fabrication et de moulage par injection de poudre métallique et application associée Download PDF

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Publication number
WO2016206595A1
WO2016206595A1 PCT/CN2016/086852 CN2016086852W WO2016206595A1 WO 2016206595 A1 WO2016206595 A1 WO 2016206595A1 CN 2016086852 W CN2016086852 W CN 2016086852W WO 2016206595 A1 WO2016206595 A1 WO 2016206595A1
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WO
WIPO (PCT)
Prior art keywords
camera module
metal powder
bracket
holder
module holder
Prior art date
Application number
PCT/CN2016/086852
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English (en)
Chinese (zh)
Inventor
许毅
赵波杰
张扣文
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201510358084.0A external-priority patent/CN104994259A/zh
Priority claimed from CN201520449883.4U external-priority patent/CN205005139U/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Publication of WO2016206595A1 publication Critical patent/WO2016206595A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements

Definitions

  • the invention relates to an optical imaging device, in particular to a camera module bracket based on metal powder molding, a manufacturing method thereof and an application thereof.
  • portable electronic devices represented by smart phones and tablet computers are increasingly seeking to be thin and light, which requires the size of various components of portable electronic devices (especially the thickness dimensions of individual components) to be smaller and smaller, for example, as portable electronic devices.
  • the camera module of one of the standard components also has a trend of thinning and thinning.
  • the camera module of the portable electronic device can be divided into a single camera module and a multi camera module.
  • the single camera module includes components such as a lens, a bracket, a chip, and a circuit board.
  • the single camera module may further include a motor, and the single camera module includes a motor as an example, and the structure thereof Yes, the single camera module is mounted on the motor, the chip is mounted on the circuit board, the motor and the circuit board are respectively mounted on both sides of the bracket, and the lens is located in the photosensitive path of the chip. It can be understood that, in the case where the thickness of the motor is determined, the thickness of the camera module depends on the thickness of the bracket.
  • the thickness of the bracket is also made thinner.
  • the material of the prior art stent is selected from a plastic material. Due to the limitation of the mechanical properties of the plastic material, the thinner the thickness of the stent, the less the mechanical properties of the stent can meet the requirements of the camera module, as shown in The thickness of the bracket is too thin, which causes it to be easily deformed during transportation, which leads to a great reduction in the packaging yield of the camera module, and further causes a series of problems such as poor imaging quality of the camera module.
  • the single camera module generates a large amount of heat while performing photoelectric conversion
  • the bracket made of plastic material has poor thermal conductivity and heat dissipation, and cannot effectively assist heat. radiation.
  • the conventional method is to mount a heat sink on the side of the circuit board relative to the chip to derive the heat inside the camera module. The presence of the heat sink further increases the thickness of the camera module. How to radiate the heat generated by the chip during photoelectric conversion, It is also one of the problems of the present invention that needs to be studied.
  • the multi-camera module is assembled by more than one single camera module and assembled according to a specific positional relationship.
  • the key issue involved in the assembly of multi-camera modules is how to accurately limit two or more imaging modules.
  • the limits referred to here include, but are not limited to, the limitations of the packaging process and during use. Limits.
  • it is generally required to use a specific bracket.
  • the bracket of the multi-camera module provided by the prior art is made by processing a finished metal product, for example, processing a sheet metal material can be required for a camera module. support. Although such a bracket can meet the assembly requirements of the multi-camera module, it still has the following problems.
  • the molding method using the prior art bracket is difficult, especially when a bracket having a complicated shape is involved.
  • the molding method of the prior art bracket cannot be realized;
  • the size of the molding method using the prior art bracket cannot be accurately ensured, so that when a plurality of imaging modules are assembled to the bracket, the respective imaging modules are There will be large deviations between the two, which are unacceptable and tolerable for the imaging quality of the multi-camera module.
  • the difficulty and speed of the imaging method of the prior art stent is difficult to be large-scale. Promotion and application.
  • An object of the present invention is to provide a camera module bracket based on metal powder molding, and a manufacturing method and application thereof, wherein the camera module bracket is made of metal powder or a mixture of metal powder and non-metal powder, so that the The thickness of the camera module bracket can be significantly reduced to meet the trend of increasingly thinner and lighter portable electronic devices.
  • An object of the present invention is to provide a camera module bracket based on metal powder molding, a manufacturing method thereof and an application thereof, wherein the camera module bracket made of metal powder or a mixture of metal powder and non-metal powder has excellent mechanical properties
  • the mechanical properties of the bracket made of plastic material are such that the camera module bracket is less likely to be deformed when being transported and used, thereby facilitating the image quality of the camera module having the camera module bracket.
  • An object of the present invention is to provide a camera module bracket based on metal powder molding, a manufacturing method thereof and an application thereof, wherein the camera module bracket has good thermal conductivity and heat dissipation performance, thereby having the camera module bracket
  • heat generated by the sensor chip of the camera module during operation can be conducted through the camera module bracket and radiated to the external environment of the camera module, thereby The camera module does not need to be configured with an additional heat dissipation mechanism to assist heat dissipation, so that the overall thickness of the camera module is significantly reduced.
  • An object of the present invention is to provide a camera module bracket based on metal powder molding, and a manufacturing method and application thereof, wherein the camera module bracket forms a metal powder or a mixture of a metal powder and a non-metal powder by an injection molding process or a 3D printing process. be made of.
  • An object of the present invention is to provide a camera module bracket based on metal powder molding, a manufacturing method thereof and an application thereof, wherein the manufacturing method of the camera module bracket can manufacture the camera module bracket having a complicated structure, and The accuracy of the camera module bracket manufactured by the manufacturing method can be effectively ensured, so that the camera module bracket can better meet the development needs and use requirements of the camera module.
  • An object of the present invention is to provide a camera module bracket based on metal powder molding, a manufacturing method thereof and an application thereof, wherein the manufacturing method can greatly improve the manufacturing efficiency of the camera module bracket, so that the camera The module holder is adapted to be manufactured in large quantities.
  • An object of the present invention is to provide a camera module bracket based on metal powder molding and a manufacturing method and application thereof, wherein the manufacturing method can reduce waste of materials in the process of manufacturing the camera module bracket, The manufacturing cost of the camera module bracket is further reduced.
  • the present invention provides a camera module with reduced thickness, which includes:
  • At least one photosensitive chip each of the photosensitive chips being electrically connected to the circuit board;
  • a camera module bracket made of metal powder or a mixture of metal powder and non-metal powder, the circuit board being mounted on the camera module bracket, wherein the camera module bracket is used for each of the photosensitivity
  • the heat generated by the chip during the photoelectric conversion is conducted and radiated to the external environment of the camera module bracket, so that the camera module does not need to be configured with an additional heat sink on the circuit board to reduce the camera module.
  • the thickness in the axial direction is made of metal powder or a mixture of metal powder and non-metal powder, the circuit board being mounted on the camera module bracket, wherein the camera module bracket is used for each of the photosensitivity
  • the present invention further provides a camera module bracket, wherein the camera module bracket is made of metal powder or a mixture of metal powder and non-metal powder, and the camera module bracket has at least one
  • the first mounting portion is adapted to mount at least one optical lens and/or at least one motor, and a second mounting portion to be suitable for mounting at least one circuit board.
  • the present invention also provides a thermal system for a camera module, comprising:
  • At least one photosensitive chip At least one photosensitive chip
  • a camera module holder having an internal environment and an external environment, each of the photosensitive chips being housed in the internal environment of the camera module holder, wherein each of the sensor chips is in progress
  • the heat generated during the photoelectric conversion causes the gas of the internal environment of the camera module holder to form a hot gas, and the camera module holder is used to heat the internal environment of the camera module bracket
  • the cold gas of the external environment of the camera module holder exchanges heat, thereby reducing the temperature of the internal environment of the camera module bracket.
  • the present invention further provides a heat dissipation method for a camera module, wherein the heat dissipation method includes the following steps:
  • the present invention also provides a method of manufacturing a camera module holder, wherein the manufacturing method comprises the following steps:
  • the present invention also provides a method of manufacturing the camera module holder, wherein the manufacturing method includes the steps of:
  • the camera module bracket provided by the invention is formed by metal powder or a mixture of metal powder and non-metal powder through injection molding or 3D printing process, so that the mechanical performance of the camera module bracket is superior to the prior art.
  • a bracket made of plastic material.
  • the size of the camera module bracket needs to be designed to be ultra-thin, on the one hand, during the process of transporting the camera module bracket, it is not easy to be deformed, thereby facilitating the accuracy of the subsequent camera module.
  • the package on the other hand, in the process of using the camera module, the heat generated by the photosensitive chip during long-term photoelectric conversion does not cause the camera module bracket to be thermally deformed, thereby facilitating the camera.
  • the stability of the module holder and the imaging quality of the camera module are ensured.
  • the camera module bracket provided by the present invention is formed by metal powder or a mixture of metal powder and non-metal powder through injection molding or 3D printing process, and has good thermal conductivity and heat dissipation performance to achieve the image capturing.
  • the radial direction of the module exchanges heat generated by the camera module during operation with cold air of an external environment of the camera module, thereby reducing the temperature of the internal environment of the camera module.
  • One of the advantages of such a heat dissipation method is that the radial direction has a larger heat dissipation area than the conventional heat exchange in the axial direction, thereby improving the heat dissipation efficiency of the camera module.
  • the method of performing heat exchange by the camera module bracket can eliminate the need for the camera module of the prior art to configure an additional heat sink to achieve heat dissipation, thereby significantly reducing the thickness of the camera module. In order to meet the development trend of the pursuit of thinning and thinning of the camera module.
  • FIG. 1 shows a top plan view of a camera module holder in accordance with a preferred embodiment of the present invention.
  • Figure 2 is a partial enlarged view of Figure 1 showing the air outlet of the camera module bracket.
  • Figure 3 is a cross-sectional view showing the camera module holder of the above preferred embodiment of the present invention.
  • FIG. 4 is a perspective view of a camera module holder of another preferred embodiment of the present invention.
  • FIG. 5 is a top plan view of a camera module holder in accordance with still another preferred embodiment of the present invention.
  • Figure 6 is a cross-sectional view showing the camera module holder of the above preferred embodiment of the present invention.
  • Fig. 7 is an exploded view showing the image pickup module of the above preferred embodiment of the present invention.
  • Figure 8 is a cross-sectional view showing a camera module of the above preferred embodiment of the present invention.
  • FIG. 9 is a block diagram showing a heat dissipation method of the camera module of the above preferred embodiment of the present invention.
  • Fig. 10 is a block diagram showing the manufacturing process of the camera module holder of the above preferred embodiment of the present invention.
  • Fig. 11 is a block diagram showing another manufacturing process of the camera module holder of the above preferred embodiment of the present invention.
  • the camera module can be a single camera module or a multiple camera module.
  • the multiple camera module provided in the present invention can be configured by multiple single camera modules. A specific positional relationship is assembled.
  • the camera module can include a camera module holder 10, a circuit board 20, at least one sensor chip 30, at least one optical lens 40, and at least one motor 50.
  • Each of the photosensitive chips 30 is electrically connected to the wiring board 20.
  • each of the photosensitive chips 30 may be mounted on the wiring board 20.
  • Each of the optical lenses 40 is mounted to each of the motors 50, and each of the optical lenses 40 can be driven by each of the motors 50 to be adapted to adjust a focal length of the camera module.
  • the circuit board 20 and each of the motors 50 are respectively disposed on different sides of the camera module holder 10 such that each of the optical lenses 40 is located in a photosensitive path of each of the photosensitive chips 30, thereby When the module is used to capture an image of an object, the light reflected by the object can be further accepted by each of the photosensitive chips 30 after being processed by each of the optical lenses 40 to be suitable for photoelectric conversion. That is, in the present invention, the camera module holder 10 can be used to connect the circuit board 20 and each of the motors 50.
  • each of the optical lenses 40 of the camera module may be directly disposed on the camera module bracket 10, thereby making the camera module
  • the bracket 10 is capable of directly connecting the wiring board 20 and each of the optical lenses 40.
  • the camera module bracket 10 may also be an integrated bracket, and the camera module may not be configured with the motor 50, so that each The optical lens 40 can be directly disposed on the camera module holder 10, and the camera module holder 10 directly connects the circuit board 20 and each of the optical lenses 40.
  • the present invention is not limited in this respect.
  • the camera module holder 10 provided by the invention is prepared by forming a metal powder or a mixture of a metal powder and a non-metal powder by injection molding or a 3D printing process, and is made of a plastic material compared with the prior art.
  • the bracket, the camera module 10 of the present invention has better stability.
  • the camera module holder 10 needs to be designed to be thin enough to be configured in the ultra-thin type of the camera module, the good mechanical performance of the camera module holder 10 can be ensured.
  • the camera module bracket is not easily deformed, thereby ensuring the package precision of the camera module in the subsequent manner.
  • the camera module holder 10 made based on the metal powder also has good bending resistance and good recovery ability.
  • the prior art is made of a plastic material.
  • the frame is more prone to deformation such as bending; accordingly, when the camera module holder 10 of the present invention and the prior art frame made of plastic material are subjected to an external force to produce the same degree of deformation, the external force After the revocation, the camera module holder 10 of the present invention is more easily restored to the initial state, so that the camera module holder 10 of the present invention is more stable than the bracket made of the prior art plastic.
  • the external force is easily generated during the process of transporting the camera module bracket 10.
  • the camera module bracket 10 is subjected to bumps and the like, thereby generating the external force, thereby improving the camera.
  • the mechanical properties of the module holder 10 have significant advantages over the quality of the camera module holder 10.
  • the camera module holder 10 when the camera module holder 10 is transported, even if the camera module holder 10 is subjected to an external force, no deformation occurs, and the subsequent package yield of the camera module can be ensured.
  • the camera module holder 10 when the camera module is used, the camera module holder 10 is not easily deformed when heated, thereby ensuring the imaging quality of the camera module. It can be understood by those skilled in the art that the thermal conductivity and heat dissipation performance of the prior art stent made of plastic material are relatively poor.
  • the photosensitive chip 30 is performing photoelectricity.
  • the heat generated during the conversion is not easily radiated from the inside of the camera module holder, thereby causing the bracket to be deformed due to excessive heat, and the photosensitive chip 30 and the optical lens 40 must be present once the bracket is deformed. In the case of relative tilt, the imaging quality of the camera module is adversely affected.
  • the camera module holder 10 of the present invention is formed by metal powder or a mixture of metal powder and non-metal powder through injection molding or 3D printing process, and has good thermal conductivity and heat dissipation performance, so that even in the camera module When the bracket 10 is heated, the camera module holder 10 is also not deformed.
  • the metal powder may be selected from the group consisting of iron, tungsten, molybdenum, copper, cobalt, nickel, titanium, niobium, aluminum, tin, lead, antimony, bismuth, titanium, zirconium, hafnium, tantalum, One or more of uranium.
  • the non-metal powder may be selected from one or more of graphite, carbon black, ceramics, plastics, and the like. It is also worth mentioning that the metal powder and the non-metal powder in the present invention can be obtained by a conventional powder acquisition process, thereby ensuring that the camera module holder 10 has a wide range of material sources to further reduce the camera module. The manufacturing difficulty and manufacturing cost of the bracket 10.
  • a first mounting portion 11 and a second mounting portion 12 are respectively disposed on two sides of the camera module bracket 10, and the camera module bracket 10 further has at least one light channel 13 connected to the first mounting portion. a portion 11 and the second mounting portion 12 such that each of the light tunnels 13 allows light to pass from a side of the camera module holder 10 where the first mounting portion 11 is located to the second mounting portion Radiation on the side where 12 is located.
  • the first mounting portion 11 of the camera module holder 10 is adapted to be mounted on each of the optical lenses 40 and/or each of the horses Up to 50, and each of the optical lenses 40 and/or each of the motors 50 corresponds to each of the light tunnels 13 of the camera module holder 10.
  • the second mounting portion 12 of the camera module holder 10 is adapted to be mounted on the circuit board 30, and each of the photosensitive chips 30 is respectively in the camera module bracket 10
  • the light tunnels 13 correspond so that each of the optical lenses 40 is located in a photosensitive path of each of the photosensitive chips 30, respectively.
  • the camera module holder 10 has at least one air outlet portion 14 adapted to communicate with the internal environment and the external environment of the camera module holder 10, thereby encapsulating the camera module.
  • Each of the air outlet portions 14 can balance the air pressure of the internal environment of the camera module holder 10 with the air pressure of the external environment to ensure the flatness between each of the photosensitive chips 30 and each of the optical lenses 40.
  • the space inside the inner surface of the camera module holder 10 is defined as the internal environment of the camera module holder 10, and the outer surface of the camera module holder 10 is defined. The space is the external environment of the camera module holder 10.
  • each of the air outlet portions 14 may have a different shape, for example, each of the air outlet portions 14 may be selected from a shape group consisting of a straight line, a curved line, and other irregular shapes, and each of the air outlet portions 14 The air outlet portion 14 can be located on the same side of the camera module bracket 10 as the second mounting portion 12 .
  • the camera module bracket 10 is provided with at least one first air outlet passage 141 and at least one second air outlet passage 142, and each of the first air outlet passage 141 and each of the second air outlet passages 142 respectively Connected to form each of the air outlet portions 14.
  • each of the first air outlet passages 141 and each of the second air outlet passages 142 are respectively bently communicated, so that each of the air outlet portions 14 can be filtered from each of the air outlet portions 14 from the camera module bracket.
  • the external environment of 10 enters the contaminants carried in the gas of its internal environment.
  • the camera module bracket 10 may further be provided with at least one glue overflow groove 15, and each of the glue overflow grooves 15 may be disposed at intervals from each of the air outlet portions 14 for accommodating excess glue to prevent glue.
  • Each of the photosensitive chips 30 or other components is contaminated in the internal environment of the camera module holder 10.
  • one of the overflow tanks 15 may be provided on each of the two sides of the air outlet portion 14, thereby preventing the air outlet portion 14 from being blocked by excess glue.
  • the process of encapsulating the camera module it is required to provide glue on the second mounting portion 12 of the camera module holder 10 and at least one component of the circuit board 20, and then The circuit board 20 is disposed on the second mounting portion 12 of the camera module holder 10 in a superposed manner.
  • the camera module performs baking heating. At this time, the gas in the internal environment of the camera module holder 10 is heated to increase the air pressure and form hot gas. At this time, the internal environment of the camera module holder 10 is Hot gas is exhausted to the external environment of the camera module holder 10 through each of the air outlet portions 14.
  • the air pressure of the internal environment of the camera module holder 10 is gradually lower than the air pressure of the external environment of the camera module holder 10 .
  • the gas of the external environment of the camera module holder 10 enters the internal environment of the camera module holder 10 through each of the air outlet portions 14, in the process, from the camera module holder 10 Contaminants such as dust and the like carried in the atmosphere of the external environment entering the internal environment may be precipitated at the bent link positions of the first outlet passage 141 and the second outlet passage 142 of each of the outlet portions 14, thereby contaminant
  • Each of the photosensitive chips 30 or other components is contaminated without entering the internal environment of the camera module holder 10.
  • the glue will also expand during the process of baking the camera module, so that excess glue will overflow and remain in each of the overflow tanks 15, and because the glue tank 15 and each of the glue tanks are not
  • the air portions 14 are disposed at intervals, so that the excess glue does not block each of the air outlet portions 14 on the one hand, and does not contaminate each of the light sensing chips 30 or other components in the internal environment of the camera module 10 on the other hand. Parts.
  • the camera module holder 10 is different from the above embodiment in that the camera module holder 10 is an integrated camera module holder.
  • the camera module holder 10 may have a plurality of the first mounting portions 11 and one of the second mounting portions 12, wherein each of the first mounting portions 11 and the second stickers
  • the mounting portions 12 are not symmetrically disposed on both sides of the camera module holder 10. More specifically, each of the first mounting portions 11 may be disposed along a depth direction of the camera module 10 such that each of the optical lenses 40 and/or each of the motors 50 is embedded in an embedded manner.
  • the circuit board 20 to which the sensor chip 30 is attached is attached to the second mounting portion 12 of the camera module holder 10, thereby The optical lens 40 is located in a photosensitive path of each of the photosensitive chips 30.
  • the number of the photosensitive chip 30, the optical lens 40, and the motor 50 may be one, that is, the imaging mode.
  • the group can be a single camera module.
  • the camera module holder 10 can be used to package two or more of the photosensitive chips 30 and the optical lens 40.
  • the motor 50 so that the camera module forms a multi-camera module. That is, more than one of the photosensitive chip 30, the optical lens 40, and the motor 50 may be packaged by one of the camera module holders 10.
  • the camera module holder 10 may have one of the first mounting portion 11, one of the second mounting portions 12, and two of the light tunnels 13 to be adapted. Connecting to a side where the first mounting portion 11 is located and a side where the second mounting portion 12 is located, and each of the optical lenses 40 and/or each of the motors 50 corresponds to each of the light channels 13 is attached to the first mounting portion 11 of the camera module holder 10, and when the circuit board 20 is attached to the second mounting portion 12 of the camera module holder 10 Each of the photosensitive chips 30 corresponds to each of the light channels 13 so that each of the optical lenses 40 is located in a photosensitive path of each of the photosensitive chips 30.
  • a positioning component 16 can be respectively disposed on each side of the camera module bracket 10, and each of the positioning components 16 is adapted to mount the camera module to a portable electronic device, thereby preventing the camera module.
  • each of the positioning elements 16 can be respectively provided with a positioning hole through which the camera module can be mounted on the portable electronic device. In this way, the distance between each camera module (the camera module including the optical lens, the motor and the sensor chip) between the camera modules is not offset to ensure the reliability of the camera module.
  • the camera module holder 10 made of metal powder or metal powder and non-metal powder mixture by injection molding or 3D printing process also has good thermal conductivity and heat dissipation performance.
  • the vertical direction of the camera module is defined as the axial direction of the camera module, and the surrounding direction of the camera module is defined as the radial direction of the camera module.
  • the camera module holder 10 of the present invention produced by injection molding or 3D printing from a metal powder or a mixture of metal powder and non-metal powder is substantially different from the function of the prior art stent made of plastic material. .
  • the prior art bracket made of a plastic material is only used to connect the motor and the circuit board. Therefore, in order to improve the heat dissipation capability of the prior art camera module, the opposite side of the circuit board and the photosensitive chip is required.
  • the heat dissipating device is additionally provided with a metal piece, so that the heat generated by the photo-sensitive chip during photoelectric conversion is radiated to the external environment of the camera module through the heat dissipating device.
  • the heat dissipating device is disposed in the axial direction of the camera module, that is, the prior art camera module only provides heat dissipation in the axial direction, and such a manner exists.
  • the prior art camera module can only dissipate heat along the axial direction of the camera module.
  • Such a heat dissipation method makes the contact area of the heat sink of the camera module and the external environment limited, thereby causing the prior art camera.
  • the module has insufficient heat dissipation capability.
  • the prior art camera module dissipates heat through the heat sink through the circuit board, and the circuit board is deformed when heated for a long time.
  • the relative tilt between the photosensitive chip mounted on the circuit board and the optical lens affects the imaging quality of the prior art camera module.
  • the heat dissipating device is additionally disposed in the axial direction of the camera module, so that the thickness of the camera module of the prior art is further increased, thereby facilitating the prior art camera module not being applied to the pursuit of thinning and thinning. On portable electronic devices.
  • the camera module of the present invention is different from the heat dissipation direction of the camera module of the prior art. Specifically, when the camera module holder 10 and other components are packaged to form the camera module, the sensor chip 30 is housed in the internal environment of the camera module holder 10, thereby The camera module holder 10 is disposed around the sensor chip 30. That is, the camera module holder 10 is not in the axial direction of the camera module, but is disposed in the radial direction of the camera module.
  • the photosensitive chip 30 generates heat during photoelectric conversion, the heat causes the gas in the internal environment of the camera module holder 10 to form hot gas, and accordingly, the external environment of the camera module holder 10
  • the gas is called a cold gas.
  • the heat carried by the hot gas inside the camera module holder 10 is conducted from the internal environment by the camera module holder 10 and radiated to the external environment, thereby realizing hot gas and cold gas through the camera module holder 10.
  • the heat exchange is performed to lower the temperature of the internal environment of the camera module holder 10.
  • one of the advantages is that the contact area of the camera module holder 10 with the external environment is larger than the base area of the circuit board 20 and the external environment, and the camera module bracket 10 directly realizes hot gas and The heat exchange of the cold gas is beneficial to improve the efficiency of the heat exchange; the second advantage is that the use of the camera module bracket 10 does not need to additionally configure the heat sink for the camera module, thereby making the camera.
  • the overall thickness of the module can be significantly reduced to meet the trend of the pursuit of thinness and lightness of portable electronic devices, which is unexpected in the prior art camera module, and the overall performance and thickness of the camera module are improved. The reduction is particularly effective.
  • the present invention further provides a heat dissipation method 900 for a camera module, wherein the heat dissipation method 900 includes the following steps:
  • Step 910 (A) uniformly radiating heat generated by at least one photosensitive chip 30 during photoelectric conversion along a radial direction and an axial direction of the camera module;
  • Step 920 (B) heat-exchange the hot gas in the internal environment of the camera module and the cold gas in the external environment of the camera module in the radial direction of the camera module, thereby reducing the camera module The temperature of the internal environment.
  • the axial direction of the camera module is a circuit board and an optical lens, respectively, and each of the photosensitive chips 30 is in the process of photoelectric conversion of each of the photosensitive chips 30.
  • the generated heat is conducted through the circuit board and radiated to the external environment of the camera module, and in the process, the prior art is to additionally dispose the heat sink on the side of the circuit board opposite to each of the photosensors 30.
  • this practice of the prior art undoubtedly increases the thickness of the camera module in the axial direction.
  • the camera module When the camera module is used, for example, the camera module is installed in a mobile phone that is light and thin, and the axial direction of the camera module is the thickness direction of the mobile phone, so that the thickness of the camera module is determined.
  • the thickness of the mobile phone therefore, increasing the size of the camera module in the axial direction is undoubtedly increasing the thickness of the mobile phone.
  • the present invention heats the cold gas in the internal environment of the camera module in the radial direction and the cold gas in the external environment of the camera module, and the heat dissipation area is increased.
  • the method further includes the step of: arranging a camera module holder 10 in a radial direction of the camera module for conducting and radiating heat.
  • the heat dissipation area formed by the camera module bracket 10 is greatly increased, thereby significantly increasing the heat dissipation effect of the camera module, and in this manner, the camera module bracket 10 itself forms a The heat dissipating member, so that the heat generated by each of the photoreceptor chips 30 is greatly reduced to the portion of the circuit board 20, so as to prevent the circuit board 20 from being deformed due to excessive heat energy to ensure the image sensor module. Imaging quality.
  • each of the photosensitive chips 30 is mounted on the circuit board 20, and in the step (B), the circuit board 20 is mounted on the camera module.
  • the holder 10 transmits heat transferred to the circuit board 20 during photoelectric conversion of each of the photosensitive chips 30 to be further transmitted to the camera module holder 10 to radiate at least the external environment of the camera module. That is, although heat generated by each of the photosensitive chips 30 during photoelectric conversion is conducted to the circuit board 20, part of the heat is quickly dissipated through the camera module holder 10 without continuing. Acting on the circuit board 20 to avoid deformation of the circuit board 20 due to an increase in temperature due to continuous heating.
  • a thermal system for a camera module includes at least one of the sensor chip 30 and the camera module holder 10, wherein the camera module holder 10 has An internal environment and an external environment, each of the photosensitive chips 30 is housed in the internal environment of the camera module holder 10, wherein each of the photosensitive chips 30 generates heat during photoelectric conversion.
  • the gas of the internal environment of the camera module holder 10 forms a hot gas, and accordingly, the gas of the external environment of the camera module holder 10 forms a cold gas, and the camera module holder 10 is used for
  • the hot gas in the internal environment of the camera module holder 10 exchanges heat with the cold gas in the external environment of the camera module holder 10, thereby reducing the temperature of the internal environment of the camera module holder.
  • the camera module holder 10 surrounds the radial direction of each of the photosensitive chips 30, so that the internal environment of each of the camera module holders 10 is in the radial direction of each of the photosensitive chips 30.
  • the hot gas exchanges heat with the cold gas of the external environment of the camera module holder.
  • the present invention also provides a method 1000 of manufacturing the camera module holder, wherein the manufacturing method 1000 includes the following steps.
  • Step 1010 (a) forming a stream based on the metal powder.
  • the stream is a raw material for subsequently forming the camera module holder 10, and the stream may be formed by mixing a metal powder, a metal powder, and a non-metal powder mixture.
  • the step (a) may further comprise the steps of: mixing the metal powder with an adhesive to form the stream; in another preferred embodiment of the invention, The step (a) may further comprise the step of mixing a metal powder, a non-metal powder and an adhesive to form the stream.
  • the stream referred to in the present invention refers to a raw material that can be automatically flowed under the action of gravity, so that in different embodiments, the stream can take on different forms. , such as fluid or granular solids.
  • the ratio of the raw materials used to obtain the camera module bracket 10 may be different according to different usage requirements, that is, the camera module brackets 10 of different specifications may require metal powders of different proportions, Metal powder and adhesive.
  • Step 1020 (b) pouring the material into the mold of the camera module bracket.
  • the feed port of the material of the mold module bracket is a large nozzle feed port.
  • the stream may be solidified by sintering, so that in step 1030: (c) solidifying the mold of the camera module holder The stream is used to produce the camera module holder 10. It is worth mentioning that in the step (c), the flow in the camera module bracket can be solidified by other means.
  • the manufacturing method further includes a step 1040: (d) performing an insulation process on an outer surface of the camera module holder 10, so that the camera module with the camera module holder 10 is configured
  • the internal components of the camera module and the portable electronic device can be prevented.
  • the other components are short-circuited.
  • the manufacturing method further includes a step 1050 of: (e) performing a matting process on the outer surface of the camera module holder 10 to prevent the outer surface of the camera module holder 10 from being reflected.
  • step (d) and the step (e) can also be performed synchronously, that is, coating a reflective insulating material on the outer surface of the camera module holder 10. Therefore, the reflective insulating material forms a reflective insulating layer on the outer surface of the camera module holder 10.
  • the present invention also provides a method 1100 of fabricating the camera module mount, wherein the method of manufacture 1100 includes the following steps.
  • Step 1110 (i) forming a stream based on metal powder
  • Step 1120 (ii) establishing a digital model associated with the camera module holder 10;
  • Step 1130 (iii) printing the stream using the stream based on the digital model to produce the camera module holder 10.
  • the camera module holder 10 is manufactured using the 3D printing process in the step (iii) to enable the camera module holder 10 to be quickly formed.
  • the step (ii) may further include the step of scanning a sample of the camera module holder 10 to establish the related to the camera module holder 10. Digital model.
  • the step (ii) may further comprise the step of establishing, by the modeling software, the digital model associated with the camera module holder 10 in a computer.
  • remote operation can be performed to improve the manufacturing efficiency of the camera module.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Studio Devices (AREA)

Abstract

L'invention concerne un cadre de support de module d'appareil photographique (10) basé sur un procédé de fabrication et de moulage par injection de poudre métallique et une application associée. Le cadre de support de module d'appareil photographique (10) est fabriqué à partir d'une poudre métallique ou d'un mélange d'une poudre métallique et d'une poudre non métallique. Le cadre de support de module d'appareil photographique (10) a au moins une première partie de montage (11) appropriée pour le montage d'au moins une lentille d'appareil photographique optique (40) et/ou d'au moins un moteur (50), et a une seconde partie de montage (12) appropriée pour le montage d'au moins une carte de circuits (20), permettant ainsi de former un module d'appareil photographique. Le module d'appareil photographique comprend en outre au moins une puce de photodétecteur (30), et le cadre de support de module d'appareil photographique (10) est configuré pour transférer et rayonner de la chaleur générée durant la conversion photoélectrique réalisée par chaque puce de photodétecteur (30) vers un environnement externe du cadre de support de module d'appareil photographique (10). Par conséquent, le module d'appareil photographique n'a pas besoin d'avoir un dispositif de dissipation de chaleur supplémentaire au niveau de la carte de circuits (20), permettant ainsi de réduire une épaisseur du module d'appareil photographique dans la direction axiale.
PCT/CN2016/086852 2015-06-26 2016-06-23 Cadre de support de module d'appareil photographique basé sur un procédé de fabrication et de moulage par injection de poudre métallique et application associée WO2016206595A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201510358084.0 2015-06-26
CN201520449883.4 2015-06-26
CN201510358084.0A CN104994259A (zh) 2015-06-26 2015-06-26 基于金属粉末成型的摄像模组支架及其制造方法和应用
CN201520449883.4U CN205005139U (zh) 2015-06-26 2015-06-26 基于金属粉末成型的摄像模组支架及摄像模组和散热系统

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WO2016206595A1 true WO2016206595A1 (fr) 2016-12-29

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2285094A1 (fr) * 2008-04-24 2011-02-16 Kyocera Corporation Module d'imagerie
CN101981499A (zh) * 2008-03-26 2011-02-23 京瓷株式会社 摄像模块
US20120229924A1 (en) * 2011-03-10 2012-09-13 Hon Hai Precision Industry Co., Ltd. Lens holder and camera module using the same
CN203149179U (zh) * 2013-01-08 2013-08-21 深圳欧菲光科技股份有限公司 摄像头模组支架及摄像头模组
CN204089960U (zh) * 2014-06-30 2015-01-07 惠州市泰宇光电有限公司 手机摄像头模组
CN104994259A (zh) * 2015-06-26 2015-10-21 宁波舜宇光电信息有限公司 基于金属粉末成型的摄像模组支架及其制造方法和应用
CN205005139U (zh) * 2015-06-26 2016-01-27 宁波舜宇光电信息有限公司 基于金属粉末成型的摄像模组支架及摄像模组和散热系统

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101981499A (zh) * 2008-03-26 2011-02-23 京瓷株式会社 摄像模块
EP2285094A1 (fr) * 2008-04-24 2011-02-16 Kyocera Corporation Module d'imagerie
US20120229924A1 (en) * 2011-03-10 2012-09-13 Hon Hai Precision Industry Co., Ltd. Lens holder and camera module using the same
CN203149179U (zh) * 2013-01-08 2013-08-21 深圳欧菲光科技股份有限公司 摄像头模组支架及摄像头模组
CN204089960U (zh) * 2014-06-30 2015-01-07 惠州市泰宇光电有限公司 手机摄像头模组
CN104994259A (zh) * 2015-06-26 2015-10-21 宁波舜宇光电信息有限公司 基于金属粉末成型的摄像模组支架及其制造方法和应用
CN205005139U (zh) * 2015-06-26 2016-01-27 宁波舜宇光电信息有限公司 基于金属粉末成型的摄像模组支架及摄像模组和散热系统

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