WO2016204419A1 - Capteur tactile de panneau d'écran tactile comprenant un modèle de bobine électrique pour stylo électronique et son procédé de fabrication, et panneau d'écran tactile comprenant le capteur - Google Patents

Capteur tactile de panneau d'écran tactile comprenant un modèle de bobine électrique pour stylo électronique et son procédé de fabrication, et panneau d'écran tactile comprenant le capteur Download PDF

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Publication number
WO2016204419A1
WO2016204419A1 PCT/KR2016/005495 KR2016005495W WO2016204419A1 WO 2016204419 A1 WO2016204419 A1 WO 2016204419A1 KR 2016005495 W KR2016005495 W KR 2016005495W WO 2016204419 A1 WO2016204419 A1 WO 2016204419A1
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WIPO (PCT)
Prior art keywords
touch
pattern
power coil
screen panel
coil pattern
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PCT/KR2016/005495
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English (en)
Korean (ko)
Inventor
김종수
유정상
권오정
Original Assignee
주식회사 아모그린텍
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Publication of WO2016204419A1 publication Critical patent/WO2016204419A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0442—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using active external devices, e.g. active pens, for transmitting changes in electrical potential to be received by the digitiser

Definitions

  • the present invention relates to a touch sensor for a touch screen panel having a power coil pattern for an electronic pen, a method for manufacturing the same, and a touch screen panel including the same. More specifically, the power coil pattern for an electronic pen has an outer circumference of a circuit pattern for touch sensing.
  • the present invention relates to a touch sensor for a touch screen panel having a power coil pattern for an electronic pen and a method for manufacturing the same, and a touch screen panel including the same. .
  • a capacitive type is mainly used.
  • a touch sensor having a transparent electrode on a transparent film is bonded to a cover glass.
  • the touch sensor is manufactured by coating an electrode material, that is, indium tin oxide (ITO) on one surface of a transparent film, and forming a sensing electrode by an etching process.
  • ITO indium tin oxide
  • two touch sensors for a touch screen panel in which ITO sensing electrodes are formed on a film substrate and a GFF method using tempered glass are mainly used.
  • the two sensors are each formed with an X-axis sensor or a Y-axis sensor.
  • a finger touch method or a passive stylus pen is mainly used as an input means.
  • the finger touch method does not satisfy the needs of the consumer's pen input method due to difficult touch input due to the problem of touch area.
  • the passive stylus pen is not only a simulation of the finger, it is difficult to express precisely, and it is difficult to segment and recognize the pen pressure.
  • an active electronic pen using an electromagnetic induction method is used to enable more precise and detailed expression according to the pen pressure when the touch screen panel is input.
  • a digitizer including an X-axis sensing electrode and a Y-axis sensing electrode is added to the lower portion of the LCD panel separately from the touch sensor.
  • a digitizer including an X-axis sensing electrode and a Y-axis sensing electrode is added to the lower portion of the LCD panel separately from the touch sensor.
  • the active electronic pen must have its own power source such as a battery in order to electromagnetically interact with the sensing area of the digitizer.
  • the electronic pen is preferably configured to operate by itself by receiving energy from the outside wirelessly without a separate battery, and for this purpose, Korean Patent Registration No. 0910348 has been proposed. .
  • the 'coordinate input device' is a loop-type excitation coil unit for generating an induced voltage to the electronic pen, a horizontal antenna including a plurality of parallel lines arranged for sensing the electronic pen, and arranged to be orthogonal to the horizontal antenna. And a coordinate input device including a vertical antenna including a plurality of lines arranged in parallel with each other and mounted on a lower portion of the LCD separately from the touch sensor in the touch screen panel to detect the electronic pen.
  • the 'coordinate input device' is mounted on the lower part of the LCD separately from the touch sensor in the touch screen panel, and the induction voltage in the excitation coil part passes through the LCD panel, the touch sensor and the cover glass, and then the electronic pen. Due to the transmission to the power supply to the electronic pen is often not made smoothly occurs.
  • the excitation coil part is disposed below the LCD panel and is disposed around the horizontal antenna and the vertical antenna, there is a problem in that sensing in the center portion of the touch screen panel is not smooth.
  • the present invention has been made in view of the above, and provided with a power coil pattern in the touch sensor for a touch screen panel attached to a cover in which the electronic pen is in direct contact with the electronic pen to stably supply power to the electronic pen.
  • An object of the present invention is to provide a cover for a touch screen panel having a power coil pattern for an electronic pen that improves convenience and operational reliability when using the same, a manufacturing method thereof, and a touch screen panel including the same.
  • Touch screen panel touch sensor having a power coil pattern for an electronic pen according to an embodiment of the present invention for achieving the above object is provided on a transparent substrate, the transparent substrate, formed to sense a touch on the touch screen panel And a power coil pattern formed on a touch sensing circuit pattern and a coil shape surrounding the touch sensing circuit pattern on the transparent substrate to generate an induced voltage with an electronic pen.
  • the touch sensing circuit pattern may sense a touch in a capacitive manner.
  • the transparent substrate includes a first connection terminal portion in which the connection pattern is connected to the capacitive touch sensing circuit in the touch sensing circuit pattern and a power connection pattern in which the power supply pattern is connected to the power supply unit in the power coil pattern.
  • Two connection terminals may be provided.
  • the touch sensing circuit pattern has a fine line width that is invisible on the display panel unit, and the power coil pattern has a wider line width than the touch sensing circuit pattern to form an electromagnetic force transmitted to the resonant circuit in the electronic pen. It may be formed thick or thick.
  • the power coil pattern may be formed by firing a conductive paste.
  • the conductive paste may be any one of silver paste, copper (Cu) paste, and aluminum (Al) paste.
  • the power coil pattern may be formed of a conductive deposition layer, and includes a sensing lead pattern connecting the touch sensing circuit pattern with a capacitive touch sensing circuit, and a power connection pattern connecting the power coil pattern with a power supply. It may be formed as a deposition layer.
  • the touch sensing circuit pattern and the power coil pattern may include a seed layer formed on the transparent substrate; And a plating layer deposited by plating on the seed layer.
  • the touch sensing circuit pattern and the power coil pattern may further include a plating affinity layer stacked between the seed layer and the plating layer.
  • the seed layer is a deposited thin film layer formed through the deposition, the deposited thin film layer is chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (TiW) ) And copper (Cu).
  • Cr chromium
  • Mo molybdenum
  • Ti titanium
  • W tungsten
  • NiCr nickel chromium
  • TiW titanium tungsten alloy
  • Cu copper
  • the seed layer may be an oxide film or a nitride film.
  • the oxide film is any one of titanium oxide (TiO 2), chromium oxide (CrO 2), copper oxide (CuO), nickel oxide (NiO), aluminum oxide (Al 2 O 3), silver oxide (AgO), and the nitride film is titanium nitride (TiN) or copper nitride (CuN).
  • the seed layer is formed of a conductive ink or a conductive paste
  • the conductive ink or the conductive paste may include a conductive powder and a black-based blackening agent.
  • the plating affinity layer may include any one of copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and palladium (Pd). .
  • a method of manufacturing a touch sensor for a touch screen panel having a power coil pattern the substrate preparing step of preparing a transparent substrate; And a coil pattern surrounding the circumference of the touch sensing circuit pattern formed to sense a touch on the touch screen panel and the touch sensing circuit pattern on the transparent substrate to form a power coil pattern generating an induced voltage with an electronic pen. It characterized in that it comprises a circuit pattern forming step.
  • the circuit pattern forming step may include forming a touch sensing circuit pattern on the transparent substrate and printing the conductive paste in the shape of the power coil pattern around the touch sensing circuit pattern on the transparent substrate. And baking the conductive paste.
  • the printing process using the conductive paste may include a power supply coil pattern, a sensing lead pattern connecting the touch sensing circuit pattern with a capacitive touch sensing circuit, and a power connection connecting the power coil pattern with a power supply using a conductive paste. Patterns can be printed together on the transparent substrate.
  • the circuit pattern forming step may include forming a touch sensing circuit pattern on the transparent substrate; And transferring the metal foil punched out in the shape of the power coil pattern onto the transparent substrate.
  • the circuit pattern forming step may include forming a touch sensing circuit pattern on the transparent substrate, forming a conductive deposition layer around the touch sensing circuit pattern on the transparent substrate, and the touch sensing. And etching the conductive deposition layer so that a power coil pattern is formed around the circuit pattern.
  • the etching of the conductive deposition layer may include a sensing lead pattern connecting the power coil pattern, the touch sensing circuit pattern with a capacitive touch sensing circuit, and a power connection pattern connecting the power coil pattern with a power supply. Can be formed by etching simultaneously.
  • the forming of the circuit pattern may further include plating at least one of the power coil pattern, the sensing lead pattern, and the power connection pattern after the etching of the conductive deposition layer.
  • the circuit pattern forming step may include forming a seed layer on a transparent substrate, forming a photoresist layer on the seed layer, and having a shape corresponding to the touch sensing circuit pattern on the photoresist layer.
  • the etching may include the step of etching the seed layer.
  • the circuit pattern forming step may further include forming a plating affinity layer on the seed layer after forming the seed layer and before forming the photoresist layer.
  • the circuit pattern forming step may include forming a seed layer on the transparent substrate, removing the touch sensing circuit pattern and the power coil pattern from the seed layer, and removing the seed layer. And plating the seed layer remaining on the transparent substrate.
  • the forming of the circuit pattern may further include forming a plating affinity layer on the seed layer before the etching process after forming the seed layer.
  • Touch screen panel for achieving the above object is a display panel unit for outputting a screen, the touch screen panel touch according to any one embodiment of the present invention provided on the display panel unit
  • a sensor may include a cover for a touch screen panel attached to the touch sensor for the touch screen panel.
  • the touch screen panel is disposed below the display panel unit, the digitizer unit for detecting the position of the electronic pen to operate by generating energy from the power coil pattern using an electromagnetic induction method It may further include.
  • the touch screen panel cover may include a bezel layer covering the bezel portion, and the power coil pattern may be covered by the bezel layer.
  • the present invention is provided with a power coil pattern for the electronic pen in the touch sensor for detecting a touch on the touch screen panel to provide a stable wireless power supply to the electronic pen, and improve the convenience and operation reliability of the electronic pen.
  • the present invention has the effect of simplifying the manufacturing process and reducing the manufacturing cost by simultaneously forming a touch sensing circuit pattern and a power coil pattern of the touch sensor.
  • the present invention can wirelessly charge other portable terminals capable of wireless charging, thereby greatly improving the merchandise.
  • FIG. 1 is a plan view showing an embodiment of a touch sensor for a touch screen panel having a power coil pattern for an electronic pen according to the present invention
  • FIG. 2 is a perspective view showing another example of a touch sensor for a touch screen panel having a power coil pattern for an electronic pen according to the present invention
  • 3 to 6 are cross-sectional views showing an embodiment of a touch sensor for a touch screen panel having a power coil pattern for an electronic pen according to the present invention.
  • FIG. 7 is a process diagram showing an embodiment of a touch sensor manufacturing method for a touch screen panel according to the present invention
  • FIG. 8 is a schematic diagram illustrating a method of manufacturing a touch sensor for a touch screen panel of FIG. 7;
  • FIG. 9 is a process diagram showing another embodiment of the touch sensor manufacturing method for a touch screen panel according to the present invention.
  • FIG. 10 is a schematic diagram illustrating a method of manufacturing a touch sensor for a touch screen panel of FIG. 9;
  • FIG. 11 is a process diagram showing another embodiment of the touch sensor manufacturing method for a touch screen panel according to the present invention
  • FIG. 12 is a schematic diagram illustrating a method of manufacturing a touch sensor for a touch screen panel of FIG. 11.
  • FIG. 13 is a process diagram showing another embodiment of the touch sensor manufacturing method for a touch screen panel according to the present invention
  • FIG. 14 is a schematic diagram illustrating a method of manufacturing a touch sensor for a touch screen panel of FIG. 13.
  • 15 is a process diagram showing another embodiment of the method for manufacturing a touch sensor for a touch screen panel according to the present invention.
  • FIG. 16 is a schematic diagram illustrating a method of manufacturing a touch sensor for a touch screen panel of FIG. 15.
  • FIG. 17 is a process diagram showing another embodiment of the method for manufacturing a touch sensor for a touch screen panel according to the present invention.
  • FIG. 18 is a schematic diagram illustrating a method of manufacturing a touch sensor for a touch screen panel of FIG. 17.
  • FIG. 19 is a process diagram showing another embodiment of the touch sensor manufacturing method for a touch screen panel according to the present invention.
  • FIG. 20 is a schematic diagram illustrating a method of manufacturing a touch sensor for a touch screen panel of FIG. 19.
  • 21 is a schematic diagram illustrating a touch screen panel according to the present invention.
  • FIG. 1 is a plan view illustrating a touch sensor for a touch screen panel having a power coil pattern for an electronic pen according to the present invention.
  • a touch sensor for a touch screen panel having a power coil pattern for an electronic pen includes a transparent substrate 10.
  • the transparent substrate 10 may be a transparent PI film, and may be one of a polyethylene naphthalate (PEN) film, a polyethylene terephthalate (PET) film, a polycarbonate (PC) film, and a polystyrene sulfonate (PSS) film.
  • PEN polyethylene naphthalate
  • PET polyethylene terephthalate
  • PC polycarbonate
  • PSS polystyrene sulfonate
  • Transparent films such as engineering plastics can be used.
  • a touch sensing circuit pattern 20 formed to sense a touch in the touch screen panel is provided.
  • the touch sensing circuit pattern 20 is provided on the transparent substrate 10 and is provided on the X-axis sensing circuit unit 21 or the transparent substrate 10 including a plurality of X-axis electrodes spaced apart in the horizontal direction.
  • the Y-axis sensing circuit unit 22 including a plurality of Y-axis electrodes spaced apart in the direction.
  • the plurality of X-axis electrodes spaced apart in the lateral direction and the plurality of Y-axis electrodes spaced in the longitudinal direction are connected to an external circuit through a trace electrode, and as an example of the external circuit, there is a capacitive multi-touch control unit.
  • the touch control unit is electrically connected to the main process of the electronic device.
  • the transparent substrate 10 may have X-axis sensing circuits 21 and Y-axis sensing circuits 22 respectively formed on both surfaces thereof.
  • FIG. 2 is a perspective view illustrating a touch sensor for a touch screen panel having a power coil pattern for an electronic pen according to the present invention, and referring to FIG. 2, for a touch screen panel with a power coil pattern for an electronic pen according to the present invention.
  • the touch sensor is formed of one of the X-axis sensing circuit unit 21 and the Y-axis sensing circuit unit 22 on the transparent substrate 10, and the X-axis sensing circuit unit 21 and Y-axis on the other transparent substrate 10 '.
  • One of the sensing circuit units 22 may be formed so that two transparent substrates 10 are stacked and attached to each other by the transparent adhesive layer 400.
  • the X-axis electrode and the Y-axis electrode is an example in which a plurality of touch sensor electrodes formed in a metal mesh shape of a rhombus shape is electrically connected.
  • a coil shaped power coil pattern 30 surrounding the circumference of the touch sensing circuit pattern 20 is provided.
  • the power coil pattern 30 is formed on the bezel portion of the cover for the touch screen panel on the transparent substrate 10.
  • the power coil pattern 30 generates an induced voltage with an electronic pen.
  • an alternating voltage is applied to the coil pattern of a loop shape wound around the touch sensing circuit pattern 20 a plurality of times, an electromagnetic force is generated.
  • the electromagnetic force is transmitted to the resonant circuit in the electronic pen to generate energy induced by the resonant circuit in the electronic pen.
  • the electronic pen includes a resonant circuit that receives the electromagnetic force of the power coil pattern 30, and the resonant circuit receives the electromagnetic force of the power coil pattern 30 to generate energy induced to supply power. Without a separate battery for itself to emit an electromagnetic force, it is detected by the touch sensing circuit pattern included in the touch sensor for a touch screen panel according to the present invention or the digitizer unit included in the touch screen panel according to the present invention.
  • the touch sensing circuit pattern 20 senses a touch in a capacitive manner, and the transparent substrate 10 has a capacitive touch on the touch sensing circuit pattern 20.
  • the first connection terminal part 40 on which the sensing input pattern 41 is connected to the sensing circuit and the second connection terminal part 50 on which the power connection pattern 51 connected to the power supply unit are arranged in the power coil pattern 30. ) Is provided.
  • the touch sensing circuit pattern 20 is a circuit pattern formed on a transparent substrate and not having visibility with a fine line width not visible on the display panel unit, and the power coil pattern 30 is a resonance in the electronic pen.
  • the line width is wider or thicker than the touch sensing circuit pattern 20 and is covered by the bezel part formed on the cover for the touch screen panel.
  • FIGS. 3 to 6 are cross-sectional views illustrating embodiments of a touch screen panel touch sensor having a power coil pattern for an electronic pen according to the present invention, and the touch sensing circuit pattern 20 in FIGS. 3 to 6.
  • the line width and the interval between are shown to clearly explain the configuration of the present invention and are different from the actual ones.
  • the touch sensing circuit pattern 20 may be variously modified to have a fine line width and an interval having invisible transparency in the actual touch screen panel. do.
  • the touch sensing circuit pattern 20 may include a seed layer 1 formed on the transparent substrate 10; And it may include a plating layer (2) to be laminated by plating on the seed layer (1).
  • the touch sensing circuit pattern 20 may further include a plating affinity layer 3 stacked between the seed layer 1 and the plating layer 2.
  • the plating affinity layer 3 allows the seed layer 1 to be smoothly plated and at the same time increases the bonding force between the plating layer 2 and the seed layer 1 so that the touch pattern of the circuit pattern 20 can be
  • the durability is further improved, and the shape of the touch sensing circuit pattern 20 can be maintained even when the transparent substrate 10 is deformed, such as bending deformation of the transparent substrate 10.
  • the power coil pattern 30 may be formed by firing a conductive paste.
  • the said conductive paste contains a conductive metal powder and a binder.
  • the conductive metal powder may be one selected from silver, copper, aluminum and nickel, or a mixture of two or more selected.
  • the said conductive paste is silver paste containing silver powder, a polymer resin, and a solvent.
  • the silver paste includes 73 wt% to 88 wt% of silver powder, 5.9 wt% to 9.5 wt% of polymer resin, and 5.7 wt% to 18.0 wt% of solvent.
  • the silver paste may further include 0.35 wt% to 2.90 wt% of a dispersant.
  • the polymer resin includes a polyester-based resin and has an molecular weight of 25,000 as an example.
  • the silver powder is an example that the particle size is 50nm ⁇ 5 ⁇ m, preferably 0.5 ⁇ 1.2 ⁇ m.
  • the silver powder has a problem that it is difficult to achieve resistance of 30 ⁇ or less, preferably 23 ⁇ or less, in the silver powder of more than 5 ⁇ m because the silver powder has a small particle size to move well in printing and the silver powder adheres to each other during firing.
  • the conductive paste may be a copper (Cu) paste containing Cu powder or an aluminum (Al) paste containing Al powder in addition to the silver paste.
  • the power coil pattern 30 may be attached to the punched metal foil.
  • the metal foil may be any one of silver foil, copper foil, and aluminum foil as an example, and may be attached to an adhesive layer provided between the metal foil and the transparent substrate 10.
  • the power coil pattern 30 may be formed of a conductive deposition layer, and the conductive deposition layer may be formed by depositing any one of copper, silver, aluminum, gold, and molybdenum.
  • the power coil pattern 30 may include a sensing lead pattern 41 connecting the touch sensing circuit pattern 20 to a capacitive touch sensing circuit, and a power supply connecting the power coil pattern 30 to a power supply unit.
  • the conductive pattern is formed together with the connection pattern 51.
  • the power coil pattern 30 may further include a plating layer 2 formed on the conductive deposition layer, and the plating layer 2 may be any one of copper, silver, aluminum, and gold.
  • the power coil pattern 30 may include the same seed layer 1 as the touch sensing circuit pattern 20; And it may include a plating layer (2) to be laminated by plating on the seed layer (1).
  • the touch sensing circuit pattern 20 may further include a plating affinity layer 3 stacked between the seed layer 1 and the plating layer 2.
  • the seed layer 1 is formed of a conductive ink or a conductive paste and has a light reflectance of 30% or less.
  • the seed layer 1 may be formed of a conductive ink or a conductive paste.
  • the conductive ink or the conductive paste may serve to reduce diffuse reflection of light by forming the seed layer 1 in a black series.
  • the conductive ink or the conductive paste may include a conductive powder
  • the conductive powder may include chromium (Cr) powder, molybdenum (Mo) powder, titanium (Ti) powder, tungsten (W) powder, and nickel chromium (NiCr).
  • An example may include at least one of powder, titanium tungsten alloy (TiW) powder, silver powder, copper powder, gold powder, and aluminum powder.
  • the conductive ink or the conductive paste contains at least one of the conductive powders having excellent conductivity, and it may be found that the two conductive powders may be mixed.
  • the conductive ink or the conductive paste may include a black-based conductive powder and a blackening agent, and the conductive powder may be at least one of silver powder, copper powder, gold powder, and aluminum powder.
  • the blackening agent is included in the conductive ink or the conductive paste so that the conductive ink or the conductive paste has a light reflectance of 30% or less, and at least one of carbon black or carbon nanotubes
  • the conductive ink or the conductive paste may be applied to any color that can form a black-based color, that is, a light reflectance of 30% or less, and it is more preferable that the conductivity is excellent.
  • the conductive ink may be at least one of carbon black ink and carbon nanotube ink
  • the conductive paste may be at least one of carbon black paste and carbon nanotube paste.
  • the seed layer 1 may be formed by drying or baking a conductive ink or a conductive paste. It is preferable that the seed layer 1 lowers the resistance by firing the conductive ink or the conductive paste and increases the adhesion to the substrate.
  • the seed layer 1 may be formed through deposition, and the seed layer 1 may be formed by vacuum deposition and is chromium (Cr) as an example.
  • Cr chromium
  • Mo molybdenum
  • Titanium Ti
  • tungsten W
  • NiCr nickel chromium
  • titanium tungsten alloy TiW
  • Cu copper
  • Mo molybdenum
  • titanium (Ti) tungsten
  • NiCr nickel chromium
  • TiW nickel chromium
  • TiW titanium tungsten alloy
  • TiW nickel chromium
  • TiW titanium tungsten alloy
  • TiW an alloy containing at least two of copper (Cu)
  • Mo molybdenum
  • TiW titanium tungsten alloy
  • TiW an alloy containing at least one of copper
  • the seed layer 1 uses a metal having excellent adhesion to the transparent substrate 10 and minimizing light scattering.
  • the seed layer 1 is attached on the transparent substrate 10 by vacuum deposition, so that the adhesive force with the transparent substrate 10 is strong, and is not separated from the transparent substrate 10 even in the bending deformation of the transparent substrate 10. It can be maintained firmly attached to the transparent substrate 10 without.
  • the seed layer 1 is thermally deposited copper (Cu), and the copper (Cu) is not only excellent in bonding strength with the plating layer 2 in a plating-friendly manner, but also black in thermal deposition.
  • the seed layer 1 may be an oxide film or a nitride film, and the oxide film may be titanium oxide (TiO 2 ), chromium oxide (CrO 2 ), copper oxide (CuO), nickel oxide (NiO), or aluminum oxide (Al 2 O 3). ) And silver oxide (AgO) as an example, and the nitride film is titanium nitride (TiN) or copper nitride (CuN) as an example.
  • the seed layer 1 is preferably a dark colored metal that absorbs light, and more preferably black metal after deposition, that is, a metal having a light reflectance of 30% or less.
  • the seed layer 1 has a light reflectance of 30% or less, thereby minimizing light scattering to increase transparency and preventing glare to improve visibility of the touch screen panel.
  • the seed layer 1 has a thickness of 500 kPa to 10,000 kPa, and in the present invention, the seed layer 1 is an example.
  • the plating layer 2 is one of gold (Au), silver (Ag) and copper (Cu) as an example, an alloy containing at least one of gold (Au), silver (Ag), copper (Cu) It may be.
  • the plating layer 2 serves to lower the resistance of the touch sensing circuit pattern 20, to adjust the overall resistance of the touch sensing circuit pattern 20 lower, and to adjust the touch sensing circuit pattern 20 by adjusting the thickness. You can adjust the resistance value of).
  • the plating layer 2 may be formed by being stacked on the seed layer 1 to cover only the top surface of the seed layer 1 except for the circumference of the seed layer 1.
  • the plating layer 2 is formed so as to cover only the top surface of the seed layer 1 excluding the circumference of the seed layer 1, that is, the side surface, and for the touch sensing through the thickness control stacked on the seed layer 1.
  • the resistance of the circuit pattern 20 can be adjusted.
  • the plating layer 2 is formed so as to cover only the top surface of the seed layer 1 excluding the periphery, that is, the side surface of the seed layer 1, and does not affect the line width of the touch sensing circuit pattern 20, and the fine line width. Can be accurately implemented at the line width determined by the design, thereby allowing the resistor to be adjusted to meet the tolerances within the design accuracy at the same time.
  • the plating layer 2 is formed in a shape surrounding the outer periphery of the seed layer 1, and may have a shape covering the surface and both sides of the seed layer 1, for example.
  • the plating affinity layer 3 allows the seed layer 1 to be smoothly plated and at the same time increases the bonding force between the plating layer 2 and the seed layer 1 so that the touch pattern of the circuit pattern 20 can be
  • the durability is further improved, and the shape of the touch sensing circuit pattern 20 can be maintained even when the transparent substrate 10 is deformed, such as bending deformation of the transparent substrate 10.
  • the plating affinity layer 3 is one using copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), palladium (Pd) As an example, it is noted that any plating-friendly metal can be used.
  • the plating affinity layer 3 is formed of a conductive ink or a conductive paste including a plating-friendly metal powder, and the plating-friendly metal powder is copper (Cu), nickel (Ni), silver (Ag), or gold ( At least one powder containing Au), tin (Sn), aluminum (Al), and palladium (Pd) is taken as an example, and at least two powders may be used in combination.
  • the plating-friendly metal powder is copper (Cu), nickel (Ni), silver (Ag), or gold ( At least one powder containing Au), tin (Sn), aluminum (Al), and palladium (Pd) is taken as an example, and at least two powders may be used in combination.
  • the plating affinity layer 3 is formed by drying or baking a conductive ink or a conductive paste including a plating-friendly metal powder.
  • the plating affinity layer 3 is preferably formed of a conductive ink or conductive paste containing the same metal powder as that of the metal forming the plating layer 2 having affinity for the metal forming the plating layer 2. Do.
  • the plating affinity layer 3 deposits at least one of copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and palladium (Pd).
  • the formed metal vapor deposition layer may be sufficient.
  • the touch sensor panel touch sensor manufacturing method having a power coil pattern having a power coil pattern according to an embodiment of the present invention, the substrate preparation step of preparing a transparent substrate 10 (S100), the touch on the transparent substrate 10
  • the power coil pattern 30 is formed in a coil shape surrounding the touch sensing circuit pattern 20 and the touch sensing circuit pattern 20 formed to sense a touch in the screen panel to generate an induced voltage with an electronic pen.
  • Forming circuit pattern forming step (S200) is included.
  • circuit patterns for touch sensing on the transparent substrate 10 in the circuit pattern forming step (S200) of the touch sensor panel touch sensor manufacturing method having a power coil pattern according to an embodiment of the present invention An example of forming the power coil pattern 30 after forming 20 is illustrated.
  • the circuit pattern forming step (S200) may include forming a touch sensing circuit pattern 20 on the transparent substrate 10 (S201) and the transparent substrate 10. Printing a conductive paste in the shape of the power coil pattern 30 around the touch sensing circuit pattern 20 (S201a); And firing the conductive paste (S202).
  • the touch sensing circuit pattern 20 for example, forming a transparent ITO sensing electrode that is the touch sensing circuit pattern 20.
  • the process of printing with the conductive paste includes a power supply coil pattern 30, a sensing lead pattern 41 connecting the touch sensing circuit pattern 20 with a capacitive touch sensing circuit using a conductive paste, and the power coil.
  • the power connection pattern 51 connecting the pattern 30 to the power supply unit is printed together on the transparent substrate 10.
  • the firing process (S202) is less than the potential point (Tg) of the transparent substrate 10, it is an example that the firing at 200 °C ⁇ 450 °C.
  • the firing process (S202) is to control the temperature in accordance with the transparent substrate 10, the conductive paste is fired without damage or deformation of the transparent substrate 10 to the power coil pattern 30 of a predetermined resistance value or less To be formed.
  • the circuit pattern forming step (S200) may be performed by separately forming the touch sensing circuit pattern 20 on the transparent substrate 10 first, and then the power coil pattern 30 and the touch sensing circuit pattern 20. ) Can be formed on the transparent substrate 10 at the same time the sensing lead pattern 41 for connecting the capacitive touch sensing circuit and the power connection pattern 51 for connecting the power coil pattern 30 to the power supply. .
  • the circuit pattern forming step (S200) may include forming a touch sensing circuit pattern 20 on the transparent substrate 10 (S201) and a power coil pattern 30. It may also include the step (S203) of transferring the metal foil punched in the shape of the on the transparent substrate 10.
  • a circuit for sensing touch is formed on the transparent substrate 10 other than forming an ITO sensing electrode which is the touch sensing circuit pattern 20 by etching. It should be noted that the deformation may be carried out by any known method for forming the pattern 20.
  • the metal foil other than the power coil pattern 30 patterned in the transfer film is removed to form the power coil pattern 30, and then the power coil pattern 30 is formed on the transparent substrate ( Transfer to 10) and attach to the transparent substrate 10 as an adhesive layer as an example.
  • Transferring the power coil pattern 30 to the transparent substrate 10 includes an adhesive layer on one surface of the transparent substrate 10 or the surface of the power coil pattern 30 to the transfer film.
  • the laminated power supply coil pattern 30 is transferred to one surface of the transparent substrate 10.
  • the adhesive layer provided on the transparent substrate 10 is formed of an adhesive having a stronger adhesive force than that of the adhesive layer to which the metal foil is adhered in the transfer film, and the power coil pattern 30 maintained in a state of being adhered to the transfer film. This can be smoothly transferred to the transparent substrate (10).
  • the metal foil except for the power coil pattern 30 is removed from the transfer film, and one surface of the transfer film is formed after forming an adhesive layer on one surface of the transparent substrate 10.
  • the power coil pattern 30 is transferred to the transparent substrate 10 by arranging and overlapping one surface of the transparent substrate 10 and thermocompression bonding.
  • the transfer film is separated from the transparent substrate 10 after thermal compression.
  • the metal foil except for the power coil pattern 30 may hold the power coil pattern 30 with a jig capable of pressing a part or all of the power coil pattern 30. It is preferable to remove from. This is to prevent a part of the power coil pattern 30 is also removed when the metal foil except for the power coil pattern 30 is removed from the transfer film. That is, the transferring process (S203) is to remove a portion (scrap) except for the power coil pattern 30 from the transfer film while pressing a part or all of the power coil pattern 30 by using a jig. .
  • the adhesive layer is an example of being formed of a thermosetting adhesive.
  • the transparent substrate 10 is bonded to one surface of the transfer film, and only the portion where the power coil pattern 30 is formed is pressed by applying heat to compress only the power coil pattern 30 to the transparent substrate 10. To be transferred.
  • the metal foil portions other than the power coil pattern 30 together with the transfer film are separated and removed.
  • the power coil pattern 30 may be separated from the transfer film to be transferred onto the transparent substrate 10.
  • a vacuum suction pattern corresponding to the shape of the power coil pattern 30 is a mold provided with vacuum suction and separation of the power coil pattern 30 from the transfer film.
  • the power coil pattern 30 is directly transferred to one surface of the transparent substrate 10.
  • the vacuum suction pattern is positioned in the mold so as to correspond to the power coil pattern 30, and the power absorption coil pattern 30 is absorbed by the vacuum suction pattern to transfer the film and the power supply from the metal foil. After separating and removing portions except the coil pattern 30 at once, the power coil pattern 30 is directly transferred to one surface of the transparent substrate 10. In this case, automation is possible, which reduces work time.
  • the metal foil may be any one of an aluminum foil, an aluminum foil, and an aluminum foil.
  • the metal foil is preferably aluminum foil (AL foil).
  • the aluminum foil can be used directly as the power coil pattern 30 by using a thickness of 9 ⁇ 40 ⁇ m. That is, the present invention is easy to control the thickness of the power coil pattern 30 through the thickness control of the aluminum foil.
  • Aluminum has a higher thermal conductivity and lower resistance than copper, and thus may be used as a power coil pattern 30 without an additional plating process with a thin thickness of 9 to 40 ⁇ m.
  • a pattern thickness of 20 ⁇ m should be secured through plating after etching and mainly Sn plating. This is to minimize the heat problem and power consumption.
  • the power coil pattern 30 may be formed by etching the metal foil laminated on one surface of the transparent substrate 10.
  • the circuit pattern forming step (S200) may include forming a touch sensing circuit pattern 20 on the transparent substrate 10 (S201) and the transparent substrate 10. Forming a conductive deposition layer 30a around the touch sensing circuit pattern 20 (S201b); And etching the conductive deposition layer 30a to form the power coil pattern 30 around the touch sensing circuit pattern 20 (S201c).
  • an example of forming a transparent ITO sensing electrode, which is the touch sensing circuit pattern 20 is performed on the transparent substrate 10. Note that it can be modified in any known manner to form the sensing circuit pattern 20.
  • any one of copper, silver, gold, aluminum, and molybdenum is vacuum deposited to surround the touch pattern circuit pattern 20 on the transparent substrate 10.
  • the conductive deposition layer 30a is formed.
  • the vacuum deposition may be any one of evaporation, e-beam deposition, laser deposition, sputtering, and arc ion plating.
  • the process of etching the conductive deposition layer 30a may be performed to form a power coil pattern 30 around the touch sensing circuit pattern 20.
  • the power coil pattern 30 and the A sensing lead pattern 41 for connecting the touch sensing circuit pattern 20 to a capacitive touch sensing circuit and a power connection pattern 51 for connecting the power coil pattern 30 to a power supply unit are simultaneously formed.
  • the circuit pattern forming step (S200), after the step (S201c) of etching the conductive deposition layer (30a), the power coil pattern 30, the sensing lead pattern 41, the power connection pattern 51 It may further include the step (S201d) of plating at least one of the.
  • the plating process may plate all of the power coil pattern 30, the sensing lead pattern 41, and the power connection pattern 51, depending on the resistance characteristics and pattern thickness required for circuit design. Note that it can be plated selectively.
  • the circuit pattern forming step (S200) may be performed by separately forming the touch sensing circuit pattern 20 on the transparent substrate 10 first, and then the power coil pattern 30 and the touch sensing circuit pattern 20. ) Can be formed on the transparent substrate 10 at the same time the sensing lead pattern 41 for connecting the capacitive touch sensing circuit and the power connection pattern 51 for connecting the power coil pattern 30 to the power supply. .
  • Figures 13 to 20 are the touch sensing on the transparent substrate 10 in the circuit pattern forming step (S200) of the touch sensor panel touch sensor manufacturing method having a power coil pattern according to an embodiment of the present invention An example of simultaneously forming the circuit pattern 20 and the power coil pattern 30 is shown.
  • a process of forming the seed layer 1 on the transparent substrate 10 (S204) and a photoresist layer on the seed layer 1 is performed.
  • a patterning process (S206) for forming a power coil hole 4b having a shape; Plating to form a plating layer (2) in the touch circuit hole (4a) and the power coil hole (4b) (S208); Removing the photoresist layer 4 and etching the seed layer 1 using the plating layer 2 as a barrier may be included (S209).
  • the seed layer 1 is formed by vacuum deposition, and the vacuum deposition is performed by evaporation, ebeam deposition, laser deposition, and sputtering.
  • the vacuum deposition is performed by evaporation, ebeam deposition, laser deposition, and sputtering.
  • evaporation e.g., one of Sputtering and Arc Ion Plating.
  • the vacuum deposition is any one of chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (TiW), copper (Cu), or molybdenum (Mo) , An alloy in which at least two of titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (TiW) and copper (Cu) are mixed, or molybdenum (Mo), titanium (Ti) and tungsten (W). ), An alloy containing at least one of nickel chromium (NiCr), titanium tungsten alloy (TiW) and copper (Cu) is preferably used as the target material.
  • the seed layer (1) formed by thermally depositing the copper (Cu) is a plating layer (2) formed by the plating process (S208) and the plating is smoothly made in the plating process (S208) and the plating-friendly Not only has excellent binding power but also has black color when thermal evaporation.
  • the seed layer 1 (S204) it is preferable to form an oxide film or a nitride film by vacuum depositing a target material in an oxygen gas atmosphere or a nitrogen gas atmosphere.
  • a target material such as metal, such as titanium, chromium, copper, nickel, aluminum, silver, or carbon, is sputtered in an oxygen gas atmosphere or a nitrogen gas atmosphere to form the transparent substrate ( For example, forming an oxide film or a nitride film on one surface of 10).
  • An oxide film may be formed on one surface of the transparent substrate 10 by sputtering an oxide such as silver oxide (AgO) with a target material, and sputtering a nitride such as titanium nitride (TiN) or copper nitride (CuN) as a target material.
  • the nitride film may be formed on one surface of the transparent substrate 10.
  • the oxide film or the nitride film has a reflectance of 30% or less, to prevent glare caused by the reflection of the electrode, and to enhance adhesion between the electrode and the transparent substrate 10.
  • Forming the seed layer 1 includes applying a conductive ink or a conductive paste onto the transparent substrate 10 with the conductive ink or the conductive paste. Forming the seed layer 1 is one example.
  • the coating of the conductive ink or the conductive paste may be performed by printing the conductive ink or the conductive paste to form the seed layer 1.
  • the conductive ink or the conductive paste may serve to reduce diffuse reflection of light by forming the seed layer 1 in a black series.
  • the conductive ink or the conductive paste may include a conductive powder and a black-based blackening agent, and the conductive powder may be any one of silver powder, copper powder, gold powder, and aluminum powder.
  • the conductive ink or the conductive paste contains at least one of the conductive powders having excellent conductivity, and it may be found that the two conductive powders may be mixed.
  • carbon black or carbon nanotubes are taken as an example, and any conductive black or conductive paste forming a black color may be applied, and it is more preferable that the conductivity is more preferable. Put it.
  • the conductive ink or the conductive paste may include carbon black or carbon nanotubes.
  • the seed layer 1 is formed by applying a conductive ink or conductive paste, and drying or baking. It is preferable that the seed layer 1 lowers the resistance by firing the conductive ink or the conductive paste and increases the adhesion to the substrate.
  • the photoresist layer 4 may be a dry film or formed by applying a photoresist liquid.
  • the dry film Compared with the photoresist layer 4 formed by applying the photoresist liquid, the dry film has a uniform thickness and does not require a separate drying process, thereby simplifying the manufacturing process and uniformly forming the circuit electrode with a uniform thickness.
  • the photoresist layer 4 may be formed by comma roll coating, gravure coating, doctor blade method, spray method, and electrospinning.
  • the electrospinning forms the electrospinning photoresist layer 4 to 1 to 10 mu m.
  • the electrospinning is performed on the seed layer 1 by spraying a photosensitive polymer solution with compressed air with an electrospinning nozzle and the electrospinning nozzle while the electric power is applied to the seed layer 1.
  • the radiation photoresist layer 4 is formed.
  • the electrospinning includes charge in the photosensitive polymer to be injected, the photosensitive polymer solution is not aggregated while the photosensitive polymer solution is sprayed to facilitate dispersion, thereby forming the electrospun photoresist layer 4 as a thin film having a thickness of 5 ⁇ m or less.
  • the electrospinning forms an electrospinning photoresist layer 4 on the seed layer 1 in a state in which electric power is applied to the seed layer 1, a photosensitive agent generated while the photosensitive polymer solution is radiated.
  • the fibers are uniformly applied to the seed layer 1 by the potential difference, and are strongly attached and applied.
  • the photoresist layer 4 When the photoresist layer 4 is formed by electrospinning, the photoresist layer 4 applied by electrospinning must be cured, and the photoresist layer 4 is cured by ultraviolet (UV) curing, laser curing, It hardens
  • UV ultraviolet
  • laser curing It hardens
  • the patterning process S206 may be performed by exposing the photoresist layer 4 to a developer after covering only a portion where the touch circuit hole 4a and the power coil hole 4b are formed with a mask 5.
  • the touch circuit hole 4a and the power coil hole 4b are formed in the photoresist layer 4 so that only a portion which is not cured by exposure and that is not cured by exposure, that is, is covered by the developer. Form.
  • the photoresist layer 4 is changed to an insoluble state in which a portion exposed by exposure is not dissolved by a developer.
  • the process of developing with a developer is performed by removing only a portion of the photoresist layer 4 which is not insoluble in the photoresist layer 4, that is, a portion corresponding to the touch circuit hole 4a and the power coil hole 4b.
  • the touch circuit hole 4a and the power supply coil hole 4b are formed.
  • the seed layer 1 is formed by forming the plating layer 2 using the photoresist layer 4 as a barrier in the touch circuit hole 4a and the power coil hole 4b.
  • a plating layer 2 having an accurate line width may be formed to match the line width of the power coil hole 4b.
  • the photoresist layer 4 is removed, and the seed layer 1 is etched using the plating layer 2 as a barrier so that the seed layer 1 becomes the plating layer 2.
  • the touch sensing circuit pattern 20 and the power coil pattern 30 having the exact line width that matches the touch circuit hole 4a and the power coil hole 4b may be formed.
  • the circuit pattern forming step (S200) may include forming the seed layer (1) after forming the seed layer (1) and before forming the photoresist layer (4) (S205). It is preferable to further include the process (S204a) of forming the plating affinity layer 3 on 1).
  • the photoresist layer 4 is formed on the upper surface of the plating affinity layer 3.
  • the process of forming the plating affinity layer 3 (S204a) is performed among copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and palladium (Pd).
  • the conductive paste containing at least one of them may be printed on the seed layer 1 and dried to form the plating affinity layer 3, or may be printed and dried and then fired to form the plating affinity layer 3.
  • the conductive paste may include at least one powder of copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and palladium (Pd). .
  • the process of forming the plating affinity layer 3 (S204a) may be formed by vacuum deposition.
  • the vacuum deposition may be any one of evaporation, ebeam deposition, laser deposition, sputtering, and arc ion plating.
  • the step of forming the plating affinity layer 3 (S110) may include copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and palladium (Pd). It is preferable to form a plating affinity layer 3 on the seed layer 1 by vacuum deposition of either.
  • the vacuum deposition can easily form the plating affinity layer 3 on the seed layer (1) to simplify the manufacturing process, reduce manufacturing costs, fine adjustment of the thickness of the plating affinity layer (3) It is easy.
  • the circuit pattern forming step S200 may include forming a seed layer 1 on the transparent substrate 10; An etching process (S207) to remove the touch sensing circuit pattern 20 and the power coil pattern 30 from the seed layer 1; And plating the seed layer 1 remaining on the transparent substrate 10 in the etching process S207 (S208).
  • the process of forming the seed layer 1 is omitted as a duplicated bar as in the above embodiment.
  • the photoresist layer 4 is stacked on the seed layer 1, the photoresist layer 4 is covered with a mask layer 6, and exposed to light to expose the circuit pattern for touch sensing in the photoresist layer. 20 and the photorest remaining in the shape of the touch sensing circuit pattern 20 and the power coil pattern 30 on the seed layer 1 after leaving only a portion corresponding to the shape of the power coil pattern 30.
  • the seed layer 1 is etched with the layer 4 as a barrier.
  • the photoresist layer 4 is removed through a developer so that only portions corresponding to the shapes of the touch sensing circuit pattern 20 and the power coil pattern 30 remain on the seed layer 1. Is omitted.
  • the photoresist layer 4 on the seed layer 1 is removed during the plating process S208.
  • the photoresist layer may be formed by applying a dry film or a photoresist liquid, may be formed by spraying, coater, gravure and electrospinning, and the process of forming the photoresist layer 4 It is to be noted that (S205) and the embodiment are the same and are omitted as redundant descriptions.
  • the circuit pattern forming step S200 may include forming a plating affinity layer 3 on the seed layer 1 before the etching process S207 after forming the seed layer 1. It is preferable to further include the step (S204a) of forming a).
  • the step (S204a) of forming the plating affinity layer (3) is the same as the above-described embodiment is omitted to be omitted as a redundant substrate.
  • the etching process S207 is removed except for portions corresponding to the touch sensing circuit pattern 20 and the power coil pattern 30 in the plating affinity layer 3 and the seed layer 1. It is noted that the method is omitted as redundant description as described above.
  • the plating process (S208), the plating is performed in a state where the plating affinity layer (3) is laminated on the seed layer (1) to cover the plating affinity layer (3) and the seed layer (1)
  • the plating layer 2 is formed, and electroplating or electroless plating of gold (Au), silver (Ag), or copper (Cu) is one example.
  • 21 is a schematic diagram illustrating a touch screen panel according to the present invention.
  • the touch screen panel according to the present invention includes a display panel unit 100 for outputting a screen and the touch sensor 200 for the touch screen panel according to an embodiment of the present invention provided on the display panel unit 100. And a touch screen panel cover attached to the touch sensor 200 for the touch screen panel.
  • the touch sensor 200 for the touch screen panel uses an electromagnetic induction method around the outside of the touch sensing circuit pattern 20 and the touch sensing circuit pattern 20 on the transparent substrate 10.
  • the power coil pattern 30 for generating an induced voltage to the electronic pen of the electronic pen more detailed embodiments will be omitted that overlaps with the above.
  • the touch screen panel cover 300 includes a bezel layer 301 covering a bezel portion, and the power coil pattern 30 is formed at a portion of the transparent substrate 10 corresponding to the bezel layer 301. It is formed and covered by the bezel layer 301 is not exposed to the outside.
  • the touch screen panel according to the present invention is connected to the touch sensor for touch screen panel 200, the touch sensing circuit unit to check the touch position on the cover 300 for the touch screen panel, and the touch sensor for the touch screen panel A touch on the cover 300 for the touch screen panel through the touch sensor 200 for the touch screen panel, including an electronic pen sensing circuit unit connected to a 200 to check the position of the electronic pen using an electromagnetic induction method. And it may be possible to detect the position and operation of the electronic pen.
  • the touch screen panel according to the present invention is disposed below the display panel unit 100 and uses a electromagnetic induction method to generate energy from the power coil pattern 30 to detect the position of the electronic pen operated.
  • the electronic device may further include a unit 500 and separately detect the position and operation of the electronic pen through the digitizer unit 500 separately from the touch sensor 200 for the touch screen panel.
  • the digitizer unit 500 may include a plurality of X-axis sensing circuits 21 spaced in parallel on the opaque substrate for digitizer and a plurality of Y-axis sensing circuits spaced in parallel to orthogonal to the X-axis sensing circuits 21. It is a sensor for detecting the electromagnetic force of the electronic pen on the cover 3 for the touch screen panel, including (22).
  • the present invention is provided with a power coil pattern 30 for the electronic pen in the touch sensor 200 for the touch screen panel to sense a touch in the touch screen panel to provide a stable wireless power supply to the electronic pen, when using the electronic pen It has the effect of improving convenience and operational reliability.
  • a transparent adhesive layer 400 is provided between the touch screen panel cover 3 and the touch screen panel touch sensor 2 and between the touch screen panel touch sensor 2 and the display panel unit 100.
  • the transparent adhesive layer 400 may be an OCA optically clear adhesive (OCA) film.
  • the digitizer unit 500 detects pen pressure, a position, etc. of the electronic pen that emits electromagnetic force separately from the touch sensor for the touch screen panel, and thus enables detailed recognition and expression.
  • the present invention has the effect of simplifying the manufacturing process and reducing the manufacturing cost by simultaneously forming the touch sensing circuit pattern 20 and the power coil pattern 30 of the touch sensor.
  • the present invention can wirelessly charge other portable terminals capable of wireless charging, thereby greatly improving the merchandise.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

L'invention concerne un capteur tactile de panneau d'écran tactile comprenant un modèle de bobine électrique pour stylo électronique, un procédé de fabrication associé, et un panneau d'écran tactile comprenant le capteur. Le capteur tactile comprend : un modèle de circuit de détection tactile disposé sur un substrat transparent et formé pour détecter un contact sur le panneau d'écran tactile ; et un modèle de bobine électrique formé, sur le substrat transparent, sous forme d'une bobine recouvrant la circonférence du modèle de circuit de détection tactile de façon à générer une tension d'induction sur le stylo électronique, ce qui permet d'alimenter le stylo électronique en électricité sans fil et de manière stable, d'améliorer la commodité et la fiabilité de fonctionnement lors de l'utilisation du stylo électronique, de simplifier les opérations de fabrication et de réduire les coûts de fabrication par formation simultanée du mpodèle de circuit de détection tactile et du modèle de bobine électrique du capteur tactile.
PCT/KR2016/005495 2015-06-18 2016-05-24 Capteur tactile de panneau d'écran tactile comprenant un modèle de bobine électrique pour stylo électronique et son procédé de fabrication, et panneau d'écran tactile comprenant le capteur WO2016204419A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2015-0086861 2015-06-18
KR1020150086861A KR20160150179A (ko) 2015-06-18 2015-06-18 전자펜용 전원 코일패턴을 구비한 터치 스크린 패널용 터치센서와 그 제조방법 및 이를 포함하는 터치 스크린 패널

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WO2016204419A1 true WO2016204419A1 (fr) 2016-12-22

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PCT/KR2016/005495 WO2016204419A1 (fr) 2015-06-18 2016-05-24 Capteur tactile de panneau d'écran tactile comprenant un modèle de bobine électrique pour stylo électronique et son procédé de fabrication, et panneau d'écran tactile comprenant le capteur

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KR102154216B1 (ko) * 2017-09-18 2020-09-09 주식회사 아모그린텍 터치 스크린 패널용 기판, 이를 포함하는 터치 스크린 패널 및 이의 제조 방법
KR20190104816A (ko) * 2018-03-02 2019-09-11 동우 화인켐 주식회사 디지타이저 및 그 제조 방법

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EP2687963A2 (fr) * 2012-07-17 2014-01-22 Samsung Display Co., Ltd. Dispositif d'affichage ayant une fonction de détection tactile
KR20140033785A (ko) * 2012-09-10 2014-03-19 삼성전기주식회사 디지타이저
KR20150026961A (ko) * 2013-08-30 2015-03-11 주식회사 아모센스 터치 스크린 패널용 터치 센서, 그 제조방법 및 이를 포함하는 터치 스크린 패널
KR20150027384A (ko) * 2013-09-02 2015-03-12 주영도 디지타이저 기능을 구비한 터치패널

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EP2687963A2 (fr) * 2012-07-17 2014-01-22 Samsung Display Co., Ltd. Dispositif d'affichage ayant une fonction de détection tactile
KR20140033785A (ko) * 2012-09-10 2014-03-19 삼성전기주식회사 디지타이저
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