WO2016206023A1 - 柔性封装盖板及其制备方法、触摸显示装置及其制备方法 - Google Patents

柔性封装盖板及其制备方法、触摸显示装置及其制备方法 Download PDF

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Publication number
WO2016206023A1
WO2016206023A1 PCT/CN2015/082241 CN2015082241W WO2016206023A1 WO 2016206023 A1 WO2016206023 A1 WO 2016206023A1 CN 2015082241 W CN2015082241 W CN 2015082241W WO 2016206023 A1 WO2016206023 A1 WO 2016206023A1
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Prior art keywords
layer
filling
touch
pattern layer
spacer
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English (en)
French (fr)
Inventor
张家奇
刘自鸿
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Priority to CN201580002181.4A priority Critical patent/CN106716315A/zh
Priority to PCT/CN2015/082241 priority patent/WO2016206023A1/zh
Publication of WO2016206023A1 publication Critical patent/WO2016206023A1/zh
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • the present invention relates to the field of touch control, and more particularly to a flexible package cover having a touch function and a method for preparing a flexible package cover having a touch function, and a touch display device and a touch display device Preparation.
  • touch panels provide a new human-computer interaction interface, which is more direct and more user-friendly in use.
  • the touch screen and the flat display panel are integrated to form a touch display device, which can enable the flat display device to have a touch function, and can perform input through a finger, a stylus pen, etc., and the operation is more intuitive and simple.
  • the Chinese Patent Application No. 201430792 discloses a flexible touch panel and a flexible touch display using the same, the touch display comprising a display panel and a touch layer on the display panel.
  • the touch layer is composed of two layers of upper and lower touch sensor layers and a plastic substrate and a gas barrier layer between the two layers of touch sensor layers.
  • the display panel is attached to the drive flexible circuit board (FPC).
  • the touch sensor layer is on the upper and lower surfaces of the flexible substrate, the upper surface sensor still needs to be protected when the product is output, and the sensor layer pattern gap is not filled. It is not conducive to the uniformity of light output.
  • the touch display device includes an OLED display 1 and a transparent touch screen 2.
  • the transparent touch screen 2 includes an electrode conductive layer formed on the transparent package cover 12.
  • the electrode conductive layer includes at least two unit electrodes 24, a first insulating layer 26 at the intersection of the unit electrodes 24, an auxiliary electrode 25 connecting the unit electrodes 24, and a touch driving circuit 23 electrically connected to the auxiliary electrode 25.
  • the touch display device disclosed in the patent application No. CN201410734964.9 needs to add an OLED package cover plate, and a cover plate is still required for a flexible package, and the presence of the multilayer flexible substrate affects efficiency.
  • the present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the present invention needs to provide a flexible package cover with a touch function and a method for preparing a flexible package cover with a touch function, a touch display device and a method for preparing the touch display device.
  • An embodiment of the present invention provides a flexible package cover having a touch function, including a substrate and a touch layer on the substrate, the touch layer including a filling layer and a conductive pattern layer, the filling layer covering the conductive pattern layer And filling a gap of the conductive pattern layer.
  • the flexible package cover plate includes a conductive pattern layer for implementing a touch function, which can reduce related process steps such as touch panel bonding, and at the same time, the filling layer covers the conductive pattern layer and fills the gap of the conductive pattern layer, thereby reducing the conductive pattern layer.
  • the color difference of the formed light is favorable for the uniformity of the light.
  • the embodiment of the invention further provides a method for preparing a flexible package cover plate with a touch function, which comprises the following steps:
  • S2 forming a touch layer on the substrate, the touch layer comprising a filling layer and a conductive pattern layer, the filling layer covering the conductive pattern layer and filling a gap of the conductive pattern layer;
  • An embodiment of the present invention further provides a touch display device including a display panel and a flexible package cover having a touch function, the flexible package cover including a substrate and a touch layer on the substrate, the touch layer including the filling a layer and a conductive pattern layer covering the conductive pattern layer and filling a gap of the conductive pattern layer, the touch layer being adhered to the display panel.
  • Embodiments of the present invention also provide a method of fabricating a touch display device, including the following steps:
  • S2 forming a touch layer on the substrate, the touch layer comprising a filling layer and a conductive pattern layer, the filling layer covering the conductive pattern layer and filling a gap of the conductive pattern layer;
  • FIG. 1 is a schematic structural view of a touch display device according to a preferred embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a touch display device connected to a flexible circuit board according to a preferred embodiment of the present invention
  • FIG. 3 is a schematic structural view of a conductive pattern layer of a touch display device according to a preferred embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a touch display device according to another preferred embodiment of the present invention.
  • FIG. 5 is a schematic flow chart of a method for preparing a flexible package cover according to a preferred embodiment of the present invention.
  • FIG. 6 is a schematic flow chart of a method of fabricating a touch display device according to a preferred embodiment of the present invention.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, or may be electrically connected or may communicate with each other; may be directly connected or indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • a touch display device 100 includes a display panel 102 and a flexible package cover 104 having a touch function.
  • the display panel 102 is an organic light emitting diode panel (OLED panel).
  • OLED display panel has the advantages of self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast, near 180° viewing angle and wide temperature range, which can realize flexible display and large-area full-color display.
  • a flexible circuit board 400 can be connected to the periphery of the display panel 102 for connecting the display panel 102 and the controller (control IC) of the display panel, as shown in FIG.
  • the flexible package cover 104 includes a substrate 106 , a touch layer 108 on the substrate 106 , and a bonding layer 110 on the touch layer 108 .
  • the substrate 106 is located at the outermost layer.
  • the substrate 106 is a flexible substrate, and the material thereof may be polyethylene terephthalate (PET) or polyethylene naphthalate (PEN).
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • the touch layer 108 is disposed between the substrate 106 and the bonding layer 110 .
  • the touch layer 108 includes a filling layer 112 and a conductive pattern layer 114 .
  • the filling layer 112 covers the conductive pattern layer 114 and fills a gap of the conductive pattern layer 114.
  • the touch layer 108 includes a first spacer layer 116 and a second spacer layer 118.
  • the first spacer layer 116 is connected to the substrate 106 and the conductive pattern layer 114.
  • the second spacer layer 118 is connected.
  • the material of the first spacer layer 116 may be an inorganic material
  • the material of the second spacer layer 118 may be an inorganic material.
  • the first spacer layer 116 and the second spacer layer 118 prevent gas and moisture from infiltrating into the conductive pattern layer 114 and display from the outside. Panel 102.
  • the materials of the first spacer layer 116 and the second spacer layer 118 are all formed of inorganic materials, such as nitrides and/or oxides, including calcium oxide, aluminum oxide, silica, titanium oxide, and indium oxide. , silicon oxide, silicon nitride, and/or aluminum nitride.
  • the first spacer layer 116 and the second spacer layer 118 may be formed on the flexible package cover 104 by a chemical vapor deposition (CVD) method.
  • CVD chemical vapor deposition
  • the conductive pattern layer 114 includes a first pattern layer 120 and a second pattern layer 122.
  • the first pattern layer 120 and the second pattern layer 122 are in the same layer, and between the first pattern layer 120 and the second pattern layer 122.
  • the filling layer 112 is filled.
  • the first pattern layer 120 includes a first electrode 124 and a first lead (not shown).
  • the first lead is connected to the first electrode 124 and is used to connect the external flexible circuit board 500.
  • the second pattern layer 122 includes a second electrode 126 and a second lead (not shown).
  • the second lead is connected to the second electrode 126 and is used for connecting an external flexible circuit board 500.
  • the external flexible circuit board 500 is connected to the touch layer 108. And the controller of the touch layer (control IC).
  • the first electrode 124 and the second electrode 126 have a comb-tooth structure, and the first electrode 124 and the second electrode 126 are spaced apart to form a conductive pattern.
  • the first electrode 124 and the second electrode 126 can function as a touch electrode.
  • the material of the first electrode 124 and the material of the second electrode 126 may be made of a material such as graphene or nano silver wire, and may be formed into a corresponding pattern on the conductive film by laser etching, for example, a laser may be emitted by a pulse method, and The strength of the laser is controlled to etch the conductive film.
  • the material of the first lead and the material of the second lead may be selected from a material such as a conductive silver paste, and after the first electrode 124 and the second electrode 126 are formed, formed on the first spacer layer 116 by a printing process and connected to the corresponding electrode. Since the first pattern layer 120 and the second pattern layer 122 are in the same layer, the flexible package cover 104 of the present embodiment can reduce the number of layers and make the flexible package cover 104 thinner and more flexible.
  • the gap of the conductive pattern layer 114 includes the gap (if any) of the first pattern layer 120 itself, and the second The gap between the pattern layer 122 itself (if any) and the gap formed between the first pattern layer 120 and the second pattern layer 122 are required to form a gap of the conductive pattern layer 114.
  • the filling layer 112 may be formed on the conductive pattern layer 114 and fill the gap of the conductive pattern layer 114 by a chemical vapor deposition (CVD) method or a printing process.
  • the filling layer 112 is an organic film layer.
  • the material of the organic film layer may be acrylic resin, methacrylic resin, polyester, polyethylene terephthalate, polyethylene or polypropylene.
  • the material properties of the filling layer 112 using the organic film layer determine the gap that can more closely fill the conductive pattern layer 114, and the filling layer 112 can also better cushion the stress of the entire flexible package cover 104 structure.
  • the flatness of the organic film layer as the filling layer 112 is better than that of the inorganic film filling, and further, the organic film filling effect is further improved.
  • the packaging effect of the flexible package cover 100 is also better.
  • the bonding layer 110 is located between the display panel 102 and the touch layer 108 and connects the display panel 102 and the touch layer 108.
  • the bonding layer 110 is an adhesive layer, and the bonding layer 110 may be formed on the second spacer layer 118 by a coating or pasting method.
  • the bonding layer 110 is attached to the display panel 102.
  • the flexible package cover 104 includes a conductive pattern layer 114 for implementing a touch function, which can reduce related process steps such as touch panel bonding, and at the same time, the filling film 112 covers the conductive pattern layer.
  • 114 and filling the gap of the conductive pattern layer 114 reduces the chromatic aberration of the light formed by the conductive pattern layer 114, which is favorable for uniformity of light output.
  • the touch display device 100 of the present invention reduces the use of the flexible substrate as compared with the out-cell or on-cell capacitive touch screen used in the conventional OLED display panel, thereby increasing the light-emitting efficiency of the OLED display panel 102.
  • a second preferred embodiment of the present invention provides a touch display device 200.
  • the touch display device 200 of the present embodiment is substantially the same as the touch display device 100 of the first preferred embodiment, except that the structure of the touch layer 202 of the present embodiment is different.
  • the touch layer 202 includes a first spacer layer 204, a second spacer layer 206, a third spacer layer 208, a filling layer, and a conductive pattern layer.
  • the conductive pattern layer includes a first pattern layer 210 and a second layer.
  • the pattern layer 212 includes a first filling film 214 and a second filling film 216.
  • the first spacer layer 204 connects the substrate 218 and the first pattern layer 210.
  • the first spacer layer 204 is an inorganic material, such as formed of nitrides and/or oxides, including calcium oxide, aluminum oxide, silica, titanium oxide, indium oxide, silicon oxide, silicon nitride, and/or nitrogen.
  • the first spacer layer 204 may be formed on the substrate 218 by a chemical vapor deposition (CVD) method.
  • the first pattern layer 210 includes a first electrode and a first lead.
  • a conductive film may be formed on the first spacer layer 204, and then a first electrode is prepared by a laser etching method, and the pattern of the first electrode may be preset. After printing The process forms a first lead on the first spacer layer 218 and connects the first electrode.
  • the first filling film 214 covers the first pattern layer 210 and fills a gap of the first pattern layer 210.
  • the first filling film 214 is an organic film.
  • the gap of the first pattern layer 210 includes a gap formed by the pattern of the first electrode, a gap formed by the first lead, and the like to form a gap of the desired first pattern layer 210.
  • the material of the first filling film 214 may be acrylic resin, methacrylic resin, polyester, polyethylene terephthalate, polyethylene or polypropylene.
  • the first filling film 214 may be formed on the first pattern layer 210 by a chemical vapor deposition method or a printing process.
  • the second spacer layer 206 covers the first filling film 214 and the second pattern layer 212 .
  • the material of the second spacer layer 206 is an inorganic material, such as formed of nitrides and/or oxides, including calcium oxide, aluminum oxide, silica, titanium oxide, indium oxide, silicon oxide, silicon nitride, and/or Or aluminum nitride.
  • the second spacer layer 206 may be formed on the first organic film 214 by a chemical vapor deposition (CVD) method.
  • the second pattern layer 212 includes a second electrode and a second lead.
  • a conductive film may be formed on the second spacer layer 206, and a second electrode may be prepared by a laser etching method. The pattern of the second electrode may be preset. Thereafter, a second lead is formed on the second spacer layer 206 by a printing process and the second electrode is connected.
  • the second filling film 216 covers the second pattern layer 212 and fills the gap of the second pattern layer 212.
  • the second filling film 216 is an organic film.
  • the gap of the second pattern layer 212 includes a gap formed by the pattern of the second electrode, a gap formed by the second lead, and the like to form a gap of the desired second pattern layer 212.
  • the material of the second filling film 216 may be acrylic resin, methacrylic resin, polyester, polyethylene terephthalate, polyethylene or polypropylene.
  • the second filling film 216 may be formed on the second pattern layer 212 by a chemical vapor deposition method or a printing process.
  • the first filling film 214 and the second filling film 216 can be selected from the same material to facilitate the preparation of the flexible device cover and cost saving.
  • the third spacer layer 208 is connected to the second organic film 216 and the bonding layer 220.
  • the material of the third spacer layer 208 is an inorganic material, such as a nitride and/or an oxide, including calcium oxide and aluminum oxide. , silica, titanium oxide, indium oxide, silicon oxide, silicon nitride, and/or aluminum nitride.
  • the third spacer layer 208 may be formed on the second organic film 216 by a chemical vapor deposition (CVD) method. Further, in order to facilitate the preparation of the flexible device cover and the cost saving, the first gap layer 204, the second spacer layer 206 and the third spacer layer 208 may be made of the same material.
  • the beneficial effects of the touch display device 200 of the present embodiment are substantially the same as those of the touch display device 100 of the first preferred embodiment. Further, in the embodiment, since the first pattern layer 210 and the second pattern layer 212 are layered, if the first filling film 214 and the second filling film 216 are prepared by using an elastic material, the touch display device 200 can also realize the feeling. The function of measuring pressure touch.
  • a method for preparing a flexible package cover plate with a touch function includes the following steps:
  • S2 forming a touch layer on the substrate, the touch layer comprising a filling layer and a conductive pattern layer, the filling layer covering the conductive pattern layer and filling a gap of the conductive pattern layer;
  • the substrate is a flexible substrate, and the material thereof may be polyethylene terephthalate (PET) or polyethylene naphthalate (PEN).
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • step S2 includes:
  • the first spacer layer 116 may be formed by deposition on a substrate by a chemical vapor deposition (CVD) method.
  • the material of the first spacer layer 116 is an inorganic material.
  • a conductive film may be coated on the first spacer layer 116, and the first electrode 124 and the second electrode 126 may be prepared on the conductive film by laser etching.
  • the material of the conductive film may be selected from graphene or nano silver. The patterning of the conductive film by laser etching greatly reduces the number of process steps compared to conventional photolithography processes.
  • first lead and the second lead are prepared by a printing process, the first lead is connected to the first electrode 124, and the second lead is connected to the second electrode 126.
  • the material of the lead can be selected from a conductive silver paste.
  • the filling layer 112 is an organic film layer, and the material thereof may be acrylic resin, methacrylic resin, polyester, polyethylene terephthalate, polyethylene or polypropylene.
  • the filling layer 112 may be formed on the conductive pattern layer 114 by a deposition method such as chemical vapor deposition or a printing process.
  • the deposition method using chemical vapor deposition or the like to form the filling layer 112 is more advantageous for filling the gap of the conductive pattern layer 114.
  • the filling layer 112 also fills the gap of the conductive pattern layer 114.
  • the material properties of the organic film determine the gap that can more closely fill the conductive pattern layer 114, and the filling layer 112 using the organic film layer can better cushion the stress of the entire flexible package cover 104 structure.
  • the organic film layer is used as the filling layer 112 to fill the gap of the conductive pattern layer, the flatness of the organic film layer as the filling layer 112 is better than that of the inorganic film filling, and further, the organic film filling effect is further improved.
  • the packaging effect of the flexible package cover 100 is also better.
  • the second spacer layer 118 may be formed by depositing on the filling layer 112 by a chemical vapor deposition (CVD) method.
  • the second spacer layer 118 may be made of the same inorganic material as the first gap layer 116 to facilitate the preparation of the flexible package cover 104 and reduce the cost.
  • the release film (not shown) may be attached to the touch layer 108 by using a bonding layer 110 or a vacuum.
  • the bonding layer 110 may be formed of an adhesive layer and formed on the second spacer layer 118 by coating.
  • step S2 includes:
  • the first pattern layer 210 and the second pattern layer 212 constitute the conductive pattern layer, and the first filling film 214 and the second filling film 216 constitute the filling layer.
  • the first spacer layer 204 may be formed by depositing on the substrate 218 by a chemical vapor deposition (CVD) method.
  • the first spacer layer 204 is made of an inorganic material.
  • a conductive film may be coated on the first spacer layer 204, and a first electrode may be prepared on the conductive film by laser etching.
  • the material of the conductive film may be selected from graphene or nano silver. The patterning of the conductive film by laser etching greatly reduces the number of process steps compared to conventional photolithography processes.
  • a first lead is prepared in a printing process, and the first lead is connected to the first electrode.
  • the material of the first lead may be a conductive silver paste.
  • the first filling film 214 is an organic film, and the material of the organic film may be acrylic resin, methacrylic resin, polyester, polyethylene terephthalate, polyethylene or polypropylene.
  • the first filling film 214 may be formed on the first pattern layer 210 by a deposition method such as chemical vapor deposition or a printing process. Since a gap is generated when the first pattern layer 210 is formed in step S22, the first filling film 214 also fills the gap of the first pattern layer 210.
  • the material properties of the organic film determine that the gap of the first pattern layer 210 can be more closely filled, and the first filling film 214 using the organic film can better cushion the stress of the entire flexible package cover structure, further
  • the organic film is used as the filling of the inorganic film.
  • the flatness of the first filling film 214 is better, and in addition, since the organic film filling effect is better, the packaging effect of the flexible package cover 200 is also better.
  • the deposition method using chemical vapor deposition or the like to form the first filling film 214 is more advantageous for filling the gap of the first pattern layer 210.
  • the second spacer layer 206 may be made of the same inorganic material as the first gap layer 204 to facilitate the preparation of the flexible package cover and reduce the cost. Likewise, the second spacer layer 206 can be deposited on the first organic film 214 by a chemical gas deposition method.
  • a conductive film may be coated on the second spacer layer 206, and a second electrode may be formed on the conductive film by laser etching.
  • the material of the conductive film may be selected from graphene or nano silver. The patterning of the conductive film by laser etching greatly reduces the number of process steps compared to conventional photolithography processes.
  • a second lead is prepared by a printing process, and the second lead is connected to the second electrode.
  • the material of the second lead may be a conductive silver paste.
  • the material of the second filling film 216 may be acrylic resin, methacrylic resin, polyester, polyethylene terephthalate, polyethylene or polypropylene.
  • the second filling film 216 may be formed on the second pattern layer 212 by a deposition method such as chemical vapor deposition or a printing process. Since a gap is generated when the second pattern layer 212 is formed in step S25, the second filling film 216 also fills the gap of the second pattern layer 212.
  • the material properties of the organic film determine the gap that can more closely fill the second pattern layer 212, and the second filling film 216 using the organic film can better cushion the stress of the entire flexible package cover structure, further
  • the flatness of the organic film as the second filling film 216 is better than the filling of the inorganic film, and, in addition, the organic film filling effect It is better, so the packaging effect of the flexible package cover 200 is also better.
  • the deposition method using chemical vapor deposition or the like to form the second filling film 216 is more advantageous for filling the gap of the second pattern layer 212.
  • the third spacer layer 208 may select the same inorganic material as the first gap layer 204 to facilitate the preparation of the flexible package cover and reduce the cost. Likewise, the third spacer layer 208 can be deposited on the second fill film 216 by a chemical gas deposition method.
  • the release film (not shown) may be attached to the touch layer 202 by using a bonding layer 220 or a vacuum.
  • the bonding layer 220 may be formed of an adhesive layer and formed on the third spacer layer 208 by coating.
  • the conductive pattern layer for implementing the touch function can be formed in the flexible package cover. Therefore, related process steps such as touch panel bonding can be reduced, and at the same time, filling
  • the film covers the conductive pattern layer and fills the gap of the conductive pattern layer, which reduces the chromatic aberration of the light formed by the conductive pattern layer, and is favorable for uniformity of light output.
  • a method for fabricating a touch display device includes the following steps:
  • S2 forming a touch layer on the substrate, the touch layer comprising a filling film layer and a conductive pattern layer, the filling film layer covering the conductive pattern layer and filling a gap of the conductive pattern layer;
  • step S3 if the release film is attached to the touch layer through the bonding layer, in step S4, after the release film is removed, the display panel can be directly attached to the touch layer through the bonding layer.
  • step S3 if the release film is attached to the touch layer by vacuum, in step S4, after the release film is removed, the display layer can be attached after the bonding layer is coated on the outer surface of the spacer layer. On the touch layer.
  • the bonding layer may be cured by a curing method such as pressurization or ultraviolet curing.
  • the method for preparing the touch display device can reduce the related process steps such as touch panel bonding and the uniformity of the light output of the touch display device.

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Abstract

一种具备触摸功能的柔性封装盖板(104)，其包括基板(106)及位于该基板(106)上的触控层(108)，该触控层(108)包括填充层(112)及导电图案层(114)，该填充层(112)覆盖该导电图案层(114)且填充该导电图案层(114)的间隙。上述柔性封装盖板(104)包括有用于实现触摸功能的导电图案层(114)，能够减少了触摸面板贴合等相关工艺步骤，同时，填充层(112)覆盖导电图案层(114)且填充导电图案层(114)的间隙，减少了导电图案层(114)所形成的出光色差，有利于出光的均一性。一种柔性封装盖板(104)的制备方法、一种触摸显示装置(100)及一种触摸显示装置(100)的制备方法。

Description

柔性封装盖板及其制备方法、触摸显示装置及其制备方法 技术领域
本发明涉及触摸控制领域，更具体而言，涉及一种具备触摸功能的柔性封装盖板及一种具备触摸功能的柔性封装盖板的制备方法及一种触摸显示装置及一种触摸显示装置的制备方法。
背景技术
随着便携式电子显示装置的发展，触摸屏(touch panel)提供了一种新的人机互动界面，其在使用上更直接、更人性化。将触摸屏与平面显示面板整合在一起，形成触摸显示装置，能够使平面显示装置具有触控功能，可通过手指、触控笔等执行输入，操作更加直观、简便。
例如，中国台湾专利申请第201430792号公开了一种可挠式触控面板及使用其之可挠式触控显示器，该触控显示器包括显示面板及位于显示面板上的触控层。其中，触控层由上下两层触控感测器层及位于该两层触控感测器层之间的塑胶基材和阻气层组成。显示面板与驱动软性电路板(FPC)贴合。
然而，在专利申请第201430792号公开的触控显示器中，触控感测器层处在柔性基板上下表面，产品输出时上表面感测器仍需要有保护，而且感测器层图案间隙无填充，不利于出光的均一性。
又，中国专利申请第CN201410734964.9号公开了一种OLED触控显示装置及其制造方法。该触控显示装置包括OLED显示屏1和透明触摸屏2。其中透明触摸屏2包括在透明封装盖板12上形成的电极导电层。此电极导电层至少包括两个单位电极24、位于单位电极24交叉处的第一绝缘层26、连接单位电极24的辅助电极25及与辅助电极25电性连接的触控驱动电路23。
但是，专利申请第CN201410734964.9号公开的触控显示装置需要添加OLED封装盖板，柔性封装时仍需要封装盖板(Barrier Film)，而且多层柔性基板的存在影响效率。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此，本发明需要提供一种具备触摸功能的柔性封装盖板及一种具备触摸功能的柔性封装盖板的制备方法及一种触摸显示装置及一种触摸显示装置的制备方法。
本发明的实施方式提供一种具备触摸功能的柔性封装盖板，其包括基板及位于该基板上的触控层，该触控层包括填充层及导电图案层，该填充层覆盖该导电图案层且填充该导电图案层的间隙。
上述柔性封装盖板包括有用于实现触摸功能的导电图案层，能够减少了触摸面板贴合等相关工艺步骤，同时，填充层覆盖导电图案层且填充导电图案层的间隙，减少了导电图案层所形成的出光色差，有利于出光的均一性。
本发明的实施方式还提供一种具备触摸功能的柔性封装盖板的制备方法，其包括以下步骤：
S1：提供基板；
S2：在该基板上形成触控层，该触控层包括填充层及导电图案层，该填充层覆盖该导电图案层且填充该导电图案层的间隙；
S3：在该触控层上形成离型膜，该触控层位于该基板与该离型膜之间。
本发明的实施方式还提供一种触摸显示装置，其包括显示面板及具备触摸功能的柔性封装盖板，该柔性封装盖板包括基板及位于该基板上的触控层，该触控层包括填充层及导电图案层，该填充层覆盖该导电图案层且填充该导电图案层的间隙，该触控层与该显示面板贴合。
本发明的实施方式还提供一种触摸显示装置的制备方法，其包括以下步骤：
S1：提供基板；
S2：在该基板上形成触控层，该触控层包括填充层及导电图案层，该填充层覆盖该导电图案层且填充该导电图案层的间隙；
S3：在该触控层上形成离型膜，该触控层位于该基板与该离型膜之间；
S4：去除该离型膜，并将显示面板通过结合层贴合在该触控层；
S5：固化该结合层。
本发明的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本发明较佳实施方式的触摸显示装置的结构示意图；
图2是本发明较佳实施方式的触摸显示装置连接有柔性电路板的示意图；
图3是本发明较佳实施方式的触摸显示装置的导电图案层的结构示意图；
图4是本发明另一较佳实施方式的触摸显示装置的结构示意图；
图5是本发明较佳实施方式的柔性封装盖板的制备方法的流程示意图；及
图6是本发明较佳实施方式的触摸显示装置的制备方法的流程示意图。
具体实施方式
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通信；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开，下文中对特定例子的部件和设定进行描述。当然，它们仅仅为示例，并且目的不在于限制本发明。此外，本发明可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设定之间的关系。此外，本发明提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参阅图1，本发明第一较佳实施方式的触摸显示装置100包括显示面板102及具备触摸功能的柔性封装盖板104。
本实施方式中，显示面板102为有机发光二极管显示面板(organic light emitting diode panel，OLED panel)。OLED显示面板具有自发光、驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角及使用温度范围宽等优点，可实现柔性显示与大面积全色显示等诸多优点。显示面板102周缘可连接有柔性电路板400，该柔性电路板400用于连接显示面板102及显示面板的控制器(控制IC)，如图2所示。
该柔性封装盖板104包括基板106、位于该基板106上的触控层108及位于该触控层108上的结合层110。
在图1所示的触摸显示装置100中，基板106位于最外层。较佳地，该基板106为柔性基板，其材料可为聚对苯二甲酸乙二醇酯(polyethylene terephthalate，PET)或聚萘二甲酸乙二醇酯(polyethylene naphthalate，PEN)等材料。
该触控层108位于该基板106与该结合层110之间，该触控层108包括填充层112及导电图案层114。该填充层112覆盖该导电图案层114且填充该导电图案层114的间隙。
本实施方式中，较佳地，该触控层108包括第一间隔层116及第二间隔层118，第一间隔层116连接该基板106及该导电图案层114，该第二间隔层118连接该填充层112及该结合层110。
第一间隔层116的材料可为无机材料，第二间隔层118的材料可为无机材料，第一间隔层116及第二间隔层118可防止气体、湿气从外界渗入导电图案层114及显示面板102。具体地，本实施方式中，第一间隔层116及第二间隔层118的材料均为无机材料，如氮化物和/或氧化物形成，包括氧化钙、氧化铝、硅石、氧化钛、氧化铟、氧化硅、氮化硅、和/或氮化铝。第一间隔层116及第二间隔层118可通过化学气相沉积(CVD)方法形成在柔性封装盖板104上。
该导电图案层114包括第一图案层120及第二图案层122，该第一图案层120及该第二图案层122处于同一层，该第一图案层120及该第二图案层122之间填充有该填充层112。
请结合图2及3，第一图案层120包括第一电极124及第一引线(图未示)，第一引线连接第一电极124并用于连接外部的柔性电路板500。第二图案层122包括第二电极126及第二引线(图未示)，第二引线连接第二电极126并用于连接外部的柔性电路板500，该外部的柔性电路板500连接触控层108及触控层的控制器(控制IC)。
请参图3，作为一个例子，第一电极124及第二电极126均呈梳齿状结构，第一电极124及第二电极126间隔交叉形成导电图案。第一电极124及第二电极126可作为触摸电极。第一电极124的材料及第二电极126的材料均可采用石墨烯或纳米银线等材料，并可通过激光蚀刻的方式在导电薄膜制成相应的图案，例如可利用脉冲方式发射激光，并控制激光的强度对导电薄膜进行蚀刻。第一引线的材料及第二引线的材料均可选用导电银浆等材料，并可在第一电极124及第二电极126形成后，通过印刷工艺形成在第一间隔层116上及连接对应的电极。由于第一图案层120及第二图案层122处于同一层，因此，本实施方式的柔性封装盖板104能够减少膜层数，将柔性封装盖板104做得更轻薄、柔韧。
需要指出的是，导电图案层114的间隙包括第一图案层120本身的间隙(若有)、第二 图案层122本身的间隙(若有)及第一图案层120与第二图案层122之间所形成的间隙等所需形成导电图案层114的间隙。
填充层112可利用化学气相沉积(CVD)方法或打印工艺形成在导电图案层114上及填充导电图案层114的间隙。本实施方式中，填充层112为有机膜层。有机膜层的材料可选用丙烯酸类树脂、甲基丙烯酸类树脂、聚酯、聚对苯二甲酸乙二醇酯、聚乙烯或聚丙烯。相较于无机膜，使用有机膜层的填充层112的材料性质决定能够更紧密地填充导电图案层114的间隙，填充层112还能够更好地缓冲整个柔性封装盖板104结构的应力。进一步地，当使用有机膜层作为填充层112填充导电图案层的间隙时，相较无机膜的填充，使用有机膜层作为填充层112的平整度会更好，另外，由于有机膜填充效果更好，所以柔性封装盖板100的封装效果对应也会更好。
结合层110位于显示面板102与触控层108之间并连接显示面板102及触控层108。结合层110为粘胶层，可利用涂布或粘贴的方法将结合层110形成在第二间隔层118上。结合层110与显示面板102贴合。
综上所述，上述触摸显示装置100中，柔性封装盖板104包括有用于实现触摸功能的导电图案层114，能够减少了触摸面板贴合等相关工艺步骤，同时，填充膜112覆盖导电图案层114且填充导电图案层114的间隙，减少了导电图案层114所形成的出光色差，有利于出光的均一性。同时，与传统OLED显示面板所使用的out-cell或者on-cell的电容触摸屏相比，本发明的触摸显示装置100减少了柔性基板的使用，从而增加了OLED显示面板102的出光效率。
请参图4，本发明第二较佳实施方式提供一种触摸显示装置200。本实施方式的触摸显示装置200与第一较佳实施方式的触摸显示装置100大致相同，其不同之处在于，本实施方式的触控层202的结构不同。
在本实施方式中，该触控层202包括第一间隔层204、第二间隙层206、第三间隔层208、填充层及导电图案层，该导电图案层包括第一图案层210及第二图案层212，该填充层包括第一填充膜214及第二填充膜216。
该第一间隔层204连接基板218及该第一图案层210。较佳的，第一间隔层204为无机材料，如由氮化物和/或氧化物形成，包括氧化钙、氧化铝、硅石、氧化钛、氧化铟、氧化硅、氮化硅、和/或氮化铝。第一间隔层204可通过化学气相沉积(CVD)方法形成在基板218上。
第一图案层210包括第一电极及第一引线。可先在第一间隔层204上形成导电薄膜，再以激光(laser)蚀刻方法制备第一电极，第一电极的图案可预先设定。之后，通过印刷 工艺在第一间隔层218上形成第一引线并连接第一电极。
该第一填充膜214覆盖该第一图案层210且填充该第一图案层210的间隙。较佳地，第一填充膜214为有机膜。第一图案层210的间隙包括第一电极的图案所形成的间隙及第一引线所形成的间隙等形成所需第一图案层210的间隙。第一填充膜214的材料可选用丙烯酸类树脂、甲基丙烯酸类树脂、聚酯、聚对苯二甲酸乙二醇酯、聚乙烯或聚丙烯。该第一填充膜214可通过化学气相沉积方法或打印工艺形成在第一图案层210上。
该第二间隔层206覆盖该第一填充膜214及该第二图案层212。较佳地，第二间隔层206的材料为无机材料，如由氮化物和/或氧化物形成，包括氧化钙、氧化铝、硅石、氧化钛、氧化铟、氧化硅、氮化硅、和/或氮化铝。第二间隔层206可通过化学气相沉积(CVD)方法形成在第一有机膜214上。
第二图案层212包括第二电极及第二引线。可先在第二间隔层206上形成导电薄膜，再以激光蚀刻方法制备第二电极，第二电极的图案可预先设定。之后，通过印刷工艺在第二间隔层206上形成第二引线并连接第二电极。
该第二填充膜216覆盖该第二图案层212且填充该第二图案层212的间隙。较佳地，第二填充膜216为有机膜。第二图案层212的间隙包括第二电极的图案所形成的间隙及第二引线所形成的间隙等形成所需第二图案层212的间隙。第二填充膜216的材料可选用丙烯酸类树脂、甲基丙烯酸类树脂、聚酯、聚对苯二甲酸乙二醇酯、聚乙烯或聚丙烯。该第二填充膜216可通过化学气相沉积方法或打印工艺形成在第二图案层212上。第一填充膜214及第二填充膜216可选用同一种材料以方便柔性装置盖板的制备及节约成本。
该第三间隔层208连接该第二有机膜216及结合层220，较佳地，第三间隔层208的材料为无机材料，如由氮化物和/或氧化物形成，包括氧化钙、氧化铝、硅石、氧化钛、氧化铟、氧化硅、氮化硅、和/或氮化铝。第三间隔层208可通过化学气相沉积(CVD)方法形成在第二有机膜216上。进一步地，为了方便柔性装置盖板的制备及节约成本，第一间隙层204、第二间隔层206及第三间隔层208可选用同一种材料。
综上所述，本实施方式的触摸显示装置200的有益效果与第一较佳实施方式的触摸显示装置100的有益效果基本相同。进一步地，在实施方式中，由于第一图案层210与第二图案层212分层设置，如果第一填充膜214及第二填充膜216选用弹性材料制备，那么触摸显示装置200还能够实现感测压力触控的功能。
请参图5，本发明第三较佳实施方式的具备触摸功能的柔性封装盖板的制备方法包括以下步骤：
S1：提供基板；
S2：在该基板上形成触控层，该触控层包括填充层及导电图案层，该填充层覆盖该导电图案层且填充该导电图案层的间隙；
S3：在该触控层上形成离型膜，该触控层位于该基板与该离型膜之间。
在步骤S1中，该基板为柔性基板，其材料可为聚对苯二甲酸乙二醇酯(polyethylene terephthalate，PET)或聚萘二甲酸乙二醇酯(polyethylene naphthalate，PEN)等材料。
对于制备第一较佳实施方式的柔性封装盖板104，步骤S2包括：
S21：在基板106上形成第一间隔层116；
S22：在该第一间隔层116上形成第一图案层120及第二图案层122，该第一图案层120及该第二图案层122处于同一层，该第一图案层120及该第二图案层122构成该导电图案层114；
S23：在该导电图案层114上形成该填充层112，该填充层112填充该第一图案层120及第二图案层122之间的间隙；
S24：在该填充层112上形成第二间隔层118。
在步骤S21中，第一间隔层116可通过化学气相沉积(CVD)方法在基板上沉积而形成，较佳地，第一间隔层116的材料为无机材料。
在步骤S22中，可先在第一间隔层116上涂布(coating)一层导电薄膜，再以激光蚀刻方法在该导电薄膜制备出第一电极124及第二电极126。导电薄膜的材料可选用石墨烯或纳米银钱。采用激光蚀刻方法图案化导电薄膜，与传统光刻工艺相比，大幅度减少了工艺步骤。
之后，以印刷工艺制备第一引线及第二引线，第一引线连接第一电极124，第二引线连接第二电极126。引线的材料可选用导电银浆。
在步骤S23中，填充层112为有机膜层，其的材料可选用丙烯酸类树脂、甲基丙烯酸类树脂、聚酯、聚对苯二甲酸乙二醇酯、聚乙烯或聚丙烯。填充层112可通过化学气相沉积等沉积方法或打印工艺形成在导电图案层114上。较佳地，使用化学气相沉积等沉积方法来形成填充层112更利于填充导电图案层114的间隙。
由于在步骤S22中，形成第一图案层120及第二图案层122时产生间隙，因此，填充层112也填充导电图案层114的间隙。相较于无机膜，有机膜的材料性质决定能够更紧密地填充导电图案层114的间隙，使用有机膜层的填充层112还能够更好地缓冲整个柔性封装盖板104结构的应力。进一步地，当使用有机膜层作为填充层112填充导电图案层的间隙时，相较无机膜的填充，使用有机膜层作为填充层112的平整度会更好，另外，由于有机膜填充效果更好，所以柔性封装盖板100的封装效果对应也会更好。
在步骤S24中，第二间隔层118可通过化学气相沉积(CVD)方法在填充层112上沉积而形成。第二间隔层118可选用与第一间隙层116相同的无机材料，以方便柔性封装盖板104的制备及降低成本。
在步骤S3中，可采用结合层110或真空方式在该触控层108上贴附该离型膜(图未示)。结合层110可采用粘胶层，并采用涂布方式形成在第二间隔层118上。
对于制备第二较佳实施方式的柔性封装盖板，步骤S2包括：
S21：在基板218上形成第一间隔层204；
S22：在该第一间隔层204上形成第一图案层210；
S23：在该第一图案层210上形成第一填充膜214，该第一填充膜214填充该第一图案层210的间隙；
S24：在该第一填充膜214上形成第二间隔层206；
S25：在该第二间隔层206上形成第二图案层212；
S26：在该第二图案层212上形成第二填充膜216，该第二填充膜216填充该第二图案层212的间隙；
S27：在该第二填充膜216上形成第三间隔层208。
该第一图案层210及该第二图案层212构成该导电图案层，该第一填充膜214及该第二填充膜216构成该填充层。
在步骤S21中，第一间隔层204可通过化学气相沉积(CVD)方法在基板218上沉积而形成，较佳地，第一间隔层204选用无机材料。
在步骤S22中，可先在第一间隔层204上涂布(coating)一层导电薄膜，再以激光蚀刻方法在该导电薄膜制备出第一电极。导电薄膜的材料可选用石墨烯或纳米银钱。采用激光蚀刻方法图案化导电薄膜，与传统光刻工艺相比，大幅度减少了工艺步骤。
之后，以印刷工艺制备第一引线，第一引线连接第一电极。第一引线的材料可选用导电银浆。
在步骤S23中，第一填充膜214为有机膜，有机膜的材料可选用丙烯酸类树脂、甲基丙烯酸类树脂、聚酯、聚对苯二甲酸乙二醇酯、聚乙烯或聚丙烯。第一填充膜214可通过化学气相沉积等沉积方法或打印工艺形成在第一图案层210上。由于在步骤S22中，形成第一图案层210时产生间隙，因此，第一填充膜214也填充第一图案层210的间隙。相较于无机膜，有机膜的材料性质决定能够更紧密地填充第一图案层210的间隙，使用有机膜的第一填充膜214还能够更好地缓冲整个柔性封装盖板结构的应力，进一步地，当使用有机膜作为第一填充膜214填充导电图案层的间隙时，相较无机膜的填充，使用有机膜作为 第一填充膜214的平整度会更好，另外，由于有机膜填充效果更好，所以柔性封装盖板200的封装效果对应也会更好。较佳地，使用化学气相沉积等沉积方法来形成第一填充膜214更利于填充第一图案层210的间隙。
在步骤S24中，第二间隔层206可选用与第一间隙层204相同的无机材料，以方便柔性封装盖板的制备及降低成本。同样地，第二间隔层206可采用化学气体沉积方法在第一有机膜214上沉积形成。
在步骤S25中，可先在第二间隔层206上涂布(coating)一层导电薄膜，再以激光蚀刻方法在该导电薄膜制备出第二电极。导电薄膜的材料可选用石墨烯或纳米银钱。采用激光蚀刻方法图案化导电薄膜，与传统光刻工艺相比，大幅度减少了工艺步骤。
之后，以印刷工艺制备第二引线，第二引线连接第二电极。第二引线的材料可选用导电银浆。
在步骤S26中，第二填充膜216的材料可选用丙烯酸类树脂、甲基丙烯酸类树脂、聚酯、聚对苯二甲酸乙二醇酯、聚乙烯或聚丙烯。第二填充膜216可通过化学气相沉积等沉积方法或打印工艺形成在第二图案层212上。由于在步骤S25中，形成第二图案层212时产生间隙，因此，第二填充膜216也填充第二图案层212的间隙。相较于无机膜，有机膜的材料性质决定能够更紧密地填充第二图案层212的间隙，使用有机膜的第二填充膜216还能够更好地缓冲整个柔性封装盖板结构的应力，进一步地，当使用有机膜作为第二填充膜216填充导电图案层的间隙时，相较无机膜的填充，使用有机膜作为第二填充膜216的平整度会更好，另外，由于有机膜填充效果更好，所以柔性封装盖板200的封装效果对应也会更好。较佳地，使用化学气相沉积等沉积方法来形成第二填充膜216更利于填充第二图案层212的间隙。
在步骤S27中，第三间隔层208可选用与第一间隙层204相同的无机材料，以方便柔性封装盖板的制备及降低成本。同样地，第三间隔层208可采用化学气体沉积方法在第二填充膜216上沉积形成。
在步骤S3中，可采用结合层220或真空方式在该触控层202上贴附该离型膜(图未示)。结合层220可采用粘胶层，并采用涂布方式形成在第三间隔层208上。
综上所述，上述柔性封装盖板的制备方法中，用于实现触摸功能的导电图案层能够形成在柔性封装盖板中，因此，能够减少了触摸面板贴合等相关工艺步骤，同时，填充膜覆盖导电图案层且填充导电图案层的间隙，减少了导电图案层所形成的出光色差，有利于出光的均一性。
请参图6，本发明第四较佳实施方式的触摸显示装置的制备方法，包括以下步骤：
S1：提供基板；
S2：在该基板上形成触控层，该触控层包括填充膜层及导电图案层，该填充膜层覆盖该导电图案层且填充该导电图案层的间隙；
S3：在该触控层上形成离型膜，该触控层位于该基板与该离型膜之间；
S4：去除该离型膜，并将显示面板通过结合层贴合在该触控层；
S5：固化该结合层。
其中，步骤S1～S3的具体说明可参以上实施方式的柔性封装盖板及其制备方法。
在步骤S3中，如果离型膜是通过结合层贴附在触控层上，那么在步骤S4中，去除离型膜后可直接通过结合层将显示面板贴合在该触控层上。
在步骤S3中，如果离型膜是通过真空方式贴附在触控层上，那么在步骤S4中，去除离型膜后，可在间隔层外表面涂布结合层后，将显示面板贴合在该触控层上。
在步骤S5中，可利用加压或紫外线固化等固化方式固化结合层。
综上所述，上述触摸显示装置的制备方法能够减少了触摸面板贴合等相关工艺步骤及有利于触摸显示装置出光的均一性。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
尽管已经示出和描述了本发明的实施方式，本领域的普通技术人员可以理解：在不脱离本发明的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型，本发明的范围由权利要求及其等同物限定。

Claims (17)

  1. 一种具备触摸功能的柔性封装盖板，其特征在于，包括基板及位于该基板上的触控层，该触控层包括填充层及导电图案层，该填充层覆盖该导电图案层且填充该导电图案层的间隙。
  2. 如权利要求1所述的具备触摸功能的柔性封装盖板，其特征在于，该填充层是有机膜层。
  3. 如权利要求1所述的具备触摸功能的柔性封装盖板，其特征在于，该触控层包括第一间隔层及第二间隔层，第一间隔层连接该基板及该导电图案层，该导电图案层包括第一图案层及第二图案层，该第一图案层及该第二图案层处于同一层，该第一图案层及该第二图案层之间填充有该填充层，该第二间隔层连接该填充层。
  4. 如权利要求3所述的具备触摸功能的柔性封装盖板，其特征在于，该第一间隔层的材料为无机材料，该第二间隔层的材料为无机材料。
  5. 如权利要求1所述的具备触摸功能的柔性封装盖板，其特征在于，该触控层包括第一间隔层、第二间隙层及第三间隔层，该导电图案层包括第一图案层及第二图案层，该填充层包括第一填充膜及第二填充膜；
    该第一间隔层连接该基板及该第一图案层；
    该第一填充膜覆盖该第一图案层且填充该第一图案层的间隙；
    该第二间隔层连接该第一填充膜及该第二图案层；
    该第二填充膜覆盖该第二图案层且填充该第二图案层的间隙；
    该第三间隔层连接该第二填充膜。
  6. 如权利要求5所述的具备触摸功能的柔性封装盖板，其特征在于，该第一间隔层的材料为无机材料，该第二间隔层的材料为无机材料，该第三间隔层的材料为无机材料。
  7. 如权利要求1所述的具备触摸功能的柔性封装盖板，其特征在于，该柔性封装盖板还包括结合层，该结合层位于该触控层上，该触控层位于该基板与该结合层之间。
  8. 一种具备触摸功能的柔性封装盖板的制备方法，其特征在于，包括以下步骤：
    S1：提供基板；
    S2：在该基板上形成触控层，该触控层包括填充层及导电图案层，该填充层覆盖该导电图案层且填充该导电图案层的间隙；
    S3：在该触控层上形成离型膜，该触控层位于该基板与该离型膜之间。
  9. 如权利要求8所述的具备触摸功能的柔性封装盖板的制备方法，其特征在于，步骤S2包括以下步骤：
    S21：在该基板上形成第一间隔层；
    S22：在该第一间隔层上形成第一图案层及第二图案层，该第一图案层及该第二图案层处于同一层，该第一图案层及该第二图案层构成该导电图案层；
    S23：在该导电图案层上形成该填充层，该填充层填充该第一图案层及第二图案层之间的间隙；
    S24：在该填充层上形成第二间隔层。
  10. 如权利要求9所述的具备触摸功能的柔性封装盖板的制备方法，其特征在于，该第一间隔层的材料为无机材料，该第二间隔层的材料为无机材料。
  11. 如权利要求8所述的具备触摸功能的柔性封装盖板的制备方法，其特征在于，步骤S2包括以下步骤：
    S21：在该基板上形成第一间隔层；
    S22：在该第一间隔层上形成第一图案层；
    S23：在该第一图案层上形成第一填充膜，该第一填充膜填充该第一图案层的间隙；
    S24：在该第一填充膜上形成第二间隔层；
    S25：在该第二间隔层上形成第二图案层；
    S26：在该第二图案层上形成第二填充膜，该第二填充膜填充该第二图案层的间隙；
    S27：在该第二填充膜上形成第三间隔层；
    该第一图案层及该第二图案层构成该导电图案层，该第一填充膜及该第二填充膜构成该填充层。
  12. 如权利要求11所述的具备触摸功能的柔性封装盖板的制备方法，其特征在于，该 第一间隔层的材料为无机材料，该第二间隔层的材料为无机材料，该第三间隔层的材料为无机材料。
  13. 如权利要求8所述的具备触摸功能的柔性封装盖板的制备方法，其特征在于，步骤S3包括：采用结合层或真空方式在该触控层上贴附该离型膜。
  14. 一种触摸显示装置，其特征在于，包括显示面板及具备触摸功能的柔性封装盖板，该柔性封装盖板包括基板及位于该基板上的触控层，该触控层包括填充层及导电图案层，该填充层覆盖该导电图案层且填充该导电图案层的间隙，该触控层与该显示面板贴合。
  15. 如权利要求14所述的触摸显示装置，其特征在于，该触控层包括第一间隔层及第二间隔层，第一间隔层连接该基板及该导电图案层，该导电图案层包括第一图案层及第二图案层，该第一图案层及该第二图案层处于同一层，该第一图案层及该第二图案层之间填充有该填充层，该第二间隔层连接该填充层。
  16. 如权利要求13所述的触摸显示装置，其特征在于，该触控层包括第一间隔层、第二间隙层及第三间隔层，该导电图案层包括第一图案层及第二图案层，该填充层包括第一填充膜及第二填充膜；
    该第一间隔层连接该基板及该第一图案层；
    该第一填充膜覆盖该第一图案层且填充该第一图案层的间隙；
    该第二间隔层连接该第一填充膜及该第二图案层；
    该第二填充膜覆盖该第二图案层且填充该第二图案层的间隙；
    该第三间隔层连接该第二填充膜。
  17. 一种触摸显示装置的制备方法，其特征在于，包括以下步骤：
    S1：提供基板；
    S2：在该基板上形成触控层，该触控层包括填充层及导电图案层，该填充层覆盖该导电图案层且填充该导电图案层的间隙；
    S3：在该触控层上形成离型膜，该触控层位于该基板与该离型膜之间；
    S4：去除该离型膜，并将显示面板通过结合层贴合在该触控层；
    S5：固化该结合层。
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